Computer board system

Abstract

The application discloses a computer board card system and belongs to the technical field of BMC management.The computer board card system comprises a mainboard circuit, a host computer and a plurality of BMC management circuits connected with the board card circuit and the host computer respectively.The mainboard circuit comprises a plurality of function modules connected with each other, and the plurality of BMC management circuits correspond to the plurality of function modules one by one.The function module is used for acquiring state information of the function module based on driving information of the function module, and adjusting the running mode of the function module in response to an adjusting instruction.The BMC management circuit is used for acquiring the state information of the corresponding function module, analyzing and diagnosing the state information to obtain a diagnosis result, determining an adjusting instruction corresponding to the diagnosis result, receiving configuration information sent by the host computer and performing configuration.The host computer is used for analyzing the state information and the diagnosis result of the plurality of BMC management circuits, and generating configuration information of each BMC management circuit.The system greatly reduces the failure rate of the BMC management circuit and improves the stability of the computer board card circuit system.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of BMC management, and particularly relates to a computer board card system. BACKGROUND

[0002] As a key component in modern servers and computing devices, the management and monitoring functions of the BMC (Baseboard Management Controller) management circuit have been significantly developed in recent years.

[0003] Modern computer systems need to monitor hardware status in real time, and the BMC management circuit needs to process data from multiple sensors such as temperature, fan speed, and voltage to ensure that the system runs in the best state. With the rapid iteration of computer devices, especially in the development of cloud computing, big data, artificial intelligence, and other fields, the requirements for the BMC management circuit to process data have significantly increased.

[0004] In related technologies, new generations of processing chips are continuously developed to improve the processing speed of the BMC management circuit. However, in high-load and high-speed running scenarios, due to the inevitable performance bottleneck of the chip itself, the BMC management circuit is prone to failure when processing complex monitoring data or management requests, and the stability is low. SUMMARY

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a computer board card system, which greatly reduces the failure rate of the BMC management circuit and improves the stability of the computer board card circuit system.

[0006] In a first aspect, the present application provides a computer board card system, comprising:

[0007] a mainboard circuit and an upper computer, and a plurality of BMC management circuits connected with the board card circuit and the upper computer respectively;

[0008] The mainboard circuit comprises a plurality of functional modules connected with each other, and the plurality of BMC management circuits correspond to the plurality of functional modules one by one;

[0009] The functional module is configured to obtain state information of the functional module based on driving information of the functional module, and adjust the running mode of the functional module in response to an adjustment instruction;

[0010] The BMC management circuit is configured to obtain state information of the corresponding functional module, analyze and diagnose the state information to obtain a diagnosis result, and determine the adjustment instruction corresponding to the diagnosis result; receive configuration information sent by the upper computer and perform configuration;

[0011] The host computer is used to analyze the status information and diagnostic results of the plurality of BMC management circuits and generate the configuration information of each BMC management circuit.

[0012] According to one embodiment of this application, the host computer is further configured to:

[0013] Extract the current temperature, current voltage, current load, and current fault occurrence frequency from the status information of each functional module;

[0014] The current temperature, current voltage, current load, and current fault occurrence frequency are analyzed and diagnosed respectively to determine temperature score, voltage score, load score, and historical performance score, wherein the historical performance score is obtained through time decay;

[0015] Based on the temperature score, voltage score, load score, and historical performance score, a comprehensive status score is obtained for each of the functional modules.

[0016] Based on the comprehensive status score and the diagnostic results, the configuration information for each BMC management circuit is generated.

[0017] According to one embodiment of this application,

[0018] The overall status score C of the functional module is:

[0019]

[0020] Among them, S min For the minimum nonlinear score, S max For the maximum non-linear score, K is the scaling factor;

[0021] The nonlinear score S of the functional module is:

[0022]

[0023] Wherein, α, β, γ, and δ are the weighting coefficients for temperature score T, voltage score V, load score L, and historical performance score H, respectively.

[0024] Temperature rating T is:

[0025]

[0026] Among them, P T The penalty factor for temperature score T, T current T represents the current temperature. normal Normal temperature, T max Maximum permissible temperature;

[0027] The voltage rating V is:

[0028]

[0029] Among them, P V V is the penalty factor for the voltage score V. current V is the current voltage. max For the maximum allowable voltage, V min For the minimum allowable voltage, V critical This is a critical voltage;

[0030] The load score L is:

[0031]

[0032] Among them, P L L is the penalty factor for the load score L. current For the current load, L max For normal maximum load, L critical For critical loads;

[0033] Historical performance rating H is:

[0034]

[0035] Where μ is the time decay factor, t is time, and P H The penalty factor for historical performance score H, where F is the current failure frequency. max This is the maximum allowed failure frequency of the functional module.

