Surface treatment device for high-density interconnection printed circuit board

Abstract

The invention discloses a surface treatment device for a high-density interconnected printed circuit board, which comprises a soaking system, the soaking system comprises a soaking box and a vibration mechanism, and the vibration mechanism is arranged at the bottom of the soaking box to promote bubbles to be separated from the surface of the circuit board; the drying system comprises a drying bin, the drying bin is fixedly connected to the machine frame, electric heating wires are arranged on the inner wall of the drying bin in a surrounding mode through a temperature controller, the temperature is accurately controlled through the temperature controller, a temperature rising curve can be set according to the coating curing requirement, accurate heating is achieved, and an exhaust fan is installed at the top of the drying bin. An air outlet is formed in the bottom of the drying bin to form air convection, and solvent steam is discharged in time. The device has the advantages that through cooperation of the vibration motor and the rotating motor and cooperation of the inclined material guiding base and rotation of the circuit board, bubbles are greatly reduced, uniform coating is achieved, it is ensured that a coating is compact and stable in electrical performance, the drying system is precisely controlled to be matched with coating curing, and the excellent coating quality is guaranteed in an all-around mode.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board surface treatment, in particular to a surface treatment device for a high-density interconnected printed circuit board. Background Art

[0002] In the field of electronic manufacturing, as electronic products develop rapidly towards miniaturization and high performance, the application of high-density interconnected printed circuit boards is becoming more and more extensive. Traditional circuit board surface treatment technology has gradually exposed many disadvantages when facing the increasingly stringent quality requirements of high-density interconnected printed circuit boards.

[0003] In the coating process, in the early days, simple immersion or spraying methods were mostly relied on, and there was a lack of effective means to remove bubbles, which resulted in bubbles easily remaining on the surface of the circuit board and in the complex internal structure. These bubbles will be transformed into defects such as pinholes and bubble marks during subsequent drying or use, seriously affecting the density and protective performance of the coating. Since the coating cannot provide a reliable protective barrier for the circuit board, external impurities such as water vapor and dust can easily invade the circuit board, corrode the lines and components, and then threaten the electrical insulation of the circuit board, easily causing short circuits, signal interference and other faults, and ultimately reducing the reliability and service life of electronic products. Especially in some fields with extremely high stability requirements, such as aerospace, high-end medical equipment, etc., even tiny bubble defects can lead to catastrophic consequences and bring huge hidden dangers to the normal operation of the equipment.

[0004] Moreover, the traditional coating process also has the problem of paint waste. Simple immersion or spraying methods are difficult to accurately control the amount and flow direction of the paint, which often leads to uneven distribution of the paint on the circuit board, paint accumulation in some areas, and insufficient coverage in other areas. This not only causes paint waste and increases production costs, but also makes it difficult to ensure the coating quality of the circuit board, further restricting the performance improvement of electronic products.

[0005] Therefore, we propose a surface treatment device for a high-density interconnected printed circuit board to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to solve the problems in the prior art and to propose a surface treatment device for a high-density interconnected printed circuit board.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions: A surface treatment device for a high-density interconnected printed circuit board, comprising: A soaking system, the soaking system comprising a soaking box and a vibration mechanism, the vibration mechanism is arranged at the bottom of the soaking box to cause bubbles to separate from the surface of the circuit board; The drying system includes a drying bin fixedly connected to a frame, an inner wall of the drying bin is provided with a heating wire surrounded by a thermostat, the temperature is precisely controlled by the thermostat, and a heating curve can be set according to the coating curing requirements to achieve precise heating, an exhaust fan is installed on the top of the drying bin, and an exhaust port is provided at the bottom of the drying bin to form air convection, discharge solvent vapor in time, and ensure a safe and efficient drying environment.

[0008] In the above-mentioned surface treatment device for high-density interconnected printed circuit boards, a material guide seat is obliquely arranged on the inner bottom wall of the immersion box, a drain pipe is connected to the side wall of the immersion box, and the drain pipe is arranged at the lowest point of the material guide seat, and a valve is installed on the drain pipe.

