Cutting assembly, cutting method and cutting device

Abstract

The invention provides a cutting assembly, a cutting method and a cutting device. The cutting assembly, the cutting method and the cutting device solve the problem that in the prior art, adhesive pulling is prone to occurring when adhesive products are cut. The cutting assembly comprises a carrier, and the interior of the carrier comprises a containing cavity; the cutting part is located on at least part of the peripheral side of the carrier, an opening is formed in the cutting part, and the opening communicates with the containing cavity; the driving part comprises a sliding unit, the sliding unit is located in the containing cavity, in the working state, liquid is arranged in the containing cavity, and the sliding unit extrudes the liquid and conveys the liquid to the opening. In the working state, after the sliding unit extrudes liquid and conveys the liquid to the opening, the liquid infiltrates the cutting part, the liquid has a certain lubricating effect, when the to-be-cut material is cut, the cutting part can smoothly cut the to-be-cut material, the adhesion phenomenon is avoided, a notch of the cut to-be-cut material is smooth, and the cutting efficiency of the to-be-cut material is improved. And the problem of glue pulling is almost avoided.

Description

Technical Field

[0001] The present application relates to the technical field of automation equipment, and in particular to a cutting assembly, a cutting method and a cutting device. Background Art

[0002] In recent years, adhesive products have been widely used in optoelectronics, communications, computers, automobiles and other industries to provide shockproof, insulation, dustproof, conductive, adhesive, shielding and other functions. Adhesive products are generally cut into specific shapes according to demand. However, due to the limitations of related technologies, adhesive products are prone to defects such as glue pulling during the cutting process, which cannot meet the needs well. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a cutting assembly, a cutting method and a cutting device, which solve the problem of adhesive pulling when cutting adhesive products in the prior art.

[0004] A first aspect of the present application provides a cutting assembly, comprising:

[0005] A carrier, wherein the interior of the carrier includes a receiving cavity;

[0006] A cutting portion is located at least partially around the carrier, and the cutting portion is provided with an opening, which is connected to the accommodating cavity;

[0007] The driving part includes a sliding unit, which is located in the accommodating cavity. In a working state, liquid is arranged in the accommodating cavity, and the sliding unit squeezes the liquid and transports the liquid to the opening.

[0008] In one embodiment, the shape of the carrier includes a cylindrical shape;

[0009] Preferably, the cutout portion is located on at least part of the circumference of the cylinder;

[0010] Preferably, the cutting portion comprises a blade, and the blade is provided with an opening;

[0011] Preferably, the carrier includes a first carrier, the cutting portion includes a first cutting sub-portion and a second cutting sub-portion located on the circumferential side of the first carrier, the first cutting sub-portions are arranged at intervals along the circumferential direction of the first carrier, and the second cutting sub-portion is located between adjacent first cutting sub-portions;

[0012] Preferably, along the circumferential direction of the first carrier, there are two second cutting sub-portions arranged at intervals between adjacent first cutting sub-portions, and the second cutting sub-portions extend along the axial direction of the first carrier;

[0013] Preferably, the shape of the first cutting sub-portion comprises a closed figure;

[0014] Preferably, the shape of the orthographic projection of the first cutting sub-portion on the first carrier comprises a rectangle;

[0015] Preferably, the shape of the second cutting sub-portion comprises a line segment;

[0016] Preferably, the height of the first cutting sub-portion protruding from the first carrier is less than the height of the second cutting sub-portion protruding from the first carrier;

[0017] Preferably, the carrier includes a second carrier, and the cutting portion includes a third cutting sub-portion located at a peripheral side of the second carrier;

[0018] Preferably, the shape of the third cutting sub-portion comprises a closed figure;

[0019] Preferably, the shape of the orthographic projection of the third cutting sub-portion on the second carrier comprises a rectangle;

[0020] Preferably, the height of the third cutting sub-portion protruding from the second carrier is greater than the height of the second cutting sub-portion protruding from the first carrier;

[0021] Preferably, along the axial direction of the second carrier, the width of the third cutting sub-portion is the first width; along the axial direction of the first carrier, the width of the first cutting sub-portion is the second width, and the first width is greater than the second width;

[0022] Preferably, along the circumference of the second carrier, the width of the third cutting sub-portion is a third width, along the circumference of the first carrier, the spacing between two second cutting sub-portions adjacent to the same first cutting sub-portion is a fourth width, and the third width is equal to the fourth width;

[0023] Preferably, the material of the cutout comprises steel.

