Electrolytic copper foil and preparation equipment thereof, negative plate, battery monomer and battery

Abstract

The invention belongs to the technical field of electrolytic copper foil preparation, and particularly relates to an electrolytic copper foil and preparation equipment thereof, a negative plate, a battery monomer, a battery and a power utilization device.The electrolytic copper foil preparation equipment comprises a pulse power supply and a foil generating device, and the pulse power supply is provided with a positive electrode and a negative electrode; the crude foil device comprises a cathode piece and an anode piece, the anode piece is provided with a plating solution tank used for bearing electroplating solution, and at least part of the cathode piece is located in the plating solution tank; the anode is electrically connected with the cathode piece, and the cathode is electrically connected with the anode piece; by utilizing the output pulse current of the pulse power supply, the crystal grain production speed of the electrolytic copper foil can be accelerated, and the crystal grain production time can be shortened, so that the crystal grains of the electrolytic copper foil can be refined, the tensile strength and the elongation of the electrolytic copper foil can be improved, and the quality of the electrolytic copper foil can be improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electrolytic copper foil preparation, and in particular relates to an electrolytic copper foil and its preparation equipment, a negative electrode sheet, a battery cell, a battery and an electrical device. Background Art

[0002] Copper foil is an extremely thin copper material, which is widely used in many fields, such as composite materials, electronic materials and decorative materials. Among them, electrolytic copper foil is an emerging material with broad application prospects. Electrolytic copper foil is widely used in the electronics industry, such as circuit boards, electronic components, batteries, etc. It has good electrical and thermal conductivity, which can improve the performance and stability of electronic products. In addition, electrolytic copper foil is also used to decorate and protect metal surfaces.

[0003] Electrolytic copper foil is usually produced by electrolysis using a direct current power supply, but the tensile strength and ductility of the electrolytic copper foil currently produced in this way are not high. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electrolytic copper foil and its preparation equipment, negative electrode sheet, battery cell, battery and electrical device, including but not limited to solving the problem of low tensile strength and ductility of electrolytic copper foil prepared by direct current power supply electrolysis in related technologies.

[0005] The technical solution adopted in the embodiment of the present application is:

[0006] In a first aspect, an electrolytic copper foil preparation device is provided, which includes a pulse power supply and a foil production device, the pulse power supply having a positive electrode and a negative electrode; the foil production device includes a cathode component and an anode component, the anode component is configured with a plating tank for carrying an electroplating solution, and at least a portion of the cathode component is located in the plating tank; the positive electrode is electrically connected to the cathode component, and the negative electrode is electrically connected to the anode component; wherein the peak current range of the pulse power supply is 70kA to 200kA.

[0007] In the electrolytic copper foil preparation equipment of the embodiment of the present application, during the preparation of the electrolytic copper foil, the electroplating solution is injected into the plating solution tank, and at least part of the cathode part is immersed in the electroplating solution, then the pulse power supply is turned on, the cathode part and the anode part are connected through the electroplating solution current, and under the action of the current, the copper ions in the electroplating solution are reduced on the cathode part to generate copper metal, forming the electrolytic copper foil, thus completing the production of the electrolytic copper foil. In this process, due to the use of a pulse power supply, the output pulse current of the pulse power supply can accelerate the grain production speed of the electrolytic copper foil, shorten the grain production time, thereby facilitating the refinement of the grains of the electrolytic copper foil, improving the tensile strength and elongation of the electrolytic copper foil, and also improving the quality of the electrolytic copper foil.

[0008] In one embodiment, the peak current of the pulse power supply ranges from 70 kA to 200 kA.

[0009] By adopting the technical solution of the embodiment of the present application, the peak current range of the pulse power supply is 70kA to 200kA. The peak current of the pulse power supply is relatively large, the grain production speed of the electrolytic copper foil is fast, and the grain production time is short, thereby refining the grains of the electrolytic copper foil and even reaching nanocrystalline, thereby greatly improving the tensile strength and elongation of the electrolytic copper foil. At the same time, it is also conducive to the mass production of high-quality electrolytic copper foil.

[0010] In one embodiment, the peak current range of the pulse power supply is 100 kA to 150 kA.

[0011] By adopting the technical solution of the embodiment of the present application, the peak current of the pulse power supply is more reasonable, the electrolytic copper foil prepared by the electrolytic copper foil preparation equipment has excellent performance, and the pulse power supply is also easy to prepare, which is conducive to the mass production of high-performance electrolytic copper foil.

[0012] In one embodiment, the duty cycle of the pulse power supply ranges from 1% to 50%.

[0013] By adopting the technical solution of the embodiment of the present application, the duty cycle range is reasonable, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil can be better balanced.

[0014] In one embodiment, the duty cycle of the pulse power supply ranges from 5% to 20%.

[0015] By adopting the technical solution of the embodiment of the present application, the duty cycle of the pulse power supply is set more reasonably, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil can be better balanced.

[0016] In one embodiment, the pulse width of the pulse power source ranges from 1 ms to 50 ms.

[0017] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil.

[0018] In one embodiment, the pulse width of the pulse power source ranges from 10 ms to 30 ms.

[0019] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply is set more reasonably, which can better balance the quality and production efficiency of the electrolytic copper foil.

[0020] In one embodiment, the average current range of the pulse power supply is 1 kA to 50 kA.

[0021] By adopting the technical solution of this embodiment, the average current of the pulse power supply is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil.

[0022] In one embodiment, the average current range of the pulse power supply is 3 kA to 20 kA.

[0023] By adopting the technical solution of this embodiment, the average current setting of the pulse power supply is more reasonable, which can better balance the quality and production efficiency of the electrolytic copper foil.

[0024] In one embodiment, the peak current density of the anode member is in the range of 181 A / dm 2 ~454A / dm 2 .

[0025] By adopting the technical solution of this embodiment, the peak current density of the anode component is reasonably set, and the quality and production efficiency of the electrolytic copper foil can be taken into account at the same time.

[0026] In one embodiment, the peak current density of the anode member is in the range of 200A / dm 2 ~240A / dm 2 .

[0027] By adopting the technical solution of this embodiment, the peak current density of the anode component is reasonably set, and the quality and production efficiency of the electrolytic copper foil can be taken into account at the same time.

[0028] In one embodiment, the average current density of the anode member is in the range of 2A / dm 2 ~113A / dm 2 .

[0029] By adopting the technical solution of this embodiment, the average current density of the anode component is reasonably set, and the quality and production efficiency of the electrolytic copper foil can be taken into account at the same time.

[0030] In one embodiment, the average current density of the anode member is in the range of 30 A / dm 2 ~80A / dm 2 .

[0031] By adopting the technical solution of this embodiment, the average current density of the anode component is reasonably set, and the quality and production efficiency of the electrolytic copper foil can be taken into account at the same time.

[0032] In one embodiment, the output waveform of the pulse power supply is a rectangular wave.

[0033] By adopting the technical solution of this embodiment, the rectangular wave can provide a higher current density, making the electrolysis process faster, thereby improving the electrolysis efficiency. Compared with a continuous DC power supply, the rectangular wave can reduce the polarization phenomenon of the anode component, thereby reducing energy consumption; in addition, the rectangular wave can control the growth rate of the electrolytic copper foil, avoiding the rough surface and internal defects of the electrolytic copper foil caused by excessive growth. By adjusting the width, interval and amplitude of the rectangular wave, the thickness of the electrolytic copper foil can be accurately controlled, thereby improving the quality of the electrolytic copper foil.

[0034] In one embodiment, the pulse power supply includes a plurality of battery cells, and the plurality of battery cells are connected in parallel.

[0035] By adopting the electrolytic copper foil preparation equipment of this embodiment, the pulse power supply includes multiple battery cells, the battery cells are connected in parallel, and the current of the pulse power supply is equal to the sum of the currents of all the battery cells, so that the pulse power supply can output a larger current and realize the preparation of high-performance electrolytic copper foil.

[0036] In one embodiment, each battery unit includes a plurality of battery modules, and the plurality of battery modules are connected in parallel.

[0037] By adopting the electrolytic copper foil preparation equipment of this embodiment, the battery unit includes multiple battery modules, the battery modules are connected in parallel, and the current of the battery unit is equal to the sum of the currents of all the battery modules, so that the battery unit can output a larger current, and the pulse power supply can also output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil.

[0038] In one embodiment, the electrolytic copper foil preparation device further includes a copper busbar, which is electrically connected between the positive electrode of the pulse power supply and the cathode member.

[0039] By adopting the technical solution of this embodiment, the positive electrode and the cathode of the pulse power supply are connected by a copper busbar, the connection method is simple, and the processing and manufacturing are convenient.

[0040] In one embodiment, the copper busbar comprises a silver-plated copper busbar, and the silver-plated copper busbar is electrically connected between the positive electrode and the cathode member of the pulse power supply.

[0041] By adopting the technical solution of this embodiment and using a silver-plated copper busbar, the skin effect of current can be reduced, the heating of the copper busbar can be reduced, and the quality of the electrolytic copper busbar can be improved.

[0042] In one embodiment, the electrolytic copper foil preparation equipment further includes a plating solution component mixing device, and the plating solution component mixing device is used to adjust the concentration of at least part of the components in the plating solution.

[0043] By adopting the technical solution of this embodiment, the electroplating solution component preparation device can at least adjust the concentration of some components in the electroplating solution to a suitable concentration range, thereby improving the performance and quality of the prepared electrolytic copper foil.

[0044] In one embodiment, the electroplating solution component mixing device is used to adjust the concentration of at least part of the components in the electroplating solution according to the detection result of the prepared electrolytic copper foil.

[0045] By adopting the technical solution of this embodiment, the concentration of the components in the electroplating solution is adjusted according to the detection results of the prepared electrolytic copper foil, and the detection and adjustment form a closed loop, which reduces errors and makes the prepared electrolytic copper foil have better quality and performance.

[0046] In one embodiment, the electroplating solution component preparation device includes a first container and a first connecting pipe, the first container is used to load the leveling agent, and the first connecting pipe connects the first container and the plating solution tank.

