Method for transferring target object to target substrate

Abstract

The invention provides a method for transferring a target object to a target substrate. The method comprises the following steps. First, a plurality of cells repeatedly appearing on a target substrate are defined, where one of the plurality of cells is composed of a plurality of target locations on the target substrate. Then, a plurality of target objects are arranged on the unit transfer printing seal, and the plurality of target objects on the unit transfer printing seal correspond to the plurality of target positions; afterwards, the plurality of target objects are transferred to the target substrate by means of the unit transfer stamp. At least one target object is then transferred to a remaining target location of the target substrate. According to the method for transferring the target object to the target substrate, the efficiency of transferring the target object to the target substrate can be improved.

Description

Technical Field

[0001] The present disclosure relates to a method for transferring a target object to a target substrate, and more particularly to a method for transferring a control element to a circuit substrate. Background Art

[0002] When transferring the control element to the circuit substrate to control the antenna units on the circuit substrate, if there are relatively many antenna units and / or the antenna units are arranged on the circuit substrate in an irregular arrangement, the efficiency of the transfer process will be reduced. Summary of the invention

[0003] Some embodiments of the present disclosure are directed to a method of transferring a target object to a target substrate, which can improve the efficiency of transferring the target object to the target substrate.

[0004] According to some embodiments of the present disclosure, a method for transferring a target object to a target substrate is provided, which includes the following steps. First, a plurality of units that appear repeatedly on the target substrate are defined, wherein one of the plurality of units is composed of a plurality of target positions on the target substrate. Next, a plurality of targets are set on a unit transfer stamp, wherein the plurality of targets on the unit transfer stamp corresponds to a plurality of target positions. Thereafter, the plurality of targets are transferred to the target substrate using the unit transfer stamp. Then, at least one target is transferred to the remaining target positions on the target substrate.

[0005] According to some other embodiments of the present disclosure, a method for transferring a target object to a target substrate is provided, which includes the following steps. First, a plurality of first units and a plurality of second units that appear repeatedly on the target substrate are defined, wherein one of the plurality of first units is composed of a plurality of first target positions on the target substrate, and one of the plurality of second units is composed of a plurality of second target positions on the target substrate. Next, a plurality of targets are set on a first unit transfer stamp, wherein the plurality of targets on the first unit transfer stamp corresponds to the plurality of first target positions. Thereafter, the plurality of targets are transferred to the target substrate using the first unit transfer stamp. Then, a plurality of targets are set on a second unit transfer stamp, wherein the plurality of targets on the second unit transfer stamp corresponds to the plurality of second target positions. Thereafter, the plurality of targets are transferred to the target substrate using the second unit transfer stamp.

[0006] Based on this, in the method of transferring a target object to a target substrate provided in the present disclosure, by defining a unit consisting of multiple target positions and repeating on the target substrate, and arranging the target object on a unit transfer stamp in this unit manner, the efficiency of transferring the target object to the target substrate can be improved.

[0007] In order to make the above features and advantages of the present disclosure more obvious and understandable, embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1A is a schematic top view of a target substrate according to a first embodiment of the present disclosure;

[0009] Figure 1B A schematic top view of a target object according to an embodiment of the present disclosure;

[0010] Figure 1C For the general Figure 1A A top view schematic diagram of dividing a target substrate into multiple regions;

[0011] Figure 1D A schematic top view of a unit transfer stamp of an embodiment of the disclosure;

[0012] Figure 2A is a schematic top view of a target substrate according to a second embodiment of the present disclosure;

[0013] Figure 2B for Figure 2A A schematic diagram of multiple line segments on a target substrate;

[0014] Figure 2C Schematic top views of various embodiments in which a target object is disposed on a unit transfer stamp;

[0015] Figure 3A is a schematic top view of a target substrate according to a third embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate;

[0016] Figure 3B for Figure 3A A schematic top view of a unit of the second embodiment in a target substrate;

[0017] Figure 3C for Figure 3A A schematic top view of a unit of the third embodiment in a target substrate;

[0018] Figure 3D for Figure 3A A schematic top view of a unit of the fourth embodiment in a target substrate;

[0019] Figure 4A is a schematic top view of a target substrate according to a fourth embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate;

[0020] Figure 4B for Figure 4A A schematic top view of a unit of the second embodiment in a target substrate;

[0021] Figure 4C for Figure 4A A schematic top view of a unit of the third embodiment in a target substrate;

[0022] Figure 4D for Figure 4A A schematic top view of a unit of the fourth embodiment in a target substrate;

[0023] Figure 5A is a schematic top view of a target substrate according to a fifth embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate;

[0024] Figure 5B for Figure 5A A schematic top view of a unit of the second embodiment in a target substrate;

[0025] Figure 5C for Figure 5A A schematic top view of a unit of the third embodiment in a target substrate;

[0026] Figure 5D for Figure 5A A schematic top view of a unit of the fourth embodiment in a target substrate;

[0027] Fig. 6A is a schematic top view of a target substrate according to a sixth embodiment of the present disclosure;

[0028] Figure 6B A schematic top view of a target object according to another embodiment of the present disclosure;

[0029] Fig. 7A is a schematic top view of a target substrate according to a seventh embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate;

[0030] Figure 7B for Fig. 7A FIG. 1 is a schematic top view of a unit of the second embodiment in a target substrate. DETAILED DESCRIPTION

[0031] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0032] The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to facilitate the understanding of the readers and the simplicity of the drawings, the multiple drawings in the present disclosure only depict a portion of the electronic device, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present disclosure.

