Resin composition, prepreg, circuit board and printed circuit board

Abstract

The invention relates to a resin composition, a prepreg, a circuit board and a printed circuit board. Wherein the resin composition comprises low-dielectric resin and modified benzocyclobutene resin, the dielectric loss of the low-dielectric resin is less than or equal to 0.002, the low-dielectric resin contains dienophile and a benzene ring, the modified benzocyclobutene resin contains a modified group of which the dipole moment is greater than or equal to 0.5, and the saturated carbon number of a main chain of the modified benzocyclobutene resin is greater than or equal to 8. The circuit substrate prepared from the resin composition disclosed by the invention has extremely low dielectric loss performance and high peel strength performance.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic industry, in particular to a resin composition, a prepreg, a circuit substrate and a printed circuit board. Background Art

[0002] Traditional resin compositions usually use hydrocarbon resins and benzocyclobutene resins in combination. Compared with conventional polyphenylene ether resin systems, although they can reduce the dielectric loss of circuit substrates, with the rapid development of the high-frequency 5G era, the dielectric loss of circuit substrates still needs to be further reduced. At the same time, the circuit substrates prepared using this resin composition still have the problem of poor peel strength. Summary of the invention

[0003] Based on this, it is necessary to provide a resin composition, a prepreg, a circuit substrate and a printed circuit board to address the above problems. The circuit substrate prepared by using the resin composition has both extremely low dielectric loss performance and high peel strength performance.

[0004] A resin composition comprises a low dielectric resin and a modified benzocyclobutene resin, wherein the dielectric loss of the low dielectric resin is ≤0.002, the low dielectric resin contains a dienophile and a benzene ring, the modified benzocyclobutene resin contains a modified group with a dipole moment ≥0.5, and the saturated carbon number of the main chain of the modified benzocyclobutene resin is ≥8.

[0005] In one embodiment, based on 35 parts by weight of the low dielectric resin, the added amount of the modified benzocyclobutene resin is 10 parts by weight to 30 parts by weight.

[0006] In one embodiment, in the low dielectric resin, the molar ratio of the dienophile to the benzene ring is 2:1-5:1.

[0007] In one embodiment, the mass fraction of the modified group in the modified benzocyclobutene resin is 20%-40%;

[0008] And / or, the dipole moment of the modified group is ≤6;

[0009] And / or, the modified group contains a cyclic structure, the main chain of the cyclic structure contains only carbon atoms, and the number of carbon atoms is ≥4.

[0010] In one embodiment, one of the terminal groups of the modified benzocyclobutene resin is an unsaturated bond.

[0011] In one embodiment, the resin composition further includes at least one of a flame retardant, a filler, a solvent, a coupling agent, an inhibitor, an antioxidant, a defoaming agent, and a catalyst, wherein the flame retardant main chain contains a P=O bond and a benzene ring, and the end group is a benzene ring, the number of the benzene rings is an even number, and adjacent benzene rings are symmetrically arranged through P=O bonds.

[0012] In one embodiment, based on 35 parts by weight of the low dielectric resin, the added amount of the flame retardant is 5 parts by weight to 20 parts by weight.

[0013] A prepreg made from the resin composition as described above.

[0014] A circuit substrate made of the prepreg described above.

[0015] A printed circuit board made of the circuit substrate as described above.

[0016] In the resin composition of the present invention, a low dielectric resin having a specific dielectric loss and a specific structure is used in combination with a modified benzocyclobutene resin having a specific dipole moment and a specific main chain structure, so that not only can the prepared circuit substrate have extremely low dielectric loss, but also the peel strength of the circuit substrate can be improved. Therefore, the circuit substrate prepared by using the resin composition of the present invention has both extremely low dielectric loss performance and high peel strength performance. DETAILED DESCRIPTION

[0017] For ease of understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing the specific implementation mode or embodiment, and are not intended to limit the present invention. The optional range of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of related listed items, and the combinations include any two related listed items, any more related listed items, or all related listed items.