[0036] According to one embodiment of this application, the host computer is further configured to:

[0037] Extract module state features from the state information of each functional module;

[0038] A state vector for each functional module is constructed based on the comprehensive state score, the module state characteristics, and the diagnostic results.

[0039] The state vectors are sequentially input into the information prediction model to obtain the configuration information of each BMC management circuit output by the information prediction model.

[0040] According to one embodiment of this application, the information prediction model is obtained by training training samples based on time series, the training samples include sample module state features and configuration information labels, and the sample module state features are timestamped.

[0041] According to one embodiment of this application, the plurality of functional modules include: a computer module, a serial interface module, a reflective memory module, a power supply module, and a network module, wherein the processing chip of the BMC management circuit is determined based on the management requirements of the functional module corresponding to the BMC management circuit;

[0042] The processing chip corresponding to the computer module is an Intel BMC series chip or an ASPEED AST2400 / AST2500 chip;

[0043] The processing chip corresponding to the serial interface module is a Texas Instruments Tiva C series chip or an STMicroelectronics STM32 series chip.

[0044] The processing chip corresponding to the reflection memory module is a Texas Instruments TMS320C67x series chip or a Xilinx Zynq series chip.

[0045] The processing chip corresponding to the power module is an NXP LPC series chip, a Microchip MCP series chip, or a Renesas ISL series chip.

[0046] The processing chip corresponding to the network module is either an NXP / Freescale i.MX series chip or an ASPEED AST series chip.

[0047] According to one embodiment of this application, the functional module is further configured to generate alarm information based on the diagnostic results;

[0048] The BMC management circuit is also used for:

[0049] Based on the polling cycle, the functional modules corresponding to the BMC management circuit are polled. If it is determined that the functional module generates the alarm information in three consecutive polling cycles, the alarm information is queried in the event log.

[0050] If the query result is empty, the alarm information will be recorded in the event log.

[0051] According to one embodiment of this application, the BMC management circuit is further configured to:

[0052] Based on the status information, determine the current load of the functional module;

[0053] If the load exceeds a preset load threshold, the polling period is determined to be the first polling period.

[0054] If the load is less than or equal to a preset load threshold, the polling period is determined to be the second polling period, which is greater than the first polling period.

[0055] According to one embodiment of this application, the BMC management circuit is further configured to:

[0056] Based on non-blocking waiting and the polling period, an asynchronous function is called to perform concurrent asynchronous polling of the functional module to obtain the status information.

[0057] According to one embodiment of this application, the functional module is further configured to:

[0058] The adjustment instructions are parsed to identify the target operating mode of the functional module;

[0059] The execution status self-check process is performed. If the self-check passes, the operating parameters of the functional module are configured based on the target operating mode to adjust the operating mode.

[0060] The status self-test process is executed, and if the self-test passes, an acknowledgment message is sent to the BMC management circuit.

[0061] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application.

[0062] The computer board system provided by this invention has the following advantages over the prior art:

[0063] (1) By deploying the BMC management circuit to correspond with different functional modules in the motherboard circuit, monitoring data can be effectively collected and analyzed in the corresponding functional modules to achieve separate management, which reduces the processing pressure of the chip in the BMC management circuit, greatly reduces the failure rate of the BMC management circuit, and improves the stability, flexibility and scalability of the computer board circuit system. It can monitor and diagnose the status and performance of each functional module in real time, achieve better management and monitoring, and is suitable for complex system architectures such as data centers or high-performance computing clusters. When a large amount of status information or control tasks need to be processed, multiple BMCs can share the workload, improve the response speed and processing capacity, and are suitable for computing devices such as servers and supercomputers that need to process massive amounts of data. The functional modules adjust the operating mode accordingly, which can quickly respond to faults. The host computer combines the status information, analyzes the diagnostic results and generates the configuration information of the BMC management circuit, so as to achieve accurate management and rapid response of the hardware status of the motherboard circuit, improve the maintainability and stability of the computer board circuit system, and can adapt to the increasingly complex computing environment requirements.

[0064] (2) The system adopts a modular structure, separating the motherboard circuit into different functional modules and configuring a dedicated BMC management circuit for each module. This facilitates individual testing and maintenance. By selecting the corresponding processing chip according to the management requirements of each functional module, the system can achieve the best balance in terms of performance, flexibility, reliability and cost.

