Electroplating equipment

Abstract

The invention provides electroplating equipment which comprises an electroplating bath, an anode assembly, a driving motor and a rotary hanging tool, the anode assembly comprises a first anode and a second anode, the second anode is arranged around the first anode, and the driving motor drives the rotary hanging tool to rotate between the first anode and the second anode with the center axis of the electroplating bath as the axis. The rotation of the rotary hanging tool is attached to the axial rotation of the output shaft of the driving motor, and the rotary hanging tool rotates around the outer side of the first anode; the rotary hanging tool rotates around the first anode under the action of the driving motor, so that the printed circuit board on the rotary hanging tool rotates in the electroplating bath by taking the central shaft as the axis, thereby realizing the dynamic position change of the surface of the printed circuit board, and effectively improving the flowability of electroplating liquid on the surface of the printed circuit board; and meanwhile, the second anodes are arranged around the first anodes to form symmetrical electric field distribution, so that the uniformity of the electroplating liquid is effectively improved, and the electroplating efficiency and the electroplating layer quality are remarkably improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electroplating process, and in particular, relates to an electroplating device. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics.

[0003] During the electroplating process of printed circuit boards, the uniformity and thickness accuracy of the electroplating layer are key factors affecting product quality. Traditional electroplating equipment uses a fixed hanger design, which leads to uneven contact time and flow state between the plating solution and the surface of the printed circuit board, resulting in significant differences in the thickness of the electroplating layer, making it difficult to meet the high requirements of printed circuit boards for electroplating uniformity. Summary of the invention

[0004] The purpose of the present application is to provide an electroplating device to solve the technical problem that in traditional equipment, due to the fixed hanger design, the contact time and flow state of the electroplating liquid with the surface of the printed circuit board are uneven, resulting in poor electroplating uniformity.

[0005] To achieve the above purpose, the specific technical solution of the electroplating equipment of this application is as follows:

[0006] An electroplating device comprising

[0007] an electroplating tank filled with an electroplating solution;

[0008] An anode assembly is arranged in the electroplating tank, the anode assembly comprises a first anode and a second anode, the first anode is arranged at the central axis position of the electroplating tank, and the second anode is arranged around the first anode;

[0009] A driving motor is arranged at one side of the electroplating tank; and

[0010] The rotating hanger is used to carry the printed circuit board to be electroplated and is arranged between the first anode and the second anode. The driving motor drives the rotating hanger to rotate between the first anode and the second anode with the central axis of the electroplating tank as the axis.

[0011] The rotation of the rotating hanger depends on the axial rotation of the output shaft of the driving motor, and the rotating hanger rotates around the outer side of the first anode.

[0012] In some embodiments of the present application, the distance between the first anode and the rotating rack is equal to the distance between the second anode and the rotating rack.

[0013] In some embodiments of the present application, the electroplating equipment further includes a jet assembly disposed in the electroplating tank, the jet assembly including:

[0014] A plurality of inner nozzles are arranged between the rotating hanger and the first anode, and the plurality of inner nozzles are arranged at intervals around the first anode;

[0015] A plurality of outer nozzles are arranged between the rotating hanger and the second anode, and the plurality of outer nozzles are arranged at intervals around the rotating hanger.

[0016] In some embodiments of the present application, the distance between each inner nozzle and the rotating hanger is equal to the distance between each outer nozzle and the rotating hanger.

[0017] In some embodiments of the present application, a plurality of first nozzles are disposed on a side of each inner nozzle tube facing the rotating hanger, and the plurality of first nozzles are disposed at intervals along the direction of the central axis of the electroplating tank;

[0018] Furthermore, a plurality of second nozzles are arranged on one side of each outer nozzle facing the rotating hanger, and the plurality of second nozzles are arranged at intervals along the direction of the central axis of the electroplating tank.

[0019] In some embodiments of the present application, a hook assembly is provided on a side of the rotating hanger close to the driving motor, and the hook assembly includes a first hook, a second hook and an arch rod connected to each other;

[0020] The arch rod is connected to the two ends of the rotating hanger on the side close to the driving motor, one end of the first hook is fixedly connected to the arch rod, and one end of the second hook is fixedly connected to the arch rod.

[0021] In some embodiments of the present application, a cross bar is provided at one end of the output shaft of the driving motor close to the hook assembly, a first groove is provided on one side of the cross bar, and a second groove is provided on the other side, the first groove is embedded in the first hook, and the second groove is embedded in the second hook.

