Coil component

Abstract

The technical problem of the present invention is to increase the volume of a magnetic element body in a coil component having a structure in which a magnetic element body is embedded in a plurality of conductor layers laminated with an insulating resin layer interposed therebetween. This coil component (100) is provided with conductor layers (L1-L6) embedded in a magnetic element body (110). The conductor layer (L1) includes a coil pattern (10) and connection patterns (11, 12) exposed from the mounting surface. The conductor layer (L6) includes a coil pattern (60) and a connection pattern (62) exposed from the mounting surface. The conductor layers (L2-L5) include coil patterns (20, 30, 40, 50) and connection patterns (22, 32, 42, 52) exposed from the mounting surface. The connection pattern (11) is covered by the terminal electrode (131). The connection patterns (12, 22, 32, 42, 52, 62) are covered by the terminal electrode (132). A magnetic element body (110) is disposed at least in an end region (D6) of the conductor layer (L6), the end region (D6) overlapping the connection pattern (11) in plan view from the lamination direction.

Description

Technical Field

[0001] The present disclosure relates to a coil component, and more particularly to a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body. Background Art

[0002] Patent Document 1 discloses a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body. In Patent Document 1, each conductor layer includes a coil pattern and a pair of connection patterns exposed from the magnetic body.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-152043 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In order to increase the inductance of the coil component, it is effective to increase the volume of the magnetic body.

[0008] This disclosure describes a technique for improving the inductance by increasing the volume of a magnetic body in a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body.

[0009] Methods used to solve problems

[0010] A coil component according to one aspect of the present disclosure comprises: a magnetic body having a mounting surface; a plurality of conductor layers embedded in the magnetic body and stacked with insulating resin layers therebetween; and a first terminal electrode and a second terminal electrode, wherein the plurality of conductor layers comprise: a first conductor layer located at one end in the stacking direction; a second conductor layer located at the other end in the stacking direction; and one or more third conductor layers located between the first conductor layer and the second conductor layer, wherein the first conductor layer comprises: a first coil pattern having a coil axis direction parallel to the mounting surface; a first connection pattern exposed from the mounting surface and connected to an outer peripheral end of the first coil pattern; and a second connection pattern exposed from the mounting surface and separated from the first coil pattern in the plane, and the second conductor layer comprises: a second coil pattern having a coil axis direction parallel to the mounting surface; and a third connection pattern exposed from the mounting surface and connected to the outer peripheral end of the second coil pattern, the third conductor layer includes: a third coil pattern whose coil axis direction is parallel to the mounting surface; and a fourth connection pattern exposed from the mounting surface and separated from the third coil pattern in the plane, the second connection pattern, the third connection pattern and the fourth connection pattern overlap with each other when viewed from the stacking direction, and are connected to each other via through holes provided in the insulating resin layer, the first terminal electrode is provided on the mounting surface in contact with the first connection pattern, the second terminal electrode is provided on the mounting surface in contact with the second connection pattern, the third connection pattern and the fourth connection pattern, and at least in the second conductor layer, a magnetic body is arranged in an end area overlapping with the first connection pattern when viewed from the stacking direction.

[0011] Effects of the Invention

[0012] According to the present disclosure, there is provided a technology for improving the inductance by increasing the volume of a magnetic body in a coil component having a structure in which a plurality of conductor layers stacked via an insulating resin layer are buried in a magnetic body. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 (a) is a schematic perspective view showing the appearance of a coil component 100 according to one embodiment of the present disclosure. Figure 1 (b) is a schematic perspective view showing a state where the terminal electrodes 131 and 132 are removed from the coil component 100 according to the present embodiment.

[0014] Figure 2 It is a schematic plan view for explaining the structure of the conductor layer L1.

[0015] Figure 3 It is a schematic plan view for explaining the structure of the conductor layer L2.

[0016] Figure 4 It is a schematic plan view for explaining the structure of the conductor layer L3.

[0017] Figure 5It is a schematic plan view for explaining the structure of the conductor layer L4.

[0018] Figure 6 It is a schematic plan view for explaining the structure of the conductor layer L5.

[0019] Figure 7 It is a schematic plan view for explaining the structure of the conductor layer L6.