[0065] (3) By using the current load as the basis for whether to shorten the polling cycle, the polling frequency can be increased under high load to monitor the status of functional modules more closely, thereby responding to possible problems faster and improving real-time performance. When the load is low, extending the polling cycle can reduce unnecessary monitoring operations, thereby reducing the system's energy consumption.

[0066] (4) By performing self-checks before and after adjusting the operating mode, the functional module can respond to the adjustment command efficiently and reliably, and switch to the specified operating mode while ensuring its own health.

[0067] (5) Consider the impact of time on the overall status score C, especially by introducing a time decay factor in the failure frequency and historical performance score, so that the historical performance score decreases over time, reflecting that recent performance is more important. Attached Figure Description

[0068] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0069] Figure 1 This is a schematic diagram of the structure of the computer board system provided in the embodiments of this application;

[0070] Figure 2 This is a flowchart illustrating the operation of the computer board system provided in the embodiments of this application;

[0071] Figure 3 This is a schematic diagram of the polling process of the BMC management circuit provided in the embodiments of this application. Detailed Implementation

[0072] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0073] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0074] The computer board system provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0075] like Figure 1 As shown, the computer board system (hereinafter referred to as the system) includes: a motherboard circuit and a host computer, as well as multiple BMC management circuits respectively connected to the board circuit and the host computer;

[0076] The motherboard circuit includes multiple interconnected functional modules, and the multiple BMC management circuits correspond one-to-one with the multiple functional modules.

[0077] The functional module is used to obtain the status information of the functional module based on the driving information of the functional module; and to adjust the operating mode of the functional module in response to the adjustment command.

[0078] The BMC management circuit is used to acquire the status information of the corresponding functional module, analyze and diagnose the status information to obtain a diagnosis result, and determine the adjustment command corresponding to the diagnosis result; receive configuration information sent by the host computer and perform configuration.

[0079] The host computer is used to analyze the status information and diagnostic results of the plurality of BMC management circuits and generate the configuration information of each BMC management circuit.

[0080] The BMC management circuit is connected to each functional module via an I2C bus or an LPC bus. The processing chip of the BMC management circuit can be an AST2500 chip. The BMC management circuit includes a microcontroller (AST2500 chip), memory, sensor interface, communication interface, and user interface. It can control the cooling fan of the functional module and realize PCIe (Peripheral Component Interconnect Express) data acquisition.

[0081] It should be noted that during the data transmission and storage process in the system, an error detection and correction (EDC) algorithm is used to ensure the integrity and accuracy of information, improve the reliability of data transmission, and reduce failures caused by data errors.

[0082] Adjustment commands are used to adjust the operating mode of functional modules to reduce damage caused by equipment failures and achieve rapid response to faults.

[0083] Understandably, the computer module is responsible for processing data and performing computing tasks, and typically includes core components such as CPU and memory. The CPU can be a QM77 bridge controller. The serial interface module provides a communication interface between the system and external devices, such as RS-232 and USB, and is responsible for sending and receiving data. The reflective memory module is used to achieve high-speed data transmission and allows multiple processing units to share memory to improve system performance. The power module provides a stable power supply to the motherboard circuitry and all its components to ensure the normal operation of the system.

[0084] Driver information is the data or parameters used by the driver program corresponding to the functional module. It is used to configure the functional module and obtain the status information of the functional module. Driver information may include the configuration parameters, status reports, error codes, device characteristics, etc. of the functional module.

[0085] Status information is data on the current status of each module, which may include temperature, current, voltage, and signals. Fault information may include the type of fault or failure that occurred in the system, the time of occurrence, etc. The operating mode of a functional module may be the working mode under a specific state, such as normal working mode, fault protection mode, and maintenance mode.

[0086] In actual implementation, such as Figure 2 As shown, after the system is powered on, the operating system of the motherboard circuit starts, each functional module in the motherboard is initialized, the corresponding driver is loaded, the status of each component is automatically checked, all functional modules are ensured to work normally, and they are ready to communicate with the BMC management circuit.

[0087] Each functional module of the motherboard circuit obtains its own status information such as temperature, operating voltage, and operating load based on the driver information, and packages the status information and sends it to the BMC management circuit corresponding to each functional module.

[0088] Each BMC management circuit receives the status information of the corresponding functional module, parses the received status information data packets, extracts the key parameters and error logs that affect the working status of the corresponding functional module, and performs anomaly judgment on the key parameters according to the preset range or normal state of the key parameters, analyzes and identifies faults in the error logs, obtains diagnostic results, and sends the adjustment instructions corresponding to the diagnostic results to each functional module of the main board circuit. At the same time, the diagnostic results and status information are sent to the host computer for summary.

