A graphene multi-chip stacking liquid cooling heat dissipation device and method

Abstract

The present invention relates to the technical field of graphene multi-chip heat dissipation, and discloses a graphene multi-chip stacking liquid-cooled heat dissipation device and method, comprising a heat dissipation component and a chip soldered on a mainboard, wherein the mainboard is mounted with a heat dissipation cover acting on the outside of the chip through a buckle, and the top of the heat dissipation cover is provided with a heat dissipation patch acting on the upper surface of the chip, and the top of the heat dissipation patch is provided with a semiconductor. The liquid-cooled heat dissipation device can increase the flow rate of the heat dissipation medium at the local heating part appearing in the process of stacking the graphene multi-chips, and realize rapid heat exchange and cooling by increasing the flow of the heat dissipation medium, and can throttle the heat dissipation medium or reduce the flow rate of the heat dissipation medium at the local non-heating part or the low-heating part, provide precise adjustment of the cooling medium, do not need to increase the amount of cooling medium, reduce the power consumption of the pump, and will not cause unnecessary waste of resources.

Description

Technical Field

[0001] The present invention relates to the technical field of graphene multi-chip heat dissipation, and in particular to a graphene multi-chip stacking liquid cooling heat dissipation device and method. Background Art

[0002] With the rapid development of electronic technology, the integration of integrated circuits (ICs) continues to increase, and the power consumption of chips also increases. In this context, multi-chip module (MCM) technology came into being, which integrates multiple chips in one package to achieve higher performance and more compact size.

[0003] However, with the increase in the number of chip stacking layers and the improvement of integration, the problem of local heating has become increasingly prominent and has become a key factor restricting chip performance and reliability. Chip stacking will increase thermal resistance, making it difficult for local heat to dissipate, and then thermal stress will be concentrated, causing material expansion, which will lead to desoldering between chips, resulting in reduced reliability and performance degradation. If each part is cooled directly, the amount of cooling medium needs to be increased, which will not only increase the power consumption of the pump, but also cause unnecessary waste of resources. Summary of the invention

[0004] The object of the present invention is to provide a graphene multi-chip stacking liquid cooling heat dissipation device and method, aiming to solve the problem of poor local heat dissipation effect of existing graphene chip stacking.

[0005] The present invention is implemented as follows: a graphene multi-chip stacking liquid cooling device comprises a heat dissipation component and a chip soldered on a mainboard, the mainboard is mounted with a heat dissipation cover acting on the outside of the chip through a buckle, a heat dissipation patch acting on the upper surface of the chip is provided on the top of the heat dissipation cover, a semiconductor is provided on the top of the heat dissipation patch, and the heat dissipation component is used to pump a heat dissipation medium into the heat dissipation surface of the semiconductor;

[0006] The chip includes a plurality of bonding slots, in which bonding slot sheets are inserted, heat conducting sheets are arranged at the ends of the bonding slot sheets, and a plurality of heat exchange sheets arranged at the sides of the chip are arranged at both ends of the heat conducting sheets. The inner wall of the heat dissipation cover is also provided with a plurality of local heat dissipation plates installed through a bracket, and the local heat dissipation plates are attached to the heat exchange sheets and are used for dissipating heat from the local heating parts of the chip.

[0007] Preferably, the heat dissipation assembly includes a fan, a plurality of fins, a heat exchange coil and a pump, the heat exchange coil is embedded in the plurality of fins, the air inlet of the fan is placed on the top of the fin, the liquid suction end of the pump is connected to one end of the heat exchange coil, and the other end of the heat exchange coil and the liquid outlet end of the pump are respectively connected to the liquid inlet and liquid outlet of the semiconductor.

[0008] Preferably, both sides of the top of the heat dissipation cover are connected with pressure rods through bearings, the external threads of the pressure rods are connected with pressure plates, and the ends of the pressure plates are connected to the top of the heat dissipation patch.

