Preparation method of display device

Abstract

The invention provides a preparation method of a display device, which comprises the following steps: providing a display module, and arranging optical glue on the display module; the optical glue is cured to form an optical glue layer, the top face, away from the display module, of the optical glue layer is a flat surface, and at least one side face of the optical glue layer is a flat surface; a glass cover plate is attached to the optical adhesive layer to form the display device. The optical glue is solidified on the display module, and then the glass cover plate is attached, so that the display device without black edges locally can be manufactured, leveling preparation of the optical glue layer can be conveniently carried out, the problem that the display effect is affected due to the fact that the glue layer is uneven or burrs of the glue layer are seen from the inclined side edge of the glass cover plate is reduced, and the display effect is improved. And the display effect of the display device is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of display device manufacturing process, and in particular, relates to a method for manufacturing a display device. Background Art

[0002] In the large-size commercial display lamination industry, in order to improve the display effect and clarity of the display device, the display module and the touch control cover or glass cover are generally fully laminated with glue. Usually, the fully laminated glue layer is smaller than the glass cover and the display module, and a certain black edge area is retained.

[0003] In order to improve the display effect of the display device, the glass cover is usually partially free of black edges, and the bonding line of the glass cover is in the display area of ​​the display module. However, the use of the existing bonding method will cause uneven glue layer cut surface and glue layer burrs to be seen on the oblique side of the glass cover, affecting the display effect. Summary of the invention

[0004] The embodiment of the present application provides a method for manufacturing a display device, which can improve the flatness of the adhesive layer by improving the bonding method between the glass cover plate and the display module, thereby improving the display effect of the display device.

[0005] The present application provides a method for manufacturing a display device, comprising:

[0006] Providing a display module, and disposing optical glue on the display module;

[0007] Curing the optical glue to form an optical glue layer, wherein the top surface of the optical glue layer facing away from the display module is a flat surface, and at least one side surface of the optical glue layer is a flat surface;

[0008] A glass cover is bonded to the optical adhesive layer to form the display device.

[0009] Optionally, providing a display module, and setting optical glue on the display module includes:

[0010] Placing the display module on a carrier, wherein the projection of the display module on the carrier is located inside the carrier;

[0011] A glue scraping baffle is arranged on the carrier, and the glue scraping baffle and the display module are surrounded to form a glue storage tank;

[0012] Optical glue is poured into the glue storage tank, and a side of the optical glue facing away from the display module is scraped flat.

[0013] Optionally, after the scraping glue baffle is provided on the carrier and the scraping glue baffle and the display module are surrounded to form a glue storage tank, the preparation method further includes:

[0014] A protective tape is provided at the connection between the scraping glue blocking strip and the display module.

[0015] Optionally, before laminating the glass cover plate to the optical adhesive layer to form the display device, the preparation method further includes:

[0016] After the optical glue is cured, the protective tape and part of the optical glue material thereon are removed to form an optical glue layer with at least one side being a flat surface.

[0017] Optionally, the step of providing a scraper block strip on the carrier and making the scraper block strip and the display module surround each other to form a glue storage tank comprises:

[0018] Disposing at least a portion of the circuit board of the display module on the carrier and spaced apart from the display module;

[0019] The scraping glue baffle is arranged between the display module and the circuit board, and the scraping glue baffle is higher than the circuit board. The scraping glue baffle and the display module are surrounded to form a glue storage tank.

[0020] Optionally, before pouring the optical glue into the glue storage tank and flattening a side of the optical glue facing away from the display module, the preparation method further comprises:

[0021] An isolation layer is arranged on the display module, and the surface of the isolation layer facing away from the display module is made flat, so that the chip-on-chip film of the display module is isolated from the optical glue.

[0022] Optionally, the step of laminating a glass cover plate to the optical adhesive layer to form the display device includes:

[0023] The glass cover plate is attached to the optical adhesive layer, and in the length direction of the display module, the first end of the glass cover plate covers the display area of ​​the display module, and the edge of the first end overlaps with the edge of the optical adhesive layer, or a portion of the optical adhesive layer is exposed.

