Optical lever detection device and detection method for Micro Led chip

Abstract

The present invention relates to the field of chip bonding quality detection, and is an optical lever detection device and detection method for Micro LED chips, comprising a sample displacement stage, a force deformation member, an optical module and a detection module, wherein the sample displacement stage is used to move a chip to be detected to a target detection position, the force deformation member comprises a clamping part, a cantilever and a probe part, and the optical module comprises a support, a fixture, a reflection prism, an aperture assembly and a laser source; in the optical lever detection device for Micro LED chips of the present invention, since the laser source emits a laser beam through the aperture assembly to the reflection prism, the laser beam is reflected by the reflection prism to the surface of the probe part, and the angle information of the light reflected from the surface of the probe part is recognized and received by the detector, so that when the deformation amount of the probe part abutting against the chip to be detected is different, the cantilever or the probe part is deformed, and the angle of the light reflected from the surface changes, and then the detector detects the contact force between the chip to be detected and the probe part according to the change in the angle of the reflected light.

Description

Technical Field

[0001] The present invention relates to the technical field of chip bonding quality detection, and in particular to an optical lever detection device and a detection method for a Micro Led chip. Background Art

[0002] With the innovative development of LED display technology, LED chip size specifications and pixel pitch are gradually moving towards micro-nano scale, making the splicing of large screen panels more flexible, interactive and easy to modularize. Panel-level MicroLed display screens have the advantages of high brightness, high contrast, low power consumption, fast response time and excellent color performance, and have gradually become the main development direction of the next generation of new display technology.

[0003] In the prior art, a Micro Led chip connection adhesion detection device and detection method with application number CN202410621892.0 is disclosed, which includes a load-carrying and transferring mechanism, which is used to load the chip to be detected and transfer the chip to be detected to a target detection position; a force deformation detection mechanism, which includes a detection probe, a deformation module and a detection module, wherein the detection probe is arranged on one side of the load-carrying and transferring mechanism, and is used to contact the chip to be detected, the deformation module is connected to the detection probe, and can sense the contact force of the detection probe and generate a corresponding deformation, the detection module is assembled with the deformation module, and is used to convert the deformation of the deformation module into a displacement; and a data analysis device, which is electrically connected to the detection module, and is used to convert the displacement obtained by the detection module into an electrical signal, thereby calculating the real-time detection connection adhesion size. However, when the deformation module is converted into displacement, the structural redundancy is large and the accuracy of the chip adhesion measurement results is not accurate enough, resulting in the inability to distinguish between the excellent, good and qualified grades of the connection between the chip and the substrate.

[0004] Therefore, on the basis of solving the bonding force measurement between the Micro Led chip and the substrate, it is necessary to further simplify the structural design and improve the accuracy of the bonding force measurement results between the chip and the substrate, so as to distinguish the excellent, good and qualified levels of the chip and substrate connection, and thus better solve the problems of uneven brightness, color deviation, pixel failure, inconsistent response time and unstable service life of the Micro Led display panel. Summary of the invention

[0005] The first object of the present invention is to provide an optical lever detection device for a Micro Led chip, aiming to solve the problem of low measurement accuracy of the bonding force between the Micro Led chip and the substrate.

[0006] To solve the above technical problems, a light lever detection device for a Micro Led chip is provided, which includes a sample displacement stage, a force deformation member, an optical module, and a detection module. The sample displacement stage is used to load the chip to be detected and move the chip to be detected to the target detection position. The force deformation member includes a clamping portion, a cantilever, and a probe head. Two ends of the cantilever are respectively connected to the clamping portion and the probe head, and the probe head abuts against the chip to be detected. The optical module includes a support member, a fixture, a reflecting prism, a diaphragm assembly, and a laser source. The fixture is connected to one end of the support member for connecting the clamping portion. The reflecting prism slides on the support member and is located above the clamping portion. The laser source is located at a position on the support member away from the reflecting prism, and the diaphragm assembly is located between the laser source and the reflecting prism. The detection module includes a monitoring camera and a detector. The monitoring camera is located above the probe head for identifying the relative position between the force deformation member and the chip to be detected, and the detector is located in the obliquely upward direction of the probe head.

