Chip sorting and binding table and sorting and binding method

By designing a chip sorting and material tying table and providing a sorting box for sorting and storage, the problem of chaotic classification clamp identification during the chip sorting and material tying process is solved, and the correct sorting and material tying of multiple batches of chips is achieved, which improves work efficiency and accuracy.

CN119819601APending Publication Date: 2025-04-15XINYUN SEMICON (ZHUJI) CO LTD
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Patent Information

Application Number
CN202510150910.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2025-04-15

AI Technical Summary

Technical Problem

During the chip sorting and material cutting process, the classification clamps used in different batches of chips cannot be mixed, which can easily lead to confusion in the identification of the classification clamps and affect the correct sorting and material cutting of the chip.

Method used

A chip sorting and tying table is designed, including a table body and a storage box. The table body is equipped with a storage box for sorting and tying materials, a qualified product placement area and a bad product placement area. Classification clip boxes, label boxes and batch clip boxes are attached to the storage box to ensure that the classification clips can be stored in a classified manner and used correctly.

Benefits of technology

Through the chip sorting and material cutting table and method, the problem of disordered classification clamp labeling when the chip leaves the factory can be effectively avoided, ensuring the correct sorting and material cutting of multiple batches of chips, and improving work efficiency and accuracy.

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Abstract

The invention belongs to the technical field of chips, and discloses a chip sorting and binding table and a sorting and binding method, the chip sorting and binding table is used for sorting and binding containing boxes containing chips, the chip sorting and binding table comprises a first table top, the containing boxes used for sorting and binding, a second table top, a third table top and a third table top, the storage rack is provided with a defective product placing area and used for placing defective product bundles, and the storage rack is fixed on the first table top; the storage box comprises a plurality of classification clamp boxes, and the classification clamp boxes are hung on the storage rack and used for storing the classification clamps, so that a worker can select the corresponding classification clamps for the chips and clamp the classification clamps on the containing boxes. According to the chip sorting and material binding method, by using the transfer table before the chip power-on test, sorting and material binding can be carried out on multiple batches of chips, and the problem of disordered chip delivery classification clamp identification is avoided.
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Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a chip sorting and bundling method and a sorting and bundling table. Background Art

[0002] Before leaving the factory, the chip must be powered on and tested to determine whether it is a qualified product. There must be defective chips in the same batch of chips. After the chip is powered on and tested, it is necessary to install a classification clip on the chip clip to indicate whether the chip is a qualified product, sort out the defective chips in the same batch, and then bundle the qualified chips into bundles. However, different batches of chips have classification clips of specific specifications and cannot be mixed. When sorting and bundling several batches of chips, the classification clips are easily mixed and cannot be marked on the chips of the corresponding batch, which easily leads to confusion in the classification clip marking of chips leaving the factory. Summary of the invention

[0003] The object of the present invention is to provide a chip factory sorting workbench, which can sort and bundle multiple batches of chips without the problem of confusion in the chip factory classification clip identification.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] In a first aspect, a chip sorting and bundling table is provided, which is used for sorting and bundling a containing box containing chips, and the chip sorting and bundling table comprises:

[0006] The table body includes a first table top, a second table top, a third table top and a storage rack arranged in a vertical direction. The first table top is used to sort the bundled material storage boxes. The second table top is provided with a qualified product placement area for placing qualified product bundles. The third table top is provided with a defective product placement area for placing defective product bundles. The storage rack is fixed on the first table top.

[0007] The storage box comprises a classification clip box, and a plurality of classification clip boxes are hung on a storage rack for storing classification clips.

[0008] Preferably, the storage rack comprises a bracket and a hanging piece, the hanging piece is fixed on the bracket, and the classification clip box is hung on the hanging piece.

[0009] Preferably, the storage box further comprises a label box, which is hung on the hanging member and is used for storing labels.

[0010] Preferably, the storage box further comprises a batch clip box, which is used to store batch clips, the batch clip box is hung on the storage rack, and a plurality of batch clip boxes are hung on the hanging member.

[0011] Preferably, at least two hanging members are fixed on the bracket at intervals along the vertical direction, the batch clamp box is only hung on one of the at least two hanging members, and the classification clamp box is only hung on the other of the at least two hanging members.

[0012] Preferably, the chip sorting and bundling table further comprises: a strap rack, which can be fixedly connected to the first desktop and / or the second desktop, and the strap rack is used for hanging straps.

[0013] Preferably, the first desktop and the second desktop are both provided with baffles, the strap rack includes a strap hanging portion and a hook, at least two hooks are arranged on the strap hanging portion in parallel and at intervals, and the strap hanging portion is hung on the baffle.

