Adjusting method of wafer adjusting table

Abstract

The invention discloses an adjusting method of a wafer adjusting table. The adjusting method of the wafer adjusting table comprises the following steps of S1, early-stage preparation of equipment; s2, an ejector pin lifting power device drives an ejector pin to ascend, the ejector pin descends after supporting the wafer, and the wafer falls on a wafer placement table; s3, the negative pressure system exhausts air through the negative pressure channel, and the wafer is adsorbed on the wafer placing table; s4, a sensor lifting power device drives a bottom measuring sensor to ascend, the bottom measuring sensor abuts against the bottom of the wafer placing table, and whether the wafer is placed horizontally or not is measured; s5, performing horizontal adjustment and height adjustment on the wafer placement table by the lifting leveling device according to data measured by the bottom measurement sensor; s6, a turntable driving device drives the wafer turntable to rotate, and the wafer rotates to a corresponding etching angle; according to the method, after the wafer is placed on the wafer placing table, the horizontal state and height of the wafer during etching can be accurately adjusted, and the wafer can be ensured to be accurately located at a proper etching position.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection equipment, and in particular to an adjustment method for a wafer adjustment platform. Background Art

[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. It is round in shape, and the wafer needs to be placed on a wafer turntable. The wafer needs to be etched multiple times during photolithography. A bottom sensor is needed on the wafer turntable to determine whether the wafer is placed back accurately and to determine the subsequent processing height to ensure accurate and stable processing. The bottom sensor is installed inside the wafer turntable, with the bottom of the wafer turntable as a reference. Currently, the bottom sensor includes a sensor head and a cylinder that drives the sensor head to rise and fall. An airflow interface is connected to the cylinder, and then the cylinder is directly fixed to the bottom of the wafer turntable. The installation and fixation are relatively cumbersome, and when the cylinder or sensor head needs to be replaced, the air pipes on the airflow interface need to be unplugged one by one. The disassembly is also very cumbersome, and the bottom of the cylinder cannot effectively ensure that the installation is flush, affecting the accuracy of the bottom measurement, and the wafer turntable is provided with a carrier. The corresponding wafer is adsorbed and placed on the wafer holding table, and the wafer holding table needs to ensure the level of the end face to ensure that the wafer can be in a horizontal state during etching. Therefore, the wafer holding table needs to perform horizontal adjustment of the end face on the wafer turntable. Patent No. 202223067713.9 discloses a turntable adjustment mechanism and a detection device. The turntable adjustment mechanism drives the lead screw to rotate through a driving member, thereby driving the moving block to move linearly, and the moving block is connected to the rotating plate through a connecting assembly. The moving block moves linearly. In order to enable the rotating plate to rotate in a circle, guide rails, bearings and other components are also provided on the connecting assembly. Therefore, the complexity of the structure is increased when the drive is rotated, and the lead screw and nut also require a higher matching accuracy, which will also increase the complexity of the structure and increase the cost of use; at the same time, the wafer turntable cannot be adjusted horizontally, which affects the etching accuracy of the wafer. Summary of the invention

[0003] The technical problem to be solved by the present invention is: a method for adjusting a wafer adjustment table, which can accurately adjust the horizontal state and height of the wafer during etching after placing the wafer on the wafer placement table, and can ensure that the wafer can be accurately in a suitable etching position.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: a method for adjusting a wafer adjustment platform, the method for adjusting the wafer adjustment platform comprising the following steps:

[0005] S1. Preliminary preparation of equipment, providing a wafer adjustment table, including a bottom plate, on which a wafer turntable is rotatably mounted, a turntable driving device for driving the wafer turntable to rotate is provided on the bottom plate, the wafer turntable includes an upper disc located at the bottom and a shell surrounding the upper disc, a lifting and leveling device is installed on the upper disc, a workbench is installed on the lifting and leveling device, a wafer placement table is installed on the workbench, and the lifting and leveling device drives the wafer placement table to lift and level; a pin is installed on the upper disc to support the wafer lifting and lowering, and the pin is driven by a pin lifting power device, and a plurality of bottom measuring sensors that are lifted and passed through the wafer placement table are also provided on the upper disc, and the bottom measuring sensors are driven by a sensor lifting power device, and a negative pressure channel for negative pressure absorption of the wafer is provided on the wafer placement table, and the negative pressure channel is connected to a negative pressure system;

[0006] S2, the ejector is driven to rise by the ejector lifting power device, the ejector supports the wafer and then descends, and the wafer falls on the wafer placement table;

[0007] S3, the negative pressure system extracts air through the negative pressure channel, and the wafer is adsorbed on the wafer placement table;

[0008] S4, driving the bottom measuring sensor to rise by the sensor lifting power device, and the bottom measuring sensor is against the bottom of the wafer placement table to detect whether the wafer is placed horizontally;

[0009] S5. The lifting and leveling device adjusts the level and height of the wafer placement table according to the data measured by the bottom measuring sensor;

[0010] S6. The turntable driving device drives the wafer turntable to rotate, and the wafer rotates to a corresponding etching angle.

[0011] As a preferred solution, in step S4, the upper disc is provided with a receiving groove corresponding to the bottom measuring sensor, a mounting base is installed in the receiving groove, a sensor driving cylinder is vertically inserted and installed on the mounting base, the upper surface of the mounting base is a reference surface, the bottom of the sensor driving cylinder is in contact with the reference surface, an air flow channel connected to the sensor driving cylinder is provided on the mounting base, the air flow channel is connected to the cylinder driving air source, the bottom measuring sensor is lifted and installed on the sensor driving cylinder, the sensor driving cylinder is also provided with a sensor harness connected to the bottom measuring sensor, and an auxiliary fixing device for assisting the sensor driving cylinder in vertical installation is provided on the upper disc; the method for installing the bottom measuring sensor and determining the initial position is as follows:

[0012] The sensor driving cylinder drives the bottom measuring sensor to rise and fall, and a receiving groove is opened on the upper disc. The mounting base is installed on the receiving groove with the bottom surface of the receiving groove as a reference; the sensor driving cylinder is inserted and installed on the mounting base. With the upper surface of the mounting base as a reference, after the bottom of the sensor driving cylinder contacts the upper surface of the mounting base, the auxiliary fixing device assists the fixed installation of the sensor driving cylinder to complete the determination of the initial position of the bottom measuring sensor.

[0013] As a preferred solution, in step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disc and rotating synchronously with the wafer turntable, a pushing block for pushing the rotating connecting rod is horizontally and linearly slidably mounted on the bottom plate, the end of the pushing block is close to the side of the rotating connecting rod, the pushing block is driven by a linear driving power device, a reset structure connected to the rotating connecting rod and pulled to rotate the wafer turntable is provided on the bottom plate, and a limit structure is provided on the bottom plate to limit the rotating connecting rod to follow the rotation range of the wafer turntable; the rotation adjustment method of the wafer turntable is as follows:

[0014] The linear push power device drives the push block to extend and retract linearly, and the push block extends out to push the rotating connecting rod. The rotating connecting rod swings forward to drive the wafer turntable to rotate until the rotating connecting rod hits the limit structure and stops rotating. Then the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always resists the rotating connecting rod to complete the rotation adjustment of the wafer turntable.