[0007] Wherein, the chip to be detected is connected to the substrate to generate a bonding force. The laser source emits a laser beam through the diaphragm assembly to the reflecting prism, and the laser beam is reflected by the reflecting prism to the surface of the probe head. The angle information of the light reflected from the surface of the probe head is identified and received by the detector. When the amount of deformation of the probe head in contact with the chip to be detected is different, the angle of the light reflected from the surface of the probe head changes to detect the magnitude of the contact force between the chip to be detected and the probe head.

[0008] Further, the contact force between the probe head and the chip to be detected is denoted as F, the flexural rotation angle between the cantilever and the clamping portion is denoted as a, and the flexural rotation angle a is positively correlated with the contact force F.

[0009] Further, the bonding force between the chip to be detected and the substrate is denoted as f, the point where the laser beam hits the probe head is the light spot, the side surface of the probe head in contact with the chip to be detected is the contact surface, the horizontal distance from the light spot to the contact surface is l, and the horizontal distance from the contact surface to the cantilever is L. When 0 < F ≤ 1 / 2f, l = 2 / 3L; when 1 / 2f < F ≤ f, l = 1 / 3L.

[0010] Further, the probe head is obliquely downward connected to the end of the cantilever. The flexural rotation angle between the cantilever and the probe head is denoted as b. When 1 / 2f < F ≤ f, the flexural rotation angle b is positively correlated with the bonding force f.

[0011] Furthermore, the support member includes a limiting groove, a light guiding groove and a notch groove, the limiting groove is located at the end of the support member, the light guiding groove connects the laser source and the limiting groove, the reflecting prism slides on the limiting groove, the notch groove is connected to the bottom of the limiting groove, the clamp fixes the clamping part to one side of the limiting groove, and the notch groove is opposite to the probe part, so that the laser beam emitted by the laser source passes through the light guiding groove, the limiting groove and the notch groove to the probe part respectively.

[0012] Furthermore, the optical module also includes a first fastener and a second fastener, the first fastener is connected to the reflective prism parallel to the direction of the light guide groove, and the second fastener abuts against the reflective prism perpendicular to the direction of the light guide groove, so that the reflective prism can adjust its relative position with the limiting groove.

[0013] Furthermore, the aperture assembly includes a first aperture piece and a second aperture piece, and the first aperture piece and the second aperture piece are spaced apart and located on the light guide groove.

[0014] Furthermore, the optical lever detection device of the Micro Led chip also includes a digital terminal, and the digital terminal is electrically connected to the monitoring camera and the detector respectively.

[0015] The second object of the present invention is to provide an optical lever detection method for a Micro Led chip, aiming to solve the problem of low measurement accuracy of the bonding force between the Micro Led chip and the substrate.

[0016] In order to solve the above technical problems, a method for detecting an optical lever of a Micro Led chip is provided, which is applicable to the optical lever detection device of the above Micro Led chip, and comprises the following steps:

[0017] S1. Input the bonding force level between the chip to be tested and the substrate;

[0018] S2, installing the chip to be detected on the sample displacement stage, and controlling the sample displacement stage to drive the chip to be detected to move to a target detection position so that the probe part contacts the chip to be detected;

[0019] S3, the sample displacement stage continues to drive the chip to be detected to move toward the probe part, so that the probe part generates a squeezing force, and the squeezing force forces the force-deformable member to generate a deformation;

[0020] S4, the detection module detects the deformation of the force-deformed member and converts it into an angular displacement of the laser beam;

[0021] S5. The monitoring camera and the detector transmit the displacement of the laser beam to the digital terminal, and the digital terminal converts the angular displacement of the laser beam into an electrical signal, calculates the real-time contact force of the force-deformation component, and when the real-time contact force of the force-deformation component reaches the theoretical critical connection force between the chip to be detected and the substrate, controls the sample displacement stage to stop moving, and identifies and determines the state of the chip to be detected through the monitoring camera.

[0022] Furthermore, the contact force of the real-time force deformation member reaches the theoretical critical connection force between the chip to be detected and the substrate, including the following steps:

[0023] When the theoretical critical connection force is much larger than the real-time contact force of the force deformation member, the reflective prism is adjusted to move away from the probe part; when the real-time contact force of the force deformation member gradually approaches the theoretical critical connection force from small to large, the reflective prism is adjusted to move toward the probe part.