[0019] The present invention provides a resin composition, which comprises a low dielectric resin and a modified benzocyclobutene resin, wherein the dielectric loss of the low dielectric resin is ≤0.002, the low dielectric resin contains a dienophile and a benzene ring, the modified benzocyclobutene resin contains a modified group with a dipole moment ≥0.5, and the saturated carbon number of the main chain of the modified benzocyclobutene resin is ≥8.

[0020] In the present invention, by setting a low dielectric resin with specific dielectric loss and specific structure, on the one hand, the low dielectric resin has the characteristic of low dielectric loss, so that the prepared circuit substrate has low dielectric loss performance; on the other hand, the benzene ring in the low dielectric resin is utilized to improve the polarity of the low dielectric resin to a certain extent, and the dienophile in the low dielectric resin can effectively improve the reaction activity between the low dielectric resin and the modified benzocyclobutene resin under heating conditions, and can effectively improve the bonding force between the resin system and the metal foil (such as copper foil), thereby improving the peeling strength of the circuit substrate. In addition, the reaction between the two makes the resins have good compatibility, which can further improve the structural stability of the circuit substrate.

[0021] At the same time, by setting a modified benzocyclobutene resin with a specific dipole moment and a specific main chain structure, on the one hand, the modified group is used as a polar group, so that the modified benzocyclobutene resin has a higher polarity, further improving the polarity of the resin system, which can further improve the bonding force between the resin system and the metal foil and improve the peeling strength of the circuit substrate; on the other hand, by using the main chain saturated carbon number ≥ 8, the modified benzocyclobutene resin has a long chain structure, and the presence of the long chain structure can reduce the flexibility of the modified benzocyclobutene resin molecular chain, so that the movement of the molecular chain is restricted, the movement of the dipole is reduced, thereby reducing the dielectric loss of the resin system, and further reducing the dielectric loss of the circuit substrate.

[0022] Therefore, the resin composition of the present invention, under the synergistic combination of a low dielectric resin having a specific dielectric loss and a specific structure and a modified benzocyclobutene resin having a specific dipole moment and a specific main chain structure, not only enables the prepared circuit substrate to have extremely low dielectric loss, but also improves the bonding force between the resin system and the metal foil (such as copper foil), and improves the peel strength of the circuit substrate, so that the prepared circuit substrate can have both extremely low dielectric loss performance and high peel strength performance.

[0023] Optionally, in the low dielectric resin, the molar ratio of the dienophile to the benzene ring is 2: 1-5: 1. It can be understood that in the present invention, the polarity of the low dielectric resin can be adjusted by adjusting the content of the dienophile and the benzene ring in the low dielectric resin, thereby adjusting the balance between the peel strength and the dielectric loss of the low dielectric resin, thereby facilitating further reducing the dielectric loss of the circuit substrate and improving the peel strength of the circuit substrate.

[0024] It should be noted that the dienophile in the present invention refers to a group that can react with a conjugated diene in a diene synthesis (Diels-Alder) reaction. In one embodiment, the dienophile is selected from any one of an unsaturated bond, an aldehyde group, a carboxyl group, an ester group, a nitro group, and a cyano group, wherein the unsaturated bond is preferably a carbon-carbon double bond.

[0025] In one embodiment, the low dielectric resin is selected from at least one of hydrocarbon resin, divinylbenzene copolymer, styrene butadiene copolymer, and modified polyphenylene ether, and is preferably hydrocarbon resin.

[0026] In the present invention, based on 35 parts by weight of the low dielectric resin, the modified benzocyclobutene resin is added in an amount of 10 parts by weight to 30 parts by weight. This arrangement is beneficial to further improve the peel strength of the circuit substrate and reduce its dielectric loss.

[0027] Optionally, the mass fraction of the modified group in the modified benzocyclobutene resin is 20%-40%. This arrangement can further improve the peeling strength of the circuit substrate while still allowing the circuit substrate to have low dielectric loss.