[0015] As a preferred solution, in step S5, the lifting and leveling device includes four lifting mounting frames fixedly mounted on the upper disc, the four lifting mounting frames are evenly arranged in a circle with the wafer placement table as the center, each of the lifting mounting frames is vertically slidably mounted with a sliding seat, the sliding seat is driven by a workbench lifting power device, two of the sliding seats are on the X diameter and are defined as X sliding seats, the other two sliding seats are on the Y diameter and are defined as Y sliding seats, the X sliding seats are fixedly mounted with an X adjustment block, the Y sliding seats are fixedly mounted with a Y adjustment block, and the workbench is fixed on the X adjustment block and the Y adjustment block. On the node block, the X adjustment block is divided into an X upper block and an X lower block, a Y connection block in the Y direction is provided between the X upper block and the X lower block, an X connection block in the X direction is provided between the X lower block and the X sliding seat, and gaps are provided between the X upper block and the X lower block, and between the X lower block and the X sliding seat; the Y adjustment block is divided into a Y upper block and a Y lower block, an X connection block in the X direction is provided between the Y upper block and the Y lower block, a Y connection block in the Y direction is provided between the Y lower block and the Y sliding seat, and gaps are provided between the Y upper block and the Y lower block, and between the Y lower block and the Y sliding seat; the horizontal adjustment method of the wafer placement table is as follows:

[0016] After the wafer is placed on the wafer placement table, when the two X sliding seats are lifted and slid, the Y connecting blocks on the X sliding seats are twisted respectively, driving the wafer placement table to swing up and down on both sides of the X direction, and the Y connecting blocks on the Y sliding seats are also twisted, and the gaps on both sides of the Y connecting blocks are compressed and expanded respectively; when the two Y sliding seats are lifted and slid, the X connecting blocks on the Y sliding seats are twisted respectively, driving the wafer placement table to swing up and down on both sides of the Y direction, and the X connecting blocks on the X sliding seats are also twisted, completing the horizontal adjustment of the wafer placement table.

[0017] As a preferred solution, the auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disk, and a fixed clamp block that clamps each other is provided between the auxiliary rod and the sensor driving cylinder; the auxiliary fixing device also includes an auxiliary positioning piece, and the auxiliary positioning piece is provided with an inner positioning sleeve portion sleeved on the auxiliary rod and an outer positioning sleeve portion sleeved on the sensor driving cylinder, and the fixed clamp block is located above the auxiliary positioning piece; the auxiliary positioning piece initially constrains the auxiliary rod and the sensor driving cylinder to be parallel to each other and aligns them through the inner positioning sleeve portion and the outer positioning sleeve portion and inserts them into the mounting base, the fixed clamp block clamps and fixes the sensor driving cylinder and the auxiliary rod, and the bottom of the sensor driving cylinder is pressed against the mounting base.

[0018] As a preferred solution, in step S6, a sensing device for detecting the moving position of the push block is further provided on the base plate, and the sensing device cooperates with the limit lever to limit the position; the sensing device is a grating ruler, and the grating ruler is fixed on the push block to detect the moving distance of the push block; the grating ruler is used to detect the linear extension and retraction distance of the push block, and the linear distance corresponds to the rotation angle of the wafer turntable.

[0019] As a preferred solution, in step S5, after the horizontal adjustment of the wafer turntable is completed, the sensor drives the cylinder to drive the bottom sensor to rise to detect whether the wafer is horizontal, and then the X sliding seat and the Y sliding seat are synchronously raised and lowered to adjust the distance between the wafer and the mask.

[0020] After adopting the above technical solution, the effect of the present invention is: due to the adjustment method of the wafer adjustment platform, the adjustment method of the wafer adjustment platform includes the following steps:

[0021] S1. Preliminary preparation of equipment, providing a wafer adjustment table, including a bottom plate, on which a wafer turntable is rotatably mounted, a turntable driving device for driving the wafer turntable to rotate is provided on the bottom plate, the wafer turntable includes an upper disc located at the bottom and a shell surrounding the upper disc, a lifting and leveling device is installed on the upper disc, a workbench is installed on the lifting and leveling device, a wafer placement table is installed on the workbench, and the lifting and leveling device drives the wafer placement table to lift and level; a pin is installed on the upper disc to support the wafer lifting and lowering, and the pin is driven by a pin lifting power device, and a plurality of bottom measuring sensors that are lifted and passed through the wafer placement table are also provided on the upper disc, and the bottom measuring sensors are driven by a sensor lifting power device, and a negative pressure channel for negative pressure absorption of the wafer is provided on the wafer placement table, and the negative pressure channel is connected to a negative pressure system;

[0022] S2, the ejector is driven to rise by the ejector lifting power device, the ejector supports the wafer and then descends, and the wafer falls on the wafer placement table;

[0023] S3, the negative pressure system extracts air through the negative pressure channel, and the wafer is adsorbed on the wafer placement table;

[0024] S4, driving the bottom measuring sensor to rise by the sensor lifting power device, and the bottom measuring sensor is against the bottom of the wafer placement table to detect whether the wafer is placed horizontally;

[0025] S5. The lifting and leveling device adjusts the level and height of the wafer placement table according to the data measured by the bottom measuring sensor;

[0026] S6. The turntable driving device drives the wafer turntable to rotate, and the wafer rotates to the corresponding etching angle. In this method, the ejector pin lifting power device drives the ejector pin to rise to effectively support the conveyed wafer, and then descends to make the wafer fall on the wafer placement table. The negative pressure channel on the wafer placement table draws air through the negative pressure system to effectively adsorb the wafer. Then the sensor lifting power device drives the bottom measuring sensor to rise and touch the bottom of the wafer, calculates the distance length to determine whether the wafer is horizontal, and then controls the wafer surface to be in a horizontal state through the lifting and leveling device. Finally, the turntable driving device drives the rotation to ensure that the wafer can be in the same position during repeated etching, so as to accurately etch.

[0027] Furthermore, in step S4, a receiving groove corresponding to the bottom measuring sensor is provided on the upper disc, a mounting base is installed in the receiving groove, a sensor driving cylinder is vertically inserted and installed on the mounting base, the upper surface of the mounting base is a reference surface, the bottom of the sensor driving cylinder is in contact with the reference surface, an air flow channel connected to the sensor driving cylinder is provided on the mounting base, the air flow channel is connected to the cylinder driving air source, the bottom measuring sensor is lifted and installed on the sensor driving cylinder, the sensor driving cylinder is also provided with a sensor harness connected to the bottom measuring sensor, and an auxiliary fixing device for assisting the sensor driving cylinder in vertical installation is provided on the upper disc; the method for installing the bottom measuring sensor and determining the initial position is as follows:

[0028] The sensor-driven cylinder drives the bottom measuring sensor to rise and fall, and a receiving groove is opened on the upper disc. The mounting base is installed on the receiving groove with the bottom surface of the receiving groove as a reference; the sensor-driven cylinder is inserted and installed on the mounting base, and the upper surface of the mounting base is used as a reference. After the bottom of the sensor-driven cylinder contacts the upper surface of the mounting base, the auxiliary fixing device assists the fixed installation of the sensor-driven cylinder to complete the determination of the initial position of the bottom measuring sensor; using the receiving groove as a preliminary reference can ensure that the mounting base is set stably, and then using the upper surface of the mounting base as a reference to complete the installation of the sensor-driven cylinder, the contacted support area is reduced to facilitate the improvement of the reference accuracy, ensuring fast and accurate installation.