[0020] Figure 8 It is a schematic perspective view showing the appearance of the coil component according to the first modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0021] Fig. 9 It is a schematic perspective view showing the appearance of a coil component according to a second modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0022] Fig.10 It is a schematic perspective view showing the appearance of a coil component according to a third modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0023] Fig.11 It is a schematic perspective view showing the appearance of a coil component according to a fourth modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0024] Description of Reference Numerals

[0025] 10, 20, 30, 40, 50, 60 coil patterns

[0026] 11, 12, 21, 22, 31, 32, 42, 52, 62 connection patterns

[0027] 71~75、81~85 through holes

[0028] 100 Coil Components

[0029] 110 Magnetic Body

[0030] 111~116 Surface of magnetic body

[0031] 120 Insulation resin layer

[0032] 131, 132 terminal electrodes

[0033] D2~D6 end area

[0034] L1~L6 conductor layer DETAILED DESCRIPTION

[0035] Hereinafter, embodiments of the technology disclosed herein will be described in detail with reference to the drawings.

[0036] Figure 1(a) is a schematic perspective view showing the appearance of a coil component 100 according to one embodiment of the present disclosure. Figure 1 (b) is a schematic perspective view showing a state where the terminal electrodes 131 and 132 are removed from the coil component 100 according to the present embodiment.

[0037] like Figure 1 (a) and Figure 1 As shown in (b), the coil component 100 of this embodiment includes: a magnetic body 110 composed of a composite material of a magnetic filler composed of a metal magnetic body and a resin adhesive; and a plurality of conductor layers L1 to L6 embedded in the magnetic body 110 and stacked via an insulating resin layer 120. The conductor patterns provided in the conductor layers L1 to L6 are insulated from the magnetic body 110 by the insulating resin layer 120. The conductor patterns provided in the conductor layers L1 to L6 are composed of a good conductor such as Cu (copper). The insulating resin layer 120 is composed of a non-magnetic insulating resin.

[0038] The coil component 100 of the present embodiment is an embedded type coil component having an insulating resin layer 120 and a structure in which the conductor layers L1 to L6 are embedded in the magnetic body 110, and the structure is different from that of a laminated type coil component in which magnetic sheets and coil patterns made of ceramics or the like are alternately laminated. For example, in a laminated type coil component, a magnetic sheet is interposed between coil patterns adjacent in the lamination direction, but in the coil component 100 of the present embodiment, coil patterns adjacent in the lamination direction are insulated by the insulating resin layer 120, and the magnetic body 110 is not interposed between the two. In addition, the structure of the sheet coil (sheet coil) of the type in which the coil pattern is formed on the printed circuit board is also different.

[0039] The magnetic body 110 has: surfaces 111 and 112 constituting the XZ plane and located on opposite sides; surfaces 113 and 114 constituting the YZ plane and located on opposite sides; and surfaces 115 and 116 constituting the XY plane and located on opposite sides. The surface 111 constitutes the mounting surface facing the surface of the circuit board when actually used. In addition, the Z direction is the stacking direction of the conductor layers L1 to L6. That is, in the coil component 100 of this embodiment, the mounting surface is parallel to the stacking direction.

[0040] Exposed on the mounting surface 111 are: connection patterns 11 and 12 located on the conductor layer L1; connection pattern 22 located on the conductor layer L2; connection pattern 32 located on the conductor layer L3; connection pattern 42 located on the conductor layer L4; connection pattern 52 located on the conductor layer L5; and connection pattern 62 located on the conductor layer L6. Furthermore, the terminal electrode 131 is disposed on the mounting surface 111 in contact with the connection pattern 11. The terminal electrode 132 is disposed on the mounting surface 111 in contact with the connection patterns 12, 22, 32, 42, 52, and 62. Figure 1In the example shown in (b), the exposed width W1 of the connection pattern 11 exposed from the mounting surface 111 in the horizontal direction (X direction) is smaller than the exposed width W2 of the connection patterns 12 , 22 , 32 , 42 , 52 , 62 exposed from the mounting surface 111 in the horizontal direction (X direction).

[0041] Figure 2 to Figure 7 Each of them is a schematic plan view for explaining the structure of the conductor layers L1 to L6.

[0042] like Figure 2 As shown, the conductor layer L1 has a coil pattern 10 and connection patterns 11 and 12. A magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 10 and the outer area located outside the coil pattern 10 in the radial direction, with an insulating resin layer 120 interposed therebetween. The coil pattern 10 is wound around for about 2 turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 10 is connected to the connection pattern 11. The connection pattern 11 is a portion located near the outer peripheral end of the coil pattern 10, and is a portion extending in the -Y direction away from the turns located on the inner peripheral side. That is, the connection pattern 11 is a portion sandwiched by the magnetic body 110 from both sides in the width direction (X direction) of the coil pattern 10, with the insulating resin layer 120 interposed therebetween. The connection pattern 12 is not connected to the coil pattern 10 in the plane, and is independent in the plane. The coil pattern 10 and the connection pattern 12 are separated by the insulating resin layer 120.