[0022] In some embodiments of the present application, the first anode includes an anode inner cylinder, and the second anode includes a plurality of anode outer cylinders, and the plurality of anode outer cylinders are arranged around the anode inner cylinder at equal intervals.

[0023] In some embodiments of the present application, the electroplating tank includes an inner electroplating cylinder and an outer electroplating cylinder arranged outside the inner electroplating cylinder, and a heating coil and a cooling coil are arranged between the inner electroplating cylinder and the outer electroplating cylinder.

[0024] An electroplating device of the present application has the following advantages:

[0025] The rotating hanger rotates around the first anode under the action of the driving motor, so that the printed circuit board on the rotating hanger rotates around the central axis in the electroplating tank, thereby realizing the dynamic position change of the surface of the printed circuit board and effectively improving the fluidity of the electroplating solution on the surface of the circuit board; at the same time, the second anode is arranged around the first anode to form a symmetrical electric field distribution, which effectively improves the uniformity of the electroplating solution and significantly improves the electroplating efficiency and the quality of the electroplating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of the electroplating equipment of this application;

[0027] Figure 2 A top view of the electroplating equipment of the present application;

[0028] Figure 3 For this application Figure 2 Cross-sectional view of the AA surface of the electroplating equipment.

[0029] Explanation of the markings in the figure: 1. electroplating tank; 11. electroplating inner cylinder; 12. electroplating outer cylinder; 13. heating coil; 14. cooling coil; 2. anode assembly; 21. first anode; 211. anode inner cylinder; 22. second anode; 221. anode outer cylinder; 3. driving motor; 31. cross bar; 311. first groove; 312. second groove; 4. rotating hanger; 41. hook assembly; 411. first hook; 412. second hook; 413. arch rod; 5. jet assembly; 51. inner nozzle; 511. first nozzle; 52. outer nozzle; 521. second nozzle. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0031] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] like Figures 1 to 3 As shown, an electroplating device of the present application includes an electroplating tank 1, an anode assembly 2, a driving motor 3 and a rotating hanger 4; the electroplating tank 1 is filled with a plating solution, the anode assembly 2 is composed of a first anode 21 arranged on the central axis of the electroplating tank 1 and a second anode 22 surrounding the first anode 21, and the rotating hanger 4 is arranged between the first anode 21 and the second anode 22, and is used to carry a printed circuit board to be electroplated, and is driven by the driving motor 3 to rotate around the central axis of the electroplating tank 1, and the rotation of the rotating hanger 4 depends on the output shaft of the driving motor 3, and rotates around the outer side of the first anode 21.

[0035] In this embodiment, the rotating hanger 4 rotates around the first anode 21 under the action of the driving motor 3, so that the printed circuit board on the rotating hanger 4 rotates around the central axis in the electroplating tank 1, thereby realizing the dynamic position change of the surface of the printed circuit board, and effectively improving the fluidity of the electroplating solution on the surface of the circuit board; at the same time, the second anode 22 is arranged around the first anode 21 to form a symmetrical electric field distribution, which effectively improves the uniformity of the electroplating solution and significantly improves the electroplating efficiency and the quality of the electroplating layer.

[0036] In this embodiment, the first anode 21 and the second anode 22 are soluble anodes, which gradually dissolve during the electroplating process and can automatically replenish metal ions in the plating solution, thereby helping to maintain a stable metal concentration in the plating solution.

[0037] In this embodiment, the first anode 21 and the second anode 22 are insoluble anodes. Since the insoluble anodes do not dissolve and do not produce anode mud, the contamination of the electrolyte is avoided, which helps to maintain the cleanliness of the electroplating solution and improve the quality of the coating.

[0038] like Figure 1 and Figure 3As shown, the distance between the first anode 21 and the rotating hanger 4 is equal to the distance between the second anode 22 and the rotating hanger 4 .

[0039] In this embodiment, by ensuring that the distances from the first anode 21 and the second anode 22 to the rotating hanger 4 are consistent, a stable and symmetrical electric field distribution can be formed during the electroplating process, so that the current density on the surface of the printed circuit board is more uniform during the electroplating process, thereby significantly improving the uniformity and quality of the electroplated layer.

[0040] like Figures 1 to 3 As shown, the electroplating equipment also includes a jet assembly 5 arranged in the electroplating tank 1, and the jet assembly 5 includes a plurality of inner nozzles 51 and a plurality of outer nozzles 52, the plurality of inner nozzles 51 are arranged between the rotating hanger 4 and the first anode 21, and the plurality of inner nozzles 51 are arranged at intervals around the first anode 21; the plurality of outer nozzles 52 are arranged between the rotating hanger 4 and the second anode 22, and the plurality of outer nozzles 52 are arranged at intervals around the rotating hanger 4.