[0033] Certain words are used throughout the specification and the claims that follow to refer to specific components. It will be understood by those skilled in the art that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "include", "contain", "have" are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the presence of corresponding features, regions, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations and / or components.

[0034] Directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In the accompanying drawings, each figure shows the general characteristics of the methods, structures and / or materials used in a particular embodiment. However, these drawings should not be interpreted as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative size, thickness and position of each film layer, region and / or structure may be reduced or enlarged.

[0035] When a corresponding component (such as a film layer or region) is referred to as being "on another component", it may be directly on the other component, or other components may exist between the two. On the other hand, when a component is referred to as being "directly on another component", there is no component between the two unless otherwise specified in the specification. In addition, when a component is referred to as being "on another component", the two have a vertical relationship in the top view direction, and the component may be above or below the other component, and this vertical relationship depends on the orientation of the device.

[0036] The terms "equal to" or "same as", "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0037] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify the elements. They do not imply or represent any previous ordinal numbers of the element (or elements), nor do they represent the order of one element and another element, or the order of the manufacturing method. The use of these ordinal numbers is only used to make the element with a certain name clearly distinguishable from another element with the same name. The claims and the specification may not use the same words. Accordingly, the first component in the specification may be the second component in the claim.

[0038] It should be noted that the following embodiments may replace, reorganize, or mix features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. Features between embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0039] The electrical connection or electrical connection described in the present disclosure may refer to direct connection or indirect connection. In the case of direct connection, the endpoints of the components on the two circuits are directly connected or connected to each other by a conductor segment, and in the case of indirect connection, there is a switch, diode, capacitor, inductor, other suitable components, or a combination of the above components between the endpoints of the components on the two circuits, but it is not limited to these.

[0040] In the present disclosure, the thickness, length, width and area can be measured by an optical microscope, and the thickness can be measured by a cross-sectional image in an electron microscope, but it is not limited to this. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0041] The electronic device disclosed herein may be applied to a display device, a light-emitting device, a backlight device, an antenna device, a sensing device or a splicing device, or may be a temporary storage substrate for assisting electronic units to be placed at a specific spacing, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic device may include electronic components such as passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light-emitting diode or a photodiode. A light-emitting diode (LED) may include, for example, an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device can be any combination of the above arrangements, but is not limited thereto. In addition, the shape of the electronic device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes.

[0042] Figure 1A is a schematic top view of a target substrate according to a first embodiment of the present disclosure, and Figure 1B FIG. 1 is a schematic top view of a target object according to an embodiment of the present disclosure.

[0043] Please refer to Figure 1A , which shows a target substrate 100a. In this embodiment, the target substrate 100a includes a target position 100L where a plurality of target objects 200 are to be disposed. The target substrate 100a may be, for example, a circuit substrate. For example, the target substrate 100a may include a base SB and a device layer (not shown).

[0044] The material of the substrate SB may be, for example, glass, plastic, or a combination thereof. For example, the material of the substrate SB may include quartz, sapphire, silicon (Si), germanium (Ge), silicon carbide (SiC), gallium nitride (GaN), silicon germanium (SiGe), polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), or other suitable materials or a combination of the above materials, but the present disclosure is not limited thereto.

[0045] The component layer is, for example, disposed on the substrate SB, and may include, for example, an electrical connection structure (not shown) and electronic components (not shown).

[0046] The electrical connection structure may, for example, include at least one conductive layer and at least one insulating layer alternately stacked on each other, wherein two adjacent conductive layers may be electrically connected to each other through an opening of the insulating layer therebetween, so that the electrical connection structure may serve as a conductive transmission path.

[0047] The electronic element is, for example, disposed on the electrical connection structure and electrically connected thereto. In some embodiments, the electronic element may include an antenna element, a light emitting element, or other suitable electronic elements. In this embodiment, the electronic element includes a reconfigurable intelligent surface (RIS) element, a frequency selective surface (FSS) element, an orbital angular momentum (OAM) element, other antenna elements, or a combination thereof, but the present disclosure is not limited thereto.

[0048] The target object 200 may include another electronic component. In the present embodiment, the target object 200 includes a control component for controlling the electronic component. For example, the target object 200 may include a switching component, a light emitting diode, a variable capacitance diode, or other suitable control components, but the present disclosure is not limited thereto. Figure 1B , which shows a schematic top view of the target object 200. In the present embodiment, the target object 200 includes a wafer 210 and pads 220 and 230 disposed on the wafer 210 in the direction Z. The pads 220 and 230 are disposed, for example, corresponding to the line segment CL passing through the center of the wafer 210. It is worth noting that the present embodiment defines the rotation angle θ of the target object 200 as the angle between the line segment CL passing through the center of the wafer 210 and the direction X.

[0049] In some embodiments, each of the multiple targets 200 includes the same wafer, but the disclosure is not limited thereto. In other embodiments, each of the multiple targets 200 may include a different wafer.