[0024] Implementing the embodiments of the present invention will have the following beneficial effects:

[0025] In the optical lever detection device for Micro Led chips in this embodiment, since the chip to be detected is connected to the substrate to generate a bonding force, the laser source emits a laser beam through the aperture assembly to the reflecting prism, and the laser beam is reflected by the reflecting prism to the surface of the probe part. The angle information of the light reflected from the surface of the probe part is recognized and received by the detector. Therefore, when the deformation amount of the probe part abuts against the chip to be detected is different, the cantilever or the probe part is deformed, and the angle of the light reflected from the surface changes. Then, the detector detects the contact force between the chip to be detected and the probe part according to the change in the angle of the reflected light, thereby overcoming the problem of low accuracy in measuring the bonding force between the Micro Led chip and the substrate in the prior art.

[0026] In the optical lever detection device for the Micro Led chip in this embodiment, since the support member includes a limit groove, a light guide groove and a notch groove, the limit groove is located at the end of the support member, the light guide groove connects the laser source and the limit groove, the reflective prism slides on the limit groove, the notch groove is connected to the bottom of the limit groove, and the clamp fixes the clamping part on one side of the limit groove, and the notch groove is opposite to the probe part, so that by adjusting the position of the reflective prism in the limit groove, the position of the laser reflected to the probe part is forced to change, and then the angle change of the laser reflected by the probe part is generated according to the deformation of the cantilever or the probe part.

[0027] In the optical lever detection method of the Micro Led chip in this embodiment, since the chip to be detected is installed on the sample displacement stage, the displacement stage drives the chip to be detected to move to the target detection position so that the probe part contacts the chip to be detected, and then the sample displacement stage continues to drive the chip to be detected to move toward the probe part, thereby generating an extrusion force between the probe part and the chip to be detected, and the extrusion force forces the force deformation member to produce a deformation amount, and the detection module detects the deformation amount of the force deformation member and converts it into an angular displacement amount of the laser beam, and then the monitoring camera and the detector transmit the displacement amount of the laser beam to the digital terminal, and the digital terminal converts the angular displacement amount of the laser beam into an electrical signal, calculates the real-time contact force of the force deformation member, and when the real-time contact force of the force deformation member reaches the theoretical critical connection force between the chip to be detected and the substrate, the sample displacement stage is controlled to stop moving, and the state of the chip to be detected is judged by the monitoring camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is a schematic diagram of the optical lever detection device of the Micro Led chip according to the first embodiment of the present invention;

[0030] Figure 2 Schematic diagram of the principle of the optical lever detection device of the Micro Led chip according to the first embodiment of the present invention

[0031] Figure 3 This is a schematic diagram of the structure of an optical module according to Embodiment 1 of the present invention;

[0032] Figure 4 This is an exploded schematic diagram of the optical module according to the first embodiment of the present invention;

[0033] Figure 5 This is a schematic structural diagram of a support member according to Embodiment 1 of the present invention;

[0034] Figure 6 It is a schematic structural diagram of the force deformation member according to the first embodiment of the present invention;

[0035] Figure 7 for Figure 6 A partial enlarged view of the middle A;

[0036] Figure 8 This is a flow chart of the optical lever detection method of the Micro Led chip according to the second embodiment of the present invention.

[0037] Wherein: 100, optical lever detection device; 110, sample displacement stage; 120, chip to be detected; 121, substrate; 130, force deformation member; 131, clamping part; 132, cantilever; 133, probe part; 140, optical module; 141, support member; 1411, limit groove; 1412, light guide groove; 1413, notch groove; 142, fixture; 143, reflecting prism; 144, aperture assembly; 1441, first aperture piece; 1442, second aperture piece; 145, laser source; 146, first fastener; 147, second fastener; 150, detection module; 151, monitoring camera; 152, detector; 160, digital terminal. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Example

[0041] Please refer to Figure 1-Figure 7The first embodiment of the present invention provides an optical lever detection device 100 for a Micro Led chip, comprising a sample displacement stage 110, a force deformation member 130, an optical module 140 and a detection module 150. The sample displacement stage 110 is used to load a chip to be detected 120 and move the chip to be detected 120 to a target detection position; the force deformation member 130 comprises a clamping portion 131, a cantilever 132 and a probe portion 133, the two ends of the cantilever 132 are respectively connected to the clamping portion 131 and the probe portion 133, and the probe portion 133 abuts against the chip to be detected 120; the optical module 140 comprises a support member 141, a fixture 142, a reflection prism 143, an aperture assembly 144 and a laser The light source 145 and the clamp 142 are connected to one end of the support 141 and are used to connect to the clamping part 131. The reflecting prism 143 slides on the support 141 and is located above the clamping part 131. The laser source 145 is located at a position of the support 141 away from the reflecting prism 143. The aperture assembly 144 is located between the laser source 145 and the reflecting prism 143. The detection module 150 includes a monitoring camera 151 and a detector 152. The monitoring camera 151 is located above the probe part 133 and is used to identify the relative position of the force deformation member 130 and the chip to be detected 120. The detector 152 is located in the oblique upward direction of the probe part 133.

