Covering structure, input device and manufacturing method of covering structure

Abstract

The invention discloses a covering structure which comprises a first covering layer, a second covering layer and a connecting part. The first cover layer includes a first material and has a first edge. The second cover layer includes a second material and has a second edge. The first covering layer and the second covering layer are stacked to form a stacked structure. The stacked structure is configured such that the first edge faces the second edge. The connecting part is connected between a part of the first edge and a part of the second edge and comprises a first material and a second material. And the connecting part is formed by hot-pressing and welding the edge of the stacked structure.

Description

Technical Field

[0001] The present application relates to a covering structure, an input device and a manufacturing method of the covering structure. Background Art

[0002] With the development and popularity of tablet computers, leather keyboard cases that match them are becoming more and more common. Generally speaking, the front and back of a leather keyboard case are made of two types of fabrics, with the front being made of a more dirt-resistant fabric and the back being made of a more non-slip fabric.

[0003] There are generally two ways to join two pieces of fabric: (1) the upper and lower pieces of fabric are directly glued together to form a skirt shape (appearance); and (2) the upper and lower pieces of fabric are gathered inside the product (non-appearance). However, for the first method, the joint at the ends of the two pieces of fabric will have problems in terms of appearance and reliability.

[0004] In addition, if the design is changed to a single piece of fabric (that is, the two fabric sections are directly aligned and spliced, and then bonded with special glue), in addition to the poor appearance (for example, gaps) caused by poor alignment, a pasted object (such as the outer surface of the product) is required as a base for the fabric to be spliced ​​and bonded, which limits the flexibility of the process.

[0005] Therefore, how to propose a covering structure, an input device, and a method for manufacturing the covering structure that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve. Summary of the invention

[0006] In view of this, an object of the present application is to provide a cover structure, an input device and a method for manufacturing the cover structure that can solve the above-mentioned problems.

[0007] In order to achieve the above-mentioned object, according to one embodiment of the present application, a covering structure includes a first covering layer, a second covering layer and a connecting portion. The first covering layer includes a first material and has a first edge. The second covering layer includes a second material and has a second edge. The first covering layer and the second covering layer are stacked to form a stacking structure. The stacking structure is configured so that the first edge faces the second edge. The connecting portion is connected between a portion of the first edge and a portion of the second edge, and includes the first material and the second material. The connecting portion is formed by hot-pressing and welding the edges of the stacking structure.

[0008] In one or more embodiments of the present application, one of the first material and the second material is plastic.

[0009] In one or more embodiments of the present application, one of the first material and the second material is a fiber layer.

[0010] In one or more embodiments of the present application, another portion of the first edge and another portion of the second edge abut against each other.

[0011] In one or more embodiments of the present application, the first covering layer has a first front surface and a first back surface. The second covering layer has a second front surface and a second back surface. The connecting portion connects the first front surface and the second front surface and is separated from the first back surface and the second back surface.

[0012] In one or more embodiments of the present application, the covering structure further includes an adhesive layer, which is bonded to the first back surface and the second back surface.

[0013] To achieve the above object, according to one embodiment of the present application, an input device includes a body and the aforementioned covering structure. The body has a top surface and a bottom surface opposite to each other. The covering structure covers the top surface and the bottom surface of the body.

[0014] In one or more embodiments of the present application, the input device further includes an expansion base. The covering structure further covers the outer surface of the expansion base.

[0015] In one or more embodiments of the present application, the outer surface of the expansion base includes an upper surface and a lower surface. The upper surface corresponds to the top surface of the body. The lower surface corresponds to the bottom surface of the body. The first covering layer is bonded and fixed to the upper surface. The second covering layer is bonded and fixed to the lower surface.

[0016] In one or more embodiments of the present application, the connecting portion is located on a side of the first covering layer and the second covering layer away from the outer surface.

