Method for collaborative thermal simulation design of mechanical and electrical products

Abstract

The invention belongs to the field of electromechanical engineering, and relates to an electromechanical product collaborative thermal simulation design method, which comprises the following steps of: designing an overall structure, and publishing a structure model of circuit design; circuit schematic diagram design and PCB wiring design are carried out; generating a PCB three-dimensional model containing component density and heat conduction coefficient; the PCB three-dimensional model and other structural component models are assembled into a whole machine structural model, component BOM information is supplemented according to the affiliation relation of parts and assembly bodies in a whole machine assembly body, and the assembly bodies to which the components belong and the types of the components are added behind the component BOM in the second step; executing thermal simulation analysis; and generating a thermal simulation analysis report. According to the method, automatic assignment and extraction of component parameters in the model are supported, the problems of large workload of manual assignment and manual extraction of model parameters and low cross-professional file interaction and cooperation efficiency are solved, and the quality and efficiency of thermal simulation design can be improved.

Description

Technical Field

[0001] The invention belongs to the field of electromechanical engineering, and in particular relates to a method for collaborative thermal simulation design of electromechanical products. Background Art

[0002] In the existing technology, electromechanical equipment needs to carry out structural design and circuit design for electromechanical collaborative design. Circuit designers need structural designers to provide the size diagram and space constraints of the circuit board; structural designers carry out structural modeling and simulation analysis based on the space occupied by the circuit board. In the early stage of product design, the circuit board and structural form are uncertain, and both parties need to coordinate the mechanical interface of both parties to complete the design collaboratively; if there are components that do not meet the requirements in the simulation analysis of the structural designer, it is also necessary to make a collaborative decision to modify the circuit design or structural design.

[0003] In the traditional collaborative design process of electromechanical products, information and models are usually transmitted through emails and CDs. On the one hand, the process files are not managed, and the model version is not updated from time to time, resulting in board errors; on the other hand, the selection of circuit components and the adjustment of wiring layout will also bring a lot of workload to structural modeling and simulation analysis. Structural designers need to manually model and assign values ​​to components again, and manually extract simulation result information from the simulation model.

[0004] The entire process involves designers from different disciplines, multiple development tools, and multi-level R&D activities. The entire process is not a waterfall-style linear process, but a multi-round iterative cycle. There is cross-disciplinary file interaction, and communication and collaboration efficiency is low. Structural modeling and simulation analysis require a lot of manual modeling and assignment of component materials and thermal power consumption, and the efficiency of electromechanical collaborative design is low. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] The technical problem to be solved by the present invention is how to provide a method for collaborative thermal simulation design of electromechanical products to solve the problems of large workload of manual assignment and manual extraction of model parameters and low efficiency of cross-professional file interaction and collaboration in the traditional thermal design process of electromechanical products.

[0007] (II) Technical solution

[0008] In order to solve the above technical problems, the present invention proposes a method for collaborative thermal simulation design of electromechanical products, which is based on the collaborative thermal simulation process of electromechanical products driven by component BOM, completes the construction and simulation analysis of the thermal simulation model of electromechanical products through information interaction among the structural design model, the circuit design model and the component BOM, and supports the automatic assignment and extraction of component parameters in the model. The method comprises the following steps:

[0009] Step 1: Overall structural design, publish the structural model of circuit design;

[0010] Step 2: Design the circuit schematic based on the structural model. After the design is completed, generate the component BOM from the circuit schematic, which contains the circuit board name, component unique code and component thermal power consumption information;

[0011] Step 3: Carry out PCB wiring design based on the structural model. After the design is completed, based on the component BOM and the component size data in the component database, generate a PCB structure modeling file containing component size information from the PCB wiring design model file;

[0012] Step 4: Generate a 3D model of the PCB board including component density and thermal conductivity based on the PCB structure modeling file, component BOM, and component density and thermal conductivity in the component database;