[0009] In the above-mentioned surface treatment device for a high-density interconnected printed circuit board, the vibration mechanism includes a mounting plate, and the mounting plate is slidably connected to a frame, the mounting plate is fixedly connected to the lower end surface of the immersion box, a protective cover is fixedly connected to the outer wall of the frame, a vibration motor is installed on the outer wall of the protective cover, the output shaft of the vibration motor extends into the protective cover and is installed with a synchronous belt assembly, both output ends of the synchronous belt assembly are installed with vibration shafts, and one of the vibration shafts is connected to the output shaft of the vibration motor, and a plurality of eccentric wheels are evenly spaced on each of the vibration shafts.

[0010] In the above-mentioned surface treatment device for high-density interconnected printed circuit boards, the synchronous belt assembly includes two synchronous wheels that are symmetrically arranged, and each synchronous wheel is installed on a vibration shaft at a corresponding position, and a synchronous belt is installed on the two synchronous wheels.

[0011] In the above-mentioned surface treatment device for high-density interconnected printed circuit boards, a horizontal electric slide rail is horizontally installed on the frame, a sliding seat is slidably connected to the horizontal electric slide rail, an L-shaped mounting seat is fixedly connected to the sliding seat to ensure that the L-shaped mounting seat does not enter the drying bin when the circuit board enters the drying bin, a vertical electric slide rail is vertically arranged on the L-shaped mounting seat, a movable plate is slidably connected to the vertical electric slide rail, and a plurality of L-shaped connecting rods are symmetrically installed on the movable plate to ensure that the L-shaped mounting seat does not come into contact with the liquid when the circuit board is immersed in the liquid, a fixed plate is commonly connected to a plurality of the L-shaped connecting rods, a rotating motor is installed on the side wall of the fixed plate, the output shaft of the rotating motor passes through the fixed plate and is installed with an extension frame, a buffer plate is fixedly connected to the extension frame, an outer frame is installed on the buffer plate, an inner frame is rotatably connected to the outer frame, and a plurality of clamping cylinders are passed through the inner frame.

[0012] In the above-mentioned surface treatment device for the high-density interconnected printed circuit board, a bevel gear ring is fixedly connected to the side wall of the fixed plate, a sealed cavity is opened on the extension frame, a mounting shaft 1 and a mounting shaft 2 are horizontally mounted on the extension frame, and the inner frame is arranged on the mounting shaft 2, the mounting shaft 1 and the mounting shaft 2 extend into the sealed cavity and are respectively mounted with a first sprocket and a second sprocket, a chain is jointly sleeved on the first sprocket and the second sprocket, the mounting shaft 1 extends out of the sealed cavity and is mounted with a bevel gear, and the bevel gear is meshed with the bevel gear ring.

[0013] In the above-mentioned surface treatment device for high-density interconnected printed circuit boards, a control panel is provided on the frame, a temperature sensor 1 and a pH value sensor are installed inside the immersion box, and both the temperature sensor 1 and the pH value sensor are electrically connected to the control panel.

[0014] In the above-mentioned surface treatment device for high-density interconnected printed circuit boards, a second temperature sensor and a humidity sensor are installed on the inner wall of the drying chamber, and both the second temperature sensor and the humidity sensor are electrically connected to the control panel.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. In the immersion process, the vibration mechanism and the rotating motor work together. The vibration motor drives the eccentric wheel to rotate, causing the immersion box to vibrate up and down, destroying the steady state of bubbles from a macro level and causing them to detach from the circuit board; the rotating motor drives the circuit board to rotate, and cooperates with the vibration to allow the coating to penetrate into the complex structure under the action of centrifugal force and scouring from a micro perspective, driving away bubbles and minimizing the adhesion of bubbles on the surface and internal structure of the circuit board, effectively avoiding defects such as pinholes and bubble marks in the coating, ensuring that the coating is dense and uniform, and greatly improving the protection performance and appearance smoothness.