[0024] In one embodiment, the size of the opening is greater than or equal to 1 micron and less than or equal to 2 microns;

[0025] Preferably, the size of the accommodating cavity is greater than or equal to 4 cm and less than or equal to 6 cm;

[0026] Preferably, the outer perimeter of the carrier is greater than or equal to 210 cm and less than or equal to 290 cm.

[0027] In one embodiment, it further comprises: a liquid flow channel located between the opening and the accommodating cavity;

[0028] Preferably, the sliding unit comprises a piston;

[0029] Preferably, the driving part is a cylinder.

[0030] In one embodiment, the system further comprises: bearings, wherein the bearings are located on opposite sides of the carrier in the axial direction of the carrier;

[0031] Preferably, it further comprises: a transmission wheel, which is located on at least one side of the carrier in the axial direction of the carrier, and the bearing passes through the transmission wheel.

[0032] In one embodiment, the cutting assembly further comprises a liquid inlet hole, which is located in the carrier, and the liquid inlet hole is connected to the accommodating cavity;

[0033] Preferably, the liquid comprises a release agent;

[0034] Preferably, the release agent comprises silicone oil.

[0035] A second aspect of the present application provides a cutting method, comprising:

[0036] S1. Adding liquid into the receiving cavity of the carrier;

[0037] S2, causing the sliding unit in the driving part to squeeze the liquid and transport the liquid to the opening of the cutting part; the cutting part is located at least partially around the carrier;

[0038] S3, using the cutting unit to cut the material to be cut.

[0039] In one embodiment, causing the sliding unit in the driving part to squeeze the liquid and deliver the liquid to the opening of the cutting part comprises:

[0040] The sliding unit squeezes the liquid to push a predetermined amount of the liquid to the opening of the cutting portion;

[0041] Preferably, pushing a predetermined amount of liquid to the opening of the cutting portion comprises:

[0042] Pushing a predetermined amount of liquid to the opening of the cutting portion within a predetermined time;

[0043] Preferably, the predetermined time is 1 minute to 2 minutes.

[0044] In one embodiment, cutting the material to be cut by using the cutting unit includes:

[0045] After a predetermined amount of the material to be cut is cut by the cutting unit, steps S1 to S3 are repeated;

[0046] Preferably, the material to be cut includes optical adhesive.

[0047] A third aspect of the present application provides a cutting device, including the above-mentioned cutting assembly, or the cutting device uses the above-mentioned cutting method to cut the material to be cut.

[0048] According to the cutting component provided in the embodiment of the present application, in the working state, after the sliding unit squeezes the liquid and transports the liquid to the opening, the liquid will infiltrate the cutting part. The liquid has a certain lubricating effect. When cutting the material to be cut, the cutting part can cut the material to be cut relatively smoothly without adhesion, and the cut of the material to be cut after cutting is relatively smooth, and there is almost no problem of glue pulling. At the same time, the position of the sliding unit can be adjusted so that the liquid can be transported to the opening as needed and then the cutting part can be infiltrated, so that the cutting part can remain lubricated for a longer period of time. In addition, the liquid in the accommodating chamber can be replenished according to actual conditions, which is beneficial to improving the life of the cutting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 This is a schematic diagram of the structure of a cutting component in one embodiment of the present application.

[0050] Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure of the cutting component along the AA' direction.

[0051] Figure 3 for Figure 1 A schematic diagram of a cross-sectional structure of a cutting portion of a cutting assembly along the BB' direction.

[0052] Figure 4 This is a front view of a cutting component in one embodiment of the present application.

[0053] Figure 5 for Figure 4 A schematic diagram of a local enlarged structure of the cutting component at position a.

[0054] Figure 6 This is a front view of a cutting component in another embodiment of the present application.

[0055] Figure 7 This is a schematic diagram of the structure after the cutting component cuts the material to be cut in one embodiment of the present application.

[0056] Figure 8 for Figure 7 A schematic cross-sectional structure diagram of the structure along the CC' direction after the middle cutting component cuts the material to be cut.

[0057] Fig. 9 This is a schematic diagram of the structure after the cutting assembly cuts the material to be cut in another embodiment of the present application.

[0058] Fig.10 for Fig. 9 A schematic cross-sectional structure diagram of the structure along the DD' direction after the middle cutting component cuts the material to be cut.

