Polishing equipment collision detection system and method, computer equipment, medium and product

Abstract

The invention relates to the technical field of chemical polishing, and discloses a polishing equipment collision detection system and method, computer equipment, a medium and a product, the polishing equipment collision detection system is applied to chemical mechanical polishing equipment, and the chemical mechanical polishing equipment comprises a polishing head and a grinding corrector. The system comprises a light source device, a collecting device, a processing device and a control device. The light source device is used for irradiating the polishing head and the grinding corrector. The collecting device is used for collecting a target image containing the polishing head and the grinding corrector and sending the target image to the processing device. The processing device is used for identifying position information between the polishing head and the grinding corrector in the target image, judging whether the position information meets a collision condition or not, and sending a control signal to the control device when the position information meets the collision condition; the control device is used for controlling the chemical mechanical polishing equipment to stop working based on the control signal. According to the invention, collision detection of the polishing head and the grinding corrector can be automatically carried out, and mechanical polishing equipment is protected.

Description

Technical Field

[0001] The present invention relates to the technical field of chemical polishing, and in particular to a polishing equipment collision detection system, method, computer equipment, medium and product. Background Art

[0002] In the CMP (Chemical Mechanical Polishing) process of semiconductor production, the wafer is transferred from the wafer box to the Polish module through the wafer transfer system. After the wafer transfer is completed, the processing module executes the set Recipe (processing menu).

[0003] During wafer processing, the Head (polishing head) and Pad Condition (grinding corrector) perform relative Sweep motion. Since the Sweep motion is a point-to-point motion, and since the positions of the two mechanical parts of the polishing head and the grinding corrector are different, the starting and ending points of the sweep motion of the polishing head and the grinding corrector are different. If the starting and ending points of the polishing head and the grinding corrector are not set properly, the two modules of the polishing head and the grinding corrector may collide, and the collision will not only damage the mechanical parts, but also the debris generated by the collision will scratch the wafers processed later.

[0004] The current CMP machine does not use a device to detect the distance between the polishing head and the grinding corrector. The distance between the two modules is mainly observed manually. If the starting and ending points of the polishing head and the grinding corrector are set unreasonably, or the configuration file is damaged, it is very easy to cause a collision between the polishing head and the grinding corrector, affecting the grinding process. Summary of the invention

[0005] In view of this, the present invention provides a polishing equipment collision detection system, method, computer equipment, medium and product, which automatically perform collision detection between a polishing head and a grinding corrector to protect mechanical polishing equipment.

[0006] In the first aspect, the present invention provides a polishing equipment collision detection system, which is applied to chemical mechanical polishing equipment, the chemical mechanical polishing equipment includes a polishing head and a grinding corrector, the system includes a light source device, a collection device, a processing device and a control device, the processing device is respectively connected to the collection device and the control device; the light source device is used to irradiate the polishing head and the grinding corrector; the collection device is used to collect a target image containing the polishing head and the grinding corrector, and send the target image to the processing device; the processing device is used to identify the position information between the polishing head and the grinding corrector in the target image, determine whether the position information meets the collision condition, and when the position information meets the collision condition, send a control signal to the control device; the control device is used to control the chemical mechanical polishing equipment to stop working based on the control signal.

[0007] In this implementation, by setting up an acquisition device that can illuminate the chemical mechanical polishing equipment through a light source device, it can provide demand support for image acquisition, so that the acquisition device can acquire high-quality, high-contrast images. The image is further identified by the processing device to determine the positional relationship between the polishing head and the grinding corrector, and whether a collision occurs is determined based on the positional relationship. Automatic collision identification can be achieved to protect the mechanical polishing equipment.

[0008] In an optional embodiment, the acquisition device includes a first acquisition device, which is mounted on a first side of the chemical mechanical polishing equipment, and the acquisition direction of the first acquisition device is perpendicular to the connection direction of the polishing head and the grinding corrector; the first acquisition device is used to acquire a first target image and send the first target image to a processing device; the processing device is used to identify the position information between the polishing head and the grinding corrector in the first target image.

