Method, system, device and equipment for controlling semiconductor manufacturing equipment

Abstract

The invention discloses a method, system, device and equipment for controlling semiconductor manufacturing equipment, and the method comprises the steps: controlling visual detection equipment to carry out the fragment residue detection of semiconductor products at a material processing position under the condition of determining that the semiconductor products are unloaded at the material processing position of the semiconductor manufacturing equipment; inspection result information which is sent by visual inspection equipment and corresponds to the material processing position is obtained, and fragment residual abnormal information included in the inspection result information is sent by the visual inspection equipment under the condition that it is detected that the material processing position has the bottom color the same as that of the semiconductor product; and when it is determined that the check result information comprises fragment residual abnormal information, operation is stopped, and alarm processing is carried out. Therefore, automatic detection of semiconductor product fragment residues can be realized, the maintenance cost and the labor cost of equipment are reduced, and the productivity of the equipment is also improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method, system, device and equipment for controlling semiconductor manufacturing equipment. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the automation level of semiconductor manufacturing equipment has also become higher and higher, including: cleaning equipment, double-sided grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc. Among them, many semiconductor manufacturing equipment require manufacturing auxiliary equipment, such as robot arms, which place semiconductor products in the corresponding material processing positions before performing corresponding processing, and after the corresponding processing is completed, the semiconductor products are unloaded from the material processing positions. For example, the robot arm can absorb the wafer and put it into the material processing position corresponding to the DSP, and can absorb the wafer and unload it from the material processing position corresponding to the DSP.

[0003] At present, after semiconductor products are unloaded from the material processing position of semiconductor manufacturing equipment, the semiconductor manufacturing equipment needs to perform subsequent corresponding operations regardless of whether the semiconductor products unloaded from the material processing position are complete. However, when the semiconductor manufacturing equipment processes the semiconductor products, the semiconductor products may be broken, or the semiconductors themselves may be broken. In this way, after the semiconductor products are unloaded from the material processing position, there may be residual semiconductor product fragments at the material processing position of the semiconductor manufacturing equipment, that is, during the unloading and unloading process of the semiconductor products, there are residual semiconductor product fragments at the material processing position. Once there are residual semiconductor product fragments, if the semiconductor manufacturing equipment still performs subsequent operation, it may cause damage to the setting devices of the semiconductor manufacturing equipment, while also increasing the maintenance cost and labor cost of the equipment, affecting the equipment production capacity. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method, system, device and equipment for controlling semiconductor manufacturing equipment. The technical problem to be solved by the present invention is achieved through the following technical solutions: A first aspect of an embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, comprising: When it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a residual semiconductor product fragment inspection at the material processing position; Obtaining inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the semiconductor product is detected at the material processing position; When it is determined that the inspection result information includes abnormal information of residual debris, the operation is stopped and an alarm is processed.

[0005] A second aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor equipment, control equipment, and visual inspection equipment, wherein: The control device is configured to, when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment, control the visual inspection device to perform a fragment residue detection of the semiconductor product at the material processing position; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device; when it is determined that the inspection result information includes abnormal information of the fragment residue, stop the operation and perform an alarm process; The visual inspection device is configured to perform debris residue detection on the material processing position, and send inspection result information including debris residue abnormality information when the material processing position is detected to have the same background color as the semiconductor product.

[0006] A third aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: The first control module is configured to When it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a residual semiconductor product fragment inspection at the material processing position; The detection acquisition module is configured to acquire the inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the semiconductor product is detected at the material processing position; The second control module is configured to stop running and perform alarm processing when it is determined that the inspection result information includes abnormal information of debris residue.

[0007] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, the processor being configured to execute the above-mentioned method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0008] A fourth aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: a device body; and the above-mentioned device for controlling semiconductor manufacturing equipment, which is installed on the device body.

