Welding structure with cooling water channel target material back plate and welding method of welding structure
By using components such as thermal conductivity rings, mounting rings and other components in the welding structure of the target back plate, combined with technologies such as sealing thermal conductivity of the silicone grease and tooth rings, the problem of lax sealing of the solder is solved, and a welding structure with leakage-free and effective heat dissipation function is achieved, which improves the performance of the product.
Patent Information
- Application Number
- CN202411751998.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-04-15
AI Technical Summary
In the prior art, the solder sealing structure of the target back plate has a poor solder sealing property, which can easily lead to solder leakage and solder defects, affecting the performance of the product.
Components such as thermal conductivity rings and mounting rings are adopted, through structures such as plug-in grooves, welding grooves and fixing grooves, combined with sealing thermal grease and tooth rings, the thermal conductivity rings and the target back plate are achieved, and a sealed and thermally conductive structure is formed through welding of the mounting rings and the cold water cooling channel.
It realizes a small welded joint without leakage, and has effective heat dissipation function, improving the performance and reliability of the product.
Smart Images

Figure CN119820195A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of target materials, and in particular to a welding structure of a target material back plate with a cooling water channel and a welding method thereof. Background Art
[0002] The target material used for semiconductor sputtering generates a lot of heat when working. In order to reduce the product temperature when the target material is working, cooling water needs to flow through the target material back plate. Usually, cooling back plates are divided into two types according to the type of sputtering machine: back plates with cooling water channels and back plates without cooling water channels. Back plates with cooling water channels usually use welding to process the water channel structure. However, if the welding structure design is unreasonable, the solder is selected incorrectly, or the welding process is inappropriate, welding defects and product deformation will occur, which will cause water leakage in the water channel and damage the equipment.
[0003] The prior art application number CN104588807A discloses a method for forming a back plate and a back plate, wherein the method for forming the back plate comprises: providing a bottom plate and a cover plate, wherein the surface of the bottom plate facing the cover plate is the top surface of the bottom plate, the top surface of the bottom plate is a plane, the bottom surface of the cover plate is a plane, and the bottom of the cover plate has a cooling water channel groove structure; the cooling water channel groove structure and the bottom plate form a cooling water channel; and the bottom surface of the cover plate and the top surface of the bottom plate are welded by a brazing process to form a back plate.
[0004] The sealing of the solder in the back plate described in the above technical solution is not strict, which may easily lead to solder leakage and welding defects, seriously affecting the performance of the product. For this reason, we propose a welding structure and welding method of a target back plate with a cooling water channel. Summary of the invention
[0005] The purpose of the present invention is to solve the shortcomings existing in the prior art, and to propose a welding structure of a target material back plate with a cooling water channel and a welding method thereof. The welding structure of the target material back plate with a cooling water channel solves the problem of poor sealing of the solder in the back plate, which easily leads to solder leakage and welding defects.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions:
[0007] A welding structure with a target back plate having a cooling water channel comprises a target, a back plate is arranged on the lower side of the target, a first heat dissipation connection part is arranged on the upper side of the back plate, and a second heat dissipation connection part is arranged on the lower side of the back plate.
[0008] Preferably, the heat dissipation connection part 1 includes a plug-in slot, which is arranged on the upper side of the back plate, in which a thermal conductive ring is inserted, a welding slot 1 is arranged on the upper side of the thermal conductive ring and close to the outer side of the target material, and welding slots 2 are arranged on the upper side of the plug-in slot and on both sides of the thermal conductive ring.
[0009] Through the above technical solution, the thermal conductive ring is inserted into the plug-in slot, and then the solder is filled into the second welding slot, and then the thermal conductive ring and the back plate are welded, and then the solder is directly filled into the first welding slot to weld the thermal conductive ring and the target material, providing a small weld without leakage, and at the same time can perform the function of effective heat dissipation.
[0010] Preferably, the second heat dissipation connection part includes an installation groove, which is arranged on the lower side of the back plate, and a mounting ring is inserted into the installation groove. A plurality of fixing grooves are arranged on the lower side of the back plate, and a cold water cooling channel is inserted into the fixing groove, and the cold water cooling channel is connected to the installation ring.
