System and method for forming component

Abstract

Systems and methods for forming a component are provided. A system (100) for forming a component (102) includes one or more heaters (104) configured to generate heat to form a component (102), where the component (102) includes the one or more heaters (104) when formed. A method for forming a component (102) includes: generating heat by one or more heaters (104) to form the component (102); and forming an assembly (102) at least in part by said generating, wherein the assembly (102) comprises the one or more heaters (104) when formed.

Description

[0001] Citations of Related Applications

[0002] This application is related to and claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 589,684, filed on October 12, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to systems and methods for forming (eg, via integrated curing) assemblies such as composite laminate parts. Background Art

[0004] Composite materials have been used as structural elements in various applications. Composite materials such as fiber reinforced polymers have a relatively high strength to weight ratio. The high strength to weight ratio makes these materials desirable for vehicle construction such as aircraft. These materials typically include multiple layers or plies of a reinforcing material combined in a matrix material to form a heterogeneous material with a combination of properties that are different from the reinforcing material and the matrix material, respectively.

[0005] For some applications, it is desirable for composite materials to provide multiple functions. For example, it may be desirable to have a single laminate structure that provides structural support and conducts electrical current to power electrical loads, communication transmissions, and / or the like. Power distribution to embedded conductive materials within a laminate composite structure requires a means to deliver current to known locations within the thickness of the laminate structure and in specific areas.

[0006] Some existing systems embed one or more insulated wires through the thickness of the laminated structure. The assembly of the laminate may include forming an incision or splicing through multiple plies, and feeding the wire through the incision when the plies are sequentially applied to a mandrel or other tool to form a laminate stack. This process of embedding wires in the structure at multiple locations during the structure formation process may be harmful to the structural performance of the laminated structure, and may inhibit the appropriate interface between the structural plies of the laminated structure and adjacent components (e.g., honeycomb core). For example, arranging wires through the surface of the laminated structure at multiple locations may lead to discontinuities within the laminated structure, such as bulges and stress concentrations. Discontinuities may reduce the structural performance of the laminate, thereby requiring additional plies (and therefore weight) to meet material strength requirements. In addition, the insulating material of the wire may contaminate the base material (e.g., resin) of the laminated structure, reducing material performance. Wire stripping (stripping) and other wire preparation and wiring tasks may increase the risk of foreign object debris (FOD) contaminating the laminated structure. Embedded wires may also introduce failure risks due to the handling of the wires and interference between the wires and adjacent components. During the life of the system, embedded wires may experience fatigue and wear over time, which may lead to wire failure.

[0007] During forming processes such as composite material manufacturing processes, various types of components are cured. Typically, aerospace composite parts are cured by long, slow and expensive convection heating processes. These processes, which are typically performed in a heating chamber or oven in an autoclave, include heating air and / or gas volumes, then transferring heat to a large tool, and then transferring heat to the part. In a tool that does not employ a closed mold system, the air / gas volume also transfers heat to the part through several layers of bagging material on the side opposite to the tool. This process is typically unable to effectively transfer energy to the part. In particular, the amount of energy given to the part for curing is typically only a portion of the combined energy of heating a large amount of air, tooling and bagging material. In addition, the large thermal mass of the system results in inaccurate control of part temperature rise, stay and decline, thereby causing challenges associated with customizing temperatures for discrete regions of composite parts (e.g., slower heating of thicker regions and pads typically limits processing speed and may have non-uniformity in curing). In addition, part size is limited by the size of the heating chamber. Therefore, production rates are typically limited by the footprint of these chambers and loading and unloading times. Summary of the invention

[0008] There is a need for improved systems and methods for forming (eg, via curing) assemblies (eg, laminated composite parts).Furthermore, there is a need for efficient and effective systems for forming composite parts.

[0009] In view of these needs, certain embodiments of the present disclosure provide a system for forming a component. The system includes one or more heaters configured to generate heat to form the component. The component includes one or more heaters when formed.

[0010] In at least one embodiment, the assembly further comprises one or more parts when formed. The one or more heaters are configured to generate heat to join, consolidate, fabricate or cure the one or more parts and the one or more heaters together to form the assembly. The one or more parts may include one or more composite layers and one or more dielectric layers.

[0011] In at least one embodiment, the component is an ice protection system configured for a nacelle of a propulsion system and / or a leading edge of a lifting surface of an aircraft.

[0012] The system may further include a control unit in communication with the one or more heaters. The control unit is configured to control the operation of the one or more heaters.

[0013] The one or more heaters may be one or more resistive heaters.

[0014] In at least one embodiment, one or more heaters are used to form the assembly and to provide functional heating to the assembly after the assembly is formed.

[0015] In at least one embodiment, the one or more heaters are configured to heat a first zone of the component to a different temperature than a second zone of the component. For example, the one or more heaters include a first heater configured to heat the first zone and a second heater configured to heat the second zone.

[0016] The system may also include an imaging device configured to acquire an image of the component as it is formed.