[0029] Furthermore, in step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disc and rotating synchronously with the wafer turntable, a pushing block for pushing the rotating connecting rod is horizontally and linearly slidably mounted on the bottom plate, the end of the pushing block is in close contact with the side of the rotating connecting rod, the pushing block is driven by a linear driving power device, a reset structure connected to the rotating connecting rod and pulled to rotate the wafer turntable is provided on the bottom plate, and a limit structure is provided on the bottom plate to limit the rotating connecting rod to follow the rotation range of the wafer turntable; the rotation adjustment method of the wafer turntable is as follows:

[0030] The linear push power device drives the push block to extend and retract linearly, and the push block extends out to push the rotating connecting rod. The rotating connecting rod swings forward to drive the wafer turntable to rotate until the rotating connecting rod hits the limit structure and stops rotating. Then the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always resists the rotating connecting rod to complete the rotation adjustment of the wafer turntable. The linear push power device drives the push block to extend and retract linearly, which can directly push the movement of the rotating connecting rod, thereby driving the wafer turntable to rotate. When rotating, only the push block needs to be retracted, and the reset structure pulls the rotating connecting rod at the same time. The driving method is simple and convenient.

[0031] Furthermore, in step S5, the lifting and leveling device includes four lifting mounting frames fixedly mounted on the upper disc, the four lifting mounting frames are evenly arranged in a circle with the wafer placement table as the center, each of the lifting mounting frames is vertically slidably mounted with a sliding seat, the sliding seat is driven by a workbench lifting power device, two of the sliding seats are located on the X diameter and are defined as X sliding seats, the other two sliding seats are located on the Y diameter and are defined as Y sliding seats, the X sliding seats are fixedly mounted with an X adjustment block, the Y sliding seats are fixedly mounted with a Y adjustment block, and the workbench is fixed on the X adjustment block and the Y adjustment block. The X adjustment block is divided into an X upper block and an X lower block, a Y connection block in the Y direction is provided between the X upper block and the X lower block, an X connection block in the X direction is provided between the X lower block and the X sliding seat, and gaps are provided between the X upper block and the X lower block, and between the X lower block and the X sliding seat; the Y adjustment block is divided into a Y upper block and a Y lower block, an X connection block in the X direction is provided between the Y upper block and the Y lower block, a Y connection block in the Y direction is provided between the Y lower block and the Y sliding seat, and gaps are provided between the Y upper block and the Y lower block, and between the Y lower block and the Y sliding seat; the horizontal adjustment method of the wafer placement table is as follows:

[0032] After the wafer is placed on the wafer placement table, when the two X sliding seats are lifted and slid, the Y connecting blocks on the X sliding seats are twisted respectively, driving the high and low swings on both sides of the wafer placement table in the X direction, and the Y connecting blocks on the Y sliding seats are also twisted, and the gaps on both sides of the Y connecting blocks are respectively compressed and expanded; when the two Y sliding seats are lifted and slid, the X connecting blocks on the Y sliding seats are twisted respectively, driving the high and low swings on both sides of the wafer placement table in the Y direction, and the X connecting blocks on the X sliding seats are also twisted, completing the horizontal adjustment of the wafer placement table; since there is a gap between the X adjustment block and the Y adjustment block, the X connecting block and the Y connecting block can be deformed through the gap when twisting, and since the wafer placement table is close to the X sliding seat when the X sliding seat is lifted and lowered, the adjustment range is large, so the Y connecting block is arranged between the X upper block and the X lower block, and the Y sliding seat is in the middle of the horizontal adjustment, so the range is small, and the Y connecting block is arranged between the Y lower block and the Y sliding seat, and vice versa when the Y sliding seat is lifted and lowered, the same applies, the structure is simple, and the adjustment is convenient.

[0033] Since the auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, a fixed clamping block that clamps each other is provided between the auxiliary rod and the sensor driving cylinder; the auxiliary fixing device also includes an auxiliary positioning piece, the auxiliary positioning piece is provided with an inner positioning sleeve portion sleeved on the auxiliary rod and an outer positioning sleeve portion sleeved on the sensor driving cylinder, and the fixed clamping block is located above the auxiliary positioning piece; the auxiliary positioning piece initially constrains the auxiliary rod and the sensor driving cylinder to be parallel to each other through the inner positioning sleeve portion and the outer positioning sleeve portion and aligns them to be inserted into the mounting base, the fixed clamping block clamps and fixes the sensor driving cylinder and the auxiliary rod, and the bottom of the sensor driving cylinder is pressed against the mounting base; the auxiliary positioning piece can first limit the sensor driving cylinder to ensure that the sensor driving cylinder and the auxiliary rod are parallel, and then the fixed clamping block can fix them, so that the sensor driving cylinder can be accurately fixed vertically and then drive the bottom measuring sensor to rise and fall accurately.

[0034] Furthermore, in step S6, a sensing device for detecting the moving position of the push block is further provided on the bottom plate, and the sensing device cooperates with the limit lever to limit the position; the sensing device is a grating ruler, and the grating ruler is fixed on the push block to detect the moving distance of the push block; the grating ruler is used to detect the linear extension and retraction distance of the push block, and the linear distance corresponds to the rotation angle of the wafer turntable; the moving distance of the push block can be quickly obtained by the grating ruler, thereby calculating the rotation angle, and the rotation is accurate.

[0035] In step S5, after the horizontal adjustment of the wafer turntable is completed, the sensor drives the cylinder to drive the bottom sensor to rise to detect whether the wafer is horizontal, and then the X sliding seat and the Y sliding seat are synchronously raised and lowered to adjust the distance between the wafer and the mask; it is ensured that the wafer is in an accurate horizontal state after adjustment, and then the height adjustment is performed to improve the accuracy of etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0037] Figure 1 is a stereogram of an embodiment of the present invention;

[0038] Figure 2 is a schematic diagram of the structure on the bottom plate of an embodiment of the present invention;

[0039] Figure 3 It is a schematic structural diagram of a lifting and leveling device according to an embodiment of the present invention;

[0040] Figure 4 It is a structural schematic diagram of the ejector lifting power device of an embodiment of the present invention;

[0041] Figure 5 is a schematic structural diagram of a turntable driving device according to an embodiment of the present invention;

[0042] Figure 6 is a schematic structural diagram of a bottom measuring sensor according to an embodiment of the present invention;

[0043] Figure 7 It is a schematic diagram of the structure of the mounting base and the sensor driving cylinder according to an embodiment of the present invention;

[0044] Figure 8 It is a schematic structural diagram of a truncated table in an embodiment of the present invention;

[0045] Fig. 9 It is a schematic diagram of the structure of the bottom measuring sensor installed in an embodiment of the present invention;

[0046] In the attached drawings: 1, bottom plate; 2, wafer turntable; 3, upper disc; 4, housing; 5, workbench; 6, wafer placement table; 7, ejector pin; 8, bottom measuring sensor; 9, negative pressure channel; 10, annular arc protrusion; 11, negative pressure exhaust port; 12, rotating connecting rod; 13, ejector block; 14, receiving groove; 15, mounting base; 16, sensor drive cylinder; 17, air flow channel; 18, sensor harness; 19, lifting mounting frame; 20, X sliding seat; 21, insertion port; 22, Y sliding seat; 23, X adjustment block; 231, X upper block; 232, X lower block; 24, Y adjustment block; 241, Y upper block; 242, Y lower block; 25, X connection block; 26, Y Connecting block; 27. Screw; 28. Connecting tension spring; 29. ​​Vertical slide seat; 30. Support seat; 31. Strip through hole; 32. Eccentric rotating rod; 33. Ejector drive motor; 34. Arc protrusion; 35. Sliding guide rail; 36. Voice coil motor; 37. Motor fixing plate; 38. Mounting plate; 39. Reset fixing rod; 40. Reset tension spring; 41. Limit stop rod; 42. Grating scale; 43. Cover; 44. Pipe protrusion; 45. Sealing groove; 46. Auxiliary rod; 47. Fixed clamp block; 48. Limit step; 49. Auxiliary positioning piece; 491. Inner positioning sleeve; 492. Outer positioning sleeve; 50. Connecting rod; 51. Mounting pad; 52. Semicircular groove. DETAILED DESCRIPTION

[0047] The present invention is further described in detail below through specific examples.