[0024] Optionally, the step of laminating a glass cover plate to the optical adhesive layer to form the display device further includes:

[0025] The glass cover plate is attached to the optical adhesive layer, so that the second end of the glass cover plate opposite to the first end covers the optical adhesive layer and the display module in the length direction of the display module, and the second end, the optical adhesive layer and the display module are surrounded to form a receiving groove;

[0026] A reinforcing adhesive is arranged in the receiving groove to bond the second end, the optical adhesive layer and the display module.

[0027] Optionally, the display module is a liquid crystal display module;

[0028] After laminating the glass cover plate to the optical adhesive layer, in the length direction of the display module, so that the first end of the glass cover plate covers the display area of ​​the display module, and the edge of the first end overlaps with the edge of the optical adhesive layer, or partially exposes the optical adhesive layer, the preparation method further includes:

[0029] A light emitting diode direct display module is placed on the exposed portion of the optical adhesive layer, and the surface of the light emitting diode direct display module facing away from the display module is flush with the surface of the glass cover plate facing away from the display module.

[0030] Optionally, before placing a light emitting diode direct display module on the exposed portion of the optical adhesive layer and making the surface of the light emitting diode direct display module facing away from the display module flush with the surface of the glass cover plate facing away from the display module, the preparation method further includes:

[0031] The semi-finished product formed by the two bonded glass cover plates, the optical adhesive layer and the display module is arranged on the same plane, and the two parts of the exposed optical adhesive layer are arranged adjacently and at intervals.

[0032] The method for preparing a display device provided in an embodiment of the present application can produce a display device without black edges in some parts by curing optical glue on a display module and then bonding a glass cover plate, and can also facilitate the flattening of the optical adhesive layer, thereby reducing the occurrence of problems such as uneven adhesive layers or burrs on the adhesive layer being seen from the oblique sides of the glass cover plate, which affect the display effect, thereby improving the display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0034] In order to more completely understand the present application and its beneficial effects, the following description will be made in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0035] Figure 1 This is a schematic diagram of the first process of the method for preparing a display device provided in an embodiment of the present application.

[0036] Figure 2This is a schematic diagram of the first preparation process of the method for preparing a display device provided in an embodiment of the present application.

[0037] Figure 3 A second schematic flow chart of the method for preparing a display device provided in an embodiment of the present application.

[0038] Figure 4 A schematic diagram of a second preparation process of the method for preparing a display device provided in an embodiment of the present application.

[0039] Figure 5 for Figure 4 A schematic diagram of the structure of part B during the preparation process of the display device.

[0040] Figure 6 A third flow chart of the method for preparing a display device provided in an embodiment of the present application.

[0041] Figure 7 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0042] Figure 8 This is a schematic diagram of the fourth process of the method for preparing a display device provided in an embodiment of the present application.

[0043] Fig. 9 A schematic diagram of a second preparation process of the method for preparing a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0045] In order to improve the flatness of the optical adhesive layer and reduce the problem of uneven cut surface and burrs of the adhesive layer being visible through the oblique side of the glass cover plate, which affects the display effect, an embodiment of the present application provides a method for preparing a display device, which will be described below in conjunction with the accompanying drawings.

[0046] See also Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of a first process of a method for manufacturing a display device provided in an embodiment of the present application. Figure 2 This is a schematic diagram of the first preparation process of the method for preparing a display device provided in an embodiment of the present application.

[0047] The present application provides a method for manufacturing a display device, comprising:

[0048] 101. Provide a display module, and set optical glue on the display module.

[0049] The display module 10 is a component in the manufacturing process of the display device 1 , and the display module 10 can be in various forms.

[0050] For example, if the display device 1 is a liquid crystal display type, the display module 10 is a form in which a color filter substrate, an array substrate and a liquid crystal are manufactured. In this case, the display device 1 also includes a backlight module (not shown in the figure), which provides a backlight source for the display module 10 and cooperates with the display module 10 to realize image display.

[0051] For another example, if the display device 1 is an organic electric laser display type, the display principle is that the organic semiconductor material and the light-emitting material, under the drive of the electric field, emit light through carrier injection and recombination. The display module 10 is composed of a cathode, an anode, an organic semiconductor material and a driving circuit. The substrate where the driving circuit is located can also be called an array substrate.

[0052] Of course, the display module 10 may also be of other types, which will not be described in detail here.