[0017] Certain embodiments of the present disclosure provide a method for forming a component, the method comprising: generating heat by one or more heaters to form the component; and forming the component at least partially by the generating, wherein the component includes the one or more heaters when being formed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] These and other features, aspects and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings, in which like reference numerals refer to like parts throughout, and in which:

[0019] Figure 1 A block diagram of a system for forming an assembly according to an embodiment of the present disclosure is shown.

[0020] Figure 2 A flow chart of a method for forming an assembly according to an embodiment of the present disclosure is shown.

[0021] Figure 3 A top view of a system for forming an assembly according to an embodiment of the present disclosure is shown.

[0022] Figure 4 Shows Figure 3 side of the system.

[0023] Figure 5 A schematic diagram of a system for forming an assembly according to an embodiment of the present disclosure is shown.

[0024] Figure 6 An isometric view of components within a tool according to an embodiment of the present disclosure is shown.

[0025] Figure 7 A perspective view of an aircraft is shown.

[0026] Figure 8 An isometric view of an engine nacelle showing the propulsion system of an aircraft.

[0027] Fig. 9 Shows Figure 8 A front view of an inlet cover of an engine compartment is shown.

[0028] Fig.10 Shown by Fig. 9 The dashed circle in the figure indicates a part of the inlet mask. DETAILED DESCRIPTION

[0029] When read in conjunction with the accompanying drawings, the above overview and the following detailed description of certain embodiments will be better understood. As used herein, elements or steps stated in the singular and preceded by the word "one" or "a kind of" should be understood to not necessarily exclude the plural number of elements or steps. In addition, reference to "an embodiment" is not intended to be interpreted as excluding the existence of other embodiments that also combine the stated features. In addition, unless explicitly stated to the contrary, embodiments that "comprise" or "have" an element or multiple elements with a specific attribute may include other elements that do not have the attribute.

[0030] Embodiments of the present disclosure provide systems and methods for effectively and efficiently forming (e.g., assembling, curing, heating, and / or the like) components such as laminated composite components. The component is formed by heating to join, assemble, merge, cure, etc. the various parts together. In at least one embodiment, an embedded heater within the component is used to cure the component, resulting in direct conductive heat transfer from the heater to the substrate (e.g., polymer resin). The use of an embedded heater as an integral part of the component reduces the amount of heat transfer to the surrounding tools, air / gas volume, and the component itself, thereby greatly improving efficiency and rate while reducing wasted energy. Therefore, the lower thermal mass and conductive heat transfer of the system allow for fast and tighter control of the temperature of the component, which is desirable for optimizing the curing cycle, reducing changes in overshoot, and uncontrolled exothermic events. In short, embodiments of the present disclosure enable faster curing and higher composite component quality. Embodiments of the present disclosure may also be used with materials other than composite materials.

[0031] In addition, embodiments of the present disclosure are used to form multifunctional structures, wherein the embedded heater can also be used as a lightweight heater for a component such as an anti-icing system for a portion of an aircraft. For example, the heater of the anti-icing system is used to cure the anti-icing system during the forming process. Such methods eliminate, minimize or reduce the need for any other large heating chambers (e.g., ovens or autoclaves), which reduces manufacturing, labor, and processing time and costs.

[0032] Figure 1A block diagram of a system 100 for forming an assembly 102 according to an embodiment of the present disclosure is shown. The system 100 includes one or more heaters 104 of the assembly 102. The one or more heaters 104 communicate with a power source 106, such as through one or more wired connections (e.g., one or more leads, bus bars, and / or the like). The one or more heaters 104 also communicate with a control unit 108, such as through one or more wired or wireless connections. In at least one embodiment, the power source 106 is wired to the control unit 108, which can provide power to the one or more heaters 104.

[0033] In at least one embodiment, the assembly 102 includes one or more components 110 such as composite layers, such as one or more carbon layers (e.g., a carbon shield having one or more carbon fibers, carbon nanotubes, and / or the like), one or more dielectric layers (e.g., including glass fiber prepreg and adhesive), one or more film layers, one or more adhesive layers, and / or the like. The assembly 102 also includes one or more heaters 104. The assembly 102 may also include wires for connecting to the one or more heaters 104. That is, the assembly 102 includes one or more heaters 104 for use during the life of the assembly 102 when it is formed (e.g., via, for example, heating, curing, and / or assembly). For example, the assembly 102, when formed, may be a laminated composite structure that includes one or more heaters 104 for use during the life of the formed assembly 102. The one or more heaters 104 are not removed from the assembly 102. Instead, the one or more heaters 104 are an integrated and functional part of the assembly 102. The one or more heaters 104 may be resistive heaters. One or more heaters 104 may be electrically-powered resistive layers that are integrated into component 102 (e.g., a composite laminate) and configured for other desired functions after component 102 is formed. For example, one or more heaters 104 may be used in an anti-icing system for a nacelle of a propulsion system of an aircraft. In this manner, one or more heaters 104 are used for different purposes, such as for forming component 102 and for functional heating after component 102 is formed and completed.