[0050] In some embodiments, the shapes of the plurality of objects 200 may each include a circle, a rectangle, a hexagon, or a . In other words, the plurality of objects 200 may each have a different size and / or shape, but the disclosure is not limited thereto.

[0051] In this embodiment, in order to transfer multiple target objects 200 using a transfer stamp, it is necessary to first define the setting relationship between multiple target positions 100L on the target substrate 100a to design the characteristics of the unit transfer stamp, thereby increasing the efficiency of transferring the target objects 200 by performing repeated actions (such as translation or rotation) on the unit transfer stamp. After using the unit transfer stamp to transfer most of the target objects 200, a smaller unit transfer stamp or a single transfer unit can be used to transfer the target objects 200 to the remaining target positions 100L. The above concepts proposed in this embodiment can be divided into two stages: (1) Sampling; (2) Repeat. (1) Sampling refers to finding the unit composed of multiple target positions 100L, and then finding the same repeated unit on the target substrate 100a by translating or rotating the unit. It is worth noting that the repeated unit refers to the remaining multiple target positions 100L to which the target object 200 can be transferred by using the unit transfer stamp through translation or rotation symmetry.

[0052] Although changing the position of the target object 200 may affect the efficiency of the electronic device (not shown) including the target object 200, it can be improved by: (A) increasing the density of the target object 200; (2) compensating through other electronic components (such as active components such as power amplifiers or phase detectors); (3) using the electronic device including the target object 200 in a field with relatively low efficiency requirements.

[0053] Please continue to refer to Figure 1A In the present embodiment, the center angle φ between the line connecting any target position 100L' and the center position 100Lc on the target substrate 100a is related to the center position 100Lc, but the center angle φ between the line connecting any target position 100L' and the center position 100Lc on the target substrate 100a is not related to the rotation angle θ of the target object 200, which will be described in detail in the following embodiments.

[0054] In the present embodiment, the target positions 100L of the target substrate 100a are arranged in a symmetrical radial arrangement. Specifically, the target positions 100L include a center position 100Lc and other target positions 100L', and the other target positions 100L' are arranged, for example, away from the center position 100Lc, and the other target positions 100L' having substantially equal spacing from the center position 100Lc can be arranged in a circular shape. In the present embodiment, the other target positions 100L' include a first circle of target positions 100L1, a second circle of target positions 100L2, a third circle of target positions 100L3, a fourth circle of target positions 100L4, a fifth circle of target positions 100L5, and a sixth circle of target positions 100L6 away from the center position 100Lc in the following order, and the target positions increase in the same number. For example, the first circle of target positions 100L1 may include n target positions, the second circle of target positions 100L2 may include 2*n target positions, the third circle of target positions 100L3 may include 3*n target positions, and the number of target positions of the fourth circle of target positions 100L4, the fifth circle of target positions 100L5 and the sixth circle of target positions 100L6 may be deduced by analogy, and will not be described in detail herein. In this embodiment, there is a spacing △R (e.g. Figure 1A 11 and 100L21). Since the target positions 100L are arranged in a radial arrangement with symmetry, the target substrate 100a can be divided into a plurality of regions having a repeating unit.

[0055] Figure 1C For the general Figure 1A A schematic top view of dividing a target substrate into multiple areas.

[0056] Please refer to Figure 1C, which shows that the target substrate 100a is divided into region A, region B, region C, region D, region E, region F, region G, region H, region I, region J, region K, region L, region M and region N, wherein the above regions have the same center angle φ. It is worth noting that the center angle φ is calculated with the center position 100Lc as the center. Based on this, the center angle φ of each region of the target substrate 100a may be 360 / (2*n) degrees, but the present disclosure is not limited thereto. In the present embodiment, regions A to N may be further divided into a first region and a second region. Taking region A as an example, region A is divided into a first region A1 and a second region A2. The first region A1, for example, means that the target position 100L has a less repeated arrangement feature in this region. For example, the spacings between adjacent target positions 100L in the first region A1 are significantly different, or the target positions 100L are not arranged in a straight line. The second area A2 means, for example, that the target positions 100L have an orderly arrangement feature in this area, wherein the orderly arrangement feature may, for example, include multiple groups of adjacent target positions 100L with the same spacing and / or multiple groups of target positions 100L arranged in a straight line.

[0057] In the second area A2, the arrangement of the target positions 100L on the same straight line (for example, straight line 10a, straight line 10b, straight line 10c and straight line 10d extending in direction X) meets the following characteristics and can be regarded as an orderly arrangement: (1) the difference between each spacing △X between adjacent target positions 100L on the straight line and the spacing △R between the target positions of adjacent circles is less than 0.01 mm; (2) the maximum height difference (the difference in the component in direction Y) of the target positions 100L on the straight line is less than 0.03 mm.