[0009] Beneficial effects of the present invention: In the semiconductor manufacturing process, after the semiconductor products have been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to detect the residual fragments of the semiconductor products at the material processing position, and when it is determined that there are residual fragments of the semiconductor products at the material processing position, a shutdown alarm is performed. In this way, the automatic detection of residual fragments of semiconductor products can be achieved, reducing the probability of damage to the set components of the semiconductor manufacturing equipment due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment and improves the production capacity of the equipment.

[0010] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0011] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of a system structure for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 2 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 3 A schematic diagram of the structure of DSP blanking provided by an embodiment of the present invention; Figure 4 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention; Figure 7 A schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0013] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0014] With the development of science and technology, the automation level of semiconductor product manufacturing equipment, such as cleaning equipment, double-sided grinding and polishing equipment (DSP), etching equipment, deposition equipment, etc., is getting higher and higher. Among them, cleaning equipment, DSP, etching equipment, etc. need to take out semiconductor products from the corresponding material processing position in the semiconductor manufacturing equipment, that is, unloading. Generally, the unloading can be automated through manufacturing auxiliary equipment, such as robot arms. In the embodiment of the present invention, in the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to detect the residual fragments of the semiconductor product at the material processing position, and when it is determined that there are residual fragments of the semiconductor product at the material processing position, the shutdown alarm processing is performed. In this way, the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing is reduced, and at the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0015] like Figure 1 As shown, an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, including: semiconductor manufacturing equipment 100, a control device 200, and a visual inspection device 300.

[0016] The semiconductor manufacturing equipment 100 may be a DSP, an etching device, a deposition device, etc. The control device 200 may be a device at the front end of the DSP (Equipment Front End Module, EFEM), or other devices with control capabilities, such as a desktop computer, a handheld tablet computer, etc. The visual inspection device 300 may include one, two or more cameras, so that the corresponding image information of the inspected area can be obtained, and the corresponding image analysis can be performed to obtain the corresponding inspection results.

[0017] The semiconductor manufacturing equipment 100 and the control equipment 200 may be connected by wire or wirelessly to perform data communication, and the semiconductor manufacturing equipment 100 and the visual inspection equipment 300 may also be connected by wire or wirelessly to perform data communication.

[0018] Therefore, in an embodiment of the present invention, the control device 200 is configured to control the visual inspection device 300 to perform debris residue detection of the semiconductor product at the material processing position when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment 100; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device 300; when it is determined that the inspection result information includes abnormal debris residue information, stop the operation and perform alarm processing; the visual inspection device 300 is configured to perform debris residue detection on the material processing position, and when it is detected that there is a background color the same as the semiconductor product at the material processing position, send the inspection result information including abnormal debris residue information.

[0019] Since the semiconductor manufacturing equipment 100 can process semiconductor products, for example, the DSP can perform double-sided grinding and polishing on wafers, it is necessary to load semiconductor products onto the semiconductor manufacturing equipment 100 or unload semiconductor products from the semiconductor manufacturing equipment 100. In some embodiments, Figure 1 As shown, the system for controlling semiconductor manufacturing equipment may also include: manufacturing auxiliary equipment 400, which is configured to absorb semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the unloading buffer. That is, the manufacturing auxiliary equipment 400 can be used to place semiconductor products in the material processing position corresponding to the semiconductor manufacturing equipment, or to take out the processed products from the material processing position of the semiconductor manufacturing equipment, and then unload or unload the materials. The manufacturing auxiliary equipment 400 may include: a robot arm or a robot, etc. Of course, it can also be other equipment for assisting semiconductor production. The control device 200 can also be connected to the manufacturing auxiliary equipment 400 by wire or wirelessly, so as to perform data communication.

[0020] In the system for controlling semiconductor manufacturing equipment, the control device 200 can control two or more of the semiconductor manufacturing equipment 100, the visual inspection equipment 300 and the manufacturing auxiliary equipment 400 to automatically implement the detection of residual debris of semiconductor products in the semiconductor manufacturing equipment.

