Semiconductor dispensing and laminating equipment

Abstract

The invention relates to the technical field of semiconductors, and provides semiconductor dispensing and laminating equipment. The conveying mechanism is arranged on the working table and is used for conveying a tool with a chip; the dispensing head and the suction nozzle are arranged above the conveying mechanism; the mounting frame is arranged on the working table and is used for mounting the dispensing head and the suction nozzle; the two driving mechanisms are arranged on the mounting frame and are used for respectively driving the dispensing head and the suction nozzle to do reciprocating sliding motion; the conveying mechanism comprises a plurality of guide rails which are arranged at intervals in the length direction of the mounting frame, and the dispensing head and the suction nozzle are arranged on the two sides of the mounting frame respectively; and a cleaning mechanism is arranged on the workbench on the advancing path of the dispensing head towards the conveying mechanism. The adhesive dispensing device has the advantages that residual adhesive on the adhesive dispensing head can be cleaned in time in the adhesive dispensing operation interval, the problem that the adhesive is preliminarily cured due to too long retention time is effectively prevented, and therefore the situation that the cured adhesive is mixed into new adhesive to affect the bonding quality is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors, and in particular to a semiconductor dispensing and bonding device. Background Art

[0002] As one of the core pillars of modern high-tech industries, the semiconductor industry has an important strategic position in the world. With the continuous advancement of science and technology, the integration of semiconductor devices is getting higher and higher, and the requirements for manufacturing processes are becoming more and more stringent. As one of the key links in the semiconductor manufacturing process, the dispensing and bonding process directly affects the performance, reliability and yield of the chip.

[0003] At present, the methods commonly adopted by the industry to solve the problem of residual glue tips include regular replacement of glue tips, use of high temperature heating to remove residual glue, or introduction of auxiliary tools for manual cleaning. Specifically, common treatment methods include: first, using an external cleaning device to spray solvent to dissolve the residue and then wipe it off; second, softening the solidified glue through a built-in heating system for subsequent cleaning; third, designing a special scraper structure to directly remove aging substances attached to the surface. Although these methods can alleviate the problem to a certain extent, they still have shortcomings.

[0004] However, the above traditional methods have exposed obvious limitations in practical applications. During the dispensing operation, the dispensing head usually has a certain residence time after dispensing chips on a tool or a batch of tools. If this time is relatively long, especially for glue with a short initial curing time, the glue near the dispensing head may solidify to a certain extent. When dispensing chips on the next batch or the next tool, the glue that has solidified to a certain extent will be mixed into the new glue, affecting the subsequent bonding effect between the chips and other components. At this time, the solidified glue on the dispensing head is not easy to clean using the above method during the operation, so further improvement is needed. Summary of the invention

[0005] In order to solve the above problems, the present application provides a semiconductor dispensing and bonding device.

[0006] The present application provides a semiconductor dispensing and bonding device, which adopts the following technical solution: A semiconductor glue dispensing and laminating device comprises a workbench, a conveying mechanism arranged on the workbench for conveying a tooling with a chip, a glue dispensing head and a suction nozzle arranged above the conveying mechanism, a mounting frame arranged on the workbench for mounting the glue dispensing head and the suction nozzle, and two driving mechanisms arranged on the mounting frame for respectively driving the glue dispensing head and the suction nozzle to perform reciprocating sliding motion, wherein the conveying mechanism comprises a plurality of guide rails arranged at intervals along the length direction of the mounting frame, and the glue dispensing head and the suction nozzle are respectively arranged on both sides of the mounting frame; a cleaning mechanism is arranged on the workbench on the path where the glue dispensing head travels toward the conveying mechanism, and the cleaning mechanism is used to clean the residual glue on the glue dispensing head, and the cleaning mechanism comprises a receiving plate for receiving the residual glue separated from the glue dispensing head as the glue is heated, an elastic scraper arranged on the receiving plate for scraping the glue, and an adjusting component for adjusting the horizontal position of the receiving plate, and the elastic scraper is arranged on the side of the receiving plate close to the conveying mechanism.

