Resin composition, cured product, camera module, and electronic device

Abstract

The purpose of the present invention is to provide: a resin composition having a cured product with good elongation; and a cured product, a camera module, and an electronic device using the resin composition. Namely, the present invention relates to a resin composition containing a polyfunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent, the polyfunctional epoxy resin containing a polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. Or more, and the resin composition satisfying the following conditions. Condition: X is the ratio of the content of the polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. Or more to the epoxy equivalent of the polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. Or more, Y is the ratio of the content of the monofunctional epoxy resin to the epoxy equivalent of the monofunctional epoxy resin, X is the ratio of the content of the monofunctional epoxy resin to the epoxy equivalent of the monofunctional epoxy resin, and Y is the ratio of the content of the monofunctional epoxy resin to the epoxy equivalent of the monofunctional epoxy resin. When the ratio of the content of all polyfunctional epoxy resins / epoxy equivalents of all polyfunctional epoxy resins is Z, X / Z is 0.3-1.0, and Y / Z is 0.35-1.20.

Description

Technical Field

[0001] The invention relates to a resin composition, a cured product, a camera module and an electronic device. Background Art

[0002] Electronic devices (for example, portable terminals such as smartphones and home appliances) equipped with cameras are currently popular.

[0003] Electronic devices with cameras are equipped with a component called a camera module. A camera module is generally composed of a large number of components, and therefore these components need to be assembled at a high density.

[0004] In order to assemble the components at a high density, a large amount of adhesive is used.

[0005] The components used in the camera module include components with poor heat resistance, and the adhesive used in the assembly of the camera module is required to be curable at low temperatures. In order to meet this requirement, a resin composition containing an epoxy resin, a curing agent and silver powder has been proposed as an adhesive (for example, see Patent Documents 1 and 2).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2015-042696

[0009] Patent Document 2: Japanese Patent Application No. 2018-030184 Summary of the invention

[0010] Technical problem to be solved by the invention

[0011] In recent years, cameras installed in electronic devices are required to have higher performance and functions. For this reason, the number of components constituting camera modules has increased, resulting in a continuous increase in the size and weight of the entire camera module. When such electronic devices equipped with high-performance and high-functional camera modules are subjected to impacts such as falling, the cured product of the resin composition as the adhesive may crack and the components may peel off.

[0012] Therefore, there is a demand for a resin composition in which cracks and peeling do not occur in the adhesive portion even when the electronic device is subjected to an impact, that is, a resin composition in which the cured product has impact resistance.

[0013] The impact resistance of a cured product means that the cured product is easily deformed to a certain extent. The elongation of the cured product is an indicator of the deformability of the cured product. If the elongation of the cured product is good, the cured product is impact resistant.

[0014] An object of the present invention is to provide a resin composition having a good elongation of a cured product, and a cured product, a camera module, and an electronic device using the resin composition.

[0015] Technical solutions for solving technical problems

[0016] Japanese Patent Publication No. 2015-042696 describes a resin composition containing a bisphenol A-type and bisphenol F-type multifunctional epoxy resin, silver particles, and a modified polyamine as a curing agent. In addition, Japanese Patent Publication No. 2018-030184 describes a resin composition containing a multifunctional epoxy resin, a monofunctional epoxy resin, and a curing agent.

[0017] The epoxy equivalent of the epoxy resin described above is 200 g / eq. or less, and the impact resistance is not considered.

[0018] To this end, the inventors of the present invention have studied resin compositions and discovered that when a multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more and a monofunctional epoxy resin are combined, the impact resistance can be improved even when cured at 80°C (low temperature), that is, the elongation of the cured product can be improved, thereby completing the present invention.

[0019] Specifically, in order to achieve the above-mentioned object, one embodiment of the present invention is as follows.