[0053] The embodiment of the present application is to bond the display module 10 to the glass cover plate 30 . Therefore, before bonding the display module 10 to the glass cover plate 30 , it is necessary to provide the completed display module 10 and the glass cover plate 30 to facilitate the subsequent bonding steps.

[0054] In the related art, in order to improve the display effect and clarity of the display device, the display module and the glass cover plate or the touch control cover plate are generally fully bonded with glue. Usually, the bonded glue layer is smaller than the glass cover plate and the display module, and a certain black edge area is retained. Among them, there are usually two ways to bond with liquid optical glue. One is wet bonding, which can achieve bonding, but the edge of the glass cover plate cannot be processed neatly, and the thickness uniformity of the glue layer is biased and uneven; the other is dry bonding. The mainstream method of dry bonding is to apply glue to the glass cover plate or the touch control cover plate. In this way, it is impossible to achieve the bonding of the structure of the glass cover plate and the glue layer, and the edge cannot be fully bonded.

[0055] Therefore, in order to realize the structural form of the staggered bonding of the glass cover plate and the adhesive layer, the embodiment of the present application provides a new bonding method, which can realize the staggered bonding of the glass cover plate 30 and the optical adhesive layer 20, that is, the edge of the glass cover plate 30 does not overlap with the edge of the optical adhesive layer 20, for example, one end of the glass cover plate 30 can protrude from the optical adhesive layer 20, and the other end of the glass cover plate 30 can be located on the optical adhesive layer 20, so as to use the same optical adhesive layer 20 to fix other components. In addition, the uniformity and edge flatness of the optical adhesive layer 20 can be ensured, and the phenomenon of uneven adhesive layer or adhesive layer burrs seen from the oblique side of the glass cover plate 30 can be reduced, which can improve the display effect of the display device 1.

[0056] In the embodiment of the present application, before the glass cover plate 30 is bonded to the display module 10, optical glue is provided on the display module 10, for example, fluid liquid optical glue is dispensed onto the display module 10, and the optical glue is scraped flat to ensure that the optical adhesive layer 20 has a flat surface after curing, thereby ensuring the display effect after bonding the glass cover plate 30.

[0057] 102. Curing the optical glue to form an optical glue layer, wherein the top surface of the optical glue layer facing away from the display module is a flat surface, and at least one side surface of the optical glue layer is a flat surface.

[0058] If the glass cover is directly bonded to the liquid optical glue, on the one hand, it is easy to cause the optical glue layer to be uneven or uneven after curing, and on the other hand, it is not convenient to position and bond the glass cover.

[0059] Therefore, before bonding the glass cover plate 30, the embodiment of the present application first solidifies the liquid optical glue. For example, the liquid optical glue and the display module 10 can be sent to a low-temperature baking oven with a baking temperature of 50°C + / - 5°C for 20 to 30 minutes to allow the optical glue to react and solidify to form an optical adhesive layer 20. The cured optical adhesive layer 20 still has a certain viscosity and elasticity, so the optical adhesive layer 20 is a solid elastomeric tape to facilitate subsequent bonding with other components.

[0060] Among them, the top surface of the cured optical adhesive layer 20 facing away from the display module 10 is a flat surface, and at least one side surface of the optical adhesive layer 20 is a flat surface, thereby improving the display effect after the glass cover plate 30 is bonded and reducing the problem of affecting the visual effect caused by the unevenness of the optical adhesive layer 20.

[0061] 103. Bond a glass cover plate to the optical adhesive layer to form a display device.

[0062] The glass cover plate 30 is bonded to the optical adhesive layer 20 , thereby achieving bonding between the glass cover plate 30 and the display module 10 , and preparing for forming a finished product of the display device 1 .

[0063] Exemplarily, during lamination, a camera CCD (Charge Coupled Device), also known as a CCD image sensor, may be used to perform positioning on the optical adhesive layer 20 , thereby achieving positioning and laminating the glass cover plate 30 on the optical adhesive layer 20 .

[0064] In the method for preparing a display device provided in an embodiment of the present application, by curing the optical glue on the display module 10 and then bonding the glass cover plate 30, a display device 1 with no black edges in some parts can be produced, and the optical adhesive layer 20 can be easily prepared for planarization, thereby reducing the occurrence of problems such as uneven adhesive layer or burrs on the adhesive layer seen from the oblique side of the glass cover plate 30 that affect the display effect, thereby improving the display effect of the display device 1.