[0042] The chip 120 to be detected is connected to the substrate 121 to generate bonding force, the laser source 145 emits a laser beam through the aperture assembly 144 to the reflecting prism 143, and the laser beam is reflected by the reflecting prism 143 to the surface of the probe part 133. The angle information of the light reflected from the surface of the probe part 133 is recognized and received by the detector 152. When the deformation amount of the probe part 133 is different when it abuts against the chip 120 to be detected, the angle of the light reflected from the surface of the probe part 133 changes to detect the contact force between the chip 120 to be detected and the probe part 133. In specific applications, Micro When the optical lever detection device 100 for LED chips is used, the bonding force between the chip to be detected 120 and the substrate 121 is first determined; the chip to be detected 120 is mounted on the sample displacement stage 110, and the sample displacement stage 110 is controlled to drive the chip to be detected 120 to move to the target detection position, so that the chip to be detected 120 and the probe part 133 collide with each other; the sample displacement stage 110 continues to drive the chip to be detected 120 to move toward the probe part 133, so that an extrusion force is generated between the two, and the extrusion force forces the deformation member 130 to produce a deformation amount, so that the probe part 133 produces an angular deflection amount, and the reflection angle of the laser beam when it is irradiated to the surface of the probe part 133 changes, and the angle information of the light reflected from the surface of the probe part 133 is recognized and received by the detector 152, Then, the force-deformation member 130 converts the deformation into the angular deflection of the laser beam, and the contact force of the force-deformation member 130 can be calculated according to the deformation of the force-deformation member 130. By comparing the contact force of the force-deformation member 130 with the theoretical critical connection force of the chip to be detected 120 and the substrate 121 (the critical connection force is the maximum external force required for the chip to be detected 120 and the substrate 121 to separate when the two have a complete welding area and the best welding strength. In this embodiment, the external force can be the squeezing force between the chip to be detected 120 and the force-deformation member 130), the welding strength between the electrode of the chip to be detected 120 and the pad on the substrate 121 can be distinguished as excellent, good, and qualified, thereby reducing the probability of uneven brightness, color deviation, pixel failure, inconsistent response time, and other problems in the Micro Led display, ensuring the overall display quality and performance, and improving the quality rate of the Micro Led display.

[0043] It is worth noting that the chip to be detected 120 in the present invention can be a single chip or a chip array unit composed of multiple chips. When the chip to be detected 120 refers to a chip array unit, it is necessary to perform a connection force test on each chip to be detected 120 in turn during the detection. At this time, there is a gap between two adjacent chips to be detected 120, and the size of the gap should be sufficient to accommodate the probe part 133 so that the probe part 133 can collide with the side of the chip to be detected 120.

[0044] It can be understood that the sample displacement stage 110 is specifically composed of an X-axis movement module, a Y-axis movement module, and a Z-axis movement module, which can drive the substrate 121 to move linearly in the positive and negative directions along the X-axis, Y-axis, and Z-axis respectively or synchronously with high precision, so as to ensure that the probe head 133 can accurately move to each gap and effectively contact different chips 120 to be detected. The sample displacement stage 110 is used to fix the substrate 121, thereby preventing the substrate 121 and the chips 120 to be detected mounted thereon from moving or rotating in the XY-axis direction due to the contact force of the probe head 133 during the test, which affects the detection result.