[0016] 2. The drying system has precise temperature control. The temperature rise curve is preset according to the characteristics of the coating. The heating wire generates heat strictly according to the instructions. The efficient convection constructed by the exhaust fan and the exhaust vent creates an ideal temperature and humidity environment for the volatilization of the coating solvent and the curing reaction, ensuring that the coating is chemically cross-linked and physically dried as expected, and that key properties such as hardness, adhesion, and corrosion resistance meet the standards, so that the circuit board can operate reliably under complex working conditions.

[0017] 3. Under the control of the control system, horizontal electric slides, vertical electric slides and various motors and cylinders can orderly complete a series of operations such as circuit board clamping, transfer, and angle adjustment, which greatly reduces manual intervention, reduces labor costs and the risk of operational errors, improves production efficiency and product quality stability, and adapts to large-scale and batch production needs.

[0018] 4. The fixture system adopts an adjustable clamping cylinder and a rotating inner frame design, which can flexibly cope with high-density interconnected printed circuit boards of different sizes and shapes. Whether it is a conventional rectangular board or a slightly irregular circuit board, it can be firmly clamped and accurately processed without frequent replacement of fixtures, thereby improving the versatility of the equipment.

[0019] In summary, the present invention greatly reduces bubbles and achieves uniform coating through the coordination of vibration and rotation motors, and the inclined material guide seat cooperates with the rotation of the circuit board, ensuring dense coating and stable electrical performance. In addition, the drying system has precise temperature control to adapt to paint curing, thereby ensuring excellent coating quality in all aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a surface treatment device for a high-density interconnected printed circuit board proposed by the present invention; Figure 2 A visual diagram from another perspective of a surface treatment device for a high-density interconnected printed circuit board proposed by the present invention; Figure 3 A schematic diagram of the structure of a partial immersion system in a surface treatment device for a high-density interconnected printed circuit board proposed by the present invention; Figure 4 for Figure 2 Schematic diagram of the structure after removing the rack and immersion system; Figure 5 for Figure 4 Another visual perspective; Figure 6 This is an enlarged view of the structure of the conical gear ring part in the surface treatment device for a high-density interconnected printed circuit board proposed by the present invention; Figure 7 for Figure 6 Schematic diagram of the structure after removing the extension frame.

[0021] In the figure: 1 frame, 2 drying bin, 3 horizontal electric slide rail, 4 exhaust fan, 5 L-type mounting seat, 6 mounting plate, 7 eccentric wheel, 8 immersion box, 9 protective cover, 10 vibration motor, 11 drainage pipe, 12 synchronous wheel, 13 synchronous belt, 14 material guide seat, 15 sliding seat, 16 vertical electric slide rail, 17 moving plate, 18 L-type connecting rod, 19 fixed plate, 20 bevel gear ring, 21 buffer plate, 22 outer frame, 23 exhaust port, 24 heating wire, 25 inner frame, 26 clamping cylinder, 27 extension frame, 28 bevel gear, 29 rotating motor, 30 mounting shaft one, 31 second sprocket, 32 chain, 33 mounting shaft two. DETAILED DESCRIPTION

[0022] The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Example

[0023] Reference Figure 1-7 , a surface treatment device for a high-density interconnected printed circuit board, comprising a frame 1, on which a soaking system and a drying system are provided; The soaking system includes a soaking box 8 and a vibration mechanism. A material guide seat 14 is obliquely arranged on the inner bottom wall of the soaking box 8. A drain pipe 11 is connected to the side wall of the soaking box 8. The drain pipe 11 is arranged at the lowest point of the material guide seat 14. A valve is installed on the drain pipe 11. The vibration mechanism is arranged at the bottom of the immersion box 8 to cause the bubbles to leave the surface of the circuit board. The vibration mechanism includes a mounting plate 6, and the mounting plate 6 is slidably connected to the frame 1, and the mounting plate 6 is fixedly connected to the lower end surface of the immersion box 8. A protective cover 9 is fixedly connected to the outer wall of the frame 1, and a vibration motor 10 is installed on the outer wall of the protective cover 9. The output shaft of the vibration motor 10 extends into the protective cover 9 and is installed with a synchronous belt assembly. The two output ends of the synchronous belt assembly are installed with vibration shafts, and one of the vibration shafts is connected to the output shaft of the vibration motor 10. A number of eccentrics are evenly sleeved on each vibration shaft. The synchronous belt assembly includes two synchronous wheels 12 that are symmetrically arranged, and each synchronous wheel 12 is installed on a vibration shaft corresponding to the position, and a synchronous belt 13 is installed on the two synchronous wheels 12. The drying system includes a drying bin 2, and the drying bin 2 is fixedly connected to the frame 1. The inner wall of the drying bin 2 is surrounded by a heating wire 24 through a thermostat. The temperature is accurately controlled by the thermostat. The heating curve can be set according to the coating curing requirements to achieve precise heating. An exhaust fan 4 is installed on the top of the drying bin 2, and an exhaust port 23 is opened at the bottom of the drying bin 2 to form air convection, discharge solvent vapor in time, and ensure a safe and efficient drying environment.