[0059] Fig.11 This is a schematic diagram of the cutting method flow in one embodiment of the present application. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0061] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0062] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0063] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0064] In the prior art, when cutting optical adhesive (OCA) using a cutting assembly, in order to prevent the cutting part from sticking to the OCA colloid during the cutting process, resulting in adhesive pulling and causing product defects, the following two solutions are generally used:

[0065] 1. Apply a silicone coating on the surface of the cutting blade; 2. Apply a Teflon coating on the surface of the cutting blade; Both of these solutions are to set a coating structure on the surface of the blade, and friction will be generated when the blade contacts the OCA colloid during cutting. Due to friction, after a certain number of cutting times, the coating on the surface of the blade will be worn or completely worn off, causing the worn coating or the blade to directly contact the OCA colloid and adhere to the OCA colloid, resulting in the problem of glue pulling, and the wear of the coating will reduce the life of the cutting component.

[0066] In view of this, the first aspect of the present application provides a cutting component, referring to Figure 1 The structural diagram of the cutting assembly shown, and Figure 2 and Figure 3 The cross-sectional structural diagram of the cutting assembly shown in the figure includes: a carrier 100 , a cutting part 200 and a driving part 300 .

[0067] Among them, the interior of the carrier 100 includes a accommodating cavity 110; the cutting portion 200 is located on at least part of the circumference of the carrier 100, and the cutting portion 200 is provided with an opening 210, which is connected to the accommodating cavity 110; the driving portion 300 includes a sliding unit 310, and the sliding unit 310 is located in the accommodating cavity 110. In the working state, liquid is provided in the accommodating cavity 110, and the sliding unit 310 squeezes the liquid and transports the liquid to the opening 210.

[0068] According to the cutting component provided in the embodiment of the present application, in the working state, after the sliding unit 310 squeezes the liquid and transports the liquid to the opening 210, the liquid will infiltrate the cutting part 200. The liquid has a certain lubricating effect. When cutting the material to be cut, the cutting part 200 can cut the material to be cut relatively smoothly without adhesion, and the cut of the material to be cut after cutting is relatively smooth, and there is almost no problem of glue pulling. At the same time, the position of the sliding unit 310 can be adjusted so that the liquid can be transported to the opening 210 as needed, thereby making the cutting part infiltrated, so that the cutting part 200 can maintain a lubricated state for a long time. In addition, the liquid in the accommodating cavity 110 can be replenished according to actual conditions, which is beneficial to improving the life of the cutting component.

[0069] In one embodiment, the shape of the carrier 100 includes a cylindrical shape. Figure 1 The cutting part 200 is located at least partially around the cylindrical body. Thus, the carrier 100 can roll, and the cutting part 200 is arranged at least partially around the cylindrical carrier 100. The carrier 100 can continuously cut the material to be cut during the rolling process, thereby improving work efficiency.

[0070] In one embodiment, the outer perimeter of the carrier 100 is greater than or equal to 210 cm and less than or equal to 290 cm, for example, it can be 210 cm, 220 cm, 230 cm, 240 cm, 250 cm, 260 cm, 270 cm, 280 cm or 290 cm, etc. Therefore, more cutting parts 200 can be provided on the outer perimeter of the carrier 100, which is conducive to improving work efficiency.

[0071] Optionally, in the same cutting assembly, when multiple cutting parts 200 are arranged on the peripheral side of the carrier 100, the structures or shapes of the multiple cutting parts 200 may be the same or different. For example, in the same cutting assembly, the structures or shapes of the multiple cutting parts 200 are the same, which is conducive to the continuous cutting of the material to be cut.

[0072] Optionally, in different cutting assemblies, the cutting portions 200 on the outer periphery of different carriers 100 may be the same or different. For example, in different cutting assemblies, the cutting portions 200 on the outer periphery of different carriers 100 are different, and different cutting assemblies can be used to complete the cutting of the material to be cut.

[0073] In one embodiment, referring to Figure 4 In the structural schematic diagram of the cutting assembly shown, the carrier 100 includes a first carrier 120 , and the cutting portion 200 includes a first cutting sub-portion 201 and a second cutting sub-portion 202 located on the periphery of the first carrier 120 .

[0074] Exemplarily, along the circumference of the first carrier 120 , the first cutting sub-portions 201 are arranged at intervals. Exemplarily, a plurality of first cutting sub-portions 201 are arranged at intervals along the axial direction of the first carrier 120 .

[0075] Optionally, the shape of the first cutting sub-portion 201 includes a closed figure; for example, the shape of the orthographic projection of the first cutting sub-portion 201 on the first carrier includes a rectangle.

[0076] Exemplarily, along the circumference of the first carrier 120, the second cutting sub-portions 202 are located between adjacent first cutting sub-portions 201. For example, along the circumference of the first carrier 120, there are two second cutting sub-portions 202 arranged at intervals between adjacent first cutting sub-portions 201, and the second cutting sub-portions 202 extend along the axial direction of the first carrier 120.