[0048] like Figures 1 to 9 As shown, an embodiment of the present invention discloses a method for adjusting a wafer adjustment platform, and the method for adjusting the wafer adjustment platform includes the following steps:

[0049] S1. Preliminary preparation of equipment, providing a wafer adjustment table, comprising a bottom plate 1, on which a wafer turntable 2 is rotatably mounted, and a turntable driving device for driving the wafer turntable 2 to rotate is provided on the bottom plate 1, and the wafer turntable 2 comprises an upper disc 3 located at the bottom and a shell 4 surrounding the upper disc 3, and a lifting and leveling device is installed on the upper disc 3, and a workbench 5 is installed on the lifting and leveling device, and a wafer placement table 6 is installed on the workbench 5, and the lifting and leveling device drives the wafer placement table 6 to lift and level; a pin 7 penetrating the wafer placement table 6 for supporting the wafer lifting is installed on the upper disc 3, and the pin 7 is driven by the lifting power device of the pin 7, and a plurality of bottom measuring sensors 8 penetrating the wafer placement table 6 are also provided on the upper disc 3, and the bottom measuring sensors 8 are driven by the sensor lifting power device, and a negative pressure channel 9 for negative pressure absorption of the wafer is provided on the wafer placement table 6, and the negative pressure channel 9 is connected to the negative pressure system;

[0050] S2, the ejector pin 7 is driven to rise by the ejector pin 7 lifting power device, the ejector pin 7 supports the wafer and then descends, and the wafer falls on the wafer placement table 6;

[0051] S3, the negative pressure system evacuates air through the negative pressure channel 9, and the wafer is adsorbed on the wafer placement table 6;

[0052] S4, driving the bottom measuring sensor 8 to rise by the sensor lifting power device, the bottom measuring sensor 8 is against the bottom of the wafer placement table 6, and detecting whether the wafer is placed horizontally;

[0053] S5, using the data measured by the bottom measuring sensor 8, the lifting and leveling device performs horizontal and height adjustment on the wafer placement table 6;

[0054] S6, the turntable driving device drives the wafer turntable 2 to rotate, and the wafer rotates to the corresponding etching angle; in this method, the ejector pin 7 lifting power device drives the ejector pin 7 to rise to effectively support the conveyed wafer, and then descends to make the wafer fall on the wafer placement table 6. The negative pressure channel 9 on the wafer placement table 6 draws air through the negative pressure system to effectively adsorb the wafer, and then the sensor lifting power device drives the bottom measuring sensor 8 to rise and touch the bottom of the wafer, calculates the distance length to determine whether the wafer is horizontal, and then controls the wafer surface to be in a horizontal state through the lifting and leveling device, and finally drives the rotation through the turntable driving device to ensure that the wafer can be in the same position during repeated etching, so as to accurately etch.

[0055] Preferably, in step S4, the upper disc 3 is provided with a receiving groove 14 corresponding to the bottom measuring sensor 8, a mounting base 15 is installed in the receiving groove 14, a sensor driving cylinder 16 is vertically inserted and installed on the mounting base 15, the upper surface of the mounting base 15 is a reference surface, the bottom of the sensor driving cylinder 16 is in contact with the reference surface, the mounting base 15 is provided with an air flow channel 17 connected to the sensor driving cylinder 16, the air flow channel 17 is connected to the cylinder driving air source, the bottom measuring sensor 8 is lifted and installed on the sensor driving cylinder 16, the sensor driving cylinder 16 is also provided with a sensor harness 18 connected to the bottom measuring sensor 8, and the upper disc 3 is provided with an auxiliary fixing device for assisting the sensor driving cylinder 16 to be vertically installed; the method for installing the bottom measuring sensor 8 and determining the initial position is as follows:

[0056] The sensor driving cylinder 16 drives the bottom measuring sensor 8 to rise and fall, and a receiving groove 14 is opened on the upper disc 3. The mounting base 15 is installed on the receiving groove 14 with the bottom surface of the receiving groove 14 as a reference; the sensor driving cylinder 16 is inserted and installed on the mounting base 15, and the upper surface of the mounting base 15 is used as a reference. After the bottom of the sensor driving cylinder 16 contacts the upper surface of the mounting base 15, the auxiliary fixing device assists the fixed installation of the sensor driving cylinder 16 to complete the determination of the initial position of the bottom measuring sensor 8; using the receiving groove 14 as a preliminary reference can ensure that the mounting base 15 is set stably, and then using the upper surface of the mounting base 15 as a reference to complete the installation of the sensor driving cylinder 16, the contacted support area is reduced to facilitate the improvement of the reference accuracy, and ensure fast and accurate installation.

[0057] Preferably, in step S6, the turntable driving device includes a rotating connecting rod 12 fixedly mounted on the upper disc 3 and rotating synchronously with the wafer turntable 2, a pushing block 13 for pushing the rotating connecting rod 12 is horizontally and linearly slidably mounted on the bottom plate 1, the end of the pushing block 13 is in close contact with the side of the rotating connecting rod 12, the pushing block 13 is driven by a linear driving power device, a reset structure connected to the rotating connecting rod 12 and pulled to rotate the wafer turntable 2 is provided on the bottom plate 1, and a limiting structure is provided on the bottom plate 1 to limit the rotating connecting rod 12 to follow the rotation range of the wafer turntable 2; the rotation adjustment method of the wafer turntable 2 is as follows:

[0058] The linear pushing power device drives the pushing block 13 to extend and retract linearly. The pushing block 13 extends out to push the rotating connecting rod 12. The rotating connecting rod 12 swings forward to drive the wafer turntable 2 to rotate until the rotating connecting rod 12 hits the limiting structure and stops rotating. Then the pushing block 13 retracts, and the reset structure pulls the rotating connecting rod 12 to swing backward. At the same time, the pushing block 13 always resists the rotating connecting rod 12 to complete the rotation adjustment of the wafer turntable 2. The linear pushing power device drives the pushing block 13 to extend and retract linearly, which can directly push the movement of the rotating connecting rod 12, thereby driving the wafer turntable 2 to rotate. When rotating, only the pushing block 13 needs to be retracted, and the reset structure pulls the rotating connecting rod 12 at the same time. The driving method is simple and convenient.