[0009] In this implementation, by setting a collection device on one side of the chemical mechanical polishing equipment, and the collection direction is perpendicular to the connection direction of the polishing head and the grinding corrector, the collection range of the collection device can be increased, the positional relationship between the polishing head and the grinding corrector can be detected more comprehensively, and the detection accuracy can be improved.

[0010] In an optional embodiment, the acquisition device also includes a second acquisition device, which is mounted on a second side of the chemical mechanical polishing equipment relative to the second acquisition device; the second acquisition device is used to acquire the first target image and send the second target image to the processing device; the processing device is used to combine the first target image and the second target image to identify the position information between the polishing head and the grinding corrector.

[0011] In this implementation, by respectively arranging acquisition devices on both sides of the chemical mechanical polishing equipment, the position detection result can be verified, which can further improve the detection accuracy.

[0012] In an optional embodiment, the acquisition device includes a third acquisition device, which is mounted on the top of the chemical mechanical polishing equipment; the third acquisition device is used to acquire a third target image and send the third target image to the processing device; the processing device is used to identify the position information between the polishing head and the grinding corrector based on the third target image.

[0013] In this implementation, by arranging a collection device on the top of the chemical mechanical polishing equipment, detection errors caused by occlusion can be avoided, and detection accuracy can be further improved.

[0014] In an optional embodiment, the acquisition device includes a first acquisition device, a second acquisition device and a third acquisition device, wherein the processing device is used to perform binarization and filtering on the first target image, the second target image and the third target image to generate a first filtered image, a second filtered image and a third filtered image; based on the first filtered image and the second filtered image, it is obtained whether the image areas of the polishing head and the grinding corrector overlap; when the image areas of the polishing head and the grinding corrector overlap, the target distance between the polishing head and the grinding corrector in the third filtered image is identified; when it is identified that the target distance is less than a preset distance, a control signal is generated.

[0015] In this implementation, the binarization method is used to extract image features, which can improve image quality and accurately extract contour features. On this basis, the two side acquisition devices are first used for collision identification. When the two side acquisition devices cannot accurately identify the collision, the top acquisition device is further used for collision identification, which can quickly and accurately determine whether a collision occurs.

[0016] In the second aspect, the present invention provides a polishing equipment collision detection method, which is applied to the above-mentioned processing device. The polishing equipment collision detection method includes: receiving a target image, which is acquired by an acquisition device; identifying position information between a polishing head and a grinding corrector in the target image; judging whether the position information meets a collision condition, and sending a control signal to a control device when the position information meets the collision condition.

[0017] In an optional embodiment, the target image includes a first target image acquired by a first acquisition device, a second target image acquired by a second acquisition device, and a third target image acquired by a third acquisition device, and identifying the position information between the polishing head and the grinding corrector in the target image includes: binarizing and filtering the first target image, the second target image, and the third target image to generate a first filtered image, a second filtered image, and a third filtered image; obtaining whether the image areas of the polishing head and the grinding corrector overlap based on the first filtered image and the second filtered image; when the image areas of the polishing head and the grinding corrector overlap, identifying the target distance between the polishing head and the grinding corrector in the third filtered image; judging whether the position information satisfies a collision condition, and when the position information satisfies the collision condition, sending a control signal to the control device includes: identifying that when the target distance is less than a preset distance, a control signal is generated.

[0018] In a third aspect, the present invention provides a computer device comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, computer instructions being stored in the memory, and the processor executing the polishing equipment collision detection method of the first aspect or any corresponding embodiment thereof by executing the computer instructions.

[0019] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the polishing equipment collision detection method of the first aspect or any corresponding embodiment thereof.