[0077] For example, refer to Figure 5 The first cutting sub-portion 201 and the second cutting sub-portion 202 are arranged at an interval.

[0078] Optionally, the shape of the second cutting sub-portion 202 includes a line segment.

[0079] Exemplarily, a height of the first cutting sub-portion 201 protruding from the first carrier 120 is smaller than a height of the second cutting sub-portion 202 protruding from the first carrier 120 .

[0080] In another embodiment, referring to Figure 6 The carrier 100 includes a second carrier 130 , and the cutting portion 200 includes a third cutting sub-portion 203 located at a peripheral side of the second carrier 130 . For example, a plurality of third cutting sub-portions 203 are arranged at intervals along the peripheral side of the second carrier 130 .

[0081] Optionally, the shape of the third cutting sub-portion 203 includes a closed figure; for example, the shape of the orthographic projection of the third cutting sub-portion 203 on the second carrier 130 includes a rectangle.

[0082] Exemplarily, the height of the third cutting sub-section 203 protruding from the second carrier 130 is greater than the height of the second cutting sub-section 202 protruding from the first carrier 120; along the axial direction of the second carrier 130, the width of the third cutting sub-section 203 is the first width W1; along the axial direction of the first carrier 120, the width of the first cutting sub-section 201 is the second width W2, and the first width W1 is greater than the second width W2; Exemplarily, along the circumference of the second carrier 130, the width of the third cutting sub-section 203 is the third width W3, and along the circumference of the first carrier 120, the spacing between two second cutting sub-sections 202 adjacent to the same first cutting sub-section 201 is the fourth width W4, and the third width W3 is equal to the fourth width W4. Therefore, the first cutting sub-section 201, the second cutting sub-section 202 and the third cutting sub-section 203 cooperate with each other, which is conducive to the continuous cutting of the material to be cut.

[0083] In one embodiment, referring to Figure 3 , the cutting part 200 includes a blade 204. It can be understood that the blade 204 refers to a position where the material to be cut can be effectively cut, that is, the material to be cut produces an incision after being cut at the blade 204. Exemplarily, the blade 204 is provided with an opening 210. Thus, after the liquid is transported to the opening 210, it flows out from the opening 210 and then infiltrates the blade 204. During cutting, the surface of the blade 204 is in a lubricated state, and the cutting part 200 can cut the material to be cut relatively smoothly without adhesion, and the incision of the material to be cut after cutting is relatively smooth, and there is almost no problem of glue pulling.

[0084] For example, refer to Figure 7 and Fig. 9 The material to be cut includes an optical adhesive layer 10. During the cutting process, two opposite surfaces of the optical adhesive need to be covered with release films, for example, a light release film 30 is covered on one surface of the optical adhesive, and a heavy release film 20 is covered on the other surface of the optical adhesive. Figure 7 and Figure 8In the cutting process, the heavy release film 20 is first arranged on the surface of the optical adhesive layer 10, and the optical adhesive layer 10 and the heavy release film 20 are cut using a cutting assembly. The optical adhesive layer 10 is located on the side of the heavy release film 20 close to the cutting assembly. At this time, the first cutting sub-section 201 is used to cut the optical adhesive layer 10 to obtain a first incision 11, and the second cutting sub-section 202 is used to cut the heavy release film 20 to obtain a second incision 21; the cutting thickness of the second cutting sub-section 202 is The sum of the thicknesses of the optical adhesive layer 10 and the heavy release film 20, the cutting thickness of the first cutting sub-section 201 is the thickness of the optical adhesive layer 10; the second incision 21 penetrates the optical adhesive layer 10 and the heavy release film 20, the first incision 11 penetrates the optical adhesive layer 10, that is, the first cutting sub-section 201 only cuts the optical adhesive layer 10, and the second cutting sub-section 202 cuts the optical adhesive layer 10 and the heavy release film 20 (specifically, the structural schematic diagram of the optical adhesive layer 10 and the heavy release film 20 after cutting is referred to Figure 7 and Figure 8 ); then, a light release film 30 is attached to the surface of the optical adhesive layer 10 away from the heavy release film 20, and the light release film 30 is located on the side of the optical adhesive layer 10 close to the cutting component. At this time, the light release film 30, the optical adhesive layer 10 and the heavy release film 20 are cut by the third cutting sub-unit 203 to obtain a third incision 31, and the third incision 31 passes through the light release film 30, the optical adhesive layer 10 and the heavy release film 20 (specifically, the structural schematic diagram of the light release film 30, the optical adhesive layer 10 and the heavy release film 20 after cutting is shown in FIG. Fig. 9 and Fig.10 ), when the third cutting sub-unit 203 cuts the heavy release film 20, part of the cutting position coincides with the position where the second cutting sub-unit 202 cuts the heavy release film 20. It can be understood that the first cutting sub-unit 201 and the second cutting sub-unit 202 are on the first carrier 120, and the third cutting sub-unit 203 is on the second carrier 130, and two cutting assemblies are used to complete the above cutting. After the cutting is completed, the obtained product includes the light release film 30, the optical adhesive layer 10 and the heavy release film 20 stacked in sequence.