[0047] By adopting the technical solution of this embodiment, it is concluded from the detection results of the electrolytic copper foil that when the leveling agent in the electroplating solution needs to be added, the leveling agent in the first container can flow into the plating solution tank through the first pipe to increase the concentration of the leveling agent in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0048] In one embodiment, the first connecting pipe is provided with a first flow detection member for detecting the flow of the first connecting pipe.

[0049] By adopting the technical solution of this embodiment, the amount of leveling agent added can be accurately controlled through the first flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0050] In one embodiment, the electroplating solution component preparation device includes a second container and a second connecting pipe, the second container is used to load the wetting agent, and the second connecting pipe connects the second container and the plating solution tank.

[0051] By adopting the technical solution of this embodiment, it is concluded from the detection results of the electrolytic copper foil that when the wetting agent in the electroplating solution needs to be added, the wetting agent in the second container can flow into the plating solution tank through the second pipe to increase the concentration of the wetting agent in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0052] In one embodiment, the second connecting pipe is provided with a second flow detection member for detecting the flow of the second connecting pipe.

[0053] By adopting the technical solution of this embodiment, the amount of wetting agent added can be accurately controlled through the second flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0054] In one embodiment, the electroplating solution component preparation device includes a third container and a third connecting pipe, the third container is used to load a solution containing chloride ions, and the third connecting pipe connects the third container and the plating solution tank.

[0055] By adopting the technical solution of this embodiment, it is concluded from the detection results of the electrolytic copper foil that when the solution containing chloride ions in the electroplating solution needs to be added, the solution containing chloride ions in the third container can flow into the plating tank through the third pipe to increase the concentration of the solution containing chloride ions in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0056] In one embodiment, the third connecting pipe is provided with a third flow detection member for detecting the flow of the third connecting pipe.

[0057] By adopting the technical solution of this embodiment, the addition amount of the solution containing chloride ions can be accurately controlled through the third flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0058] In one embodiment, the electroplating solution component preparation device includes a fourth container and a fourth connecting pipe, the fourth container is used to load brightener, and the fourth connecting pipe connects the fourth container and the plating solution tank.

[0059] By adopting the technical solution of this embodiment, it is concluded from the detection results of the electrolytic copper foil that when the brightener in the plating solution needs to be added, the brightener in the fourth container can flow into the plating solution tank through the fourth pipe to increase the concentration of the brightener in the plating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0060] In one embodiment, the fourth connecting pipe is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe.

[0061] By adopting the technical solution of this embodiment, the amount of brightener added can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0062] In one embodiment, the electroplating solution component preparation device includes a fifth container and a fifth connecting pipe, the fifth container is used to load the copper sulfate solution, and the fifth connecting pipe connects the fifth container and the plating solution tank.

[0063] By adopting the technical solution of this embodiment, it is concluded from the detection results of the electrolytic copper foil that when the copper sulfate solution in the electroplating solution needs to be added, the copper sulfate solution in the fifth container can flow into the plating solution tank through the fifth pipe to increase the concentration of the copper sulfate solution in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0064] In one embodiment, the fifth connecting pipe is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe.

[0065] By adopting the technical solution of this embodiment, the addition amount of the copper sulfate solution can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0066] In a second aspect, an electrolytic copper foil is provided. The electrolytic copper foil is produced by using the electrolytic copper foil production equipment as described in the above embodiment.

[0067] The electrolytic copper foil of the embodiment of the present application is prepared by using the above-mentioned electrolytic copper foil preparation equipment, and the electrolytic copper foil has high tensile strength and elongation.

[0068] In a third aspect, a negative electrode sheet is provided, comprising the electrolytic copper foil as described in the above embodiment.

[0069] The negative electrode sheet of the embodiment of the present application adopts the above-mentioned electrolytic copper foil, which has high tensile strength and elongation, and is of great help to the subsequent design and development of ultra-thin battery cells.

[0070] In a fourth aspect, a battery cell is provided, comprising the negative electrode sheet as described in the above embodiment.

[0071] The battery cell of the embodiment of the present application adopts the above-mentioned negative electrode sheet, which has a significant improvement effect on the cycle life and safety of high expansion force battery cells, such as silicon-doped system batteries, and can improve the expansion and fracture problem of the negative electrode sheet in the late stage of the battery cell charge and discharge cycle.

[0072] In a fifth aspect, a battery is provided, comprising the battery cell as described in the above embodiment.

[0073] The battery of the embodiment of the present application adopts the above-mentioned battery cell, which has good performance and is conducive to improving the cycle life and safety of the battery.

[0074] In a sixth aspect, an electrical device is provided, comprising a battery as described in the above embodiment.

[0075] The battery of the embodiment of the present application adopts the above-mentioned battery, and the battery has good performance and safety, which is beneficial to improving the reliability of the use of electrical devices.

[0076] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0078] Figure 1 A schematic structural diagram of an electrolytic copper foil preparation device provided in one embodiment of the present application.

[0079] Figure 2 This is a tensile curve diagram of an electrolytic copper foil prepared by an electrolytic copper foil preparation device provided by another embodiment of the present application.

[0080] Figure 3 A schematic structural diagram of a vehicle provided in accordance with yet another embodiment of the present application.

[0081] Figure 4 A schematic diagram of an exploded view of a battery provided in accordance with yet another embodiment of the present application.

[0082] Figure 5 A schematic structural diagram of a battery cell provided in yet another embodiment of the present application.

[0083] Figure 6 A schematic diagram of an exploded view of a battery cell provided in yet another embodiment of the present application.

[0084] Figure 7 A schematic structural diagram of an electrode assembly provided in yet another embodiment of the present application.

[0085] Figure 8 For along Figure 7 Sectional view along line AA.

[0086] Among them, the reference numerals in the figure are:

[0087] 1000, vehicle; 1100, battery; 1200, controller; 1300, motor; 10, housing; 11, first part; 12, second part; 20, battery cell; 21, end cap; 211, electrode terminal; 212, pressure relief mechanism; 22, housing; 23, electrode assembly; 231, positive electrode sheet; 2311, positive electrode current collector; 2312, positive electrode active material layer; 232, negative electrode sheet; 2321, negative electrode current collector; 2322, negative electrode active material layer; 233, separator;

[0088] 100. Electrolytic copper foil preparation equipment; 110. Pulse power supply; 111. Battery unit; 120. Foil production device; 121. Cathode component; 122. Anode component; 1221. Plating solution tank; 123. Plating solution; 131. Silver-plated copper busbar; 132. Electrical connector; 140. Plating solution component mixing device; 1401. First container; 1402. First connecting tube; 1403. Second container; 1404. Second connecting tube; 1405. Third container; 1406. Third connecting tube; 1407. Fourth container; 1408. Fourth connecting tube; 1409. Fifth container; 1410. Fifth connecting tube; 200. Electrolytic copper foil. DETAILED DESCRIPTION

[0089] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0090] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0091] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0092] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments in any suitable manner.

[0093] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0094] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces). "Several" means one or more than one, unless otherwise clearly and specifically defined.

[0095] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0096] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0097] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0098] Copper foil is an extremely thin copper material, including electrolytic copper foil, rolled copper foil, hot-rolled copper foil, etc. Among them, electrolytic copper foil is widely used as a conductive material for circuit boards and a negative electrode material for batteries due to its good electrical conductivity and thermal conductivity.

[0099] Electrolytic copper foil is made using electrolytic copper foil preparation equipment, which generally includes a power supply, an anode component and a cathode component. The anode component is formed with a plating solution tank, in which a plating solution is loaded, and the cathode component is at least partially immersed in the plating solution. The anode component is electrically connected to the negative electrode of the power supply, and the cathode component is electrically connected to the positive electrode of the power supply. Through the action of the electric current, the copper ions in the plating solution are reduced on the cathode component to generate copper metal, thereby forming electrolytic copper foil.

[0100] The electrolytic copper foil industry generally uses DC power supply for mass production. The improvement of the mechanical properties of electrolytic copper foil mainly relies on the adjustment of organic additives, such as amines, polyether organics, cellulose and sulfur-containing organics, to balance the tensile strength and elongation performance. However, there are different opinions on its mechanism of action, and it is still impossible to directly observe it. Moreover, the adjustment of additives has reached its limit, and it is impossible to improve the tensile strength and elongation of electrolytic copper foil at the same time.

[0101] Based on this, the electrolytic copper foil preparation equipment of the embodiment of the present application adopts a pulse power supply. The output pulse current of the pulse power supply can increase the grain production speed of the electrolytic copper foil and shorten the grain production time, thereby facilitating the refinement of the grains of the electrolytic copper foil, improving the tensile strength and elongation of the electrolytic copper foil, and also improving the quality of the electrolytic copper foil.

[0102] Combination Figure 1 As shown, in one embodiment of the present application, an electrolytic copper foil preparation device 100 is provided, which includes a pulse power supply 110 and a foil production device 120; the pulse power supply 110 has a positive electrode and a negative electrode; the foil production device 120 includes a cathode component 121 and an anode component 122, the anode component 122 is configured with a plating tank 1221 for carrying a plating solution 123, and at least a part of the cathode component 121 is located in the plating tank 1221; the positive electrode is electrically connected to the cathode component 121, and the negative electrode is electrically connected to the anode component 122.

[0103] The pulse power supply 110 is a power supply device that can output a pulse current with a certain frequency and pulse width. The working principle of the pulse power supply 110 is to achieve pulse output by adjusting the switching frequency and duty cycle based on a DC power supply. The pulse power supply 110 can be, but is not limited to, a switching power supply, an inverter power supply, and a DC-DC converter.

[0104] The positive pole of the pulse power supply 110 may refer to the current outflow end of the pulse power supply 110, and the negative pole of the pulse power supply 110 may refer to the current inflow end of the pulse power supply 110; during the operation of the pulse power supply 110, the time interval during which the pulse current repeats in a complete cycle is called a pulse cycle. The output waveform of the pulse current may be various, for example: rectangular wave, square wave, triangle wave, etc.

[0105] The cathode member 121 may refer to a component electrically connected to the positive electrode of the pulse power supply 110. The cathode member 121 may be made of materials such as stainless steel or titanium alloy; the shape of the cathode member 121 may be cylindrical or hollow cylindrical, and the surface of the cathode member 121 may be smooth to reduce damage to the electrolytic copper foil 200.