[0021] Combination Figure 1 The system for controlling semiconductor manufacturing equipment shown in the figure, the embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, such as Figure 2 As shown, the process of semiconductor manufacturing equipment control includes: Step 201: When it is determined that a semiconductor product has been unloaded at a material processing position of a semiconductor manufacturing device, control a visual inspection device to perform a semiconductor product debris residue inspection at the material processing position.

[0022] There may be many types of semiconductor manufacturing equipment, such as cleaning equipment, grinding and polishing equipment, etching equipment, deposition equipment, etc. These equipments have corresponding processing areas, which can be used to place semiconductor products and then perform corresponding processing.

[0023] Among them, some semiconductor manufacturing equipment may have only one processing area, and there is only one material processing position in the processing area, or some semiconductor manufacturing equipment may have only one processing area, but there are one, two or more material processing positions in the processing area, or some semiconductor manufacturing equipment may have one, two or more processing areas, and there is one, two or more material processing positions in each processing area.

[0024] For example: semiconductor manufacturing equipment is DSP, such as Figure 3 As shown, DSP has five processing areas, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. These five processing areas can form a processing truncated table, i.e., the lower grinding plate. The angle between each two adjacent processing areas can be 72°, and each processing area has three material processing positions, namely, Hole1, Hole2 and Hole3. Each material processing position can hold a wafer, and the wafers in each material processing position can be defined as Wafer 1, Wafer 2 and Wafer 3, respectively. Thus, there are 15 material processing positions in DSP.

[0025] The semiconductor product can be taken out from the material processing position manually, i.e., unloading manually, or, in some embodiments, the unloading can be performed automatically through manufacturing auxiliary equipment. In this way, determining that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment includes: controlling the manufacturing auxiliary equipment to adsorb the semiconductor product from the material processing position corresponding to the semiconductor manufacturing equipment and place it in the unloading buffer zone; upon receiving the unloading completion signal sent by the manufacturing auxiliary equipment, determining that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment.

[0026] During the unloading process of the semiconductor manufacturing equipment, the control device can send unloading instructions to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment can absorb the semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment according to the received unloading instructions and place them in the unloading buffer.

[0027] Since semiconductor manufacturing equipment may have two or more material processing positions, in some embodiments, controlling a manufacturing auxiliary device to absorb semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and placing them in a material unloading buffer includes: upon determining that the manufacturing auxiliary device corresponds to a first processing area of ​​the semiconductor manufacturing equipment, sending a first unloading instruction to the manufacturing auxiliary device so that the manufacturing auxiliary device absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them in a material unloading buffer, wherein the first processing area has one or more material processing positions; upon receiving a first area unloading completion signal sent by the manufacturing auxiliary device, controlling the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary device.

[0028] The control device can control the manufacturing auxiliary equipment and the semiconductor manufacturing equipment so that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment. Then, the control device sends a first unloading instruction to the auxiliary equipment, so that the manufacturing auxiliary equipment absorbs the semiconductor product from the material processing position of the first processing area and places it in the unloading buffer area. If the first processing area has two or more material processing positions, then the manufacturing auxiliary equipment can also simultaneously absorb two or more semiconductor products from the corresponding material processing positions in the first processing area and place them in the unloading buffer area. That is, the manufacturing auxiliary equipment can unload materials to one processing area at one time. Of course, the present invention may not be limited to this. The manufacturing auxiliary equipment can also unload materials to one processing area twice or more times.

[0029] After the manufacturing auxiliary equipment completes unloading the material to the first processing area, it can send a signal that the unloading of the first area is completed to the control device, so that the control device can control the semiconductor manufacturing equipment so that the second processing area of ​​the semiconductor manufacturing equipment corresponds to the manufacturing auxiliary equipment. Then, the control device continues to control the manufacturing auxiliary equipment to perform corresponding unloading operations, so that the manufacturing auxiliary equipment can also unload the material to the second processing area once, twice or multiple times. According to the above process, the semiconductor manufacturing equipment unloads the corresponding semiconductor products from each material processing position in each processing area. Alternatively, according to the application scenario requirements, the corresponding semiconductor products are unloaded from some material processing positions in some processing areas of the semiconductor manufacturing equipment.