[0043] like Figure 3 As shown, the conductor layer L2 has a coil pattern 20 and a connection pattern 22. A magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 20 and the outer area located outside the coil pattern 20 in the radial direction, with an insulating resin layer 120 interposed therebetween. The coil pattern 20 is wound around for about 2 turns, and the adjacent turns are insulated by the insulating resin layer 120. The inner peripheral end of the coil pattern 20 is connected to the inner peripheral end of the coil pattern 10 via a via hole 71 provided in the insulating resin layer 120. The connection pattern 22 is not connected to the coil pattern 20 in the plane, is independent in the plane, and is connected to the connection pattern 12 via a via hole 81 provided in the insulating resin layer 120. The coil pattern 20 and the connection pattern 22 are separated by the insulating resin layer 120. The portion of the magnetic body 110 located in the conductor layer L2 that overlaps with the connection pattern 11 located in the conductor layer L1 when viewed from the Z direction constitutes an end region D2.

[0044] like Figure 4As shown, the conductor layer L3 has a coil pattern 30 and a connection pattern 32. A magnetic body 110 is arranged in the inner diameter region surrounded by the coil pattern 30 and in the outer region located outside the coil pattern 30 in the radial direction, with an insulating resin layer 120 interposed therebetween. The coil pattern 30 is wound around for about two turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 30 is connected to the outer peripheral end of the coil pattern 20 via a through hole 72 provided in the insulating resin layer 120. The connection pattern 32 is not connected to the coil pattern 30 in the plane, is independent in the plane, and is connected to the connection pattern 22 via a through hole 82 provided in the insulating resin layer 120. The coil pattern 30 and the connection pattern 32 are separated by the insulating resin layer 120. The portion of the magnetic body 110 located in the conductor layer L3 that overlaps with the connection pattern 11 located in the conductor layer L1 when viewed from the Z direction constitutes an end region D3.

[0045] like Figure 5 As shown, the conductor layer L4 has a coil pattern 40 and a connection pattern 42. A magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 40 and in the outer area located outside the coil pattern 40 in the radial direction, with an insulating resin layer 120 interposed therebetween. The coil pattern 40 is wound around for about 2 turns, and the adjacent turns are insulated by the insulating resin layer 120. The inner peripheral end of the coil pattern 40 is connected to the inner peripheral end of the coil pattern 30 via a through hole 73 provided in the insulating resin layer 120. The connection pattern 42 is not connected to the coil pattern 40 in the plane, is independent in the plane, and is connected to the connection pattern 32 via a through hole 83 provided in the insulating resin layer 120. The coil pattern 40 and the connection pattern 42 are separated by the insulating resin layer 120. The portion of the magnetic body 110 located in the conductor layer L4 that overlaps with the connection pattern 11 located in the conductor layer L1 when viewed from the Z direction constitutes an end region D4.

[0046] like Figure 6 As shown, the conductor layer L5 has a coil pattern 50 and a connection pattern 52. The magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 50 and the outer area located outside the coil pattern 50 in the radial direction, with the insulating resin layer 120 interposed therebetween. The coil pattern 50 is wound around for about 2 turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 50 is connected to the outer peripheral end of the coil pattern 40 via a through hole 74 provided in the insulating resin layer 120. The connection pattern 52 is not connected to the coil pattern 50 in the plane, is independent in the plane, and is connected to the connection pattern 42 via a through hole 84 provided in the insulating resin layer 120. The coil pattern 50 and the connection pattern 52 are separated by the insulating resin layer 120. The portion of the magnetic body 110 located in the conductor layer L5 that overlaps with the connection pattern 11 located in the conductor layer L1 when viewed from the Z direction constitutes the end region D5.