[0059] Preferably, in step S5, the lifting and leveling device includes four lifting mounting frames 19 fixedly mounted on the upper disc 3, the four lifting mounting frames 19 are evenly arranged in a circle with the wafer placement table 6 as the center, each of the lifting mounting frames 19 is vertically slidably mounted with a sliding seat, the sliding seat is driven by the lifting power device of the workbench 5, two of the sliding seats are on the X diameter and are defined as X sliding seats 20, and the other two sliding seats are on the Y diameter and are defined as Y sliding seats 22, the X sliding seats 20 are fixedly mounted with X adjustment blocks 23, the Y sliding seats 22 are fixedly mounted with Y adjustment blocks 24, the workbench 5 is fixed on the X adjustment blocks 23 and the Y adjustment blocks 24, and the X adjustment blocks 23 are divided into an X upper block 231 and an X lower block 232. Block 232, a Y connecting block 26 in the Y direction is provided between the X upper block 231 and the X lower block 232, an X connecting block 25 in the X direction is provided between the X lower block 232 and the X sliding seat 20, and gaps are provided between the X upper block 231 and the X lower block 232, and between the X lower block 232 and the X sliding seat 20; the Y adjustment block 24 is divided into a Y upper block 241 and a Y lower block 242, an X connecting block 25 in the X direction is provided between the Y upper block 241 and the Y lower block 242, a Y connecting block 26 in the Y direction is provided between the Y lower block 242 and the Y sliding seat 22, and gaps are provided between the Y upper block 241 and the Y lower block 242, and between the Y lower block 242 and the Y sliding seat 22; the horizontal adjustment method of the wafer placement table 6 is as follows:

[0060] After the wafer is placed on the wafer placement table 6, when the two X sliding seats 20 are lifted and slid, the Y connecting blocks 26 on the X sliding seats 20 are twisted respectively, driving the wafer placement table 6 to swing up and down on both sides of the X direction, and the Y connecting blocks 26 on the Y sliding seat 22 are also twisted, and the gaps on both sides of the Y connecting blocks 26 are compressed and expanded respectively; when the two Y sliding seats 22 are lifted and slid, the X connecting blocks 25 on the Y sliding seat 22 are twisted respectively, driving the wafer placement table 6 to swing up and down on both sides of the Y direction, and the X connecting blocks 25 on the X sliding seat 20 are also twisted, completing the wafer placement table 6 Since there is a gap between the X adjustment block 23 and the Y adjustment block 24, the X connection block 25 and the Y connection block 26 can be deformed through the gap when twisting. Since the X sliding seat 20 is lifted and lowered, the wafer placement table 6 is close to the X sliding seat 20, so the adjustment range is large, so the Y connection block 26 is arranged between the X upper block 231 and the X lower block 232, and the Y sliding seat 22 is in the middle of the horizontal adjustment, so the range is small, and the Y connection block 26 is arranged between the Y lower block 242 and the Y sliding seat 22. On the contrary, when the Y sliding seat 22 is lifted and lowered, the same is true. The structure is simple and the adjustment is convenient.

[0061] Preferably, the auxiliary fixing device includes an auxiliary rod 46 vertically fixedly mounted on the upper disc 3, and a fixing clamp 47 is provided between the auxiliary rod 46 and the sensor driving cylinder 16 to clamp each other; the auxiliary fixing device also includes an auxiliary positioning member 49, and the auxiliary positioning member 49 is provided with an inner positioning sleeve 491 sleeved on the auxiliary rod 46 and an outer positioning sleeve 492 sleeved on the sensor driving cylinder 16, and the fixing clamp 47 is located above the auxiliary positioning member 49; the auxiliary positioning member 49 is provided with an inner positioning sleeve 491 and an outer positioning sleeve 492 sleeved on the sensor driving cylinder 16, and the fixing clamp 47 is located above the auxiliary positioning member 49; The sleeve 492 initially constrains the auxiliary rod 46 and the sensor driving cylinder 16 to be parallel to each other and align them to be inserted into the mounting base 15, and the fixed clamp block 47 clamps and fixes the sensor driving cylinder 16 and the auxiliary rod 46, and the bottom of the sensor driving cylinder 16 is pressed against the mounting base 15; the auxiliary positioning member 49 can first limit the sensor driving cylinder 16 to ensure that the sensor driving cylinder 16 and the auxiliary rod 46 are matched and parallel, and then the fixed clamp block 47 can fix them, so that the sensor driving cylinder 16 is accurately fixed vertically and then drives the bottom measuring sensor 8 to rise and fall accurately.

[0062] Preferably, in step S6, the base plate 1 is further provided with a sensing device for detecting the moving position of the push block 13, and the sensing device cooperates with the limit lever to limit the position; the sensing device is a grating ruler 42, and the grating ruler 42 is fixed on the push block 13 to detect the moving distance of the push block 13; the grating ruler 42 is used to detect the linear extension and contraction distance of the push block 13, and the linear distance corresponds to the rotation angle of the wafer turntable 2; the moving distance of the push block 13 can be quickly obtained through the grating ruler 42, thereby calculating the rotation angle, and the rotation is accurate.

[0063] Preferably, in step S5, after completing the horizontal adjustment of the wafer turntable 2, the sensor driving cylinder 16 drives the bottom measuring sensor 8 to rise to detect whether the wafer is horizontal, and then the X sliding seat 20 and the Y sliding seat 22 are synchronously raised and lowered to adjust the distance between the wafer and the mask; ensuring that the wafer is in an accurate horizontal state after adjustment, and then performing height adjustment to improve the accuracy of etching.

[0064] In addition, the embodiment of the present invention also discloses a wafer adjustment platform for implementing the adjustment method.

[0065] like Figures 1 to 9 As shown, a wafer adjustment table comprises a base plate 1, on which a wafer turntable 2 is rotatably mounted, and a turntable driving device for driving the wafer turntable 2 to rotate is provided on the base plate 1, and the wafer turntable 2 comprises an upper disc 3 located at the bottom and a shell 4 surrounding the upper disc 3, and a lifting and leveling device is installed on the upper disc 3, and a workbench 5 is installed on the lifting and leveling device, and a wafer placement table 6 is installed on the workbench 5, and the lifting and leveling device drives the wafer placement table 6 to be lifted and leveled; a pin 7 penetrating the wafer placement table 6 for supporting the wafer to be lifted and lowered is installed on the upper disc 3, and the pin 7 is driven by the lifting power device of the pin 7, and a plurality of bottom measuring sensors 8 penetrating the wafer placement table 6 are also provided on the upper disc 3, and a negative pressure channel 9 for negative pressure absorption of the wafer is provided on the wafer placement table 6, and the negative pressure channel 9 is connected to the negative pressure system.

[0066] In this embodiment, the wafer placement table 6 and the workbench 5 are fixedly connected to each other, and the gap between the workbench 5 and the outer shell 4 is matched, which facilitates the horizontal adjustment of the workbench 5, and the wafer placement table 6 is provided with several layers of annular arc-shaped protrusions 10, and the annular arc-shaped protrusions 10 are provided with a negative pressure exhaust port 11 connected to the negative pressure channel 9. Then, the negative pressure exhaust port 11 is evacuated through the negative pressure system, and the wafer is pressed on the annular arc-shaped protrusion 10 to form a negative pressure in the annular arc-shaped protrusion 10, so that it can be effectively adsorbed.

[0067] like Figure 5As shown, the turntable driving device includes a rotating connecting rod 12 fixedly mounted on the upper disc 3 and rotating synchronously with the wafer turntable 2, a pushing block 13 for pushing the rotating connecting rod 12 is horizontally and linearly slidably mounted on the base plate 1, the end of the pushing block 13 is close to the side of the rotating connecting rod 12, the pushing block 13 is driven by a linear pushing power device, a reset structure connected with the rotating connecting rod 12 and pulled to rotate the wafer turntable 2 is provided on the base plate 1, and a limiting structure is provided on the base plate 1 to limit the rotation range of the rotating connecting rod 12 to follow the wafer turntable 2; the pushing block 13 is driven by the linear pushing power device to push, and then the pushing block 13 pushes the rotating connecting rod 12 to rotate the wafer turntable 2, when the wafer turntable 2 is to rotate, the reset structure drives the rotation, and at the same time the pushing block 13 pushes the rotating connecting rod 12 to retract; the wafer turntable 2 is effectively driven to rotate stably and accurately, the structure is simple, and the practicality is improved.