[0011] Through the above technical solution, the installation ring is inserted into the installation groove, the cold water cooling channel is inserted into the fixing groove, and they are welded so that the installation ring, the cold water cooling channel and the back plate form an integrated structure.
[0012] Preferably, the fixing groove is filled with sealing thermally conductive silicone grease.
[0013] Through the above technical solution, the setting of the sealing thermal conductive silicone grease not only provides a sealing function between the fixed groove and the cold water cooling channel but also has a heat conductive function.
[0014] Preferably, water hole 1 is provided on both sides of the cold water cooling channel, and water hole 2 is provided on both sides of the mounting ring.
[0015] Through the above technical solution, the water hole one is provided to provide a cooling water diversion function for the cold water channel, and the water hole two is provided to fill the mounting ring with cooling water.
[0016] Preferably, a tooth groove is provided in the installation groove, a tooth ring is provided on the outer side of the installation ring, and a residual groove is provided between the tooth ring and the tooth groove.
[0017] Through the above technical solution, the tooth ring is inserted into the tooth groove to match the residual groove, which provides a leakage-free welding function for the welding between the mounting ring and the back plate.
[0018] Preferably, a bottom plate is provided on the lower side of the mounting ring, a sealing protrusion is provided on the upper side of the bottom plate, and the sealing protrusion is threadedly connected to the mounting ring.
[0019] Through the above technical solution, the bottom plate cooperates with the sealing protrusion to provide a sealing connection function to the bottom of the mounting ring.
[0020] A welding method for a welding structure of a target material back plate with a cooling water channel, the specific steps are as follows:
[0021] S1. Bend and weld the thermal conductive ring according to the size of the target material;
[0022] S2, inserting the heat-conducting ring into the plug-in slot on the back plate, and then filling solder into the second welding slot to weld the heat-conducting ring and the back plate;
[0023] S3, insert the installation ring with the cold water cooling channel into the installation groove and the fixing groove respectively, then fill the residual groove with flux, and weld the installation ring and the back plate;
[0024] S4, then placing the target material in the heat-conducting ring, and then filling the solder in the welding groove 1, welding the target material and the heat-conducting ring, so that the back plate and the target material are integrated;
[0025] S5. Finally, the bottom plate with the sealing protrusion is threadedly connected to the lower side of the mounting ring, so that the cold water channel in the mounting ring is closed.
[0026] In summary, in the present invention, the thermally conductive ring is inserted into the plug-in slot, and then solder is filled into the second welding slot, and then the thermally conductive ring and the back plate are welded, and then solder is directly filled into the first welding slot to weld the thermally conductive ring and the target material, providing a small weld without leakage, and at the same time can perform the function of effective heat dissipation.
[0027] In the present invention, the tooth ring is inserted into the tooth groove to match the residual groove, so as to provide a leakage-free welding function for the welding between the mounting ring and the back plate.
[0028] The present invention provides a sealing heat-conducting silicone grease, which provides a sealing function between the fixing groove and the cold water cooling channel and also has a heat-conducting function. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a schematic diagram of the exploded structure of the front axial side of the present invention;
[0030] Figure 2 It is a schematic diagram of the exploded structure on the bottom axial side of the present invention;
[0031] Figure 3 It is a structural schematic diagram of the front axial side of the present invention;
[0032] Figure 4 It is a schematic structural diagram of the present invention in front section on the axial side;
[0033] Figure 5 It is a schematic structural diagram of the present invention when the shaft side is cut away.
[0034] In the figure: 1. back plate; 2. target material; 3. plug-in slot; 4. thermal conductive ring; 5. welding slot 1; 6. welding slot 2; 7. mounting slot; 8. fixing slot; 9. mounting ring; 10. cooling water channel; 11. tooth ring; 12. water hole 1; 13. water hole 2; 14. tooth groove; 15. bottom plate; 16. sealing bump. DETAILED DESCRIPTION
[0035] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0036] Reference Figure 1-Figure 5 A welding structure of a target back plate with a cooling water channel comprises a target 2, a back plate 1 is arranged on the lower side of the target 2, a heat dissipation connection part 1 is arranged on the upper side of the back plate 1, the heat dissipation connection part 1 comprises a plug-in slot 3, the plug-in slot 3 is arranged on the upper side of the back plate 1, a heat conduction ring 4 is inserted in the plug-in slot 3, a welding slot 1 5 is arranged on the upper side of the heat conduction ring 4 and close to the outer side of the target 2, welding slots 2 6 are arranged on the upper side of the plug-in slot 3 and on both sides of the heat conduction ring 4, and the cross section of the welding slot 1 5 and the welding slot 2 6 is arranged in a T-shaped structure.
