Stable processing technology for conductive foam product
Through multiple composite and die-cutting processing, the various layers of materials of conductive foam products are composited and cut layer by layer, and the problems of unstable processing and high cost of conductive foam products are solved, achieving high efficiency, stable processing and improvement of product yield.
Patent Information
- Application Number
- CN202411890954.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-04-15
AI Technical Summary
During processing, conductive foam products have rough surfaces or special coatings, which leads to uneven adhesion of the protective film, which affects the appearance and conductive properties of the product. The materials vary greatly in each batch, making it difficult to achieve stable mass production, resulting in an increase in production costs.
A stable processing technology is adopted, through multiple composite and die-cutting processing, the silicone protective film, partition layer by layer, conductive foam, conductive cloth and PE film, and the PET film is composited in the last step to form a discharge tape to ensure uniform adhesion and cutting of each layer.
It improves the processing stability, efficiency and yield of conductive foam products, reduces design and development costs, and ensures the uniformity and conductive performance of the products.
Smart Images
Figure CN119833243A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of conductive material processing, and in particular to a stable processing technology for conductive foam products. Background Art
[0002] During the processing of conductive foam products, since their surface is often rough or they are designed with special coatings, it will cause uneven fit when the protective film is adhered to the conductive foam product, thus affecting the appearance or conductive performance of the product.
[0003] In addition, the surface properties of the conductive foam products produced in each batch of production and processing are often different, which may often cause the adhesion of the protective film on each conductive foam product to be insufficient or excessive, which may easily cause the protective film to fall off or peel off during subsequent processing or use, thereby tearing the foam.
[0004] In summary, since each batch of conductive foam materials has large differences and lacks stability, it is often difficult to carry out normal mass production through die-cutting processing. If corresponding processing equipment or methods are specially designed and developed, the cost of production and processing will be greatly increased. Summary of the invention
[0005] To solve the above problems, the present invention provides a stable processing technology for conductive foam products, which optimizes the production process of conductive foam, improves the processing stability, processing efficiency and yield of conductive foam products, and saves design and development costs.
[0006] According to one aspect of the present invention, a conductive foam product stabilization processing technology is provided, comprising the following steps:
[0007] S1: Compounding a layer of silicone protective film on a first base film, compounding an interlayer on the silicone protective film, and then die-cutting the silicone protective film;
[0008] S2: Compounding a layer of conductive foam on the interlayer, compounding a layer of conductive cloth on the conductive foam, and then die-cutting half of it to the interlayer, and die-cutting the shape of the conductive foam;
[0009] S3: Compounding a layer of PE film on the conductive fabric, and then die-cutting it in half to the silicone protective film;
[0010] S4: Compounding a layer of waste film on the bottom of the first base film, and then die-cutting to the deepest half on the outside to the first base film, and cutting in the middle to the waste film to form a handle;
[0011] S5: Compounding a layer of PET film on a second backing film, and then die-cutting the second backing film in half to form an outgoing material strip.
[0012] S6: The products processed in steps S1 to S4 are laminated onto the discharge belt processed in step S5 to discharge the products.
[0013] In some embodiments, the process uses six compounding devices and five die-cutting devices, and each die-cutting device is arranged between each compounding device.
[0014] In some embodiments, in step S1, the thickness of the first base film is 0.055 mm, the thickness of the silicone protective film is 0.06 mm or 0.085 mm, and the thickness of the interlayer is 0.025 mm. This is beneficial in that it describes the thickness of each layer in the first composite process.
[0015] In some embodiments, in step S1, the top surface of the silicone protective film is the adhesive surface, and the bottom surface of the spacer is the release surface. This is beneficial in that it further describes the relevant situation in the first composite processing.
[0016] In some embodiments, in step S2, the thickness of the conductive foam is 0.8 mm, and the thickness of the conductive cloth is 0.05 mm. The benefit lies in that the thickness of the relevant layers in the second composite process is described.
[0017] In some embodiments, in step S2, the bottom surface of the conductive foam is a rubber surface. The benefit is that it further describes the relevant situation in the second composite processing.
[0018] In some embodiments, in step S3, the thickness of the PE film is 0.025 mm. This is beneficial in that it describes the thickness of the relevant layers in the third composite process.
[0019] In some embodiments, in step S4, the thickness of the scrap film is 0.055 mm. This is beneficial in that it describes the thickness of the relevant layer in the fourth composite processing.
[0020] In some embodiments, in step S5, the thickness of the second base film is 0.06 mm, and the thickness of the PET film is 0.05 mm. This is beneficial in that it describes the thickness of the relevant layers in the fifth composite process.
[0021] In some embodiments, in steps S1 to S6, each composite process has a waste discharge process, which is beneficial in that waste can be discharged in a timely manner for each composite process by setting the waste discharge process. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A schematic diagram of a product of the first compounding and die-cutting of a stable processing technology of a conductive foam product according to an embodiment of the present invention;
[0023] Figure 2 for Figure 1 The schematic diagram of the product of the second lamination and die-cutting is shown;
[0024] Figure 3 for Figure 1 The schematic diagram of the product of the third lamination and die-cutting is shown;
[0025] Figure 4 for Figure 1 The schematic diagram of the product of the fourth compounding and die-cutting is shown;
[0026] Figure 5 for Figure 1 Schematic diagram of the product after the fifth compounding and die-cutting.
[0027] In the figure: a first supporting film 1, a silicone protective film 2, a partition 3, a conductive foam 4, a conductive cloth 5, a PE film 6, a waste film 7, a second supporting film 8, and a PET film 9. DETAILED DESCRIPTION
[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings.
[0029] The process includes six compounding processes and five die-cutting processes which are alternating with each other, so six compounding devices and five die-cutting devices are required, and each die-cutting device is respectively arranged between each compounding device.