[0020] (1) A resin composition characterized by comprising a multifunctional epoxy resin, a monofunctional epoxy resin and a latent curing agent, wherein the multifunctional epoxy resin comprises a multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more, and the resin composition satisfies the following conditions:

[0021] -condition-

[0022] When the ratio of the content of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more / the epoxy equivalent of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is X, the ratio of the content of the monofunctional epoxy resin / the epoxy equivalent of the monofunctional epoxy resin is Y, and the ratio of the content of all the multifunctional epoxy resins / the epoxy equivalent of all the multifunctional epoxy resins is Z,

[0023] X / Z is 0.3 to 1.0, and Y / Z is 0.35 to 1.20.

[0024] (2) The resin composition according to the above (1), further comprising a conductive filler.

[0025] (3) The resin composition according to (1) or (2) above, wherein the epoxy equivalent of the monofunctional epoxy resin is 200 g / eq. or more.

[0026] (4) A cured product obtained from the resin composition according to any one of (1) to (3) above.

[0027] (5) A camera module comprising the cured product according to (4) above.

[0028] (6) An electronic device comprising the camera module described in (5) above.

[0029] ==Cross-references to related literature==

[0030] This application claims priority based on Japanese patent application No. 2022-150359 filed on September 21, 2022, which is incorporated by reference into this specification.

[0031] Effects of the Invention

[0032] According to the present invention, it is possible to provide a resin composition having a cured product having excellent elongation, and a cured product, a camera module, and an electronic device using the resin composition. DETAILED DESCRIPTION

[0033] (Resin composition)

[0034] The resin composition of the present embodiment contains a multifunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent, preferably contains a conductive filler, and contains other components as necessary.

[0035] In addition, in this specification, following the convention in the field of epoxy resins, for the name containing the term "resin" which generally refers to a polymer (especially a synthetic polymer) for the compound containing an epoxy group constituting the resin composition before curing, this name is sometimes used even if the compound is not a polymer. In addition, the epoxy equivalent is, in principle, a value obtained by the method described in JIS K7236. When the epoxy equivalent cannot be obtained by this method, it is a value calculated as a quotient obtained by dividing the molecular weight of the epoxy resin by the number of epoxy groups in one molecule of the epoxy resin.

[0036] <Multifunctional Epoxy Resin>

[0037] The polyfunctional epoxy resin contains a polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more, and contains a polyfunctional epoxy resin having an epoxy equivalent of less than 400 g / eq. (other polyfunctional epoxy resin) as needed.

[0038] The multifunctional epoxy resin refers to an epoxy resin having two or more epoxy groups.

[0039] <<Multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more>>

[0040] The polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is included to impart adhesiveness to the resin composition and to increase the elongation of the cured product. In one embodiment of the present invention, the polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more includes a bifunctional epoxy resin.

[0041] The epoxy equivalent of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is preferably 450 g / eq. or more. In addition, the epoxy equivalent is preferably 1200 g / eq. or less, and more preferably 900 g / eq. or less. In one embodiment, the epoxy equivalent of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is preferably 400 g / eq. to 1200 g / eq., and more preferably 400 g / eq. to 900 g / eq.

[0042] Here, the epoxy equivalent is the mass of a resin containing one equivalent of epoxy groups as defined in JIS K 7236: 2001. It should be noted that "eq." is an abbreviation for "equivalent."

[0043] When the epoxy equivalent of the multifunctional epoxy resin is 400 g / eq. or more, the elongation of the cured product of the resin composition is improved.

[0044] As the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more, for example, bisphenol A epoxy resin, modified bisphenol epoxy resin having a flexible skeleton, etc. can be cited. The flexible skeleton (also called soft segment) is a skeleton that can improve the mobility of the main chain, and for example, an alkylene skeleton, a cycloalkane skeleton, a polyoxyalkylene skeleton, etc. can be cited. In a certain embodiment, the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is liquid at room temperature.

[0045] The polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more may be synthesized as appropriate, or a commercial product may be used. Examples of the commercial product include the following products.