[0017] In order to achieve the above-mentioned purpose, according to one embodiment of the present application, a method for manufacturing a covering structure includes: providing a stacking structure including a first covering layer and a second covering layer, wherein the first covering layer and the second covering layer respectively include a first material and a second material; hot pressing an edge of the stacking structure to form a connecting portion connecting a first edge of the first covering layer and a second edge of the second covering layer, wherein the connecting portion includes the first material and the second material; and unfolding the first covering layer and the second covering layer so that the first edge and the second edge abut against each other.

[0018] In one or more embodiments of the present application, the method for manufacturing the covering structure further includes: before unfolding the first covering layer and the second covering layer, cutting the connecting portion.

[0019] In one or more embodiments of the present application, the length of the cut connecting portion is smaller than the thickness of the stacking structure.

[0020] In one or more embodiments of the present application, the edge of the heat-compressed stacked structure is performed using a high frequency welding process.

[0021] In one or more embodiments of the present application, after unfolding the first covering layer and the second covering layer, the connecting portion connects the first front surface of the first covering layer and the second front surface of the second covering layer, and is separated from the first back surface of the first covering layer and the second back surface of the second covering layer.

[0022] In one or more embodiments of the present application, the method for manufacturing the covering structure further includes: bonding an adhesive layer to the first back surface of the first covering layer and the second back surface of the second covering layer.

[0023] In summary, in the covering structure of the present application, the connecting portion between the first covering layer and the second covering layer is formed by hot pressing the edges of the two layers, and by unfolding the first covering layer and the second covering layer so that the edges of the two layers abut against each other, a single-layer covering structure can be obtained without using the adhered object as a base, and the connecting portion can also effectively eliminate the seam between the first covering layer and the second covering layer.

[0024] The above description is only used to illustrate the problems to be solved by the present application, the technical means to solve the problems, and the effects produced, etc. The specific details of the present application will be introduced in detail in the implementation methods and related drawings below. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to make the above and other purposes, features, advantages and embodiments of the present application more clearly understood, the accompanying drawings are described as follows:

[0026] Figure 1A The figure is a three-dimensional diagram of an input device according to an embodiment of the present application.

[0027] Figure 1B To illustrate Figure 1A A schematic partial cross-sectional view of the input device along line segment 1B-1B.

[0028] Figure 1C To illustrate Figure 1A A schematic partial cross-sectional view of the input device along line segment 1C-1C.

[0029] Figure 2 The figure is a flow chart illustrating a method for manufacturing a covering structure according to an embodiment of the present application.

[0030] Figure 3A The figure is a schematic diagram illustrating a covering structure in an intermediate manufacturing stage according to one embodiment of the present application.

[0031] Figure 3B FIG5 is a schematic diagram illustrating a covering structure at an intermediate manufacturing stage according to an embodiment of the present application.

[0032] Figure 3C The figure is a schematic diagram illustrating a covering structure in an intermediate manufacturing stage according to one embodiment of the present application.

[0033] Figure 3D The figure is a schematic diagram illustrating a covering structure in an intermediate manufacturing stage according to one embodiment of the present application.

[0034] Figure 3E The figure is a schematic diagram illustrating a covering structure in an intermediate manufacturing stage according to one embodiment of the present application.

[0036] Figure 3F The figure is a schematic diagram illustrating a covering structure in an intermediate manufacturing stage according to one embodiment of the present application.

[0037] Explanation of symbols:

[0038] 100: input device;

[0039] 111: Ontology;

[0040] 111a: top surface;

[0041] 111b: bottom surface;

[0042] 112: expansion base;

[0043] 112a: upper surface;

[0044] 112b: lower surface;

[0045] 120: covering structure;

[0046] 121: first covering layer;

[0047] 121e: first edge;

[0048] 121f: first front side;

[0049] 121r: first back side;

[0050] 122: second covering layer;

[0051] 122e: second edge;

[0052] 122f: second front side;

[0053] 122r: second back side;

[0054] 123: connecting part;

[0055] 124: adhesive layer;

[0056] H: hot pressing head;

[0057] M: mold;

[0058] S: stacking structure;

[0059] S101, S102, S103, S104, S105: steps. DETAILED DESCRIPTION

[0060] The following will disclose multiple embodiments of the present application with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present application. In other words, in some embodiments of the present application, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be depicted in a simple schematic manner in the drawings.