[0045] In a possible implementation manner, denote the contact force between the probe head 133 and the chip 120 to be detected as F, and the flexure angle between the cantilever 132 and the clamping portion 131 as α. The flexure angle α is positively correlated with the contact force F. In specific applications, the sample displacement stage 110 continues to drive the chip 120 to be detected towards the probe head 133 to generate a squeezing force between the two. The squeezing force forces the force deformation member 130 to generate a deformation amount, so that the probe head 133 generates an angular deflection amount. In this process, since the force deformation member 130 includes a clamping portion 131, a cantilever 132, and a probe head 133, both ends of the cantilever 132 are respectively connected to the clamping portion 131 and the probe head 133, and the probe head 133 abuts against the chip 120 to be detected. Therefore, the squeezing force generated between the probe head 133 and the chip 120 to be detected will force the cantilever 132 and the clamping portion 131 to form a flexure angle α, that is, the contact force F between the probe head 133 and the chip 120 to be detected is the squeezing force, and the flexure angle α increases as the contact force F increases.

[0046] In a possible implementation manner, denote the bonding force between the chip 120 to be detected and the substrate 121 as f, the point where the laser beam hits the probe head 133 as the light spot, the side surface of the probe head 133 contacting the chip 120 to be detected as the contact surface, the horizontal distance from the light spot to the contact surface as l, and the horizontal distance from the contact surface to the cantilever 132 as L. When 0 < F ≤ 1 / 2f, l = 2 / 3L; when 1 / 2f < F ≤ f, l = 1 / 3L. In specific applications, the bonding force between the chip 120 to be detected and the substrate 121 is f. During the detection process, the sample displacement stage 110 slowly drives the chip 120 to be detected towards the probe head 133. In practice, the connection strength between the chip and the substrate 121 is uneven. In order to distinguish the quality of the connection strength between the chip and the substrate 121 and improve the detection accuracy, when 0 < F ≤ 1 / 2f, l = 2 / 3L, that is, the contact force between the probe head 133 and the chip 120 to be detected is small. At this time, the deformation amount of the force deformation member 130 is mainly concentrated between the clamping portion 131 and the cantilever 132. The laser beam should be incident on the side of the probe head 133 close to the cantilever 132. In this way, the connection strength between the chip 120 to be detected and the substrate 121 can be effectively identified in batches during the continuous increase of the contact force F.

[0047] In a possible implementation manner, the probe head 133 is obliquely downwardly connected to the end of the cantilever 132. Denote the flexure angle between the cantilever 132 and the probe head 133 as b. When 1 / 2f < F ≤ f, the flexure angle b is positively correlated with the bonding force f. In specific applications, when the contact force F gradually increases and approaches f, since the flexural deformation between the clamping portion 131 and the cantilever 132 has a limit, the calculation when the contact force F is relatively large cannot be accurately recognized. That is, as the contact force F continuously increases, the flexural deformation between the clamping portion 131 and the cantilever 132 basically remains unchanged, resulting in inaccurate recognition of the strong bonding force between the identification chip and the substrate 121. Therefore, when 1 / 2f < F ≤ f, l = 1 / 3L, there is a flexure angle b between the cantilever 132 and the probe head 133, and the flexure angle b is positively correlated with the bonding force f. At this time, the deformation amount of the force deformation member 130 is not only concentrated between the clamping portion 131 and the cantilever 132, but also distributed between the cantilever 132 and the probe head 133. The laser beam should fall on the side of the probe head 133 far from the cantilever 132. In this way, a relatively large bonding force between the chip 120 to be detected and the substrate 121 can be effectively recognized.

[0048] In a possible implementation manner, the support member 141 includes a limit groove 1411, a light guide groove 1412, and a notch groove 1413. The limit groove 1411 is located at the end of the support member 141. The light guide groove 1412 connects the laser source 145 and the limit groove 1411. The reflecting prism 143 slides on the limit groove 1411. The notch groove 1413 communicates with the lower part of the limit groove 1411. The fixture 142 fixes the clamping portion 131 on one side of the limit groove 1411, and the notch groove 1413 faces the probe head 133, so that the laser beam emitted by the laser source 145 passes through the light guide groove 1412, the limit groove 1411, and the notch groove 1413 to the probe head 133. In specific applications, since the support member 141 includes a limit groove 1411, a light guide groove 1412, and a notch groove 1413, the limit groove 1411 is located at the end of the support member 141, the light guide groove 1412 connects the laser source 145 and the limit groove 1411, the reflecting prism 143 slides on the limit groove 1411, the notch groove 1413 communicates with the lower part of the limit groove 1411, the fixture 142 fixes the clamping portion 131 on one side of the limit groove 1411, and the notch groove 1413 faces the probe head 133. Thus, by adjusting the position of the reflecting prism 143 in the limit groove 1411, the position where the laser is reflected to the probe head 133 is forced to change, and further, the angle change of the laser reflected by the probe head 133 is generated according to the deformation of the cantilever 132 or the probe head 133.