[0068] like Figure 8 and Fig. 9 As shown, the upper disc 3 is provided with a receiving groove 14 corresponding to the bottom measuring sensor 8, and a mounting base 15 is installed in the receiving groove 14. A sensor driving cylinder 16 is vertically inserted and installed on the mounting base 15. The upper surface of the mounting base 15 is a reference surface, and the bottom of the sensor driving cylinder 16 is in contact with the reference surface. The mounting base 15 is provided with an air flow channel 17 connected to the sensor driving cylinder 16, and the air flow channel 17 is connected to the cylinder driving air source. The bottom measuring sensor 8 is installed and lifted on the sensor driving cylinder 16. The sensor driving cylinder 16 6 is also provided with a sensor harness 18 connected to the bottom measuring sensor 8, and the upper disc 3 is provided with an auxiliary fixing device for assisting the vertical installation of the sensor driving cylinder 16; inserting the sensor driving cylinder 16 into the mounting base 15 can ensure that it can be effectively connected with the air flow channel 17, and the installation is convenient, and the mounting base 15 is installed in the accommodating groove 14, which can ensure stable installation. This is used as a reference to ensure that the installation is effectively vertical and the measurement is accurate. Then, the auxiliary fixing device is used to ensure that the sensor driving cylinder 16 can be stably raised and lowered, and the sensor harness 18 is used to enable the bottom measuring sensor 8 to be effectively detected, thereby improving the use effect.

[0069] like Figure 2As shown, the lifting and leveling device includes four lifting mounting frames 19 fixedly mounted on the upper disc 3, and the four lifting mounting frames 19 are evenly arranged in a circle with the wafer placement table 6 as the center. A sliding seat is vertically slidably mounted on each lifting mounting frame 19, and the sliding seat is driven by a workbench lifting power device. The workbench lifting power device includes a workbench lifting cylinder, two of which are on the X diameter and defined as X sliding seats 20, and the other two sliding seats are on the Y diameter and defined as Y sliding seats 22. The X sliding seats 20 are fixedly mounted with X adjustment blocks 23, and the Y sliding seats 22 are fixedly mounted with Y adjustment blocks 2 4, the workbench 5 is fixed on the X adjustment block 23 and the Y adjustment block 24, the X adjustment block 23 is divided into an X upper block 231 and an X lower block 232, a Y connection block 26 in the Y direction is provided between the X upper block 231 and the X lower block 232, an X connection block 25 in the X direction is provided between the X lower block 232 and the X sliding seat 20, and gaps are provided between the X upper block 231 and the X lower block 232, and between the X lower block 232 and the X sliding seat 20; the Y adjustment block 24 is divided into a Y upper block 241 and a Y lower block 242, an X connection block 25 in the X direction is provided between the Y upper block 241 and the Y lower block 242, A Y-oriented Y connecting block 26 is provided between the Y lower block 242 and the Y sliding seat 22, and gaps are provided between the Y upper block 241 and the Y lower block 242, and between the Y lower block 242 and the Y sliding seat 22; the lifting mounting frames 19 are evenly distributed at four positions of the circumference on the upper disc 3, so as to ensure that the four lifting mounting frames 19 are symmetrical in pairs, and then the lifting cylinder of the workbench 5 on the lifting mounting frame 19 can drive the sliding seat to lift and lower, and when the four sliding seats are lifted and lowered synchronously, the workbench 5 can be lifted and lowered as a whole, and when horizontal adjustment is required, the sliding seats on the same diameter are lifted and lowered, and when the two X sliding seats 20 are lifted and lowered, the X sliding The Y connection block 26 on the moving seat 20 is twisted, and the Y connection block 26 on the Y sliding seat 22 is also twisted, and the gaps on both sides of the Y connection block 26 are compressed and expanded respectively, so that the wafer placement table 6 can be effectively adjusted horizontally. Since the wafer placement table 6 is close to the X sliding seat 20 when the X sliding seat 20 is lifted, the adjustment range is large. Therefore, the Y connection block 26 is arranged between the X upper block 231 and the X lower block 232, and the Y sliding seat 22 is in the middle of the horizontal adjustment, so the range is small, and the Y connection block 26 is arranged between the Y lower block 232 and the Y sliding seat 22. Conversely, when the Y sliding seat 22 is lifted, the same is true. The structure is simple and the adjustment is convenient.

[0070] Furthermore, a groove is provided at the bottom of the workbench 5 for matching with the X adjustment block 23 and the Y adjustment block 24, and the workbench 5 is fixedly installed with the X adjustment block 23 and the Y adjustment block 24 by screws 27; the workbench 5 can be quickly and accurately buckled on the X adjustment block 23 and the Y adjustment block 24 through the groove, and then fixed by the screws 27, ensuring that when adjusting the level, the workbench 5 can move synchronously with the X adjustment block 23 and the Y adjustment block 24, so that the installation is accurate and firm.

[0071] A connecting tension spring 28 connected to each other is also provided between the upper disc 3 and the workbench 5, which can ensure that the workbench 5 can be effectively pressed on the X adjustment block 23 and the Y adjustment block 24, and when the workbench 5 rises, the connecting tension spring 28 can effectively pull the workbench 5 back to the initial position quickly and accurately.

[0072] like Figure 4 As shown, a vertical slide 29 is provided on the upper disk 3, and a support seat 30 for supporting the ejector 7 is fixedly mounted on the vertical slide 29, and a horizontally extending strip through hole 31 is provided below the support seat 30, and the ejector 7 lifting power device comprises an ejector drive motor 33 fixedly mounted on the upper disk 3, and an eccentric rotating rod 32 is connected to the output end of the ejector drive motor 33, and the eccentric rotating rod 32 is constrained in the strip through hole 31; a mounting plate 38 for supporting the ejector drive motor 33 is provided in the middle of the upper disk 3, and the mounting plate 38 allows the ejector drive motor 33 to be placed horizontally, and then drives the eccentric rotating rod 32 to rotate, so that the eccentric rotating rod 32 drives the support seat 30 with the strip through hole 31 to rise and fall, and the support seat 30 slides along the vertical slide 29, and the lifting and lowering are accurate, ensuring that the wafer can be accurately supported and landed on the wafer placement table 6.

[0073] like Figure 5As shown, the end of the pushing block 13 is provided with an arc protrusion 34, and the arc protrusion 34 is close to the side of the rotating connecting rod 12. The bottom plate 1 is provided with a sliding guide rail 35, and the pushing block 13 is slidably installed on the bottom plate 1 through the sliding guide rail 35; the pushing block 13 is not fixedly connected to the rotating connecting rod 12, so it will deviate when pushing the rotating connecting rod 12 to rotate, and the arc protrusion 34 can facilitate the relative movement with the rotating connecting rod 12 when pushing the rotating connecting rod 12, and ensure that the pushing can also be stable and accurate, and when the arc protrusion 34 pushes the rotating connecting rod 12, since there is a certain distance between the rotating connecting rod 12 and the wafer turntable 2, when rotating the same angle, the rotating connecting rod 12 is stable. The swing distance of the connecting rod 12 can be much greater than the rotation distance of the wafer turntable 2, so the influence of the swing error of the rotating connecting rod 12 can be reduced and the use effect can be improved. The linear propulsion power device includes a voice coil motor 36, which is fixedly mounted on the motor fixing plate 37 and drives the push block 13 to move horizontally and linearly. The voice coil motor 36 has the characteristics of simple structure, small size, high speed, high acceleration and fast response, so the structure can be made more compact. The sliding guide rail 35 is a cross ball guide rail, one part of which is fixed to the push block 13, and the other part is fixed to the base plate 1, so that the push plate can slide linearly and the direction of linear movement can be effectively determined.