[0061] Please refer to Figures 1A to 1C . Figure 1A FIG. 1 is a perspective view of an input device 100 according to an embodiment of the present application. Figure 1B To illustrate Figure 1A A schematic partial cross-sectional view of the input device 100 along line segment 1B-1B. Figure 1C To illustrate Figure 1A FIG. 1 is a schematic partial cross-sectional view of the input device 100 along line segment 1C-1C. Figures 1A to 1C As shown, in this embodiment, the input device 100 is a leather keyboard as an example. The input device 100 includes a body 111, an expansion base 112 and a covering structure 120. The body 111 is a keyboard component. The body 111 has a top surface 111a and a bottom surface 111b relative to each other. The covering structure 120 covers the top surface 111a and the bottom surface 111b of the body 111. The covering structure 120 further covers the outer surface of the expansion base 112. The expansion base 112 can be a docking base for the input device 100 to dock with a tablet computer, but the present application is not limited to this. The outer surface of the expansion base 112 includes an upper surface 112a and a lower surface 112b. The upper surface 112a corresponds to the top surface 111a of the body 111. The lower surface 112b corresponds to the bottom surface 111b of the body 111. In some embodiments, the input device 100 may also be a mouse, and the covering structure 120 may be a skin structure of the mouse, and the covering structure 120 covers the outer surface of the body of the mouse. The body may be a shell of the mouse, and the body has a top surface and a bottom surface relative to each other for accommodating various components, but the present application is not limited thereto.

[0062] Depend on Figure 1B and Figure 1CIt can be clearly seen that the covering structure 120 includes a first covering layer 121 and a second covering layer 122. The first covering layer 121 and the second covering layer 122 are laterally spliced. The first covering layer 121 is located on the top surface 111a of the body 111 of the input device 100 and the upper surface 112a of the expansion base 112. The second covering layer 122 is located on the bottom surface 111b of the body 111 of the input device 100 and the lower surface 112b of the expansion base 112. The first covering layer 121 is adhesively fixed to the top surface 111a of the body 111 and the upper surface 112a of the expansion base 112. The second covering layer 122 is adhesively fixed to the bottom surface 111b of the body 111 and the lower surface 112b of the expansion base 112.

[0063] like Figure 1C As shown, the seam between the first covering layer 121 and the second covering layer 122 (ie, the lateral joint of the two, and the connecting portion 123 is located at the seam) is located at the bottom surface 111 b of the body 111 of the input device 100 .

[0064] In practical applications, the expansion base 112 may be omitted. That is, the cover structure 120 of this embodiment may also be applied to a keyboard device that does not include the expansion base 112 .

[0065] In some embodiments, the first covering layer 121 located on the top surface 111a of the body 111 and the upper surface 112a of the docking station 112 may be made of a cloth that is more resistant to dirt. For example, the material of the first covering layer 121 is a fiber layer, a leather layer, or a cloth layer. The fiber layer is, for example, a man-made fiber layer of MicroFiber, but the present application is not limited thereto.

[0066] In some embodiments, the second covering layer 122 located on the bottom surface 111b of the body 111 and the lower surface 112b of the docking station 112 may be made of a non-slip fabric. For example, the material of the second covering layer 122 is plastic. The plastic is, for example, polyurethane (PU), polyethylene terephthalate (PET), polyvinyl chloride (PVC) or other thermoplastic plastics, but the present application is not limited thereto.

[0067] Please refer to Figure 2 , which is a flow chart illustrating a method for manufacturing a covering structure according to an embodiment of the present application. Figure 2 As shown, in this embodiment, the method for manufacturing the covering structure includes steps S101 to S105. FIG. 3A to FIG. 3F Explain the details of these steps in detail. FIG. 3A to FIG. 3F FIG. 1 is a schematic diagram illustrating a covering structure 120 at an intermediate manufacturing stage according to an embodiment of the present application.