[0049] In a possible implementation, the optical module 140 further includes a first fastener 146 and a second fastener 147, wherein the first fastener 146 is connected to the reflective prism 143 in a direction parallel to the light guide groove 1412, and the second fastener 147 is abutted against the reflective prism 143 in a direction perpendicular to the light guide groove 1412, so that the reflective prism 143 can adjust its relative position with respect to the limiting groove 1411. In a specific application, the first fastener 146 is first rotated to allow the reflective prism 143 to move forward or backward in the limiting groove 1411 along the direction of the light guide groove 1412, and then the second fastener 147 is rotated to fix the reflective prism 143 on the limiting groove 1411, so that the reflective prism 143 can adjust its relative position with respect to the limiting groove 1411, thereby adjusting the position of the laser beam reflected from the reflective prism 143 to the probe portion 133.

[0050] In a possible implementation, the aperture assembly 144 includes a first aperture piece 1441 and a second aperture piece 1442, and the first aperture piece 1441 and the second aperture piece 1442 are spaced apart on the light guide groove 1412. In a specific application, the laser source 145 emits a laser beam, which is respectively reduced by the first aperture piece 1441 and the second aperture piece 1442, and the first aperture piece 1441 and the second aperture piece 1442 are spaced apart on the light guide groove 1412, and is reflected by the reflection prism 143 to the reflection surface of the probe part 133, and finally the laser beam is reflected to the detector 152.

[0051] In a possible implementation, the optical lever detection device 100 of the Micro Led chip further includes a digital terminal 160, and the digital terminal 160 is electrically connected to the monitoring camera 151 and the detector 152. In a specific application, the force deformation member 130 converts the deformation into the angular displacement of the laser beam, and the monitoring camera 151 and the detector 152 transmit the displacement of the laser beam to the digital terminal 160, and the digital terminal 160 converts the angular displacement of the laser beam into an electrical signal, thereby calculating the real-time detection chip bonding force. When the real-time bonding force reaches the critical connection force, the sample displacement stage 110 is controlled to stop moving. Example

[0052] Compared with the first embodiment, the subject matter of this embodiment is different, as follows:

[0053] Please refer to Figure 8 Embodiment 2 of the present invention provides an optical lever detection method for a Micro Led chip, which is applicable to the optical lever detection device 100 of the Micro Led chip, and includes the following steps:

[0054] S1, input the bonding force level between the chip to be tested 120 and the substrate 121;

[0055] S2, installing the chip to be detected 120 on the sample displacement stage 110, and controlling the sample displacement stage 110 to move the chip to be detected 120 to a target detection position, so that the probe part 133 abuts against the chip to be detected 120;

[0056] S3, the sample displacement stage 110 continues to drive the chip to be detected 120 to move toward the probe part 133, so that the probe part 133 generates a squeezing force, and the squeezing force forces the deformable member 130 to generate a deformation;

[0057] S4, the detection module 150 detects the deformation of the force-deformable member 130 and converts it into the angular displacement of the laser beam;