[0009] Preferably, a thermally conductive silicon pad is attached between the heat sink and the chip.

[0010] Preferably, mounting blocks are provided inside both sides of the heat dissipation cover, the internal bearings of the mounting blocks are connected to adjusting rods, the external threads of the adjusting rods are connected to telescopic rods that penetrate through and extend into the heat dissipation cover, and the brackets are connected through the ends of the telescopic rods.

[0011] Preferably, both ends of the local heat dissipation plate are respectively connected with a liquid injection pipe and a liquid outlet pipe, the ends of the liquid injection pipe and the liquid outlet pipe respectively penetrate and extend to the outside of the mounting block, and are respectively connected with the liquid inlet and outlet of the semiconductor.

[0012] Preferably, a resist is provided on one side of the local heat dissipation plate close to the chip, the resist is located on one side inside the local heat dissipation plate and has two slide grooves, and a memory metal is slidably installed through the two slide grooves, a pressure plate is connected to the memory metal, and a resist corresponding to the pressure plate is also provided on the inner wall of the local heat dissipation plate.

[0013] Preferably, a liquid conducting coil is laid inside the resisting piece, an expansion bag placed between the resisting piece and the resisting plate is connected in series between one end of the liquid conducting coil and the liquid injection pipe, and the other end of the liquid conducting coil is connected to one end of the liquid outlet pipe.

[0014] A graphene multi-chip stack liquid cooling heat dissipation method, applied to the graphene multi-chip stack liquid cooling heat dissipation device, comprises the following steps:

[0015] Step 1: Adjust the positions of several local heat sinks in the heat sink on the bracket according to the chip stacking spacing, attach a thermal conductive silicon pad on the top of the chip, and snap the heat sink onto the mainboard through the buckle;

[0016] Step 2: Rotate the pressure rods around the heat dissipation cover to move the heat dissipation patch at the end of the pressure piece onto the thermal conductive silicon pad;

[0017] Step 3: Turn the adjustment rod on the mounting block to push the bracket toward the side of the chip, keeping the abutment of the local heat sink in contact with the heat exchange plates on both sides of the chip;

[0018] Step 4: Connect one end of the heat exchange coil of the heat dissipation component to the pump in series, and connect the other end of the heat exchange coil and the pump to the liquid inlet and outlet of the semiconductor, and then connect the liquid injection pipe and liquid outlet pipe at both ends of the local heat dissipation plate to the liquid inlet and liquid outlet of the semiconductor respectively;

[0019] Step 5: Start the heat dissipation components and semiconductors, and use the cooling medium to dissipate heat for the semiconductors while continuously cooling the heat dissipation patch;

[0020] Step 6: When high temperature is generated locally in the chip, the bonding slot will transfer the temperature to the heat exchanger through the heat conducting sheet, and the heat exchanger will transfer the temperature to the contact sheet of the local heat sink, causing the memory metal to deform and straighten due to heat, thereby increasing the distance between the contact sheet and the contact plate, expanding the expansion bag, and injecting the cooling medium into the liquid guide coil to take away the heat from the contact sheet, thereby cooling the local heating part of the chip. When the temperature of the local heating part of the chip drops, the memory metal will deform and shrink, and its arched part will push the contact sheet to cooperate with the contact plate to compress the expansion bag, thereby reducing or closing the flow of the cooling medium and providing precise adjustment of the cooling medium.