[0068] In step S101, a stack structure S including a first cover layer 121 and a second cover layer 122 is provided, wherein the first cover layer 121 and the second cover layer 122 respectively include a first material and a second material (eg Figure 3A In this embodiment, the first cover layer 121 is stacked on the second cover layer 122 .

[0069] In step S102, the edge of the stacked structure S is heat-pressed to form a connecting portion 123 connecting the first edge 121e of the first covering layer 121 and the second edge 122e of the second covering layer 122, wherein the connecting portion 123 comprises a first material and a second material (eg Figure 3B and Figure 3C shown).

[0070] In some embodiments, step S102 is performed using a high-frequency heat welding process. Figure 3B As shown, the edges of the stacked structure S can be respectively pressed by the hot pressing head H and the mold M. Thus, the edges of the stacked structure S are pressed by the hot pressing head H and the mold M, and the first edge 121e and the second covering layer 122 are hot pressed and fused at the position between the hot pressing head H and the mold M to form a connecting portion 123 (as shown in FIG. Figure 3C shown).

[0071] As mentioned above, the connection portion 123 formed by hot pressing the first edge 121e and the second covering layer 122 includes a first material and a second material. For example, in an embodiment where the first material of the first covering layer 121 is a fiber layer and the second material of the second covering layer 122 is plastic, during the execution of step S102, the plastic will be hot-melted and penetrate or diffuse into the fiber layer, thereby making the connection portion 123 a composite structure in which the first material and the second material are tightly combined. In detail, the high-frequency welding process transmits energy to the edge of the stacking structure S through the vibration of the hot pressing head H, and a local high temperature (with sufficient heat) is generated at the bonding interface of the first material and the second material, so that the second material melts and penetrates or diffuses into the first material and is pressed and bonded into one.

[0072] In some embodiments, the first material of the first covering layer 121 may be plastic, and the second material of the second covering layer 122 may be a fiber layer, but the present application is not limited thereto. Alternatively, the first material of the first covering layer 121 and the second material of the second covering layer 122 may be the same material, for example, the first material of the first covering layer 121 and the second material of the second covering layer 122 are both plastic.

[0073] In step S103 , the connecting portion 123 is cut.

[0074] like Figure 3D As shown, by executing step S103 , the length of the cut connecting portion 123 can be made smaller than the thickness of the stacking structure S.

[0075] In practical applications, if the length of the connecting portion 123 is smaller than the thickness of the stacking structure S after executing step S102 , step S103 may be selectively omitted.

[0076] In step S104, the first covering layer 121 and the second covering layer 122 are unfolded so that the first edge 121e and the second edge 122e are in contact with each other (eg, Figure 3E The so-called unfolding here refers to converting the stacked structure S into a single-layer appearance in which the first covering layer 121 and the second covering layer 122 are laterally spliced.

[0077] Specifically, the connecting portion 123 is connected to a portion of the first edge 121e (eg, the first edge 121e is connected to a portion of the first edge 121e). Figure 3E The upper part of the second edge 122e) and a portion of the second edge 122e (such as the second edge 122e at Figure 3E and the other part of the first edge 121e (such as the first edge 121e at the Figure 3E the lower portion of the second edge 122e) and another portion of the second edge 122e (such as the second edge 122e at Figure 3E That is, the connection portion 123 is a fusion region between the first material and the second material, and the thickness of the connection portion 123 is less than the thickness of the first covering layer 121 and the thickness of the second covering layer 122.

[0078] In some embodiments, in order to prevent the connection portion 123 from hindering the first edge 121e and the second edge 122e from abutting against each other, step S103 may be performed so that the length of the cut connection portion 123 is less than the thickness of one of the first cover layer 121 and the second cover layer 122. For example, the length of the cut connection portion 123 may be in the range of 1 / 3 to 1 / 2 of the thickness of one of the first cover layer 121 and the second cover layer 122, so as to preferably achieve the following purposes at the same time: (1) the cut connection portion 123 will not break easily; and (2) the first edge 121e and the second edge 122e can abut against each other more smoothly.