[0030] like Figure 3As shown, DSP has five processing areas, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. Each processing area has three material processing positions, namely Hole1, Hole2 and Hole3. The manufacturing auxiliary equipment may include a robot 1, which corresponds to each processing area. The robot 1 has three suction cups, namely Sucker1, Sucker2 and Sucker3, which suck wafer 1, wafer 2 and wafer 3 respectively. In this way, after starting to run, Carrier 1 in the DSP corresponds to robot 1, so that the DSP EFEM can send a first unloading instruction to the robot 1, and the robot 1 can suck wafer 1, wafer 2 and wafer 3 from Hole 1, Hole 2 and Hole 3 of Carrier 1, and put them into the unloading buffer UnLoadbuffer. After the placement is completed, the robot 1 sends a first area unloading completion signal to the DSP EFEM, so that the DSP EFEM controls the DSP to rotate the processing area, and the lower grinding disk can be rotated 72° clockwise. In this way, Carrier 2 corresponds to robot 1, that is, robot 2 can unload Carrier 2, and this cycle is repeated until a total of 15 wafers in 5 carriers are placed in UnLoadbuffer. UnLoadbuffer has 15 slots for wafers, and 15 wafers can be placed in sequence.

[0031] According to the scene requirements, after the semiconductor products have been unloaded at the material processing position of the semiconductor manufacturing equipment, the manufacturing auxiliary equipment can send a material unloading completion signal to the control device, or after the manual unloading is completed, the material unloading completion signal can also be sent to the control device through the human-computer interaction interface or terminal. Thus, after receiving the material unloading completion signal, the control device can determine that the semiconductor products have been unloaded at the material processing position of the semiconductor manufacturing equipment. At this time, the control device can control the visual inspection device to perform residual semiconductor product fragments detection at the material processing position.

[0032] The visual inspection equipment is equipped with a camera that can collect image information within the action area and perform image analysis on the collected image information to obtain corresponding inspection results.

[0033] Some manufacturing auxiliary equipment has only one processing area, and the processing area has only one or two material processing positions. In this way, the visual inspection equipment can be configured with only one camera, and the effective area of ​​the camera can cover each material processing position, that is, the control device can control the camera on the visual inspection equipment to collect image information of each material processing position of the unloaded semiconductor product, and perform image analysis based on the collected image information to obtain corresponding inspection results.

[0034] Some manufacturing auxiliary equipment has only one processing area, but the processing area has only two or more material processing positions, or some manufacturing auxiliary equipment has one or more processing areas, and each processing area has one or more material processing positions. At this time, the action area of ​​one camera of the visual inspection equipment cannot cover each material processing position. Therefore, the visual inspection equipment may be configured with two or more cameras, and these two or more cameras can be used to detect the debris residue of semiconductor products at the material processing position. In some embodiments, controlling the visual inspection equipment to detect the debris residue of semiconductor products at the material processing position includes: when there are two or more material processing positions in the current processing area, controlling the first camera in the visual inspection equipment to capture the first image information of one or more material processing positions in the current processing area; when it is determined that the first camera has completed the shooting, controlling the semiconductor manufacturing equipment to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and controlling the second camera in the visual inspection equipment to capture the second image information of other material processing positions.

[0035] DSP has five processing areas, and each processing area has three material processing positions. In this way, DSPEFEM can send a detection instruction to the visual inspection device, thereby triggering the first camera in the visual inspection device. In this way, the first camera can shoot the two holes in the current processing area, that is, the current carrier, to obtain the first image information. Then, when it is determined that the first camera has completed shooting, DSP EFEM controls DSP to rotate the lower grinding disk clockwise by 72°, and then triggers the second camera in the visual inspection device. In this way, the second camera can shoot another hole in the current carrier to obtain the second image information. Therefore, the visual inspection device can complete the detection of residual fragments of semiconductor products in a group of material processing positions.

[0036] Step 202: Obtain inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the semiconductor product is detected at the material processing position.