[0021] The present invention discloses a graphene multi-chip stacking liquid-cooling heat dissipation device and method, the beneficial effects of which are: the liquid-cooling heat dissipation device can increase the flow rate of the heat dissipation medium at the local heating parts appearing in the process of graphene multi-chip stacking, realize rapid heat exchange and cooling by increasing the flow of the heat dissipation medium, and can throttle the heat dissipation medium or reduce the flow rate of the heat dissipation medium at the local non-heating parts or low-heating parts, provide precise adjustment of the cooling medium, do not need to increase the amount of cooling medium, reduce the power consumption of the pump, and will not cause unnecessary waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of a graphene multi-chip stacking liquid cooling device provided by an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of a heat dissipation cover of a graphene multi-chip stacking liquid cooling heat dissipation device provided by an embodiment of the present invention;

[0024] Figure 3 It is a schematic diagram of the cross-sectional structure of a heat dissipation cover of a graphene multi-chip stacking liquid-cooling heat dissipation device provided by an embodiment of the present invention;

[0025] Figure 4 A graphene multi-chip stacking liquid cooling device provided by an embodiment of the present invention Figure 3 Schematic diagram of the local internal structure at A in FIG.

[0026] Figure 5 It is a partial internal structural schematic diagram of a graphene multi-chip stacking liquid cooling heat dissipation device provided by an embodiment of the present invention;

[0027] Figure 6 It is a schematic diagram of the internal structure of a local heat dissipation plate of a graphene multi-chip stacked liquid-cooled heat dissipation device provided by an embodiment of the present invention.

[0028] Marking Description:

[0029] 1. Heat dissipation cover; 2. Heat dissipation patch; 3. Semiconductor; 4. Heat dissipation component; 5. Mainboard;

[0030] 11. Mounting block; 12. Adjustment rod; 13. Telescopic rod; 14. Bracket; 15. Local heat dissipation plate;

[0031] 151, abutment sheet; 152, liquid guiding coil; 153, slideway; 154, memory metal; 155, pressing sheet; 156, liquid injection tube; 157, liquid outlet tube; 158, expansion bag; 159, abutment plate;

[0032] 21. Press rod; 22. Press sheet; 23. Thermal conductive silicon pad;

[0033] 41. Fan; 42. Fin; 43. Heat exchange coil; 44. Pump;

[0034] 51. Chip; 52. Bonding slot; 53. Bonding slot plate; 54. Heat conducting plate; 55. Heat exchanging plate. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0037] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0038] In this embodiment:

[0039] Reference Figure 1-2 As shown, a preferred embodiment of the present invention is provided.

[0040] The graphene multi-chip stacking liquid cooling device of this embodiment includes a heat dissipation component 4 and a chip 51 soldered on a mainboard 5, wherein the mainboard 5 is provided with a heat dissipation cover 1 acting on the outside of the chip 51 through a buckle, and a heat dissipation patch 2 acting on the upper surface of the chip 51 is provided on the top of the heat dissipation cover 1, and a semiconductor 3 is provided on the top of the heat dissipation patch 2, and the heat dissipation component 4 is used to pump a heat dissipation medium into the heat dissipation surface of the semiconductor 3;

[0041] Among them, Figure 5 In the embodiment, the chip 51 includes a plurality of bonding slots 52, in which bonding slot sheets 53 are inserted, and ends of the bonding slot sheets 53 are provided with heat conducting sheets 54, and both ends of the heat conducting sheets 54 are provided with a plurality of heat exchange sheets 55 placed on the sides of the chip 51. The inner wall of the heat dissipation cover 1 is also provided with a plurality of local heat dissipation plates 15 through a bracket 14, and the local heat dissipation plates 15 are attached to the heat exchange sheets 55 and are used to dissipate heat from the local heating parts of the chip 51.

[0042] The heat dissipation assembly 4 includes a fan 41, a plurality of fins 42, a heat exchange coil 43 and a pump 44. The heat exchange coil 43 is embedded in the plurality of fins 42. The air inlet of the fan 41 is placed on the top of the fins 42. The liquid suction end of the pump 44 is connected to one end of the heat exchange coil 43. The other end of the heat exchange coil 43 and the liquid outlet end of the pump 44 are respectively connected to the liquid inlet and the liquid outlet of the semiconductor 3. The heat dissipation medium is continuously sent to the heat dissipation surface of the semiconductor 3 through the pump 44, and the heat dissipation medium after heat exchange is sent to the heat exchange coil 43. After heat exchange through the fins 42, the fan 41 is used to perform heat dissipation operation.