[0079] like Figure 3EAs shown, after unfolding the first covering layer 121 and the second covering layer 122, it can be seen that the first covering layer 121 has a first front side 121f and a first back side 121r, the second covering layer 122 has a second front side 122f and a second back side 122r, and the connecting portion 123 connects the first front side 121f and the second front side 122f, and is separated from the first back side 121r and the second back side 122r. That is, the connecting portion 123 is partially connected between the first covering layer 121 and the second covering layer 122. The unconnected portion of the first covering layer 121 and the second covering layer 122 is used to allow one of them to be separated from the other and unfolded on a plane, so that the first edge 121e of the first covering layer 121 and the second edge 122e of the second covering layer 122 abut against each other.

[0080] In step S105, the adhesive layer 124 is bonded to the first back surface 121r of the first cover layer 121 and the second back surface 122r of the second cover layer 122 (eg, Figure 3F shown).

[0081] It should be noted that after executing step S104, since the mutually abutting first edge 121e and second edge 122e are not adhered to each other, the unfolded first covering layer 121 and second covering layer 122 may slightly warp at the position of the connecting portion 123. By bonding the first back surface 121r of the first covering layer 121 and the second back surface 122r of the second covering layer 122 with the adhesive layer 124, the aforementioned warping phenomenon can be effectively reduced or eliminated, thereby obtaining a flat covering structure 120.

[0082] like Figure 1C As shown, the covering structure 120 does not show the adhesive layer 124, but the covering structure 120 can adhere the first covering layer 121 and the second covering layer 122 to the outer surface of the expansion base 112 through the adhesive layer 124. In addition, the connecting portion 123 is located on the side of the first covering layer 121 and the second covering layer 122 away from the outer surface of the expansion base 112. Thereby, when the covering structure 120 is viewed from the side of the first front surface 121f and the second front surface 122f, the connecting portion 123 can effectively eliminate the seam between the first covering layer 121 and the second covering layer 122.

[0083] It should be noted that in this embodiment, the covering structure 120 is formed by high frequency welding two different covering layer materials to form the connecting portion 123 and can cover the opposite sides of the input device 100. In this way, the opposite sides of the input device 100 have different covering layer material properties. Figure 1B and Figure 1CAs shown, the top side of the input device 100 is covered by the first covering layer 121 with a microfiber texture, and the bottom side of the input device 100 is covered by the second covering layer 122 with an anti-fouling function, but the present application is not limited thereto. In practical applications, the reverse configuration can also be made, where the top side of the input device 100 is covered by the second covering layer 122 with an anti-fouling function, and the bottom side of the input device 100 is covered by the first covering layer 121 with a microfiber texture.

[0084] In detail, since the connection portion 123 between the first covering layer 121 and the second covering layer 122 is made by hot pressing welding technology, in this embodiment, the connection portion 123 has a composite structure of the first material of the first covering layer 121 and the second material of the second covering layer 122. Thus, by connecting the first covering layer 121 and the second covering layer 122 through the connection portion 123, the bonding strength and bonding tightness of the covering structure 120 can be effectively increased, and a flat connection surface can be achieved after unfolding, and the use of covering layer materials can be saved.

[0085] In some embodiments, the adhesive layer 124 is a heat activated film (HAF), but the present application is not limited thereto.

[0086] In some embodiments, the covering structure 120 only covers the outer surface of the docking station 112 , and step S105 and the adhesive layer 124 may be selectively omitted.

[0087] like Figure 3F As shown, in this embodiment, the adhesive layer 124 is completely bonded to the first back surface 121r and the second back surface 122r, but the present application is not limited thereto. In practical applications, the adhesive layer 124 is only partially bonded to the first back surface 121r and the second back surface 122r, and correspondingly covers the lateral seam between the first cover layer 121 and the second cover layer 122. That is, the partially disposed adhesive layer 124 will be aligned with the connecting portion 123 in the thickness direction of the cover structure 120.