[0074] The reset structure includes a reset fixing rod 39 vertically fixed on the base plate 1, and a reset tension spring 40 is provided between the reset fixing rod 39 and the end of the rotating connecting rod 12; the reset tension spring 40 can always pull the rotating connecting rod 12, so that the rotating connecting rod 12 can be pulled back and cooperated with the push block 13 to complete the rotation of the wafer turntable 2. The structure is simple and easy to use. The connection between the reset tension spring 40 and the end of the rotating connecting rod 12 can maximize the force of the reset pull rope spring and improve the reset effect.

[0075] The limiting structure includes limiting bars 41 located on both sides of the rotating connecting rod 12, and the limiting bars 41 are fixedly mounted on the base plate 1; the base plate 1 is also provided with a sensing device for detecting the moving position of the push plate, and the sensing device cooperates with the limiting bars 41 to limit the position; there are two limiting bars 41, which are respectively located on both sides of the rotating connecting rod 12, effectively blocking the swing range of the rotating connecting rod 12, preventing the wafer turntable 2 from rotating excessively, and improving the rotation accuracy; the sensing device is a grating ruler 42, and the grating ruler 42 is fixed on the push block 13 to detect the moving distance of the push block 13; because the push block 13 pushes the rotating connecting rod 12, the rotating connecting rod 12 can only swing back and forth between the limiting bars 41, and the extension distance of the push block 13 corresponds to the rotation angle of the wafer turntable 2, so the distance moved by the push block 13 can be accurately obtained by detecting the grating ruler 42, thereby ensuring accurate rotation and improving the use effect.

[0076] The bottom plate 1 is fixedly provided with a cover shell 43 covering the pushing block 13 ; the cover shell 43 cooperates with the motor fixing plate 37 to effectively protect the pushing block 13 to push safely and stably.

[0077] like Figure 7 As shown, the mounting base 15 is provided with an insertion port 21, the bottom of the sensor driving cylinder 16 is provided with a pipe protrusion 44 that cooperates with the insertion port 21, the upper end surface of the mounting base 15 is located at the edge of the insertion port 21 and is provided with a sealing groove 45, and the sealing groove 45 is provided with a sealing ring that seals with the lower end surface of the pipe protrusion 44; the connection or disconnection with the airflow channel 17 can be completed by inserting or pulling out the pipe protrusion 44, and the sealing ring can effectively improve the sealing effect, so that the sensor driving cylinder 16 is more stable.

[0078] like Figure 6 As shown, the auxiliary fixing device includes an auxiliary rod 46 vertically fixedly installed on the upper disc 3, and a fixed clamping block 47 that clamps each other is provided between the auxiliary rod 46 and the sensor driving cylinder 16; there are three accommodating grooves 14 on the upper disc 3, so there are three mounting bases 15 corresponding to the three accommodating grooves 14 respectively, so each mounting base 15 is inserted and installed with the sensor driving cylinder 16, and then the auxiliary rod 46 is arranged in parallel with the sensor driving cylinder 16, and then the sensor driving cylinder 16 can be effectively fixed with the auxiliary rod 46 as a reference through the fixed clamping block 47, and the fixed clamping block 47 has a simple structure and is easy to use; the fixed clamping block 47 is two fixed half clamping blocks set in mirror image, and a semicircular groove 52 is provided on the fixed half clamping block that fits the auxiliary rod 46 and the sensor driving cylinder 16, so that the semicircular grooves 52 on the two fixed half clamping blocks form a whole circular groove to fix the auxiliary rod 46 and the sensor driving cylinder 16.

[0079] The auxiliary fixing device also includes an auxiliary positioning member 49, on which an inner positioning sleeve 491 sleeved on the auxiliary rod 46 and an outer positioning sleeve 492 sleeved on the sensor driving cylinder are provided, and the fixing clamp 47 is located above the auxiliary positioning member 49; the auxiliary rod 46 is provided with a limiting step 48, and the inner positioning sleeve 491 abuts against the limiting step 48; first, the auxiliary positioning member 49 is sleeved on the sensor driving cylinder 16, and then the inner positioning sleeve 491 of the auxiliary positioning member 49 is sleeved on the auxiliary rod 46, Then insert the sensor driving cylinder 16 into the mounting base 15 to complete the cooperation between the sensor driving cylinder 16 and the mounting base 15, and then fix the fixing clamp 47 on the auxiliary positioning member 49 to further ensure stable fixation and effectively press the sensor driving cylinder 16 on the mounting base 15; the limiting step 48 clamps the inner positioning sleeve 491, so as to ensure that the auxiliary positioning member 49 will not fall, thereby limiting the auxiliary rod 46 and the sensor driving cylinder 16 at a certain height, so that the sensor driving cylinder 16 can be installed more accurately and the constraint is stable and reliable.

[0080] like Figure 8 and Fig. 9 As shown, the accommodating groove 14 is a straight line hole, and a mounting pad 51 that fits in the straight line hole is provided below the mounting base 15. The mounting pad 51 is installed in the straight line hole, and the mounting base 15 and the mounting pad 51 are detachably fixed, and the outlet of the airflow channel 17 is arranged on the side of the mounting base 15; the mounting pad 51 is first fixedly installed in the straight line hole, and then the mounting base 15 is installed on the mounting pad 51, to ensure the leakage of the airflow channel 17 on the mounting base 15, to facilitate connection, and also to facilitate replacement, thereby improving convenience.

[0081] In this embodiment, the number of the bottom measuring sensors 8 is three and they are evenly distributed around the circumference, the number of the corresponding sensor driving cylinders 16 is also three, and the auxiliary positioning member 49 also includes a connecting rod portion 50 that connects the outer positioning sleeve portion 492 in sequence; in this way, the auxiliary positioning member 49 forms a whole, which constrains the three bottom measuring sensors 8. In this way, the auxiliary positioning member 49 can ensure that the corresponding sensor driving cylinder 16 and the corresponding auxiliary rod 46 are effectively arranged in parallel, and at the same time, the three sensor driving cylinders 16 can restrict each other, further improving the installation accuracy, and the three sensor driving cylinders 16 can be inserted into the corresponding mounting base 15 at the same time, which is convenient for installation and improves the use effect.

[0082] The above-described embodiments are merely descriptions of preferred implementations of the present invention and are not intended to limit the scope of the present invention. Various modifications and alterations to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the scope of protection defined by the claims of the present invention.