[0043] Moreover, in the attached Figure 2 In the embodiment, both sides of the top of the heat dissipation cover 1 are connected with a pressure rod 21 through a bearing, and a pressure plate 22 is connected to the outside of the pressure rod 21 through a thread, and the end of the pressure plate 22 is connected to the top of the heat dissipation patch 2, and a thermal conductive silicon pad 23 is attached between the heat dissipation patch 2 and the chip 51. The heat dissipation patch 2 at the end of the pressure plate 22 is driven to sink by rotating the pressure rod 21, so that it can cooperate with the thermal conductive silicon pad 23 to act on the upper surface of the chip 51 of different specifications, so that the upper surface of the chip 51 can be basically cooled by the semiconductor 3;

[0044] For further information, see Attachment Figure 3-4As shown, mounting blocks 11 are provided inside both sides of the heat dissipation cover 1, and the internal bearing of the mounting block 11 is connected to an adjusting rod 12, and the external thread of the adjusting rod 12 is connected to a telescopic rod 13 that penetrates and extends into the heat dissipation cover 1, and the bracket 14 is connected through the end of the telescopic rod 13. When adjusting the distance between the local heat dissipation plate 15 and the heat exchange plate 55 of the chip 51, the adjusting rod 12 is rotated to push the telescopic rod 13 to extend and retract by the thread, and the bracket 14 is pushed to move away from or close to the heat exchange plate 55 to meet the heat dissipation requirements of different chip 51 specifications.

[0045] It is worth noting that in the attached Figure 2 In the embodiment, both ends of the local heat dissipation plate 15 are connected with a liquid injection pipe 156 and a liquid outlet pipe 157, respectively. The ends of the liquid injection pipe 156 and the liquid outlet pipe 157 respectively penetrate and extend to the outside of the mounting block 11, and are respectively connected with the liquid inlet and the liquid outlet of the semiconductor 3, so that the pump 44 can be injected into the local heat dissipation plate 15 through the liquid injection pipe 156 and the liquid outlet pipe 157, so as to cool down the local heating part of the chip 51;

[0046] Among them, in the attached Figure 6 In the embodiment, a side of the local heat dissipation plate 15 close to the chip 51 is provided with a pressing piece 151, and the pressing piece 151 is located on one side of the local heat dissipation plate 15 and has two slide grooves 153, and a memory metal 154 is slidably installed through the two slide grooves 153. The memory metal 154 will be straightened due to elastic deformation under heat, and the middle part will bend due to the memory effect during cooling. A pressing piece 155 is connected to the memory metal 154, and a pressing plate 159 corresponding to the pressing piece 155 is also provided on the inner wall of the local heat dissipation plate 15, and a liquid guide coil 152 is laid inside the pressing piece 151, and one end of the liquid guide coil 152 is connected in series with the liquid injection pipe 156. An expansion bag 158 is connected between the pressure piece 155 and the plate 159, and the other end of the liquid guiding coil 152 is connected to one end of the liquid outlet pipe 157. The memory effect of the memory metal 154 is used to control the deformation according to the temperature of the local heating part of the chip 51, so that the pressure piece 155 cooperates with the plate 159 to squeeze and release the expansion bag 158, thereby realizing the control of the flow of the heat dissipation medium, which can prevent the heat dissipation medium from flowing to the part that does not need cooling, and can also increase the flow of the heat dissipation medium according to the heat in the part that needs cooling, without increasing the amount of cooling medium, and also reduces the power consumption of the pump 44, and will not cause unnecessary waste of resources.