[0088] From the above detailed description of the specific implementation methods of the present application, it can be clearly seen that in the covering structure of the present application, the connecting portion between the first covering layer and the second covering layer is formed by hot pressing the edges of the two, and the first covering layer and the second covering layer are unfolded so that the edges of the two are abutted against each other, so that a single-layer covering structure can be obtained without using the adhered object as the bottom, and the connecting portion can also effectively eliminate the seam between the first covering layer and the second covering layer.

[0089] Although the present application has been disclosed in the implementation mode as above, it is not intended to limit the present application. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be determined by the scope of the attached patent application.

Claims

1. A covering structure, characterized in that: Include: a first cover layer comprising a first material and having a first edge; A second covering layer comprising a second material and having a second edge, wherein the first covering layer and the second covering layer overlap to form a stacking structure, and the stacking structure is arranged such that the first edge faces the second edge; as well as The connecting portion is connected between a portion of the first edge and a portion of the second edge and comprises the first material and the second material, wherein the connecting portion is formed by hot-pressing and welding the edges of the stacking structure.

2. The covering structure according to claim 1, characterized in that: One of the first material and the second material is plastic.

3. The covering structure according to claim 1, characterized in that: One of the first material and the second material is a fiber layer.

4. The covering structure according to claim 1, characterized in that: Another portion of the first edge and another portion of the second edge abut against each other.

5. The covering structure according to claim 1, characterized in that: The first covering layer has a first front surface and a first back surface, the second covering layer has a second front surface and a second back surface, and the connecting portion connects the first front surface and the second front surface and is separated from the first back surface and the second back surface.

6. The covering structure according to claim 5, characterized in that The invention further comprises an adhesive layer, which is adhered to the first back surface and the second back surface.

7. An input device, characterized in that: Include: A body having opposing top and bottom surfaces; and The covering structure according to any one of claims 1 to 6, covering the top surface and the bottom surface of the body.

8. The input device according to claim 7, characterized in that Further included is a docking station, wherein the covering structure further covers an outer surface of the docking station.

9. The input device according to claim 8, characterized in that The outer surface of the expansion base includes an upper surface and a lower surface, the upper surface corresponds to the top surface of the body, the lower surface corresponds to the bottom surface of the body, the first covering layer is bonded and fixed to the upper surface, and the second covering layer is bonded and fixed to the lower surface.

10. The input device according to claim 8, wherein: The connecting portion is located on a side of the first covering layer and the second covering layer away from the outer surface.

11. A method for manufacturing a covering structure, characterized in that: Include: Providing a stack structure comprising a first covering layer and a second covering layer, wherein the first covering layer and the second covering layer comprise a first material and a second material respectively; hot pressing the edge of the stacked structure to form a connecting portion connecting a first edge of the first covering layer and a second edge of the second covering layer, wherein the connecting portion comprises the first material and the second material; as well as The first covering layer and the second covering layer are unfolded so that the first edge and the second edge abut against each other.

12. The method for manufacturing a covering structure according to claim 11, characterized in that: Further including: Before unfolding the first covering layer and the second covering layer, cutting the connecting portion.

13. The method for manufacturing a covering structure according to claim 12, characterized in that: The length of the cut connecting portion is smaller than the thickness of the stacking structure.

14. The method for manufacturing a covering structure according to claim 11, characterized in that: The heat pressing of the edge of the stacked structure is performed by a high frequency welding process.

15. The method for manufacturing a covering structure according to claim 11, characterized in that: After the first covering layer and the second covering layer are unfolded, the connecting portion connects the first front surface of the first covering layer and the second front surface of the second covering layer, and is separated from the first back surface of the first covering layer and the second back surface of the second covering layer.

16. The method for manufacturing a covering structure according to claim 15, characterized in that: Further including: An adhesive layer is bonded to the first back surface of the first cover layer and the second back surface of the second cover layer.

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