[0106] The anode member 122 may refer to a component electrically connected to the negative electrode of the pulse power supply 110; the anode member 122 is made of copper; the shape of the anode member 122 may be a flat plate, a cylinder or other shapes. In one embodiment, the anode member 122 is a semicircular plate to match the cylindrical cathode member 121. In addition, the size and shape of the anode may be adjusted according to the design and production requirements of the specific plating tank 1221.

[0107] The electroplating solution 123 may refer to a solution that undergoes an electrochemical reaction under the action of an electric current. The electroplating solution 123 may include copper sulfate, a leveler, a brightener, and the like.

[0108] The plating tank 1221 may refer to a tank structure formed by the anode member 122, and the plating tank 1221 is used to carry the electroplating solution 123. The shape of the plating tank 1221 may be compatible with the shape of the cathode member 121 to improve the quality of the electrolytic copper foil 200; the shape of the plating tank 1221 may refer to various shapes, such as cylindrical, square column, etc.

[0109] At least part of the cathode component 121 is located in the plating tank 1221. It can be understood that part of the cathode component 121 is located in the plating tank 1221, and the other part is located outside the plating tank 1221. After the plating solution 123 is injected into the plating tank 1221, part of the cathode component 121 will also be immersed in the plating solution 123; or, the cathode component 121 is completely located in the plating tank 1221, and after the plating solution 123 is injected into the plating tank 1221, part of the cathode component 121 can be immersed in the plating solution 123, or the cathode component 121 can be immersed in the plating solution 123.

[0110] The positive electrode is electrically connected to the cathode member 121. It is understood that the positive electrode of the pulse power supply 110 can be electrically connected to the cathode member 121. The positive electrode of the pulse power supply 110 and the cathode member 121 can be electrically connected through a wire, a copper busbar or direct electrical contact.

[0111] The negative electrode is electrically connected to the anode member 122. It is understood that the negative electrode of the pulse power supply 110 can be electrically connected to the anode member 122. The negative electrode of the pulse power supply 110 and the anode member 122 can be electrically connected through a wire, a copper busbar or direct electrical contact.

[0112] In the electrolytic copper foil preparation device 100 of the embodiment of the present application, during the process of preparing the electrolytic copper foil 200, the electroplating solution 123 is injected into the plating solution tank 1221, and at least part of the cathode 121 is immersed in the electroplating solution 123, then the pulse power supply 110 is turned on, the cathode 121 and the anode 122 are connected by the current of the electroplating solution 123, and under the action of the current, the copper ions in the electroplating solution 123 are reduced on the cathode 121 to generate copper metal, forming the electrolytic copper foil 200, thus completing the production of the electrolytic copper foil 200. In this process, due to the use of the pulse power supply 110, the output pulse current of the pulse power supply 110 can accelerate the grain production speed of the electrolytic copper foil 200, shorten the grain production time, thereby being conducive to refining the grains of the electrolytic copper foil 200, improving the tensile strength and elongation of the electrolytic copper foil 200, and also improving the quality of the electrolytic copper foil 200.

[0113] In one embodiment, the pulse power supply adopts an industrial pulse power supply, but the peak current of the industrial pulse power supply 110 is usually about 5000A. However, the tensile strength and elongation of the electrolytic copper foil prepared in this way have certain advantages over the electrolytic copper foil prepared by the current DC power supply, but the advantages are not particularly obvious.

[0114] In some embodiments, the peak current of the pulse power supply 110 ranges from 70 kA to 200 kA.

[0115] The peak current of the pulse power supply 110 may refer to the maximum instantaneous current in the pulse current emitted by the pulse power supply 110. The peak current of the pulse power supply 110 may be directly measured by a measuring instrument such as an ammeter or an oscilloscope, or directly obtained from the label or specification of the pulse power supply 110.

[0116] The peak current range of the pulse power supply 110 is 70kA to 200kA. It can be understood that the peak current of the pulse power supply 110 can be 70kA, 200kA or any value between 70kA and 200kA. As an example, the peak current of the pulse power supply 110 can be but is not limited to 70kA, 80kA, 90kA, 100kA, 110kA, 120kA, 130kA, 140kA, 150kA, 160kA, 170kA, 180kA, 190kA, and 200kA.

[0117] The peak current of the industrial pulse power supply 110 is about 5000A, while the peak current of the pulse power supply 110 of the embodiment of the present application is greater than or equal to 70kA, which is much greater than the peak current of the industrial pulse power supply 110. In addition, the peak current of the pulse power supply 110 of the embodiment of the present application is less than or equal to 200kA, so that the peak current of the pulse power supply 110 is not too large, which greatly increases the manufacturing difficulty and manufacturing cost of the pulse power supply 110, thereby facilitating the mass production of the electrolytic copper foil 200.

[0118] By adopting the technical solution of this embodiment, since the peak current range of the pulse power supply 110 is 70kA to 200kA, the peak current of the pulse power supply 110 is relatively large, the grain production speed of the electrolytic copper foil 200 is fast, and the grain production time is short, thereby refining the grains of the electrolytic copper foil 200 and even reaching nanocrystalline, thereby greatly improving the tensile strength and elongation of the electrolytic copper foil 200, and at the same time, it is also conducive to the mass production of high-quality electrolytic copper foil 200.

[0119] In actual production, the tensile strength of the electrolytic copper foil 200 produced by the electrolytic copper foil preparation equipment 100 of the embodiment of the present application is greatly improved compared with the DC power supply, which can reach 800MPa. At the same time, the elongation is greater than or equal to 6%. In addition, the electrolytic copper foil 200 is characterized and analyzed by material EBSD (Electron Backscatter Diffraction), which shows that uniform and refined nanocrystals are generated in the electrolytic copper foil 200, which also explains from a mechanism that the electrolytic copper foil 200 produced by the electrolytic copper foil preparation equipment 100 of the embodiment of the present application has the essence of ultra-high tensile strength and ultra-high elongation.

[0120] The ultra-high strength and high ductility electrolytic copper foil 200 produced by the electrolytic copper foil preparation equipment 100 of the embodiment of the present application has extremely high application value in the lithium battery industry. On the one hand, it is of great help for the application of ultra-thin and even ultra-thin lithium battery copper foil current collectors in the future, such as 4.5um and 3.5um copper foils; on the other hand; for high expansion force battery cells, such as silicon-doped system batteries 1100, the cycle life and safety are significantly improved, and the expansion and fracture problem of the negative electrode sheet 232 in the late stage of the charge and discharge cycle of the battery cell 20 can be improved; it can also meet the batch preparation of 1450mm wide cathode rollers in the electrolytic copper foil 200 industry.

[0121] In some embodiments, the peak current of the pulse power supply 110 is in the range of 100 kA to 150 kA.

[0122] It can be understood that the peak current of the pulse power supply 110 can be 100kA, 150kA or any value between 100kA and 150kA; as an example, the peak current of the pulse power supply 110 can be but is not limited to 100kA, 105kA, 110kA, 115kA, 120kA, 125kA, 130kA, 135kA, 140kA, 145kA, 150kA.

[0123] By adopting the technical solution of the embodiment of the present application, the peak current of the pulse power supply 110 is more reasonable, the electrolytic copper foil 200 prepared by the electrolytic copper foil preparation equipment 100 has excellent performance, and the pulse power supply 110 is also easy to prepare, which is conducive to the mass production of high-performance electrolytic copper foil 200.

[0124] Table 1 below shows some experimental process parameters for preparing the electrolytic copper foil 200 and the mechanical property parameters of the electrolytic copper foil 200. The mechanical properties of the electrolytic copper foil 200 were tested by a universal testing tensile machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 1 to 10 is a rectangular wave, and Comparative Example 1 uses a DC power supply. Among them, in Examples 1 to 10 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and after multiple tests and taking the average value, the tensile strength and elongation in the table are obtained. Combined with Figure 2 As shown, Figure 2 This is the tensile curve of multiple tests in Example 1.

[0125] The duty cycle in the table refers to the duty cycle of the pulse power supply 110. The duty cycle of the pulse power supply 110 refers to the ratio of the effective (or high level) time of the pulse signal to the total time in one pulse cycle. It is usually expressed as a percentage, ranging from 0% to 100%. The duty cycle of the pulse power supply 110 can be directly measured using an oscilloscope or a logic analyzer; or, it can be directly obtained from the label or specification of the pulse power supply 110.

[0126] The plating solution temperature may refer to the temperature of the electroplating solution 123 in a working state; the plating solution temperature may be directly measured using a thermometer or other device.

[0127] The copper ion concentration may refer to the concentration of copper ions in the electroplating solution 123. The concentration of copper ions in the electroplating solution 123 may be measured by potentiometric titration.

[0128] The pulse width may be the pulse width of the pulse power supply 110. The pulse width of the pulse power supply 110 refers to the duration of the high level in one pulse cycle. The pulse width may be measured using an oscilloscope, a frequency meter, a counter, or other equipment.

[0129] The pole pitch may refer to the distance between the anode member 122 and the cathode member 121 ; as an example, the distance between the surfaces of the cathode member 121 and the anode member 122 facing each other.

[0130] Table 1

[0131]

[0132] As shown in Table 1, when the peak current is in the range of 70kA to 95kA, the tensile strength of the electrolytic copper foil 200 is in the range of 786MPa to 820MPa, and the elongation is in the range of 6.84% to 6.93%; when the peak current is in the range of 100kA to 150kA, the tensile strength of the electrolytic copper foil 200 is in the range of 826MPa to 892MPa, and the elongation is in the range of 6.94% to 7.13%; when the peak current is in the range of 155kA to 200kA, the tensile strength of the electrolytic copper foil 200 is in the range of 826MPa to 892MPa, and the elongation is in the range of 6.94% to 7.13%. kA, the tensile strength of the electrolytic copper foil 200 is in the range of 904MPa to 923MPa, and the elongation is in the range of 6.7% to 6.9%; while the tensile strength of the electrolytic copper foil 200 obtained by using a DC power supply is 410MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 obtained by using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 obtained by the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0133] In some embodiments, the duty cycle of the pulse power supply 110 ranges from 1% to 50%.