[0007] By adopting the above technical solution, as the driving mechanism drives the dispensing head to dispense glue on the next tooling or the next batch of chips, the new glue that has been heated can be squeezed out with pressure as the dispensing head moves toward the chip, and then the cured glue is driven to flow out under the premise of pressure extrusion, and then it is received by the receiving plate to prevent it from dripping randomly and causing waste or pollution; as it moves, it moves to the elastic scraper, and the elasticity of the elastic scraper itself can flexibly scrape off residual glue in different forms to ensure the cleaning effect. In this way, the glue that has been solidified before each dispensing can be scraped off to reduce the impact of the subsequent bonding effect between the chip and other components, and this method has less impact on the working state of the dispensing head than replacing the dispensing head, using high-temperature heating to remove residual glue, or manual cleaning.

[0008] Among them, the dispensing head and the suction nozzle are respectively arranged on both sides of the mounting frame, so as to be suitable for glue with a short initial solidification time. After the glue is initially solidified, other components are bonded to the chip through the suction nozzle to improve the bonding effect between the chip and other components. Since the path of the dispensing head moving toward the chip is relatively fixed, if the glue solidified on the dispensing head is scraped at the same place, the residual glue previously received and the glue scraped by the elastic scraper may also be bonded to the dispensing head along with the glue squeezed out again. In this regard, after the dispensing head is used a certain number of times at the same position on the receiving plate and the elastic scraper, the horizontal position of the receiving plate is changed by adjusting the assembly. At this time, the glue on the receiving plate and the elastic scraper can be cleaned manually or by disassembly. Compared with the prior art, this method can also reduce damage to the dispensing head.

[0009] Preferably, the cleaning mechanism also includes a collecting assembly for collecting the glue on the receiving plate and the elastic scraper, the collecting assembly includes a scraper abutting the receiving plate, a guide plate arranged on the scraper, and a collecting trough for receiving the glue guided by the guide plate, and the scraper is used to abut against the elastic scraper.

[0010] By adopting the above technical solution, a collection component is provided to collect the glue on the receiving plate and the elastic scraper, so as to further improve the system, comprehensively recycle the waste glue generated during the cleaning process, and keep the working environment clean. Specifically, the scraper can effectively remove the residual glue on the receiving plate, and the guide plate can guide the scraped glue to the collection tank for centralized treatment, thereby avoiding the contamination of the dispensing head by the residual glue and the influence on the subsequent dispensing operation.

[0011] Preferably, the receiving plate and the elastic scraper are both non-stick plates, both of which are thermally conductive, the receiving plate has a containing cavity inside, and the receiving plate is provided with an input pipe for conveying high-temperature medium into the containing cavity and an output pipe for outputting the medium after heat exchange outside.

[0012] By adopting the above technical solution, the receiving plate has thermal conductivity and is provided with a receiving cavity, which can use high-temperature medium to heat the receiving plate and conduct heat to the elastic scraper, thereby effectively softening the residual glue received or melting the solidified glue remaining on the dispensing head, so as to improve the cleaning efficiency on the receiving plate and the elastic scraper. At the same time, the design of the non-stick plate reduces the adhesion of the residual glue on the surface of the receiving plate and the elastic scraper, which is convenient for subsequent removal. The input pipe and the output pipe are set to realize the medium circulation, ensure the continuous supply of heat, improve the energy utilization rate, and further ensure the cleaning effect.

[0013] Preferably, the receiving plate is arranged at an end close to the conveying mechanism and is inclined upward, the collecting groove is arranged on the side of the receiving plate away from the conveying mechanism, and the collecting groove is arranged along the entire length direction of the receiving plate; the guide plate is arranged on the side of the scraper away from the collecting groove, the guide plate is arranged in an arc shape in the direction away from the collecting groove, one end of the guide plate is arranged close to the elastic scraper, and the other end of the guide plate is arranged close to the collecting groove, and the angle between the guide plate and the scraper is set to be an acute angle.

[0014] By adopting the above technical solution, the end of the receiving plate close to the conveying mechanism is tilted upward to effectively guide the glue to flow away from the conveying mechanism, avoiding the glue from flowing back and contaminating the dispensing area. The collection trough is set along the entire length of the receiving plate to ensure that all the glue flowing down is completely collected, improving the cleaning efficiency and reducing waste. The arc design of the guide plate and the sharp angle between it and the scraper help optimize the glue flow path, allowing the glue to be more smoothly introduced into the collection trough, thereby improving the cleaning effect.