[0024] A horizontal electric slide rail 3 is horizontally installed on the frame 1, and a sliding seat 15 is slidably connected to the horizontal electric slide rail 3. An L-shaped mounting seat 5 is fixedly connected to the sliding seat 15 to ensure that the L-shaped mounting seat 5 does not enter the drying bin 2 when the circuit board enters the drying bin 2. A vertical electric slide rail 16 is vertically arranged on the L-shaped mounting seat 5, and a moving plate 17 is slidably connected to the vertical electric slide rail 16. A plurality of L-shaped connecting rods 18 are symmetrically installed on the moving plate 17 to ensure that the L-shaped mounting seat 5 does not come into contact with the liquid when the circuit board is immersed in the liquid. A fixed plate 19 is commonly connected to the plurality of L-shaped connecting rods 18. A rotating motor 29 is installed on the side wall of the fixed plate 19. The output shaft of the rotating motor 29 passes through the fixed plate 19 and is installed with an extension frame 27. A buffer plate 21 is fixedly connected to the extension frame 27. An outer frame 22 is installed on the buffer plate 21. An inner frame 25 is rotatably connected to the outer frame 22, and a plurality of clamping cylinders 26 are passed through the inner frame 25. A bevel gear ring 20 is fixedly connected to the side wall of the fixed plate 19, a sealed cavity is opened on the extension frame 27, a mounting shaft 1 30 and a mounting shaft 2 33 are horizontally mounted on the extension frame 27, and the inner frame 25 is arranged on the mounting shaft 2 33, the mounting shaft 1 30 and the mounting shaft 2 33 extend into the sealed cavity and are respectively mounted with a first sprocket and a second sprocket 31, a chain 32 is jointly sleeved on the first sprocket and the second sprocket 31, the mounting shaft 1 30 extends out of the sealed cavity and is mounted with a bevel gear 28, and the bevel gear 28 is meshed with the bevel gear ring 20.

[0025] A control panel is provided on the frame 1, a temperature sensor 1 and a pH value sensor are installed inside the soaking box 8, and the temperature sensor 1 and the pH value sensor are electrically connected to the control panel, and a temperature sensor 2 and a humidity sensor are installed on the inner wall of the drying bin 2, and the temperature sensor 2 and the humidity sensor are electrically connected to the control panel.

[0026] When the operation starts, the circuit board is accurately placed in the clamp system composed of the inner frame 25, the outer frame 22 and the clamping cylinder 26. The clamping cylinder 26 receives the command to start, the piston extends, and drives the clamp to clamp the circuit board so that it is fixed on the inner frame 25. The inner frame 25 is rotatably connected to the outer frame 22 to facilitate subsequent adjustments. At this time, the horizontal electric slide 3 and the vertical electric slide 16 are running at the same time. According to the preset procedure, the clamp with the circuit board is smoothly moved to the specified position above the immersion box 8, ready to be immersed in the paint. The clamp slowly descends with the circuit board at an appropriate speed and is immersed in the paint in the immersion box 8. The bottom of the immersion box 8 is provided with an inclined material guide seat 14, which is conducive to the flow of paint and ensures that all parts of the circuit board are in full and uniform contact with the paint.