[0013] Step 5: Assemble the PCB board 3D model and other structural sub-component models into the whole machine structure model, and supplement the component BOM information according to the relationship between parts and assemblies in the whole machine assembly, and add the assembly and type of the component to the component BOM in the second step;

[0014] Step 6: Import the whole machine structure model into the thermal simulation software, assign the thermal power consumption parameters of the components to the thermal simulation model based on the thermal power consumption information P in the component BOM, and perform thermal simulation analysis;

[0015] Step 7: After completing the thermal simulation analysis, automatically extract the component case temperature parameter T1 in the thermal simulation model and the junction-to-case thermal resistance R, operating temperature and derating in the component database, calculate the junction temperature T2 and compare it with the operating temperature, where T2 = T1 + R × P, and write the simulation results of T1, T2 and whether they meet the working requirements into the thermal simulation analysis report.

[0016] Furthermore, the eighth step is included: if there are components that do not meet the operating temperature requirements in the above process, it is decided to modify the circuit or PCB design or the structural heat dissipation design, and repeat the second to seventh steps until the operating temperature requirements are met.

[0017] (III) Beneficial effects

[0018] The present invention proposes a method for collaborative thermal simulation design of electromechanical products, which utilizes component BOM to drive the entire thermal design process of the electromechanical products, thereby improving the collaborative efficiency of the thermal design of the electromechanical products. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a flow chart of the present invention. DETAILED DESCRIPTION

[0020] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples.

[0021] The purpose of the present invention is to provide a method for collaborative thermal simulation design of electromechanical products, which adopts a collaborative thermal simulation process of electromechanical products driven by component BOM (Bill of Material, hereinafter referred to as BOM) to improve the quality and efficiency of thermal simulation design. Circuit and structural designers complete the construction and simulation analysis of the thermal simulation model of electromechanical products through information exchange among structural design models, circuit design models and component BOMs, and support automatic assignment and extraction of component parameters in the model, solving the problems of large workload of manual parameter assignment and manual extraction and low efficiency of cross-professional file interaction and collaboration.

[0022] like Figure 1 As shown, in a specific embodiment of the present invention, it includes:

[0023] Step 1: Overall structural design. The structural designer releases the structural model of the circuit design (dxf format) to the circuit designer.

[0024] Step 2: The circuit designer designs the circuit schematic based on the structural model (dxf format). After the design is completed, the circuit designer generates a component BOM (csv format) from the circuit schematic that contains the circuit board name, component unique code, and component thermal power consumption information, see Table 1.

[0025] Table 1

[0026] Serial number Unique code Component name Position No. Thermal power consumption Circuit board

[0027] Among them, the component BOM (csv format) is customized and developed according to the component BOM requirements through the secondary development interface in the circuit design tool, including unique code, component name, position number, thermal power consumption, circuit board and other information.

[0028] Step 3: Circuit designers carry out PCB wiring design based on the structural model (dxf format). After the design is completed, based on the component BOM and the component size data in the component database, the circuit designer generates a PCB structural modeling file (emn, emp format) containing component size information from the PCB wiring design model file; among them, the component unique code and size data (length, width and height) are uniformly maintained in the component database, and the unique code and the unique code of the component in the circuit schematic diagram are kept synchronized and consistent. The PCB structural modeling file (emn, emp format) is obtained through the customized development of the secondary development interface in the circuit design tool, and the component size data is assigned to the corresponding component size information in emn and emp through the secondary development interface based on the unique component code.

[0029] Step 4: The structural designer generates a PCB board three-dimensional model (asm format) containing material information such as component density and thermal conductivity based on the PCB structure modeling file (emn, emp format), component BOM and material data such as component density and thermal conductivity in the component database; wherein, the PCB board three-dimensional model (asm format) is directly assembled and generated according to the PCB structure modeling file (emn, emp format), the assignment of component material information of the PCB board three-dimensional model is obtained through the customized development of the secondary development interface in the structural design tool, the component material information is assigned to the corresponding component through a unique code, and the material information such as component density and thermal conductivity is uniformly maintained in the component database.