[0058] S5, the monitoring camera 151 and the detector 152 transmit the displacement of the laser beam to the digital terminal 160, and the digital terminal 160 converts the angular displacement of the laser beam into an electrical signal, and calculates the real-time contact force of the force-deformation component 130. When the real-time contact force of the force-deformation component 130 reaches the theoretical critical connection force between the chip 120 to be detected and the substrate 121, the sample displacement stage 110 is controlled to stop moving, and the state of the chip 120 to be detected is identified and judged by the monitoring camera 151. In a specific application, first determine the bonding force level between the chip to be detected 120 and the substrate 121. The bonding force levels correspond to the contact force levels of the stress-deformation member 130. The bonding force levels are first, second and third levels, respectively. That is, the contact force of the stress-deformation member 130 corresponds to the bonding force levels from low to high from small to large. The first-level bonding force is used to detect the qualified rate of the welding strength between the electrode of the chip to be detected 120 and the pad on the substrate 121. The second-level bonding force is used to detect the good rate of the welding strength between the electrode of the chip to be detected 120 and the pad on the substrate 121. The third-level bonding force is used to detect the excellent rate of the welding strength between the electrode of the chip to be detected 120 and the pad on the substrate 121. Install the chip to be detected 120 on the sample displacement stage 110, and control the sample displacement stage 110 to drive the chip to be detected 120 to move The sample displacement stage 110 moves the chip 120 to the target detection position so that the chip 120 to be detected contacts the probe part 133; the sample displacement stage 110 continues to drive the chip 120 to be detected to move toward the probe part 133, so that an extrusion force is generated between the two, and the extrusion force forces the force-deformed member 130 to produce a deformation; the force-deformed member 130 converts the deformation into an angular displacement of the laser beam, and the monitoring camera 151 and the detector 152 transmit the displacement of the laser beam to the digital terminal 160, and the digital terminal 160 converts the displacement of the laser beam into an electrical signal, thereby calculating the real-time contact force of the force-deformed member 130. When the real-time contact force of the force-deformed member 130 reaches the theoretical critical connection force between the chip 120 to be detected and the substrate 121, the sample displacement stage 110 is controlled to stop moving, and the monitoring camera is used to identify and determine whether the state of the chip to be detected is normal, displaced or detached. By detecting the real-time contact force and comparing it with the theoretical critical connection force (the critical connection force is the maximum external force required for the chip to be detected 120 and the substrate 121 to separate when the two have a complete welding area and the best welding strength. In this embodiment, the external force can be the squeezing force between the chip to be detected 120 and the probe part 133), the welding strength between the electrode of the chip to be detected 120 and the pad on the substrate 121 can be distinguished as excellent, good and qualified, thereby reducing the probability of uneven brightness, color deviation, pixel failure, inconsistent response time and other problems in the Micro Led display, ensuring the overall display quality and performance, and improving the quality rate of the Micro Led display.

[0059] In a possible implementation, the contact force of the real-time force deformation member 130 reaches the theoretical critical connection force between the chip to be detected 120 and the substrate, including the following steps:

[0060] When the theoretical critical connection force is much greater than the contact force of the real-time force-deformable member 130, the reflective prism 143 is adjusted to move away from the probe part 133; when the contact force of the real-time force-deformable member 130 gradually approaches the theoretical critical connection force from small to large, the reflective prism 143 is adjusted to move toward the probe part 133. In specific applications, when the theoretical critical connection force is much greater than the contact force of the real-time force-deformable member 130, the deformation of the force-deformable member 130 is mainly concentrated between the clamping part 131 and the cantilever 132. The reflective prism 143 is adjusted to move away from the probe part 133 so that the laser beam falls on the side of the probe part 133 close to the cantilever 132, thereby effectively identifying the connection strength between the chip 120 to be detected and the substrate 121 in batches during the continuous increase in the contact force of the force-deformable member 130, and then distinguishing the welding strength between the electrode of the chip 120 to be detected and the pad on the substrate 121 The test results are as follows: the test results of the optical lever detection device 100 are as follows: when the contact force of the real-time force-deformation member 130 gradually approaches the theoretical critical connection force from small to large, the deformation of the force-deformation member 130 is concentrated between the clamping portion 131 and the cantilever 132, and is also distributed between the cantilever 132 and the probe portion 133. The reflective prism 143 is adjusted to move toward the probe portion 133 so that the laser beam falls on the side of the probe portion 133 away from the cantilever 132, thereby effectively identifying the larger bonding force between the chip 120 to be detected and the substrate 121, thereby improving the detection adaptability range of the optical lever detection device 100.

[0061] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An optical lever detection device for a Micro Led chip, characterized in that: Including: A sample displacement stage for loading a chip to be detected and moving the chip to be detected to a target detection position; A force deformation member including a clamping portion, a cantilever, and a probe head. The two ends of the cantilever are respectively connected to the clamping portion and the probe head, and the probe head abuts against the chip to be detected; An optical module including a support member, a fixture, a reflecting prism, a diaphragm assembly, and a laser source. The fixture is connected to one end of the support member for connecting the clamping portion. The reflecting prism slides on the support member and is located above the clamping portion. The laser source is located at a position on the support member away from the reflecting prism, and the diaphragm assembly is located between the laser source and the reflecting prism; A detection module including a monitoring camera and a detector. The monitoring camera is located above the probe head for identifying the relative position between the force deformation member and the chip to be detected, and the detector is located in the obliquely upward direction of the probe head; Wherein, the chip to be detected is connected to a substrate to generate a bonding force. The laser source emits a laser beam that passes through the diaphragm assembly to the reflecting prism, and the laser beam is reflected by the reflecting prism to the surface of the probe head. The angle information of the light reflected by the surface of the probe head is identified and received by the detector. When the deformation amount of the probe head in contact with the chip to be detected is different, the angle of the light reflected by the surface of the probe head changes to detect the magnitude of the contact force between the chip to be detected and the probe head.