[0134] It is understandable that, in the process of making the electrolytic copper foil 200, the duty cycle of the pulse power supply 110 can be 1%, 50% or any value between 1% and 50%; as an example, the duty cycle of the pulse power supply 110 can be but not limited to 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%. In one embodiment, the adjustable range of the duty cycle of the pulse power supply 110 can cover the range of 1% to 50%, or can cover a part of the range of 1% to 50%; in another embodiment, the duty cycle of the pulse power supply 110 can also be non-adjustable, and the preparation requirements of different duty cycles can be met by replacing the pulse power supply 110 with different duty cycles.

[0135] If the duty cycle is too low, the thickness of the electrolytic copper foil 200 will be uneven, affecting the quality of the electrolytic copper foil 200 and the production capacity of the electrolytic copper foil 200 will be low; if the duty cycle is too high, it will be close to the DC electroplating performance and the performance of the prepared electrolytic copper foil 200 will be poor; in addition, the duty cycle needs to be adjusted together with the peak current to reach a balanced state.

[0136] By adopting the technical solution of the embodiment of the present application, the duty cycle range is reasonable, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil 200 can be better balanced.

[0137] In some embodiments, the duty cycle of the pulse power supply 110 ranges from 5% to 20%.

[0138] It is understandable that, in the process of manufacturing the electrolytic copper foil 200, the duty cycle of the pulse power supply 110 can be 5%, 20% or any value between 5% and 20%; as an example, the duty cycle of the pulse power supply 110 can be but not limited to 1%, 2%, 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%.

[0139] By adopting the technical solution of the embodiment of the present application, the duty cycle of the pulse power supply 110 is set more reasonably, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil 200 can be better balanced.

[0140] Table 2 below shows some experimental process parameters for preparing electrolytic copper foil 200 and mechanical property parameters of electrolytic copper foil 200. The mechanical properties of electrolytic copper foil 200 were tested by a universal tensile testing machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 11 to 20 is a rectangular wave, and Comparative Example 1 uses a DC power supply. Among them, in Examples 11 to 20 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and the tensile strength and elongation in the table can be obtained after multiple tests and taking the average value.

[0141] As shown in Table 2, when the duty ratio is in the range of 1% to 4.3%, the tensile strength of the electrolytic copper foil 200 is in the range of 684MPa to 790MPa, and the elongation is in the range of 5.69% to 6.15%; when the duty ratio is in the range of 5% to 20%, the tensile strength of the electrolytic copper foil 200 is in the range of 739MPa to 849MPa, and the elongation is in the range of 6.61% to 7.1%; when the duty ratio is in the range of 21% to 50%, the tensile strength of the electrolytic copper foil 200 is in the range of 739MPa to 849MPa, and the elongation is in the range of 6.61% to 7.1%. The tensile strength of the prepared electrolytic copper foil 200 is in the range of 619MPa to 640MPa, and the elongation is in the range of 6.15% to 6.6%; while the tensile strength of the electrolytic copper foil 200 prepared using a DC power supply is 410MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0142] Table 2

[0143]

[0144] In some embodiments, the pulse width of the pulse power source 110 ranges from 1 ms to 50 ms.

[0145] It can be understood that, in the process of manufacturing the electrolytic copper foil 200, the pulse width of the pulse power supply 110 can be 1ms, 50ms or any value between 1ms and 50ms; as an example, the pulse width of the pulse power supply 110 can be but is not limited to 1ms, 5ms, 10ms, 15ms, 20ms, 25ms, 30ms, 35ms, 40ms, 45ms, 50ms.

[0146] During the preparation of the electrolytic copper foil 200, if the pulse width is set too large, the current density during the electrolysis process will increase, resulting in pits and holes on the surface of the copper foil, affecting the quality of the electrolytic copper foil 200. If the pulse width is set too small, the current density during the electrolysis process will decrease, thereby affecting the growth rate and thickness uniformity of the electrolytic copper foil 200.

[0147] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply 110 is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil 200.

[0148] In some embodiments, the pulse width of the pulse power source 110 ranges from 10 ms to 30 ms.

[0149] It can be understood that, in the process of manufacturing the electrolytic copper foil 200, the pulse width of the pulse power supply 110 can be 10ms, 30ms or any value between 10ms and 30ms; as an example, the pulse width of the pulse power supply 110 can be but is not limited to 10ms, 12ms, 14ms, 16ms, 18ms, 20ms, 22ms, 24ms, 26ms, 28ms, 30ms.

[0150] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply 110 is set more reasonably, which can better balance the quality and production efficiency of the electrolytic copper foil 200.

[0151] Table 3 below shows some experimental process parameters for preparing electrolytic copper foil 200 and mechanical property parameters of electrolytic copper foil 200. The mechanical properties of electrolytic copper foil 200 were tested by a universal tensile testing machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 21 to 30 is a rectangular wave, and Comparative Example 1 uses a DC power supply. Among them, in Examples 21 to 30 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and the tensile strength and elongation in the table can be obtained after multiple tests and taking the average value.

[0152] Table 3

[0153]

[0154] It can be seen from Table 3 that when the pulse width is in the range of 1ms to 9ms, the tensile strength of the electrolytic copper foil 200 is in the range of 826MPa to 861MPa, and the elongation is in the range of 6.94% to 7.37%; when the pulse width is in the range of 10ms to 30ms, the tensile strength of the electrolytic copper foil 200 is in the range of 657MPa to 768MPa, and the elongation is in the range of 6.73% to 6.83%; when the pulse width is in the range of 31ms to 50ms, The tensile strength of the prepared electrolytic copper foil 200 is in the range of 653MPa to 669MPa, and the elongation is in the range of 5.68% to 6.63%; while the tensile strength of the electrolytic copper foil 200 prepared using a DC power supply is 410MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0155] In some embodiments, the average current range of the pulse power supply 110 is 1 kA to 50 kA.

[0156] The average current refers to the average current of the pulse power supply 110, which refers to the average value of the current in one pulse cycle. As an example, the waveform of the pulse current emitted by the pulse power supply 110 is rectangular, and the average current of the pulse power supply 110 is equal to the peak current multiplied by the duty cycle.

[0157] It can be understood that, in the process of making the electrolytic copper foil 200, the average current of the pulse power supply 110 can be 1kA, 50kA or any value between 1kA and 50kA; as an example, the duty cycle of the pulse power supply 110 can be but is not limited to 1kA, 5kA, 10kA, 15kA, 20kA, 25kA, 30kA, 35kA, 40kA, 45kA, 50kA.

[0158] During the preparation of the electrolytic copper foil 200, if the average current of the pulse power supply 110 is set too large, the deposition rate of copper ions during the electrolysis process will be too fast, thereby making the thickness of the electrolytic copper foil 200 uneven, affecting the quality and performance of the electrolytic copper foil 200. If the average current of the pulse power supply 110 is set too small, the deposition rate of copper ions during the electrolysis process will be too slow, thereby reducing the production efficiency of the electrolytic copper foil 200 and increasing the production cost.

[0159] By adopting the technical solution of this embodiment, the average current of the pulse power supply 110 is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil 200.

[0160] In some embodiments, the average current range of the pulse power supply 110 is 3 kA to 20 kA.

[0161] It can be understood that, in the process of manufacturing the electrolytic copper foil 200, the average current of the pulse power supply 110 can be 3kA, 20kA or any value between 3kA and 20kA; as an example, the average current of the pulse power supply 110 can be but is not limited to 3kA, 5kA, 7kA, 9kA, 11kA, 13kA, 15kA, 17kA, 19kA, 20kA.

[0162] By adopting the technical solution of this embodiment, the average current setting of the pulse power supply 110 is more reasonable, which can better balance the quality and production efficiency of the electrolytic copper foil 200.

[0163] In some embodiments, the peak current density of the anode member 122 is in the range of 181 A / dm 2 ~454A / dm 2 .

[0164] The peak current density of the anode member 122 may refer to the peak current per unit area of ​​the anode member 122. As an example, the anode member 122 is a semicircular plate, and the peak current flowing through the unit area of ​​the outer surface of the semicircular plate, that is, the peak current density of the semicircular plate is equal to the peak current divided by the area of ​​the outer surface of the semicircular plate; in the actual calculation process, since the thickness of the semicircular plate is small, the area of ​​the inner surface and the outer surface of the semicircular plate are not much different, so the peak current density of the semicircular plate can also be equal to the peak current divided by the area of ​​the inner surface of the semicircular plate.

[0165] In the process of making the electrolytic copper foil 200, the peak current density can be 181A / dm 2 、454A / dm 2 Or at 181A / dm 2 With 454A / dm 2 As an example, the peak current density may be, but is not limited to, 181 A / dm 2 、200A / dm 2 、250A / dm 2 、300A / dm 2 、350A / dm 2 、400A / dm 2 、450A / dm 2 、454A / dm 2 .

[0166] Generally speaking, if the peak current density is too large, it may cause problems such as rough surface, increased holes, and uneven thickness of the electrolytic copper foil 200, reducing the quality and performance of the copper foil; if the peak current density is too small, it may cause problems such as slow growth rate of the electrolytic copper foil 200, low production efficiency, and increased costs.

[0167] By adopting the technical solution of this embodiment, the peak current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0168] In some embodiments, the peak current density of the anode member 122 is in the range of 200 A / dm 2 ~240A / dm 2 .

[0169] During the process of manufacturing the electrolytic copper foil 200, the peak current density may be 200A / dm 2 、240A / dm 2 Or at 200A / dm 2 With 240A / dm 2 As an example, the peak current density may be, but is not limited to, 200 A / dm 2 、205A / dm 2 、210A / dm 2 、215A / dm 2 、220A / dm 2 、225A / dm 2 、230A / dm 2 、235A / dm 2 、240A / dm 2 .

[0170] By adopting the technical solution of this embodiment, the peak current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0171] In some embodiments, the average current density of the anode member 122 is in the range of 2A / dm 2 ~113A / dm 2 .