[0085] Understandably, Fig. 9 In the figure, the optical adhesive layer 10 cannot be directly shown in the top view, and the dotted lines are used to represent the optical adhesive layer 10 and the first cutout 11, which should not be construed as a limitation to the present application.

[0086] Exemplarily, the material to be cut includes optical glue, which is used for bonding film layers in a display device. Exemplarily, the display device includes an array substrate, a light-emitting device, a touch panel and a cover plate stacked in sequence, and the film layer of the touch panel close to the cover plate is bonded to the cover plate through optical glue.

[0087] For example, the material to be cut includes optical glue, which is used to adhere the film layer of the touch panel close to the cover plate to the cover plate. The shape of the product obtained after the first cutting sub-unit 201 cuts the material to be cut matches the shape of the cover plate. For details, refer to Figure 7 or Fig. 9 shape of the optical adhesive layer 10. Exemplarily, the first cutting sub-unit 201 and the second cutting sub-unit 202 are on the first carrier 120, and the third cutting sub-unit 203 is on the second carrier 130. The two cutting components cooperate with each other to complete the cutting of the optical adhesive, and the obtained material includes the stacked light release film 30, the optical adhesive layer 10 and the heavy release film 20. The stacked light release film 30 and the heavy release film 20 can effectively protect the optical adhesive layer 10 and improve the product yield.

[0088] Exemplarily, the material of the cutting portion 200 includes steel, so that the material has appropriate hardness and excellent cutting effect.

[0089] In one embodiment, the size of the opening 210 is greater than or equal to 1 micron and less than or equal to 2 microns, for example, 1 micron, 1.2 microns, 1.4 microns, 1.6 microns, 1.8 microns or 2 microns, etc. Thus, when the sliding unit 310 squeezes the liquid and delivers the liquid to the opening 210, the size of the opening 210 is convenient for the liquid to flow out, and when the sliding unit 310 does not squeeze the liquid, the liquid will hardly flow out of the opening, which is beneficial to prolonging the service life of the cutting component.

[0090] It should be noted that the size of the opening 210 refers to the maximum distance between any two points in the opening 210 .

[0091] In one embodiment, the size of the accommodating cavity 110 is greater than or equal to 4 cm and less than or equal to 6 cm, for example, it can be 4 μm, 4.5 μm, 5 μm, 5.5 μm or 6 μm. It should be noted that the size of the accommodating cavity 110 refers to the cross-sectional size of the accommodating cavity 110, that is, the maximum distance between any two points in the cross-sectional area of ​​the accommodating cavity 110, and the length of the accommodating cavity 110 can be flexibly selected according to actual conditions. When the size of the accommodating cavity 110 is greater than or equal to 4 cm and less than or equal to 6 cm, it is beneficial to control the sliding unit 310 to squeeze the liquid and transport a suitable amount of liquid to the opening 210, which is beneficial to extend the service life of the cutting component; at the same time, the size of the accommodating cavity 110 is greatly different from the size of the opening 210. When the sliding unit 310 squeezes the liquid and transports the liquid to the opening 210, the liquid flows out of the opening 210, and when the sliding unit 310 does not squeeze the liquid, the liquid hardly flows out of the opening 210.

[0092] In one embodiment, referring to Figure 2The cutting assembly further includes: a liquid flow channel 400, which is located between the opening 210 and the accommodating chamber 110. The sliding unit 310 squeezes the liquid and delivers the liquid to the liquid flow channel 400, and the liquid is delivered to the opening 210 after passing through the liquid flow channel 400. In one embodiment, the size of the accommodating chamber 110 is greatly different from the size of the liquid flow channel 400. When the sliding unit 310 squeezes the liquid and delivers the liquid to the opening 210, the liquid flows out of the opening 210. When the sliding unit 310 does not squeeze the liquid, the liquid hardly flows out of the opening 210.