[0027] At the same time, the vibration mechanism starts, the vibration motor 10 is powered on, the output shaft drives the synchronous belt assembly to work, the synchronous wheel 12 cooperates, and the power is transmitted to the two vibration shafts through the synchronous belt 13. The eccentric wheel 7 rotates at high speed to generate periodic centrifugal force, so that the mounting plate 6 drives the immersion box 8 to vibrate up and down. This vibration destroys the stability of the bubbles in the paint and causes the bubbles to detach from the surface of the circuit board. The rotating motor 29 works, and its power output is meshed with the bevel gear ring 20 through the bevel gear 28, changing the direction of the force, driving the mounting shaft 1 30 to rotate, and the chain 32 transmits the power to the second sprocket 31 on the mounting shaft 2 33, driving the inner frame 25 to rotate, thereby causing the circuit board to rotate. This can not only allow the paint to penetrate into the grooves, holes and other structures of the circuit board to ensure uniform coating, but also cooperate with the vibration mechanism to promote the efficient detachment of bubbles and improve the coating quality by means of centrifugal force and the scouring effect of the paint.

[0028] During the soaking process, the temperature sensor 1 and the pH sensor in the soaking box 8 monitor the temperature and pH of the coating in real time, and the data is transmitted to the control panel. The operator adjusts the coating state accordingly to provide a suitable environment for soaking the circuit board.

[0029] After the circuit board is immersed in the coating for a predetermined time, the vibration and rotation mechanisms are closed in turn, and the horizontal electric slide rail 3 and the vertical electric slide rail 16 run in the opposite direction, slowly lifting the fixture and the circuit board, smoothly moving them out of the immersion box 8, and transferring them to the drying system to complete the connection between the immersion and drying links. When the circuit board is immersed and about to enter the drying chamber 2, the rotating motor 29 is started again, and the angle of the circuit board is adjusted according to the precision transmission link, combined with the characteristics of the circuit board and the drying requirements, so that it enters the drying chamber 2 in a posture that adapts to the drying process. At the same time, auxiliary structures such as the L-shaped mounting seat 5 play a role in ensuring that the circuit board enters the drying chamber 2 smoothly, avoiding contact with high-temperature components and liquid residues in the chamber, and ensuring the normal drying process.

[0030] After the circuit board enters the drying chamber 2, the chamber door is closed, and the electric heating wire 24 starts to heat up under the control of the thermostat. The thermostat adjusts the power of the electric heating wire 24 in real time according to the pre-set temperature rise curve that conforms to the curing characteristics of the paint, so that the temperature in the chamber gradually rises, prompting the paint solvent to volatilize stably and the coating to cure evenly. The exhaust fan 4 at the top of the drying chamber 2 cooperates with the exhaust port 23 at the bottom to form air convection, and the solvent vapor is quickly discharged out of the chamber after it is generated. This not only creates a safe drying environment and prevents solvent accumulation, but also improves heat exchange efficiency, speeds up drying, and improves production efficiency. During the drying process, the temperature sensor 2 and the humidity sensor on the inner wall of the drying chamber 2 monitor the temperature and humidity in the chamber in real time, and the data is fed back to the control panel. The operator makes fine adjustments accordingly to ensure the stability of the drying quality and ensure that the circuit board meets the standard requirements.

[0031] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface treatment device for a high density interconnected printed circuit board, characterized in that: include A soaking system, the soaking system comprising a soaking box (8) and a vibration mechanism, wherein the vibration mechanism is arranged at the bottom of the soaking box (8) to cause bubbles to separate from the surface of the circuit board; A drying system, the drying system comprising a drying chamber (2), wherein the drying chamber (2) is fixedly connected to a frame (1), the inner wall of the drying chamber (2) is surrounded by a thermostat and provided with a heating wire (24), the temperature is precisely controlled by the thermostat, the temperature rise curve can be set according to the coating curing requirements, and precise heating is achieved, an exhaust fan (4) is installed on the top of the drying chamber (2), and an exhaust port (23) is opened at the bottom of the drying chamber (2) to form air convection, timely discharge solvent vapor, and ensure a safe and efficient drying environment.