[0028] Optionally, one of the end groups of the modified benzocyclobutene resin is an unsaturated bond, preferably a carbon-carbon double bond. It is understood that when one of the end groups of the modified benzocyclobutene resin is an unsaturated bond, the other end group can only be other groups, not unsaturated bonds. Such arrangement is conducive to improving the reactivity of the modified benzocyclobutene resin, further improving the chemical reaction between it and the low dielectric resin or metal foil, improving the bonding force between materials, improving the peeling strength of the circuit substrate, and simultaneously helping to reduce the dielectric loss of the circuit substrate.

[0029] It should be noted that, in the present invention, the terminal groups of the modified benzocyclobutene resin refer to the head and tail groups of the modified benzocyclobutene resin molecular chain.

[0030] Optionally, the dipole moment of the modified group is ≤6. This configuration is beneficial for improving the polarity of the modified benzocyclobutene resin while effectively avoiding the influence of the introduction of the modified group on the dielectric loss of the resin system, so that the circuit substrate has high peel strength and low dielectric loss.

[0031] Furthermore, the modified group is selected from at least one of hydroxyl, amino, nitro, carboxyl, amide, ester and anhydride groups, preferably anhydride groups. This arrangement is conducive to further improving the peel strength of the circuit substrate.

[0032] Optionally, the modified group contains a cyclic structure, the main chain of the cyclic structure contains only carbon atoms, and the number of carbon atoms is ≥ 4. This arrangement can make the molecular chain of the modified benzocyclobutene resin have a longer chain length, thereby reducing its own flexibility, restricting the movement of its molecular chain, reducing the movement of dipoles, reducing the dielectric loss of the resin, and thus reducing the dielectric loss of the circuit substrate.

[0033] In the present invention, the modified benzocyclobutene resin can be prepared by the following method: a compound containing a modifying group, a benzocyclobutene resin, a catalyst and an inhibitor are mixed, and then placed in an oil bath at a temperature of 60°C-140°C for reaction for 2h-4h, the oil bath is removed, and then the reaction is continued at 60°C-90°C for 1h, and a vacuum degassing treatment is performed to obtain the modified benzocyclobutene resin.

[0034] Wherein, by weight, the compound containing a modifying group is 10 to 30 parts by weight, the benzocyclobutene resin is 20 to 40 parts by weight, the catalyst is 0.01 to 1 part by weight, and the polymerization inhibitor is 0.01 to 1 part by weight.

[0035] Specifically, in one embodiment, when the modifying group is an anhydride group, the compound containing the modifying group is selected from an anhydride containing an aliphatic group, preferably maleic anhydride, tung oil anhydride, olefin succinic anhydride, tetrahydrophthalic anhydride, hexahydrobenzene, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, nadic anhydride, methylnadic anhydride, glutaric anhydride, olefinic anhydride, methylcyclohexene tetrahydrophthalic anhydride, dodecenyl succinic anhydride, methacrylic anhydride, maleic anhydride, etc. Such an arrangement is conducive to fully crosslinking the compound containing the modifying group with the benzocyclobutene resin to obtain a modified benzocyclobutene resin, thereby further improving the peel strength of the circuit substrate.

[0036] Furthermore, the compound containing the modifying group also contains a cyclic structure, the main chain of the cyclic structure contains only carbon atoms, and the number of carbon atoms is ≥ 4, preferably methacrylic anhydride or maleic anhydride. In this way, the molecular chain of the prepared modified benzocyclobutene resin can have a longer chain length, thereby reducing its own flexibility, restricting the movement of its molecular chain, reducing the movement of the dipole, reducing the dielectric loss of the resin, and thus reducing the dielectric loss of the circuit substrate.

[0037] In the present invention, the resin composition further comprises at least one of a flame retardant, a filler, a solvent, a coupling agent, an inhibitor, an antioxidant, a defoaming agent, and a catalyst.