[0065] See also Figure 3 and Figure 4 As shown, Figure 3 A second schematic diagram of the method for preparing a display device provided in an embodiment of the present application, Figure 4 A schematic diagram of a second preparation process of the method for preparing a display device provided in an embodiment of the present application.

[0066] The present application also provides a method for manufacturing a display device, including:

[0067] 201. Provide a display module.

[0068] The display module 10 is a component in the manufacturing process of the display device 1 , and the display module 10 can be in various forms.

[0069] For example, if the display device 1 is a liquid crystal display type, the display module 10 is a form in which a color filter substrate, an array substrate and a liquid crystal are manufactured. In this case, the display device 1 also includes a backlight module (not shown in the figure), which provides a backlight source for the display module 10 and cooperates with the display module 10 to realize image display.

[0070] For another example, if the display device 1 is an organic electric laser display type, the display principle is that the organic semiconductor material and the light-emitting material, under the drive of the electric field, emit light through carrier injection and recombination. The display module 10 is composed of a cathode, an anode, an organic semiconductor material and a driving circuit. The substrate where the driving circuit is located can also be called an array substrate.

[0071] Of course, the display module 10 may also be of other types, which will not be described in detail here.

[0072] The embodiment of the present application is to bond the display module 10 to the glass cover plate 30 . Therefore, before bonding the display module 10 to the glass cover plate 30 , it is necessary to provide the completed display module 10 and the glass cover plate 30 to facilitate the subsequent bonding steps.

[0073] 202. Place the display module on a carrier, and the projection of the display module on the carrier is located inside the carrier.

[0074] 203. A glue scraping baffle is arranged on the carrier, and the glue scraping baffle and the display module are surrounded to form a glue storage tank.

[0075] Regarding steps 202 and 203:

[0076] Since the optical glue is in liquid form and has a certain fluidity, in order to enable the liquid optical glue to be stored and subsequently cured, the embodiment of the present application is provided with a scraper strip 50 to block the flow of the liquid optical glue. In order to facilitate the placement of the scraper strip 50, the embodiment of the present application is also provided with a carrier 40, which is used to carry the display module 10 and the scraper strip 50. The carrier 40 has a flat surface. For example, the material of the carrier 40 can be glass to reduce the occurrence of instability when making the display device 1. During the preparation process, the display module 10 is placed on the carrier 40, wherein the area of ​​the display module 10 is smaller than the area of ​​the carrier 40, or the projection of the display module 10 on the carrier 40 is located within the carrier 40, so as to facilitate the placement of the scraper strip 50 on the carrier 40, or to reserve space for the scraper strip 50 and other components.

[0077] Afterwards, a scraping glue stopper 50 is arranged on the carrier 40, and the scraping glue stopper 50 and the display module 10 are surrounded to form a glue storage tank 51. The thickness of the scraping glue stopper 50 is greater than the thickness of the display module 10, so as to form a structure with a glue storage tank 51, which is convenient for the production of the optical adhesive layer 20. The scraping glue stopper 50 can be an annular structure, the inner circle shape is adapted to the shape of the display module 10, and the inner circle of the scraping glue stopper 50 abuts against the periphery of the display module 10 to reduce the problem of optical glue leaking to the side of the display module 10.

[0078] The display device 1 further includes a circuit board 60 , which is electrically connected to the display module 10 . A chip and various electrical components are integrated on the circuit board 60 to control the display module 10 .

[0079] In the related art, the distance between the circuit board and the display module is relatively close, but it is not conducive to the arrangement of the scraping glue stop strip 50 .

[0080] Therefore, in the embodiment of the present application, at least a portion of the circuit board 60 is disposed on the carrier 40 and is spaced apart from the display module 10 . The spacing distance between the circuit board 60 and the display module 10 is greater than the thickness of the scraper strip 50 , so as to facilitate the placement of the scraper strip 50 between the circuit board 60 and the display module 10 .

[0081] The scraper strip 50 is higher than the circuit board 60. By limiting the height of the circuit board 60 to be lower than the display module 10 and the optical adhesive layer 20 on the display module 10, interference when setting other components such as the glass cover 30 can be reduced. If the circuit board is too high, even exceeding the height of the optical adhesive layer, when setting other components such as a splicing screen in the later stage, in order to ensure the flushness of other components such as the splicing screen and the glass cover, the circuit board may be crushed, or the components on the circuit board such as the splicing screen may be damaged.