[0047] like Figure 7 As shown, the conductor layer L6 has a coil pattern 60 and a connection pattern 62. The magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 60 and the outer area located outside the coil pattern 60 in the radial direction via the insulating resin layer 120. The coil pattern 60 is wound around about 1.5 turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 60 is connected to the connection pattern 62. The connection pattern 62 is a portion located near the outer peripheral end of the coil pattern 60, and is a portion extending in the -Y direction in a manner away from the turns located on the inner peripheral side. That is, the connection pattern 62 is a portion sandwiched by the magnetic body 110 from both sides in the width direction (X direction) of the coil pattern 60 via the insulating resin layer 120. The connection pattern 62 is connected to the connection pattern 52 via the through hole 85 provided in the insulating resin layer 120. The inner peripheral end of the coil pattern 60 is connected to the inner peripheral end of the coil pattern 50 via the through hole 75 provided in the insulating resin layer 120. The portion of the magnetic body 110 located in the conductive layer L6 that overlaps with the connection pattern 11 located in the conductive layer L1 in a plan view as viewed from the Z direction constitutes an end region D6.

[0048] like Figure 1 (a) and Figure 1 As shown in (b), the connection patterns 12, 22, 32, 42, 52, and 62 overlap each other when viewed from the Z direction, and are all exposed from the surface 111 of the magnetic body 110. In contrast, in the top view viewed from the Z direction, the end regions D2 to D6 overlapping the connection patterns 11 are not provided with conductor patterns, but are provided with the magnetic body 110. As a result, the volume of the magnetic body 110 located in the conductor layers L2 to L6 increases compared to the case where the end regions D2 to D6 are buried with conductor patterns, so that high inductance can be obtained. In addition, since the volume of the magnetic body 110 increases, the leakage flux is also reduced.

[0049] Furthermore, the volume of the magnetic body 110 located in the conductor layer L1 is also increased because the exposed width W1 of the connection pattern 11 is smaller than the exposed width W2 of the connection patterns 12, 22, 32, 42, 52, and 62. On the other hand, the exposed width W2 of the connection patterns 12, 22, 32, 42, 52, and 62 requires a certain width because the through holes 81 to 85 need to be formed.

[0050] When actually manufacturing the coil component 100 of this embodiment, the insulating resin layer 120 and the conductor layers L1 to L6 are alternately stacked in sequence, and then the magnetic body 110 is filled in the space where the insulating resin layer 120 and the conductor layers L1 to L6 do not exist, thereby completing the coil component 100. In this case, in the conductor layers L1 to L5 located below the connection pattern 62 located on the conductor layer L6, some base for forming the connection pattern 62 is required, but in this embodiment, the connection patterns 12, 22, 32, 42, and 52 function as the base of the connection pattern 62. In addition, the connection patterns 12, 22, 32, 42, and 52 are connected to the connection pattern 62 via the through holes 81 to 85, so that the resistance value between the terminal electrode 132 and the coil pattern 60 is also reduced.

[0051] As described above, in the coil component 100 of the present embodiment, no conductor pattern is provided in the end areas D2 to D6 overlapping with the connection pattern 11 constituting the outer peripheral end of the coil pattern 10 located in the bottom layer, and the end areas D2 to D6 are buried in the magnetic body 110, so the volume of the magnetic body 110 is increased, resulting in that a high inductance can be obtained.

[0052] Figure 8 It is a schematic perspective view showing the appearance of the coil component according to the first modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0053] Figure 8 The first modification shown is different from the coil component 100 of the above embodiment in that a connection pattern 21 is added to the conductor layer L2. The connection pattern 21 is arranged at Figure 3 The end region D2 shown is a position overlapping with the connection pattern 11 when viewed from the Z direction. The connection pattern 21 is not connected to the coil pattern 20 in the plane, is independent in the plane, and is connected to the connection pattern 11 via a through hole provided in the insulating resin layer 120. As illustrated in the first modification, the connection pattern 21 can also be arranged in the end region D2 located in the conductor layer L2. As a result, the terminal electrode 131 contacts the two connection patterns 11 and 21, so the connection reliability of the terminal electrode 131 is improved.

[0054] Fig. 9 It is a schematic perspective view showing the appearance of a coil component according to a second modification, and shows a state in which terminal electrodes 131 and 132 are removed.

[0055] Fig. 9 The second modification shown is different from the coil component 100 of the above embodiment in that connection patterns 21 and 31 are added to the conductor layers L2 and L3, respectively. The connection pattern 21 is arranged at Figure 3The end region D2 shown is a position overlapping the connection pattern 11 when viewed from the Z direction. The connection pattern 21 is not connected to the coil pattern 20 in the plane, but is independent in the plane and connected to the connection pattern 11 via a through hole provided in the insulating resin layer 120. The connection pattern 31 is arranged at Figure 4 The end region D3 shown is a position overlapping with the connection pattern 11 when viewed from the Z direction. The connection pattern 31 is not connected to the coil pattern 30 in the plane, but is independent in the plane and connected to the connection pattern 21 via a through hole provided in the insulating resin layer 120. As shown in the second modification, as long as the connection pattern connected to the terminal electrode 131 (in Fig. 9 In the example shown, the number of connection patterns 11, 21, 31) is less than the number of connection patterns connected to the terminal electrode 132 (in Fig. 9 In the example shown, the number of connection patterns is 12, 22, 32, 42, 52, 62), and it is also possible to have multiple end regions (in Fig. 9 In the example shown, connection patterns are provided for the end regions D2, D3).