[0038] Specifically, when the resin composition includes a flame retardant, the flame retardant main chain contains a P=O bond and a benzene ring, and the terminal group is a benzene ring, the number of the benzene rings is an even number, and the adjacent benzene rings are symmetrically arranged by the P=O bond, preferably at least one of diphenylphosphine oxide, diphenyl isodecyl phosphate, triphenyl phosphate, tris(2-chloropropyl) phosphate, tris(2.3-dichloropropyl) phosphate, tris(β-chloroethyl) phosphate, triphenyl phosphite, and dimethyl methylphosphonate. In this way, diphenyl-BCB-based phosphine oxide (Ph2POB), phenyl-diBCB-based phosphine oxide (PhPOB2) and triBCB-based phosphine oxide (POB3) can be further synthesized with modified benzocyclobutene resin, and the synthetic product can form an interpenetrating network structure in the modified benzocyclobutene ring opening, making the resin composition more stable, and effectively reducing dielectric loss, so that the circuit substrate has flame retardant properties while still maintaining extremely low dielectric loss performance.

[0039] Optionally, based on 35 parts by weight of the low dielectric resin, the flame retardant is added in an amount of 5 parts by weight to 20 parts by weight. This arrangement is conducive to further improving the flame retardancy of the circuit substrate while maintaining extremely low dielectric loss performance of the circuit substrate.

[0040] When the resin composition includes a filler, the amount of the filler added is 20 to 40 parts by weight based on 35 parts by weight of the low dielectric resin. Further, the filler is selected from at least one of silicon dioxide, barium titanate, aluminum nitride, silicon carbide, boron nitride, aluminum oxide, titanium dioxide, boehmite, silicon nitride, strontium titanate, hollow glass microspheres, quartz, and diamond.

[0041] When the resin composition includes a catalyst, the catalyst is preferably a peroxidation catalyst. This arrangement is beneficial to increasing the reaction rate between the low dielectric resin and the modified benzocyclobutene resin.

[0042] Furthermore, based on 35 parts by weight of the low dielectric resin, the added amount of the catalyst is 0.01 parts by weight to 1 part by weight.

[0043] When the resin composition further includes a solvent, in the present invention, there is no particular limitation on the solvent. For example, the solvent may be toluene, acetone, propylene glycol methyl ether, N,N-dimethylformamide, butanone or xylene.

[0044] Meanwhile, the present invention also provides a prepreg made from the resin composition as described above.

[0045] Specifically, the prepreg includes a reinforcing material and the resin composition as described above attached to the reinforcing material.

[0046] In one embodiment, the present invention does not limit the specific method for preparing a semi-cured sheet from a resin composition. The resin composition can be formed on a reinforcing material by dipping and / or coating, and then taken out and dried at 100° C.-120° C. for 1 min-9 min to obtain a semi-cured sheet.

[0047] In the present invention, there is no particular limitation on the reinforcing material, which is usually glass fiber cloth, preferably 1078 type quartz fiber cloth.

[0048] In addition, the present invention also provides a circuit substrate made of the prepreg as described above, which has both extremely low dielectric loss performance and high peel strength, specifically, the dielectric loss of the circuit substrate is lower than 0.002, and the peel strength is higher than 0.45N / mm.

[0049] Specifically, the circuit substrate includes an insulating layer and a conductive layer arranged on at least one surface of the insulating layer, wherein the insulating layer is pressed from one or more superimposed semi-cured sheets as described above, and the conductive layer is selected from conductive materials such as copper foil and aluminum foil, and the present invention does not limit this.

[0050] In the present invention, the specific type of metal foil is not particularly limited, for example, the metal foil may be copper foil, aluminum foil, etc. Preferably, the metal foil is copper foil.

[0051] Furthermore, the present invention also provides a printed circuit board made of the circuit substrate as described above.

[0052] Specifically, the printed circuit board is mainly made of the circuit substrate through processes such as drilling, hole filling, micro-etching, pre-preg, activation, acceleration, chemical copper and copper thickening.

[0053] Hereinafter, the resin combination, prepreg, circuit substrate and printed circuit board will be further described by the following specific examples. However, it will be appreciated by those skilled in the art that the following examples are only used to illustrate the present invention and should not be considered as limiting the scope of the present invention. If specific conditions are not specified in the examples, they are carried out according to normal conditions or conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be obtained commercially.