[0020] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the polishing equipment collision detection method of the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a schematic diagram of a top view of a chemical mechanical polishing device according to an embodiment of the present invention;

[0023] Figure 2 is a schematic top view of another chemical mechanical polishing device according to an embodiment of the present invention;

[0024] Figure 3is a schematic top view of another chemical mechanical polishing device according to an embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of a top view of another chemical mechanical polishing device according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a target image according to an embodiment of the present invention;

[0027] Figure 6 Flow chart of a polishing equipment collision detection method according to an embodiment of the present invention

[0028] Figure 7 is a flow chart of another polishing equipment collision detection method according to an embodiment of the present invention;

[0029] Figure 8 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Furthermore, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0034] According to an embodiment of the present invention, a polishing equipment collision detection system is provided, which is applied to chemical mechanical polishing equipment. Figure 1 , Figure 1 1 is a schematic diagram of a top view of a chemical mechanical polishing device according to an embodiment of the present invention.

[0035] The chemical mechanical polishing device includes a polishing head 1 and a grinding corrector 2. The polishing head 1 and the grinding corrector 2 respectively perform a sweeping motion between a preset starting point and a preset end point on the polishing pad. Generally, the movement routes of the polishing head 1 and the grinding corrector 2 performing the sweeping motion may intersect, that is, the polishing head 1 and the grinding corrector 2 may collide.

[0036] In one implementation, the polishing pad is milky white, and the polishing head 1 and the grinding corrector 2 are silver.

[0037] Based on this, the present application proposes a polishing equipment collision detection system for performing collision detection on a polishing head 1 and a grinding corrector 2 during a machining process.

[0038] The polishing equipment collision detection system comprises a light source device, a collection device, a processing device and a control device, wherein the processing device is connected to the collection device and the control device respectively.

[0039] The light source device is used to illuminate the polishing head and the grinding corrector.

[0040] Specifically, the light source device is used to illuminate the area of ​​the acquisition device, providing clear acquisition conditions for the acquisition device, so that the acquisition device can acquire high-quality, high-contrast images.

[0041] In one implementation, the light source device is mounted on the side and / or top of the chemical mechanical polishing device.

[0042] The acquisition device is used to acquire a target image including the polishing head and the grinding corrector, and send the target image to the processing device.

[0043] Among them, the acquisition device can be a camera, a monocular camera, a binocular camera, or other equipment with image and video acquisition functions.

[0044] Exemplarily, the acquisition device is a CCD (Charge Coupled Device) camera, and the CCD camera is used to acquire motion images of the polishing head and the grinding corrector.

[0045] Specifically, the acquisition device performs image acquisition to obtain a target image when the polishing head and the grinding corrector perform a sweeping motion, or the acquisition device performs video acquisition to obtain a target video when the polishing head and the grinding corrector perform a sweeping motion, and performs image decomposition on the target video, decomposes the target video into multiple target images according to frames, and sends the target image to the processing device.

[0046] In one implementation, the acquisition device includes a first acquisition device, which is mounted on a first side of the chemical mechanical polishing device, and the acquisition direction of the first acquisition device is perpendicular to the connection direction of the polishing head and the grinding corrector. The first acquisition device is used to acquire a first target image, and the first target image is sent to the processing device.

[0047] See also Figure 2 , Figure 2 FIG. 2 is a schematic diagram of a top view of another chemical mechanical polishing device according to an embodiment of the present invention. Figure 2 As shown, the first acquisition device 3 is set up on the first side of the chemical mechanical polishing equipment, that is, at a 90-degree position of the chemical mechanical polishing equipment. Specifically, the midpoint position of the polishing head 1 when performing a sweeping motion according to a preset starting point and a preset end point is obtained, and the midpoint position of the grinding dresser 2 when performing a sweeping motion according to a preset starting point and a preset end point is obtained, and the connecting line of the two end points is used as the connecting direction of the polishing head 1 and the grinding corrector 2, and the first acquisition device 3 is set up on the first side of the chemical mechanical polishing equipment, so that the lens of the first acquisition device 3 is aligned with the polishing head 1 and the grinding corrector 2, and the lens direction is perpendicular to the connecting direction of the polishing head 1 and the grinding corrector 2.