[0014] Preferably, the chip sorting and bundling table further comprises an ion fan, which is fixed on the first table top and / or the second table top, and the air outlet of the ion fan faces the chip.

[0015] In a second aspect, a chip sorting and bundling method is provided, which uses the above-mentioned chip sorting and bundling table, and is characterized by comprising the following steps:

[0016] S100, according to the power-on test result, taking out the qualified product classification clip or the defective product classification clip corresponding to the chip from the classification clip box, and inserting the classification clip into the containing box containing the chip;

[0017] S200, sort out the storage boxes with qualified product classification clips, bundle several storage boxes with qualified product classification clips into qualified product bundles, fix batch clips on the qualified product bundles, and place the qualified product bundles into the qualified product placement area; bundle several storage boxes with defective product classification clips into defective product bundles, and place the defective product bundles into the defective product placement area.

[0018] Preferably, a storage box with a green binding strap and a classification clip for qualified products is provided, and a storage box with a red binding strap and a classification clip for defective products is provided.

[0019] Beneficial effects of the present invention:

[0020] The chip sorting and bundling table provided by the present invention can distinguish whether the chips are qualified products by installing classification clips on the first desktop for the containing box containing chips, and bundle the containing boxes containing qualified chips into qualified product bundles, and bundle the containing boxes containing defective chips into defective product bundles, so as to sort out the defective products; by placing the qualified product bundles in the qualified product placement area of ​​the second desktop, and placing the defective product bundles in the defective product placement area of ​​the third desktop, the qualified products are separated from the defective products; by hanging a plurality of classification clip boxes on the storage rack, the classification clips can be classified and stored, and when installing the classification clips on the containing box, the staff can select the corresponding classification clips for the chips and install them on the containing box. The chip sorting and bundling method can sort and bundle multiple batches of chips by adopting the above-mentioned chip sorting and bundling table without the problem of confusion in the identification of the classification clips of the chips leaving the factory. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is an exploded schematic diagram of the containing box provided by the present invention;

[0022] Figure 2 It is a structural schematic diagram of the chip sorting and bundling table provided by the present invention.

[0023] In the figure:

[0024] 100, chip; 200, containing box; 201, box body; 202, box cover;

[0025] 1. Table body; 11. First table top; 12. Second table top; 13. Third table top; 14. Storage rack; 141. Bracket; 142. Hanging piece;

[0026] 2. Storage box; 21. Classification clip box; 211. Classification clip box body; 212. Classification clip box hanging part; 22. Label box; 23. Batch clip box; 231. Batch clip box body; 232. Batch clip box hanging part;

[0027] 3. strap rack; 31. strap attachment portion; 32. hook;

[0028] 4. Ion fan. DETAILED DESCRIPTION

[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0030] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0033] Figure 1 FIG. 2 shows an exploded schematic diagram of the container box 200 provided in this embodiment. Figure 1 As shown, specifically, the containing box 200 includes a box body 201 and a box cover 202, and the chip 100 is placed in the box body 201, and the box body 201 and the box cover 202 are buckled together to contain the chip 100. When sorting and bundling several batches of chips 100, the classification clips are easily mixed up and cannot be marked on the corresponding batch of chips 100, which easily leads to the problem of confusion in the factory classification clips of the chips 100. Therefore, the key to solving the above technical problems is to classify and store the classification clips corresponding to several batches of chips 100. Figure 2 The schematic diagram of the structure of the chip sorting and bundling table provided in this embodiment is shown below. Figure 1 to Figure 2 The chip sorting and bundling table and the chip sorting and bundling method provided by the present invention are introduced in detail.

[0034] like Figure 1 to Figure 2As shown, the chip sorting and bundling table provided in this embodiment is used for sorting and bundling the containing box 200 containing the chip 100, and the chip sorting and bundling table includes a table body 1 and a storage box 2. The table body 1 includes a first desktop 11, a second desktop 12, a third desktop 13 and a storage rack 14 arranged in the vertical direction. The first desktop 11 is used for sorting and bundling the containing box 200, the second desktop 12 is provided with a qualified product placement area for placing qualified product bundles, the third desktop 13 is provided with a defective product placement area for placing unqualified product bundles, and the storage rack 14 is fixed on the first desktop 11. The storage box 2 includes a classification clip box 21, and several classification clip boxes 21 are hung on the storage rack 14 for storing classification clips. It should be noted that the chip 100 itself has been marked as a qualified product after the power-on test, and the staff needs to manually set the classification clip card on the containing box 200, and finally manually confirm and mark whether the chip 100 is a qualified product.