[0034] In at least one embodiment, the assembly 102 includes a single heater 104. As another embodiment, the assembly 102 includes two or more heaters 104. In at least one embodiment, one or more heaters 104 form one or more heater layers 105 of the assembly 102. The heater layer 105 is an electrical layer configured to generate heat. In at least one embodiment, the heater layer 105 is a carbon shield that includes randomly oriented carbon fibers. As another embodiment, the heater layer 105 includes carbon nanotubes. The heater layer 105 can be any type of continuous conductive material configured to provide a resistive heater. For example, the current generated by the power supply 106 flows into the heater layer 105, thereby increasing the temperature of the heater layer 105.

[0035] In operation, to form (e.g., via curing) the assembly 102, the control unit 108 operates one or more heaters 104 (of the assembly 102 to be formed) to heat the one or more components 110 and the one or more heaters 104 to join, merge, assemble, cure together, and / or in a similar manner. The control unit 108 operates to control the one or more heaters 104 to heat one or more parts of the assembly 102 to a desired temperature. In this way, the assembly 102 is formed via internal heating, which is generated by the one or more heaters 104, rather than being arranged in a heating chamber of an oven, autoclave, etc. The assembly 102 is formed via heat generated by the one or more heaters 104 from the interior of the assembly 102 (as opposed to external heat in the interior chamber of the oven, autoclave, etc.). The assembly 102 is formed by the heat generated by the one or more heaters 104, and the one or more heaters 104 themselves become an integral part of the assembly 102. After operating the one or more heaters 104 to form the assembly 102, the one or more heaters 104 are an integral part of the formed assembly 102. One or more heaters 104 are used during the life of component 102. For example, one or more heaters 104 may be part of an anti-icing system for a nacelle of a propulsion system of an aircraft. Additionally, one or more heaters 104 may be used to reform component 102 during maintenance operations of component 102. For example, if replacement part 110 is a composite layer, heater 104 may be operated to generate heat to reform component 102 with replacement part 110, rather than using an oven or autoclave to reform component 102.

[0036] The system 100 including one or more heaters 104 for the component 102 effectively forms (e.g., by heating to join, merge, assemble, cure together, and / or similarly bring together the various parts) the component 102 by using the integrated one or more embedded heaters 104. For example, the one or more heaters 104 cure the composite laminate part and the one or more heaters 104 together, thereby resulting in direct conductive heat transfer from the one or more heaters 104 to the matrix (e.g., polymeric resin) of the component 102. By using the one or more heaters 104 to heat the component 102 internally during the forming process, the amount of heat transfer to the surrounding tool, air, and the component 102 itself is reduced (compared to using an oven or autoclave). Therefore, the lower thermal mass and conductive heat transfer of the system 100 allow for faster and tighter control of the temperature of the component 102, which is ideal for optimizing the curing cycle, reducing the chance of overshoot, exotherm, etc.

[0037] As described herein, a system 100 for forming an assembly 102 includes one or more heaters 104 configured to generate heat to form the assembly 102. The assembly 102 includes the one or more heaters 104 when formed. The assembly 102 also includes one or more components 110. The one or more heaters 104 are configured to generate heat to join, merge, assemble, or cure the one or more components 110 and the one or more heaters 104 together to form the assembly 102.

[0038] Figure 2 A flow chart of a method for forming an assembly according to an embodiment of the present disclosure is shown. Figure 1 and Figure 2 , at 120, one or more heaters 104 are arranged on or within one or more other components of the assembly 102 to be formed. The other components may include one or more adhesives, films, structural layers, bus bars and / or the like. At 122, the control unit 108 operates the one or more heaters 104 to generate heat at one or more desired temperatures or power input levels for one or more desired time periods. At 124, the assembly 102 including the one or more heaters 104 and other components is formed via the heat generated by the one or more heaters 104. One or more integrated embedded heaters 104 of the assembly 102 itself are used to form (such as joining, merging, assembling, curing, etc. through the heat generated) the assembly 102. After the assembly 102 is formed, the one or more heaters 104 can be used to generate heat according to the function of the assembly 102 (such as preventing ice from forming on the structure, heating the structure and / or similar effects).

[0039] The systems and methods described herein use one or more heaters 104 (e.g., embedded electric heaters) in an assembly 102 (e.g., a composite laminate) during the formation of the assembly 102. For example, the one or more heaters 104 are used to cure or assist in curing the assembly 102. It has been found that the energy used to conduction cure a composite part using one or more integrated embedded heaters is orders of magnitude lower than that of an appropriately sized convection heating chamber (e.g., an autoclave or oven). This is due to the lower total heated thermal mass and heat flow direction from the inside out (from the one or more embedded heaters 104 within the assembly 102) compared to the outside in (from the tool or heated air / gas) in the case of convection curing.