[0047] The present embodiment also discloses a graphene multi-chip stack liquid cooling heat dissipation method, which is applied to the graphene multi-chip stack liquid cooling heat dissipation device, including the following steps: adjusting the positions of a plurality of local heat dissipation plates 15 in the heat dissipation cover 1 on the bracket 14 according to the spacing of the chip 51 stacking, attaching a thermal conductive silicon pad 23 on the top of the chip 51, and snapping the heat dissipation cover 1 onto the main board 5 through a buckle; rotating the pressure rods 21 around the heat dissipation cover 1 to apply the heat dissipation patch 2 at the end of the pressure plate 22 to the top of the thermal conductive silicon pad 23; rotating the adjustment rod 12 on the mounting block 11 to push the bracket 14 toward the side of the chip 51, keeping the abutment plate 151 of the local heat dissipation plate 15 in contact with the heat exchange plates 55 on both sides of the chip 51; connecting one end of the heat exchange coil 43 of the heat dissipation component 4 in series with the pump 44, and connecting the other end of the heat exchange coil 43 and the pump 44 to the liquid inlet and outlet of the semiconductor 3, and then connecting the injection pipe 156 and the liquid outlet pipe 157 at both ends of the local heat dissipation plate 15 to the heat exchange plate 55 on both sides of the chip 51 respectively. It is connected to the liquid inlet and outlet of the semiconductor 3; the heat dissipation component 4 and the semiconductor 3 are started, and the cooling medium is used to dissipate heat for the semiconductor 3 while continuously cooling the heat dissipation patch 2; when high temperature is generated locally at the chip 51, the bonding slot 53 will transfer the temperature to the heat exchange plate 55 through the heat conductive plate 54, and the heat exchange plate 55 will transfer the temperature to the abutment 151 of the local heat dissipation plate 15, causing the memory metal 154 to be deformed and stretched by heat, so that the distance between the pressing plate 155 and the abutment 159 is enlarged, the expansion capsule 158 is expanded, and the cooling medium can be injected into the liquid guide coil 152 to take away the heat on the abutment 151, so as to cool the local heating part of the chip 51. When the temperature of the local heating part of the chip 51 drops, the memory metal 154 will deform and shrink, and its arched part will push the pressing plate 155 to cooperate with the abutment 159 to compress the expansion capsule 158, thereby reducing or closing the flow of the cooling medium and providing precise adjustment of the cooling medium.

[0048] The present liquid cooling device can increase the flow of the heat dissipation medium at the local heating parts appearing in the process of stacking multiple graphene chips, realize rapid heat exchange and cooling by increasing the flow of the heat dissipation medium, and can throttle the heat dissipation medium or reduce the flow of the heat dissipation medium at the local non-heating parts or low-heating parts, provide precise adjustment of the cooling medium, do not need to increase the amount of cooling medium, and also reduce the power consumption of the pump 44, without causing unnecessary waste of resources.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A graphene multi-chip stacking liquid cooling device, comprising a heat dissipation component and a chip soldered on a mainboard, characterized in that: The mainboard is mounted with a heat dissipation cover acting on the outside of the chip through a buckle, a heat dissipation patch acting on the upper surface of the chip is provided on the top of the heat dissipation cover, a semiconductor is provided on the top of the heat dissipation patch, and the heat dissipation component is used to pump a heat dissipation medium into the heat dissipation surface of the semiconductor; The chip includes a plurality of bonding slots, and a bonding slot sheet is inserted in the bonding slot, and a heat conducting sheet is arranged at the end of the bonding slot sheet, and a plurality of heat exchange sheets are arranged at both ends of the heat conducting sheet as far as the side of the chip, and a plurality of local heat dissipation plates are installed on the inner wall of the heat dissipation cover through a bracket, and the local heat dissipation plates are attached to the heat exchange sheets and are used to dissipate heat at the local heating part of the chip; Mounting blocks are provided inside both sides of the heat dissipation cover, and both ends of the local heat dissipation plate are respectively connected with a liquid injection pipe and a liquid outlet pipe, and the ends of the liquid injection pipe and the liquid outlet pipe respectively penetrate and extend to the outside of the mounting block and are respectively connected with the liquid inlet and liquid outlet of the semiconductor; A resist sheet is arranged on one side of the local heat dissipation plate close to the chip, and two slide grooves are arranged on one side of the resist sheet inside the local heat dissipation plate, and a memory metal is slidably installed through the two slide grooves, and a resist sheet is connected to the memory metal, and a resist sheet corresponding to the resist sheet is also arranged on the inner wall of the local heat dissipation plate; A liquid conducting coil is laid inside the abutment sheet, an expansion bag placed between the abutment sheet and the abutment plate is connected in series between one end of the liquid conducting coil and the liquid injection tube, and the other end of the liquid conducting coil is connected to one end of the liquid outlet tube.