[0082] Exemplarily, an isolation layer 70 may be provided on the display module 10, and the isolation layer 70 is used to protect the chip-on-chip film on the display module 10 and reduce the influence of the optical glue on the chip-on-chip film. The surface of the isolation layer 70 away from the display module 10 is a flat surface, so as to form a uniform optical glue layer on the isolation layer 70.

[0083] 204. Provide a protective tape at the connection between the scraper strip and the display module.

[0084] Please refer to Figure 5 , Figure 5 for Figure 4 Schematic diagram of the structure of part B during the preparation process of the display device. Since the scraper strip 50 and the display module 10 are both solid materials, after the two are in contact, it is still easy for liquid optical glue to flow into the gap at the connection between the scraper strip 50 and the display module 10. In order to reduce the glue leakage phenomenon, the embodiment of the present application also provides a protective tape 80 at the connection between the scraper strip 50 and the display module 10. The protective tape 80 is Z-shaped to prevent the optical glue from leaking. The protective tape 80 can extend to the junction of the display area and the non-display area of ​​the display module 10, or the protective tape 80 is set to the non-display area, and the above-mentioned isolation layer 70 can be set to the non-display area of ​​the display module 10 to protect the chip-on-chip film in the non-display area of ​​the display module 10.

[0085] 205. Pour the optical glue into the glue storage tank, and scrape the side of the optical glue facing away from the display module.

[0086] In the related art, in order to improve the display effect and clarity of the display device, the display module and the glass cover plate or the touch control cover plate are generally fully bonded with glue. Usually, the bonded glue layer is smaller than the glass cover plate and the display module, and a certain black edge area is retained. Among them, there are usually two ways to bond with liquid optical glue. One is wet bonding, which can achieve bonding, but the edge of the glass cover plate cannot be processed neatly, and the thickness uniformity of the glue layer is biased and uneven; the other is dry bonding. The mainstream method of dry bonding is to apply glue to the glass cover plate or the touch control cover plate. In this way, it is impossible to achieve the bonding of the structure of the glass cover plate and the glue layer, and the edge cannot be fully bonded.

[0087] Therefore, in order to realize the structural form of staggered bonding of the glass cover plate and the adhesive layer, the embodiment of the present application provides a new bonding method, which can realize the staggered bonding of the glass cover plate 30 and the optical adhesive layer 20, and can ensure the uniformity and edge flatness of the optical adhesive layer 20, reduce the phenomenon of uneven adhesive layer or burrs on the adhesive layer seen from the oblique side of the glass cover plate 30, and improve the display effect of the display device 1.

[0088] In the embodiment of the present application, optical glue is provided on the display module 10 before bonding, for example, fluid liquid optical glue is dispensed onto the display module 10, that is, poured into the glue storage tank 51, and the optical glue is scraped flat to ensure that the optical adhesive layer 20 has a flat surface after curing, thereby ensuring the display effect after bonding the glass cover plate 30.

[0089] If the glass cover is directly bonded to the liquid optical glue, on the one hand, it is easy to cause the optical glue layer to be uneven or uneven after curing, and on the other hand, it is not convenient to position and bond the glass cover.

[0090] Therefore, before bonding the glass cover 30, the embodiment of the present application first solidifies the liquid optical glue. For example, the liquid optical glue and the display module 10 can be sent to a low-temperature baking oven with a baking temperature of 50°C + / - 5°C for 20 to 30 minutes to allow the optical glue to react and solidify to form an optical adhesive layer 20. At this time, the optical adhesive layer 20 is in the form of a solid elastomeric tape to facilitate subsequent bonding with other components.

[0091] Among them, the top surface of the cured optical adhesive layer 20 facing away from the display module 10 is a flat surface, and at least one side surface of the optical adhesive layer 20 is a flat surface, thereby improving the display effect after the glass cover plate 30 is bonded and reducing the problem of affecting the visual effect caused by the unevenness of the optical adhesive layer 20.

[0092] 206. After the optical glue is cured, remove the protective tape and part of the optical glue material thereon to form an optical glue layer with at least one side being a flat surface.