[0037] Generally, the color of the material processing position of semiconductor manufacturing equipment is inconsistent with the color of semiconductor products. Thus, after the semiconductor products in the material processing position are unloaded, the camera of the visual inspection equipment can only see the color of the material processing position after acquiring images, but cannot see the color of the semiconductor products, i.e., the background color. If the acquired image information includes the background color of the semiconductor products, then it can be shown that there are residual semiconductor product fragments at the material processing position, and color analysis can be used to detect the residual semiconductor product fragments.

[0038] As in the above example, the color of the chassis PAD of the material processing position of the DSP, that is, the material processing position is white, and the semiconductor product, that is, the wafer, is black, that is, the background color is black. If black wafers are unloaded on all 15 holes of the DSP, then when the visual inspection equipment performs debris residue detection, if there is black information in the image information obtained by the camera, it means that there are residual wafer fragments at the material processing position corresponding to the black information, that is, the visual inspection equipment can send the inspection result including the abnormal information of debris residue to the control device. If there is no black information in the image information obtained by the camera, then the inspection result sent by the visual inspection equipment to the control device does not include the abnormal information of debris residue.

[0039] In some embodiments, the visual inspection device sends inspection result information corresponding to each material processing position including: when a background color identical to that of the semiconductor product is detected in the image information detected by the debris residue, the visual inspection device determines the current material processing position corresponding to the background color; and the visual inspection device sends the debris residue abnormality information through the current communication address corresponding to the current material processing position.

[0040] The control device can communicate with the visual inspection device, and in some embodiments, in an image information taken by each camera in the visual inspection device, different material processing positions correspond to different communication addresses. Therefore, after the visual inspection device determines the current material processing position corresponding to the residual semiconductor product background color in the image information, the visual inspection device can send debris residue abnormality information through the current communication address corresponding to the current material processing position.

[0041] For example: if the current image information detected by the DSP contains black information, the current hole corresponding to the black information is determined, and the corresponding inspection result is determined to be "1". If there is no black information in the current image information detected, the inspection result corresponding to each hole in the image information is "0". The three holes in the Carrier of any processing area of ​​the DSP have a separate communication address, which are defined as communication address 1, communication address 2 and communication address 3 respectively, and are used for the DSP EFEM to receive the inspection results sent by the visual inspection equipment. Among them, if the residual fragments of wafer 1 are detected on Hole 1, the visual inspection equipment sends "1" to the DSP EFEM through its communication address 1; if the residual fragments of wafer 1 are not detected on Hole 1, the visual inspection equipment sends "0" to the DSP EFEM through its communication address 1; the inspection of wafers 2 and 3 is the same, so I will not repeat them one by one.

[0042] Step 203: When it is determined that the inspection result information includes abnormal information of residual debris, the operation is stopped and an alarm is processed.

[0043] The inspection result information obtained by the control device includes abnormal information on residual debris, which can determine that there are residual fragments of semiconductor products at the material processing location. At this time, the control device is shut down, and the semiconductor manufacturing equipment can also be shut down, and corresponding alarm processing can be performed. The semiconductor product fragmentation residual alarm can be prompted by one or more of the following methods: the indicator light turns red, the buzzer sounds, and the touch screen prompts text.

[0044] As mentioned above, if the DSP EFEM receives the inspection result information including "1", it can be determined that there are residual wafer fragments on the DSP's carrier, and the DSP can no longer process other wafers. At this time, the DSP EFEM can send a stop operation instruction to the DSP, and can issue a residual fragment alarm through a buzzer sound and a touch screen text prompt.

[0045] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the visual inspection equipment can be controlled to perform a semiconductor product debris residue detection on the material processing position, and when it is determined that there are semiconductor product debris residues at the material processing position, a shutdown alarm is performed. In this way, automatic detection of semiconductor product debris residues can be achieved, reducing the probability of damage to the set components of the semiconductor manufacturing equipment due to continuous processing, and at the same time, reducing the equipment maintenance cost and labor cost, and improving the equipment's production capacity.