[0046] Examples of the bisphenol A type epoxy resin include jER 1001 (epoxy equivalent: 450 to 500 g / eq.), jER 1002 (epoxy equivalent: 600 to 700 g / eq.), jER 1004 (epoxy equivalent: 875 to 975 g / eq.) (all manufactured by Mitsubishi Chemical Corporation), 1050 (epoxy equivalent: 450 to 500 g / eq.), 1055 (epoxy equivalent: 450 to 500 g / eq.), and 2050 (epoxy equivalent: 610 to 660 g / eq.) (all manufactured by DIC Corporation).

[0047] Examples of modified bisphenol-type epoxy resins having a flexible skeleton include jER YX7105 (epoxy equivalent: 487 g / eq.) (manufactured by Mitsubishi Chemical Corporation), HP-A-4860 (epoxy equivalent: 411 g / eq.), EXA-4850-150 (epoxy equivalent: 450 g / eq.) (all manufactured by DIC Corporation), and Albiflex 297 (epoxy equivalent: 775 g / eq.) (manufactured by Evonik).

[0048] These products may be used alone or in combination of two or more.

[0049] From the viewpoint of curability, the content of the epoxy resin having an epoxy equivalent of 400 g / eq. or more is preferably 5% by mass to 70% by mass.

[0050] The content of the epoxy resin having an epoxy equivalent of 400 g / eq. or more is preferably 30% by mass to 70% by mass, more preferably 35% by mass to 65% by mass, based on all epoxy resin components.

[0051] <<Multifunctional epoxy resin with epoxy equivalent weight less than 400 g / eq.>>

[0052] As the multifunctional epoxy resin (other multifunctional epoxy resin) having an epoxy equivalent of less than 400 g / eq., there is no particular limitation as long as it is a multifunctional epoxy resin contained in a common resin composition, and it can be appropriately selected according to the purpose, and preferably has a bisphenol skeleton. As the multifunctional epoxy resin having a bisphenol skeleton, bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferred, and bisphenol F type epoxy resin is more preferred.

[0053] The epoxy equivalent of other multifunctional epoxy resins is not particularly limited and may be appropriately selected depending on the purpose, but is preferably 90 to 220 g / eq., more preferably 130 to 200 g / eq., and further preferably 150 to 180 g / eq.

[0054] <Monofunctional epoxy resin>

[0055] The monofunctional epoxy resin is contained in order to adjust the viscosity of the resin composition and to improve the elongation of the cured product.

[0056] When a multifunctional epoxy resin is cured, a cured product with a high crosslinking density is formed. Therefore, the glass transition temperature of the cured product of a resin composition containing only a multifunctional epoxy resin becomes high, and the elongation of the cured product is insufficient. Therefore, by adding a monofunctional epoxy resin to the multifunctional epoxy resin, the crosslinking density of the cured product can be reduced to a certain extent, and the elongation of the cured product can be increased.

[0057] In addition, the monofunctional epoxy resin can reduce the viscosity of the resin composition. The above-mentioned multifunctional epoxy resin with an epoxy equivalent of 400 g / eq. or more is a solid resin or a high-viscosity resin. Therefore, in the case of a resin composition whose resin component is only a multifunctional epoxy resin with an epoxy equivalent of 400 g / eq. or more, it becomes solid or high-viscosity, and it is difficult to apply it to components of a camera module, etc. In addition, although there is also a method of reducing the viscosity by making the resin composition contain a solvent, there is also the possibility of bubbles being generated when the resin composition is cured, so it is not preferred.

[0058] On the other hand, since the monofunctional epoxy resin can be used as a reactive diluent, the viscosity of the resin composition can be reduced.

[0059] Since the monofunctional epoxy resin is an essential component in the present invention, the viscosity of the resin composition can be made comparable to that of a conventional resin composition in which a multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is an optional component. It should be noted that the viscosity can be measured using an appropriate device corresponding to the viscosity range.

[0060] The monofunctional epoxy resin is not particularly limited as long as it is a monofunctional epoxy resin generally used for a resin composition, and can be appropriately selected according to the purpose.