2. A graphene multi-chip stacking liquid cooling device as claimed in claim 1, characterized in that: The heat dissipation component includes a fan, a plurality of fins, a heat exchange coil and a pump. The heat exchange coil is embedded in the plurality of fins. The air inlet of the fan is placed on the top of the fin. The liquid suction end of the pump is connected to one end of the heat exchange coil. The other end of the heat exchange coil and the liquid outlet end of the pump are respectively connected to the liquid inlet and liquid outlet of the semiconductor.

3. A graphene multi-chip stacking liquid cooling device as claimed in claim 1, characterized in that: Both sides of the top of the heat dissipation cover are connected with pressure rods through bearings, and the external threads of the pressure rods are connected with pressure plates, and the ends of the pressure plates are connected to the top of the heat dissipation patch.

4. A graphene multi-chip stacking liquid cooling device as claimed in claim 1, characterized in that: A thermally conductive silicon pad is attached between the heat dissipation patch and the chip.

5. A graphene multi-chip stacking liquid cooling device as claimed in claim 2, characterized in that: Mounting blocks are provided inside both sides of the heat dissipation cover, the internal bearings of the mounting blocks are connected to adjusting rods, the external threads of the adjusting rods are connected to telescopic rods that penetrate and extend into the heat dissipation cover, and the brackets are connected through the ends of the telescopic rods.

6. A graphene multi-chip stack liquid cooling method, applied to the graphene multi-chip stack liquid cooling device according to any one of claims 1 to 5, characterized in that: The steps include: Step 1: Adjust the positions of several local heat sinks in the heat sink on the bracket according to the chip stacking spacing, attach a thermal conductive silicon pad on the top of the chip, and snap the heat sink onto the mainboard through the buckle; Step 2: Rotate the pressure rods around the heat dissipation cover to move the heat dissipation patch at the end of the pressure piece onto the thermal conductive silicon pad; Step 3: Turn the adjustment rod on the mounting block to push the bracket toward the side of the chip, keeping the abutment of the local heat sink in contact with the heat exchange plates on both sides of the chip; Step 4: Connect one end of the heat exchange coil of the heat dissipation component to the pump in series, and connect the other end of the heat exchange coil and the pump to the liquid inlet and outlet of the semiconductor, and then connect the liquid injection pipe and liquid outlet pipe at both ends of the local heat dissipation plate to the liquid inlet and liquid outlet of the semiconductor respectively; Step 5: Start the heat dissipation components and semiconductors, and use the cooling medium to dissipate heat for the semiconductors while continuously cooling the heat dissipation patch; Step 6: When high temperature is generated locally in the chip, the bonding slot will transfer the temperature to the heat exchanger through the heat conducting sheet, and the heat exchanger will transfer the temperature to the contact sheet of the local heat sink, causing the memory metal to deform and straighten due to heat, thereby increasing the distance between the contact sheet and the contact plate, expanding the expansion bag, and injecting the cooling medium into the liquid guide coil to take away the heat from the contact sheet, thereby cooling the local heating part of the chip. When the temperature of the local heating part of the chip drops, the memory metal will deform and shrink, and its arched part will push the contact sheet to cooperate with the contact plate to compress the expansion bag, thereby reducing or closing the flow of the cooling medium and providing precise adjustment of the cooling medium.

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