[0093] In one embodiment, the sliding unit 310 includes a piston, so that the piston can slide in the accommodating chamber 110 and has an excellent sealing effect.

[0094] In one embodiment, the driving part 300 is a cylinder. Therefore, it is convenient to realize automatic control of the piston in the cylinder, and the piston can be controlled to squeeze the liquid more accurately and deliver a predetermined amount of liquid to the opening 210. For example, the piston can be controlled to move 1 mm to 2 mm in the direction toward the liquid flow channel 400 to deliver a predetermined amount of liquid to the opening 210.

[0095] Exemplarily, the arrangement of the cylinder is not particularly limited, as long as the sliding unit 310 in the cylinder is located in the accommodating chamber 110 , the sliding unit 310 can slide in the accommodating chamber 110 and squeeze the liquid to transport the liquid to the opening 210 .

[0096] In one embodiment, referring to Figure 1 The cutting assembly further includes: bearings 500, which are located on opposite sides of the carrier 100 in the axial direction of the carrier 100. Thus, the carrier 100 can be fixed by the bearings 500, which is conducive to the rotation of the carrier 100. Exemplarily, the bearings 500 are placed in the circular groove or through hole to facilitate the rotation of the carrier 100.

[0097] In one embodiment, referring to Figure 4 The cutting assembly further includes: a transmission wheel 600, which is located on at least one side of the carrier 100 in the axial direction of the carrier 100, and the bearing 500 passes through the transmission wheel 600. Thus, the carrier 100 can be driven to rotate by the rotation of the transmission wheel, so as to realize the continuous operation of the cutting assembly. Exemplarily, the transmission wheel 600 includes a gear.

[0098] It is understandable that the method of adding liquid to the receiving cavity of the carrier includes but is not limited to adding liquid to the receiving cavity after the sliding unit is taken out; a liquid inlet hole can also be opened on the surface of the carrier, the liquid inlet hole is connected to the receiving cavity, and the liquid is injected into the receiving cavity through the liquid inlet hole.

[0099] In one embodiment, referring to Figure 1The cutting assembly further includes a liquid inlet 700, which is located in the carrier 100, and the liquid inlet 700 is connected to the receiving chamber 110. Therefore, it is convenient to add liquid to the receiving chamber 110 through the liquid inlet 700.

[0100] Illustratively, when there is no need to add liquid, the liquid inlet hole 700 is in a sealed state, for example, it can be sealed with a rubber plug; when it is necessary to add liquid, the sealing state of the liquid inlet hole 700 is released, and liquid is added to the accommodating chamber 110 through the liquid inlet hole 700.

[0101] In one embodiment, the liquid includes a release agent. Therefore, the release agent has a high degree of lubricity, which helps to avoid the problem of glue pulling caused by excessive friction between the cutting component and the material to be cut during cutting, thereby improving the cutting yield.

[0102] In one embodiment, the release agent includes silicone oil. Therefore, silicone oil has high lubricity and a wide range of sources; it helps avoid the problem of glue pulling caused by excessive friction between the cutting component and the material to be cut during cutting, thereby improving the cutting yield.

[0103] The second aspect of the present application provides a cutting method, referring to Fig.11 The cutting method shown includes the following steps.

[0104] S1. Add liquid into the containing cavity of the carrier.

[0105] It should be noted that the carrier, the containing cavity and the liquid are consistent with the previous description and will not be elaborated here.

[0106] It is understandable that the method of adding liquid to the receiving cavity of the carrier includes but is not limited to adding liquid to the receiving cavity after the sliding unit is taken out; a liquid inlet hole can also be opened on the surface of the carrier, the liquid inlet hole is connected to the receiving cavity, and the liquid is injected into the receiving cavity through the liquid inlet hole.

[0107] S2, causing the sliding unit in the driving part to squeeze the liquid and transport the liquid to the opening of the cutting part.

[0108] It should be noted that the cutting portion is located at least partially around the carrier.

[0109] It should be noted that the driving part, the sliding unit and the cutting part are consistent with the above description and will not be described in detail here.

[0110] In one embodiment, causing the sliding unit in the driving portion to squeeze the liquid and deliver the liquid to the opening of the cutting portion includes: causing the sliding unit to squeeze the liquid and push a predetermined amount of the liquid to be delivered to the opening of the cutting portion.

[0111] It is understandable that the driving part can be a cylinder, which controls the gas in the cylinder to push the sliding unit to squeeze the liquid, thereby delivering the liquid to the opening. It should be noted that the working principle of the cylinder is the working principle of the cylinder in the prior art, which is not an improvement of the present application and will not be described in detail here.