[0061] In one embodiment, the monofunctional epoxy resin preferably has an epoxy group and a linear hydrocarbon group, and preferably has a linear chain having 7 or more carbon atoms. The number of carbon atoms in the linear portion of the monofunctional epoxy resin is preferably 10 or more, more preferably 13 or more. In one embodiment, the number of carbon atoms in the linear portion of the monofunctional epoxy resin is preferably 7 to 20, more preferably 13 to 18. In addition, the linear chain may have a double bond. Examples of such monofunctional epoxy resins include cardanol compounds having an epoxy group.

[0062] In another embodiment, the monofunctional epoxy resin is preferably a silane coupling agent containing an epoxy group. Examples of the silane coupling agent containing an epoxy group include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, and 8-glycidoxyoctyltrimethoxysilane.

[0063] In another embodiment, the monofunctional epoxy resin may be a glycidyl ester of versatic acid.

[0064] In one embodiment, the viscosity of the monofunctional epoxy resin at 25° C. is preferably 1 mPa·s to 500 mPa·s, more preferably 3 mPa·s to 350 mPa·s, and even more preferably 5 mPa·s to 200 mPa·s.

[0065] The epoxy equivalent of the monofunctional epoxy resin is not particularly limited and can be appropriately selected according to the purpose, but is preferably 200 g / eq. or more, more preferably 230 g / eq. or more, and further preferably 300 g / eq. or more. In addition, the epoxy equivalent of the monofunctional epoxy resin is preferably 200 / eq. to 500 g / eq., more preferably 230 / eq. to 470 g / eq., and further preferably 300 / eq. to 450 g / eq. When the epoxy equivalent of the monofunctional epoxy resin is this value, the solid latent curing agent becomes less soluble, and the viscosity increase during storage becomes smaller.

[0066] Monofunctional epoxy resins can be appropriately synthesized, or commercial products can be used. Examples of commercial products include Cardura E10P (glycidyl ester of tertiary carboxylic acid, manufactured by Hexion, epoxy equivalent: 235 g / eq.), LITE 513E (cardanol compound with epoxy group, manufactured by Cardolite, epoxy equivalent: 385 g / eq.), and KBM 403 (silane coupling agent with epoxy group, manufactured by Shin-Etsu Chemical Co., Ltd., epoxy equivalent: 236 g / eq.). These can be used alone or in combination of two or more.

[0067] In the resin composition of the present invention, from the viewpoint of the elongation of the cured product, the relationship of the epoxy groups has the following characteristics.

[0068] When the ratio of the content of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more / the epoxy equivalent of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is set to X, the ratio of the content of the monofunctional epoxy resin / the epoxy equivalent of the monofunctional epoxy resin is set to Y, and the ratio of the content of all multifunctional epoxy resins / the epoxy equivalent of all multifunctional epoxy resins is set to Z, X / Z is 0.3 to 1.0, preferably 0.4 to 1.0, and Y / Z is 0.35 to 1.20, preferably 0.4 to 1.0.

[0069] X is a value obtained by dividing the content (mass) of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more by the value of the epoxy equivalent of the multifunctional epoxy resin.

[0070] Y is a value obtained by dividing the content (mass) of the monofunctional epoxy resin by the value of the epoxy equivalent of the monofunctional epoxy resin.

[0071] Z is a value obtained by dividing the content (mass) of all multifunctional epoxy resins by the value of the epoxy equivalent of the multifunctional epoxy resin.

[0072] It should be noted that when two or more polyfunctional epoxy resins having an epoxy equivalent of 400 g / eq. or more are contained, for each polyfunctional epoxy resin, the value obtained by dividing the content (mass) of the polyfunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more by the epoxy equivalent of the polyfunctional epoxy resin is calculated, and the total is set to X.

[0073] Y and Z are similarly the total of the values ​​of the respective resins.

[0074] When the values ​​of X / Z and Y / Z are within the above ranges, the elongation of the cured product of the resin composition can be increased.