[0089] For example, key parameters of the status information corresponding to the computer module include voltage, temperature, and load, and may also include CPU utilization, processor temperature, and computer error log; key parameters of the status information corresponding to the serial interface module include serial port status, data transmission rate, packet loss rate, and interface temperature; key parameters of the status information corresponding to the reflective memory module include memory usage, latency, data integrity, and memory error log; key parameters of the status information corresponding to the power supply module include input voltage, output voltage, output current, and power supply temperature.

[0090] The preset ranges for CPU utilization and processor temperature are 0%-85% and 0℃-85℃, respectively. The normal state of the serial port is normal or idle. The preset range for data transmission rate is above the minimum rate threshold. The normal state for data packet loss rate is 0%. The preset range for interface temperature is 0℃-85℃.

[0091] In addition, for computer modules, check the computer error log to identify potential hardware or software faults; for reflective memory modules, analyze the memory error log to identify memory faults, and use the combination of the fault judgment result and the fault identification result as the diagnostic result.

[0092] On one hand, the host computer analyzes the diagnostic results and status information to obtain the configuration information of each BMC management circuit. The host computer then sends the configuration information of each BMC management circuit to the corresponding BMC management circuit. The BMC management circuit configures itself according to the received configuration information.

[0093] On the other hand, each functional module of the motherboard circuit responds to the adjustment command and adjusts the operating mode of the functional module.

[0094] Understandably, each functional module corresponds to a different working mode. These working modes help each functional module achieve optimal performance in different usage scenarios, while ensuring the security and reliability of the system.

[0095] For example, a computer module includes normal mode, power saving mode, and failsafe mode. In normal mode, the computer executes various tasks of user programs and the operating system, and the CPU, memory, and other hardware modules are all working actively. In power saving mode, the CPU frequency is reduced and some hardware is shut down to reduce power consumption. In failsafe mode, the computer module enters a safe mode, restricting functions to protect the hardware and allowing troubleshooting.

[0096] The serial interface module includes a data transmission mode, a monitoring mode, and an idle mode. In data transmission mode, the serial interface module sends and receives data in real time through the serial port. In monitoring mode, it monitors the serial port status and traffic, including error detection and packet monitoring. In idle mode, there is no data transmission, maintaining a low-power state and ready to respond to data requests at any time.

[0097] The reflective memory module includes read-write mode, synchronous mode, and fault detection mode. In read-write mode, data can be read and written quickly between memory nodes to support high-performance real-time applications. In synchronous mode, data consistency between different computing nodes is ensured, allowing multiple nodes to share data. In fault detection mode, memory status is monitored, error logs are recorded, and fault conditions are reported.

[0098] The power module includes a voltage regulation mode, a power saving mode, and a protection mode. In voltage regulation mode, it maintains a stable output voltage and current to ensure reliable power supply to the system. In power saving mode, it reduces output power to improve energy efficiency and is suitable for low load conditions. In protection mode, it automatically enters a protection state to prevent damage and is suitable for detecting abnormal conditions such as overvoltage, overcurrent, or overheating.

[0099] The computer board system provided in this application, by deploying the BMC management circuit corresponding to different functional modules in the motherboard circuit, effectively collects and analyzes monitoring data in the corresponding functional modules, achieving separate management, reducing the processing pressure on the chip in the BMC management circuit, greatly reducing the failure rate of the BMC management circuit, and improving the stability, flexibility, and scalability of the computer board circuit system. It can perform real-time monitoring and fault diagnosis of the status and performance of each functional module, achieving better management and monitoring. It is suitable for complex system architectures such as data centers or high-performance computing clusters. When a large amount of status information or control tasks need to be processed, multiple BMCs can share the workload, improving response speed and processing capacity. It is suitable for computing devices such as servers and supercomputers that need to process massive amounts of data. The functional modules adjust the operating mode accordingly, enabling rapid response to faults. The host computer combines the status information, analyzes the diagnostic results, and generates configuration information for the BMC management circuit, achieving precise management and rapid response to the hardware status of the motherboard circuit. This improves the maintainability and stability of the computer board circuit system and can adapt to the increasingly complex computing environment requirements.