[0037] A heat dissipation connection part 2 is provided on the lower side of the back plate 1. The heat dissipation connection part 2 includes a mounting groove 7. The mounting groove 7 is provided on the lower side of the back plate 1. A mounting ring 9 is inserted in the mounting groove 7. A plurality of fixing grooves 8 are provided on the lower side of the back plate 1. The fixing groove 8 is filled with sealing thermal grease. A cold water cooling channel 10 is inserted in the fixing groove 8. The cold water cooling channel 10 adopts a tungsten plate component. The cold water cooling channel 10 is connected to the mounting ring 9. Water holes 12 are provided on both sides of the cold water cooling channel 10. Water holes 2 13 are provided on both sides of the mounting ring 9. A tooth groove 14 is provided in the mounting groove 7. A tooth ring 11 is provided on the outer side of the mounting ring 9. A margin groove is provided between the tooth ring 11 and the tooth groove 14. A bottom plate 15 is provided on the lower side of the mounting ring 9. A sealing protrusion 16 is provided on the upper side of the bottom plate 15. The sealing protrusion 16 is threadedly connected to the mounting ring 9.
[0038] In this embodiment, the thermally conductive ring 4 is inserted into the plug-in groove 3, and then the solder is filled into the welding groove 6. Then, the thermally conductive ring 4 and the back plate 1 are welded. Then, the solder is directly filled into the welding groove 5 to weld the thermally conductive ring 4 and the target material 2. The mounting ring 9 is inserted into the mounting groove 7, and the cold water cooling channel 10 is inserted into the fixing groove 8. The tooth ring 11 is plugged into the tooth groove 14 to cooperate with the residual groove, and then the flux is filled. After being welded, the mounting ring 9 with the cold water cooling channel 10 forms an integrated structure with the back plate 1, and the bottom plate 15 cooperates with the sealing protrusion 16 to close the bottom of the mounting ring 9.
[0039] It should be noted that tungsten plate components are made of tungsten, a very special metal with extremely high hardness and excellent electrical and thermal conductivity. The melting point of tungsten is also very high, so it remains intact in high temperature environments.
[0040] A welding method for a welding structure of a target material back plate with a cooling water channel, the specific steps are as follows:
[0041] S1, bending and welding the heat conducting ring 4 according to the size of the target material 2;
[0042] S2, insert the heat-conducting ring 4 into the plug-in slot 3 on the back plate 1, then fill the solder into the second soldering slot 6, and solder the heat-conducting ring 4 to the back plate 1;
[0043] S3, the mounting ring 9 with the cooling water channel 10 is respectively inserted into the mounting groove 7 and the fixing groove 8, and then the residual groove is filled with flux, and the mounting ring 9 and the back plate 1 are welded;
[0044] S4, then placing the target material 2 in the heat-conducting ring 4, and then filling the solder in the welding groove 5, welding the target material 2 and the heat-conducting ring 4, so that the back plate 1 and the target material 2 are integrated;
[0045] S5. Finally, the bottom plate 15 with the sealing protrusion 16 is threadedly connected to the lower side of the mounting ring 9, so that the cold water cooling channel 10 in the mounting ring 9 is in a closed state.
[0046] In the above welding method, the diameter of the backing plate 1 is larger than the diameter of the target material 2, and the diameter difference is ±10 cm;
[0047] Before welding, the components need to be pretreated. The welding surface of the back plate 1 is degreased with an organic solvent, and then the welding surface is sandblasted for 5-20 minutes using an abrasive with an average particle size of 500-860μm under a pressure of 8-15kg. During the sandblasting, the distance between the sandblasting port and the welding surface is 50-230mm. The roughness of the welding surface after sandblasting is 6-12μm. After that, ultrasonic cleaning is performed for 8-19min and vacuum drying is performed at 60-90℃ for 0.5-2.3h.
