Reliability testing method and reliability testing device for packaging device

Abstract

The invention relates to the technical field of wireless communication, and provides a reliability testing method and a reliability testing device for a packaging device, and the reliability testing method comprises the following steps: S1, preparing a coloring agent; s2, the test box is semi-sealed and heated, the relative humidity is kept to be lower than a preset threshold value, and the condition is maintained for 25-40 min; s3, carrying out drying treatment on the to-be-tested device; s4, a coloring agent is evaporated into the test box through a heating pipeline, the steam pressure of the test box is slowly increased to 180-210 kPa within 1 h, and the environment temperature in the test box is maintained for 30 min; and S5, after the test in the test box is performed for a preset test time, slowly reducing the steam pressure of the test box to normal pressure within 1h, moving the to-be-tested device out of the test box, and performing external dyeing path analysis and uncovering analysis on the moved-out to-be-tested device to obtain a reliability test result. The reliability test method of the packaging device is low in experiment cost and good in reliability test effect.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless communication, and in particular to a reliability testing method and a reliability testing device for a packaged device. Background Art

[0002] At present, semiconductor devices are core components in the fields of industrial automation, transportation, smart grid, new energy, etc., and their reliability research has become a hot topic for scientific research institutions and large and medium-sized high-tech enterprises. The moisture-proof reliability of semiconductor devices is a key parameter that determines their lifespan. Studies have shown that 60% of semiconductor device failures are caused by poor internal moisture-proof performance.

[0003] The relevant semiconductor device packaging detection method is generally detected by the GJB548B fluorine oil leak detection method. Since the low-boiling point fluorine oil molecules are small, even tiny leaks can be penetrated by them; if there is a leak in the electronic device, when pressure is applied, the low-boiling point fluorine oil will enter the inside of the device. Since the boiling point of low-boiling point fluorine oil is about 47°C, when exposed to high-boiling point fluorine oil of about 125°C, the low-boiling point fluorine oil will quickly vaporize, causing the pressure in the internal cavity of the device to rise sharply. Therefore, the gas coming out of the leak will form bubbles in the high-boiling point fluorine oil, which can be used as an obvious indicator of the existence of a leak.

[0004] However, the above detection method requires the use of additional imaging equipment or imaging measures to display the test results, and is only applicable to film-mounted and flip-chip packaged IC products. When there is a small leakage rate, it cannot be displayed, and the test accuracy is poor. Summary of the invention

[0005] In view of the above shortcomings of the prior art, the present invention proposes a reliability testing method for a packaged device to solve the problem of poor testing accuracy of the prior reliability testing method for a packaged device.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: In a first aspect, an embodiment of the present invention provides a reliability testing method for a packaged device, the reliability testing method comprising the following steps: S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with the chromosomes and stir evenly to prepare a stain; S2. Provide a test box, wherein the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., and the relative humidity is kept below a preset threshold for 25-40 minutes; S3, placing the device under test through the through hole into the test box and keeping it for 25-40 minutes to dry the device under test; S4, evaporating the dye into the test box through the heating pipe, making the relative humidity in the test box reach 100%, the temperature reach 120±2°C, gradually increasing the steam pressure in the test box to 180-210 kPa within 1 hour, and maintaining the ambient temperature in the test box for 30 minutes; S5. After the preset test time, gradually reduce the steam pressure in the test box to normal pressure within 1 hour, then remove the device under test from the test box, perform external dyeing path analysis and cover opening analysis on the removed device under test, and obtain reliability test results.

[0007] Preferably, in step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, wherein the mixture is formed by a mixture of tetramethylpararosaniline chloride, pentamethylpararosaniline chloride and hexamethylpararosaniline chloride.

[0008] Preferably, in step S2, the preset threshold value of the relative humidity is 10%.

[0009] Preferably, in step S2, the test box is semi-sealed and heated to 90°C, and the relative humidity is kept below the preset threshold for 30 minutes.

[0010] Preferably, in step S4, the steam pressure in the test box is gradually increased to 205 kPa within 1 hour.

[0011] Preferably, in step S5, the preset test time t satisfies the following conditions: t = 4E-17V 2 +2E-08V+4.355; Wherein, V is the volume of the internal cavity of the chip of the device under test, in um 3 ; E is the base of natural logarithm.

[0012] Preferably, the length of the internal cavity of the chip of the device under test is 300-1500um; the width of the internal cavity of the chip of the device under test is 300-1500um; and the height of the internal cavity of the chip of the device under test is 300um.