[0015] Preferably, the elastic scraper is a first airbag on the top of the receiving plate, the first airbag is filled with gas, and the first airbag is arranged along the entire length direction of the receiving plate.

[0016] By adopting the above technical solution, the elastic scraper is used as the first airbag and is arranged on the top of the receiving plate. Due to its own elasticity and deformation ability, it can adapt to different surface shapes when abutting the dispensing head to avoid equipment damage or incomplete scraping due to rigid collision, while ensuring that the residual glue is fully removed, thereby improving the quality and reliability of the dispensing process.

[0017] Preferably, the receiving plate is a flexible plate, a heat conducting plate is arranged below the receiving plate and abuts against the receiving plate for heat conduction, the adjusting component includes two reels for winding around the two ends of the receiving plate and a second driving member for driving the reels to rotate, and two scrapers are provided and are respectively arranged at the two ends of the heat conducting plate.

[0018] By adopting the above technical solution, the receiving plate set on the flexible plate can better adapt to different working environments and improve the flexibility and efficiency of residual glue cleaning. The design of the heat conducting plate abutting against the receiving plate for heat conduction can effectively maintain the surface temperature of the receiving plate and prevent the residual glue from cooling and solidifying. The reel and the second driving member in the adjustment component are used together to achieve precise adjustment of the receiving plate and the elastic scraper in the horizontal position to ensure the stability of the cleaning process.

[0019] As the second driving member drives the reel to rotate, the two reels reel in and unreel the receiving plate respectively. During the reeling process, the scraper scrapes the softened residual rubber and squeezes the gas in the first airbag, so that the gas in the first airbag reeled on the reel is squeezed into the first airbag located between the two reels to form an arched state. This reduces the possibility of uneven reeling in the subsequent reeling process of the first airbag along with the receiving plate. After reeling to a certain extent, it rotates in the opposite direction for repeated use.

[0020] Preferably, both ends of the receiving plate are fixed to form a closed loop, and the adjusting assembly includes a rotating shaft around which the receiving plate is arranged and a third driving member for driving the rotating shaft to rotate.

[0021] By adopting the above technical solution, the two ends of the receiving plate are fixed to form a closed loop, so that the receiving plate forms a continuous circulation structure. This design can ensure that the receiving plate always maintains a stable shape during the cleaning process, avoiding deformation or failure due to uneven force.

[0022] Preferably, the first airbag is provided with elastic protrusions, and a plurality of the elastic protrusions are arranged at intervals along the length direction of the first airbag, and the elastic protrusions are used to abut against the side wall of the dispensing head.

[0023] By adopting the above technical solution, although the first airbag can adapt to dispensing heads of different shapes, when squeezed, the first airbag becomes concave, and the contact area between it and the side wall of the dispensing head is small. In this regard, by arranging elastic protrusions on the first airbag, the friction and contact area between the first airbag and the side wall of the dispensing head are increased. The elastic protrusions can enhance the contact effect between the first airbag and the side wall of the dispensing head, and can more effectively remove residual glue on the side wall of the dispensing head.

[0024] Preferably, the elastic protrusion is a second airbag, and the second airbag is connected to the first airbag, or adjacent second airbags are connected.

[0025] By adopting the above technical solution, the elastic convex point is designed as the second airbag, which can effectively enhance the cleaning effect of the side wall of the dispensing head. Compared with other fixed structures, the second airbag has better flexibility and can produce appropriate deformation when contacting the dispensing head, so as to fit the surface contour of the dispensing head more closely and improve the efficiency of residual glue cleaning. At the same time, when the second airbag is connected to the first airbag or adjacent second airbags are connected to each other, the pressure can be evenly distributed, avoiding the risk of damage to the equipment due to excessive local cleaning force, and ensuring that the entire cleaning process is stable and reliable.

[0026] Preferably, the first airbag is detachably connected to the receiving plate.

[0027] By adopting the above technical solution, a detachable connection is achieved between the first airbag and the receiving plate. This design allows the first airbag to be easily replaced or maintained after long-term use. At the same time, this detachable connection method also facilitates the separate cleaning or maintenance of the first airbag.