[0054] Example 1

[0055] 35 parts by weight of hydrocarbon resin BVPE (brand name Keyi GU910, dielectric loss of 0.001, containing carbon-carbon double bonds and benzene rings, and the molar ratio of carbon-carbon double bonds to benzene rings is 3:1), 20 parts by weight of modified benzocyclobutene resin (brand name Keyi GU9401, the modified group is a carboxyl group, the mass fraction of the modified group is 30%, the dipole moment of the modified group is about 4.1, the main chain saturated carbon number is 10 and the single end group is a double bond), 15 parts by weight of diphenyl isodecyl phosphate (brand name Yinglang Chemical), 35 parts by weight of spherical silica (brand name Jinyi) and 0.3 parts by weight of a hydrogen peroxide catalyst (brand name Arkema) are added to 50 parts by weight of toluene solvent (brand name Qidi) and mixed evenly to obtain a resin composition.

[0056] The 1078 type quartz fiber cloth was immersed in the resin composition obtained above, taken out and dried at 110° C. for 5 minutes to obtain a prepreg.

[0057] Six of the semi-cured sheets obtained above were stacked, and covered on both sides with HVLP4 grade copper foil with a thickness of 18 μm. They were then placed in a vacuum hot press for heat pressing, wherein the temperature was heated to 200°C at a heating rate of 3°C / min, the pressure was 3 MPa, and the pressing time was 2 hours to obtain a circuit substrate.

[0058] Example 2

[0059] Embodiment 2 is compared with embodiment 1, and the only difference is that 35 weight parts of divinylbenzene copolymer (brand name is Shengquan SQDB-X001, dielectric loss is 0.0015, containing carboxyl and benzene ring, and the molar ratio of carboxyl to benzene ring is 2:1), 15 weight parts of modified benzocyclobutene resin (brand name is Keyi GU9402, the modified group is amide group, the mass fraction of the modified group is 20%, the dipole moment of the modified group is about 2, the main chain saturated carbon number is 12 and the single end group is a double bond), 10 weight parts of diphenyl isodecyl phosphate (brand name is Yinglang Chemical), 40 weight parts of spherical silica (brand name is Jinyi) and 0.2 weight parts of hydrogen peroxide catalyst (brand name is Arkema) are added to 45 weight parts of toluene solvent (brand name is Qidi) and mixed uniformly to obtain a resin composition, and the other conditions are the same to obtain a circuit substrate.

[0060] Example 3

[0061] Compared with Example 1, Example 3 is different in that 35 parts by weight of styrene butadiene copolymer (brand name: Huawei Ruike Chemical, dielectric loss is 0.001, containing ester group and benzene ring, ester group to benzene ring molar ratio is 5:1), 28 parts by weight of modified benzocyclobutene resin (brand name: Keyi GU9403, modified group is The mass fraction of the modified group is 40%, the dipole moment of the modified group is about 0.8, the number of saturated carbons in the main chain is 11 and the single end group is a double bond), 18 parts by weight of diphenyl isodecyl phosphate (brand name Yinglang Chemical), 30 parts by weight of spherical silica (brand name Jinyi) and 0.4 parts by weight of hydrogen peroxide catalyst (brand name Arkema) are added to 55 parts by weight of toluene solvent (brand name Qidi) and mixed evenly to obtain a resin composition. The other conditions are the same to obtain a circuit substrate.

[0062] Example 4

[0063] The only difference between Example 4 and Example 1 is that 5 parts by weight of modified benzocyclobutene resin is used, and other conditions are the same to obtain a circuit substrate.

[0064] Example 5

[0065] Compared with Example 1, Example 5 differs only in that 35 parts by weight of modified polyphenylene ether (brand name Shengquan SQP-045M, dielectric loss of 0.0018, containing carbon-carbon double bonds and benzene rings, and the molar ratio of carbon-carbon double bonds to benzene rings is 1:1) is used, and other conditions are the same to obtain a circuit substrate.