[0040] It has been found that one or more heaters 104 can quickly ramp up and closely track a specified temperature curing curve for a composite laminate, even across laminates having regions of different laminate thicknesses, resulting in a curing time savings because the component temperature meets the dwell temperature specification more quickly. In addition, multiple heaters 104 can be used to generate heat in different zones of the assembly 102. Different zones may correspond to regions with different thicknesses. Thus, the control unit 108 can operate to independently customize and control the heating of each zone so that temperature set points can be quickly and efficiently met even in complex components.

[0041] In addition, the one or more integrated heaters 104 enable curing without the use of an oven or autoclave, and do not require expensive and pressure-rated tools, thereby reducing equipment costs and loading time. Also, the one or more integrated heaters 104 allow for the formation of large single-piece composite parts that are not limited to chamber size (such as an oven or autoclave), which reduces the structural design weight of the part because fasteners and structural interfaces can be reduced.

[0042] In addition, thermal insulation tools can be used to further improve efficiency by capturing heat provided by the one or more heaters 104 from within the component 102. Moreover, the one or more embedded heaters 104 can also assist in the convection curing process. For example, the component 102 having the one or more embedded heaters 104 can be nominally heated in a heating chamber (e.g., an oven or autoclave) while also having electrical power delivered to the one or more embedded heaters 104, thereby resulting in heating from both inside and outside the component 102. The net effect is a faster ramp-to-dwell temperature, and improved temperature uniformity of the component 102. Moreover, the embedded heaters 104 can also assist in structural repair of the component 102, such as by providing internal heating that can be used to cure adhesives and patches of reinforcement materials around damaged areas.

[0043] As used herein, the terms "control unit," "central processing unit," "CPU," "computer," and the like may include any processor-based or microprocessor-based system, including systems using microcontrollers, reduced instruction set computers (RISC), application specific integrated circuits (ASICs), logic circuits, and any other circuit or processor, including hardware, software, or a combination thereof, capable of performing the functions described herein. This is exemplary only, and thus is not intended to limit the definition and / or meaning of such terms in any way. For example, the control unit 108 may be or include one or more processors configured to control operations as described herein.

[0044] The control unit 108 is configured to execute instruction sets stored in one or more data storage units or elements (such as one or more memories) to process data. For example, the control unit 108 may include or be coupled to one or more memories. The data storage unit may also store data or other information as required or desired. The data storage unit may be in the form of an information source or physical memory element within the processing machine.

[0045] The instruction set may include various commands that instruct the control unit 108 to perform specific operations as a processor, such as the methods and processes of various embodiments of the subject matter described herein. The instruction set may be in the form of a software program. The software may be in various forms, such as system software or application software. Furthermore, the software may be in the form of a collection of independent programs, a subset of programs within a larger program, or a portion of a program. The software may also include modular programming in the form of object-oriented programming. The processing of the input data by the processor may be in response to user commands, or in response to the results of previous processing, or in response to a request made by another processor.

[0046] The figures of the embodiments herein may show one or more control or processing units, such as control unit 108. It should be understood that the processing or control unit may represent a circuit, circuit system, or part thereof that can be implemented as hardware (e.g., software stored on a tangible and non-transitory computer-readable storage medium (e.g., a computer hard drive, ROM, RAM, etc.) with associated instructions to perform the operations described herein. The hardware may include a state machine circuit system that is hardwired to perform the functions described herein. Alternatively, the hardware may include an electronic circuit that includes and / or is connected to one or more logic-based devices such as a microprocessor, a processor, a controller, etc. Optionally, the control unit 108 may represent one or more of a processing circuit system such as a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a microprocessor, and / or the like. The circuits in different embodiments may be configured to execute one or more algorithms to perform the functions described herein. Whether or not explicitly identified in a flowchart or method, one or more algorithms may include aspects of the embodiments disclosed herein.

[0047] As used herein, the terms "software" and "firmware" are interchangeable and include any computer program stored in a data storage unit (e.g., one or more memories) for execution by a computer, including RAM memory, ROM memory, EPROM memory, EEPROM memory, and non-volatile RAM (NVRAM) memory. The above data storage unit types are exemplary only and therefore do not limit the types of memory that can be used to store computer programs.

[0048] Figure 3 A top view of a system 100 for forming an assembly 102 is shown in accordance with an embodiment of the present disclosure. Figure 4 Shows Figure 3 140 and the second zone 142 are associated with a second thickness of the component 102. The first thickness is different from the second thickness. The first heater 104a can be disposed in the first zone 140 and the second heater 104b can be disposed in the second zone 142. The first heater 104a and the second heater 104b are within the heater layer 105. See Figure 1 , Figure 3 and Figure 4 , the control unit 108 operates the first heater 104a and the second heater 104b to heat different regions 140 and 142 to different temperatures to form the component 102. Optionally, the thickness of the regions 140 and 142 may be the same. Also optionally, the component 102 may include other regions configured to be heated to different temperatures.

[0049] The assembly 102 to be formed may be placed on a substrate 150, such as a tool or mold. The substrate 150 may include a vacuum port 152. The assembly 102 may also include a bus bar 154. Wires 156 may electrically couple the heaters 104a and 104b to the power source 106. A bagging 160 and an insulator 162 may be provided on the assembly 102 during the forming process.