[0028] In summary, this application has the following beneficial effects: By setting a cleaning mechanism on the travel path of the dispensing head, the residual glue on the dispensing head can be cleaned in time between dispensing operations, effectively preventing the initial curing of the glue caused by too long a dwelling time, thereby avoiding the solidified glue from mixing into the new glue and affecting the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application; Figure 2 It is a structural schematic diagram of the workbench in Example 1 of the present application; Figure 3 is a schematic diagram of the structure of the nozzle in Example 1 of the present application; Figure 4 yes Figure 2 A local enlarged schematic diagram at A in FIG. Figure 5 It is a schematic diagram of the internal structure of the receiving plate in Example 1 of the present application; Figure 6 It is a schematic diagram of the structure of the cleaning mechanism in Example 2 of the present application; Figure 7 is a schematic diagram of the structure of Example 3 of the present application; Figure 8 It is a schematic diagram of the structure of the elastic bump in Example 4 of the present application.

[0030] Explanation of the reference numerals: 1. workbench; 11. conveying mechanism; 111. guide rail; 112. sliding seat; 12. dispensing head; 13. suction nozzle; 14. mounting frame; 15. driving mechanism; 16. control mechanism; 17. cover body; 171. cabinet door; 18. annular light source detection device; 2. cleaning mechanism; 21. receiving plate; 211. accommodating chamber; 212. input pipe; 213. output pipe; 22. elastic scraper; 221. deformation space; 23. adjustment component; 231. rack; 232. incomplete gear; 233. first driving member; 234. reel; 235. second driving member; 236. rotating shaft; 237. third driving member; 24. collecting component; 241. scraper; 242. guide plate; 243. collecting trough; 25. heat conducting plate; 3. elastic protrusion. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-8 , further details of this application are given.

[0032] The embodiment of the present application discloses a semiconductor dispensing and bonding device.

[0033] Embodiment 1: A semiconductor dispensing and bonding device, referring to Figure 1 , Figure 2 and Figure 3 , including a workbench 1, a conveying mechanism 11 arranged on the workbench 1 for conveying a tooling with chips, a dispensing head 12 and a suction nozzle 13 arranged above the conveying mechanism 11, a mounting frame 14 arranged on the workbench 1 for installing the dispensing head 12 and the suction nozzle 13, two driving mechanisms 15 and a control mechanism 16 arranged on the mounting frame 14 to respectively drive the dispensing head 12 and the suction nozzle 13 to perform reciprocating sliding motion, wherein the control mechanism 16 is used to be electrically connected to the conveying mechanism 11, the driving mechanism 15, the dispensing head 12 and the suction nozzle 13, so as to respectively control the transportation of the tooling with chips, drive the dispensing head 12 or the suction nozzle 13 to move accordingly, control the dispensing head 12 to dispense glue and the suction nozzle 13 to adsorb parts for bonding with chips. Since the control mechanism 16 is a prior art, it will not be described in detail here.

[0034] Among them, a cover body 17 is provided on the workbench 1 to cover the components arranged on the upper surface of the workbench 1 to achieve a dust-proof effect, and an opening is opened on the cover body 17, and a cabinet door 171 is provided on the cover body 17 to open and close the opening, so that the corresponding tooling with chips can be placed in the cover body 17 for gluing and bonding.

[0035] The conveying mechanism 11 includes a plurality of guide rails 111 spaced apart along the length direction of the mounting frame 14, a sliding seat 112 slidably connected to the guide rails 111, and a driving assembly (not shown in the figure) for driving the sliding seat 112 to slide. In this embodiment, two guide rails 111 are specifically shown, and two sliding seats 112 are correspondingly provided for placing the tooling for sliding transportation. The driving assembly can be a combination of a screw rod and a driving motor to drive the sliding seat 112 to slide, or other driving methods can be used to drive the sliding seat 112 to slide, which will not be described in detail here.

[0036] The length direction of the mounting frame 14 is parallel to the width direction of the guide rail 111, and the glue dispensing head 12 and the suction nozzle 13 are respectively arranged on both sides of the mounting frame 14. The glue dispensing head 12 is used to dispense glue to the chip through the driving mechanism 15, and the suction nozzle 13 is used to suck the parts to fit them with the glued chip.

[0037] Among them, in order to improve the accuracy of dispensing and fitting, an annular light source detection device 18 is provided on the side of the dispensing head 12 and the suction nozzle 13 close to the conveying mechanism 11. The annular light source detection device 18 is electrically connected to the control mechanism 16 to transmit the corresponding detected image to the control mechanism 16 for processing or viewing, so as to improve the accuracy of dispensing or the suction nozzle 13 when working.