[0075] <Latent curing agent>

[0076] Resin combination of the present invention comprises latent curing agent.Latent curing agent is the curing agent of above-mentioned epoxy resin, and its curing action is blocked, but can be recovered by suitable physical or chemical stimulation (heat, react with moisture, electromagnetic wave, ultrasonic wave, mechanical shearing etc.).Therefore, in the mixture obtained by mixing epoxy resin with latent curing agent, curing reaction can hardly or completely be carried out at normal temperatures, but once the suitable stimulation of this mixture is given, curing action recovered by this latent curing agent will carry out curing reaction.In the present invention, the curing action of latent curing agent preferably does not show substantially before heating, but just can be recovered by heating.

[0077] As latent curing agents, those that are solid at room temperature (eg, 25° C.) and those that are liquid at room temperature are known. The latent curing agent used in the present invention is preferably solid at 25° C.

[0078] In one embodiment, the latent curing agent is a modified amine or a microcapsule-type latent curing agent having a softening point.

[0079] The modified amine having a softening point is solid at a temperature of 25° C. and includes amine compounds. Examples of amine compounds include aliphatic primary amines, alicyclic primary amines, aromatic primary amines, aliphatic secondary amines, alicyclic secondary amines, aromatic secondary amines, aliphatic tertiary amines, alicyclic tertiary amines, aromatic tertiary amines, imidazole compounds, and imidazoline compounds. Among these, the amine compound is preferably an aliphatic tertiary amine, an alicyclic tertiary amine, an aromatic tertiary amine, an imidazole compound, and an imidazoline compound. In addition, the amine compound can also be used in the form of a reaction product with a carboxylic acid, a sulfonic acid, an isocyanate, an epoxy compound, and the like. These compounds can be used alone or in combination of two or more, for example, the above-mentioned amine compound and its reaction product with a carboxylic acid, a sulfonic acid, an isocyanate, an epoxy compound, and the like can be used in combination.

[0080] The microcapsule-type latent curing agent is a curing agent for epoxy resins whose curing action is reversibly blocked by forming microcapsules. In the microcapsule-type latent curing agent, the curing action can be restored by other appropriate physical or chemical stimulations (mechanical shearing, etc.) in addition to heating, depending on the situation.

[0081] The curing agent contained in the microcapsule-type latent curing agent is not particularly limited as long as it can cure the epoxy resin, and can be appropriately selected according to the purpose.

[0082] In the microcapsule type latent curing agent, examples of the curing agent contained in the capsule include amine compounds (including imidazole compounds) and the like.

[0083] The latent curing agent may be synthesized as appropriate, or a commercially available product may be used.

[0084] Examples of commercially available latent curing agents of modified amines having a softening point include Fujicure series FXE-1000, FXB-1050, FXR1121, FXR1020, FXR1030, FXR1081, FXR1032, and FXR1131 (all manufactured by T&K TOKA CORPORATION).

[0085] Examples of commercially available latent curing agents that form microcapsules include HXA9322HP, HX3721, HX3088, HXA3932HP, HXA3922HP, HXA5945HP, and HXA5911HP (all manufactured by Asahi Kasei Corporation) of the NOVACURE (registered trademark) series.

[0086] These latent curing agents may be used alone or in combination of two or more. Among these, NOVACURE HXA9322HP is preferred from the viewpoint of increasing the curing speed.

[0087] It should be noted that the microcapsule type latent curing agent includes a product provided in the form of a dispersion liquid containing a liquid epoxy resin and a curing agent enclosed in microcapsules dispersed in the liquid epoxy resin, such as a powder composed of an amine compound. When using a curing agent in this form, it should be noted that the amount of the liquid epoxy resin is also included in the amount of the epoxy resin in the resin composition of the present invention.

[0088] The content of the latent curing agent is not particularly limited and may be appropriately selected according to the purpose. From the viewpoint of viscosity and moisture resistance reliability, it is preferably 10 to 30% by mass, more preferably 15 to 25% by mass, relative to the resin composition excluding the conductive filler.

[0089] In one embodiment, the content of the latent curing agent is preferably 10 to 50 parts by mass, more preferably 15 to 45 parts by mass, and even more preferably 20 to 40 parts by mass, based on 100 parts by mass of the epoxy resin.