[0050] The assembly 102 to be formed includes various components. For example, the assembly 102 includes a composite laminate layer 164, a fiberglass layer 166, one or more bus bars 154, heaters 104a and 104b in the heater layer 105, and a fiberglass layer 168. The assembly 102 may include more or fewer components than shown. As described, the heaters 104a and 104b that will become part of the assembly 102 are used to generate heat to form the assembly 102, such as to cure the various components together.

[0051] Figure 5 1 is a schematic diagram of a system 100 for forming an assembly 102 according to an embodiment of the present disclosure. Figure 1-5 As noted, the control unit 108 is used to control the operation of the heaters 104a and 104b to generate heat with respect to the zones 140 and 142 to form the assembly 102. A user interface (user interface) 170 may be used to monitor and control the operation. For example, the user interface 170 includes a display 172 (e.g., an electronic screen or monitor) and an input device 174 (e.g., a keyboard, a mouse, a touch screen interface, a stylus, and / or the like). The user interface 170 communicates with the control unit 108, such as via one or more wired or wireless connections. In at least one embodiment, the user interface 170 includes the control unit 108.

[0052] The control unit 108 (and the user interface 170) may also communicate with an imaging device 176 (e.g., a thermal camera, an infrared camera, and / or the like). The imaging device 176 is configured to capture images of the component 102 during the forming process. The imaging device 176 communicates with the control unit 108, such as via one or more wired or wireless connections. The control unit 108 receives a signal including the acquired image to monitor the temperature of the component 102 (e.g., the different zones 140 and 142), and adaptively controls the heaters 104a and 104b accordingly. Optionally, the system 100 does not include the imaging device 176.

[0053] The control unit 108 may also communicate with one or more thermometers configured to detect the temperature of the component 102 during the forming process. For example, different thermometers may be disposed on or adjacent to the different zones 140 and 142. The control unit 108 receives signals from the thermometers to monitor the temperature of the component 102 (e.g., the different zones 140 and 142) and adaptively controls the heaters 104a and 104b accordingly. Optionally, the system 100 does not include a thermometer.

[0054] Figure 6 An isometric view of the assembly 102 within a tool 180 is shown according to an embodiment of the present disclosure. The tool 180 is Figure 3 and Figure 4 The tool 180 includes a base 182 and one or more upright walls 184 having an arcuate inner surface 186 configured to cradle the component 102 to provide a desired shape during the forming process. The shape of the tool 180 may be similar to Figure 6 In at least one embodiment, tool 180 may be a planar mold. In at least one other embodiment, no tool may be used.

[0055] The arcuate inner surface 186 of the tool 180 defines a curved receiving chamber 188 for the component 102 to be formed. The component 102 may include regions of varying thickness, built-up areas, etc. Figure 1-6 , the control unit 108 may operate the one or more heaters 104 to generate heat that causes the temperature to vary, such as with respect to the different zones 140 and 142 .

[0056] See also Figure 1-6 In at least one embodiment, the one or more heaters 104 provide a network of conductive heater layers sandwiched between dielectrics on the composite structure and electrically connected to a power source (via wires or other arrangements). The one or more heaters 104 generate heat from within the component 102 to increase the temperature of the component 102. The temperature of the component 102 can be tracked (such as via an imaging device 176 in communication with the control unit 108) and subsequently controlled by the control unit 108, such as by varying the electrical power input to the one or more heaters 104. The one or more heaters 104 and the component 110 can be placed at any depth within the laminate stack.

[0057] The component 110 may include a dielectric layer that electrically isolates the one or more heaters 104 from the composite laminate to limit the electrical power applied to the heater layer 105. Prior to the forming process, the composite material may be uncured, semi-cured, or pre-cured. The substrate 150 (e.g., tool 180) helps maintain the shape of the uncured material stack and thereby determines the geometry of the resulting component 102 during and after the forming process. In addition, one or more caul plates may be stacked on top of the component prior to the forming process to control surface quality and, if thermally conductive, may help spread heat more evenly across the component 102, particularly between regions. Insulators may be used to capture heat generated from the one or more heaters 104 and reduce heat transfer to media and materials external to the component 102 (e.g., air, external tools, and fixturing).

[0058] Figure 7 2 is a perspective view of an aircraft 200. Aircraft 200 may include one or more assemblies 102 as described herein. For example, assembly 102 may be an anti-icing system mounted on aircraft 200. Aircraft 200 may include a fuselage 202 extending from a nose 203 to an empennage 204. Emitter 204 may include one or more tail surfaces for directional control of aircraft 200. Aircraft 200 includes a pair of wings 206 extending from fuselage 202. One or more propulsion systems 208 propel aircraft 200. Propulsion systems 208 are supported by wings 206 of aircraft 200, but may be mounted to the fuselage or tail in other types of aircraft. Each propulsion system 208 includes a rotor assembly 219 having a rotor that rotates to direct air.

