Mechanical disturbance compensation system and method for charged particle beam

Abstract

The invention provides a mechanical interference compensation system and method for a charged particle beam, and the system comprises a mechanical interference signal obtaining device which is used for measuring the mechanical interference suffered by the charged particle beam, and obtaining a mechanical interference signal; the signal compensation device is used for generating a control signal according to the mechanical interference signal; and the field generator is used for generating a modulation field according to the control signal, and the modulation field acts on the charged particle beam to compensate the mechanical disturbance. The mechanical interference compensation system provided by the invention can compensate the mechanical interference suffered by the charged particle beam and improve the precision of the charged particle beam equipment.

Description

Technical Field

[0001] The present application relates to the field of charged particle beams, and in particular to a mechanical interference compensation system and method for charged particle beams. Background Art

[0002] As the localization rate accelerates, semiconductor equipment has great potential in the current and future markets. As a semiconductor precision instrument, charged particle beam equipment has high requirements for mechanical interference during operation, and has the characteristics of high value, high precision, and demanding use environment. Mechanical interference generated in the environment, such as micro-vibration, will cause the accuracy of charged particle beam equipment to decrease, resulting in unacceptable deviations and damage, and the sources of mechanical interference that can damage the equipment come from all aspects of the environment.

[0003] Therefore, how to reduce or eliminate the impact of mechanical interference such as micro-vibration and improve the accuracy of charged particle beam equipment is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present application provides a system and method for compensating mechanical interference of a charged particle beam, which can improve the accuracy of a charged particle beam device.

[0005] In a first aspect, a mechanical interference compensation system for a charged particle beam is provided, comprising: a mechanical interference signal acquisition device, used to measure the mechanical interference exerted on the charged particle beam and obtain a mechanical interference signal; a signal compensation device, used to generate a control signal according to the mechanical interference signal; and a field generator, used to generate a modulation field according to the control signal, wherein the modulation field acts on the charged particle beam to compensate for the mechanical interference.

[0006] The present application provides a mechanical interference compensation system for a charged particle beam. A mechanical interference signal acquisition device can capture the mechanical interference experienced by the charged particle beam in real time. A signal compensation device analyzes the mechanical interference to generate a control signal. A field generator generates a modulation field according to the control signal. The modulation field acts on the charged particle beam to compensate for the mechanical interference experienced by the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0007] In a possible implementation, the signal compensation device includes a signal conversion control module and a signal generator, wherein the signal conversion control module is used to convert the mechanical interference signal into an electrical compensation signal, and the signal generator is used to generate the above control signal according to the electrical compensation signal. The electrical compensation signal has the same frequency and phase as the mechanical interference signal, and the control signal has the same frequency and phase as the mechanical interference signal.

[0008] The signal conversion control module can be a hardware collection of similar functions such as a signal control board and a spectrum analyzer, which can convert a mechanical interference signal into an electrical compensation signal to express mechanical vibration, such as a vibration with a frequency of 50 Hz and an amplitude of 5 nanometers (nm). The electrical compensation signal converted from the mechanical interference signal is input into a signal generator to generate a control signal. For example, the electrical compensation signal with a frequency of 50 Hz and an amplitude of 5 nm is transmitted to an adjustable power supply / pulse generator to generate a control signal with a frequency of 50 Hz and an amplitude of 5 nm.

[0009] The control signal is transmitted to the field generator to generate a modulated field. For example, the field generator is a solenoid, and the control signal generated by the power supply / pulse generator is transmitted to the solenoid to generate a magnetic field of corresponding magnitude, so that the charged particle beam is subjected to a corresponding Lorentz force, thereby generating a controlled motion to compensate for the mechanical disturbance.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal.

[0011] The present application provides a mechanical interference compensation system for a charged particle beam. The compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal, which can make the charged particle beam vibrate along with the mechanical interference and undergo the same displacement in the same reference frame, presenting a relative static effect, thereby compensating for the mechanical interference suffered by the charged particle beam.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal is associated with any one or more of the following parameters: the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator.

[0013] There may be a certain relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal, such as y=ax+b, so that the generated modulation field can just offset the mechanical vibration. Wherein, x is the amplitude of the mechanical interference signal, y is the compensation amplitude, and a and b are preset parameters. For example, a mechanical interference signal with a frequency of 50Hz and an amplitude of 5nm can be converted into an electrical compensation signal with a frequency of 50Hz and an amplitude of a×5+b, so that the generated modulation field can just offset the vibration of 5nm after acting on the charged particle beam. The specific relationship can be given according to the actual situation, and is related to many parameters such as the landing voltage of the charged particle beam, the working distance, and the number of solenoid turns. The landing voltage of a charged particle refers to the potential difference or voltage generated when a charged particle (such as an electron, an ion, etc.) contacts an object or surface. The working distance is the distance between the generator of the charged particle beam and the sample stage. The number of turns of the solenoid refers to the number of coils wound in the solenoid.

[0014] The present application provides a mechanical interference compensation system for a charged particle beam, which can set the relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal according to any one or more parameters of the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator, so that the generated modulation field can compensate for the mechanical interference of the charged particle beam after acting on the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0015] In combination with the first aspect, in some implementations of the first aspect, the mechanical interference signal acquisition device includes a laser interferometer or a micro-vibration sensor.

[0016] Exemplarily, a laser interferometer can be used to obtain a mechanical interference signal. The laser interferometer can be arranged in a vacuum chamber or a non-vacuum chamber, and after calibration, it is used to monitor the mechanical interference between the charged particle beam generator (such as the end of the pole shoe) and the sample stage, and then the identified mechanical interference signal can be transmitted through the optical fiber. The mechanical interference signal obtained by the laser interferometer is a displacement signal in the time domain. If two lasers are respectively hit on two objects to be measured, the time domain displacement changes of the two can be obtained. After the difference is made, the relative displacement change of the two can be obtained, which can be regarded as one of the expressions of the mechanical interference signal.

[0017] For example, a micro-vibration sensor can be used to obtain a mechanical interference signal. The micro-vibration sensor can be arranged in a vacuum chamber, fixed on a mirror group, a sample stage or other core components, and used to monitor mechanical interference after calibration, and then the identified mechanical interference signal can be transmitted through a cavity-penetrating data line. In this case, the mechanical interference signal can be expressed by acceleration and velocity.