[0048] In one implementation, the acquisition device includes a first acquisition device and a second acquisition device, the first acquisition device is mounted on the first side of the chemical mechanical polishing device, the second acquisition device is mounted on the second side of the chemical mechanical polishing device relative to the second acquisition device, the acquisition direction of the first acquisition device is perpendicular to the direction of the connection between the polishing head and the grinding corrector, and the acquisition direction of the second acquisition device is perpendicular to the direction of the connection between the polishing head and the grinding corrector. The first acquisition device is used to acquire the first target image, the second acquisition device is used to acquire the second target image, and the first target image and the second target image are sent to the processing device.

[0049] See also Figure 3 , Figure 3 FIG. 2 is a schematic diagram of a top view of another chemical mechanical polishing device according to an embodiment of the present invention. Figure 3As shown, the first acquisition device 3 is set up on the first side of the chemical mechanical polishing equipment, that is, at a 90-degree position of the chemical mechanical polishing equipment. The second acquisition device 4 is set up on the second side of the chemical mechanical polishing equipment, that is, at a 270-degree position of the chemical mechanical polishing equipment. Specifically, the midpoint position of the polishing head 1 when performing a sweeping motion according to a preset starting point and a preset end point is obtained, and the midpoint position of the grinding dresser 2 when performing a sweeping motion according to a preset starting point and a preset end point is obtained, and the connecting line of the two end points is used as the connecting direction of the polishing head 1 and the grinding corrector 2. The first acquisition device 3 is set up on the first side of the chemical mechanical polishing equipment, and the second acquisition device 4 is set up on the second side of the chemical mechanical polishing equipment, so that the lens of the first acquisition device 3 and the lens of the second acquisition device 4 are respectively aligned with the polishing head 1 and the grinding corrector 2, and the lens direction is perpendicular to the connecting direction of the polishing head 1 and the grinding corrector 2, and the lenses of the first acquisition device 3 and the second acquisition device 4 are opposite.

[0050] In one implementation, the acquisition device includes a third acquisition device. The third acquisition device is mounted on the top of the chemical mechanical polishing device. The third acquisition device is used to acquire a third target image and send the third target image to the processing device.

[0051] See also Figure 4 , Figure 4 FIG. 2 is a schematic diagram of a top view of another chemical mechanical polishing device according to an embodiment of the present invention. Figure 4 As shown, the third acquisition device 5 is mounted on the top of the chemical mechanical polishing device. The lens of the third acquisition device 5 is aimed at the polishing head 1 and the grinding corrector 2.

[0052] In one implementation, the acquisition device includes a first acquisition device, a second acquisition device, and a third acquisition device. The first acquisition device is mounted on the first side of the chemical mechanical polishing device, the second acquisition device is mounted on the second side of the chemical mechanical polishing device relative to the second acquisition device, the acquisition direction of the first acquisition device is perpendicular to the direction of the connection between the polishing head and the grinding corrector, the acquisition direction of the second acquisition device is perpendicular to the direction of the connection between the polishing head and the grinding corrector, and the third acquisition device is mounted on the top of the chemical mechanical polishing device. The first acquisition device is used to acquire the first target image, the second acquisition device is used to acquire the second target image, and the third acquisition device is used to acquire the third target image, and the first target image, the second target image, and the third target image are sent to the processing device.

[0053] In one implementation, the light source device and the collection device are installed together at the same position of the chemical mechanical polishing equipment.

[0054] The processing device is used to identify the position information between the polishing head and the grinding corrector in the target image, determine whether the position information meets the collision condition, and send a control signal to the control device when the position information meets the collision condition.

[0055] Specifically, the processing device performs image processing on the target image to obtain a filtered image. The image processing includes binarization processing and filtering processing. The shape, angle or area features of the polishing head and the grinding corrector are obtained from the filtered image, and the position information of the polishing head and the grinding corrector in the filtered image is determined. The position information includes position distance and position contact.

[0056] In one implementation, when the polishing head and the grinding corrector are in contact with each other in the filtered image, it is determined that a collision condition is satisfied between the polishing head and the grinding corrector, and a control signal is sent to the control device.