[0172] The average current density of the anode member 122 may refer to the average current per unit area of ​​the anode member 122. As an example, the anode member 122 is a semicircular plate, and the average current flowing through the unit area of ​​the outer surface of the semicircular plate, that is, the average current density of the semicircular plate is equal to the average current divided by the area of ​​the outer surface of the semicircular plate; in the actual calculation process, since the thickness of the semicircular plate is small, the area of ​​the inner surface and the outer surface of the semicircular plate are not much different, so the average current density of the semicircular plate can also be equal to the average current divided by the area of ​​the inner surface of the semicircular plate.

[0173] During the process of manufacturing the electrolytic copper foil 200, the average current density may be 2A / dm 2 、113A / dm 2 Or at 2A / dm 2 With 113A / dm 2 As an example, the average current density may be, but is not limited to, 2A / dm 2 、10A / dm 2 , 20A / dm 2 、30A / dm 2 、40A / dm 2 、50A / dm 2 、60A / dm 2 、70A / dm 2 、80A / dm 2 、90A / dm 2 、100A / dm 2 、110A / dm 2 、113A / dm 2 .

[0174] Generally speaking, if the average current density is too large, it may cause problems such as rough surface, increased holes, and uneven thickness of the electrolytic copper foil 200, reducing the quality and performance of the copper foil; if the average current density is too small, it may cause problems such as slow growth rate of the electrolytic copper foil 200, low production efficiency, and increased costs.

[0175] By adopting the technical solution of this embodiment, the average current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0176] In some embodiments, the average current density of the anode member 122 is in the range of 30 A / dm 2 ~80A / dm 2 .

[0177] During the process of manufacturing the electrolytic copper foil 200, the average current density may be 30A / dm 2 、80A / dm 2 Or at 30A / dm 2 With 80A / dm 2 As an example, the average current density may be, but is not limited to, 30 A / dm 2 、35A / dm 2 、40A / dm 2 、45A / dm 2 、50A / dm 2 、55A / dm 2 、60A / dm 2 、65A / dm 2 、70A / dm 2 、75A / dm 2 、80A / dm 2 .

[0178] By adopting the technical solution of this embodiment, the average current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0179] In one embodiment, the output waveform of the pulse power supply 110 is a rectangular wave.

[0180] A rectangular wave may refer to a periodic waveform whose current value remains constant for a certain period of time and is rectangular in the horizontal direction. As an example, in one cycle, the pulse power supply 110 outputs a constant current for a part of the time and does not output current for another part of the time.

[0181] By adopting the technical solution of this embodiment, the rectangular wave can provide a higher current density, making the electrolysis process faster, thereby improving the electrolysis efficiency. Compared with a continuous DC power supply, the rectangular wave can reduce the polarization phenomenon of the anode member 122, thereby reducing energy consumption; in addition, the rectangular wave can control the growth rate of the electrolytic copper foil 200, avoiding the surface roughness and internal defects of the electrolytic copper foil 200 caused by excessive growth. By adjusting the width, interval and amplitude of the rectangular wave, the thickness of the electrolytic copper foil 200 can be accurately controlled, and the quality of the electrolytic copper foil 200 can be improved.

[0182] In some embodiments, the pulse power supply 110 includes a plurality of battery cells 111 , and the plurality of battery cells 111 are connected in parallel.

[0183] The battery unit 111 may refer to a component including multiple battery modules, which may include multiple battery cells 20. The battery units 111 may be modular components connected in series, parallel or mixed. As an example, the battery unit 111 includes a cabinet, and multiple battery modules are loaded in the cabinet to form a whole, so as to facilitate the assembly and use of the pulse power supply 110.

[0184] The multiple battery cells 111 can be connected in parallel via conductive components such as wires and copper busbars.

[0185] By adopting the electrolytic copper foil preparation equipment 100 of this embodiment, the pulse power supply 110 includes a plurality of battery cells 111, and the battery cells 111 are connected in parallel. The current of the pulse power supply 110 is equal to the sum of the currents of all the battery cells 111, so that the pulse power supply 110 can output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil 200.

[0186] In some embodiments, each battery unit 111 includes a plurality of battery modules, and the plurality of battery modules are connected in parallel.

[0187] Multiple battery modules can be connected in parallel through conductive components such as wires and copper busbars.

[0188] By adopting the electrolytic copper foil preparation equipment 100 of this embodiment, the battery cell 111 includes multiple battery modules, the battery modules are connected in parallel, and the current of the battery cell 111 is equal to the sum of the currents of all the battery modules, so that the battery cell 111 can output a larger current, and the pulse power supply 110 can also output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil 200.

[0189] In one embodiment, the electrolytic copper foil preparation device 100 further includes a copper busbar, which is electrically connected between the positive electrode of the pulse power supply 110 and the cathode member 121 .

[0190] Copper busbar is a conductive material used for power transmission, usually made of copper. The shape and size of copper busbar can be customized according to actual needs. Common shapes include rectangular, circular and special shapes.

[0191] By adopting the technical solution of this embodiment, the positive electrode of the pulse power supply 110 and the cathode member 121 are connected by a copper busbar, which has a simple connection method and is convenient for processing and manufacturing.

[0192] In one embodiment, the copper busbar includes a silver-plated copper busbar 131 , and the silver-plated copper busbar 131 is electrically connected between the positive electrode of the pulse power supply 110 and the cathode member 121 .

[0193] The silver-plated copper busbar 131 is an electronic material, which is made of a layer of silver plated on the surface of the copper busbar. The copper busbar itself has good electrical conductivity, and silver has better electrical conductivity, so the silver-plated copper busbar 131 has higher electrical conductivity and good anti-oxidation ability, which can improve electrical performance and stability.

[0194] By adopting the technical solution of this embodiment and using the silver-plated copper busbar 131, the current skin effect can be reduced, the heating of the copper busbar can be reduced, and the quality of the electrolytic copper busbar can be improved.

[0195] In one embodiment, multiple battery cells 111 are connected in parallel through copper wires, the positive electrodes of the multiple battery cells 111 are electrically connected to the cathode member 121 through a silver-plated copper busbar 131, and the negative electrodes of the multiple battery cells 111 are electrically connected to the anode member 122 through an electrical connector 132, which may be a copper busbar, a wire, etc.; as an example, the pulse power supply 110 includes 48 battery modules, the output current peak value of the pulse power supply 110 is 120kA, the voltage is 0V to 6V, the adjustable range of the duty cycle is 1% to 50%, and the average current is 1kA to 50kA; the 48 battery modules are respectively loaded into 6 cabinets, and 8 battery modules are arranged in each cabinet; each battery module is designed to have an output current of 2500A and an output voltage of 6V, and the 8 battery modules are assembled in parallel into an integrated cabinet to form a battery cell 111; the output current of each battery cell 111 is 20kA, and the voltage is 6V. The eight battery modules are connected in parallel via multiple strands of copper wires, and the positive electrodes of the six battery cells 111 are respectively connected to the conductive sliders of the cathode member 121 via silver-plated copper busbars 131 .

[0196] In one embodiment, the electrolytic copper foil preparation equipment 100 further includes a plating solution component mixing device 140 , and the plating solution component mixing device 140 is used to adjust the concentration of at least part of the components in the plating solution 123 .

[0197] The plating solution component preparation device 140 may refer to a component that can adjust the concentration of at least some components in the plating solution 123; wherein, the plating solution component preparation device 140 can adjust the concentration of some components in the plating solution 123, and can also adjust the concentration of all components in the plating solution 123. As an example, the plating solution component preparation device 140 can prepare the concentration of deionized water, high-concentration copper sulfate solution, polyethylene glycol solution, hydrochloric acid solution, gelatin solution, sulfur-containing organic solution and other substances in the plating solution 123.

[0198] By adopting the technical solution of this embodiment, the electroplating solution component preparation device 140 can at least adjust the concentration of some components in the electroplating solution 123 to a suitable concentration range, thereby improving the performance and quality of the prepared electrolytic copper foil 200.

[0199] In one embodiment, the electroplating solution component preparation device 140 is used to adjust the concentration of at least part of the components in the electroplating solution 123 according to the detection result of the prepared electrolytic copper foil 200 .

[0200] It is understandable that the prepared electrolytic copper foil 200 is first tested, and then, according to the test result of the electrolytic copper foil 200 , the concentration of the components in the electroplating solution 123 is adjusted by the electroplating solution component mixing device 140 , so as to improve the quality of the electrolytic copper foil 200 .

[0201] By adopting the technical solution of this embodiment, the concentration of the components in the electroplating solution 123 is adjusted according to the detection results of the prepared electrolytic copper foil 200, and the detection and adjustment form a closed loop to reduce errors, so that the prepared electrolytic copper foil 200 has better quality and performance.

[0202] In one embodiment, the electroplating solution component preparation device 140 includes a first container 1401 and a first connecting pipe 1402 . The first container 1401 is used to load the leveling agent, and the first connecting pipe 1402 connects the first container 1401 and the plating solution tank 1221 .

[0203] The first container 1401 may be a container capable of loading a leveling agent; the main function of the leveling agent is to improve the uniformity and smoothness of the electrolytic copper foil 200. The leveling agent can fill the concave part of the surface of the electrolytic copper bar to make the electrolytic copper foil 200 more flat and smooth. The leveling agent may be, but is not limited to, a hydroxide solution (e.g., sodium hydroxide, potassium hydroxide, etc.), an organic additive (e.g., polyethylene glycol, polyacrylic acid, etc.), a metal salt solution (e.g., nickel sulfate, cobalt sulfate, etc.), an acid solution (e.g., sulfuric acid, nitric acid, etc.), and a gelatin solution.

[0204] The first connecting pipe 1402 may refer to a pipe connecting the first container 1401 and the plating solution tank 1221 .

[0205] By adopting the technical solution of this embodiment, it can be concluded from the detection results of the electrolytic copper foil 200 that when the leveling agent in the electroplating solution 123 needs to be added, the leveling agent in the first container 1401 can flow into the plating solution tank 1221 through the first pipe to increase the concentration of the leveling agent in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0206] In one embodiment, the number of first containers 1401 can be one or more, and the first connecting tubes 1402 are connected to the first containers 1401 one by one. The multiple first containers 1401 can be loaded with the same leveling agent or different leveling agents. The specific setting is based on actual conditions and is not limited here.