[0018] The present application provides a mechanical interference compensation system for a charged particle beam, which can capture the mechanical interference of the charged particle beam in real time through a laser interferometer or a micro-vibration sensor. A signal compensation device analyzes the mechanical interference to generate a control signal. A field generator generates a modulation field according to the control signal. The modulation field acts on the charged particle beam to compensate for the mechanical interference of the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0019] In combination with the first aspect, in some implementations of the first aspect, the field generator includes a magnetic field generator or an electric field generator, and the modulation field includes a magnetic field or an electric field.

[0020] When the field generator is a magnetic field generator, the modulation field is a magnetic field, and the charged particle beam moves in a controlled manner according to the Lorentz force of the magnetic field. When the field generator is an electric field generator, the modulation field is an electric field, and the charged particle beam moves in a controlled manner according to the Coulomb force of the electric field.

[0021] The present application provides a mechanical interference compensation system for a charged particle beam. A mechanical interference signal acquisition device can capture the mechanical interference suffered by the charged particle beam in real time. A signal compensation device analyzes the mechanical interference to generate a control signal. A magnetic field or electric field generator generates a magnetic field or electric field according to the control signal. The magnetic field or electric field acts on the charged particle beam to compensate for the mechanical interference suffered by the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0022] In combination with the first aspect, in certain implementations of the first aspect, the mechanical interference signal acquisition device is located in the sample stage or the charged particle beam generating device, and the charged particle beam is used to scan the sample on the sample stage.

[0023] In a second aspect, a method for compensating mechanical interference of a charged particle beam is provided, the method comprising: acquiring a mechanical interference signal, the mechanical interference signal being used to indicate the mechanical interference suffered by the charged particle beam; generating a control signal according to the mechanical interference signal, the control signal being used to generate a modulation field, the modulation field acting on the charged particle beam to compensate for the mechanical interference.

[0024] The present application provides a method for compensating mechanical interference of a charged particle beam, which can obtain the mechanical interference of the charged particle beam in real time, analyze the mechanical interference to generate a control signal, and generate a modulation field according to the control signal. The modulation field acts on the charged particle beam to compensate for the mechanical interference of the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0025] In a possible implementation, generating a control signal according to the mechanical interference signal includes: generating an electrical compensation signal according to the mechanical interference signal; and generating the control signal according to the electrical compensation signal, wherein the electrical compensation signal has the same frequency and phase as the mechanical interference signal, and the control signal has the same frequency and phase as the mechanical interference signal.

[0026] In combination with the second aspect, in certain implementations of the second aspect, the compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal.

[0027] The present application provides a method for compensating mechanical interference of a charged particle beam. The compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal, which can make the charged particle beam vibrate along with the mechanical interference and undergo the same displacement in the same reference frame, presenting a relative static effect, thereby compensating for the mechanical interference suffered by the charged particle beam.

[0028] In combination with the second aspect, in certain implementations of the second aspect, the relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal is associated with any one or more of the following parameters: the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator.

[0029] There may be a certain relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal, such as y=ax+b, so that the generated modulation field can just offset the mechanical vibration. Wherein, x is the amplitude of the mechanical interference signal, y is the compensation amplitude, and a and b are preset parameters. For example, a mechanical interference signal with a frequency of 50Hz and an amplitude of 5nm can be converted into an electrical compensation signal with a frequency of 50Hz and an amplitude of a×5+b, so that the generated modulation field can just offset the vibration of 5nm after acting on the charged particle beam. The specific relationship can be given according to the actual situation, and is related to many parameters such as the landing voltage of the charged particle, the working distance, and the number of solenoid turns. The landing voltage of the charged particle refers to the potential difference or voltage generated when a charged particle (such as electrons, ions, etc.) contacts an object or surface. The working distance is the distance between the generator of the charged particle beam and the sample stage. The number of turns of the solenoid refers to the number of coils wound in the solenoid.

[0030] The present application provides a method for compensating mechanical interference of a charged particle beam, which can set the relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal according to any one or more parameters of the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator, so that the generated modulation field can compensate for the mechanical interference of the charged particle beam after acting on the charged particle beam, thereby improving the accuracy of the charged particle beam equipment.

[0031] In a third aspect, a mechanical interference compensation device for a charged particle beam is provided, the device comprising: an acquisition unit, used to acquire a mechanical interference signal, the mechanical interference signal is used to indicate the mechanical interference suffered by the charged particle beam; a processing unit, used to generate a control signal according to the mechanical interference signal, the control signal is used to generate a modulation field, the modulation field acts on the charged particle beam to compensate for the mechanical interference. The device may correspond to the signal compensation device in the first aspect or any of its aspects.

[0032] In combination with the third aspect, in certain implementations of the third aspect, the compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal.

[0033] In combination with the third aspect, in certain implementations of the third aspect, the relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal is associated with any one or more of the following parameters: the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator.

[0034] The beneficial effects of the third aspect and any possible implementation of the third aspect correspond to the beneficial effects of the second aspect and any possible implementation of the second aspect, and will not be elaborated on this.

[0035] In a fourth aspect, an embodiment of the present application provides a computer device, which includes a processor, wherein the processor is used to couple with a memory, read and execute instructions and / or program codes in the memory to execute the second aspect or any possible implementation of the second aspect.

[0036] Optionally, the processor may be a general-purpose processor, which may be implemented by hardware or software. When implemented by hardware, the processor may be a logic circuit, an integrated circuit, etc.; when implemented by software, the processor may be a general-purpose processor implemented by reading software code stored in a memory, which may be integrated in the processor or located outside the processor and exist independently.

[0037] In a fifth aspect, an electronic device is provided, comprising a charged particle beam generating device and a mechanical interference compensation system according to the first aspect and any possible implementation of the first aspect, wherein the charged particle beam generating device is used to generate a charged particle beam, and the mechanical interference compensation system is used to compensate for mechanical interference experienced by the charged particle beam.

[0038] The mechanical interference compensation system or method provided in the present application is applicable to semiconductor vacuum precision equipment using charged particle beams, and is also applicable to other precision equipment in other vacuum, non-vacuum, semiconductor and non-semiconductor industries that work based on charged particle beams, including but not limited to electron beam detection equipment such as scanning electron microscopes, electron beam lithography equipment, focused ion beam lithography, ion beam etching equipment, electron beam induced deposition, electron beam welding, etc.

[0039] In a sixth aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a program code. When the computer storage medium runs on a computer, it enables the computer to execute the second aspect or any possible implementation of the second aspect.