[0046] The following is an example of a specific process for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention.

[0047] like Figure 3 As shown, the semiconductor manufacturing equipment control may be DSP, and there are five processing areas on the lower grinding disc, namely Carrier1, Carrier2, Carrier3, Carrier4 and Carrier5. The angle between each two adjacent processing areas can be 72°, and each processing area has three material processing positions, namely Hole1, Hole2 and Hole3. The manufacturing auxiliary equipment includes robot 1, corresponding to each processing area, and there are three suction cups on robot 1, namely Sucker1, Sucker2 and Sucker3, which suck wafer 1, wafer 2 and wafer 3 respectively. The control device may be DSP EFEM. There are two cameras on the visual inspection equipment.

[0048] like Figure 4 As shown, the process of semiconductor manufacturing equipment control may include: Step 401: DSP EFEM, DSP, and robot 1 are started and run respectively.

[0049] Step 402: DSP EFEM determines a carrier at a position corresponding to robot 1 in DSP as the current carrier.

[0050] Step 403: DSP EFEM sends the current unloading instruction to robot 1, so that robot 1 absorbs three wafers from Hole 1, Hole 2 and Hole 3 of the current carrier and puts them into the unloading buffer Loadbuffer.

[0051] Step 404: DSP EFEM determines whether it has received the material unloading completion signal sent by robot 1. If so, execute step 405; otherwise, return to step 404.

[0052] Step 405: The DSP EFEM controls the DSP to rotate the lower grinding disc 72° clockwise.

[0053] Step 406: DSP EFEM determines whether all carriers have been unloaded. If yes, execute step 407; otherwise, return to step 402.

[0054] Step 407: DSP EFEM controls the robot 1 to leave the set area, and controls the visual inspection device to start and run to the corresponding area.

[0055] Step 408: The DSP EFEM determines a carrier at a position in the DSP corresponding to the first camera in the visual inspection device as the current carrier.

[0056] Step 409: the DSP EFEM controls the first camera in the visual inspection device to capture first image information, wherein the first image information includes: two holes on the current carrier.

[0057] Step 410: DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each Hole.

[0058] Among them, if black is detected on the first image information, the visual inspection device determines the current hole corresponding to black, and then sends "1" to the DSP EFEM through the current communication address corresponding to the current hole. If black is not detected on the first image information, the visual inspection device sends "0" to the DSP EFEM through the communication addresses corresponding to the two holes respectively. The inspection result information includes: "00", "01", "10", or "11".

[0059] Step 411: Determine whether the inspection result information includes "1". If yes, execute step 412; otherwise, execute step 413.

[0060] Step 412: The DSP EFEM controls the DSP to stop running, and issues an alarm for residual wafer fragments by turning on the indicator light in red, the buzzer sounding, and the touch screen providing a text prompt.

[0061] Step 413: the DSP EFEM controls the DSP to rotate the lower grinding disc 72° clockwise, and controls the second camera to capture second image information, wherein the second image information includes: image information of another hole on the current carrier.

[0062] Step 414: DSP EFEM receives the inspection result information returned by the visual inspection equipment through the communication address corresponding to each Hole.

[0063] Among them, if black is detected on the second image information, the visual inspection device will send "1" to the DSP EFEM through the current communication address corresponding to the hole. If black is not detected on the second image information, the visual inspection device will send "0" to the DSP EFEM through the communication address corresponding to the hole. The inspection result information includes: "0" or "1".

[0064] Step 415: DSP EFEM determines whether the inspection result information includes "1". If yes, execute step 412; otherwise, execute step 416.

[0065] Step 416: DSP EFEM determines whether all carriers have been subjected to debris residue detection. If so, this process ends; otherwise, the process returns to step 408.

[0066] It can be seen that in this embodiment, during the wafer manufacturing process, after the wafer is unloaded from the hole of the DSP, the visual inspection equipment can be controlled to perform residual wafer fragment detection, and when it is determined that there are residual wafer fragments in the hole, the DSP is controlled to shut down and perform alarm processing. In this way, automatic detection of residual wafer fragments can be achieved, reducing the probability of damage to the lower grinding disk in the DSP due to continuous processing. At the same time, it also reduces the maintenance cost and labor cost of the equipment, and also improves the production capacity of the equipment.