[0207] In one embodiment, the first connecting pipe 1402 is provided with a first flow detection member for detecting the flow of the first connecting pipe 1402 .

[0208] The first flow detection component may refer to a component used to detect the flow of the first connecting pipe 1402. The first flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0209] By adopting the technical solution of this embodiment, the amount of the leveling agent added can be accurately controlled through the first flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0210] In one embodiment, the electroplating solution component preparation device 140 includes a second container 1403 and a second connecting pipe 1404 . The second container 1403 is used to load the wetting agent. The second connecting pipe 1404 connects the second container 1403 and the plating solution tank 1221 .

[0211] The second container 1403 may refer to a container capable of loading a wetting agent; the main function of the wetting agent is to improve the uniformity and smoothness of the electrolytic copper foil 200. The main function of the wetting agent is to improve the wettability of the electroplating solution 123 on the surface of the electrolytic copper bar, thereby promoting the transfer of current and improving the electroplating efficiency. The wetting agent can reduce the surface tension between the liquid and the solid surface, making it easier for the electroplating solution 123 to form a uniform electroplating layer on the surface of the electrolytic copper bar. The wetting agent may be, but is not limited to, organic sulfides (e.g., mercaptans, thioethers, etc.), organic acids (e.g., acetic acid, citric acid, etc.), surfactants (e.g., anionic, cationic and nonionic surfactants), polymers (e.g., polyethylene glycol, polyacrylic acid, hydroxyethyl cellulose, etc.).

[0212] The second connecting pipe 1404 may refer to a pipe connecting the second container 1403 and the plating solution tank 1221 .

[0213] By adopting the technical solution of this embodiment, it can be concluded from the detection results of the electrolytic copper foil 200 that when the wetting agent in the electroplating solution 123 needs to be added, the wetting agent in the second container 1403 can flow into the plating solution tank 1221 through the second pipe to increase the concentration of the wetting agent in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0214] In one embodiment, the number of second containers 1403 can be one or more, and the second connecting tubes 1404 are connected to the second containers 1403 one by one. Multiple second containers 1403 can be loaded with the same wetting agent or different wetting agents. The specific setting is based on actual conditions and is not limited here.

[0215] In one embodiment, the second connecting pipe 1404 is provided with a second flow detection member for detecting the flow of the second connecting pipe 1404 .

[0216] The second flow detection component may refer to a component used to detect the flow of the second connecting pipe 1404. The second flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0217] By adopting the technical solution of this embodiment, the amount of wetting agent added can be accurately controlled through the second flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0218] In one embodiment, the electroplating solution component preparation device 140 includes a third container 1405 and a third connecting pipe 1406 . The third container 1405 is used to load a solution containing chloride ions. The third connecting pipe 1406 connects the third container 1405 and the plating solution tank 1221 .

[0219] The third container 1405 may refer to a container capable of loading a solution containing chloride ions; the main function of the solution containing chloride ions is to improve the uniformity and smoothness of the electrolytic copper foil 200. The chloride ions in the solution containing chloride ions are a good electrolyte that can improve the conductivity of the electroplating solution 123, thereby increasing the transmission efficiency of the current; the chloride ions can also promote the reduction reaction of copper ions, making it easier for the copper ions to be reduced to copper metal and deposited on the cathode 121; the chloride ions also help to maintain the balance of metal ions and acid ions in the electroplating solution 123, thereby maintaining the stability of the electroplating solution 123 and extending the service life of the electroplating solution 123. The solution containing chloride ions may be, but is not limited to, a sodium chloride solution, a sodium chloride solution, a potassium chloride solution, a copper chloride solution, and a hydrochloric acid solution.

[0220] The third connecting pipe 1406 may refer to a pipe connecting the third container 1405 and the plating solution tank 1221 .

[0221] By adopting the technical solution of this embodiment, it can be concluded from the detection results of the electrolytic copper foil 200 that when the solution containing chloride ions in the electroplating solution 123 needs to be added, the solution containing chloride ions in the third container 1405 can flow into the plating tank 1221 through the third pipe to increase the concentration of the solution containing chloride ions in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0222] In one embodiment, the number of the third container 1405 can be one or more, and the third container 1405 is connected to the third connecting pipe 1406 in a one-to-one correspondence. The multiple third containers 1405 can be loaded with the same solution containing chloride ions, or can be loaded with different solutions containing chloride ions, which is specifically set according to actual conditions and is not limited here.

[0223] In one embodiment, the third connecting pipe 1406 is provided with a third flow detection member for detecting the flow of the third connecting pipe 1406 .

[0224] The third flow detection component may refer to a component used to detect the flow of the third connecting pipe 1406. The third flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0225] By adopting the technical solution of this embodiment, the addition amount of the solution containing chloride ions can be accurately controlled through the third flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0226] In one embodiment, the electroplating solution component preparation device 140 includes a fourth container 1407 and a fourth connecting pipe 1408 . The fourth container 1407 is used to load brightener, and the fourth connecting pipe 1408 connects the fourth container 1407 and the plating solution tank 1221 .

[0227] The fourth container 1407 may be a container capable of loading a brightener; the main function of the brightener is to improve the uniformity and smoothness of the electrolytic copper foil 200. The function of the brightener is to increase the reducibility of metal ions in the electroplating solution 123, making the coating brighter and denser; the brightener may be, but is not limited to, aluminates (such as aluminum sulfate, aluminum nitrate, etc.), zinc sulfate, stannous chloride, sodium carbonate, aminosulfonic acid, and sodium polydisulfane sulfonate: the hardness and wear resistance of the coating can be improved, and the appearance of the coating can also be improved.

[0228] The fourth connecting pipe 1408 may refer to a pipe connecting the fourth container 1407 and the plating solution tank 1221 .

[0229] By adopting the technical solution of this embodiment, it can be concluded from the detection results of the electrolytic copper foil 200 that when the brightener in the plating solution 123 needs to be added, the brightener in the fourth container 1407 can flow into the plating solution tank 1221 through the fourth pipe to increase the concentration of the brightener in the plating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0230] In one embodiment, the number of the fourth container 1407 can be one or more, and the fourth container 1407 is connected to the fourth connecting pipe 1408 in a one-to-one correspondence. The plurality of fourth containers 1407 can be loaded with the same brightener or different brighteners, which is specifically set according to actual conditions and is not limited here.

[0231] In one embodiment, the fourth connecting pipe 1408 is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe 1408 .

[0232] The fourth flow detection component may refer to a component used to detect the flow of the fourth connecting pipe 1408. The fourth flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0233] By adopting the technical solution of this embodiment, the amount of brightener added can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0234] In one embodiment, the electroplating solution component preparation device 140 includes a fifth container 1409 and a fifth connecting pipe 1410 . The fifth container 1409 is used to load the copper sulfate solution. The fifth connecting pipe 1410 connects the fifth container 1409 and the plating solution tank 1221 .

[0235] The fifth container 1409 may be a container capable of loading a copper sulfate solution; the main function of the copper sulfate solution is to provide copper ions and participate in the electrochemical reaction. During the electrolysis process, the copper ions in the copper sulfate solution enter the electroplating solution 123 at the anode 122, and then are reduced to pure copper (electrolytic copper) at the cathode through electrolysis.

[0236] The fifth connecting pipe 1410 may refer to a pipe connecting the fifth container 1409 and the plating solution tank 1221 .

[0237] By adopting the technical solution of this embodiment, it can be concluded from the detection results of the electrolytic copper foil 200 that when the copper sulfate solution in the electroplating solution 123 needs to be added, the copper sulfate solution in the fifth container 1409 can flow into the plating solution tank 1221 through the fifth pipe to increase the concentration of the copper sulfate solution in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0238] In one embodiment, the fifth connecting pipe 1410 is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe 1410 .

[0239] The fifth flow detection component may refer to a component used to detect the flow of the fifth connecting pipe 1410. The fifth flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0240] By adopting the technical solution of this embodiment, the addition amount of the copper sulfate solution can be accurately controlled by the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0241] In one embodiment, one end of the first connecting tube 1402 is connected to the first container 1401, one end of the second connecting tube 1404 is connected to the second container 1403, one end of the third connecting tube 1406 is connected to the third container 1405, one end of the fourth connecting tube 1408 is connected to the fourth container 1407, and one end of the fifth connecting tube 1410 is connected to the fifth container 1409. The other end of the first connecting tube 1402, the other end of the second connecting tube 1404, the other end of the third connecting tube 1406, the other end of the fourth connecting tube 1408 and the other end of the fifth connecting tube 1410 are assembled to form a group of connecting tubes and then connected to the liquid inlet of the plating tank 1221. The pipeline layout is simple and the production is simple.

[0242] In one embodiment, the electroplating solution component preparation device 140 further includes a control device, through which the components required by the electrolyte can be automatically added according to the detection results of the electrolytic copper foil 200 to achieve precise control. The specific control principle and control circuit diagram are mature technologies and will not be described in detail here.

[0243] The electrolytic copper foil preparation device 100 is described below in conjunction with some embodiments.

[0244] In this embodiment, the electrolytic copper foil preparation equipment 100 includes a pulse power supply 110 and a foil production device 120, the pulse power supply 110 has a positive electrode and a negative electrode; the foil production device 120 includes a cathode component 121 and an anode component 122, the anode component 122 is configured with a plating tank 1221 for carrying a plating solution 123, and at least a part of the cathode component 121 is located in the plating tank 1221; the positive electrode is electrically connected to the cathode component 121, and the negative electrode is electrically connected to the anode component 122; wherein, the peak current range of the pulse power supply 110 is 70kA to 200kA, and the output waveform of the pulse power supply 110 is a rectangular wave.

[0245] In this embodiment, the cathode component 121 is cylindrical, that is, the cathode component 121 is a cathode roller, and the anode plate is a semicircular plate. The semicircular plates are arranged to form a semicircular groove as a plating liquid tank 1221. The bottom of the plating liquid tank 1221 is provided with a liquid inlet for allowing the electroplating liquid 123 to flow in. The cathode roller and the semicircular plate are coaxially arranged, and the cathode roller can rotate relative to the semicircular plate to drive the plating liquid 123 to flow, so as to promote the formation of electrolytic copper foil 200.