[0040] By way of example, these computer-readable storages include, but are not limited to, one or more of the following: read-only memory (ROM), programmable ROM (PROM), erasable PROM (EPROM), Flash memory, electrically EPROM (EEPROM), and hard drive.

[0041] Optionally, as an implementation manner, the above-mentioned storage medium may specifically be a non-volatile storage medium.

[0042] In a seventh aspect, an embodiment of the present application provides a computer program product, the computer program product comprising: a computer program code, when the computer program code is run on a computer, the computer executes the second aspect or any possible implementation of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the vibration source of harmful environmental vibration of a precision instrument.

[0044] Figure 2 It is a standard schematic diagram of foundation vibration.

[0045] Figure 3 It is a schematic diagram of the principle of the mechanical interference compensation method provided in an embodiment of the present application.

[0046] Figure 4 It is a schematic diagram of a mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0047] Figure 5 It is a schematic diagram of the architecture of a mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0048] Figure 6 It is a schematic diagram of another mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0049] Figure 7 It is an exemplary flow chart of a method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0050] Figure 8 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0051] Fig. 9 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0052] Fig.10 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0053] Fig.11 This is a structural example diagram of an electronic device provided in an embodiment of the present application.

[0054] Fig.12 This is a structural example diagram of a mechanical interference compensation device provided in an embodiment of the present application.

[0055] Fig.13 This is a diagram showing an example of the structure of a computer device provided in an embodiment of the present application.

[0056] Fig.14 It is an example diagram of a computer program product provided in an embodiment of the present application. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work should fall within the scope of protection of the present application.

[0058] In the embodiments of the present application, words such as "exemplary" and "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0059] The business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Ordinary technicians in this field can know that with the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0060] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0061] In the present application, "at least one" means one or more, and "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: including the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0062] Semiconductor industry equipment mainly includes photolithography machines, etching equipment, measurement and testing equipment, cleaning equipment and ion implantation machines. According to data from the International Semiconductor Equipment and Materials Industry Association (SEMI), the measurement and testing equipment market is the largest, with a total global market size of US$18.2 billion in 21 years. Measurement and testing equipment and photolithography equipment based on the principle of charged particle beams have a high market share and are of various types, such as electron beam detection equipment, electron beam lithography equipment, focused ion beam lithography, ion beam etching equipment, etc.

[0063] As a semiconductor precision instrument, charged particle beam equipment has high requirements for mechanical interference during operation, and has the characteristics of high value, high precision, and demanding use environment. Mechanical interference generated in the environment, such as micro-vibration, can cause the charged particle beam equipment to reduce accuracy, produce unacceptable deviations, and cause damage. The sources of mechanical interference that can damage the equipment come from all aspects of the environment. Figure 1 It is a schematic diagram of the vibration sources of harmful environmental vibrations for precision instruments. The vibration sources mainly include natural vibration sources and artificial vibration sources. Natural vibration sources include earth pulsation, earthquakes, typhoons and others. Artificial vibration sources inside buildings include people walking and power equipment. Artificial vibration sources outside buildings include rail transit, ground transportation and others. Figure 2 It is a standard diagram of foundation vibration. The horizontal axis is 1 / 3 octave and the vertical axis is the root mean square (RMS) of the vibration velocity.

[0064] Reducing, eliminating or compensating for the impact of mechanical interference such as micro-vibration is an important guarantee for the efficient operation of equipment. Table 1 shows the specifications for the allowable values ​​of vibration interference for such precision / ultra-precision instruments and equipment in the semiconductor industry.

[0065] Table 1

[0066]

[0067] Mechanical interference can be further decomposed or weakened into the complex scanning motion of the charged particle beam during scanning imaging, such as two-dimensional expansion in time (scanning time) and space (two-dimensional plane), which is manifested as jitter and glitches on the image. Image glitches refer to the jagged or discontinuous edge phenomenon that appears in the image, also known as jagged artifacts or jagged distortion. It usually appears in the oblique lines, curves or edge parts of the image, making the edge look not smooth, but composed of a series of jagged pixels. If the above idea is further abstracted, it can be understood that there are corresponding fluctuations on the image. If the corresponding fluctuations can be captured in real time, and a device that can make the charged particle beam move in the same direction as the fluctuation is used to compensate synchronously, it can be reflected in the image as no fluctuations.

[0068] The processing of mechanical interference can be divided into three types: source, path and carrier. The current existing technical solutions are mostly aimed at processing at the source (such as adding shielding covers, sound insulation cotton, etc.) and weakening on the transmission path (such as using flexible bellows, adding shock absorbers, etc.), and there are few direct means to deal with the mechanical interference of the carrier. The former two are often constrained by many external conditions, and have the disadvantages of being incomplete, restricted, and easily affected. Therefore, there is an urgent need for a solution to deal with mechanical interference from the perspective of the carrier, which can be free from the constraints of various complex mechanical interference sources in the environment and the physical conditions in the transmission path (such as space, structure, position, etc.), and can directly eliminate the mechanical interference.

[0069] Semiconductor precision / ultra-precision equipment (such as charged particle beam equipment) must be isolated or attenuated from mechanical interference to achieve normal working standards. The current mainstream methods for dealing with mechanical interference of such equipment generally include three categories:

[0070] (1) Active vibration absorber: Based on passive vibration isolation, the active vibration absorber measures the vibration state of the system through a vibration measuring element (sensor), then transforms it in the controller according to the established control strategy, transmits it to a special electromechanical device (actuator), and applies feedback control force to the system to achieve the purpose of suppressing vibration. If fully active vibration isolation is used, passive vibration isolation must be eliminated between the vibration source and the vibration receiving component, and the vibration reduction purpose is achieved directly by the actuator.

[0071] Active vibration absorbers are expensive to purchase, with a low domestic production rate and high R&D costs. In addition, they are difficult to adjust due to complex control strategies. Their vibration isolation frequency band and adjustment capabilities are also limited. They mainly reduce vibration at low frequencies, and high-frequency interference will amplify them. At the same time, they are large in size, heavy in weight, and occupy a large space. The heavier the equipment that needs vibration reduction, the more active vibration isolation units are required, and the more complicated it is to maintain. In addition, active vibration absorbers have high environmental requirements, such as high requirements for foundation flatness.

[0072] (2) Passive shock absorber: Passive shock absorber is mainly composed of elastic stiffness elements and energy dissipation damping elements. Compared with active shock absorber, its structure is simpler, its operation is more stable and reliable, and it can achieve the attenuation effect of mechanical interference.