[0059] The rotor assembly 219 of each propulsion system 208 is surrounded by a nacelle 210. The nacelle 210 is a housing or shell that holds the rotor assembly 219. The nacelle 210 includes an inlet portion at the front end or front end of the nacelle 210, called an inlet shroud. The nacelle 210 may also include a fan shroud, a thrust reverser section, and an aft fairing section located behind the inlet shroud along the longitudinal length of the nacelle 210. The inlet shroud has an inner barrel that defines an air intake duct for directing air to the rotor assembly 219. The nacelle 210 may have an exhaust nozzle 212 (e.g., a main exhaust nozzle and a fan nozzle) located at the rear end of the propulsion system 208. In one embodiment, each propulsion system 208 may include or represent a gas turbine engine. The rotor assembly 219 may be a part of the engine. The engine burns fuel such as gasoline, kerosene, biofuel or other fuel sources to generate thrust for propelling the aircraft 200.

[0060] Figure 8An implementation of a nacelle 210 of one of the propulsion systems 208 of an aircraft 200 is shown according to one embodiment. The nacelle 210 extends a length from a front end 220 to a rear end 222 (opposite the front end 220). The nacelle 210 may include an inlet shroud 224, a fan shroud 226 disposed at the rear of the inlet shroud 224, and at least one rear section 228 disposed at the rear of the fan shroud 226. The inlet shroud 224 defines a leading edge 230 of the nacelle 210 at the front end 220 to guide air into a core 232 of the nacelle 210.

[0061] Fig. 9 for Figure 8 The inlet housing 224 has an annular barrel shape defining a central opening 234 that is fluidly connected to the core 232 of the nacelle 210 (at Figure 6 234). The term "annular barrel shape" means that the inlet shroud 224 defines a closed annular shape when viewed from the front. The annular barrel shape is oriented about a central longitudinal axis 236 extending through the central opening 234. The inlet shroud 224 may have a generally cylindrical shape. For example, the leading edge 230 may be circular. The inlet shroud 224 guides air through the central opening 234 into the core 232.

[0062] The inlet shroud 224 has a leading edge 230, an outer side 238, and an inner side 240. The outer side 238 extends from the leading edge 230 to an outer trailing edge 242. The inner side 240 extends from the leading edge 230 to an inner trailing edge 244. The outer side 238 is located radially outward of the inner side 240 and surrounds the inner side 240. The inner side 240 may define a central opening 234 that operates as an intake duct to supply air into the core 232 for the rotor assembly 219. The inlet shroud 224 may define a cavity (not shown) that is located rearward of the leading edge 230 and radially disposed between the outer side 238 and the inner side 240.

[0063] In one embodiment, after formation, component 102 (relative to Figure 1-61 and 2 (shown and described) are used to define the leading edge 230 of the inlet shroud 224. For example, the component 102 can be formed in an annular barrel shape. An anti-icing system including one or more heaters 104 can define the skin of the inlet shroud 224 that is exposed to the surrounding environment. Optionally, the component 102 is one panel of a plurality of different panels assembled side by side along the periphery of the inlet shroud 224. For example, a first component 102 (such as a first laminate structure) can be assembled adjacent to a second component 102 (such as a second laminate structure), and the second component 102 has the same or similar composition, shape and size as the first component 102. In another embodiment, the component 102 can be a unified one-piece structure that forms the entire annular leading edge 230 without any seams. In this one-piece embodiment, the component 102 can optionally include multiple electrical loads within the thickness, and the electrical loads can be separated from each other at the seams.

[0064] The assembly 102 may be or form part of an electrical ice protection system (EIPS) for meeting engine ice accretion and ingestion requirements. The electrical load may be a heater element (e.g., a resistive plate layer). The heater element converts electrical energy into thermal energy to heat the outer skin of the inlet shroud 224 along the leading edge 230. In one embodiment, one or more assemblies 102 include a plurality of heater elements spaced apart from each other by seams. The heater elements are arranged along the periphery of the inlet shroud 224 so that each heater element defines a corresponding heater zone 252 representing a circumferential portion of the leading edge 230.

[0065] Continue to see Fig. 9 , Fig.10 Shown by Fig. 9 250 is a portion of the inlet hood 224 indicated by the dashed circle 251 in FIG. In one embodiment, the seam 250 is not oriented parallel to the central longitudinal axis 236 and / or the flow direction of the airflow through the central opening 234. For example, the heater elements may be arranged such that the seam 250 defined between adjacent heater elements defines an inclination angle 256 relative to the central longitudinal axis 236 and the flow direction of the airflow 258 through the inlet hood 224. The inclination angle 256 is not parallel or perpendicular. For example, the inclination angle 256 is 1 to 89 degrees. In one embodiment, the inclination angle 256 may be 20 to 70 degrees. Alternatively, the inclination angle 256 may be 30 to 60 degrees. In one embodiment, the seam 250 is oriented such that the seam 250 defines an inclination angle relative to the entire range 260 of the flow direction of the airflow that the aircraft 200 may experience in flight. For example, the range 260 may be defined between a maximum rise angle 262 (when the aircraft is ascending) and a maximum descent angle 264 (when the aircraft is descending). Range 260 may be maximum rise angle 262 plus, to maximum descent angle 264. Thus, regardless of the angle of attack of the aircraft at a given time during typical flight conditions, seam 250 is oriented obliquely relative to the current flow direction of airflow 258.

