Packaging structure of ultrathin LED

Abstract

The invention relates to the technical field of LEDs, in particular to a packaging structure of an ultrathin LED. The light emitted by the CSP chip can be uniformly dispersed to a larger area in the surrounding space as much as possible through the first packaging body, so that the illumination brightness of the LED is reduced, the chromatic aberration correction of the LED before and after improvement is realized through the second packaging body, so that the consistency of the light emitted by the LED is ensured, and a part of the light is absorbed through the further arranged light shielding body, so that the brightness of the LED is improved. Meanwhile, more part of light rays on the front face of the CSP chip are dispersed to the side face of the LED, so that the brightness of the front face of the CSP chip is reduced, by setting the shape of the arc-shaped light reflecting face on the shading body, the reflection direction of the light rays emitted by the CSP chip after passing through the arc-shaped light reflecting face is controlled, and the brightness of the front face of the LED is reduced; the problems that the brightness is too high and chromatic aberration occurs after the thickness of the packaging colloid of the current 0603CSP product is reduced are solved.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to a packaging structure of an ultra-thin LED. Background Art

[0002] At present, the chip thickness of 0603CSP products in the industry is usually in the range of 0.1mm to 0.15mm, and the colloid thickness is usually in the range of 0.05mm to 0.2mm. The actual thickness of 0603CSP products is in the range of 0.15mm to 0.35mm, and the general thickness of 0603CSP products used in the industry is about 0.15mm, of which the chip thickness is about 0.1mm and the colloid thickness is about 0.05mm.

[0003] However, with the ultra-thin design development trend of notebook and consumer electronic product backlight series products, the overall thickness of 0603CSP products also needs to be reduced accordingly. The reduction method is to reduce the chip thickness on the one hand and the package colloid thickness on the other hand. However, after reducing the colloid thickness, under the condition that the test parameters remain unchanged, the brightness of 0603CSP products will be too bright and color difference will occur, making it difficult for the product to be used in the notebook and consumer electronic product backlight series products, and it is difficult to meet the needs of individual customers. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides an ultra-thin LED packaging structure, which solves the problem that the current 0603CSP product has excessive brightness and color difference after the thickness of the packaging colloid is reduced.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A packaging structure of an ultra-thin LED comprises a CSP chip for emitting light, wherein a first packaging body for directing the side light of the CSP chip to the side of the LED is packaged on the side of the CSP chip, a second packaging body for adjusting the color of the light is packaged on the front of the CSP chip and the first packaging body, and a plurality of light-shielding bodies for reflecting light are arranged in the second packaging body.

[0007] Preferably, the height between the upper surface of the first package body and the CSP chip gradually decreases from an end close to the CSP chip to an end far from the CSP chip.

[0008] Preferably, a light absorber for absorbing part of the light is disposed on the bottom surface of the first packaging body.

[0009] Preferably, the light shielding bodies are evenly distributed on the upper surface of the second packaging body, and a blank area is provided between the light shielding bodies located at the outermost sides and the edge of the upper surface of the second packaging body.

[0010] Preferably, the lower surface of the light shielding body facing the CSP chip is provided with an arc-shaped reflecting surface for reflecting light, and the center of the arc-shaped reflecting surface is located outside the second packaging body.

[0011] Preferably, the cross section of the CSP chip is circular.

[0012] Preferably, the material ratio of the second package body is, by weight: 0.5 parts of A glue: 5 parts of B glue: 2.8 parts of HYG558-6 phosphor: 2.75 parts of diffusion powder: 0.11 parts of precipitation powder.

[0013] Compared with the prior art, the present invention provides an ultra-thin LED packaging structure, which has the following beneficial effects:

[0014] 1. The first package body can disperse the light emitted by the CSP chip as evenly as possible to a larger area in the surrounding space, thereby reducing the lighting brightness of the LED, and the second package body can correct the color difference of the LED before and after the improvement to ensure the consistency of the light emitted by the LED, and the light shielding body further arranged absorbs part of the light, and at the same time disperses more light on the front of the CSP chip to the side of the LED, so that the overall brightness of the LED is more uniform, thereby reducing the brightness of the front of the CSP chip.

[0015] 2. By setting the shape of the arc-shaped reflective surface on the light shield, the reflection direction of the light emitted by the CSP chip after passing through the arc-shaped reflective surface is controlled, thereby achieving control of the overall brightness uniformity of the LED to reduce the front brightness of the LED.

[0016] 3. By setting up the blank area, on the one hand, the cost of the light shield can be reduced. On the other hand, after part of the light from the CSP chip enters the blank area, it is prevented from being reflected back to the front of the CSP chip by the light shield and then entering the outside world, thereby reducing the control effect of the amount of light on the front of the CSP chip and reducing its brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 is a schematic diagram of a cross section of an LED of the present invention;

[0019] Figure 2 A schematic diagram of the light path inside the LED of the present invention;

[0020] Figure 3 It is a schematic diagram of a second package body when the CSP chip of the present invention has edges and corners.