[0066] Example 6

[0067] Compared with Example 1, Example 6 differs only in that 35 parts by weight of modified polyphenylene ether (brand name Shengquan SQP1501, dielectric loss of 0.0015, containing carbon-carbon double bonds and benzene rings, and the molar ratio of carbon-carbon double bonds to benzene rings is 6:1) is used, and other conditions are the same to obtain a circuit substrate.

[0068] Example 7

[0069] The only difference between Example 7 and Example 1 is that 40 parts by weight of modified benzocyclobutene resin is used, and other conditions are the same to obtain a circuit substrate.

[0070] Example 8

[0071] Compared with Example 1, Example 8 differs only in that a modified benzocyclobutene resin (brand name is Keyi GU9404, the modified group is hydroxyl, the mass fraction of the modified group is 5%, the dipole moment of the modified group is about 4.1, the number of saturated carbon atoms in the main chain is 10 and the single end group is a double bond) is used, and other conditions are the same to obtain a circuit substrate.

[0072] Example 9

[0073] Compared with Example 1, Example 9 differs only in that a modified benzocyclobutene resin (brand name is Keyi GU9405, the modified group is hydroxyl, the mass fraction of the modified group is 60%, the dipole moment of the modified group is about 4.1, the number of saturated carbon atoms in the main chain is 10 and the single end group is a double bond) is used, and other conditions are the same to obtain a circuit substrate.

[0074] Example 10

[0075] Compared with Example 1, Example 10 differs only in that the terminal groups of the modified benzocyclobutene resin are all double bonds, and the other conditions are the same to obtain a circuit substrate.

[0076] Embodiment 11

[0077] The difference between Example 11 and Example 1 is that the resin composition does not contain diphenyl isodecyl phosphate, silicon dioxide and hydrogen peroxide. Other conditions are the same to obtain a circuit substrate.

[0078] Example 12

[0079] The only difference between Example 12 and Example 1 is that 3-hydroxyphenylphosphinopropionic acid (brand name: Alpha Chemical) is used to replace the same weight portion of diphenyl isodecyl phosphate, and the other conditions are the same to obtain a circuit substrate.

[0080] Comparative Example 1

[0081] Compared with Example 1, Comparative Example 1 differs only in that bismaleimide (brand name KI-70, dielectric loss of 0.003, containing carbon-carbon double bonds and benzene rings, and the molar ratio of carbon-carbon double bonds to benzene rings is 3:1) is used to replace the same weight of hydrocarbon resin BVPE (dielectric loss of 0.001, containing carbon-carbon double bonds and benzene rings, and the molar ratio of carbon-carbon double bonds to benzene rings is 3:1), and other conditions are the same to obtain a circuit substrate.

[0082] Comparative Example 2

[0083] Comparative Example 2 is compared with Example 1, except that a styrene butadiene copolymer (brand name: Huawei Ruike Chemical, dielectric loss is 0.001, the end group contains a benzene ring, and does not contain a carbon-carbon double bond) is used to replace an equal weight portion of hydrocarbon resin BVPE (dielectric loss is 0.001, contains a carbon-carbon double bond and a benzene ring, and the molar ratio of the carbon-carbon double bond to the benzene ring is 3:1), and the other conditions are the same to obtain a circuit substrate.

[0084] Comparative Example 3

[0085] Comparative Example 3 is compared with Example 1, except that a styrene butadiene copolymer (brand name: Huawei Ruike Chemical, dielectric loss is 0.001, the end group contains a carbon-carbon double bond, and does not contain a benzene ring) is used to replace an equal weight portion of hydrocarbon resin BVPE (dielectric loss is 0.001, contains a carbon-carbon double bond and a benzene ring, and the molar ratio of the carbon-carbon double bond to the benzene ring is 3:1), and the other conditions are the same to obtain a circuit substrate.