[0067] According to the above-mentioned process of semiconductor manufacturing control, a device for controlling semiconductor manufacturing equipment can be constructed. Figure 5 A device for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention can be applied to a control device for a semiconductor manufacturing equipment control system, such as Figure 5 As shown, the device 500 includes: a first control module 510 , a detection and acquisition module 520 and a second control module 530 .

[0068] The first control module 510 is configured to control the visual inspection device to perform debris residue detection on the material processing position when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment.

[0069] The detection acquisition module 520 is configured to obtain the inspection result information corresponding to the material processing position sent by the visual inspection equipment, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection equipment when the same background color as the semiconductor product is detected at the material processing position.

[0070] The second control module 530 is configured to stop running and perform alarm processing when it is determined that the inspection result information includes abnormal debris residue information.

[0071] In some embodiments, the apparatus further comprises: The material unloading control module is configured to control the manufacturing auxiliary equipment to absorb the semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the material unloading buffer area.

[0072] The state determination module is configured to determine that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment when receiving a material unloading completion signal sent by the manufacturing auxiliary equipment.

[0073] In some embodiments, the unloading control module is specifically configured to, when it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, send a first unloading instruction to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them in the unloading buffer area, wherein the first processing area has one or more material processing positions; and when receiving the first area unloading completion signal sent by the manufacturing auxiliary equipment, control the semiconductor manufacturing equipment to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

[0074] In some embodiments, the first control module 520 includes: A first control unit is configured to control a first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area when there are two or more material processing positions in the current processing area; The second control unit is configured to control the semiconductor manufacturing equipment to rotate the processing area when it is determined that the first camera has completed shooting, so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and control the second camera in the visual inspection equipment to capture second image information of other material processing positions.

[0075] It can be seen that in the embodiment of the present invention, during the semiconductor manufacturing process, after the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment, the device for controlling the semiconductor manufacturing equipment can control the visual inspection equipment to perform residual semiconductor product fragmentation detection at the material processing position, and when it is determined that there are residual semiconductor product fragments, a shutdown alarm is performed. In this way, automatic detection of residual semiconductor product fragments can be achieved, reducing the probability of damage to the setting components of the semiconductor manufacturing equipment due to continuous processing. At the same time, the maintenance cost and labor cost of the equipment are reduced, and the production capacity of the equipment is also improved.

[0076] Combination Figure 6 , an embodiment of the present invention provides a device 600 for controlling semiconductor manufacturing equipment, comprising: The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for controlling semiconductor manufacturing equipment of the above embodiment.

[0077] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0078] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, implements the method for controlling semiconductor manufacturing equipment in the above method embodiment.

[0079] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0080] An embodiment of the present invention provides an apparatus for controlling semiconductor manufacturing equipment, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0081] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for controlling semiconductor manufacturing equipment.

[0082] The embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor manufacturing equipment, control equipment and visual inspection equipment, in combination with Figure 7 , the control device includes: an equipment body 700; and the above-mentioned device 500 (600) for controlling semiconductor manufacturing equipment. The device 500 (600) for controlling semiconductor manufacturing equipment is installed in the equipment body. The installation relationship described here is not limited to placement inside the product, but also includes installation connections with other components of the product, including but not limited to physical connections, electrical connections or signal transmission connections. It can be understood by those skilled in the art that the device 500 (600) for controlling semiconductor manufacturing equipment can be adapted to a feasible equipment body, thereby realizing other feasible embodiments.

[0083] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0084] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0085] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0086] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for controlling semiconductor manufacturing equipment, characterized in that: include: When it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment, controlling the visual inspection equipment to perform a residual semiconductor product fragment inspection at the material processing position; Obtaining inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the semiconductor product is detected at the material processing position; When it is determined that the inspection result information includes abnormal information of residual debris, the operation is stopped and an alarm is processed.