[0057] In another implementation, when the polishing head and the grinding corrector are located at the same position in the filtered image and the distance between them is less than a preset distance, it is determined that the collision condition between the polishing head and the grinding corrector is satisfied, and a control signal is sent to the control device.

[0058] The image processing operation includes: the processing device performs pixel binarization processing on the target image to generate a black and white image, performs filtering processing on the black and white image to remove image noise, obtain accurate contour features, and obtain a filtered image.

[0059] In one implementation, the processing device receives a first acquired image, processes the first acquired image to obtain a first filtered image, and identifies position information between the polishing head and the grinding corrector in the first filtered image.

[0060] Specifically, see Figure 5 , Figure 5 is a schematic diagram of a target image according to an embodiment of the present invention.

[0061] For example, see Figure 5 , when it is recognized that the polishing head and the grinding corrector in the first target image are far apart, that is, the position relationship is Figure 5 a, the determined polishing head and grinding corrector do not meet the collision condition. When the polishing head and grinding corrector in the first target image are identified to be in contact, that is, the position relationship is Figure 5 b, the determined polishing head and grinding corrector meet the collision condition and generate a control signal.

[0062] In one implementation, a processing device receives a first acquired image and a second acquired image at the same time, processes the first acquired image to obtain a first filtered image, processes the second acquired image to obtain a second filtered image, identifies position information between the polishing head and the grinding corrector in the first filtered image, and verifies the position information using the second filtered image.

[0063] For example, see Figure 5, when the position relationship between the polishing head and the grinding corrector in the first target image is identified as Figure 5 When a, the determined polishing head and grinding corrector do not meet the collision condition. When the position relationship between the polishing head and the grinding corrector in the first target image is identified as Figure 5 b, and the positional relationship between the polishing head and the grinding corrector in the second target image is identified as Figure 5 When a, the determined polishing head and grinding corrector do not meet the collision condition. When the position relationship between the polishing head and the grinding corrector in the first target image is identified as Figure 5 b, and the positional relationship between the polishing head and the grinding corrector in the second target image is identified as Figure 5 b, the determined polishing head and grinding corrector meet the collision condition and generate a control signal.

[0064] In one implementation, the processing device receives a third acquired image at the same time, processes the third acquired image to obtain a third filtered image, and identifies position information between the polishing head and the grinding corrector in the third filtered image.

[0065] For example, see Figure 5 , when it is recognized that the position relationship between the polishing head and the grinding corrector in the third acquired image is Figure 5 c, the determined polishing head and grinding corrector do not meet the collision condition. When the position relationship between the polishing head and the grinding corrector in the third target image is identified as Figure 5 At d, the determined polishing head and grinding corrector meet the collision condition and generate a control signal.

[0066] In one implementation, a processing device receives a first acquired image, a second acquired image, and a third acquired image at the same time, and processes the first acquired image to obtain a first filtered image, processes the second acquired image to obtain a second filtered image, processes the third acquired image to obtain a third filtered image, identifies the position information between the polishing head and the grinding corrector in the first target filter, and verifies the position information using the second target filter and the third filtered image.

[0067] For example, see Figure 5 , when the position relationship between the polishing head and the grinding corrector in the first target image is identified as Figure 5 b, and the positional relationship between the polishing head and the grinding corrector in the second target image is identified as Figure 5 When a, the determined polishing head and grinding corrector do not meet the collision condition. When the position relationship between the polishing head and the grinding corrector in the first target image is identified as Figure 5 b, and the positional relationship between the polishing head and the grinding corrector in the second target image is identified as Figure 5b, further identify the third target image, and identify that the position relationship between the polishing head and the grinding corrector in the third acquisition image is Figure 5 c, the determined polishing head and grinding corrector do not meet the collision condition. When the position relationship between the polishing head and the grinding corrector in the third target image is identified as Figure 5 At d, the determined polishing head and grinding corrector meet the collision condition and generate a control signal.