Claims

1. A method for adjusting a wafer adjustment stage, characterized in that: The adjustment method of the wafer adjustment platform comprises the following steps: S1. Preliminary preparation of equipment, providing a wafer adjustment table, including a bottom plate, on which a wafer turntable is rotatably mounted, a turntable driving device for driving the wafer turntable to rotate is provided on the bottom plate, the wafer turntable includes an upper disc located at the bottom and a shell surrounding the upper disc, a lifting and leveling device is installed on the upper disc, a workbench is installed on the lifting and leveling device, a wafer placement table is installed on the workbench, and the lifting and leveling device drives the wafer placement table to lift and level; a pin is installed on the upper disc to support the wafer lifting and lowering, and the pin is driven by a pin lifting power device, and a plurality of bottom measuring sensors that are lifted and passed through the wafer placement table are also provided on the upper disc, and the bottom measuring sensors are driven by a sensor lifting power device, and a negative pressure channel for negative pressure absorption of the wafer is provided on the wafer placement table, and the negative pressure channel is connected to a negative pressure system; S2, the ejector is driven to rise by the ejector lifting power device, the ejector supports the wafer and then descends, and the wafer falls on the wafer placement table; S3, the negative pressure system extracts air through the negative pressure channel, and the wafer is adsorbed on the wafer placement table; S4, driving the bottom measuring sensor to rise by the sensor lifting power device, and the bottom measuring sensor is against the bottom of the wafer placement table to detect whether the wafer is placed horizontally; S5. The lifting and leveling device adjusts the level and height of the wafer placement table according to the data measured by the bottom measuring sensor; S6. The turntable driving device drives the wafer turntable to rotate, and the wafer rotates to a corresponding etching angle.

2. The method for adjusting a wafer adjustment stage as claimed in claim 1, characterized in that: In the step S4, the upper disc is provided with a receiving groove corresponding to the bottom measuring sensor, a mounting base is installed in the receiving groove, a sensor driving cylinder is vertically inserted and installed on the mounting base, the upper surface of the mounting base is a reference surface, the bottom of the sensor driving cylinder is in contact with the reference surface, an air flow channel connected to the sensor driving cylinder is provided on the mounting base, the air flow channel is connected to the cylinder driving air source, the bottom measuring sensor is installed on the sensor driving cylinder for lifting, the sensor driving cylinder is also provided with a sensor harness connected to the bottom measuring sensor, and an auxiliary fixing device for assisting the vertical installation of the sensor driving cylinder is provided on the upper disc; the method for installing the bottom measuring sensor and determining the initial position is as follows: The sensor driving cylinder drives the bottom measuring sensor to rise and fall, and a receiving groove is opened on the upper disc. The mounting base is installed on the receiving groove with the bottom surface of the receiving groove as a reference; the sensor driving cylinder is inserted and installed on the mounting base. With the upper surface of the mounting base as a reference, after the bottom of the sensor driving cylinder contacts the upper surface of the mounting base, the auxiliary fixing device assists the fixed installation of the sensor driving cylinder to complete the determination of the initial position of the bottom measuring sensor.

3. The method for adjusting a wafer adjustment stage as claimed in claim 2, characterized in that: In the step S6, the turntable driving device includes a rotating connecting rod fixedly mounted on the upper disc and rotating synchronously with the wafer turntable, a pushing block for pushing the rotating connecting rod is horizontally and linearly slidably mounted on the bottom plate, the end of the pushing block is close to the side of the rotating connecting rod, the pushing block is driven by a linear driving power device, a reset structure connected to the rotating connecting rod and pulled to rotate the wafer turntable is provided on the bottom plate, and a limit structure is provided on the bottom plate to limit the rotating connecting rod to follow the rotation range of the wafer turntable; the rotation adjustment method of the wafer turntable is as follows: The linear push power device drives the push block to extend and retract linearly, and the push block extends out to push the rotating connecting rod. The rotating connecting rod swings forward to drive the wafer turntable to rotate until the rotating connecting rod hits the limit structure and stops rotating. Then the push block retracts, and the reset structure pulls the rotating connecting rod to swing backward. At the same time, the push block always presses against the rotating connecting rod to complete the rotation adjustment of the wafer turntable.

4. The method for adjusting a wafer adjustment stage as claimed in claim 3, characterized in that: In the step S5, the lifting and leveling device includes four lifting mounting frames fixedly mounted on the upper disc, the four lifting mounting frames are evenly arranged in a circle with the wafer placement table as the center, each of the lifting mounting frames is vertically slidably mounted with a sliding seat, the sliding seat is driven by a workbench lifting power device, two of the sliding seats are on the X diameter and are defined as X sliding seats, the other two sliding seats are on the Y diameter and are defined as Y sliding seats, the X sliding seats are fixedly mounted with an X adjustment block, the Y sliding seats are fixedly mounted with a Y adjustment block, the workbench is fixed on the X adjustment block and the Y adjustment block, The X adjustment block is divided into an X upper block and an X lower block, a Y connection block in the Y direction is provided between the X upper block and the X lower block, an X connection block in the X direction is provided between the X lower block and the X sliding seat, and gaps are provided between the X upper block and the X lower block, and between the X lower block and the X sliding seat; the Y adjustment block is divided into a Y upper block and a Y lower block, an X connection block in the X direction is provided between the Y upper block and the Y lower block, a Y connection block in the Y direction is provided between the Y lower block and the Y sliding seat, and gaps are provided between the Y upper block and the Y lower block, and between the Y lower block and the Y sliding seat; the horizontal adjustment method of the wafer placement table is as follows: After the wafer is placed on the wafer placement table, when the two X sliding seats are lifted and slid, the Y connecting blocks on the X sliding seats are twisted respectively, driving the wafer placement table to swing up and down on both sides of the X direction, and the Y connecting blocks on the Y sliding seats are also twisted, and the gaps on both sides of the Y connecting blocks are compressed and expanded respectively; when the two Y sliding seats are lifted and slid, the X connecting blocks on the Y sliding seats are twisted respectively, driving the wafer placement table to swing up and down on both sides of the Y direction, and the X connecting blocks on the X sliding seats are also twisted, completing the horizontal adjustment of the wafer placement table.

5. The method for adjusting a wafer adjustment stage as claimed in claim 4, characterized in that: The auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, and a fixed clamping block is provided between the auxiliary rod and the sensor driving cylinder to clamp each other; the auxiliary fixing device also includes an auxiliary positioning piece, and the auxiliary positioning piece is provided with an inner positioning sleeve part sleeved on the auxiliary rod and an outer positioning sleeve part sleeved on the sensor driving cylinder, and the fixed clamping block is located above the auxiliary positioning piece; the auxiliary positioning piece initially constrains the auxiliary rod and the sensor driving cylinder to be parallel to each other and aligns them to be inserted into the mounting base through the inner positioning sleeve part and the outer positioning sleeve part, and the fixed clamping block clamps and fixes the sensor driving cylinder and the auxiliary rod, and the bottom of the sensor driving cylinder is pressed against the mounting base.

6. The method for adjusting a wafer adjustment stage as claimed in claim 5, characterized in that: In the step S6, the bottom plate is also provided with a sensing device for detecting the moving position of the push block, and the sensing device cooperates with the limit lever to limit the position; the sensing device is a grating ruler, and the grating ruler is fixed on the push block to detect the moving distance of the push block; the grating ruler is used to detect the linear extension and retraction distance of the push block, and the linear distance corresponds to the rotation angle of the wafer turntable.

7. The method for adjusting a wafer adjustment stage as claimed in claim 6, characterized in that: In step S5, after the horizontal adjustment of the wafer turntable is completed, the sensor-driven cylinder drives the bottom sensor to rise to detect whether the wafer is level, and then the X slide seat and the Y slide seat are synchronously raised and lowered to adjust the distance between the wafer and the mask.

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