[0100] In some embodiments, the host computer is further configured to:

[0101] Extract the current temperature, current voltage, current load, and current fault occurrence frequency from the status information of each functional module;

[0102] The current temperature, current voltage, current load, and current fault occurrence frequency are analyzed and diagnosed respectively to determine temperature score, voltage score, load score, and historical performance score, wherein the historical performance score is obtained through time decay;

[0103] Based on the temperature score, voltage score, load score, and historical performance score, a comprehensive status score is obtained for each of the functional modules.

[0104] Based on the comprehensive status score and the diagnostic results, the configuration information for each BMC management circuit is generated.

[0105] Among them, the historical performance score reflects the operating status of the functional module over a period of time. The historical performance score is adjusted over time through time decay to avoid over-reliance on outdated data.

[0106] Historical performance scores can be exponentially decayed over time.

[0107] In some embodiments, the overall status score C of the functional module is:

[0108]

[0109] Among them, S min For the minimum nonlinear score, S max For the maximum non-linear score, K is the scaling factor;

[0110] The nonlinear score S of the functional module is:

[0111]

[0112] Wherein, α, β, γ, and δ are the weighting coefficients for temperature score T, voltage score V, load score L, and historical performance score H, respectively.

[0113] Temperature rating T is:

[0114]

[0115] Among them, P T The penalty factor for temperature score T, T current T represents the current temperature. normal Normal temperature, T max Maximum permissible temperature;

[0116] The voltage rating V is:

[0117]

[0118] Among them, P V V is the penalty factor for the voltage score V. current V is the current voltage. max For the maximum allowable voltage, V min For the minimum allowable voltage, V critical This is a critical voltage;

[0119] The load score L is:

[0120]

[0121] Among them, P L L is the penalty factor for the load score L. current For the current load, L max For normal maximum load, L critical For critical loads;

[0122] Historical performance rating H is:

[0123]

[0124] Where μ is the time decay factor, t is time, and P H The penalty factor for historical performance score H, where T is the current failure frequency, and F is the current failure frequency. max This is the maximum allowed failure frequency of the functional module.

[0125] Understandably, a higher overall condition score (C) indicates a better condition of the motherboard circuitry, and the maximum failure rate is used to assess the reliability of the functional module under worst-case conditions.

[0126] For weighting coefficients α, β, γ, and δ, which are all not less than 1, adjustments can be made based on the importance of temperature score T, voltage score V, load score L, and historical performance score H.

[0127] The lower the temperature value, the higher the temperature score T; the lower the voltage fluctuation, the higher the voltage score V; the lower the load value, the higher the load score L; the historical performance score H is based on the historical failure rate or performance stability.

[0128] By introducing a penalty factor P T P V P L P L It can reduce the scores caused by faults, errors or non-compliance, and ensure that temperature score T, voltage score V, load score L and historical performance score H can reflect potential risks in a timely manner.

[0129] Introducing normalization and scaling factor K ensures that the overall state score C is within a specific range and reflects the relative state of each functional module.

[0130] The impact of time on the overall condition score C is considered, especially by introducing a time decay factor into the failure frequency and historical performance scores, which makes the historical performance score decrease over time, reflecting that recent performance is more important.

[0131] For example, the weighting coefficient for temperature score T is α = 2.0, the weighting coefficient for voltage score V is β = 1.5, the weighting coefficient for load score L is γ = 1.0, the weighting coefficient for historical performance score H is δ = 2.5, the time decay factor is μ = 0.1, and the scaling factor is K = 100.

[0132] By assigning a higher historical performance score weight δ=2.5, the sensitivity to the frequency of failures can be improved, which helps to identify potential problems in a timely manner and enhances the ability to warn of failures.

[0133] The weighting coefficients α = 2.0 for temperature score T and β = 1.5 for voltage score V emphasize the importance of temperature and voltage for system safety, which is especially important for equipment in high-temperature and high-pressure environments, ensuring early response at dangerous thresholds.

[0134] Historical performance scores reflect the system's operating status over a period of time. They should be adjusted over time to avoid over-reliance on outdated data. The introduction of a time decay factor μ = 0.1 ensures that the historical performance score H decays over time, allowing the system to focus more on the current state rather than historical records, thus adapting to a dynamically changing environment.

[0135] By using a scaling factor K=100, the rating is transformed into a more intuitive range, making it easier for users to understand the system status and facilitate subsequent decision-making.

[0136] The use of non-linear scoring S makes it possible for an improvement in a particular score to have a significant impact on the overall score, capturing the interaction between different scores and improving the accuracy of the scoring.