[0112] In one embodiment, pushing a predetermined amount of liquid to the opening of the cutting portion includes: pushing a predetermined amount of liquid to the opening of the cutting portion within a predetermined time.

[0113] Exemplarily, the cutting assembly further comprises a liquid flow channel located between the opening and the accommodating chamber. Exemplarily, the piston can be controlled to move 1 mm to 2 mm in a direction toward the liquid flow channel to deliver a predetermined amount of liquid to the opening.

[0114] In one embodiment, the predetermined time is 1 to 2 minutes, for example, 1 minute, 1.5 minutes or 2 minutes, etc. Thus, the piston can be controlled more accurately to squeeze the liquid and deliver a predetermined amount of liquid to the opening.

[0115] S3, using the cutting unit to cut the material to be cut.

[0116] It should be noted that the material to be cut is consistent with the previous description and will not be described in detail here.

[0117] In one embodiment, cutting the material to be cut using the cutting part includes: after cutting a predetermined amount of the material to be cut using the cutting part, repeating steps S1 to S3. It is understandable that during the cutting process, the liquid on the blade surface of the cutting part will gradually decrease due to the friction between the cutting part and the material to be cut. After cutting a predetermined amount of the material to be cut, the lubricity of the blade surface decreases, and liquid needs to be added to the blade surface to continue cutting. After repeating steps S1 and S2, the blade surface of the cutting part returns to a lubricated state, and step S3 can be continued to cut the material to be cut.

[0118] Exemplarily, the material to be cut includes optical adhesive. Exemplarily, referring to Figures 7 to 10 During the cutting process, the two opposite surfaces of the optical adhesive need to be covered with release films respectively, for example, a light release film 30 is covered on one surface of the optical adhesive, and a heavy release film 20 is covered on the other surface of the optical adhesive. Figure 7 and Figure 8In the cutting process, the heavy release film 20 is first arranged on the surface of the optical adhesive layer 10, and the optical adhesive layer 10 and the heavy release film 20 are cut using a cutting assembly. The optical adhesive layer 10 is located on the side of the heavy release film 20 close to the cutting assembly. At this time, the first cutting sub-section 201 is used to cut the optical adhesive layer 10 to obtain a first incision 11, and the second cutting sub-section 202 is used to cut the heavy release film 20 to obtain a second incision 21; the cutting thickness of the second cutting sub-section 202 is The sum of the thicknesses of the optical adhesive layer 10 and the heavy release film 20, the cutting thickness of the first cutting sub-section 201 is the thickness of the optical adhesive layer 10; the second incision 21 penetrates the optical adhesive layer 10 and the heavy release film 20, the first incision 11 penetrates the optical adhesive layer 10, that is, the first cutting sub-section 201 only cuts the optical adhesive layer 10, and the second cutting sub-section 202 cuts the optical adhesive layer 10 and the heavy release film 20 (specifically, the structural schematic diagram of the optical adhesive layer 10 and the heavy release film 20 after cutting is referred to Figure 7 and Figure 8 ); then, a light release film 30 is attached to the surface of the optical adhesive layer 10 away from the heavy release film 20, and the light release film 30 is located on the side of the optical adhesive layer 10 close to the cutting component. At this time, the light release film 30, the optical adhesive layer 10 and the heavy release film 20 are cut by the third cutting sub-unit 203 to obtain a third incision 31, and the third incision 31 passes through the light release film 30, the optical adhesive layer 10 and the heavy release film 20 (specifically, the structural schematic diagram of the light release film 30, the optical adhesive layer 10 and the heavy release film 20 after cutting is shown in FIG. Fig. 9 and Fig.10 ), when the third cutting sub-unit 203 cuts the heavy release film 20, part of the cutting position coincides with the position where the second cutting sub-unit 202 cuts the heavy release film 20.

[0119] A third aspect of the present application provides a cutting device, including the above-mentioned cutting assembly, or the cutting device uses the above-mentioned cutting method to cut the material to be cut.

[0120] It should be noted that, in addition to the above-mentioned cutting components, the cutting device may also include structures that a conventional cutting device should have, such as a control system, a power supply, etc., which will not be elaborated herein.

[0121] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0122] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A cutting assembly, characterized in that: include: A carrier, wherein the interior of the carrier includes a receiving cavity; A cutting portion, located at least partially around the carrier, the cutting portion is provided with an opening, and the opening is communicated with the accommodating cavity; The driving part includes a sliding unit, and the sliding unit is located in the accommodating cavity. In a working state, liquid is arranged in the accommodating cavity, and the sliding unit squeezes the liquid and transports the liquid to the opening.