[0073] Passive vibration absorbers are also large in size and weight, and their vibration reduction capacity is also very limited. They are often unable to isolate low-frequency interference that has a greater impact on precision equipment, and can only attenuate high frequencies. At the same time, due to the structure of the precision equipment itself and the complexity of the vibration transmission path, the internal natural frequency can basically not play a role in attenuation.

[0074] (3) Active and passive hybrid vibration isolation: The actuator is connected in parallel or series with the passive vibration isolation device. The passive vibration isolation isolates high frequencies, while the active vibration isolation isolates low frequencies. This reduces the energy consumption of the control system and achieves better vibration isolation performance and a wider vibration isolation bandwidth.

[0075] Active and passive hybrid vibration isolation is more expensive, larger in size, and has a complex control strategy and a large debugging workload. At the same time, the assembly process is relatively strict and complex, the reliability is relatively low, the structure is delicate and easy to cause damage, and there are risks such as air leakage, reduced accuracy, and deviation.

[0076] For semiconductor precision equipment based on charged particle beams, the impact of mechanical interference is obvious. Existing solutions to eliminate mechanical interference are mostly active and passive vibration isolators, which are costly, have a low localization rate, and occupy a large space. The weight and structure of semiconductor equipment also greatly limit the number, location, and arrangement of vibration isolators. At the same time, the frequency band range and self-adjustment ability of vibration isolation are limited, and the requirements for the installation environment are high, resulting in limited elimination of mechanical interference.

[0077] Therefore, the following technical problems need to be solved:

[0078] (1) Space occupation problem. For semiconductor vacuum equipment, if the space occupied is too large, it will increase the difficulty of transportation and increase the cost of maintenance and site. Therefore, it is necessary to design a mechanical interference compensation structure with a small footprint, which can save costs and improve efficiency. Traditional mechanical interference compensation equipment is about 30-70 centimeters (cm) in length, width and height, and weighs generally 10-50 kilograms (kg), occupying a large space.

[0079] (2) The effective bandwidth and effect of eliminating mechanical interference. Among the existing mainstream mechanical interference elimination methods, active vibration reduction mainly eliminates low-frequency interference, while passive vibration reduction eliminates high-frequency interference. Even if the two are used in combination, the frequency band that can be covered is relatively limited. Ultra-low frequency, high frequency and the inherent frequency of the equipment itself cannot be eliminated. At the same time, the elimination of mechanical interference is only carried out from the perspective of weakening and isolation, and cannot be 100% eliminated. In order to eliminate mechanical interference in the entire frequency band and make the elimination effect close to 100%, a more efficient way and method is needed to compensate for mechanical interference.

[0080] (3) Requirements for the basic environment. Mainstream mechanical interference compensation solutions such as active vibration isolators have requirements for the basic environment and installation environment. For example, they have relatively strict requirements on the flatness of the foundation and the coaxiality with the equipment. At the same time, their robustness is poor. Any slight deviation in the environment will have a great impact on the elimination of mechanical interference, which will in turn affect the accuracy and efficiency of the charged particle beam equipment during scanning and imaging. In severe cases, it may cause irreversible damage to the equipment. Therefore, a mechanical interference compensation system with low environmental requirements and strong robustness is needed.

[0081] (4) The problem of self-regulation ability. The self-regulation ability of mainstream mechanical interference elimination solutions such as active vibration isolators is limited by their principles and structures. For example, the three-way adjustable amplitude is limited, and it can often only cover millimeter-level displacement; the adjustment speed is limited, and the acceleration of motion compensation after actuator feedback is usually 10m / s 2 The following is the limit of plane repeatability stability. It is also limited by the working principle and structure. This value is usually not less than 10 microns. To a certain extent, it determines that the elimination effect of mechanical interference cannot be completely eliminated. Therefore, a mechanical interference compensation method with strong self-adjustment ability, fast response speed, high stability and accuracy is needed.

[0082] (5) Cost issues. Traditional mechanical interference compensation devices have high purchase or R&D costs. The domestic production rate in the market is low, and the R&D costs are relatively high. Foreign suppliers have various problems such as high prices, unstable or limited cooperation. Therefore, it is necessary to provide an independent solution with low purchase and R&D costs to compensate for mechanical interference and ensure the normal operation of charged particle beam equipment.

[0083] (6) Maintenance and reliability issues. Traditional mechanical interference compensation devices are difficult to debug and maintain, and their reliability is relatively low. Learning control strategies and parameter debugging and optimization takes a long time and requires a lot of work. The maintenance and disassembly processes are relatively complicated. For example, support structures are required during disassembly, and the assembly process is relatively strict and complicated. At the same time, the structure is delicate and easily damaged, and there are risks such as air leakage, reduced accuracy, and deviation, which results in insufficient reliability. Therefore, it is necessary to provide a mechanical interference compensation method with a simple principle, small debugging workload, convenient maintenance and disassembly, and high reliability.

[0084] In view of the above problems, this application provides a mechanical interference compensation solution. Figure 3 It is a schematic diagram of the principle of the mechanical interference compensation method provided in an embodiment of the present application.

[0085] The process of generating images by charged particle beam scanning generally involves the following steps: (1) Emitting the particle beam: Using a particle accelerator, such as an electron gun or an ion source, a charged particle beam with the desired energy and charge is generated. The type of particle beam can be an electron beam, an ion beam, or other charged particle beam. (2) Focusing the particle beam: The particle beam is focused to the desired size and shape by using focusing elements such as magnetic fields or electric fields, which helps to maintain the spatial resolution and collimation of the particle beam. (3) Sample preparation: Prepare the sample to be scanned. The sample can be fixed on a support structure and the sample can be surface treated or coated to produce the desired interaction during the scanning process. (4) Scanning process: The focused charged particle beam is scanned along the sample surface. The position and movement of the particle beam can be controlled using a scanning control system, such as a scanning electron microscope (SEM) or a focused-ion-beam (FIB) etching system. (5) Interaction and signal collection: When the charged particle beam interacts with the sample surface, some signals are generated. These signals can be the result of processes such as scattering, transmission, annealing or excitation. For example, these signals can be the result of scattering or emission of electrons, ions, neutrons or other particles. (6) Signal detection and processing: Use appropriate detectors and electronic equipment to detect and record the signals generated by the interaction. These signals can be converted into voltage, current or other measurement forms and enhanced and resolved through signal processing and amplification. (7) Image reconstruction: Use the obtained signal data to reconstruct an image of the scanned area. This can be achieved by associating the signal with the scan position. The final image generated can show the topology, morphology, composition or other relevant information of the sample surface.