2. The surface treatment device for a high density interconnected printed circuit board according to claim 1, characterized in that: A material guide seat (14) is obliquely arranged on the inner bottom wall of the soaking box (8), a liquid discharge pipe (11) is connected to the side wall of the soaking box (8), and the liquid discharge pipe (11) is arranged at the lowest point of the material guide seat (14), and a valve is installed on the liquid discharge pipe (11).

3. The surface treatment device for a high density interconnection printed circuit board according to claim 1, characterized in that: The vibration mechanism comprises a mounting plate (6), and the mounting plate (6) is slidably connected to the frame (1), the mounting plate (6) is fixedly connected to the lower end surface of the immersion box (8), a protective cover (9) is fixedly connected to the outer wall of the frame (1), a vibration motor (10) is installed on the outer wall of the protective cover (9), the output shaft of the vibration motor (10) extends into the protective cover (9) and is installed with a synchronous belt assembly, both output ends of the synchronous belt assembly are installed with vibration shafts, and one of the vibration shafts is connected to the output shaft of the vibration motor (10), and a plurality of eccentric wheels (7) are sleeved on each of the vibration shafts at equal distances.

4. The surface treatment device for a high density interconnection printed circuit board according to claim 3, characterized in that: The synchronous belt assembly comprises two synchronous wheels (12) which are symmetrically arranged, and each synchronous wheel (12) is mounted on a vibration shaft at a corresponding position, and a synchronous belt (13) is mounted on the two synchronous wheels (12) together.

5. The surface treatment device for a high density interconnected printed circuit board according to claim 1, characterized in that: A horizontal electric slide rail (3) is horizontally mounted on the frame (1), a sliding seat (15) is slidably connected to the horizontal electric slide rail (3), an L-shaped mounting seat (5) is fixedly connected to the sliding seat (15) to ensure that the L-shaped mounting seat (5) does not enter the drying chamber (2) when the circuit board enters the drying chamber (2), a vertical electric slide rail (16) is vertically mounted on the L-shaped mounting seat (5), a moving plate (17) is slidably connected to the vertical electric slide rail (16), and a plurality of L-shaped connecting rods (18) are symmetrically mounted on the moving plate (17) to ensure that the circuit board is immersed in the liquid. When inside, the L-shaped mounting seat (5) does not come into contact with the liquid. A fixing plate (19) is commonly connected to a plurality of the L-shaped connecting rods (18). A rotating motor (29) is installed on the side wall of the fixing plate (19). The output shaft of the rotating motor (29) passes through the fixing plate (19) and is installed with an extension frame (27). A buffer plate (21) is fixedly connected to the extension frame (27). An outer frame (22) is installed on the buffer plate (21). An inner frame (25) is rotatably connected to the outer frame (22). A plurality of clamping cylinders (26) are provided on the inner frame (25).

6. The surface treatment device for a high density interconnection printed circuit board according to claim 5, characterized in that: A bevel gear ring (20) is fixedly connected to the side wall of the fixed plate (19); a sealed cavity is formed on the extension frame (27); a first mounting shaft (30) and a second mounting shaft (33) are horizontally mounted on the extension frame (27); and the inner frame (25) is arranged on the second mounting shaft (33); the first mounting shaft (30) and the second mounting shaft (33) extend into the sealed cavity and are respectively mounted with a first sprocket wheel and a second sprocket wheel (31); a chain (32) is commonly sleeved on the first sprocket wheel and the second sprocket wheel (31); the first mounting shaft (30) extends out of the sealed cavity and is mounted with a bevel gear (28); and the bevel gear (28) is meshed with the bevel gear ring (20).

7. The surface treatment device for a high density interconnection printed circuit board according to claim 1, characterized in that: The frame (1) is provided with a control panel, and a temperature sensor 1 and a pH value sensor are installed inside the soaking box (8), and both the temperature sensor 1 and the pH value sensor are electrically connected to the control panel.

8. The surface treatment device for a high density interconnection printed circuit board according to claim 7, characterized in that: A second temperature sensor and a humidity sensor are installed on the inner wall of the drying bin (2), and both the second temperature sensor and the humidity sensor are electrically connected to the control panel.

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