[0013] In a second aspect, an embodiment of the present invention provides a reliability testing device for a packaged device, the reliability testing device comprising: A mixing module is used to use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it into the chromosomes and stir evenly to prepare a dye; A heating module is used to provide a test box, the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., and the relative humidity is kept below a preset threshold for 25-40 minutes; A drying module, which performs drying treatment on the device under test by placing the device under test into the test box through the through hole and keeping it for 25-40 minutes; A pressurizing module, used to evaporate the dye into the test box through a heating pipe, so that the relative humidity in the test box reaches 100%, the temperature reaches 120±2°C, gradually increase the steam pressure in the test box to 180-210 kPa within 1 hour, and maintain the ambient temperature in the test box for 30 minutes; The analysis module is used to gradually reduce the steam pressure in the test box to normal pressure within 1 hour after a preset test time, then remove the device under test from the test box, perform external dyeing path analysis and cover opening analysis on the removed device under test, and obtain reliability test results.

[0014] Compared with the related art, in the embodiments of the present invention, by directly displaying under a microscope based on the tracking dye, the cost is low and the speed is high, and the path and speed of water vapor intrusion can be determined, which is beneficial to improving the dynamic detection accuracy of water vapor intrusion and fundamentally improving the moisture-proof reliability of the packaged device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings: Figure 1 A flowchart of a reliability testing method for a packaged device provided in Embodiment 1 of the present invention; Figure 2 A schematic diagram of a module of a reliability testing device for a packaged device provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0017] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Embodiment 1 See also Figure 1 As shown, an embodiment of the present invention provides a reliability testing method for a packaged device, the reliability testing method comprising the following steps: S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with the chromosomes and stir evenly to prepare a stain.

[0020] S2. Provide a test box, wherein the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., and the relative humidity is kept below a preset threshold for 25-40 minutes.

[0021] S3, placing the device under test through the through hole into the test box and keeping it for 25-40 minutes to dry the device under test.

[0022] S4. Evaporate the dye into the test box through a heating pipe, so that the relative humidity in the test box reaches 100% and the temperature reaches 120±2°C. Gradually increase the steam pressure in the test box to 180-210 kPa within 1 hour, and maintain the ambient temperature in the test box for 30 minutes.

[0023] S5. After the preset test time, gradually reduce the steam pressure in the test box to normal pressure within 1 hour, then remove the device under test from the test box, perform external dyeing path analysis and cover opening analysis on the removed device under test, and obtain reliability test results.

[0024] Among them, after the test is completed, the chamber steam pressure is slowly reduced to normal pressure within 1 hour. During the equipment control and cooling procedures, special care should be taken to prevent the tested device from being destructively depressurized. After the drop phase is over, the device is removed from the test chamber. If it needs to be stored, it is necessary to put the tested device into a sealed wet bag (without desiccant) to reduce the moisture release rate of the device. Through optical microscope observation, whether there are obvious signs of chromosome invasion around the package, dissect the package to see if there is any invasion inside, so as to better analyze the test results and improve the test accuracy.

[0025] Specifically, deionized water with a conductivity greater than 1 MΩ·cm at room temperature is used, mixed with the chromosome and stirred evenly to prepare a dye; a test box is provided, the test box is semi-sealed and heated to 90-100°C, and the relative humidity is kept below a preset threshold for 25-40 minutes; the device to be tested is placed into the test box through the through hole and kept for 25-40 minutes to dry the device to be tested; the dye is evaporated into the test box through a heating pipe, so that the relative humidity in the test box reaches 100%, the temperature reaches 120±2°C, and the steam pressure in the test box is gradually increased to 180-210 within 1 hour. kPa, maintain the ambient temperature in the test box for 30 minutes; after the preset test time, gradually reduce the steam pressure in the test box to normal pressure within 1 hour, then remove the device to be tested from the test box, perform external dyeing path analysis and lid opening analysis on the removed device to obtain reliability test results; this can be used to evaluate the reliability of non-airtight packaged IC devices in a humid environment; temperature / humidity / bias conditions are used to accelerate the penetration of moisture, which can penetrate through external protective materials (plastic packaging materials or seals), or along the interface between external protective materials and metal conductive materials, and can achieve low-cost visual airtightness analysis of semiconductor packaging. By tracking the dye, it can be directly displayed under a microscope, which is low-cost and fast, and the path and speed of water vapor intrusion can be determined, which is conducive to improving the dynamic detection accuracy of water vapor intrusion and fundamentally improving the moisture-proof reliability of packaged devices.

[0026] In this embodiment, in step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, wherein the mixture is formed by a mixture of tetramethyl pararosaniline chloride, pentamethyl pararosaniline chloride and hexamethyl pararosaniline chloride. Among them, methyl pararosaniline chloride is easily soluble in water, has bright colors and high stability. By mixing the mixture of tetramethyl pararosaniline chloride, pentamethyl pararosaniline chloride and hexamethyl pararosaniline chloride with water, the obtained dyeing agent has good dyeing effect and high clarity.