[0090] <Conductive filler>

[0091] The resin composition contains a conductive filler in order to impart conductivity to the resin composition.

[0092] In the present invention, since the resin component makes the elongation of the cured product good, even if a conductive filler is added in large amounts to form a conductive paste, the cured product has excellent impact resistance.

[0093] The raw material of the conductive filler is not particularly limited and can be appropriately selected according to the purpose. For example, metal particles such as silver (Ag), gold (Au), copper (Cu), nickel (Ni), palladium (Pd), tin (Sn) and alloys of these metals, and inorganic fillers coated with gold, silver, and palladium can be cited. They can be used alone or in combination of two or more. Among them, silver or an alloy containing silver is preferred from the viewpoint of price and conductivity.

[0094] The shape of the conductive filler is not particularly limited and may be appropriately selected depending on the purpose, and examples thereof include spherical, scaly, needle-like, and irregular shapes. These conductive fillers may be used alone or in combination of two or more.

[0095] The volume average particle size of the conductive filler is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.5 μm to 15 μm, more preferably 1 μm to 10 μm, from the viewpoint of handleability and low resistance.

[0096] In the present embodiment, the volume average particle size refers to a particle size at which the volume cumulative particle size distribution measured by a laser diffraction method reaches 50%.

[0097] The conductive filler may be synthesized as appropriate, or a commercial product may be used. Examples of the commercial product include silver powder, such as FA618 (manufactured by DOWA Electronics Co., Ltd.) and SL02 (manufactured by Mitsui Mining & Smelting Co., Ltd.).

[0098] From the viewpoint of resistance value, the content of the conductive filler is preferably 19 volume % to 47 volume %, more preferably 22 volume % to 38 volume %. It should be noted that when volume % is converted to mass %, when silver powder is used, it is preferably 70 mass parts to 90 mass parts, more preferably 74 mass parts to 86 mass parts, relative to a total of 100 mass parts of the resin composition.

[0099] <Other ingredients>

[0100] As long as other components are components usually contained in the resin composition, there is no particular limitation and they can be appropriately selected according to the purpose, for example, carbon black, titanium black, ion capture agent, leveling agent, antioxidant, defoamer, thixotropic agent, viscosity modifier, flame retardant, colorant, solvent, etc. These components can be used alone or in combination of two or more.

[0101] The content of other components is not particularly limited and can be appropriately selected according to the purpose.

[0102] It should be noted that, from the viewpoint of preventing corrosion of the adherend, the resin composition of one embodiment of the present invention preferably does not contain a thiol compound (does not substantially contain a thiol compound). In addition, when the resin composition is a conductive paste containing a conductive filler, from the viewpoint of reducing the specific resistance value of the conductive paste, it is also preferred that the resin composition does not contain a thiol compound (does not substantially contain a thiol compound).

[0103] —Method for producing resin composition—

[0104] The method for producing the resin composition is not particularly limited and may be appropriately selected depending on the intended purpose. For example, there may be mentioned a method of mixing and stirring the above components.

[0105] In addition, the components may be mixed simultaneously, or some of the components may be mixed first and then the remaining components may be mixed. In the case where it is difficult to evenly disperse the filler in the epoxy resin (multifunctional epoxy resin and monofunctional epoxy resin), the epoxy resin and the filler may be mixed first and then the remaining components may be mixed.

[0106] The apparatus used for mixing and stirring is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a roll mill and the like.

[0107] (cured material)

[0108] The cured product of the present embodiment is a cured product obtained by curing the above-mentioned resin composition.

[0109] The shape and thickness of the cured product are not particularly limited and may be appropriately selected according to the intended purpose.

[0110] The method of curing the resin composition includes, for example, heating.

[0111] The heating temperature is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 80°C to 150°C, more preferably 100°C to 130°C.

[0112] The heating time is not particularly limited and may be appropriately selected depending on the intended purpose. For example, the heating time may be 1 minute to 2 hours.