[0048] The thermally conductive ring 4 is bent and welded according to the size of the target material 2, and the thermally conductive ring 4 is inserted into the plug-in slot 3 on the back plate 1, and then the solder is filled into the welding slot 6, and the thermally conductive ring 4 and the back plate 1 are welded. The mounting ring 9 with the cooling water channel 10 is respectively inserted into the mounting slot 7 and the fixing slot 8, and then the residual slot is filled with flux, and the mounting ring 9 and the back plate 1 are welded, thereby forming a target material back plate with a cooling water channel.
[0049] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A welding structure of a target back plate with a cooling water channel, comprising a target (2), characterized in that: A back plate (1) is arranged on the lower side of the target material (2), a heat dissipation connection part 1 which is easy to weld is arranged on the upper side of the back plate (1), and a heat dissipation connection part 2 which is easy to weld is arranged on the lower side of the back plate (1).
2. The welding structure of the target material back plate with cooling water channel according to claim 1, characterized in that: The heat dissipation connection part 1 comprises a plug-in slot (3), the plug-in slot (3) is arranged on the upper side of the back plate (1), a heat-conducting ring (4) is inserted into the plug-in slot (3), a welding slot 1 (5) is arranged on the upper side of the heat-conducting ring (4) and close to the outer side of the target material (2), and welding slots 2 (6) are arranged on the upper side of the plug-in slot (3) and on both sides of the heat-conducting ring (4).
3. The welding structure of the target back plate with cooling water channel according to claim 1, characterized in that: The second heat dissipation connection part comprises a mounting groove (7), the mounting groove (7) being arranged on the lower side of the back plate (1), a mounting ring (9) being inserted into the mounting groove (7), a plurality of fixing grooves (8) being arranged on the lower side of the back plate (1), a cold water cooling channel (10) being inserted into the fixing grooves (8), and the cold water cooling channel (10) being connected to the mounting ring (9).
4. The welding structure of the target back plate with cooling water channel according to claim 3, characterized in that: The fixing groove (8) is filled with sealing heat-conducting silicone grease.
5. The welding structure of the target back plate with cooling water channel according to claim 3, characterized in that: Water holes one (12) are provided on both sides of the cold water cooling channel (10), and water holes two (13) are provided on both sides of the mounting ring (9).
6. The welding structure of the target back plate with cooling water channel according to claim 1, characterized in that: A tooth groove (14) is provided in the installation groove (7), a tooth ring (11) is provided on the outer side of the installation ring (9), and a residual groove is provided between the tooth ring (11) and the tooth groove (14).
7. The welding structure of the target back plate with cooling water channel according to claim 3, characterized in that: A bottom plate (15) is arranged on the lower side of the mounting ring (9), a sealing convex block (16) is arranged on the upper side of the bottom plate (15), and the sealing convex block (16) is threadedly connected to the mounting ring (9).
8. A welding method for a welding structure of a target material back plate with a cooling water channel according to any one of claims 1 to 7, characterized in that: The specific steps are as follows S1, bending and welding the heat-conducting ring (4) according to the size of the target material (2); S2, inserting the heat-conducting ring (4) into the insertion slot (3) on the back plate (1), then filling solder into the second welding slot (6), and welding the heat-conducting ring (4) and the back plate (1); S3, the mounting ring (9) with the cooling water channel (10) is respectively inserted into the mounting groove (7) and the fixing groove (8), and then the residual groove is filled with flux, and the mounting ring (9) and the back plate (1) are welded; S4, the target material (2) is then placed in the heat-conducting ring (4), and then the solder is filled into the welding groove (5), and the target material (2) and the heat-conducting ring (4) are welded to form a whole with the back plate (1) and the target material (2); S5. Finally, the bottom plate (15) with the sealing protrusion (16) is threadedly connected to the lower side of the mounting ring (9), so that the cold water channel (10) in the mounting ring (9) is closed.
Citation Information
Patent Citations
Method for forming backboard and backboard
CN104588807A