[0058] For details, please refer to Figure 1C , taking the straight line 10a as an example, the five target positions 100L on the straight line 10a meet the above characteristics, so they can constitute a unit U1. However, the unit U1 is not limited to only include five target positions 100L. After determining the unit U1 on the target substrate 100a, the target object 200 can be arranged in the manner of the above-mentioned unit U1. Figure 1D The target object 200 can be subsequently transferred to the straight line 10a of the target substrate 100a by the unit transfer stamp ST. Figure 1D The unit transfer stamp ST can be designed to be multiple and have a spacing △R between each other, thereby improving the efficiency of transferring the target object 200 to the target substrate 100a. Please continue to refer to Figure 1CAfter finding the unit U1 on the straight line 10a, the five target positions 100L on the straight line 10b and the straight line 10c are different from the five target positions 100L on the straight line 10a only in that the starting points of the target positions 100L in the direction X are different. Therefore, the target object 200 can be transferred to the straight line 10b and the straight line 10c of the target substrate 100a in sequence by using a transfer device (not shown) to sequentially translate the above-mentioned unit transfer stamp ST in the direction Y and the direction X by a specific distance. Based on this, the above steps can be repeated to complete the configuration of the target object 200 in the second area A2.

[0059] For the first area A1 of area A, for example, a single target object 200 can be sequentially transferred to the remaining target positions 100L; or another unit that may exist in the first area A1 can be found, and multiple targets 200 can be sequentially transferred to the remaining target positions 100L using the steps described in the above embodiment.

[0060] For region B, the above-mentioned unit U1 can also be found in the respective second regions, and the difference between region B and region A is that the line segment CL of the center of the wafer 210 to be set in region B has a rotation angle θ of 360 / (2*n) degrees. Therefore, the target object 200 can be transferred to the second region of region B by rotating the above-mentioned transfer stamp ST by 360 / (2*n) degrees using a transfer device (not shown).

[0061] As for the transfer from area C to area N, the target object 200 can also be transferred through the steps of the above embodiment, which will not be described in detail here.

[0062] Based on this, by dividing into multiple regions (region A to region N) having a central angle φ of 360 / (2*n) degrees, and further dividing each of the multiple regions into a first region and a second region, the efficiency of transferring the target object 200 to the target substrate 100a can be increased.

[0063] Through the description of the above embodiments, the method of transferring the target object 200 to the target substrate 100 a in this embodiment includes the following steps.

[0064] Step (1): define a plurality of units U1 that appear repeatedly on the target substrate 100a, wherein one of the plurality of units U1 is composed of a plurality of target locations 100L on the target substrate 100a.

[0065] Step (2): a plurality of target objects 200 are disposed on the unit transfer stamp ST, wherein the plurality of target objects 200 on the unit transfer stamp ST correspond to the plurality of target positions 100L.

[0066] Step (3): Transferring the plurality of target objects 200 to the target substrate 100a using the unit transfer stamp ST.

[0067] In this step, the first group of target objects 200 may be transferred to a first region on the target substrate 100a (e.g., a region formed by a plurality of target positions 100L through which the straight line 10a passes), and then the unit transfer stamp ST may be moved in the direction X and / or the direction Y. After the unit transfer stamp ST absorbs the second group of target objects 200, the unit transfer stamp ST may be used to transfer the second group of target objects 200 to a second region on the target substrate 100a (e.g., a region formed by a plurality of target positions 100L through which the straight line 10b passes). However, the present disclosure is not limited thereto.

[0068] Step (4): Transfer at least one target object 200 to the remaining target position of the target substrate 100a.

[0069] Figure 2A is a schematic top view of a target substrate according to a second embodiment of the present disclosure, and Figure 2B for Figure 2A Schematic diagram of multiple line segments on the target substrate. It should be noted that Figure 2A The embodiments can be used Figure 1A The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0070] Please refer to Figure 2A , which shows the target substrate 100b. In this embodiment, the central angle φ between the line connecting any target position 100L' and the center position 100Lc on the target substrate 100b is related to the center position 100Lc, and the central angle φ between the line connecting the target position 100L on the target substrate 100b and the center position 100Lc is also related to the rotation angle θ of the target object 200. In this case, a plurality of straight lines 20 can be found in the radial direction passing through the center position 100Lc, wherein the straight lines 20 pass through the centers of the plurality of target positions 100L.

[0071] For example, in this embodiment, a plurality of straight lines 20a, a plurality of straight lines 20b, and a plurality of straight lines 20c can be found on the target substrate 100b, wherein the straight line 20a has six target positions 100L, the straight line 20b has four target positions 100L, and the straight line 20c has two target positions 100L, but the present disclosure is not limited thereto. In some embodiments, after finding the plurality of straight lines 20a, the plurality of straight lines 20b, and the plurality of straight lines 20c, the greatest common factor of the number of target positions 100L thereon can be further found. Please refer to Figure 2BIn this embodiment, the greatest common factor of the number of target positions 100L on the plurality of straight lines 20a, the plurality of straight lines 20b, and the plurality of straight lines 20c is 2. Afterwards, the plurality of straight lines 20a, the plurality of straight lines 20b, and the plurality of straight lines 20c can be further divided into a plurality of line segments by the aforementioned greatest common factor. Specifically, the plurality of straight lines 20a can be further divided into line segments 20a1, 20a2, and 20a3, and the plurality of straight lines 20b can be further divided into line segments 20b1 and 20b2. The target positions 100L on the plurality of straight lines 20c are the same as the aforementioned greatest common factor and do not need to be further divided. Afterwards, the manner in which the target object 200 is set on the unit transfer stamp ST can be determined.

[0072] Figure 2C Schematic top views of various embodiments of the target object being disposed on a unit transfer stamp.