[0041] In this embodiment, by arranging the inner nozzle 51 and the outer nozzle 52 around the rotating hanger 4, the plating liquid can be sprayed in multiple directions to the printed circuit board on the rotating hanger 4 through the inner and outer nozzles 52, so that the plating liquid forms a uniform and continuous flow on the surface of the printed circuit board, further improving the exchange efficiency of the plating liquid.

[0042] like Figures 1 to 3 As shown, the distance between each inner nozzle 51 and the rotating hanger 4 is equal to the distance between each outer nozzle 52 and the rotating hanger 4 .

[0043] In this embodiment, by equidistantly arranging the inner and outer nozzles 52, the plating liquid can act on the surface of the printed circuit board on the rotating hanger 4 at the same speed and flow rate, so that the plating liquid jet is evenly distributed on the surface of the printed circuit board, ensuring the stability of the current density during the electroplating process, thereby improving the uniformity of the electroplating layer.

[0044] like Figures 1 to 3 As shown, each of the inner nozzles 51 is provided with a plurality of first nozzles 511 on the side facing the rotating hanger 4, and the plurality of first nozzles 511 are arranged at intervals along the direction of the central axis of the electroplating tank 1; each of the outer nozzles 52 is provided with a plurality of second nozzles 521 on the side facing the rotating hanger 4, and the plurality of second nozzles 521 are arranged at intervals along the direction of the central axis of the electroplating tank 1.

[0045] In this embodiment, the multi-point distribution design of the nozzle can ensure that the plating liquid is distributed at different height areas of the rotating hanger 4 at a uniform flow rate, further expanding the coverage of the plating liquid jet and improving the uniformity of the current density on the surface of the printed circuit board.

[0046] like Figure 1 As shown, a hook assembly 41 is provided on the side of the rotating hanger 4 close to the driving motor 3, and the hook assembly 41 includes a first hook 411, a second hook 412 and an arch rod 413 connected to each other. The arch rod 413 connects the two ends of the rotating hanger 4 close to the driving motor 3, one end of the first hook 411 is fixedly connected to the arch rod 413, and one end of the second hook 412 is fixedly connected to the arch rod 413.

[0047] In this embodiment, the hook assembly 41 cooperates with the cross bar 31 to form a two-point hook through the first hook 411 and the second hook 412, which can evenly distribute the weight and force of the rotating hanger 4 during rotation, ensuring that the rotating hanger 4 remains stable during rotation.

[0048] like Figure 1 As shown, a cross bar 31 is provided at one end of the output shaft of the driving motor 3 close to the hook assembly 41, a first groove 311 is provided on one side of the cross bar 31, and a second groove 312 is provided on the other side, the first groove 311 is embedded in the first hook 411, and the second groove 312 is embedded in the second hook 412.

[0049] In this embodiment, the first groove 311 and the second groove 312 limit the movement of the first hook 411 and the second hook 412 to prevent the rotating hanger 4 from shifting or loosening during rotation, thereby enhancing the stability of the rotating hanger 4 and allowing it to remain stable during rotation.

[0050] like Figure 1 and Figure 2 As shown, the first anode 21 includes an anode inner cylinder 211 , and the second anode 22 includes a plurality of anode outer cylinders 221 , and the plurality of anode outer cylinders 221 are arranged around the anode inner cylinder 211 at equal intervals.

[0051] In this embodiment, by designing multiple anode outer cylinders 221 surrounding the anode inner cylinder 211, a symmetrical electric field distribution can be formed, which effectively reduces the difference in thickness of the electroplating layer caused by uneven arrangement of the anodes. The multi-point surrounding design of the anode cylinder makes the distribution of the electric field in the plating solution more uniform, greatly improving the thickness consistency of the electroplating layer of the printed circuit board.

[0052] like Figures 1 to 3 As shown, the electroplating tank 1 includes an inner electroplating cylinder 11 and an outer electroplating cylinder 12 arranged outside the inner electroplating cylinder 11, and a heating coil 13 and a cooling coil 14 are arranged between the inner electroplating cylinder 11 and the outer electroplating cylinder 12 for adjusting the temperature of the electroplating solution according to demand.

[0053] In this embodiment, by arranging a heating coil 13 and a cooling coil 14 between the electroplating inner cylinder 11 and the electroplating outer cylinder 12, the temperature of the electroplating solution can be accurately controlled to ensure that the electroplating solution operates within the optimal temperature range, thereby improving the electroplating efficiency and the quality stability of the electroplating layer.