[0056] Fig.10 It is a schematic perspective view showing the appearance of a coil component according to a third modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0057] Fig.10 The third modification shown is different from the coil component 100 of the above embodiment in that the exposed widths W21, W22, W23, W24, W25, and W26 of the connection patterns 12, 22, 32, 42, 52, and 62 in the X direction are

[0058] W21<W22<W23<W24<W25<W26.

[0059] As shown in the third modification, the exposed width of the connection pattern in contact with the terminal electrode 132 may be wider toward the upper layer. This can further increase the volume of the magnetic body 110. In addition, the resistance value between the terminal electrode 132 and the coil pattern 60 is strongly dependent on the exposed width of the connection pattern located in the upper layer. Fig.10 Even with the structure shown, the resistance value between the terminal electrode 132 and the coil pattern 60 hardly increases.

[0060] Fig.11 It is a schematic perspective view showing the appearance of a coil component according to a fourth modification, and shows a state in which the terminal electrodes 131 and 132 are removed.

[0061] Fig.11The fourth modification shown is different from the coil component 100 of the above embodiment in that the exposed widths W21, W22, W23, W24, W25, and W26 of the connection patterns 12, 22, 32, 42, 52, and 62 in the X direction are

[0062] W21<W22<W23, and

[0063] W26<W25<W24.

[0064] As shown in the fourth variant, the exposed width of the connection pattern in contact with the terminal electrode 132 may be narrowed from the center in the stacking direction toward the upper and lower layers. This can increase the volume of the portion of the magnetic body 110 located near the surface 111 constituting the mounting surface that is close to the two ends in the stacking direction. The closer the magnetic body 110 located near the mounting surface is to the two ends in the stacking direction, the higher the magnetic flux density is. Fig.11 In the modified example shown, higher inductance can be obtained.

[0065] Although the embodiments of the technology of the present disclosure have been described above, the technology of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention, and such modifications are naturally included in the scope of the technology of the present disclosure.

[0066] For example, in the above-described embodiment, six conductor layers L1 to L6 are stacked, but the number of conductor layers is not particularly limited, and for example, a four-layer structure may be employed.

[0067] The technology of the present disclosure includes the following structural examples, but the present disclosure is not limited thereto.

[0068] A coil component according to one aspect of the present disclosure comprises: a magnetic body having a mounting surface; a plurality of conductor layers embedded in the magnetic body and stacked with insulating resin layers therebetween; and a first terminal electrode and a second terminal electrode, the plurality of conductor layers comprising: a first conductor layer located at one end in the stacking direction; a second conductor layer located at the other end in the stacking direction; and one or more third conductor layers located between the first conductor layer and the second conductor layer, the first conductor layer comprising: a first coil pattern having a coil axis direction parallel to the mounting surface; a first connection pattern exposed from the mounting surface and connected to an outer peripheral end of the first coil pattern; and a second connection pattern exposed from the mounting surface and separated from the first coil pattern in the plane, the second conductor layer comprising: a second coil pattern having a coil axis direction parallel to the mounting surface; and a third connection pattern exposed from the mounting surface and connected to the outer peripheral end of the second coil pattern, the third conductor layer includes: a third coil pattern whose coil axis direction is parallel to the mounting surface; and a fourth connection pattern exposed from the mounting surface and separated from the third coil pattern in the plane, the second connection pattern, the third connection pattern and the fourth connection pattern overlap each other when viewed from the stacking direction, and are connected to each other via a through hole provided in the insulating resin layer, the first terminal electrode is provided on the mounting surface in a manner of contacting the first connection pattern, the second terminal electrode is provided on the mounting surface in a manner of contacting the second connection pattern, the third connection pattern and the fourth connection pattern, and at least in the second conductor layer, a magnetic body is arranged in an end region overlapping with the first connection pattern when viewed from the stacking direction. Thus, the volume of the magnetic body can be increased.