[0038] Reference Figure 2 , Figure 4 Furthermore, during the use of the glue dispensing head 12, due to the limited length of the guide rail 111 and the number of sliding seats 112 that can be placed, there will be a rest gap in the glue dispensing operation. For this reason, the glue in the glue dispensing head 12 may be initially solidified, and when the operation is continued, it may be mixed with the newly squeezed glue to be dispensed on the chip, thereby affecting the subsequent bonding quality between the parts. For this reason, in this embodiment, a cleaning mechanism 2 is provided on the workbench 1 on the path where the glue dispensing head 12 travels toward the conveying mechanism 11.

[0039] The cleaning mechanism 2 is used to clean the residual glue on the dispensing head 12. The cleaning mechanism 2 specifically includes a receiving plate 21 for receiving the residual glue that is separated from the dispensing head 12 as the glue is heated, an elastic scraper 22 arranged on the receiving plate 21 for scraping the glue, an adjusting component 23 for adjusting the horizontal position of the receiving plate 21, and a collecting component 24 for collecting the glue on the receiving plate 21 and the elastic scraper 22.

[0040] In this embodiment, the receiving plate 21 and the elastic scraper 22 are both non-stick plates, and both are thermally conductive, wherein the receiving plate 21 can be made of ceramic, silicon dioxide, aluminum alloy or stainless steel, and is specifically configured according to the needs. The elastic scraper 22 needs to have a certain elasticity, and can be made of thermally conductive silicone.

[0041] Reference Figure 4 , Figure 5 , wherein the receiving plate 21 has a receiving cavity 211 inside, and an input pipe 212 for conveying high-temperature medium into the receiving cavity 211 and an output pipe 213 for outputting the medium after heat exchange are fixedly penetrated outside the receiving plate 21, wherein, in order to facilitate the subsequent adjustment component 23 to adjust the horizontal position of the receiving plate 21, the input pipe 212 and the output pipe 213 are both hose settings. wherein, the elastic scraper 22 is arranged on the side of the receiving plate 21 close to the conveying mechanism 11, and can be thermoplastically connected to the receiving plate 21, and the elastic scraper 22 can be arched in the direction away from the receiving plate 21, and the arched part can be arranged in a triangular shape or an arc shape, and is specifically arranged according to the needs, and a deformation space 221 is reserved between the elastic scraper 22 and the receiving plate 21 for the elastic scraper 22 to deform when it abuts against the dispensing head 12.

[0042] It should be noted that, with use, the elastic scraper 22 may be pressed and may become concave. To prevent this phenomenon, a fixing plate fixedly connected to the receiving plate 21 may be provided at the end of the elastic scraper 22, and air of a certain pressure may be injected into the deformation space 221. Alternatively, springs may be provided at intervals along the length direction of the elastic scraper 22 in the deformation space 221 to provide support for the elastic scraper 22, and the specific setting is based on the needs.

[0043] The adjusting assembly 23 may be a screw threaded through the lower end of the receiving plate 21 and a driving motor driving the screw to rotate, and the position on the receiving plate 21 may be changed as the driving motor rotates forward or reversely, or the adjusting assembly 23 may include two racks 231 arranged on the upper surface of the workbench 1 to be arranged opposite to each other, an incomplete gear 232 meshed with the rack 231, and a first driving member 233 fixedly connected to the incomplete gear 232, wherein the first driving member 233 is specifically arranged as a driving motor, and because it is an incomplete gear 232, the receiving plate 21 may be driven to slide back and forth under the unidirectional rotation of the driving motor. In this embodiment, the adjusting assembly 23 is specifically shown as the latter.

[0044] The collecting assembly 24 includes a scraper 241 abutting against the receiving plate 21, a guide plate 242 arranged on the scraper 241, and a collecting groove 243 for receiving the glue guided by the guide plate 242. The scraper 241 is used to abut against the elastic scraper 22. It should be noted that, in order to facilitate the subsequent collection of the heated glue, in this embodiment, the end of the receiving plate 21 close to the conveying mechanism 11 is arranged to be inclined upward, so that the softened glue flows along the inclined direction of the receiving plate 21. For this purpose, the collecting groove 243 is arranged on the side of the receiving plate 21 away from the conveying mechanism 11, and the collecting groove 243 is arranged along the entire length of the receiving plate 21. The guide plate 242 is arranged on the side of the scraper 241 away from the collecting groove 243. The guide plate 242 is arranged in an arc shape in the direction away from the collecting groove 243. One end of the guide plate 242 is arranged close to the elastic scraper 22, and the other end of the guide plate 242 is arranged close to the collecting groove 243. The angle between the guide plate 242 and the scraper 241 is arranged at an acute angle, so as to flow the scraped glue into the collecting groove 243 for collection.