[0246] In this embodiment, the pulse power supply 110 includes a plurality of battery cells 111, each battery cell 111 includes a cabinet and a plurality of battery modules arranged in the cabinet, the plurality of battery modules are connected in parallel, the plurality of battery cells 111 are connected in parallel, and the positive electrodes of the plurality of battery cells 111 are integratedly connected to the conductive slider of the cathode member 121 through a silver-plated copper bus 131.

[0247] In this embodiment, the electrolytic copper foil preparation equipment 100 further includes a plating solution component mixing device 140 for adjusting the concentration of at least part of the components in the plating solution 123 according to the detection result of the prepared electrolytic copper foil 200 .

[0248] In this embodiment, the electroplating solution component preparation device 140 includes a first container 1401 and a first connecting pipe 1402 . The first container 1401 is used to load the leveling agent, and the first connecting pipe 1402 connects the first container 1401 and the plating solution tank 1221 .

[0249] In this embodiment, the first connecting pipe 1402 is provided with a first flow detection member for detecting the flow of the first connecting pipe 1402 .

[0250] In this embodiment, the electroplating solution component preparation device 140 includes a second container 1403 and a second connecting pipe 1404 . The second container 1403 is used to load the wetting agent. The second connecting pipe 1404 connects the second container 1403 and the plating solution tank 1221 .

[0251] In this embodiment, the second connecting pipe 1404 is provided with a second flow detection member for detecting the flow of the second connecting pipe 1404 .

[0252] In this embodiment, the electroplating solution component preparation device 140 includes a third container 1405 and a third connecting pipe 1406 . The third container 1405 is used to load a solution containing chloride ions. The third connecting pipe 1406 connects the third container 1405 and the plating solution tank 1221 .

[0253] In this embodiment, the third connecting pipe 1406 is provided with a third flow detection member for detecting the flow of the third connecting pipe 1406 .

[0254] In this embodiment, the electroplating solution component preparation device 140 includes a fourth container 1407 and a fourth connecting pipe 1408 . The fourth container 1407 is used to load brightener, and the fourth connecting pipe 1408 connects the fourth container 1407 and the plating solution tank 1221 .

[0255] In this embodiment, the fourth connecting pipe 1408 is provided with a fourth flow detection component for detecting the flow of the fourth connecting pipe 1408 .

[0256] In this embodiment, the electroplating solution component preparation device 140 includes a fifth container 1409 and a fifth connecting pipe 1410 . The fifth container 1409 is used to load the copper sulfate solution. The fifth connecting pipe 1410 connects the fifth container 1409 and the plating solution tank 1221 .

[0257] In this embodiment, the fifth connecting pipe 1410 is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe 1410 .

[0258] In this embodiment, one end of the first connecting tube 1402 is connected to the first container 1401, one end of the second connecting tube 1404 is connected to the second container 1403, one end of the third connecting tube 1406 is connected to the third container 1405, one end of the fourth connecting tube 1408 is connected to the fourth container 1407, and one end of the fifth connecting tube 1410 is connected to the fifth container 1409. The other end of the first connecting tube 1402, the other end of the second connecting tube 1404, the other end of the third connecting tube 1406, the other end of the fourth connecting tube 1408 and the other end of the fifth connecting tube 1410 are assembled to form a group of connecting tubes and then connected to the liquid inlet of the plating liquid tank 1221. The pipeline layout is simple and the production is simple.

[0259] In another embodiment of the present application, an electrolytic copper foil 200 is provided. The electrolytic copper foil 200 is manufactured by using the electrolytic copper foil manufacturing device 100 as described in the above embodiment.

[0260] The electrolytic copper foil 200 of the embodiment of the present application is manufactured by using the electrolytic copper foil manufacturing equipment 100 described above, and the electrolytic copper foil 200 has high tensile strength and elongation.

[0261] The electric device of the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet, a laptop computer, an electric toy, an electric tool, a battery car, an electric car, a ship, a spacecraft, etc. Among them, the electric toy may include a fixed or mobile electric toy, such as a game console, an electric car toy, an electric ship toy, and an electric airplane toy, etc., and the spacecraft may include an airplane, a rocket, a space shuttle, and a spacecraft, etc.

[0262] For the convenience of description, the following embodiments are described by taking a vehicle 1000 as an example of an electrical device according to an embodiment of the present application.

[0263] Please refer to Figure 3 , Figure 3 A schematic diagram of the structure of a vehicle 1000 provided for some embodiments of the present application. The vehicle 1000 may be a fuel vehicle, a gas vehicle or a new energy vehicle, and the new energy vehicle may be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. A battery 1100 is provided inside the vehicle 1000, and the battery 1100 may be provided at the bottom, head or tail of the vehicle 1000. The battery 1100 may be used to power the vehicle 1000, for example, the battery 1100 may be used as an operating power source for the vehicle 1000. The vehicle 1000 may also include a controller 1200 and a motor 1300, and the controller 1200 is used to control the battery 1100 to power the motor 1300, for example, for starting, navigating and driving the vehicle 1000.

[0264] In some embodiments of the present application, the battery 1100 can not only serve as the operating power source of the vehicle 1000, but also serve as the driving power source of the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0265] Please refer to Figure 4 As an embodiment of the battery 1100, the battery 1100 includes a box body 10 and a battery cell 20, and the battery cell 20 is contained in the box body 10. The box body 10 is used to provide a storage space for the battery cell 20, and the box body 10 can adopt a variety of structures. In some embodiments, the box body 10 may include a first part 11 and a second part 12, and the first part 11 and the second part 12 cover each other, and the first part 11 and the second part 12 jointly define a storage space for accommodating the battery cell 20. The second part 12 may be a hollow structure with one end open, and the first part 11 may be a plate-like structure, and the first part 11 covers the open side of the second part 12, so that the first part 11 and the second part 12 jointly define a storage space; the first part 11 and the second part 12 may also be hollow structures with one side open, and the open side of the first part 11 covers the open side of the second part 12. Of course, the box body 10 formed by the first part 11 and the second part 12 may be in a variety of shapes, such as a cylinder, a cuboid, etc.

[0266] In the battery 1100 , there may be a plurality of battery cells 20 , and the plurality of battery cells 20 may be connected in series, in parallel, or in mixed connection. Mixed connection means that the plurality of battery cells 20 may be connected in series or in parallel.

[0267] In one embodiment, multiple battery cells 20 can be directly connected in series, parallel or hybrid, and then the whole formed by the multiple battery cells 20 is accommodated in the box 10; of course, the battery 1100 can also be a battery module formed by connecting multiple battery cells 20 in series, parallel or hybrid, and then the multiple battery modules are connected in series, parallel or hybrid to form a whole and accommodated in the box 10. The battery 1100 can also include other structures, for example, the battery 1100 can also include a busbar component for realizing electrical connection between the multiple battery cells 20.

[0268] Each battery cell 20 may be a secondary battery 1100 or a primary battery 1100, or a lithium-sulfur battery 1100, a sodium-ion battery 1100, or a magnesium-ion battery 1100, but is not limited thereto. The battery cell 20 may be cylindrical, flat, rectangular, or in other shapes.

[0269] As another embodiment of the battery 1100, the battery 1100 may not include the housing 10, but may be assembled into an electrical device by electrically connecting a plurality of battery cells 20 and forming a whole with necessary fixing structures.

[0270] In the present application, the battery cell 20 may include a lithium-ion secondary battery, a lithium-ion primary battery, a lithium-sulfur battery, a sodium-lithium-ion battery, a sodium-ion battery, a lithium metal battery or a magnesium-ion battery, etc., and the embodiments of the present application do not limit this. The battery cell 20 may be cylindrical, flat, rectangular or other shapes, etc., and the embodiments of the present application do not limit this. The battery cell 20 is generally divided into three types according to the packaging method: cylindrical battery cells, square battery cells and soft-pack battery cells, and the embodiments of the present application do not limit this.

[0271] The battery 1100 mentioned in the embodiments of the present application refers to a single physical module including one or more battery cells 20 to provide higher voltage and capacity. For example, the battery 1100 mentioned in the present application may include a battery module or a battery pack. The battery 1100 generally includes a box 10 for encapsulating one or more battery cells 20. The box 10 can prevent liquid or other foreign matter from affecting the charging or discharging of the battery cells 20.

[0272] In one embodiment, in combination Figure 5 and Figure 6 As shown, the battery cell 20 further includes an end cover 21 , a shell 22 and an electrode assembly 23 .

[0273] The end cap 21 refers to a component that covers the opening of the shell 22 to isolate the internal environment of the battery cell 20 from the external environment. Without limitation, the shape of the end cap 21 can be adapted to the shape of the shell 22 to match the shell 22. Optionally, the end cap 21 can be made of a material with a certain hardness and strength (such as aluminum alloy), so that the end cap 21 is not easily deformed when squeezed and collided, so that the battery cell 20 can have a higher structural strength and the safety performance can also be improved. Functional components such as electrode terminals 211 can be provided on the end cap 21. The electrode terminal 211 can be used to electrically connect with the electrode assembly 23 for outputting or inputting electrical energy of the battery cell 20. In some embodiments, the end cap 21 can also be provided with a pressure relief mechanism 212 for releasing the internal pressure when the internal pressure or temperature of the battery cell 20 reaches a threshold. The material of the end cap 21 can also be a variety of materials, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and the embodiment of the present application does not impose any special restrictions on this. In some embodiments, an insulating member may be provided inside the end cap 21, and the insulating member may be used to isolate the electrical connection components in the housing 22 from the end cap 21 to reduce the risk of short circuit. For example, the insulating member may be plastic, rubber, or the like.