[0030] Preferably, the step distance of each die-cutting device is 25.5 mm, and the processing speed is 250-280 C / M.
[0031] The process includes some main steps, which are described as follows, taking the processing of a product with a handle as an example.
[0032] S1: First lamination and die cutting.
[0033] like Figure 1 As shown, in this step, a first composite device is used to composite a layer of silicone protective film 2 on a first base film 1, and then composite an interlayer 3 on the silicone protective film 2. The top surface of the silicone protective film 2 is the adhesive surface, and the bottom surface of the interlayer 3 is the release surface.
[0034] Preferably, the thickness of the first supporting film 1 is 0.055 mm, the thickness of the silicone protective film 2 is 0.06 mm or 0.085 mm, and the thickness of the interlayer 3 is 0.025 mm.
[0035] Then, the first die-cutting device is used to cut from the top surface of the interlayer 3 , halfway through the silicone protective film 2 , thereby die-cutting the adhesive area of the silicone protective film 2 .
[0036] In this die-cutting operation, the relevant holes are cut completely.
[0037] S2: Second lamination and die cutting.
[0038] like Figure 2 As shown, in this step, a second composite device is used to composite a layer of conductive foam 4 on the interlayer 3, and then a layer of conductive cloth 5 is composited on the conductive foam 4. The bottom surface of the conductive foam 4 is a rubber surface.
[0039] Preferably, the thickness of the conductive foam 4 is 0.8 mm, and the thickness of the conductive cloth 5 is 0.05 mm.
[0040] Then, a second die-cutting device is used to cut the conductive cloth 5 from the top surface thereof, cutting it halfway onto the partition layer 3 , thereby die-cutting the shape of the conductive foam 4 .
[0041] S3: The third lamination and die-cutting.
[0042] like Figure 3 As shown, in this step, a third composite device is used to composite a layer of PE film 6 on the conductive cloth 5, thereby achieving assembly and pasting.
[0043] Preferably, the thickness of the PE film 6 is 0.025 mm.
[0044] Then, a third die-cutting device is used to cut the PE film 6 from the top surface and cut it in half onto the silicone protective film 2.
[0045] S4: The fourth lamination and die-cutting.
[0046] like Figure 4 As shown, in this step, a fourth composite device is used to composite a layer of waste film 7 on the bottom of the first supporting film 1.
[0047] Preferably, the thickness of the scrap film 7 is 0.055 mm.
[0048] Then, the fourth die-cutting device is used to perform die-cutting from the top surface of the PE film 6. Die-cutting is performed on the outside and the middle of the material, with the deepest half of the outside being cut to the first base film 1 and the middle being cut to the waste film 7, thereby further die-cutting out part of the product shape, such as the handle of the product.
[0049] In this die-cutting operation, the relevant holes are cut completely.
[0050] S5: Fifth lamination and die cutting.
[0051] like Figure 4 As shown, in this step, a fifth laminating device is used to laminate a layer of PET film 9 on a second base film 8 .
[0052] Preferably, the thickness of the second base film 8 is 0.06 mm, and the thickness of the PET film 9 is 0.05 mm.
[0053] Then, a fifth die-cutting device is used to perform die-cutting from the top surface of the PET film 9 and half-cut to the second base film 8, thereby die-cutting an output material strip of the product.
[0054] S6: The Sixth Reunion
[0055] In this step, the sixth composite device is used to attach the products processed in steps S1 to S4 to the discharge belt processed in step S5, and finally the discharge belt can be pulled to discharge the products.
[0056] In addition, in the composite processing of the above steps, there is a waste removal process for the relevant layers.
[0057] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A stable processing technology for conductive foam products, characterized by: The following steps are included S1: Compounding a layer of silicone protective film (2) on a first base film (1), compounding an interlayer (3) on the silicone protective film (2), and then die-cutting the silicone protective film (2); S2: Compounding a layer of conductive foam (4) on the interlayer (3), compounding a layer of conductive cloth (5) on the conductive foam (4), and then die-cutting halfway to the interlayer (3), and die-cutting the shape of the conductive foam (4); S3: Compounding a layer of PE film (6) on the conductive fabric (5), and then die-cutting it in half to the silicone protective film (2); S4: Compounding a layer of waste film (7) on the bottom of the first supporting film (1), and then die-cutting to the deepest half on the outside to the first supporting film (1), and cutting in the middle to the waste film (7), to form a handle; S5: Compounding a layer of PET film (9) on a second backing film (8), and then die-cutting the second backing film (8) in half to form an output material strip; S6: The products processed in steps S1 to S4 are laminated onto the discharge belt processed in step S5 to discharge the products.
2. The conductive foam product stabilization processing technology according to claim 1, characterized in that: The process uses six compounding devices and five die-cutting devices, and each die-cutting device is respectively arranged between each compounding device.
3. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S1, the thickness of the first supporting film (1) is 0.055 mm, the thickness of the silicone protective film (2) is 0.06 mm or 0.085 mm, and the thickness of the interlayer (3) is 0.025 mm.
4. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S1, the top surface of the silicone protective film (2) is the adhesive surface, and the bottom surface of the spacer (3) is the release surface.
5. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S2, the thickness of the conductive foam (4) is 0.8 mm, and the thickness of the conductive cloth (5) is 0.05 mm.
6. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S2, the bottom surface of the conductive foam (4) is a rubber surface.
7. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S3, the thickness of the PE film (6) is 0.025 mm.
8. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S4, the thickness of the scrap film (7) is 0.055 mm.
9. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In step S5, the thickness of the second base film (8) is 0.06 mm, and the thickness of the PET film (9) is 0.05 mm.
10. The conductive foam product stabilization processing technology according to claim 1, characterized in that: In steps S1 to S6 , each composite process includes a waste removal process.