[0086] The main principle of the method of the present application is to capture and analyze mechanical vibrations in real time on a scanned image. Through certain processing rules, a field generating device with a faster actuation speed is used to generate a modulation field. The modulation field acts on the charged particle beam to compensate for the mechanical interference, thereby reducing image jitter or glitches.

[0087] Figure 4 It is a schematic diagram of a mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0088] The mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application includes a mechanical interference signal acquisition device 410, a signal compensation device 420 and a field generator 430. Among them, the mechanical interference signal acquisition device 410 can be a laser interferometer or a micro-vibration sensor. The mechanical interference signal acquisition device 410 is used to measure the mechanical interference of the charged particle beam and obtain a mechanical interference signal. The signal compensation device 420 is used to generate a control signal according to the mechanical interference signal. The field generator 430 is used to generate a modulation field according to the control signal, and the modulation field acts on the charged particle beam 450 generated by the charged particle beam generating device 440 to compensate for the mechanical interference of the charged particle beam 450. The field generator 430 can be a magnetic field generator or an electric field generator. When the field generator 430 is a magnetic field generator, the modulation field generated is a magnetic field. When the field generator 430 is an electric field generator, the modulation field generated is an electric field. The signal compensation device 420 can be implemented by software, hardware or a combination of the two. Specifically, it can be implemented by a computer or a processor running software. The specific software implementation can refer to the subsequent Fig.14 The corresponding implementation examples are introduced.

[0089] Figure 5 It is a schematic diagram of the architecture of a mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0090] The architecture of the mechanical interference compensation system based on charged particle beam includes a charged particle beam imaging system core component 510, a vibration monitoring module 520, a signal conversion control module 530, a signal generator 540, a field generator 550, a charged particle beam 560 and a compensated clear image 570. The vibration monitoring module 520 can identify the frequency, phase and relative displacement amplitude of the mechanical interference by setting a three-axis laser interferometer or a micro-vibration sensor to generate a mechanical interference signal, and then the signal conversion control module 530 generates an electrical compensation signal according to the mechanical interference signal, the signal generator 540 generates a control signal through the electrical compensation signal, and the field generator 550 generates a corresponding modulation compensation field between particle beams according to the modulated field signal, so that the charged particle beam 560 of the imaging system is subjected to a specified field force to perform a corresponding controlled movement, and a compensated clear image 570 is obtained. It should be understood that the relevant field generating device can be arranged inside or outside the chamber of the imaging system component, and the volume can be large or small. Among them, the electrical compensation signal has the same frequency and phase as the mechanical interference signal, and the control signal has the same frequency and phase as the mechanical interference signal.

[0091] Figure 6 It is a schematic diagram of another mechanical interference compensation system for a charged particle beam provided in an embodiment of the present application.

[0092] The mechanical interference compensation system of the charged particle beam provided in the embodiment of the present application includes a vibration monitoring module 520, a measuring medium 523, a signal conversion control module 530, a signal generator 540 and a compensation generation module 580. Among them, the vibration monitoring module 520 includes a mechanical interference signal acquisition device 521, and the mechanical interference signal acquisition device 521 can be a laser interferometer or a micro-vibration sensor. When the mechanical interference signal acquisition device 521 is a laser interferometer, the measuring medium 523 can be a laser. When the mechanical interference signal acquisition device 521 is a micro-vibration sensor, the measuring medium 523 can be a variable voltage. The compensation generation module 580 includes a charged particle beam generation device 511, a charged particle beam 560 generated by the charged particle beam generation device 511, a field generator 550, a sample 515 and a sample stage 513. The signal conversion control module 530 is used to convert the identified mechanical interference signal into a corresponding electrical compensation signal. The signal generator 540 is used to generate a control signal based on the electrical compensation signal, which acts on the field generator 550. The field generator 550 generates a modulated field to compensate for the mechanical interference of the charged particle beam 560, thereby reducing image jitter or glitches.

[0093] Figure 7 It is an exemplary flow chart of a method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0094] 610, Laser interferometer calibration.

[0095] In the embodiment of the present application, a laser interferometer can be used to obtain a mechanical interference signal. The laser interferometer can be arranged in a vacuum chamber or a non-vacuum chamber, and after calibration, it is used to monitor the mechanical interference between the charged particle beam generating device (such as the end of the pole shoe) and the sample stage, and then the identified mechanical interference signal can be transmitted through an optical fiber.

[0096] 620, Mechanical interference monitoring.

[0097] The laser interferometer can monitor the mechanical interference between the charged particle beam generating device (such as the end of the pole shoe) and the sample stage to obtain a mechanical interference signal.

[0098] The mechanical interference signal obtained by the laser interferometer is a displacement signal in the time domain. If two lasers are respectively projected onto two objects to be measured, their time domain displacement changes can be obtained. After taking the difference, the relative displacement changes between the two can be obtained, which can be regarded as one of the expressions of the mechanical interference signal.

[0099] 630 , generating an electrical compensation signal according to the mechanical interference signal.

[0100] The signal conversion control module 530 can generate an electrical compensation signal according to the mechanical interference signal. The signal conversion control module 530 can be a hardware set with similar functions such as a signal control board, a spectrum analyzer, etc. The signal conversion control module 530 can convert the mechanical interference signal in step 620 into an electrical compensation signal to express mechanical vibration, such as a vibration with a frequency of 50 Hertz (Hz) and an amplitude of 5 nanometers (nm).

[0101] After the signal conversion control module 530 expresses the mechanical interference signal as an electrical compensation signal, the frequency and phase can remain consistent, and the amplitude can have a certain relationship, such as y=ax+b, so that the generated modulation field can just offset the mechanical interference of the charged particle beam. For example, a mechanical interference signal with a frequency of 50Hz and an amplitude of 5nm can be converted into an electrical compensation signal with a frequency of 50Hz and an amplitude of a×5+b, so that the generated modulation field can just offset the vibration of 5nm after acting on the charged particle beam. The specific relationship needs to be given according to the actual situation, and is related to many parameters such as the landing voltage of the charged particle beam, the working distance, and the number of solenoid turns. The landing voltage of a charged particle refers to the potential difference or voltage generated when a charged particle (such as an electron, ion, etc.) contacts an object or surface. The working distance is the distance between the generator of the charged particle beam and the sample stage. The number of turns of the solenoid refers to the number of coils wound in the solenoid.