[0066] Generally speaking, the seam 250 represents an area along the inlet shroud 224 that is at risk for ice accumulation because the seam 250 may have a lower heat flux than the adjacent heater zone 252. Ice accumulation may negatively affect the aerodynamic characteristics of the aircraft 200 and may also potentially damage the rotor accessories 219 or increase wear on the rotor accessories 219. The inlet shroud 224 avoids ice accumulation by orienting the heater elements so that the seams 250 between the heater zones 252 are inclined relative to the flow direction of the airflow 258. For example, cold air moving along the airflow direction 258 intersects the seam 250 only in a small area before passing through the heater zones 252. Most of the cold air is heated along the first heater zone 252 and then intersects across the seam 250 before being heated along the second heater zone 252.

[0067] Furthermore, the present disclosure includes embodiments according to the following clauses:

[0068] Clause 1. A system for forming a component, the system comprising:

[0069] One or more heaters are configured to generate heat to form the component, wherein the component includes the one or more heaters when formed.

[0070] Item 2. A system according to Item 1, wherein the assembly when formed further includes one or more components, and wherein the one or more heaters are configured to generate heat to join, merge, assemble or cure the one or more components and the one or more heaters together to form the assembly.

[0071] Clause 3. The system of clause 2, wherein the one or more components include:

[0072] one or more composite layers; and

[0073] One or more dielectric layers.

[0074] Clause 4. The system of any of clauses 1-3, wherein the component is an ice protection system configured for use in an engine nacelle of a propulsion system of an aircraft.

[0075] Clause 5. The system of any of clauses 1-4, further comprising a control unit in communication with the one or more heaters, wherein the control unit is configured to control operation of the one or more heaters.

[0076] Clause 6. The system of any of clauses 1-5, wherein the one or more heaters are one or more resistive heaters.

[0077] Clause 7. The system of any of Clauses 1-6, wherein the one or more heaters are used to form the component and to perform functional heating of the component after forming the component.

[0078] Clause 8. The system of any of Clauses 1-7, wherein the one or more heaters are configured to heat a first zone of the component to a different temperature than a second zone of the component.

[0079] Clause 9. The system of clause 8, wherein the one or more heaters comprises:

[0080] a first heater configured to heat the first zone; and

[0081] The second heater is configured to heat the second zone.

[0082] Clause 10. The system of any of clauses 1-9, further comprising an imaging device configured to acquire an image of the component while it is being formed.

[0083] Clause 11. A method for forming an assembly, the method comprising:

[0084] generating heat by one or more heaters to form the assembly; and

[0085] A component is formed at least in part by said generating, wherein the component when formed includes one or more heaters.

[0086] Clause 12. A method according to clause 11, wherein the generating includes generating heat by one or more heaters to join, merge, assemble or cure one or more components with the one or more heaters, and wherein the assembly when formed includes the one or more heaters and the one or more components.

[0087] Clause 13. The method of clause 12, wherein the one or more components include:

[0088] one or more composite layers; and

[0089] One or more dielectric layers.

[0090] Clause 14. The method of any of clauses 11-13, wherein the component is an ice protection system configured for an engine nacelle of a propulsion system of an aircraft.

[0091] Clause 15. The method of any of clauses 11-14, further comprising controlling operation of the one or more heaters via a control unit in communication with the one or more heaters.

[0092] Clause 16. The method of any of Clauses 11-15, wherein the one or more heaters are one or more resistive heaters.

[0093] Clause 17. The method of any of Clauses 11-16, wherein one or more heaters are used to form the component and to perform functional heating of the component after forming the component.

[0094] Clause 18. The method of any of Clauses 11-17, wherein the generating comprises heating a first zone of the assembly to a different temperature than a second zone of the assembly.

[0095] Clause 19. The method of clause 18, wherein the one or more heaters comprises:

[0096] a first heater configured to heat the first zone; and

[0097] The second heater is configured to heat the second zone.

[0098] Clause 20. The method of any of Clauses 11-19, further comprising acquiring an image of the component by an imaging device during said generating.

[0099] As described herein, embodiments of the present disclosure provide improved systems and methods for forming assemblies such as composite parts.In addition, embodiments of the present disclosure provide efficient and effective systems for forming composite parts.

[0100] Although various spatial and directional terms such as top, bottom, lower, middle, lateral, horizontal, vertical, front, etc. may be used to describe embodiments of the present disclosure, it should be understood that these terms are used only with respect to the orientations shown in the accompanying drawings. The orientation may be reversed, rotated or changed so that upper is lower and vice versa, horizontal becomes vertical, etc.