[0137] In some embodiments, the host computer is further configured to:

[0138] Extract module state features from the state information of each functional module;

[0139] A state vector for each functional module is constructed based on the comprehensive state score, the module state characteristics, and the diagnostic results.

[0140] The state vectors are sequentially input into the information prediction model to obtain the configuration information of each BMC management circuit output by the information prediction model.

[0141] In actual implementation, multiple training samples are constructed using historical configuration information and state vectors to train the information prediction model, so that the information prediction model can learn the relationship between the configuration information and state vector of each module.

[0142] In some embodiments, the information prediction model is obtained by training training samples based on time series, the training samples including sample module state features and configuration information labels, the sample module state features having timestamps.

[0143] Time series is formed by sorting training samples according to timestamps. The training samples are then sequentially input into the information prediction model according to the time series to train the information prediction model.

[0144] In this embodiment, introducing time series features can enhance the model's adaptability to dynamic changes, effectively capture the time dependence of data, and improve the accuracy and reliability of fault prediction.

[0145] Understandably, the host computer can also make comprehensive fault judgments on each functional module based on status information, reduce false alarms, and more easily identify the root cause of the fault.

[0146] For example, if the CPU utilization and processor temperature of the computer module are low, but the power supply temperature is high, the host computer will determine that the power supply module has malfunctioned based on multiple status information, and it needs to increase the fan power of the power supply module and report an error. If the CPU utilization and processor temperature of the computer module are high, but the power supply temperature is high, the host computer will determine that the power supply module has not malfunctioned based on multiple status information, and it does not need to report an error. It only needs to increase the output power of the fans at the computer module and the power supply module.

[0147] In some embodiments, the processing chip of the BMC management circuit is determined based on the management requirements of the computer module, the serial interface module, the reflective memory module, the power module, and the network module, respectively.

[0148] The processing chip corresponding to the computer module is an Intel BMC series chip or an ASPEED AST2400 / AST2500 chip;

[0149] The processing chip corresponding to the serial interface module is a Texas Instruments Tiva C series chip or an STMicroelectronics STM32 series chip.

[0150] The processing chip corresponding to the reflection memory module is a Texas Instruments TMS320C67x series chip or a Xilinx Zynq series chip.

[0151] The processing chip corresponding to the power module is an NXP LPC series chip, a Microchip MCP series chip, or a Renesas ISL series chip.

[0152] The processing chip corresponding to the network module is either an NXP / Freescale i.MX series chip or an ASPEED AST series chip.

[0153] The serial interface module is an eight-channel asynchronous serial port module, and the network module is a dual-redundant gigabit network module.

[0154] The computer module, serial interface module, reflective memory module, power supply module, and network module have different requirements for the BMC management circuit, so different processing chips need to be selected.

[0155] The computer module needs to monitor the status of the CPU, memory, and other critical hardware in real time and handle complex management tasks. The corresponding BMC management circuit processing chip can be an Intel BMC series chip or an ASPEED AST2400 / AST2500 chip. The serial interface module requires efficient data transmission and protocol processing, and monitors the health status of serial communication. The corresponding BMC management circuit processing chip can be a Texas Instruments Tiva C series chip or an STMicroelectronics STM32 series chip. The reflective memory module needs to handle high-speed data streams and synchronous operations, requiring low latency and high bandwidth. The corresponding BMC management circuit processing chip can be a Texas Instruments TMS320C67x series chip or a Xilinx Zynq series chip. The power module needs to monitor power status, perform power management operations, and ensure stable system operation. The corresponding BMC management circuit processing chip can be an NXP LPC series chip, a Microchip MCP series chip, or a Renesas ISL series chip. The network module needs to handle network traffic. Depending on the task complexity, the corresponding BMC management circuit processing chip can be an NXP / Freescale i.MX series chip or an ASPEED AST series chip.

[0156] Understandably, by setting up multiple BMC management circuits to connect to the board circuit, redundancy is achieved, ensuring that even if one BMC management circuit fails, other BMC management circuits can still manage the board circuit, thus improving the reliability of the computer board circuit system.

[0157] In this embodiment, the system adopts a modular structure, separating the motherboard circuit into different functional modules and configuring a dedicated BMC management circuit for each module. This facilitates individual testing and maintenance. By selecting the corresponding processing chip according to the management requirements of each functional module, the system can achieve the best balance in terms of performance, flexibility, reliability, and cost.

[0158] In some embodiments, the functional module is further configured to generate alarm information based on the diagnostic results;

[0159] The BMC management circuit is also used for:

[0160] Based on the polling cycle, the functional modules corresponding to the BMC management circuit are polled. If it is determined that the functional module generates the alarm information in three consecutive polling cycles, the alarm information is queried in the event log.