[0027] In this embodiment, in step S2, the preset threshold value of the relative humidity is 10%.

[0028] In this embodiment, in step S2, the test box is semi-sealed and heated to 90°C, and the relative humidity is kept below the preset threshold for 30 minutes, thereby improving the permeability of the dye and facilitating the observation of the packaging test analysis results.

[0029] In this embodiment, in step S4, the steam pressure in the test box is gradually increased to 205 kPa within 1 hour.

[0030] In this embodiment, in step S5, the preset test time t satisfies the following conditions: t = 4E-17V 2 +2E-08V+4.355; Wherein, V is the volume of the internal cavity of the chip of the device under test, in um 3 ; E is the base of natural logarithm.

[0031] In this embodiment, the length of the internal cavity of the chip of the device under test is 300-1500 um; the width of the internal cavity of the chip of the device under test is 300-1500 um; and the height of the internal cavity of the chip of the device under test is 300 um.

[0032] Specifically, the length of the internal cavity of the chip of the device under test is 300um; the width of the internal cavity of the chip of the device under test is 300um; the height of the internal cavity of the chip of the device under test is 300um, and the volume is 3E+07 um. 3 The pressurization time is 5h.

[0033] The length of the internal cavity of the chip of the device under test is 500um; the width of the internal cavity of the chip of the device under test is 500um; the height of the internal cavity of the chip of the device under test is 300um, and the volume is 8E+07 um 3 The pressurization time is 6h.

[0034] The length of the internal cavity of the chip of the device under test is 1000um; the width of the internal cavity of the chip of the device under test is 1000um; the height of the internal cavity of the chip of the device under test is 300um, and the volume is 3E+08 um 3 The pressurization time is 14h.

[0035] The length of the internal cavity of the chip of the device under test is 1500um; the width of the internal cavity of the chip of the device under test is 1500um; the height of the internal cavity of the chip of the device under test is 300um, and the volume is 7E+08 um 3 The pressurization time is 36h.

[0036] In summary, when the size of the device under test gradually increases, the required pressurization time also increases, so as to better dye the device under test and improve the test accuracy.

[0037] Embodiment 2 like Figure 2 As shown, an embodiment of the present invention provides a reliability testing device 200 for a packaged device, and the reliability testing device 200 includes: The mixing module 21 is used to mix deionized water with an electrical conductivity greater than 1 MΩ·cm at room temperature into the chromosomes and stir them evenly to prepare a dye.

[0038] The heating module 22 is used to provide a test box, the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., keeping the relative humidity below a preset threshold for 25-40 minutes.

[0039] The drying module 23 performs drying treatment on the device under test by placing the device under test into the test box through the through hole and keeping it for 25-40 minutes.

[0040] The pressurizing module 24 is used to evaporate the dye into the test box through the heating pipe, so that the relative humidity in the test box reaches 100% and the temperature reaches 120±2°C, gradually increase the steam pressure in the test box to 180-210 kPa within 1 hour, and maintain the ambient temperature in the test box for 30 minutes.

[0041] The analysis module 25 is used to gradually reduce the steam pressure in the test box to normal pressure within 1 hour after the preset test time, and then remove the device to be tested from the test box, and perform external dyeing path analysis and lid opening analysis on the removed device to obtain the reliability test result. This can be used to evaluate the reliability of non-airtight packaged IC devices in a humid environment; the temperature / humidity / bias conditions are used to accelerate the penetration of moisture, which can penetrate through external protective materials (plastic packaging materials or seals), or along the interface between external protective materials and metal conductive materials, and can achieve low-cost visual airtightness analysis of semiconductor packaging. By tracking the dye, it can be directly displayed under a microscope, which is low-cost and fast, and the path and speed of water vapor intrusion can be determined, which is conducive to improving the dynamic detection accuracy of water vapor intrusion and fundamentally improving the moisture-proof reliability of packaged devices.

[0042] In this embodiment, the chromosome is a solution with a concentration of 10% formed by a mixture and water, wherein the mixture is formed by a mixture of tetramethyl pararosaniline chloride, pentamethyl pararosaniline chloride and hexamethyl pararosaniline chloride. Among them, methyl pararosaniline chloride is easily soluble in water, has bright colors and high stability. By mixing the mixture of tetramethyl pararosaniline chloride, pentamethyl pararosaniline chloride and hexamethyl pararosaniline chloride with water, the obtained dyeing agent has good dyeing effect and high clarity.

[0043] In this embodiment, the preset threshold value of the relative humidity is 10%.