[0102] 640 , generating a control signal according to the electrical compensation signal.

[0103] The control signal can be generated by inputting the electrical compensation signal converted from the mechanical interference signal into the signal generator 540. For example, the electrical compensation signal with a frequency of 50 Hz and an amplitude of 5 nm is transmitted to the adjustable power supply / pulse generator to generate a control signal with a frequency of 50 Hz and an amplitude of 5 nm.

[0104] 650, a field generator generates a modulated field.

[0105] The control signal is transmitted to the field generator 550, so that a modulated field can be generated. Exemplarily, the field generator 550 is a solenoid, and the response signal generated by the power supply / pulse generator is transmitted to the solenoid, so that a magnetic field of a corresponding magnitude can be generated.

[0106] 660, A beam of charged particles is forced to produce controlled motion.

[0107] When the field generator is a magnetic field generator, the modulation field is a magnetic field, and the charged particle beam moves in a controlled manner according to the Lorentz force of the magnetic field. When the field generator is an electric field generator, the modulation field is an electric field, and the charged particle beam moves in a controlled manner according to the Coulomb force of the electric field.

[0108] 670, determine whether the mechanical interference on the image is eliminated.

[0109] For example, the human eye can be used to judge whether the mechanical interference is eliminated. At the specified resolution, when the electron microscope operator performs normal operation, no image jitter or burr is found, which means that the elimination is successful and the compensation work is completed. If at the specified resolution, the electron microscope operator finds that the image still has jitter or burr, repeat steps 620 to 670 until the compensation is completed.

[0110] Optionally, a camera plus an artificial intelligence image recognition algorithm can be used to determine whether the mechanical interference has been eliminated. If the image captured by the camera is determined to have no jitter or burrs after the algorithm is detected, the elimination is successful and the compensation work is completed. If the image captured by the camera is determined to have jitter or burrs after the algorithm is detected, steps 620 to 670 are repeated until the mechanical interference compensation is completed.

[0111] Figure 8 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0112] 710, Calibration of micro-vibration sensors.

[0113] In the embodiment of the present application, a micro-vibration sensor can be used to obtain a mechanical interference signal. The micro-vibration sensor can be a micro-vibration acceleration sensor or a micro-vibration velocity sensor. The sensor can be arranged in a vacuum chamber, fixed to a generator of a charged particle beam (such as a mirror group), a sample stage or other core components, and used to monitor mechanical interference after calibration, and then the identified mechanical interference signal can be transmitted through a cavity-penetrating data line.

[0114] 720, Mechanical interference monitoring.

[0115] The micro-vibration sensor can monitor the mechanical interference between the charged particle beam generator (such as the end of the pole shoe) and the sample stage to obtain a mechanical interference signal, which can be expressed by acceleration or velocity.

[0116] 730-770, see Figure 7 The description of steps 630 to 770 will not be repeated in this application.

[0117] Fig. 9 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0118] 810, calibration of mechanical interference signal acquisition device.

[0119] The mechanical interference signal acquisition device in the embodiment of the present application can be a laser interferometer or a micro-vibration sensor. The laser interferometer can be arranged in a vacuum cavity or a non-vacuum cavity, and after calibration, it is used to monitor the mechanical interference between the charged particle beam generating device (such as the end of the pole shoe) and the sample stage, and then the identified mechanical interference signal can be transmitted through the optical fiber. The micro-vibration sensor can be a micro-vibration acceleration sensor or a micro-vibration velocity sensor. The micro-vibration sensor can be arranged in a vacuum cavity, fixed on a mirror group, a sample stage or other core components, and used to monitor mechanical interference after calibration, and then the identified mechanical interference signal can be transmitted through a cavity data line.

[0120] 820, Mechanical interference monitoring.

[0121] For example, a laser interferometer can be used to obtain a mechanical interference signal. The mechanical interference signal obtained by the laser interferometer is a displacement signal in the time domain. If two lasers are respectively projected onto two objects under test, the time domain displacement changes of the two objects can be obtained. After the difference is made, the relative displacement changes of the two objects can be obtained, which can be regarded as one of the expressions of the mechanical interference signal.

[0122] Exemplarily, a micro-vibration sensor may be used to obtain a mechanical interference signal. In this case, the mechanical interference signal may be expressed by acceleration and velocity.

[0123] 830, converting the mechanical interference signal into an electrical signal.

[0124] The signal conversion control module 530 can generate an electrical compensation signal according to the mechanical interference signal. The signal conversion control module 530 can be a hardware set with similar functions such as a signal control board, a spectrum analyzer, etc. The signal conversion control module 530 can convert the mechanical interference signal in step 620 into an electrical compensation signal to express mechanical vibration, such as a vibration with a frequency of 50 Hertz (Hz) and an amplitude of 5 nanometers (nm).

[0125] After the signal conversion control module 530 expresses the mechanical interference signal as an electrical compensation signal, the frequency and phase can remain consistent, and the amplitude can have a certain relationship, such as y=ax+b, so that the generated modulation field can just offset the mechanical interference of the charged particle beam. For example, a mechanical interference signal with a frequency of 50Hz and an amplitude of 5nm can be converted into an electrical compensation signal with a frequency of 50Hz and an amplitude of a×5+b, so that the generated modulation field can just offset the vibration of 5nm after acting on the charged particle beam. The specific relationship needs to be given according to the actual situation, and is related to many parameters such as the landing voltage of the charged particle beam, the working distance, and the number of solenoid turns. The landing voltage of a charged particle refers to the potential difference or voltage generated when a charged particle (such as an electron, ion, etc.) contacts an object or surface. The working distance is the distance between the generator of the charged particle beam and the sample stage. The number of turns of the solenoid refers to the number of coils wound in the solenoid.

[0126] At 840, the signal generator generates a response signal.

[0127] The control signal can be generated by inputting the electrical compensation signal converted from the mechanical interference signal into the signal generator 540. For example, the electrical compensation signal with a frequency of 50 Hz and an amplitude of 5 nm is transmitted to the adjustable power supply / pulse generator to generate a control signal with a frequency of 50 Hz and an amplitude of 5 nm.

[0128] 850, the magnetic field generator generates a corresponding magnetic field.

[0129] The control signal is transmitted to the field generator 550, and a modulation field can be generated. Exemplarily, the field generator 550 in the embodiment of the present application is a magnetic field generator, and the specific modulation field generated is a magnetic field. For example, a magnetic field generator such as a Helmholtz coil can generate a corresponding magnetic field, so that the moving charged particles are subjected to the corresponding Lorentz force, thereby generating a controlled motion to compensate for the mechanical interference of the charged particle beam.