2. The optical lever detection device of Micro Led chip according to claim 1, characterized in that: Denote the contact force between the probe head and the chip to be detected as F, the deflection angle between the cantilever and the clamping portion as a, and the deflection angle a is positively correlated with the contact force F.

3. The optical lever detection device of Micro Led chip according to claim 2, characterized in that: Denote the bonding force between the chip to be detected and the substrate as f, the point where the laser beam hits the probe head as the light spot, the side surface of the probe head in contact with the chip to be detected as the contact surface, the horizontal distance from the light spot to the contact surface as l, and the horizontal distance from the contact surface to the cantilever as L. When 0 < F ≤ 1 / 2f, l = 2 / 3L; when 1 / 2f < F ≤ f, l = 1 / 3L.

4. The optical lever detection device of Micro Led chip according to claim 3, characterized in that: The probe head is obliquely downward connected to the end of the cantilever. Denote the deflection angle between the cantilever and the probe head as b. When 1 / 2f < F ≤ f, the deflection angle b is positively correlated with the bonding force f.

5. The optical lever detection device of Micro Led chip according to any one of claims 1 to 4, characterized in that: The support member includes a limit groove, a light guide groove, and a notch groove. The limit groove is located at the end of the support member. The light guide groove communicates the laser source with the limit groove. The reflecting prism slides on the limit groove. The notch groove communicates below the limit groove. The fixture fixes the clamping portion on one side of the limit groove, and the notch groove faces the probe head, so that the laser beam emitted by the laser source passes through the light guide groove, the limit groove, and the notch groove to the probe head.

6. The optical lever detection device of Micro Led chip according to claim 5, characterized in that: The optical module further includes a first fastener and a second fastener. The first fastener is connected to the reflecting prism in the direction parallel to the light guide groove, and the second fastener abuts against the reflecting prism in the direction perpendicular to the light guide groove to adjust the relative position of the reflecting prism with respect to the limit groove.

7. The optical lever detection device of Micro Led chip according to claim 5, characterized in that: The aperture assembly includes a first aperture plate and a second aperture plate, and the first aperture plate and the second aperture plate are spaced apart and located on the light guide groove.

8. The optical lever detection device of Micro Led chip according to claim 1, characterized in that: The optical lever detection device of the MicroLed chip further comprises a digital terminal, and the digital terminal is electrically connected to the monitoring camera and the detector respectively.

9. A method for detecting an optical lever of a Micro Led chip, characterized in that: An optical lever detection device for a Micro Led chip according to any one of claims 1 to 8, comprising the steps of: S1. Input the bonding force level between the chip to be tested and the substrate; S2, installing the chip to be detected on the sample displacement stage, and controlling the sample displacement stage to drive the chip to be detected to move to a target detection position so that the probe part contacts the chip to be detected; S3, the sample displacement stage continues to drive the chip to be detected to move toward the probe part, so that the probe part generates a squeezing force, and the squeezing force forces the force-deformable member to generate a deformation; S4, the detection module detects the deformation of the force-deformed member and converts it into an angular displacement of the laser beam; S5. The monitoring camera and the detector transmit the displacement of the laser beam to the digital terminal, and the digital terminal converts the angular displacement of the laser beam into an electrical signal, calculates the real-time contact force of the force-deformation component, and when the real-time contact force of the force-deformation component reaches the theoretical critical connection force between the chip to be detected and the substrate, controls the sample displacement stage to stop moving, and identifies and determines the state of the chip to be detected through the monitoring camera.

10. The optical lever detection method of Micro Led chip according to claim 9, characterized in that: The contact force of the real-time force deformation member reaches the theoretical critical connection force between the chip to be detected and the substrate, comprising the following steps: When the theoretical critical connection force is much larger than the real-time contact force of the force deformation member, the reflective prism is adjusted to move away from the probe part; when the real-time contact force of the force deformation member gradually approaches the theoretical critical connection force from small to large, the reflective prism is adjusted to move toward the probe part.

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