[0068] In one implementation, a processing device receives a first acquisition image, a second acquisition image, and a third acquisition image at the same time, performs binarization processing and filtering processing on the first target image, the second target image, and the third target image to generate a first filtered image, a second filtered image, and a third filtered image. Based on the first filtered image and the second filtered image, it is determined whether the image areas of the polishing head and the grinding corrector overlap; when the image areas of the polishing head and the grinding corrector overlap, the target distance between the polishing head and the grinding corrector in the third filtered image is identified, and when it is identified that the target distance is less than a preset distance, a control signal is generated.

[0069] It can be understood that when the polishing head and the grinding corrector are identified using the first acquired image and the second acquired image, there may be a misalignment between the polishing head and the grinding corrector, resulting in contact between the polishing head and the grinding corrector in the image, but the polishing head and the grinding corrector do not collide, that is, the polishing head and the grinding corrector are located far apart in the third acquired image.

[0070] The control device is used to control the chemical mechanical polishing equipment to stop working based on the control signal.

[0071] Furthermore, the control device performs fault processing and starts the chemical mechanical polishing equipment after the processing is completed.

[0072] Specifically, the preset starting point and the preset end point of the grinding head and / or the grinding corrector are adjusted to adjust the sweeping path of the grinding head and / or the grinding corrector.

[0073] In this implementation, by setting up an acquisition device that can illuminate the chemical mechanical polishing equipment through a light source device, it can provide demand support for image acquisition, so that the acquisition device can acquire high-quality, high-contrast images. The image is further identified by the processing device to determine the positional relationship between the polishing head and the grinding corrector, and whether a collision occurs is determined based on the positional relationship. Automatic collision identification can be achieved to protect the mechanical polishing equipment.

[0074] According to an embodiment of the present invention, an embodiment of a polishing equipment collision detection method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0075] In this embodiment, a polishing equipment collision detection method is provided, which can be used for the above-mentioned processing device. Figure 6 is a flow chart of a polishing equipment collision detection method according to an embodiment of the present invention. It should be noted that if there are substantially the same results, this embodiment does not use Figure 6 The process sequence shown is limited. Figure 6 As shown, the process includes the following steps:

[0076] Step S601, receiving a target image.

[0077] The target image is acquired by the acquisition device.

[0078] Step S602, identifying the position information between the polishing head and the grinding corrector in the target image.

[0079] Step S603, determining whether the position information satisfies a collision condition, and sending a control signal to the control device when the position information satisfies the collision condition.

[0080] For details, please see Figure 1-5 The illustrated embodiments will not be described in detail here.

[0081] In this embodiment, a polishing equipment collision detection method is provided, which can be used for the above-mentioned processing device. Figure 7 is a flow chart of another polishing equipment collision detection method according to an embodiment of the present invention. It should be noted that if there are substantially the same results, this embodiment does not use Figure 7 The process sequence shown is limited. Figure 7 As shown, the process includes the following steps:

[0082] Step S701, receiving a target image.

[0083] The target image is acquired by the acquisition device.

[0084] Step S702, identifying the position information between the polishing head and the grinding corrector in the target image.

[0085] Specifically, the above step S702 includes:

[0086] Step S7021, binarization and filtering are performed on the first target image, the second target image and the third target image to generate a first filtered image, a second filtered image and a third filtered image.

[0087] Step S7022: determining whether the image areas of the polishing head and the grinding corrector overlap based on the first filtered image and the second filtered image.

[0088] Step S7023, when the image areas of the polishing head and the grinding corrector overlap, the target distance between the polishing head and the grinding corrector in the third filtered image is identified.

[0089] Step S703, determining whether the position information satisfies a collision condition, and sending a control signal to the control device when the position information satisfies the collision condition.

[0090] When the target distance is less than the preset distance, a control signal is generated.

[0091] For details, please see Figure 1-5 The illustrated embodiments will not be described in detail here.

[0092] The processing device in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0093] An embodiment of the present invention further provides a computer device having the above-mentioned processing device.

[0094] See also Figure 8 , Figure 8 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Figure 8 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 8 A processor 10 is taken as an example.

[0095] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0096] The memory 20 stores instructions executable by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0097] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0098] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0099] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Figure 8 The example of connecting through bus is taken in the following.