[0073] Taking the straight line 20a as an example, the six targets 200 to be disposed on the six target positions 100L of the straight line 20a may have similar rotation angles θ with respect to each other or may be classified into a plurality of groups having similar rotation angles θ. Figure 2C , the six targets 200 are arranged on the transfer stamp ST1 in a manner that the rotation angle θ is 0 degrees; or they are arranged on the transfer stamp ST2 in a manner that the rotation angle θ is 45 degrees. In other embodiments, the six targets 200 can be classified into three groups of target units with rotation angles θ of 0 degrees and 90 degrees and arranged on the transfer stamp ST3. In some other embodiments, the six targets 200 can be classified into three groups of target units with rotation angles θ of 45 degrees and -45 degrees and arranged on the transfer stamp ST4. It is worth noting that the transfer stamp ST1, the transfer stamp ST2, the transfer stamp ST3 and the transfer stamp ST4 each include 3 unit transfer stamps ST. In addition, any one of the transfer stamp ST1, the transfer stamp ST2, the transfer stamp ST3 and the transfer stamp ST4 can also be used as a unit transfer stamp, and the present disclosure is not limited to this.

[0074] Please continue to refer to Figure 2A After determining the method of setting the target object 200 on the unit transfer stamp ST, taking the transfer stamp ST1 as an example, the target object 200 can be transferred by using a transfer device (not shown) to the straight line 20a with a center angle φ of 0 degrees. Then, the transfer stamp ST1 is rotated 45 degrees by the transfer device (or the target substrate 100b is rotated -45 degrees by a platform (not shown)) and / or translated by a specific distance, and then the target object 200 is transferred on the straight line 20a with a center angle φ of 45 degrees. Subsequently, the transfer of the target object 200 to the target position 100L of the straight line 20a can be completed according to the above steps, and no further description is given here.

[0075] For the four target positions 100L on the straight line 20b, the target object 200 can be transferred to the target positions 100L on the straight line 20b by combining two unit transfer stamps ST into a transfer stamp and performing the above steps, which will not be repeated here.

[0076] For the two target positions 100L on the straight line 20c, the above steps can be performed by using one unit transfer stamp ST to complete the transfer of setting the target object 200 at the target position 100L on the straight line 20c, which will not be described in detail here.

[0077] Although in Figure 2A Although not shown in the figure, for the target positions 100L that are not passed by the straight line 20, the targets 200 may be transferred to the predetermined target positions 100L in sequence, for example.

[0078] Through the description of the above embodiments, the method of transferring the target object 200 to the target substrate 100 b in this embodiment includes the following steps.

[0079] Step (1): define a plurality of units (eg, a plurality of straight lines 20a) that appear repeatedly on the target substrate 100b, wherein one of the plurality of units is composed of a plurality of target positions (eg, six target positions 100L on the straight line 20a) on the target substrate 100b.

[0080] Step (2): placing a plurality of target objects 200 on a unit transfer stamp (eg, transfer stamp ST1 ), wherein the plurality of target objects 200 on the unit transfer stamp correspond to a plurality of target positions 100L.

[0081] Step (3): Transferring the plurality of target objects 200 onto the target substrate 100 b using a unit transfer stamp.

[0082] In this step, the first group of target objects 200 may be transferred to a first area on the target substrate 100b (e.g., an area consisting of six target positions 100L through which the straight line 20a passes), and then the transfer stamp ST1 may be rotated to a specific angle (e.g., 45 degrees) or the target substrate 100b may be rotated to a specific angle (e.g., -45 degrees). After the transfer stamp ST1 adsorbs the second group of target objects 200, the transfer stamp ST1 may be used to transfer the second group of target objects 200 to a second area on the target substrate 100b (e.g., an area consisting of six target positions 100L through which another straight line 20a passes). However, the present disclosure is not limited thereto.

[0083] Step (4): Transfer at least one target object 200 to the remaining target position of the target substrate 100b.

[0084] However, the method of transferring the target object 200 to the target substrate 100 b is not limited thereto. Another embodiment of the method of transferring the target object 200 to the target substrate 100 b of the present embodiment includes the following steps.

[0085] Step (1'): define a plurality of first units (e.g., a plurality of straight lines 20a) and a plurality of second units (e.g., a plurality of straight lines 20b or a plurality of straight lines 20c) that appear repeatedly on the target substrate 100b, wherein one of the plurality of first units is composed of a plurality of first target positions on the target substrate 100b (e.g., six target positions 100L on the straight line 20a), and one of the plurality of second units is composed of a plurality of second target positions on the target substrate 100b (e.g., four target positions 100L on the straight line 20b or two target positions 100L on the straight line 20c).

[0086] Step (2a): multiple targets 200 are arranged on a first transfer stamp (eg, a transfer stamp ST1 composed of three unit transfer stamps ST), wherein the multiple targets 200 on the first transfer stamp correspond to multiple first target positions (eg, six target positions 100L on the straight line 20a).

[0087] Step (3a): using a first transfer stamp to transfer a plurality of target objects 200 to a plurality of first target positions (eg, six target positions 100L on the straight line 20a) on the target substrate 100b.