[0161] If the query result is empty, the alarm information will be recorded in the event log.

[0162] like Figure 3 As shown, after the system is powered on, the BMC management circuit periodically polls the alarm information of each functional module through the I2C bus and receives the alarm information polling messages to collect real-time sensor data of the functional modules. The polling period is adjustable, with a minimum polling period of not less than 5 seconds. If, based on the real-time sensor data, the same functional module generates alarm information within three consecutive polling periods, and if the alarm information exists in the BMC management circuit's event log, the BMC management circuit will not process the alarm information. If the alarm information does not exist in the BMC management circuit's event log, the BMC management circuit will record the alarm information in the event log and illuminate the fault indicator light through GPIO.

[0163] The BMC management circuit obtains the FRU information of this unit through the I2C bus to determine whether this unit is an air-cooled unit. When this unit is an air-cooled unit, the BMC management circuit obtains the fan speed information of this unit through the PWM wave signal and determines whether there is an alarm message based on the PWM wave signal. When an alarm message exists, the BMC management circuit marks the alarm message and records the alarm message in the event log, marks the fan fault information, and lights up the fault indicator light through GPIO.

[0164] In this embodiment, by querying alarm information in the event log, the same alarm information is avoided from being recorded repeatedly in a short period of time, thus reducing the redundancy of the event log.

[0165] In some embodiments, the BMC management circuit is further configured to:

[0166] Based on the status information, determine the current load of the functional module;

[0167] If the load exceeds a preset load threshold, the polling period is determined to be the first polling period.

[0168] If the load is less than or equal to a preset load threshold, the polling period is determined to be the second polling period, which is greater than the first polling period.

[0169] In this embodiment, the current load is used as the basis for whether to shorten the polling cycle. Under high load, the polling frequency can be increased to monitor the status of functional modules more closely, thereby responding to potential problems faster and improving real-time performance. Under low load, extending the polling cycle can reduce unnecessary monitoring operations, thereby reducing the system's energy consumption.

[0170] In some embodiments, the BMC management circuit is further configured to:

[0171] Based on non-blocking waiting and the polling period, an asynchronous function is called to perform concurrent asynchronous polling of the functional module to obtain the status information.

[0172] In this embodiment, the BMC management circuit can initiate multiple rounds of asynchronous polling of functional modules without waiting for the response of each functional module, thereby managing resources more efficiently, reducing waiting time, and improving overall performance.

[0173] In some embodiments, the functional module is further configured to:

[0174] The adjustment instructions are parsed to identify the target operating mode of the functional module;

[0175] The execution status self-check process is performed. If the self-check passes, the operating parameters of the functional module are configured based on the target operating mode to adjust the operating mode.

[0176] The status self-test process is executed, and if the self-test passes, an acknowledgment message is sent to the BMC management circuit.

[0177] In actual execution, the functional module first receives the adjustment command, which includes the identification information of the target operating mode. The functional module parses the command content and extracts the parameters of the target operating mode, such as speed, power or other related settings.

[0178] After parsing the instructions, the functional module initiates a self-test process to check its own operating status and health status. During the self-test, the module will check the status of key components, including hardware connections, software operation, temperature, power, etc.

[0179] After completing the self-test, the functional module evaluates the self-test results. If all checks pass, it continues to the next step; if any check fails, it returns an error message and stops subsequent operations.

[0180] If the self-test passes, the functional module extracts the required operating parameters according to the target operating mode, and adjusts its internal settings to configure the required operating parameters to ensure that it can operate effectively in the target mode.

[0181] After the parameters are configured, the status self-check process is executed again to ensure that the functional modules under the new configuration are still in normal operating condition.

[0182] If the self-test passes, the functional module sends a confirmation message to the BMC management circuit, indicating that it has successfully switched to the target operating mode.

[0183] In this embodiment, by performing self-checks before and after adjusting the operating mode, the functional module can respond to adjustment commands efficiently and reliably, and switch to the specified operating mode while ensuring its own health.

[0184] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0185] In the description of this application, "multiple" means two or more.