[0030] Step 5: The structural designer assembles the PCB board 3D model and other structural component models into the whole machine structure model, and supplements the component BOM information according to the relationship between parts and assemblies in the whole machine assembly, and adds the assembly and type (prt or asm) to which the component belongs after the BOM information in the second step, see Table 2.

[0031] Table 2

[0032]

[0033] Among them, the relationship between parts and assemblies in the whole machine assembly and the component BOM is obtained through customized development of the secondary development interface in the structural design software.

[0034] Step 6: Import the whole machine structure model into the thermal simulation software, assign the thermal power consumption parameters of the components to the thermal simulation model based on the thermal power consumption information (P) in the component BOM, and perform thermal simulation analysis.

[0035] Among them, the thermal power consumption parameter assignment is achieved through the customized development of the secondary development interface in the thermal simulation software, and is assigned to the corresponding components through unique codes, circuit boards, assemblies and types.

[0036] Step 7: After the thermal simulation is completed, the component case temperature parameters (T1) in the thermal simulation model and the junction-to-case thermal resistance (R), operating temperature, derating and other data in the component database are automatically extracted to calculate the junction temperature (T2) and compare the operating temperature, where T2 = T1 + R × P, and write the simulation results such as T1, T2, and whether the working requirements are met into the thermal simulation analysis report. The thermal simulation analysis report is shown in Table 3. Among them, the automatic extraction of simulation results is realized through the customized development of the secondary development interface in the thermal simulation software, and the component junction-to-case thermal resistance (R) data, operating temperature, and derating are uniformly maintained in the component database.

[0037] Table 3

[0038]

[0039] Furthermore, if there are components in the above process that do not meet the operating temperature requirements, decide whether to modify the circuit or PCB design or the structural heat dissipation design, and repeat steps 2 to 7 until the requirements are met.

[0040] The present invention adopts a thermal design method for electromechanical products based on component BOM, which uses component BOM drive to realize automatic transmission of thermal design process data, automatic assignment of component materials, thermal power consumption and other information, and automatic generation of thermal simulation analysis reports, which can effectively improve the efficiency and quality of collaborative design of electromechanical products.

[0041] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for collaborative thermal simulation design of electromechanical products, characterized in that: The steps include: Step 1: Overall structural design, publish the structural model of circuit design; Step 2: Design the circuit schematic based on the structural model. After the design is completed, generate the component BOM from the circuit schematic, which contains the circuit board name, component unique code and component thermal power consumption information; Step 3: Carry out PCB wiring design based on the structural model. After the design is completed, based on the component BOM and the component size data in the component database, generate a PCB structure modeling file containing component size information from the PCB wiring design model file; Step 4: Generate a 3D model of the PCB board including component density and thermal conductivity based on the PCB structure modeling file, component BOM, and component density and thermal conductivity in the component database; Step 5: Assemble the PCB board 3D model and other structural sub-component models into the whole machine structure model, and supplement the component BOM information according to the relationship between parts and assemblies in the whole machine assembly, and add the assembly and type of the component to the component BOM in the second step; Step 6: Import the whole machine structure model into the thermal simulation software, assign the thermal power consumption parameters of the components to the thermal simulation model based on the thermal power consumption information P in the component BOM, and perform thermal simulation analysis; Step 7: After completing the thermal simulation analysis, automatically extract the component case temperature parameter T1 in the thermal simulation model and the junction-to-case thermal resistance R, operating temperature and derating in the component database, calculate the junction temperature T2 and compare it with the operating temperature, where T2 = T1 + R × P, and write the simulation results of T1, T2 and whether they meet the working requirements into the thermal simulation analysis report.

2. The method for collaborative thermal simulation design of electromechanical products according to claim 1, characterized in that: It also includes the eighth step: If there are components that do not meet the operating temperature requirements in the above process, decide to modify the circuit or PCB design or the structural heat dissipation design, and repeat steps 2 to 7 until the operating temperature requirements are met.

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