[0088] Step (2b): Arrange multiple target objects 200 on a second transfer stamp (for example, a transfer stamp composed of two unit transfer stamps ST or a unit transfer stamp ST), wherein the multiple target objects 200 on the second transfer stamp correspond to multiple second target positions (for example, four target positions 100L on straight line 20b or two target positions 100L on straight line 20c).

[0089] Step (3b): using a second transfer stamp to transfer the plurality of target objects 200 to a plurality of second target positions on the target substrate 100b (eg, four target positions 100L on the straight line 20b or two target positions 100L on the straight line 20c).

[0090] Step (4): Transfer at least one target object 200 to the remaining target position of the target substrate 100b.

[0091] Figure 3A FIG. 1 is a schematic top view of a target substrate according to a third embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate. Figure 3B for Figure 3A A schematic top view of a unit of the second embodiment of a target substrate, Figure 3C for Figure 3A A schematic top view of a unit of the third embodiment of the target substrate, and Figure 3D for Figure 3A A schematic top view of a unit of the fourth embodiment in a target substrate. It should be noted that FIG. 3A to FIG. 3D The embodiments can be used in their own way Figure 1A as well as Figure 1B The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0092] Please refer to Figure 3A , the distribution of the target positions 100L on the target substrate 100c is independent of the rotation angle θ of the target object 200. However, the distribution of the target objects 200 in this embodiment satisfies translational symmetry, so a relatively small unit U2 consisting of a plurality of target positions 100L can be found on the target substrate 100c. After the target objects 200 are arranged on a unit transfer stamp (not shown) in the manner of the above-mentioned unit U2, the stamp can be repeatedly used to transfer a plurality of target objects 200 to the target substrate 100c, thereby improving the efficiency of transferring the target objects 200 to the target substrate 100c.

[0093] In this embodiment, the distribution of the target 200 has the following relationship:

[0094] Die A ∈Unit A ;

[0095] Unit A (r o +R)=Unit A (r o ),

[0096] Among them, Die A For the target object 200, Unit A Unit U2, r, consisting of multiple target positions 100L o is the starting position of unit U2, and R is the translation amount of unit U2.

[0097] In detail, in this embodiment, please refer to Figure 1B , the rotation angle θ of each target object 200 to be set on the target substrate 100c is 45 degrees or other angles. In this case, a unit U2 consisting of multiple target positions 100L can be found on the target substrate 100c. Please continue to refer to Figure 3A, which shows a rectangular pattern in which the unit U2 is composed of 3×3 target positions 100L. Based on this, the target object 200 can be set on a unit transfer stamp (not shown) in the manner of the above-mentioned unit U2, and then the 3×3 target objects 200 can be transferred to the repeated units U2 of the target substrate 100c by the unit transfer stamp, thereby improving the efficiency of transferring the target object 200 to the target substrate 100c.

[0098] However, the present disclosure does not limit the unit U2 to be composed of 3×3 target positions 100L. FIG. 3B to FIG. 3D , the unit U2 may be, for example, a rectangular pattern consisting of 1X4 target positions 100L; or the unit U2 may be, for example, a rectangular pattern consisting of 4X3 target positions 100L; or the unit U2 may be, for example, a diamond pattern consisting of 2X3 target positions 100L.

[0099] Please continue to refer to Figure 3A After transferring a plurality of target objects 200 to the repetitive unit U2 of the target substrate 100c, for the target positions 100L of the non-repetitive unit on the target substrate 100c, for example, a single target object 200 may be sequentially transferred to the target positions 100L of the non-repetitive unit, but the present disclosure is not limited thereto. In other embodiments, the target positions 100L of the non-repetitive unit may be divided into smaller units (smaller than the unit U2), and the target objects 200 may be transferred to the remaining target positions 100Lr of the target substrate 100c by performing the above steps.

[0100] Figure 4A FIG. 1 is a schematic top view of a target substrate according to a fourth embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate. Figure 4B for Figure 4A A schematic top view of a unit of the second embodiment of a target substrate, Figure 4C for Figure 4A A schematic top view of a unit of the third embodiment of the target substrate, and Figure 4D for Figure 4A A schematic top view of a unit of the fourth embodiment in a target substrate. It should be noted that FIG. 4A to FIG. 4D The embodiments can be used in their own way FIG. 3A to FIG. 3D The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0101] Please refer to Figure 4A The main difference between the target substrate 100d and the target substrate 100c is that the target positions 100L are staggered in the Y direction, and the adjacent target positions 100L in the X direction are mirror-arranged.

[0102] In this embodiment, the unit U3 composed of a plurality of target positions 100L may be, for example, FIG. 4A to FIG. 4D The present disclosure is not limited to the patterns shown.

[0103] Figure 5A FIG. 1 is a schematic top view of a target substrate according to a fifth embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate. Figure 5B for Figure 5A A schematic top view of a unit of the second embodiment of a target substrate, Figure 5C for Figure 5A A schematic top view of a unit of the third embodiment of the target substrate, and Figure 5D for Figure 5A A schematic top view of a unit of the fourth embodiment in a target substrate. It should be noted that FIG. 5A to FIG. 5D The embodiments can be used in their own way FIG. 3A to FIG. 3D The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0104] Please refer to Figure 5A The main difference between the target substrate 100e and the target substrate 100c is that the target positions 100L are staggered in the Y direction, and the target positions 100L adjacent to each other in the X direction have substantially equal intervals.