[0093] The flatness of the top surface of the optical adhesive layer 20 is achieved by scraping the surface of the liquid optical glue, and the flatness of the side surface of the optical adhesive layer 20 is formed by removing the protective tape 80 and part of the optical adhesive material thereon after the optical glue is cured to form an optical adhesive layer 20 with at least one side being a flat surface.

[0094] The protective tape 80 and part of the optical adhesive material thereon can be removed by pulling or cutting with a knife to form an optical adhesive layer 20 of a set size.

[0095] Before removing the protective tape 80 , the scraper strip 50 may be removed to facilitate the cutting operation.

[0096] 207. Bond the glass cover plate to the optical adhesive layer to form a display device.

[0097] The glass cover plate 30 is bonded to the optical adhesive layer 20 , thereby achieving bonding between the glass cover plate 30 and the display module 10 , and preparing for forming a finished product of the display device 1 .

[0098] During lamination, a camera CCD (Charge Coupled Device), also known as a CCD image sensor, may be used to position the optical adhesive layer 20 , thereby achieving positioning and laminating the glass cover plate 30 on the optical adhesive layer 20 .

[0099] The carrier 40 may be removed after the glass cover 30 is attached to the optical adhesive layer 20 , or may be removed after the optical adhesive layer 20 is formed, which is not specifically limited here.

[0100] The glass cover plate 30 is attached to the optical adhesive layer 20, and the glass cover plate 30 and the optical adhesive layer 20 are staggered. Figures 3 to 5 Also see Figure 6 As shown, Figure 6 The third process diagram of the method for preparing a display device provided in the embodiment of the present application is shown in FIG. The embodiment of the present application also provides a method for preparing a display device, comprising:

[0101] 301. Attach a glass cover plate to the optical adhesive layer, so that the first end of the glass cover plate covers the display area of ​​the display module in the length direction of the display module, and the edge of the first end overlaps with the edge of the optical adhesive layer, or partially exposes the optical adhesive layer.

[0102] The glass cover plate 30 of the embodiment of the present application can be offset from at least one end of the optical adhesive layer 20 to facilitate the production of a spliced ​​screen. That is, the display device 1 is in a spliced ​​form. The spliced ​​screen formed by bonding the glass cover plate 30 of the embodiment of the present application to the display module 10 can reduce problems such as black line seams in the display effect caused by splicing.

[0103] The glass cover plate 30 is attached to the optical adhesive layer 20, so that the first end 31 of the glass cover plate 30 covers the display area of ​​the display module 10 in the length direction X of the display module 10, and the edge of the first end 31 coincides with the edge of the optical adhesive layer 20 (such as Figure 7 As shown in Figure 7 Schematic diagram of a structure of a display device provided in an embodiment of the present application. ), or partially exposing the optical adhesive layer 20 (such as Figure 4 ).

[0104] The first end portion 31 overlaps with the edge of the optical adhesive layer 20 , so that a display device 1 without black edges can be manufactured, and the display seams can be reduced in a spliced ​​screen.

[0105] After the first end 31 is set, part of the optical adhesive layer 20 is exposed, that is, at least part of the display area of ​​the display module 10 can be exposed from the glass cover 30, so that other display modules can be spliced ​​with the display module 10, so that display can also be performed at the splicing joint, thereby improving the display effect of the spliced ​​screen.

[0106] 302. Attach the glass cover plate to the optical adhesive layer, so that the second end of the glass cover plate opposite to the first end covers the optical adhesive layer and the display module in the length direction of the display module, and the second end, the optical adhesive layer and the display module are surrounded to form a receiving groove.

[0107] In the length direction X of the display module 10 , the second end 32 of the glass cover 30 opposite to the first end 31 covers the optical adhesive layer 20 and the display module 10 , so that the edge of the display device 1 can reserve space for placing circuits, thereby improving space utilization.

[0108] The optical adhesive layer 20 is shorter than the display module 10, and the second end 32 of the glass cover 30 extends out of the display module 10 to reserve space for other devices. Specifically, the second end 32, the optical adhesive layer 20 and the display module 10 are surrounded by a receiving groove 33, which is used to receive components such as reinforcing glue.