2. The method according to claim 1, characterized in that Determining that semiconductor products have been unloaded at a material processing location of semiconductor manufacturing equipment includes: Control the manufacturing auxiliary equipment to absorb the semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the material unloading buffer area; When receiving the material unloading completion signal sent by the manufacturing auxiliary equipment, it is determined that the semiconductor product has been unloaded from the material processing position of the semiconductor manufacturing equipment.

3. The method according to claim 2, characterized in that The controlling manufacturing auxiliary equipment to absorb the semiconductor product from the material processing position corresponding to the semiconductor manufacturing equipment and place it in the material unloading buffer zone includes: When it is determined that the manufacturing auxiliary equipment corresponds to the first processing area of ​​the semiconductor manufacturing equipment, a first material unloading instruction is sent to the manufacturing auxiliary equipment, so that the manufacturing auxiliary equipment absorbs one or more semiconductor products from the first processing area of ​​the semiconductor manufacturing equipment and places them in the unloading buffer area, wherein the first processing area has one or more material processing positions; When receiving a first area unloading completion signal sent by the manufacturing auxiliary equipment, the semiconductor manufacturing equipment is controlled to rotate the processing area so that the second processing area corresponds to the manufacturing auxiliary equipment.

4. The method according to claim 1, characterized in that The controlling of the visual inspection device to detect the residual fragments of semiconductor products at the material processing position comprises: When there are two or more material processing positions in the current processing area, control the first camera in the visual inspection device to capture first image information of one or more material processing positions in the current processing area; When it is determined that the first camera has completed shooting, the semiconductor manufacturing equipment is controlled to rotate the processing area so that other material processing positions in the current processing area correspond to the shooting area of ​​the second camera in the visual inspection equipment, and the second camera in the visual inspection equipment is controlled to capture second image information of other material processing positions.

5. The method according to claim 1, characterized in that The visual inspection device sends inspection result information corresponding to the material processing position including: In the case where the same background color as the semiconductor product is detected in the image information detected by the debris residue, the visual inspection device determines the current material processing position corresponding to the background color; The visual inspection device sends debris residue abnormality information through the current communication address corresponding to the current material processing position.

6. A system for controlling semiconductor manufacturing equipment, characterized in that: include: Semiconductor equipment, control equipment, visual inspection equipment, among which, The control device is configured to, when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment, control the visual inspection device to perform a fragment residue detection of the semiconductor product at the material processing position; obtain the inspection result information corresponding to the material processing position sent by the visual inspection device; when it is determined that the inspection result information includes abnormal information of the fragment residue, stop the operation and perform an alarm process; The visual inspection device is configured to perform debris residue detection on the material processing position, and send inspection result information including debris residue abnormality information when the material processing position is detected to have the same background color as the semiconductor product.

7. The system according to claim 6, characterized in that Also includes: The manufacturing auxiliary equipment is configured to absorb semiconductor products from the material processing position corresponding to the semiconductor manufacturing equipment and place them in the unloading buffer area.

8. A device for controlling semiconductor manufacturing equipment, characterized in that: include: The first control module is configured to control the visual inspection device to perform a semiconductor product debris residue inspection on the material processing position when it is determined that the semiconductor product has been unloaded at the material processing position of the semiconductor manufacturing equipment; The detection acquisition module is configured to acquire the inspection result information corresponding to the material processing position sent by the visual inspection device, wherein the debris residue abnormality information included in the inspection result information is sent by the visual inspection device when the same background color as the semiconductor product is detected at the material processing position; The second control module is configured to stop running and perform alarm processing when it is determined that the inspection result information includes abnormal information of debris residue.

9. A device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for controlling semiconductor manufacturing equipment according to claims 1-5 when executing the program instructions.

10. A device for controlling semiconductor manufacturing equipment, wherein: Equipment includes: Equipment body; The device for controlling semiconductor manufacturing equipment according to claim 8 or 9 is installed in the equipment body.

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