[0069] The coil component may include two or more third conductor layers, and a magnetic body may be disposed in the end regions of the third conductor layers overlapping the first connection pattern in a plan view from the stacking direction.

[0070] In the coil component, there may be more than two third conductor layers, and at least one of the plurality of third conductor layers adjacent to the first conductor layer further includes: a fifth connection pattern that is separated from the third coil pattern in the plane and overlaps with the first connection pattern when viewed from the stacking direction, the first connection pattern and the fifth connection pattern are connected to each other via a through hole provided in the insulating resin layer, and the first terminal electrode is provided on the mounting surface in a manner of contacting the first connection pattern and the fifth connection pattern. Thus, the connection area between the first terminal electrode and the connection pattern can be enlarged.

[0071] In the coil component, the first connection pattern exposed from the mounting surface may have a smaller exposure width in a horizontal direction perpendicular to the stacking direction than the third connection pattern exposed from the mounting surface. This further increases the volume of the magnetic body.

[0072] In the coil component, the second connection pattern exposed from the mounting surface may have a smaller exposure width in a horizontal direction perpendicular to the stacking direction than a third connection pattern exposed from the mounting surface. This further increases the volume of the magnetic body.

[0073] In the coil component, the second and third connection patterns exposed from the mounting surface may have a smaller exposure width in a horizontal direction perpendicular to the stacking direction than the fourth connection pattern exposed from the mounting surface. This further improves the inductance.

Claims

1. A coil component, wherein: have: A magnetic body having a mounting surface; A plurality of conductor layers embedded in the magnetic body and stacked with insulating resin layers interposed therebetween; as well as a first terminal electrode and a second terminal electrode, The plurality of conductor layers include: a first conductor layer located at one end in a stacking direction; a second conductor layer located at the other end in the stacking direction; and one or more third conductor layers located between the first conductor layer and the second conductor layer. The first conductor layer includes: a first coil pattern whose coil axis direction is parallel to the mounting surface; a first connection pattern exposed from the mounting surface and connected to the outer peripheral end of the first coil pattern; and a second connection pattern exposed from the mounting surface and separated from the first coil pattern in the plane. The second conductor layer includes: a second coil pattern whose coil axis direction is parallel to the mounting surface; and a third connection pattern exposed from the mounting surface and connected to the outer peripheral end of the second coil pattern. The third conductor layer includes: a third coil pattern whose coil axis direction is parallel to the mounting surface; and a fourth connection pattern exposed from the mounting surface and separated from the third coil pattern in the plane, The second connection pattern, the third connection pattern, and the fourth connection pattern overlap each other in a plan view from the stacking direction, and are connected to each other via through holes provided in the insulating resin layer. The first terminal electrode is provided on the mounting surface in a manner of contacting the first connection pattern. The second terminal electrode is provided on the mounting surface in a manner of contacting the second connection pattern, the third connection pattern, and the fourth connection pattern. The magnetic body is disposed at least in an end region of the second conductor layer that overlaps with the first connection pattern in a plan view as seen in the stacking direction.

2. The coil component according to claim 1, wherein The third conductor layer has two or more layers, The magnetic body is disposed in the end regions of the plurality of third conductive layers overlapping with the first connection patterns in a plan view as seen in the stacking direction.

3. The coil component according to claim 1, wherein The third conductor layer has two or more layers, At least one of the plurality of third conductor layers adjacent to the first conductor layer further includes a fifth connection pattern that is separated from the third coil pattern in a plane and overlaps with the first connection pattern when viewed from above in the stacking direction. The first connection pattern and the fifth connection pattern are connected to each other via a through hole provided in the insulating resin layer. The first terminal electrode is provided on the mounting surface so as to be in contact with the first connection pattern and the fifth connection pattern.

4. The coil component according to any one of claims 1 to 3, wherein: An exposed width of the first connection pattern exposed from the mounting surface in a horizontal direction perpendicular to the stacking direction is smaller than an exposed width of the third connection pattern exposed from the mounting surface in the horizontal direction.

5. The coil component according to any one of claims 1 to 3, wherein: An exposed width of the second connection pattern exposed from the mounting surface in a horizontal direction perpendicular to the stacking direction is smaller than an exposed width of the third connection pattern exposed from the mounting surface in the horizontal direction.

6. The coil component according to any one of claims 1 to 3, wherein: The exposed widths of the second connection pattern and the third connection pattern exposed from the mounting surface in a horizontal direction perpendicular to the stacking direction are smaller than the exposed width of the fourth connection pattern exposed from the mounting surface in the horizontal direction.

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