[0274] The shell 22 is a component used to cooperate with the end cap 21 to form the internal environment of the battery cell 20, wherein the formed internal environment can be used to accommodate the electrode assembly 23, the electrolyte and other components. The shell 22 and the end cap 21 can be independent components, and an opening can be set on the shell 22, and the internal environment of the battery cell 20 is formed by covering the opening with the end cap 21 at the opening. Without limitation, the end cap 21 and the shell 22 can also be integrated. Specifically, the end cap 21 and the shell 22 can form a common connection surface before other components are put into the shell, and when the interior of the shell 22 needs to be encapsulated, the end cap 21 covers the shell 22. The shell 22 can be of various shapes and sizes, such as a rectangular parallelepiped, a cylindrical shape, a hexagonal prism, etc. Specifically, the shape of the shell 22 can be determined according to the specific shape and size of the electrode assembly 23. The material of the shell 22 can be various, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and the embodiment of the present application does not impose any special restrictions on this.

[0275] Combination Figure 7 and Figure 8 As shown, the electrode assembly 23 includes a positive electrode sheet 231, a negative electrode sheet 232 and a separator 233. The battery cell 20 mainly relies on the movement of metal ions between the positive electrode sheet 231 and the negative electrode sheet 232 to work. The positive electrode sheet 231 includes a positive electrode collector 2311 and a positive electrode active material layer 2312. The positive electrode active material layer 2312 is coated on the surface of the positive electrode collector 2311, and the part of the positive electrode collector 2311 that is not coated with the positive electrode active material layer 2312 is the positive electrode ear. The negative electrode sheet 232 includes a negative electrode collector 2321 and a negative electrode active material layer 2322. The negative electrode active material layer 2322 is coated on the surface of the negative electrode collector 2321, and the part of the negative electrode collector 2321 that is not coated with the negative electrode active material layer 2322 is the negative electrode ear.

[0276] In one embodiment, the material of the positive electrode current collector 2311 can be aluminum, and the material of the positive active material layer can be lithium cobalt oxide, lithium iron phosphate, ternary lithium or lithium manganese oxide, etc. The material of the negative electrode current collector 2321 can be copper, that is, the negative electrode current collector 2321 can be made of electrolytic copper foil 200, and the material of the negative active material layer can be carbon, silicon, lithium metal or lithium alloy, etc. In order to ensure that a large current passes without melting, the number of positive pole ears is multiple and stacked together, and the number of negative pole ears is multiple and stacked together. The material of the isolation film 233 can be polypropylene (PP) or polyethylene (PE), etc. In addition, the electrode assembly 23 in the embodiment of the present application includes but is not limited to a winding structure or a laminated structure.

[0277] In another embodiment of the present application, a negative electrode sheet 232 is provided, comprising the electrolytic copper foil 200 as described in the above embodiment.

[0278] It can be understood that the negative electrode current collector 2321 of the negative electrode sheet 232 adopts the electrolytic copper foil 200 described in the above embodiment.

[0279] The negative electrode sheet 232 of the embodiment of the present application adopts the electrolytic copper foil 200 mentioned above. The electrolytic copper foil 200 has high tensile strength and elongation, which is of great help to the subsequent design and development of the ultra-thin battery cell 20.

[0280] In another embodiment of the present application, a battery cell 20 is provided, comprising the negative electrode sheet 232 as described in the above embodiment.

[0281] The battery cell 20 of the embodiment of the present application adopts the above-mentioned negative electrode sheet 232, which has a significant improvement effect on the cycle life and safety of high expansion force battery cells, such as the silicon-doped system battery 1100, and can improve the expansion and fracture problem of the negative electrode sheet 232 in the late stage of the charge and discharge cycle of the battery cell 20.

[0282] In another embodiment of the present application, a battery 1100 is provided, comprising the battery cell 20 as described in the above embodiment.

[0283] The battery 1100 of the embodiment of the present application adopts the above-mentioned battery cell 20. The battery cell 20 has good performance, which is beneficial to improving the cycle life and safety of the battery 1100.

[0284] In another embodiment of the present application, an electrical device is provided, comprising the battery 1100 as described in the above embodiment.

[0285] The battery 1100 of the embodiment of the present application adopts the above-mentioned battery 1100. The battery 1100 has good performance and safety, which is beneficial to improving the reliability of the use of electrical devices.

[0286] The above description of various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other, and for the sake of brevity, they will not be repeated herein.

[0287] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. An electrolytic copper foil preparation device, characterized in that: include: A pulse power supply having a positive pole and a negative pole; The foil production device comprises a cathode component and an anode component. The anode component is provided with a plating solution tank for carrying electroplating solution. At least part of the cathode component is located in the plating solution tank. The positive electrode is electrically connected to the cathode component, and the negative electrode is electrically connected to the anode component.

2. The electrolytic copper foil preparation equipment according to claim 1, characterized in that: The peak current range of the pulse power supply is 70kA to 200kA.

3. The electrolytic copper foil preparation equipment according to claim 2, characterized in that: The peak current range of the pulse power supply is 100kA to 150kA.

4. The electrolytic copper foil preparation equipment according to any one of claims 1 to 3, characterized in that: The duty cycle of the pulse power supply ranges from 1% to 50%.

5. The electrolytic copper foil preparation equipment according to claim 4, characterized in that: The duty cycle of the pulse power supply ranges from 5% to 20%.

6. The electrolytic copper foil preparation equipment according to any one of claims 1 to 5, characterized in that: The pulse width of the pulse power supply ranges from 1 ms to 50 ms.

7. The electrolytic copper foil preparation equipment according to claim 6, characterized in that: The pulse width of the pulse power supply ranges from 10ms to 30ms.

8. The electrolytic copper foil preparation equipment according to any one of claims 1 to 7, characterized in that: The average current range of the pulse power supply is 1 kA to 50 kA.

9. The electrolytic copper foil preparation equipment according to claim 8, characterized in that: The average current range of the pulse power supply is 3kA to 20kA.

10. The electrolytic copper foil preparation equipment according to any one of claims 1 to 9, characterized in that: The peak current density of the anode element is in the range of 181A / dm 2 ~454A / dm 2 .

11. The electrolytic copper foil preparation equipment according to claim 10, characterized in that: The peak current density of the anode member is in the range of 200A / dm 2 ~240A / dm 2 .

12. The electrolytic copper foil preparation equipment according to any one of claims 1 to 11, characterized in that: The average current density of the anode member is in the range of 2A / dm 2 ~113A / dm 2 .

13. The electrolytic copper foil preparation equipment according to claim 12, characterized in that: The average current density of the anode member is in the range of 30A / dm 2 ~80A / dm 2 .

14. The electrolytic copper foil preparation equipment according to any one of claims 1 to 13, characterized in that: The output waveform of the pulse power supply is a rectangular wave.

15. The electrolytic copper foil preparation equipment according to any one of claims 1 to 14, characterized in that: The pulse power supply includes a plurality of battery cells, and the plurality of battery cells are connected in parallel.

16. The electrolytic copper foil preparation equipment according to claim 15, characterized in that: Each of the battery units includes a plurality of battery modules, and the plurality of battery modules are connected in parallel.

17. The electrolytic copper foil preparation equipment according to any one of claims 1 to 16, characterized in that: The electrolytic copper foil preparation equipment also includes a copper busbar, which is electrically connected between the positive electrode of the pulse power supply and the cathode member.

18. The electrolytic copper foil preparation equipment according to claim 17, characterized in that: The copper busbar comprises a silver-plated copper busbar, and the silver-plated copper busbar is electrically connected between the positive electrode of the pulse power supply and the cathode member.

19. The electrolytic copper foil preparation equipment according to any one of claims 1 to 18, characterized in that: The electrolytic copper foil preparation equipment also includes a plating solution component mixing device, which is used to adjust the concentration of at least part of the components in the plating solution.

20. The electrolytic copper foil preparation equipment according to claim 19, characterized in that: The electroplating solution component mixing device is used to adjust the concentration of at least part of the components in the electroplating solution according to the detection result of the prepared electrolytic copper foil.

21. The electrolytic copper foil preparation device according to claim 19 or 20, characterized in that: The electroplating solution component mixing device comprises a first container and a first connecting pipe, wherein the first container is used to load a leveling agent, and the first connecting pipe connects the first container and the plating solution tank.

22. The electrolytic copper foil preparation equipment according to claim 21, characterized in that: The first connecting pipe is provided with a first flow detection member for detecting the flow of the first connecting pipe.

23. The electrolytic copper foil preparation device according to any one of claims 19 to 22, characterized in that: The electroplating solution component preparation device also includes a second container and a second connecting pipe, wherein the second container is used to load a wetting agent, and the second connecting pipe connects the second container and the plating solution tank.

24. The electrolytic copper foil preparation equipment according to claim 23, characterized in that: The second connecting pipe is provided with a second flow detection member for detecting the flow of the second connecting pipe.

25. The electrolytic copper foil preparation device according to any one of claims 19 to 24, characterized in that: The electroplating solution component preparation device also includes a third container and a third connecting pipe. The third container is used to load a solution containing chloride ions. The third connecting pipe connects the third container and the plating solution tank.

26. The electrolytic copper foil preparation equipment according to claim 25, characterized in that: The third connecting pipe is provided with a third flow detection member for detecting the flow of the third connecting pipe.

27. The electrolytic copper foil preparation device according to any one of claims 19 to 26, characterized in that: The electroplating solution component mixing device also includes a fourth container and a fourth connecting pipe. The fourth container is used to load brightener, and the fourth connecting pipe connects the fourth container and the plating solution tank.

28. The electrolytic copper foil preparation equipment according to claim 27, characterized in that: The fourth connecting pipe is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe.

29. The electrolytic copper foil preparation device according to any one of claims 19 to 28, characterized in that: The electroplating solution component mixing device also includes a fifth container and a fifth connecting pipe. The fifth container is used to load the copper sulfate solution. The fifth connecting pipe connects the fifth container and the plating solution tank.

30. The electrolytic copper foil preparation equipment according to claim 29, characterized in that: The fifth connecting pipe is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe.

31. An electrolytic copper foil, characterized in that: The electrolytic copper foil is produced by using the electrolytic copper foil production equipment described in any one of claims 1 to 29.

32. A negative electrode sheet, characterized in that: Comprising the electrolytic copper foil as claimed in claim 31.

33. A battery cell, characterized in that: Including the negative electrode sheet as described in claim 32.

34. A battery, characterized in that: Comprising the battery cell as claimed in claim 33.

35. An electrical device, characterized in that: Comprising the battery of claim 34.

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