Highly conductive thermoset resin-based composite material and method of making same

By introducing various conductive fillers and reinforcing materials into thermosetting resin-based composite materials, a multi-layered conductive network is formed, solving the problem that existing materials cannot simultaneously meet the requirements of high conductivity and comprehensive performance. This achieves improvements in high conductivity, mechanical properties, and dielectric properties, making it suitable for applications such as electronic packaging and electromagnetic shielding.

CN119823530BActive Publication Date: 2026-06-05GONGSHENG (TIANJIN) NEW MATERIAL TECH PARTNERSHIP (LLP)
View PDF 4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GONGSHENG (TIANJIN) NEW MATERIAL TECH PARTNERSHIP (LLP)
Filing Date
2025-01-09
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing conductive composite materials cannot simultaneously meet the requirements of high conductivity and other comprehensive properties, while traditional metal materials are heavy and easily affected by the environment.

Method used

Thermosetting resin-based composite materials employ the synergistic effect of multiple conductive fillers, including conductive carbon nanotubes, silver nanoparticles, graphene nanosheets, and barium titanate nanoparticles, to form a multi-layered conductive network. Furthermore, the dispersibility and compatibility are improved through functionalized polymer microspheres and surface modification treatment.

Benefits of technology

The composite material exhibits high conductivity, good mechanical properties, heat resistance, and dielectric properties, making it suitable for applications such as electronic packaging, sensors, and electromagnetic shielding.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119823530B_ABST
    Figure CN119823530B_ABST
Patent Text Reader

Abstract

The application relates to the technical field of composite materials, in particular to a high-conductivity thermosetting resin-based composite material and a preparation method thereof, which contains the following components in parts by weight: 50-80 parts of epoxy resin, 10-30 parts of conductive carbon nanotubes, 20-40 parts of nano silver particles, 10-20 parts of functionalized polyurethane prepolymer, 5-15 parts of polyamine curing agent, 2-8 parts of organic silane coupling agent, 5-15 parts of graphene nanosheet, 5-15 parts of aluminum borate whisker, 5-15 parts of barium titanate nanoparticles, 2-10 parts of conductive polymer microspheres, 1-5 parts of nano zinc oxide; wherein the conductive polymer microspheres comprise a core composed of polyaniline or polypyrrole, and polyurethane polymer or polyacrylate polymer wrapped outside the core; the core surface is modified by nano silver particles and gamma-aminopropyl triethoxysilane; the conductive polymer microspheres are used for providing a long-range conductive path, the nano silver particles are used for providing short-range conductive connection, and the conductive polymer microspheres and the nano silver particles form a multi-level conductive network.
Need to check novelty before this filing date? Find Prior Art