[0113] (Camera Module)

[0114] The camera module of the present embodiment includes the above-mentioned cured product.

[0115] (Electronic equipment)

[0116] The electronic device of the present embodiment includes the above-mentioned camera module and, if necessary, further includes other components.

[0117] The other components are not particularly limited and can be appropriately selected according to the purpose.

[0118] Examples of the electronic device include portable terminals, tablet computers, and home electrical appliances.

[0119] Example

[0120] (Examples 1 to 16, Comparative Examples 1 to 7)

[0121] A mixture was obtained by mixing uniformly using a three-roll mill according to the blending amounts described in Tables 1 to 4. Then, bubbles in the mixture were removed using a vacuum degassing machine to obtain a resin composition.

[0122] [Table 1]

[0123]

[0124] [Table 2]

[0125]

[0126] [Table 3]

[0127]

[0128] [Table 4]

[0129]

[0130] The polyfunctional epoxy resins used in Examples and Comparative Examples are as follows.

[0131] Multifunctional epoxy resin 1 (jER YX7105, manufactured by Mitsubishi Chemical Corporation, bifunctional epoxy resin, epoxy equivalent: 487 g / eq.)

[0132] Multifunctional epoxy resin 2 (HP-A-4860, manufactured by DIC Corporation, bifunctional epoxy resin, epoxy equivalent: 411 g / eq.)

[0133] Multifunctional epoxy resin 3 (Albiflex 297, manufactured by Evonik, bifunctional epoxy resin, epoxy equivalent: 775 g / eq.)

[0134] Multifunctional epoxy resin 4 (EXA835LV, manufactured by DIC Corporation, bifunctional epoxy resin, epoxy equivalent: 165 g / eq.)

[0135] The monofunctional epoxy resins used in Examples and Comparative Examples are as follows.

[0136] Monofunctional epoxy resin 1 (Cardura E10P, manufactured by Hexion, epoxy equivalent: 235 g / eq.)

[0137] Monofunctional epoxy resin 2 (LITE513E, manufactured by Cardolite Corporation, epoxy equivalent: 385 g / eq.)

[0138] Monofunctional epoxy resin 3 (KBM403, manufactured by Shin-Etsu Chemical Co., Ltd., epoxy group-containing silane coupling agent, epoxy equivalent: 236 g / eq.)

[0139] The latent curing agents used in Examples and Comparative Examples are as follows.

[0140] Latent curing agent 1 (Fujicure FXR1020, manufactured by T&K TOKA Co., Ltd., amine curing agent)

[0141] Latent curing agent 2 (Fujicure FXR1030, manufactured by T&K TOKA Co., Ltd., amine curing agent)

[0142] The conductive fillers used in Examples and Comparative Examples are as follows.

[0143] Silver powder 1 (SL02, manufactured by Mitsui Mining and Smelting Co., Ltd.)

[0144] Silver powder 2 (FA618, manufactured by Dowa Hightech Co., Ltd.)

[0145] Other components used in Examples and Comparative Examples are as follows.

[0146] Additive 1 (CUREDUCT L-07N, manufactured by Shikoku Chemical Industry Co., Ltd., borate compound, epoxy equivalent 190 g / eq., containing 91% epoxy resin)

[0147] Additive 2 (TIPB (triisopropyl borate), manufactured by Tokyo Chemical Industry Co., Ltd.)

[0148] X, Y, and Z in the table are calculated as follows. Example 1 is used as an example for explanation. The calculation results of X, Y, and Z are collectively recorded in Tables 1 to 4.

[0149] X: 10.0 (mass of multifunctional epoxy resin 1) / 487 (epoxy equivalent of multifunctional epoxy resin 1)

[0150] Y: 4.0 (mass of monofunctional epoxy resin 1) / 235 (epoxy equivalent of monofunctional epoxy resin 1) + 2.0 (mass of monofunctional epoxy resin 2) / 385 (epoxy equivalent of monofunctional epoxy resin 2) + 0.4 (mass of monofunctional epoxy resin 3) / 236 (epoxy equivalent of monofunctional epoxy resin 3)

[0151] Z: 10.0 (mass of multifunctional epoxy resin 1) / 487 (epoxy equivalent of multifunctional epoxy resin 1) + 2.73 (multifunctional epoxy resin component of additive 1) / 190 (epoxy equivalent of multifunctional epoxy resin of additive 1)

[0152] The elongation of the cured product of the obtained resin composition was evaluated. The measurement results are collectively shown in Tables 1 to 4.