[0109] 303. Dispose reinforcing glue in the receiving groove to bond the second end, the optical glue layer and the display module.

[0110] In order to strengthen the bonding firmness of the second end 32, the optical adhesive layer 20 and the display module 10, a reinforcing adhesive 90 is further provided in the receiving groove 33 in the embodiment of the present application. The reinforcing adhesive 90 is used to bond the second end 32, the optical adhesive layer 20 and the display module 10, thereby improving the bonding firmness between the three, reducing problems such as tearing between the three, and improving the display effect of the display device 1.

[0111] In the method for preparing a display device provided in the embodiment of the present application, by curing the optical glue on the display module 10 and then laminating the glass cover plate 30, a display device 1 without a black border in part can be produced, and the flattening preparation of the optical adhesive layer 20 can be facilitated, reducing the occurrence of problems such as uneven adhesive layer or burrs on the adhesive layer seen from the oblique side of the glass cover plate 30, which affect the display effect, thereby improving the display effect of the display device 1. Among them, the use of the protective tape 80 can prevent glue leakage, and can also play a role in forming the optical adhesive layer 20 of a set size, and can improve the flatness of the optical adhesive layer 20, reducing the impact on the display effect.

[0112] Please combine Figures 1 to 7 Also see Figure 8 and Fig. 9 As shown, Figure 8 A fourth process diagram of the method for preparing a display device provided in an embodiment of the present application is shown in FIG. Fig. 9 A schematic diagram of a second preparation process of the method for preparing a display device provided in an embodiment of the present application.

[0113] The display device 1 of the embodiment of the present application may be in a spliced ​​form. To this end, the embodiment of the present application further provides a method for preparing the display device, including:

[0114] 401. Arrange the semi-finished product formed by two bonded glass cover plates, optical adhesive layers and display modules on the same plane, and arrange the two parts of the exposed optical adhesive layers adjacently and at intervals.

[0115] The display device 1 of the embodiment of the present application is in a spliced ​​form, and the component formed by the bonded glass cover plate 30, the optical adhesive layer 20 and the display module 10 is called a semi-finished product 100 as a whole. Two semi-finished products are placed on the same plane, and the two parts of the exposed optical adhesive layer 20 are adjacent and spaced apart.

[0116] Exemplarily, the display module 10 is in the form of liquid crystal, that is, the display module 10 includes a color film substrate, an array substrate and liquid crystal.

[0117] It can be understood that the display device 1 of the embodiment of the present application is of a liquid crystal display type as a whole. Therefore, during the splicing process, two semi-finished products 100 in liquid crystal form are placed on the same plane, and another display module is placed between the two to reduce the splicing seams caused by the two semi-finished products 100 in liquid crystal form that affect the display effect.

[0118] 402. Place a light emitting diode direct display module on the exposed portion of the optical adhesive layer, and make the surface of the light emitting diode direct display module facing away from the display module flush with the surface of the glass cover plate facing away from the display module.

[0119] The LED direct display module 200 is placed between the two semi-finished products 100, that is, on the two exposed parts of the optical adhesive layer 20, and the surface of the LED direct display module 200 facing away from the display module 10 is flush with the surface of the glass cover plate 30 facing away from the display module 10, thereby improving the appearance flatness of the spliced ​​display device 1.

[0120] Among them, the light-emitting diode direct display module 200 is a small module that can directly display, that is, a device including a driving circuit. The light-emitting diode direct display module 200 is placed between two spliced ​​semi-finished products 100 to cover the seam between the two spliced ​​semi-finished products 100 to achieve a seamless display display device 1.

[0121] Furthermore, compared with a liquid crystal display type display module, the LED direct display module 200 can save costs and reduce the complexity of electrical connection and control between the LED direct display module 200 and the semi-finished product 100 .

[0122] In the preparation method of the display module provided in the embodiment of the present application, by first curing and bonding the optical glue to the display module 10, and then performing staggered bonding between the glass cover plate 30 and the optical adhesive layer 20, the flatness of the optical adhesive layer 20 can be improved, and the impact on the display effect of the spliced ​​screen can be reduced; and, the optical adhesive layer 20 of the liquid crystal display module of two semi-finished products 100 is used to bond the light-emitting diode direct display module 200, without setting up other connecting structures, and the optical adhesive layer 20 of the semi-finished product 100 is reused, thereby simplifying the connection between the light-emitting diode direct display module 200 and the semi-finished product 100, and truly achieving seamless splicing.