[0054] An electroplating device of the present application has the following advantages:

[0055] The rotating hanger 4 rotates around the first anode 21 under the action of the driving motor 3, so that the printed circuit board on the rotating hanger 4 rotates around the central axis in the electroplating tank 1, thereby realizing the dynamic position change of the surface of the printed circuit board and effectively improving the fluidity of the electroplating solution on the surface of the circuit board; at the same time, the second anode 22 is arranged around the first anode 21 to form a symmetrical electric field distribution, which effectively improves the uniformity of the electroplating solution and significantly improves the electroplating efficiency and the quality of the electroplating layer.

[0056] It is to be understood that the present application is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the scope protected by the present application.

Claims

1. An electroplating device, characterized in that: include An electroplating tank (1), wherein the electroplating tank (1) is filled with an electroplating solution; An anode assembly (2) is arranged in the electroplating tank (1), the anode assembly (2) comprising a first anode (21) and a second anode (22), the first anode (21) being arranged at a central axis position of the electroplating tank (1), and the second anode (22) being arranged around the first anode (21); A driving motor (3) is arranged on one side of the electroplating tank (1); as well as A rotating hanger (4) is used to carry a printed circuit board to be electroplated and is arranged between the first anode (21) and the second anode (22). The driving motor (3) drives the rotating hanger (4) to rotate between the first anode (21) and the second anode (22) with the central axis of the electroplating tank (1) as the axis. The rotation of the rotating hanger (4) is dependent on the axial rotation of the output shaft of the driving motor (3), and the rotating hanger (4) rotates around the outside of the first anode (21).

2. The electroplating equipment according to claim 1, characterized in that: The distance between the first anode (21) and the rotating hanger (4) is equal to the distance between the second anode (22) and the rotating hanger (4).

3. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment further comprises a jet assembly (5) arranged in the electroplating tank (1), wherein the jet assembly (5) comprises: A plurality of inner nozzles (51) are arranged between the rotating hanger (4) and the first anode (21), and the plurality of inner nozzles (51) are arranged at intervals around the first anode (21); A plurality of external nozzles (52) are arranged between the rotating hanger (4) and the second anode (22), and the plurality of external nozzles (52) are arranged at intervals around the rotating hanger (4).

4. The electroplating equipment according to claim 3, characterized in that: The distance between each inner nozzle (51) and the rotating hanger (4) is equal to the distance between each outer nozzle (52) and the rotating hanger (4).

5. The electroplating equipment according to claim 3, characterized in that: A plurality of first nozzles (511) are arranged on one side of each inner nozzle pipe (51) facing the rotating hanger (4), and the plurality of first nozzles (511) are arranged at intervals along the direction of the central axis of the electroplating tank (1); Furthermore, a plurality of second nozzles (521) are arranged on one side of each of the outer nozzles (52) facing the rotating hanger (4), and the plurality of second nozzles (521) are arranged at intervals along the direction of the central axis of the electroplating tank (1).

6. The electroplating equipment according to any one of claims 1 to 5, characterized in that: A hook assembly (41) is provided on one side of the rotating hanger (4) close to the driving motor (3), and the hook assembly (41) comprises a first hook (411), a second hook (412) and an arch rod (413) which are connected to each other; The arch rod (413) is connected to two ends of the rotating hanger (4) on a side close to the driving motor (3), one end of the first hook (411) is fixedly connected to the arch rod (413), and one end of the second hook (412) is fixedly connected to the arch rod (413).

7. The electroplating equipment according to claim 6, characterized in that: A cross bar (31) is provided at one end of the output shaft of the driving motor (3) close to the hook assembly (41); a first groove (311) is provided on one side of the cross bar (31) and a second groove (312) is provided on the other side; the first groove (311) is embedded in the first hook (411), and the second groove (312) is embedded in the second hook (412).

8. The electroplating equipment according to any one of claims 1 to 5, characterized in that: The first anode (21) comprises an anode inner cylinder (211), and the second anode (22) comprises a plurality of anode outer cylinders (221), wherein the plurality of anode outer cylinders (221) are arranged around the anode inner cylinder (211) at equal intervals.

9. The electroplating equipment according to any one of claims 1 to 5, characterized in that: The electroplating tank (1) comprises an electroplating inner cylinder (11) and an electroplating outer cylinder (12) arranged outside the electroplating inner cylinder (11), and a heating coil (13) and a cooling coil (14) are arranged between the electroplating inner cylinder (11) and the electroplating outer cylinder (12).

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