[0035] The chip sorting and bundling table provided in the present embodiment distinguishes whether the chip 100 is a qualified product by installing classification clips on the first desktop 11 for the containing box 200 containing the chip 100, and bundles the containing box 200 containing qualified chips 100 into qualified product bundles, and bundles the containing box 200 containing defective chips 100 into defective product bundles, thereby sorting out the defective products; by placing the qualified product bundles on the qualified product placement area of ​​the second desktop 12, and placing the defective product bundles on the defective product placement area of ​​the third desktop 13, the qualified products are separated from the defective products; by having a plurality of classification clip boxes 21 all hung on the storage rack 14, the classification clips can be classified and stored. When installing the classification clips on the containing box 200, the staff can select the corresponding classification clips for the chip 100 and install them on the containing box 200, so that multiple batches of chips 100 can be sorted and bundled without the problem of confusion in the factory classification clip labels of the chips 100.

[0036] Continue as Figure 1 to Figure 2 As shown, the storage rack 14 includes a bracket 141 and a hanging member 142, the hanging member 142 is fixed to the bracket 141, and the classification clip boxes 21 are respectively hung on the hanging members 142, so that when the classification clips are used up, the classification clip boxes 21 can be taken away, and after the warehouse is replenished with new classification clips, the classification clip boxes 21 are hung on the hanging member 142 again. Specifically, the classification clip box 21 includes a classification clip box body 211 and a classification clip box hanging part 212, the classification clip box body 211 is fixedly connected to the classification clip box 212 hanging part, and the classification clip box hanging part 212 is hung on the hanging member 142.

[0037] In some embodiments, the storage box 2 also includes a label box 22, which is hung on the hanging part 142 and is used to store labels, so that qualified product bundles and defective product bundles can be labeled, thereby recording the number of chips 100 in the chip bundle, making it convenient for staff to know the number of chips 100 in the current chip bundle.

[0038] In the actual production process of the chip 100, the process and material quality of different batches of the chip 100 are different, so the factory batches must be distinguished. Figure 1 to Figure 2 As shown, the storage box 2 also includes a batch clip box 23, which is used to store batch clips. The batch clip box 23 is hung on the storage rack 14, and a plurality of batch clip boxes 23 are hung on the hanging member 142, so that batch clips can be mounted for qualified product bundles or defective product bundles to identify the batch to which the chip 100 belongs. Specifically, the batch clip box 23 includes a batch clip box body 231 and a batch clip box hanging portion 232, the batch clip box body 231 is fixedly connected to the batch clip box hanging portion 232, and the batch clip box hanging portion 232 is hung on the hanging member 142.

[0039] Preferably, at least two hanging parts 142 are fixed on the bracket 141 at intervals in the vertical direction, the classification clamp box 21 is only hung on one of the at least two hanging parts 142, and the batch clamp box 23 is only hung on the other of the at least two hanging parts 142, so that the batch clamp box 23 can be separated from the classification clamp box 21 and each can be summarized and concentrated, which is convenient for the staff to quickly find the batch clamps and classification clamps they need, thereby improving the sorting efficiency of the sorting and bundling table.

[0040] Continue as Figure 1 to Figure 2 As shown, the chip sorting and bundling table also includes a strap rack 3, which can be fixedly connected to the first desktop 11 and / or the second desktop 12. The strap rack 3 is used to hang straps, so that the straps can be stored in a centralized manner to prevent the straps from being lost when the straps are needed to bind the storage box 200. Specifically, the first desktop 11 and the second desktop 12 are both provided with baffles, and the strap rack 3 includes a strap hanging portion 31 and a hook 32, at least two hooks 32 are arranged on the strap hanging portion 31 in parallel and at intervals, and the strap hanging portion 31 is hung on the baffle, so that when the straps are used up, the strap rack 3 can be taken away, and after the warehouse is replenished with new straps, the strap rack 3 is hung on the baffle again.

[0041] Continue as Figure 1 to Figure 2As shown, the chip sorting and bundling table also includes an ion fan 4, which is fixed on the first desktop 11, and the air outlet of the ion fan 4 faces the chip 100, thereby eliminating static electricity and preventing the chip 100 from being damaged due to static discharge. It is worth noting that the number of ion fans 4 is not limited, and can be 1, 2, 3, or even more, as long as the air outlet of the ion fan 4 faces the chip 100, it can eliminate the static electricity of the removed chip 100 and prevent the chip 100 from being damaged due to static discharge. Similarly, the ion fan 4 is fixed on the second desktop 12, and the air outlet of the ion fan 4 faces the chip 100.