[0123] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0124] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0125] The above is a detailed introduction to the preparation method of the display device provided in the embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a display device, characterized in that: include: Providing a display module, and disposing optical glue on the display module; Curing the optical glue to form an optical glue layer, wherein the top surface of the optical glue layer facing away from the display module is a flat surface, and at least one side surface of the optical glue layer is a flat surface; A glass cover is bonded to the optical adhesive layer to form the display device.

2. The preparation method according to claim 1, characterized in that: The method provides a display module, and sets optical glue on the display module, including: Placing the display module on a carrier, wherein the projection of the display module on the carrier is located inside the carrier; A glue scraping baffle is arranged on the carrier, and the glue scraping baffle and the display module are surrounded to form a glue storage tank; Optical glue is poured into the glue storage tank, and a side of the optical glue facing away from the display module is scraped flat.

3. The preparation method according to claim 2, characterized in that: After the scraping glue baffle is arranged on the carrier and the scraping glue baffle and the display module are surrounded to form a glue storage tank, the preparation method further includes: A protective tape is provided at the connection between the scraping glue blocking strip and the display module.

4. The preparation method according to claim 3, characterized in that: Before laminating the glass cover plate onto the optical adhesive layer to form the display device, the preparation method further includes: After the optical glue is cured, the protective tape and part of the optical glue material thereon are removed to form an optical glue layer with at least one side being a flat surface.

5. The preparation method according to claim 2, characterized in that: The method of arranging a scraping glue baffle on the carrier and making the scraping glue baffle and the display module surround each other to form a glue storage tank comprises: Disposing at least a portion of the circuit board of the display module on the carrier and spaced apart from the display module; The scraping glue baffle is arranged between the display module and the circuit board, and the scraping glue baffle is higher than the circuit board. The scraping glue baffle and the display module are surrounded to form a glue storage tank.

6. The preparation method according to claim 2, characterized in that: Before pouring the optical glue into the glue storage tank and flattening the side of the optical glue facing away from the display module, the preparation method further comprises: An isolation layer is arranged on the display module, and the surface of the isolation layer facing away from the display module is made flat, so that the chip-on-chip film of the display module is isolated from the optical glue.

7. The preparation method according to any one of claims 1 to 6, characterized in that: The step of laminating the glass cover plate to the optical adhesive layer to form the display device comprises: The glass cover plate is attached to the optical adhesive layer, and in the length direction of the display module, the first end of the glass cover plate covers the display area of ​​the display module, and the edge of the first end overlaps with the edge of the optical adhesive layer, or a portion of the optical adhesive layer is exposed.

8. The preparation method according to claim 7, characterized in that: The step of laminating the glass cover plate to the optical adhesive layer to form the display device further includes: The glass cover plate is attached to the optical adhesive layer, so that the second end of the glass cover plate opposite to the first end covers the optical adhesive layer and the display module in the length direction of the display module, and the second end, the optical adhesive layer and the display module are surrounded to form a receiving groove; A reinforcing adhesive is arranged in the receiving groove to bond the second end, the optical adhesive layer and the display module.

9. The preparation method according to claim 7, characterized in that: The display module is a liquid crystal display module; After laminating the glass cover plate to the optical adhesive layer, in the length direction of the display module, so that the first end of the glass cover plate covers the display area of ​​the display module, and the edge of the first end overlaps with the edge of the optical adhesive layer, or partially exposes the optical adhesive layer, the preparation method further includes: A light emitting diode direct display module is placed on the exposed portion of the optical adhesive layer, and the surface of the light emitting diode direct display module facing away from the display module is flush with the surface of the glass cover plate facing away from the display module.

10. The preparation method according to claim 9, characterized in that: Before placing a light emitting diode direct display module on the exposed portion of the optical adhesive layer and making the surface of the light emitting diode direct display module facing away from the display module flush with the surface of the glass cover plate facing away from the display module, the preparation method further includes: The semi-finished product formed by the two bonded glass cover plates, the optical adhesive layer and the display module is arranged on the same plane, and the two parts of the exposed optical adhesive layer are arranged adjacently and at intervals.

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