2. The cutting assembly according to claim 1, characterized in that: The shape of the carrier includes cylindrical; Preferably, the cutting portion is located on at least part of the circumference of the cylinder; Preferably, the cutting portion comprises a blade, and the blade is provided with the opening; Preferably, the carrier comprises a first carrier, the cutting portion comprises a first cutting sub-portion and a second cutting sub-portion located at a circumferential side of the first carrier, the first cutting sub-portions are arranged at intervals along the circumference of the first carrier, and the second cutting sub-portion is located between adjacent first cutting sub-portions; Preferably, along the circumferential direction of the first carrier, there are two second cutting sub-portions arranged at intervals between adjacent first cutting sub-portions, and the second cutting sub-portions extend along the axial direction of the first carrier; Preferably, the shape of the first cutting sub-portion comprises a closed figure; Preferably, the shape of the orthographic projection of the first cutting sub-portion on the first carrier comprises a rectangle; Preferably, the shape of the second cutting sub-portion comprises a line segment; Preferably, the height of the first cutting sub-portion protruding from the first carrier is smaller than the height of the second cutting sub-portion protruding from the first carrier; Preferably, the carrier includes a second carrier, and the cutting portion includes a third cutting sub-portion located at a peripheral side of the second carrier; Preferably, the shape of the third cutting sub-portion comprises a closed figure; Preferably, the shape of the orthographic projection of the third cutting sub-portion on the second carrier comprises a rectangle; Preferably, the height of the third cutting sub-portion protruding from the second carrier is greater than the height of the second cutting sub-portion protruding from the first carrier; Preferably, along the axial direction of the second carrier, the width of the third cutting sub-portion is a first width; along the axial direction of the first carrier, the width of the first cutting sub-portion is a second width, and the first width is greater than the second width; Preferably, along the circumference of the second carrier, the width of the third cutting sub-portion is a third width, along the circumference of the first carrier, the spacing between two second cutting sub-portions adjacent to the same first cutting sub-portion is a fourth width, and the third width is equal to the fourth width; Preferably, the material of the cutting portion comprises steel.

3. The cutting assembly according to claim 1, characterized in that: The size of the opening is greater than or equal to 1 micron and less than or equal to 2 microns; Preferably, the size of the accommodating cavity is greater than or equal to 4 cm and less than or equal to 6 cm; Preferably, the outer perimeter of the carrier is greater than or equal to 210 cm and less than or equal to 290 cm.

4. The cutting assembly according to claim 1, characterized in that: Also includes: A liquid flow channel, located between the opening and the accommodating cavity; Preferably, the sliding unit comprises a piston; Preferably, the driving part is a cylinder.

5. The cutting assembly according to any one of claims 1 to 4, characterized in that: Also includes: bearings, located on opposite sides of the carrier in the axial direction of the carrier; Preferably, it further comprises: a transmission wheel, which is located on at least one side of the carrier in the axial direction of the carrier, and the bearing passes through the transmission wheel.

6. The cutting assembly according to any one of claims 1 to 4, characterized in that: The cutting assembly further comprises a liquid inlet hole, which is located in the carrier, and the liquid inlet hole is connected to the accommodating cavity; Preferably, the liquid comprises a release agent; Preferably, the release agent comprises silicone oil.

7. A cutting method, characterized in that: include: S1. Adding liquid into the receiving cavity of the carrier; S2, causing a sliding unit in the driving part to squeeze the liquid and transport the liquid to an opening of a cutting part; the cutting part is located at least partially around the carrier; S3, using the cutting unit to cut the material to be cut.

8. The cutting method according to claim 7, characterized in that: The method of causing the sliding unit in the driving part to squeeze the liquid and deliver the liquid to the opening of the cutting part comprises: The sliding unit squeezes the liquid to push a predetermined amount of the liquid to the opening of the cutting portion; Preferably, the step of pushing a predetermined amount of the liquid to the opening of the cutting portion comprises: Pushing a predetermined amount of the liquid to the opening of the cutting portion within a predetermined time; Preferably, the predetermined time is 1 minute to 2 minutes.

9. The cutting method according to claim 7, characterized in that: Cutting the material to be cut by using the cutting unit includes: After cutting a predetermined amount of the material to be cut by the cutting unit, repeating steps S1 to S3; Preferably, the material to be cut includes optical glue.

10. A cutting device, characterized in that: The cutting device comprises the cutting assembly as described in any one of claims 1 to 6, or the cutting device adopts the cutting method as described in any one of claims 7 to 9 to cut the material to be cut.

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