[0130] 860, A beam of charged particles is forced to produce controlled motion.

[0131] 870, determining whether mechanical interference on the image is eliminated.

[0132] For example, the human eye can be used to judge whether the mechanical interference is eliminated. At the specified resolution, when the electron microscope operator performs normal operation, no image jitter or burr is found, which means that the elimination is successful and the compensation work is completed. If at the specified resolution, the electron microscope operator finds that the image still has jitter or burr, then repeat steps 820 to 870 until the compensation is completed.

[0133] Optionally, a camera plus an artificial intelligence image recognition algorithm can be used to determine whether the mechanical interference has been eliminated. If the image captured by the camera is determined to have no jitter or burrs after the algorithm is detected, the elimination is successful and the compensation work is completed. If the image captured by the camera is determined to have jitter or burrs after the algorithm is detected, steps 820 to 870 are repeated until the mechanical interference compensation is completed.

[0134] Fig.10 This is an exemplary flow chart of another method for compensating mechanical interference of a charged particle beam provided in an embodiment of the present application.

[0135] 910-940, see Fig. 9 The description of steps 810 to 840 will not be repeated in this application.

[0136] 950, the electric field generator generates an electric field.

[0137] The control signal is transmitted to the field generator 550, which can generate a modulated field. Exemplarily, the field generator 550 in the embodiment of the present application is an electric field generator, and the specific modulated field generated is an electric field. The corresponding electric field generated by the electric field generator can cause the moving charged particles to be subjected to the corresponding Coulomb force, thereby generating controlled motion to compensate for the mechanical disturbance of the charged particle beam.

[0138] 960-970, see Fig. 9 The description of steps 860 to 870 will not be repeated in this application.

[0139] The mechanical interference compensation method for charged particle beams provided in this application can better solve the above-mentioned various problems. Compared with the traditional mechanical interference compensation device, the technical solution provided in this application has the following beneficial effects:

[0140] (1) As for solving the space occupation problem, the mechanical interference compensation device provided by the present application occupies a small space and is light in weight. In theory, a simple coil pair can be used, and the weight and size are relatively small.

[0141] (2) Regarding the effective bandwidth and effect of mechanical interference elimination, compared with active vibration reduction to isolate low frequencies and passive vibration reduction to isolate high frequencies, the technical solution provided by this application can compensate for a wider frequency range. The frequency range that can be generated by alternating current (AC) is the frequency range that can be compensated, which is theoretically the full frequency range. At the same time, due to the direct effect on the charged particle beam, the compensation effect can theoretically reach 100%.

[0142] (3) Regarding the self-regulation capability, compared with motion compensation after actuator feedback, electromagnetic compensation will be performed at the speed of light and its delay can be ignored.

[0143] (4) As for the cost issue, whether it is purchasing or R&D, its cost can be ignored compared with traditional active shock absorbers.

[0144] (5) From the perspective of debugging and reliability, the technical solution provided by this application has a small debugging workload, a simple principle, and no need to preset parameters; it is easy to disassemble during maintenance and can be disassembled at any time without affecting the structure of the entire machine; it has relatively high reliability, a simple structure, is not easy to damage, and has no risk of leakage.

[0145] Table 2 shows a comparison between the prior art and the technical solution provided by the present application. It can be seen that the technical solution provided by the present application can suppress vibration in the full frequency band, has low difficulty in adjustment and testing, simple structural design, high reliability, low cost, light weight, and easy disassembly and maintenance compared with the prior art.

[0146] Table 2

[0147]

[0148]

[0149] The technical solution provided in this application is applicable not only to semiconductor vacuum precision equipment using charged particle beams, but also to other vacuum, non-vacuum, semiconductor and non-semiconductor industry precision equipment based on charged particle beams, including but not limited to electron beam detection equipment such as scanning electron microscopes, electron beam lithography equipment, focused ion beam lithography equipment, ion beam etching equipment, electron beam induced deposition equipment, electron beam welding equipment, etc. The above embodiments should not be understood as limiting the present application.

[0150] The above describes the mechanical interference compensation system and method of the charged particle beam according to the embodiments of the present application. Fig.11 and Fig.12 The devices and apparatuses according to the embodiments of the present application are described.

[0151] The present application also provides a computer storage medium in which program instructions are stored. When the program is executed, it may include: Figure 7-10 Part or all of the steps of the mechanical interference compensation method in the corresponding embodiment.

[0152] Fig.11This is a diagram showing an example structure of an electronic device 1100 provided in an embodiment of the present application. The electronic device 1100 includes a charged particle beam generator 1110 and a mechanical interference compensation system 1120. The charged particle beam generator 1110 is used to generate a charged particle beam, and the mechanical interference compensation system 1120 is used to compensate for the mechanical interference of the charged particle beam. The charged particle beam generator 1110 is a precision equipment for vacuum, non-vacuum, semiconductor and non-semiconductor industries that works based on a charged particle beam, including but not limited to electron beam detection equipment such as scanning electron microscopes, electron beam lithography equipment, focused ion beam lithography equipment, ion beam etching equipment, electron beam induced deposition equipment, electron beam welding equipment, etc. The mechanical interference compensation system 1120 may be Figure 4-6 The mechanical disturbance compensation system in the corresponding embodiment can perform the following steps: Figure 7-10 Part or all of the steps of the mechanical interference compensation method in the corresponding embodiment. The electron particle beam generating device 1110 may correspond to Figure 4 The charged particle beam generating device 440 in the embodiment of the present invention, the mechanical interference compensation system 1120 can correspond to Figure 4 A mechanical disturbance compensation system in a related embodiment.

[0153] Fig.12 1 is a structural example diagram of a mechanical interference compensation device 1200 provided in an embodiment of the present application. The mechanical interference compensation device 1200 includes an acquisition unit 1210 and a processing unit 1220. The mechanical interference compensation device 1200 may be Figure 4 This corresponds to the signal compensation device 420 in the embodiment.

[0154] The acquisition unit 1210 is used to acquire the mechanical interference signal and execute Figure 7 620 steps in the method, Figure 8 720 steps in the method, Fig. 9 820 steps in the method, Fig.10 Step 920 of the method.