[0186] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0187] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0188] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A computer board system, characterized in that, include: The motherboard circuit and the host computer, and multiple BMC management circuits respectively connected to the motherboard circuit and the host computer; The motherboard circuit includes multiple interconnected functional modules, and the multiple BMC management circuits correspond one-to-one with the multiple functional modules. The functional module is used to obtain the status information of the functional module based on the driving information of the functional module; and to adjust the operating mode of the functional module in response to the adjustment command. The BMC management circuit is used to acquire the status information of the corresponding functional module, analyze and diagnose the status information to obtain a diagnosis result, and determine the adjustment command corresponding to the diagnosis result; receive configuration information sent by the host computer and perform configuration. The host computer is used to analyze the status information and diagnostic results of the multiple BMC management circuits and generate the configuration information of each BMC management circuit. The host computer is further used for: Extract the current temperature, current voltage, current load, and current fault occurrence frequency from the status information of each functional module; The current temperature, current voltage, current load, and current fault occurrence frequency are analyzed and diagnosed respectively to determine temperature score, voltage score, load score, and historical performance score, wherein the historical performance score is obtained through time decay; Based on the temperature score, voltage score, load score, and historical performance score, a comprehensive status score is obtained for each of the functional modules. Based on the comprehensive status score and the diagnostic results, the configuration information for each BMC management circuit is generated; The overall status score of the functional modules for: in, For the minimum nonlinear score, For the maximum non-linear score, It is the scaling factor; The nonlinear scoring of the functional module for: in, , , , These are temperature ratings. Voltage rating Load rating and historical performance rating Weighting coefficients; Temperature rating for: in, Rate the temperature The penalty factor The current temperature. Normal temperature Maximum permissible temperature; Voltage rating for: in, Voltage rating The penalty factor The current voltage, For the maximum allowable voltage, Minimum allowable voltage, This is a critical voltage; Load rating for: in, Scoring the load The penalty factor For the current load, This is the normal maximum load. For critical loads; Historical performance rating for: in, It is the time decay factor. It is time. Rate historical performance The penalty factor This is the current frequency of fault occurrence. This is the maximum allowed failure frequency of the functional module.

2. The computer board system according to claim 1, characterized in that, The host computer is further used for: Extract module state features from the state information of each functional module; A state vector for each functional module is constructed based on the comprehensive state score, the module state characteristics, and the diagnostic results. The state vectors are sequentially input into the information prediction model to obtain the configuration information of each BMC management circuit output by the information prediction model.

3. The computer board system according to claim 2, characterized in that, The information prediction model is obtained by training on time series using training samples. The training samples include sample module state features and configuration information labels, and the sample module state features are timestamped.

4. The computer board system according to claim 1, characterized in that, The multiple functional modules include: a computer module, a serial interface module, a reflective memory module, a power supply module, and a network module. The processing chip of the BMC management circuit is determined based on the management requirements of the functional modules corresponding to the BMC management circuit. The processing chip corresponding to the computer module is an Intel BMC series chip or an ASPEED AST2400 / AST2500 chip; The processing chip corresponding to the serial interface module is a Texas Instruments Tiva C series chip or an STMicroelectronics STM32 series chip. The processing chip corresponding to the reflection memory module is a Texas Instruments TMS320C67x series chip or a Xilinx Zynq series chip. The processing chip corresponding to the power module is an NXP LPC series chip, a Microchip MCP series chip, or a Renesas ISL series chip. The processing chip corresponding to the network module is either an NXP / Freescale i.MX series chip or an ASPEED AST series chip.

5. The computer board system according to claim 1, characterized in that, The functional module is also used to generate alarm information based on the diagnostic results; The BMC management circuit is also used for: Based on the polling cycle, the functional modules corresponding to the BMC management circuit are polled. If it is determined that the functional module generates the alarm information in three consecutive polling cycles, the alarm information is queried in the event log. If the query result is empty, the alarm information will be recorded in the event log.

6. The computer board system according to claim 5, characterized in that, The BMC management circuit is also used for: Based on the status information, determine the current load of the functional module; If the load exceeds a preset load threshold, the polling period is determined to be the first polling period. If the load is less than or equal to a preset load threshold, the polling period is determined to be the second polling period, which is greater than the first polling period.

7. The computer board system according to claim 5, characterized in that, The BMC management circuit is also used for: Based on non-blocking waiting and the polling period, an asynchronous function is called to perform concurrent asynchronous polling of the functional module to obtain the status information.

8. The computer board system according to claim 1, characterized in that, The functional module is further used for: The adjustment instructions are parsed to identify the target operating mode of the functional module; The execution status self-check process is performed. If the self-check passes, the operating parameters of the functional module are configured based on the target operating mode to adjust the operating mode. The status self-test process is executed, and if the self-test passes, an acknowledgment message is sent to the BMC management circuit.

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