[0042] The present embodiment also provides a chip sorting and bundling method, which uses the above-mentioned chip sorting and bundling table, including the following steps: S100, according to the power-on test result, take out the qualified product classification clip or the defective product classification clip corresponding to the chip 100 from the classification clip box 21, and install the classification clip for the containing box 200 containing the chip 100; S200, sort out the containing box 200 with the qualified product classification clip, bundle several containing boxes 200 with the qualified product classification clip into a qualified product bundle, fix the batch clip on the qualified product bundle, and place the qualified product bundle into the qualified product placement area; bundle several containing boxes 200 with the defective product classification clip into a defective product bundle, and place the defective product bundle into the defective product placement area.

[0043] In some embodiments, a container box 200 with a green binding card and a qualified product classification clip is used, and a container box 200 with a red binding card and a defective product classification clip is used, so that it is possible to directly determine whether the chip bundle is qualified based on the color of the binding card, thereby preventing defective bundles from being mistakenly packaged and shipped out of the factory.

[0044] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A chip sorting and bundling table, used for sorting and bundling a containing box (200) containing chips (100), characterized in that: The chip sorting and bundling table comprises: The table body (1) comprises a first table top (11), a second table top (12), a third table top (13) and a storage rack (14) arranged in a vertical direction, wherein the first table top (11) is used for sorting and bundling the receiving box (200), the second table top (12) is provided with a qualified product placement area for placing qualified product bundles, the third table top (13) is provided with a defective product placement area for placing defective product bundles, and the storage rack (14) is fixed on the first table top (11); The storage box (2) comprises a classification clip box (21), wherein a plurality of the classification clip boxes (21) are hung on the storage rack (14) and are used for storing classification clips.

2. The chip sorting and bundling table according to claim 1, characterized in that: The storage rack (14) comprises a bracket (141) and a hanging piece (142), wherein the hanging piece (142) is fixed on the bracket (141), and the classification clip box (21) is hung on the hanging piece (142).

3. The chip sorting and bundling table according to claim 2, characterized in that: The storage box (2) further comprises a label box (22), wherein the label box (22) is hung on the hanging member (142) and is used for storing labels.

4. The chip sorting and bundling table according to claim 2, characterized in that: The storage box (2) further comprises a batch clip box (23), wherein the batch clip box (23) is used to store batch clips, the batch clip box (23) is hung on the storage rack (14), and a plurality of the batch clip boxes (23) are hung on the hanging member (142).

5. The chip sorting and bundling table according to claim 4, characterized in that: At least two of the hanging members (142) are fixed on the bracket (141) at intervals in the vertical direction, the batch clamp box (21) is only hung on one of the at least two hanging members (142), and the classification clamp box (23) is only hung on the other of the at least two hanging members (142).

6. The chip sorting and bundling table according to claim 1, characterized in that: The chip sorting and bundling table further comprises: a strapping rack (3), wherein the strapping rack (3) can be fixedly connected to the first desktop (11) and / or the second desktop (12), and the strapping rack (3) is used for hanging straps.

7. The chip sorting and bundling table according to claim 6, characterized in that: The first tabletop (11) and the second tabletop (12) are both provided with baffles, the strap frame (3) comprises a strap hanging portion (31) and a hook (32), at least two of the hooks (32) are arranged on the strap hanging portion (31) in parallel and at intervals, and the strap hanging portion (31) is hung on the baffle.

8. The chip sorting and bundling table according to any one of claims 1 to 7, characterized in that: The chip sorting and bundling table further comprises an ion fan (4), wherein the ion fan (4) is fixed on the first table top (11) and / or the second table top (12), and an air outlet of the ion fan (4) faces the chip (100).

9. A chip sorting and bundling method, using the chip sorting and bundling table according to any one of claims 1 to 8, characterized in that: The steps include: S100, according to the power-on test result, taking out a qualified product classification clip or a defective product classification clip corresponding to the chip (100) from the classification clip box (21), and clamping the classification clip into the containing box (200) containing the chip (100); S200, sorting out the storage boxes (200) equipped with qualified product classification clips, bundling a plurality of the storage boxes (200) equipped with the qualified product classification clips into a qualified product bundle, fixing batch clips on the qualified product bundle, and placing the qualified product bundle into a qualified product placement area; bundling a plurality of the storage boxes (200) equipped with defective product classification clips into a defective product bundle, and placing the defective product bundle into a defective product placement area.

10. The chip sorting and bundling method according to claim 9, characterized in that: The receiving box (200) is provided with the qualified product classification clip using a green binding band binding card, and the receiving box (200) is provided with the defective product classification clip using a red binding band binding card.