[0101] As used herein, a structure, limitation, or element "configured to" perform a task or operation is specifically structurally formed, constructed, or adapted in a manner corresponding to the task or operation. For clarity and avoidance of doubt, an object that can merely be modified to perform a task or operation is not "configured to" perform a task or operation as used herein.

[0102] It should be understood that the above description is intended to be illustrative rather than restrictive. For example, the above embodiments (and / or aspects thereof) can be used in combination with each other. In addition, without departing from the scope of the present disclosure, many modifications can be made to adapt specific situations or materials to the teachings of the various embodiments of the present disclosure. Although the size and type of materials described herein are intended to limit the parameters of the various embodiments of the present disclosure, these embodiments are by no means restrictive, but exemplary embodiments. After reviewing the above description, many other embodiments will be apparent to those of ordinary skill in the art. Therefore, the scope of the different embodiments of the present disclosure should be determined with reference to the attached claims and the full range of equivalents granted by these claims. In the attached claims, the terms "including" and "wherein" are used as the plain English equivalents of the corresponding terms "including" and "wherein". In addition, the terms "first", "second" and "third" etc. are used only as labels, and are not intended to impose numerical requirements on their objects. In addition, the limitations of the following claims are not written in the format of device plus function, and are not intended to be interpreted according to 35 U.S.C. § 112 (f), unless and until such claim limitations explicitly use the phrase "device for..." after the functional statement to avoid additional structures.

[0103] This description uses examples to disclose various embodiments of the present disclosure, including the best mode, and also enables any person skilled in the art to practice the various embodiments of the present disclosure, including making and using any device or system and performing any incorporated method. The authorized scope of the various embodiments of the present disclosure is defined by the claims, and may include other embodiments that occur to those skilled in the art. If other embodiments have structural elements that do not differ from the literal language of the claims, or if other embodiments include equivalent structural elements that do not differ substantially from the literal language of the claims, then these embodiments are intended to fall within the scope of the claims.

Claims

1. A system (100) for forming an assembly (102), the system (100) comprising: One or more heaters (104) are configured to generate heat to form the component (102), wherein the component (102) includes the one or more heaters (104) when formed.

2. The system (100) according to claim 1, wherein: The assembly (102) further comprises one or more parts (110) when formed, and wherein the one or more heaters (104) are configured to generate the heat to join, merge, assemble or cure the one or more parts (110) and the one or more heaters (104) together to form the assembly (102).

3. The system (100) according to claim 2, wherein: The one or more components (110) include: one or more composite layers; and One or more dielectric layers.

4. The system (100) of claim 1, wherein: The assembly (102) is an anti-icing system configured for use in an engine nacelle of a propulsion system of an aircraft.

5. The system (100) according to claim 1, further comprising a control unit (108) communicating with the one or more heaters (104), wherein the control unit (108) is configured to control the operation of the one or more heaters (104).

6. The system (100) of claim 1, wherein: The one or more heaters (104) are one or more resistive heaters.

7. The system (100) of claim 1, wherein: The one or more heaters (104) are used to form the component (102) and to perform functional heating on the component (102) after the component (102) is formed.

8. The system (100) of claim 1, wherein: The one or more heaters (104) are configured to heat a first region (140) of the component (102) to a different temperature than a second region (142) of the component (102).

9. The system (100) according to claim 8, wherein: The one or more heaters (104) include: a first heater configured to heat the first zone (140); and A second heater is configured to heat the second zone (142).

10. The system (100) of claim 1, further comprising an imaging device (176) configured to acquire an image of the component (102) while the component (102) is being formed.

11. A method for forming an assembly (102), the method comprising: generating heat via one or more heaters (104) to form the assembly (102); as well as The assembly (102) is formed at least in part by the generating, wherein the assembly (102) when formed includes the one or more heaters (104).

12. The method according to claim 11, wherein: The generating includes generating the heat by the one or more heaters (104) to join, merge, assemble or cure one or more components (110) and the one or more heaters (104) together, and wherein the assembly (102) includes the one or more heaters (104) and the one or more components (110) when formed.

13. The method according to claim 12, wherein: The one or more components (110) include: one or more composite layers; and One or more dielectric layers.

14. The method according to claim 11, wherein: The assembly (102) is an anti-icing system configured for use in an engine nacelle of a propulsion system of an aircraft.

15. The method of claim 11, further comprising controlling operation of the one or more heaters (104) via a control unit (108) in communication with the one or more heaters (104).

16. The method according to claim 11, wherein: The one or more heaters (104) are one or more resistive heaters.

17. The method according to claim 11, wherein: The one or more heaters (104) are used to form the component (102) and to perform functional heating on the component (102) after the component (102) is formed.

18. The method according to claim 11, wherein: The generating includes heating a first region (140) of the component (102) to a different temperature than a second region (142) of the component (102).

19. The method according to claim 18, wherein: The one or more heaters (104) include: a first heater configured to heat the first zone (140); and A second heater is configured to heat the second zone (142).

20. The method of claim 11, further comprising acquiring an image of the component (102) via an imaging device (176) during the generating.

Images