[0105] In this embodiment, the unit U4 composed of a plurality of target positions 100L may be, for example, FIG. 5A to FIG. 5D The present disclosure is not limited to the patterns shown.

[0106] Fig. 6A is a schematic top view of a target substrate according to a sixth embodiment of the present disclosure, and Figure 6B FIG. 1 is a top view of a target object according to another embodiment of the present disclosure. It should be noted that: Fig. 6A and Figure 6B The embodiments can be used in their own way Figure 3A and Figure 1B The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0107] Please refer to Fig. 6A The main difference between the target substrate 100 f and the target substrate 100 c is that the target object on the target substrate 100 f has a different rotation angle θ.

[0108] The distribution of the target objects 200 of this embodiment satisfies translational symmetry, but can be divided into sets with a variety of different rotation angles θ, so that a plurality of different units can be found on the target substrate 100 c , each of which is composed of a plurality of target positions 100L.

[0109] In this embodiment, the distribution of the target 200 has the following relationship:

[0110] Die A ∈Unit A ;

[0111] Die B ∈Unit B ;

[0112] Unit A (r o +R)=Unit A (r o );

[0113] Unit B (r o +R)=Unit B (r o ),

[0114] Among them, Die A For a target object 200 having a first rotation angle, Die B The target object 200 has a second rotation angle, Unit A The first unit is composed of multiple target positions 100L. B The second unit is composed of multiple target positions 100L, r o are the starting positions of the first unit and the second unit respectively, and R is the translation amount of the first unit and the second unit respectively.

[0115] For details, please refer to Figure 6B , which shows a target 200', which has a different rotation angle θ from the target 200, wherein the rotation angle θ of the target 200 is 45 degrees, and the rotation angle θ of the target 200' is -45 degrees. In this case, a unit U51 consisting of a plurality of target positions 100La and a unit U52 consisting of a plurality of target positions 100Lb can be found on the target substrate 100f. Please refer to Fig. 6A, which shows that unit U51 is a rectangular pattern composed of 3×3 target positions 100La, and unit U52 is a rectangular pattern composed of 3×3 target positions 100Lb. Based on this, the target object 200 can be set on a unit transfer stamp (not shown) in the manner of the above-mentioned unit U51, and the target object 200' can be set on the unit transfer stamp in the manner of the above-mentioned unit U52. Subsequently, the 3×3 targets 200 and the target object 200' can be transferred to the repeated units U51 and U52 of the target substrate 100c through the unit transfer stamp, thereby improving the efficiency of transferring the target object 200 to the target substrate 100f.

[0116] Through the description of the above embodiments, the method of transferring the target object 200 and the target object 200 ′ to the target substrate 100 f in this embodiment includes the following steps.

[0117] Step (1'): define a plurality of units U51 and a plurality of units U52 that appear repeatedly on the target substrate 100f, wherein one of the plurality of units U51 is composed of a plurality of target positions 100La on the target substrate 100f, and one of the plurality of units U52 is composed of a plurality of target positions 100Lb on the target substrate 100f.

[0118] Step (2a): placing a plurality of target objects 200 on the unit transfer stamp, wherein the plurality of target objects 200 on the unit transfer stamp correspond to a plurality of target positions 100La.

[0119] Step (3a): using a unit transfer stamp to transfer a plurality of target objects 200 onto a target substrate 100f.

[0120] In this step, the first group of target objects 200 may be transferred to a first region (including a region of one unit U51) on the target substrate 100f using a unit transfer stamp, and then the unit transfer stamp may be moved in direction X and / or direction Y. After the unit transfer stamp absorbs the second group of target objects 200, the unit transfer stamp may be used to transfer the second group of target objects 200 to a second region (including a region of another unit U51) on the target substrate 100f. However, the present disclosure is not limited thereto.

[0121] Step (2b): placing a plurality of target objects 200 ′ on another unit transfer stamp, wherein the plurality of target objects 200 ′ on the other unit transfer stamp corresponds to a plurality of target positions 100Lb.

[0122] Step (3b): Utilize the unit transfer stamp to transfer a plurality of target objects 200' onto the target substrate 100f.

[0123] In this step, the first group of target objects 200' may be transferred to the third region (including the region of one unit U52) on the target substrate 100f using the unit transfer stamp, and then the unit transfer stamp may be moved in the direction X and / or direction Y. After the unit transfer stamp absorbs the second group of target objects 200', the unit transfer stamp may be used to transfer the second group of target objects 200' to the fourth region (including the region of another unit U52) on the target substrate 100f. However, the present disclosure is not limited thereto.

[0124] Step (4'): Transferring at least one target object 200 and / or at least one target object 200' to the remaining target position 100Lr of the target substrate 100f.

[0125] Fig. 7A is a schematic top view of a target substrate according to a seventh embodiment of the present disclosure, which shows a schematic top view of a unit of the first embodiment in the target substrate, and Figure 7B for Fig. 7A A schematic top view of a unit of the second embodiment in a target substrate. It should be noted that Fig. 7A and Figure 7B The embodiments can be used in their own way FIG. 3A to FIG. 3D The component numbers and partial contents of the embodiments are shown in the figure, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0126] Please refer to Fig. 7A The main difference between the target substrate 100g and the target substrate 100f is that the target positions 100La and the target positions 100Lb on the target substrate 100g are arranged alternately.