[0045] It should be noted that, for the collected glue, the inner bottom wall of the collecting tank 243 can be set to be inclined, and a collecting pipe can be fixedly penetrated on the end of the collecting tank 243 so that the glue can flow to the corresponding storage box for collection and processing.

[0046] The implementation principle of a semiconductor dispensing and bonding device in the embodiment of the present application is as follows: before the driving mechanism 15 drives the dispensing head 12 to dispense glue on the next tooling or the next batch of chips, the dispensing head 12 can move toward the chip with pressure to squeeze out the heated new glue, and then drive the solidified glue to flow out under the premise of pressure extrusion, and then receive it through the receiving plate 21 to prevent it from dripping randomly and causing waste or pollution; as it moves, it moves to the elastic scraper 22, and the elasticity of the elastic scraper 22 itself can flexibly scrape off residual glue in different forms to ensure the cleaning effect. In this way, the glue that has solidified before each dispensing can be scraped off to reduce the impact of the subsequent bonding effect between the chip and other components, and this method has a lower impact on the working state of the dispensing head 12 than replacing the dispensing head 12, using high-temperature heating to remove residual glue, or manual cleaning.

[0047] Embodiment 2: Reference Figure 6 , which is different from the embodiment 1, in this embodiment, the elastic scraper 22 is the first airbag on the top of the receiving plate 21, the first airbag is filled with gas, and the first airbag is arranged along the entire length of the receiving plate 21. The receiving plate 21 is a flexible plate, and a heat conducting plate 25 is arranged below the receiving plate 21 to abut against the receiving plate 21 for heat conduction. The heat conducting plate 25 can refer to the arrangement of the receiving plate 21 in the embodiment 1, and no further description is given here.

[0048] The adjustment assembly 23 includes two reels 234 for winding at both ends of the receiving plate 21 and a second driving member 235 for driving the reels 234 to rotate; the two ends of the receiving plate 21 are fixedly connected to the reels 234, or a reel for winding the receiving plate 21 is detachably connected to the reels 234. The second driving member 235 is also a driving motor. Two second driving members 235 are provided and are respectively fixedly connected to the two reels 234 so as to reel in the reels 234 at one end after unwinding. In this regard, two scrapers 241 are provided and are respectively provided at both ends of the heat conducting plate 25.

[0049] Embodiment 3: Reference Figure 7 , which is different from Example 2, is that, in this embodiment, both ends of the receiving plate 21 are fixed to form a closed loop. At this time, the adjusting component 23 includes a rotating shaft 236 for the receiving plate 21 to be arranged around and a third driving member 237 for driving the rotating shaft 236 to rotate. The third driving member 237 is provided with one, and the third driving member 237 can also be provided as a driving motor.

[0050] Embodiment 4: Reference Figure 8, which is different from Example 2 in that the first airbag is provided with elastic convex points 3, and a plurality of elastic convex points 3 are provided at intervals along the length direction of the first airbag, and the elastic convex points 3 are used to abut against the side wall of the dispensing head 12. It should be noted that the elastic convex points 3 can be provided for the second airbag, and the second airbag is connected to the first airbag, or adjacent second airbags are connected.

[0051] Furthermore, as the first airbag or the second airbag is used, it may be damaged or deformed. In this case, the first airbag may be detachably connected to the receiving plate 21 , and specifically, may be bonded to the receiving plate 21 by means of an adhesive tape.