[0044] In this embodiment, the test box is semi-sealed and heated to 90° C., and the relative humidity is kept below the preset threshold for 30 minutes, thereby improving the permeability of the dye and facilitating the observation of the packaging test analysis results.

[0045] In this embodiment, the steam pressure in the test box is gradually increased to 205 kPa within 1 hour.

[0046] In this embodiment, the preset test time t satisfies the following conditions: t = 4E-17V 2 +2E-08V+4.355; Wherein, V is the volume of the internal cavity of the chip of the device under test, in um 3 ; E is the base of natural logarithm.

[0047] In this embodiment, the length of the internal cavity of the chip of the device under test is 300-1500um; the width of the internal cavity of the chip of the device under test is 300-1500um; the height of the internal cavity of the chip of the device under test is 300um. When the volume of the device under test is gradually increasing, the required pressurization time is also increasing, so as to better dye the device under test and improve the test accuracy.

[0048] It should be noted that the various embodiments described above with reference to the accompanying drawings are only used to illustrate the present invention rather than to limit the scope of the present invention. Those skilled in the art should understand that any modification or equivalent substitution of the present invention without departing from the spirit and scope of the present invention should be included within the scope of the present invention. In addition, unless otherwise indicated by the context, words appearing in the singular include the plural form, and vice versa. In addition, unless otherwise specified, all or part of any embodiment may be used in combination with all or part of any other embodiment.

Claims

1. A reliability testing method for a packaged device, characterized in that: The reliability testing method comprises the following steps: S1. Use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it with the chromosomes and stir evenly to prepare a stain; S2. Provide a test box, wherein the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., and the relative humidity is kept below a preset threshold for 25-40 minutes; S3, placing the device under test through the through hole into the test box and keeping it for 25-40 minutes to dry the device under test; S4, evaporating the dye into the test box through the heating pipe, making the relative humidity in the test box reach 100%, the temperature reach 120±2°C, gradually increasing the steam pressure in the test box to 180-210 kPa within 1 hour, and maintaining the ambient temperature in the test box for 30 minutes; S5. After the preset test time, gradually reduce the steam pressure in the test box to normal pressure within 1 hour, then remove the device under test from the test box, perform external dyeing path analysis and cover opening analysis on the removed device under test, and obtain reliability test results.

2. The reliability testing method of a packaged device according to claim 1, characterized in that: In step S1, the chromosome is a solution with a concentration of 10% formed by a mixture and water, wherein the mixture is formed by a mixture of tetramethylpararosaniline chloride, pentamethylpararosaniline chloride and hexamethylpararosaniline chloride.

3. The reliability testing method of a packaged device according to claim 1, characterized in that: In step S2, the preset threshold value of the relative humidity is 10%.

4. The reliability testing method of a packaged device according to claim 1, characterized in that: In step S2, the test box is semi-sealed and heated to 90°C, and the relative humidity is kept below the preset threshold for 30 minutes.

5. The reliability testing method of a packaged device according to claim 1, characterized in that: In step S4, the steam pressure in the test box is gradually increased to 205 kPa within 1 hour.

6. The reliability testing method of a packaged device according to claim 1, characterized in that: In step S5, the preset test time t satisfies the following conditions: ； Wherein, V is the volume of the internal cavity of the chip of the device under test, in um 3 ; E is the base of natural logarithm.

7. The reliability testing method of a packaged device according to claim 1, characterized in that: The length of the internal cavity of the chip of the device under test is 300-1500um; the width of the internal cavity of the chip of the device under test is 300-1500um; and the height of the internal cavity of the chip of the device under test is 300um.

8. A reliability testing device for a packaged device, characterized in that: The reliability testing device comprises: A mixing module is used to use deionized water with a conductivity greater than 1 MΩ·cm at room temperature, mix it into the chromosomes and stir evenly to prepare a dye; A heating module is used to provide a test box, the test box is provided with a through hole, and the test box is semi-sealed and heated to 90-100° C., and the relative humidity is kept below a preset threshold for 25-40 minutes; A drying module, which performs drying treatment on the device under test by placing the device under test into the test box through the through hole and keeping it for 25-40 minutes; A pressurizing module is used to evaporate the dye into the test box through a heating pipe, so that the relative humidity in the test box reaches 100%, the temperature reaches 120±2°C, gradually increase the steam pressure in the test box to 180-210 kPa within 1 hour, and maintain the ambient temperature in the test box for 30 minutes; The analysis module is used to gradually reduce the steam pressure in the test box to normal pressure within 1 hour after a preset test time, then remove the device under test from the test box, perform external dyeing path analysis and cover opening analysis on the removed device under test, and obtain reliability test results.

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