[0086] Comparative Example 4

[0087] Comparative Example 4 is different from Example 1 only in that benzocyclobutene resin is used to replace the modified benzocyclobutene resin of the same weight, and other conditions are the same to obtain a circuit substrate.

[0088] Comparative Example 5

[0089] Compared with Example 1, Comparative Example 5 is different only in that a modified benzocyclobutene resin (brand name: Keyi GU9406, the modified group is an alkyl group, the mass fraction of the modified group is 30%, the dipole moment of the modified group is about 0.4, the number of saturated carbon atoms in the main chain is 10, and the single end group is a double bond) is used to replace an equal weight of modified benzocyclobutene resin (the modified group is a carboxyl group, the mass fraction of the modified group is 30%, the dipole moment of the modified group is about 4.1, the number of saturated carbon atoms in the main chain is 10, and the single end group is a double bond), and the other conditions are the same to obtain a circuit substrate.

[0090] Comparative Example 6

[0091] Compared with Example 1, Comparative Example 6 differs only in that modified benzocyclobutene resin (the modified group is a carboxyl group, the mass fraction of the modified group is 30%, the dipole moment of the modified group is about 4.1, the number of saturated carbon atoms in the main chain is 5, and the single end group is a double bond) is used to replace an equal weight of modified benzocyclobutene resin (the modified group is a carboxyl group, the mass fraction of the modified group is 30%, the dipole moment of the modified group is about 4.1, the number of saturated carbon atoms in the main chain is 10, and the single end group is a double bond), and other conditions are the same to obtain a circuit substrate.

[0092] The performance tests were conducted on the circuit substrates prepared in Examples 1-12 and Comparative Examples 1-6. The test results are shown in Table 1.

[0093] Among them, peel strength performance: the test method is carried out according to GB / T4722-20177.2.1 standard.

[0094] Dielectric loss: The test method is based on IEC61189-2-721-2015 standard, and the test condition is 10GHz;

[0095] Flame retardant performance: The test method is based on UL-94 standard.

[0096] Table 1

[0097]

[0098]

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A resin composition, characterized in that The resin composition comprises a low dielectric resin and a modified benzocyclobutene resin, wherein the dielectric loss of the low dielectric resin is ≤0.002, the low dielectric resin contains a dienophile and a benzene ring, the modified benzocyclobutene resin contains a modified group with a dipole moment ≥0.5, and the saturated carbon number of the main chain of the modified benzocyclobutene resin is ≥8.

2. The resin composition according to claim 1, characterized in that Based on 35 parts by weight of the low dielectric resin, the added amount of the modified benzocyclobutene resin is 10 parts by weight to 30 parts by weight.

3. The resin composition according to claim 1, characterized in that In the low dielectric resin, the molar ratio of the dienophile to the benzene ring is 2:1-5:

1.

4. The resin composition according to claim 1, characterized in that The mass fraction of the modified group in the modified benzocyclobutene resin is 20%-40%; And / or, the dipole moment of the modified group is ≤6; And / or, the modified group contains a cyclic structure, the main chain of the cyclic structure contains only carbon atoms, and the number of carbon atoms is ≥4.

5. The resin composition according to claim 1, characterized in that One of the terminal groups of the modified benzocyclobutene resin is an unsaturated bond.

6. The resin composition according to any one of claims 1 to 5, characterized in that The resin composition also includes at least one of a flame retardant, a filler, a solvent, a coupling agent, an inhibitor, an antioxidant, a defoaming agent, and a catalyst, wherein the flame retardant main chain contains a P=O bond and a benzene ring, and the end group is a benzene ring, the number of the benzene rings is an even number, and adjacent benzene rings are symmetrically arranged through a P=O bond.

7. The resin composition according to claim 6, characterized in that Based on 35 parts by weight of the low dielectric resin, the added amount of the flame retardant is 5 parts by weight to 20 parts by weight.

8. A prepreg made from the resin composition according to any one of claims 1 to 7.

9. A circuit substrate made of the prepreg as claimed in claim 8.

10. A printed circuit board made using the circuit substrate as claimed in claim 9.

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