[0153] <Elongation>

[0154] On a glass substrate with a Teflon (registered trademark) sheet, each resin composition was coated using a dumbbell-shaped (total length 125mm, width of both ends 10mm, length of parallel portion 40mm, width of parallel portion 5mm, distance between markings 20mm, distance between fixtures 80mm) stencil with a thickness of 0.3mm, and cured in an oven at 80°C for 1 hour to prepare a test piece with a thickness of 0.3mm. For the obtained test piece, an Instron universal testing machine (model 5566, a product made by Instron Japan) was used to stretch the test piece at a tensile speed of 5mm / min, and the distance between markings was measured until the test piece broke, and the elongation was calculated according to the following formula.

[0155] Elongation (%) = (distance between markings at break - initial distance between markings) / (initial distance between markings) × 100 (%)

[0156] The viscosity of the resin composition of the embodiment was measured, and the result was that the viscosity was equivalent to that of a conventional adhesive composition. In addition, as shown in Tables 1 to 4, the elongation of the cured product of the resin composition of the embodiment was 5.1% or more. It can be seen that the resin composition of the embodiment has a viscosity equivalent to that of a conventional adhesive, and the elongation of the cured product is good.

[0157] On the other hand, the elongations of the cured products of Comparative Examples 3 and 4, which do not contain a multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more, are 2.8% and 0.6%, respectively, and the elongation of the cured products is insufficient. In addition, the elongations of the cured products of Comparative Examples 1 and 2, in which X / Z is less than 0.3, are 4.0% and 2.0%, respectively. The elongation of the cured products is insufficient. Furthermore, the elongations of the cured products of Comparative Example 5, in which Y / Z is higher than 1.20, and Comparative Examples 6 and 7, in which Y / Z is less than 0.35, are 3.1%, 1.3%, and 2.7%, respectively, and the elongation of the cured products is insufficient.

[0158] Based on the above, it is understood that the resin composition having X / Z of 0.3 to 1.0 and Y / Z of 0.35 to 1.20 has a viscosity equivalent to that of a conventional adhesive and the elongation of the cured product is good.

[0159] The above describes the embodiments and examples of the present invention, but these are the contents shown as examples and are not used to limit the scope of the present invention. The embodiments can also be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the gist of the present invention. The embodiments and their variations are the same as the contents contained in the scope and gist of the present invention, and are also included in the scope equivalent to the invention recorded in the scope of the claim.

Claims

1. A resin composition, characterized in that: Contains multifunctional epoxy resin, monofunctional epoxy resin and latent curing agent. The multifunctional epoxy resin contains a multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more, The resin composition satisfies the following conditions: condition: The ratio of the content of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more / the epoxy equivalent of the multifunctional epoxy resin having an epoxy equivalent of 400 g / eq. or more is set as X, The ratio of the content of the monofunctional epoxy resin to the epoxy equivalent of the monofunctional epoxy resin is set as Y, When the ratio of the content of all multifunctional epoxy resins / the epoxy equivalent of all multifunctional epoxy resins is set to Z, X / Z is 0.3 to 1.0, and Y / Z is 0.35 to 1.

20.

2. The resin composition according to claim 1, wherein: Also contains conductive fillers.

3. The resin composition according to claim 1 or 2, characterized in that: The monofunctional epoxy resin has an epoxy equivalent of 200 g / eq. or more.

4. A cured product obtained from the resin composition according to any one of claims 1 to 3.

5. A camera module, characterized in that: A cured product according to claim 4.

6. An electronic device, characterized in that: A camera module according to claim 5.

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