[0127] Specifically, in this embodiment, the target position adjacent to the target position 100La is the target position 100Lb, and vice versa. In this case, a unit U6 consisting of a plurality of target positions 100La and a plurality of target positions 100Lb arranged alternately with each other can be found on the target substrate 100g. Fig. 7A , which shows that the unit U6 is a rectangular pattern composed of two target positions 100La and two target positions 100Lb arranged alternately in 4×3. Based on this, the target objects 200 and the target objects 200' can be set on a unit transfer stamp (not shown) in the manner of the above-mentioned unit U6, and then the 4×3 target objects 200 can be transferred to the repeated units U6 of the target substrate 100g by the unit transfer stamp, thereby improving the efficiency of transferring the target objects 200 to the target substrate 100g.

[0128] However, the present disclosure does not limit the unit U6 to be composed of six target positions 100La and six target positions 100Lb arranged alternately in a 4×3 pattern. Figure 7B The unit U6 may be, for example, a rectangular pattern consisting of two 2X2 target positions 100La and two target positions 100Lb arranged alternately with each other.

[0129] In summary, in some embodiments of the present disclosure, by defining a unit consisting of a plurality of target positions and appearing repeatedly on the target substrate, and arranging the target object on the unit transfer stamp in the form of a unit, the efficiency of transferring the target object to the target substrate can be improved.

[0130] Furthermore, in some other embodiments of the present disclosure, the aforementioned repetitive units may include a plurality of groups of units that are different from each other. By defining different units, the efficiency of transferring the target object to the target substrate may be improved.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for transferring a target object to a target substrate, characterized in that: include: defining a plurality of units that appear repeatedly on the target substrate, wherein one of the plurality of units is composed of a plurality of target locations on the target substrate; placing a plurality of the target objects on a unit transfer stamp, wherein the plurality of the target objects on the unit transfer stamp correspond to the plurality of target positions; transferring the plurality of target objects onto the target substrate using the unit transfer stamp; as well as At least one of the objects is transferred to a remaining target location on the target substrate.

2. The method for transferring a target object to a target substrate according to claim 1, wherein the step of transferring the plurality of target objects to the target substrate using the unit transfer stamp comprises: Using the unit transfer stamp to transfer a first group of target objects to a first area on the target substrate; moving the unit transfer stamp in a first direction and / or a second direction; as well as Using the unit transfer stamp to transfer a second group of target objects to a second area on the target substrate, The first direction is different from the second direction. 3 . The method of transferring objects to a target substrate according to claim 2 , wherein the first group of objects and the second group of objects have different sizes and / or shapes.

4. The method for transferring a target object to a target substrate according to claim 1, wherein the step of transferring the plurality of target objects to the target substrate using the unit transfer stamp comprises: Using the unit transfer stamp to transfer a first group of target objects to a first area on the target substrate; rotating the unit transfer stamp; as well as The second group of target objects is transferred to a second area on the target substrate using the unit transfer stamp. 5 . The method of transferring objects to a target substrate according to claim 4 , wherein the first group of objects and the second group of objects have different sizes and / or shapes.

6. A method for transferring a target object to a target substrate, characterized in that: include: defining a plurality of repeated first units and a plurality of repeated second units on the target substrate, wherein one of the plurality of first units is composed of a plurality of first target positions on the target substrate, and one of the plurality of second units is composed of a plurality of second target positions on the target substrate; placing a plurality of the target objects on a first unit transfer stamp, wherein the plurality of the target objects on the first unit transfer stamp correspond to the plurality of first target positions; Using the first unit transfer stamp to transfer the plurality of target objects to the target substrate; placing a plurality of the target objects on a second unit transfer stamp, wherein the plurality of the target objects on the second unit transfer stamp correspond to the plurality of second target positions; as well as The plurality of target objects are transferred onto the target substrate using the second unit transfer stamp. 7 . The method of transferring objects to a target substrate according to claim 6 , further comprising transferring at least one of the objects to a remaining target position on the target substrate.

8. The method for transferring a target object to a target substrate according to claim 6, wherein the step of transferring the plurality of target objects to the target substrate by using the first unit transfer stamp comprises: Using the first unit transfer stamp to transfer a first group of target objects to a first area on the target substrate; moving the first unit transfer stamp in a first direction and / or a second direction; as well as Using the first unit transfer stamp to transfer a second group of target objects to a second area on the target substrate, The first direction is different from the second direction. 9 . The method of transferring objects to a target substrate according to claim 8 , wherein the first group of objects and the second group of objects have different sizes and / or shapes.

10. The method for transferring a target object to a target substrate according to claim 6, wherein the step of transferring the plurality of target objects to the target substrate by using the first unit transfer stamp comprises: Using the first unit transfer stamp to transfer a first group of target objects to a first area on the target substrate; Rotating the first unit transfer stamp; as well as The second group of target objects is transferred to a second area on the target substrate using the first unit transfer stamp. 11 . The method of transferring objects to a target substrate according to claim 10 , wherein the first group of objects and the second group of objects have different sizes and / or shapes.

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