[0155] The processing unit 1220 is used to generate a control signal according to the mechanical interference signal, wherein the control signal is used to generate a modulation field, wherein the modulation field acts on the charged particle beam to compensate for the mechanical interference of the charged particle beam, and executes Figure 7-10 Some or all of the steps in the method.

[0156] Fig.13 The following is a diagram showing a structure of a computer device 1300 provided in an embodiment of the present application. The computer device 1300 includes a processor 1302, a communication interface 1303, and a memory 1304. An example of the computer device 1300 is a chip. Another example of the computer device 1300 is a computing device. The computer device 1300 may be the computer device 1300 described above. Figure 4Another embodiment of the signal compensation device 420 in the corresponding embodiment.

[0157] The mechanical interference compensation method in the above-mentioned embodiment of the present application can be applied to the processor 1302, or implemented by the processor 1302. The processor 1302 can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 1302. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the embodiment of the present application can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution.

[0158] The memory 1304 may be a volatile memory or a nonvolatile memory, or may include both volatile and nonvolatile memories. Among them, the nonvolatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), and direct rambus RAM (DRRAM). It should be noted that the memory of the methods and apparatus described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0159] The processor 1302, the memory 1304 and the communication interface 1303 can communicate with each other via a bus. The memory 1304 stores executable codes, and the processor 1302 reads the executable codes in the memory 1304 to execute the corresponding method. The memory 1304 may also include software modules required for other running processes such as an operating system. The operating system may be LINUXTM, UNIXTM, WINDOWSTM, etc.

[0160] For example, the executable code in the memory 1304 is used to implement Figure 7-10 The method shown in the figure, the processor 1302 reads the executable code in the memory 1304 to execute Figure 7-10 The method shown.

[0161] In some embodiments of the present application, the disclosed methods may be implemented as computer program instructions encoded in a machine-readable format on a computer-readable storage medium or encoded on other non-transitory media or articles of manufacture. Fig.14Schematically illustrates a conceptual partial view of an example computer program product arranged according to at least some embodiments presented herein, the example computer program product comprising a computer program for executing a computer process on a computing device. In one embodiment, the example computer program product 1400 is provided using a signal bearing medium 1401. The signal bearing medium 1401 may include one or more program instructions 1402, which when executed by one or more processors may provide the above-described Figure 7-10 Thus, for example, reference to Figure 7-10 In the embodiment shown in , one or more features thereof may be borne by one or more instructions associated with the signal bearing medium 1401 .

[0162] In some examples, the signal bearing medium 1401 may include a computer readable medium 1403, such as, but not limited to, a hard drive, a compact disk (CD), a digital video disk (DVD), a digital tape, a memory, a read-only memory (ROM) or a random access memory (RAM), etc. In some embodiments, the signal bearing medium 1401 may include a computer recordable medium 1404, such as, but not limited to, a memory, a read / write (R / W) CD, a R / W DVD, etc. In some embodiments, the signal bearing medium 1401 may include a communication medium 1405, such as, but not limited to, a digital and / or analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communication link, a wireless communication link, etc.). Thus, for example, the signal bearing medium 1401 may be communicated by a wireless form of the communication medium 1405 (e.g., a wireless communication medium that complies with the IEEE 802.11 standard or other transmission protocol). One or more program instructions 1402 may be, for example, computer executable instructions or logic implementation instructions. In some examples, the aforementioned computing device may be configured to provide various operations, functions, or actions in response to program instructions 1402 communicated to the computing device by one or more of computer-readable media 1403, computer-recordable media 1404, and / or communication media 1405. It should be understood that the arrangement described herein is only for the purpose of example. Thus, it will be appreciated by those skilled in the art that other arrangements and other elements (e.g., machines, interfaces, functions, sequences, and functional groups, etc.) can be used instead, and some elements can be omitted together according to the desired results. In addition, many of the described elements are functional entities that can be implemented as discrete or distributed components, or in any appropriate combination and position to be implemented in conjunction with other components.

[0163] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0164] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0165] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0166] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0167] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0168] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0169] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0170] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0171] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0172] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0173] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0174] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0175] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0176] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A mechanical disturbance compensation system for a charged particle beam, characterized in that: include: A mechanical interference signal acquisition device is used to measure the mechanical interference of the charged particle beam and obtain a mechanical interference signal; A signal compensation device, used for generating a control signal according to the mechanical interference signal; A field generator is used to generate a modulation field according to the control signal, wherein the modulation field acts on the charged particle beam to compensate for the mechanical interference.

2. The system according to claim 1, characterized in that The compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal.

3. The system according to claim 1 or 2, characterized in that: The relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal is associated with any one or more of the following parameters: the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator.

4. The system according to any one of claims 1 to 3, characterized in that: The mechanical interference signal acquisition device includes a laser interferometer or a micro-vibration sensor.

5. The system according to any one of claims 1 to 4, characterized in that: The field generator comprises a magnetic field generator or an electric field generator, and the modulation field comprises a magnetic field or an electric field.

6. The system according to any one of claims 1 to 5, characterized in that: The mechanical interference signal acquisition device is located in the sample stage or the charged particle beam generating device, and the charged particle beam is used to scan the sample on the sample stage.

7. A method for compensating mechanical interference of a charged particle beam, characterized in that: include: Acquiring a mechanical interference signal, wherein the mechanical interference signal is used to indicate the mechanical interference suffered by the charged particle beam; A control signal is generated according to the mechanical disturbance signal, wherein the control signal is used to generate a modulation field, wherein the modulation field acts on the charged particle beam to compensate for the mechanical disturbance.

8. The method according to claim 7, characterized in that The compensation generated by the modulation field acting on the charged particle beam has the same frequency and phase as the mechanical interference signal.

9. The method according to claim 7 or 8, characterized in that: The relationship between the amplitude of the compensation generated by the modulation field acting on the charged particle beam and the amplitude of the mechanical interference signal is associated with any one or more of the following parameters: the landing voltage of the charged particle beam, the distance between the generator of the charged particle beam and the sample stage, and the number of solenoid turns of the field generator.

10. An electronic device, characterized in that: The invention comprises a charged particle beam generating device and a mechanical interference compensation system as claimed in any one of claims 1 to 6, wherein the charged particle beam generating device is used to generate a charged particle beam, and the mechanical interference compensation system is used to compensate for mechanical interference suffered by the charged particle beam.

11. A computer readable medium, characterized in that The computer-readable medium stores a program code, and when the program code is executed on a computer, the computer is caused to execute the method according to any one of claims 7 to 9.

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