[0021] In the figure: 1, CSP chip; 2, first package body; 3, second package body; 4, light shielding body; 5, light absorbing body; 6, blank area; 7, arc-shaped reflective surface. DETAILED DESCRIPTION

[0022] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0023] In order to solve the problem that the current 0603CSP product has excessive brightness and color difference after the thickness of the encapsulation colloid is reduced, the present invention provides an ultra-thin LED packaging structure, which can reduce the brightness of the LED after the thickness of the encapsulation colloid is reduced and correct the color difference of the emitted light through structural improvements, such as Figure 1 As shown, it includes a CSP chip 1 for emitting light, where the CSP chip 1 of the 0603CSP product is used, the side of the CSP chip 1 is encapsulated with a first encapsulation body 2 for guiding the side light of the CSP chip 1 to the side of the LED, the first encapsulation body 2 is used to guide part of the light to the side of the LED, so that the light emitted by the CSP chip 1 is more dispersed, so as to reduce the brightness of the light emitted by the LED irradiated to the surrounding environment, the front of the CSP chip 1 and the first encapsulation body 2 is encapsulated with a second encapsulation body 3 for adjusting the color of the light, the second encapsulation body 3 is the encapsulation colloid mentioned above, the overall height of the second encapsulation body 3 is about 0.04mm, and a plurality of light shielding bodies 4 for reflecting light are arranged in the second encapsulation body 3. The light on the front of the CSP chip 1 is the most, so the brightness is the highest, so part of the light is reflected and absorbed by the light shielding body 4, so that part of the light is dispersed to other positions, and part of the light is allowed to pass through the second encapsulation body 3 and enter the outside after passing through the plurality of light shielding bodies 4, so as to reduce the amount of light entering the outside, thereby reducing the lighting brightness of the LED.

[0024] In order to ensure that the light emitted by the CSP chip 1 is directed to a larger angle on the side of the LED, so that the light is more dispersed, thereby reducing the brightness of the LED, the height between the upper surface of the first package body 2 and the CSP chip 1 gradually decreases from the end close to the CSP chip 1 to the end away from the CSP chip 1. Figure 2 As shown in FIG. 1 , it is a schematic diagram of the light path of an LED. By directing more light from the front of the LED to the side of the LED, the light of the LED can be more dispersed, thereby achieving the purpose of reducing the brightness of the LED.

[0025] In order to further reduce the intensity of light inside the LED to reduce the brightness of the LED, a light absorber 5 for absorbing part of the light is provided on the bottom surface of the first package body 2. When the light is reflected to the light absorber 5, part of the light can be reflected and absorbed. The light absorber 5 can be a dark surface to absorb the light, or a diffuse reflection surface, etc., to reduce the amount and intensity of light inside the LED, so as to reduce the brightness of the LED.

[0026] In order to reduce the number of light shields 4 to save costs, and at the same time, the light on the front side of the CSP chip 1 is the most, so the brightness is the highest. In order to reduce the probability that the light reaching the edge of the second package body 3 is reflected back to the middle position of the front side of the second package body 3, so as to improve the uniformity of the LED light, the light shields 4 are evenly distributed on the upper surface of the second package body 3, and a blank area 6 is provided between the outermost light shield 4 and the edge of the upper surface of the second package body 3. After part of the light of the CSP chip enters the blank area, it can also be avoided from being reflected back to the front side of the CSP chip by the light shield and then entering the outside world, thereby ensuring the dispersion effect of the LED light.

[0027] In order to reflect part of the reflected light toward the bottom or side of the LED through the shading body 4, thereby increasing the probability of the light being reflected toward the side of the LED and improving the uniformity of light at various locations of the LED, the shading body 4 is provided with an arc-shaped reflecting surface 7 for reflecting light on the lower surface facing the CSP chip 1, and the center of the arc-shaped reflecting surface 7 is located outside the second packaging body 3, thereby improving the uniformity of the LED light.

[0028] like Figure 3 As shown, if the CSP chip 1 has corners, corners will appear on the side of the first package body 2, which may cause the brightness of the LED at the position corresponding to the corners on the CSP chip 1 to decrease. In order to ensure the uniformity of the overall brightness of the LED, the cross-section of the CSP chip 1 is circular, thereby ensuring the smoothness of the surface of the first package body 2.

[0029] In order to achieve the purpose of correcting the color difference of the second package 3 so that the color of the LED does not change before and after the thickness is reduced, the material ratio of the second package 3 is, by weight: 0.5 parts of A glue: 5 parts of B glue: 2.8 parts of HYG558-6 phosphor: 2.75 parts of diffusion powder: 0.11 parts of precipitation powder.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations; the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin LED packaging structure, comprising a CSP chip (1) for emitting light, characterized in that: The side of the CSP chip (1) is packaged with a first package body (2) for directing the side light thereof to the side of the LED, the front of the CSP chip (1) and the first package body (2) is packaged with a second package body (3) for adjusting the color of the light, and a plurality of light-shielding bodies (4) for reflecting light are arranged in the second package body (3).

2. The packaging structure according to claim 1, characterized in that: The height between the upper surface of the first package body (2) and the CSP chip (1) gradually decreases from an end close to the CSP chip (1) to an end far from the CSP chip (1).

3. The packaging structure according to claim 1, characterized in that: The bottom surface of the first packaging body (2) is provided with a light absorber (5) for absorbing part of the light.

4. The packaging structure according to claim 1, characterized in that: The light shielding bodies (4) are evenly distributed on the upper surface of the second packaging body (3), and a blank area (6) is provided between the outermost light shielding body (4) and the edge of the upper surface of the second packaging body (3).

5. The packaging structure according to claim 1, characterized in that: The lower surface of the light shielding body (4) facing the CSP chip (1) is provided with an arc-shaped reflecting surface (7) for reflecting light, and the center of the arc-shaped reflecting surface (7) is located outside the second packaging body (3).

6. The packaging structure according to claim 1, characterized in that: The cross section of the CSP chip (1) is circular.

7. The packaging structure according to claim 1, characterized in that: In parts by weight, the material ratio of the second encapsulation body (3) is: 0.5 parts of A glue: 5 parts of B glue: 2.8 parts of HYG558-6 phosphor: 2.75 parts of diffusion powder: 0.11 parts of precipitation powder.

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