[0100] The input device 30 can receive input digital or character information, and generate key signal input related to the user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device can be a touch screen.

[0101] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0102] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0103] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A polishing equipment collision detection system, characterized in that: The system is applied to a chemical mechanical polishing device, the chemical mechanical polishing device comprises a polishing head and a grinding corrector, the system comprises a light source device, a collection device, a processing device and a control device, the processing device is respectively connected to the collection device and the control device; The light source device is used to illuminate the polishing head and the grinding corrector; The acquisition device is used to acquire a target image including the polishing head and the grinding corrector, and send the target image to the processing device; The processing device is used to identify the position information between the polishing head and the grinding corrector in the target image, determine whether the position information meets the collision condition, and send a control signal to the control device when the position information meets the collision condition; The control device is used for controlling the chemical mechanical polishing equipment to stop working based on the control signal.

2. The polishing equipment collision detection system according to claim 1, characterized in that: The collecting device comprises a first collecting device, the first collecting device is mounted on a first side of the chemical mechanical polishing device, and the collecting direction of the first collecting device is perpendicular to the connecting direction of the polishing head and the grinding corrector; The first acquisition device is used to acquire a first target image and send the first target image to the processing device; The processing device is used to identify the position information between the polishing head and the grinding corrector in the first target image.

3. The polishing equipment collision detection system according to claim 2, characterized in that: The collecting device further comprises a second collecting device, and the second collecting device is mounted on a second side of the chemical mechanical polishing device relative to the second collecting device; The second acquisition device is used to acquire a second target image and send the second target image to the processing device; The processing device is used to identify the position information between the polishing head and the grinding corrector in combination with the first target image and the second target image.

4. The polishing equipment collision detection system according to claim 3, characterized in that: The collecting device comprises a third collecting device, and the third collecting device is mounted on the top of the chemical mechanical polishing equipment; The third acquisition device is used to acquire a third target image and send the third target image to the processing device; The processing device is used to identify position information between the polishing head and the grinding corrector based on the third target image.

5. The polishing equipment collision detection system according to claim 4, characterized in that: The acquisition device includes the first acquisition device, the second acquisition device and the third acquisition device, wherein: The processing device is used to perform binarization processing and filtering processing on the first target image, the second target image and the third target image to generate a first filtered image, a second filtered image and a third filtered image; Acquiring whether image areas of the polishing head and the grinding corrector overlap based on the first filtered image and the second filtered image; If the image areas of the polishing head and the grinding corrector overlap, identifying the target distance between the polishing head and the grinding corrector in the third filtered image; When the target distance is less than a preset distance, a control signal is generated.

6. A polishing equipment collision detection method, characterized in that: Applied to the processing device of claim 5, the method comprises: receiving a target image, wherein the target image is acquired by the acquisition device; identifying position information between the polishing head and the grinding corrector in the target image; It is determined whether the position information satisfies a collision condition, and when the position information satisfies the collision condition, a control signal is sent to the control device.

7. The polishing equipment collision detection method according to claim 6, characterized in that: The target image includes a first target image acquired by a first acquisition device, a second target image acquired by a second acquisition device, and a third target image acquired by a third acquisition device, and the identifying of the position information between the polishing head and the grinding corrector in the target image includes: Performing binarization and filtering processing on the first target image, the second target image, and the third target image to generate a first filtered image, a second filtered image, and a third filtered image; Acquiring whether image areas of the polishing head and the grinding corrector overlap based on the first filtered image and the second filtered image; If the image areas of the polishing head and the grinding corrector overlap, identifying the target distance between the polishing head and the grinding corrector in the third filtered image; The determining whether the position information satisfies a collision condition, and when the position information satisfies the collision condition, sending a control signal to the control device comprises: When the target distance is less than a preset distance, a control signal is generated.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the polishing equipment collision detection method according to any one of claims 6 to 7 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the polishing equipment collision detection method according to any one of claims 6 to 7.

10. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the polishing equipment collision detection method according to any one of claims 6 to 7.

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