[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor dispensing and bonding device, characterized in that: The invention comprises a workbench (1), a conveying mechanism (11) arranged on the workbench (1) for conveying a tooling with a chip, a dispensing head (12) and a suction nozzle (13) arranged above the conveying mechanism (11), a mounting frame (14) arranged on the workbench (1) for mounting the dispensing head (12) and the suction nozzle (13), and two driving mechanisms (15) arranged on the mounting frame (14) for driving the dispensing head (12) and the suction nozzle (13) to perform reciprocating sliding motion, wherein the conveying mechanism (11) comprises a plurality of guide rails (111) arranged at intervals along the length direction of the mounting frame (14), and the dispensing head (12) and the suction nozzle (13) are respectively arranged On both sides of the mounting frame (14); a cleaning mechanism (2) is arranged on the workbench (1) on the path of the dispensing head (12) toward the conveying mechanism (11), the cleaning mechanism (2) being used to clean the residual glue on the dispensing head (12), the cleaning mechanism (2) comprising a receiving plate (21) for receiving the residual glue that is separated from the dispensing head (12) as the glue is heated, an elastic scraper (22) arranged on the receiving plate (21) for scraping the glue, and an adjusting component (23) for adjusting the horizontal position of the receiving plate (21), the elastic scraper (22) being arranged on a side of the receiving plate (21) close to the conveying mechanism (11).

2. The semiconductor dispensing and bonding device according to claim 1, characterized in that: The cleaning mechanism (2) further comprises a collecting assembly (24) for collecting glue on the receiving plate (21) and the elastic scraper (22); the collecting assembly (24) comprises a scraper (241) abutting against the receiving plate (21), a guide plate (242) arranged on the scraper (241), and a collecting groove (243) for receiving the glue guided by the guide plate (242); the scraper (241) is used to abut against the elastic scraper (22).

3. A semiconductor dispensing and bonding device according to claim 2, characterized in that: The receiving plate (21) and the elastic scraper (22) are both non-stick plates, and both are thermally conductive. The receiving plate (21) has a receiving cavity (211) inside, and an input pipe (212) for conveying high-temperature medium into the receiving cavity (211) and an output pipe (213) for outputting the medium after heat exchange are arranged outside the receiving plate (21).

4. The semiconductor dispensing and bonding device according to claim 2, characterized in that: One end of the receiving plate (21) close to the conveying mechanism (11) is arranged in an inclined manner upward; the collecting groove (243) is arranged on a side of the receiving plate (21) away from the conveying mechanism (11); and the collecting groove (243) is arranged along the entire length direction of the receiving plate (21); the guide plate (242) is arranged on a side of the scraper (241) away from the collecting groove (243); the guide plate (242) is arranged in an arc shape in a direction away from the collecting groove (243); one end of the guide plate (242) is arranged close to the elastic scraper (22); the other end of the guide plate (242) is arranged close to the collecting groove (243); and the angle between the guide plate (242) and the scraper (241) is arranged in an acute angle.

5. The semiconductor dispensing and bonding device according to claim 2, characterized in that: The elastic scraper (22) is a first airbag on the top of the receiving plate (21), the first airbag is filled with gas, and the first airbag is arranged along the entire length direction of the receiving plate (21).

6. The semiconductor dispensing and bonding device according to claim 5, characterized in that: The receiving plate (21) is a flexible plate, a heat conducting plate (25) is provided below the receiving plate (21) and is in contact with the receiving plate (21) for heat conduction, the adjustment component (23) comprises two reels (234) for winding around two ends of the receiving plate (21) and a second driving member (235) for driving the reels (234) to rotate, and two scrapers (241) are provided and are respectively provided at two ends of the heat conducting plate (25).

7. The semiconductor dispensing and bonding device according to claim 5, characterized in that: The two ends of the receiving plate (21) are fixed to form a closed loop, and the adjustment component (23) comprises a rotating shaft (236) around which the receiving plate (21) is arranged, and a third driving member (237) for driving the rotating shaft (236) to rotate.

8. The semiconductor dispensing and bonding device according to claim 5, characterized in that: The first airbag is provided with elastic convex points (3), and a plurality of the elastic convex points (3) are arranged at intervals along the length direction of the first airbag. The elastic convex points (3) are used to abut against the side wall of the dispensing head (12).

9. The semiconductor dispensing and bonding device according to claim 8, characterized in that: The elastic protrusion (3) is a second airbag, and the second airbag is connected to the first airbag, or adjacent second airbags are connected.

10. A semiconductor dispensing and bonding device according to any one of claims 5 to 9, characterized in that: The first airbag is detachably connected to the receiving plate (21).

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