An intelligent diode chip packaging and detection integrated device

Abstract

This invention discloses an integrated intelligent diode chip packaging and testing device. The invention relates to the field of diode chip packaging and testing technology, and includes a housing, a primary port, a machine door, a molding head, a support platform, a robotic arm, and a cooling assembly. The housing has a primary port on its outer wall, a machine door is installed on the outer wall, the molding head is installed on the inner wall, the support platform is installed on the inner wall, and the robotic arm is installed on the inner wall. This invention utilizes a primary support rod that moves a primary slide cylinder, which in turn moves a primary support rod that moves a primary spring. The spring then moves the primary support rod, which in turn moves a dispersing head. The dispersing head disperses water from a primary pipe, evenly spraying the water onto the surface of the semiconductor cooling block for rapid cooling. This achieves rapid cooling of the diode chip after packaging, increasing the production speed of the integrated device.

Description

Technical Field

[0001] This invention relates to the field of diode chip packaging and testing technology, specifically to an integrated intelligent diode chip packaging and testing device. Background Technology

[0002] As one of the core components of electronic products, the quality and performance of diodes directly affect the stability and reliability of the entire system. With the continuous upgrading of electronic products, the quality testing requirements for diodes are also getting higher and higher. The background technology of intelligent diode chip packaging and testing integrated device involves the development trend of the semiconductor industry and the importance of diodes in electronic products. With the continuous expansion of the electronic product market and the continuous progress of technology, intelligent diode chip packaging and testing integrated device will have broad market application prospects. However, the diode chips in the existing integrated diode chip packaging and testing devices cannot be cooled down quickly after packaging, which reduces the production speed of the integrated device.

[0003] The shortcomings of existing integrated diode chip packaging and testing devices are:

[0004] 1. Patent document CN115267512A discloses a chip package testing device and a chip package testing method, "including a fixed frame and a support assembly disposed on both sides inside the fixed frame for supporting the package shell. The support assembly includes a rotatably disposed traction rope and a partition fixedly sleeved on the outside of the traction rope. The protruding pins on the package shell are placed between the two partitions. A limit assembly is disposed on the partition, and a driving assembly is disposed between the partition and the inner wall of the fixed frame. When the traction rope moves the package shell into the fixed frame, the driving assembly unfolds the limit assembly and places it on the top of the pin. Due to the elasticity of the traction rope itself, when the probe moves upward and excessively squeezes the pin, the traction rope will bend, thereby causing the package shell to move upward to avoid direct confrontation with the probe. This can provide a certain buffering effect for the package shell, which is beneficial to avoid hard contact between the probe and the pin and can provide good protection for it." However, existing integrated diode chip packaging and testing devices cannot quickly cool down the packaged diode chip, reducing the production speed of the integrated device.

[0005] 2. Patent document CN113690159A discloses a chip package inspection system and method, "including a conveying module, an image capture module, a detection module, and a processor. The conveying module is used to convey multiple chip packages along a conveying path so that the multiple chip packages pass sequentially through a camera area and a detection area on the conveying path. The image capture module is disposed in the camera area and moves within the camera area to capture multiple images of at least two adjacent chip packages located in the camera area. The detection module is disposed in the detection area to perform chip inspection on the multiple chip packages. The processor is coupled to the image capture module and the detection module to determine whether to inspect the at least two adjacent chip packages in parallel based on the multiple images." However, existing integrated diode chip packaging and inspection devices are inconvenient to remove after diode chip packaging, reducing output efficiency.

[0006] 3. Patent document CN110849295A discloses a testing device for chip packaging processes, "including a collimation detection unit, a laser detection unit, and an alignment detection unit respectively disposed between the chip and the substrate. The collimation detection unit is used to initially detect the parallelism between the chip and the substrate, the laser detection unit is used to further detect the parallelism between the chip and the substrate, and the alignment detection unit is used to detect the alignment degree between the marking points of the chip and the marking points of the substrate. In addition to detecting the alignment degree, two parallelism detections are required, which naturally improves the detection accuracy. Therefore, the testing device for chip packaging processes provided by this invention has high detection accuracy. This invention also discloses a chip packaging system including the above-mentioned testing device for chip packaging processes." However, existing integrated diode chip packaging and testing devices cannot quickly detect defective diode chip packages, reducing product output quality.

[0007] 4. Patent document CN116774002B discloses a HAST test chamber for testing the reliability of chip packaging. It "includes a chamber body, with symmetrically arranged sealed placement chambers on both sides of the bottom of the chamber body, a storage cavity between the two sealed placement chambers, a storage rack installed in the middle of the storage cavity, two vertically arranged working chambers on the top of the chamber body, and a testing placement mechanism installed in each of the two working chambers. A sealed door is connected to one side of the chamber body via a hinge, and multiple locking mechanisms are provided between the sealed door and the chamber body for locking. By starting a rotating motor, the first placement toothed plate is slowly rotated, which in turn drives the second placement toothed plate to rotate. The rotation of the first and second placement toothed plates further increases the contact area between the product and the external environment and shortens the sufficient contact time, thereby improving the efficiency of the test." However, existing integrated diode chip packaging and testing devices cannot quickly detect and remove substandard diode chips, reducing the manufacturing quality of the diode chips. Summary of the Invention

[0008] The purpose of this invention is to provide an integrated intelligent diode chip packaging and testing device to solve the technical problem mentioned in the background art that the diode chip cannot be cooled down quickly after packaging, thus reducing the production speed of the integrated device.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an integrated intelligent diode chip packaging and testing device, comprising a housing, a No. 1 port, a door, a molding head, a support platform, a robotic arm, and a cooling assembly. The outer wall of the housing has a No. 1 port, the door is installed on the outer wall of the housing, the molding head is installed on the inner wall of the housing, the support platform is installed on the inner wall of the housing, the robotic arm is installed on the inner wall of the housing, the cooling assembly is installed on the inner wall of the support platform, a conveyor belt is installed through the outer wall of the No. 1 port, a pushing assembly is installed on the inner wall of the support platform, and a packaging groove is installed on the top of the support platform.

[0010] The cooling assembly includes a first box, a semiconductor cooling block, a first pipe, a water pump, a cooling pipe, a first motor, and a first L-shaped frame. The first box is located on the inner wall of the support platform, the semiconductor cooling block is located on the inner wall of the first box, the first pipe runs through the outer wall of the first box, the water pump runs through the outer wall of the first box, the cooling pipe is installed on the outer wall of the encapsulation tank, and the output end of the water pump extends to the inner wall of the cooling pipe. One end of the first pipe extends to the inner wall of the cooling pipe. The first motor runs through the outer wall of the first box, the first L-shaped frame is located on the inner wall of the first box, a first slide cylinder is installed on the outer wall of the first L-shaped frame, a first support rod is installed on the outer wall of the first slide cylinder, a first spring is installed on the outer wall of the first support rod, and one end of the first spring is connected to the outer wall of the first L-shaped frame. A first striking head is installed at the output end of the first motor, and a dispersion head is installed on the outer wall of the first support rod.

[0011] Preferably, the dispersing head moves via a first pipe, the first slide moves via the support of a first L-shaped frame, the first striking head is located above the first support rod, and the dispersing head is located above the semiconductor cooling block.

[0012] Preferably, the actuating assembly includes a second box, a top plate, a second opening, a second motor, a second spring, a limiting block, and a top head. The second box is located on the inner wall of the support platform, the top plate is located on the inner wall of the encapsulation groove, the second opening is opened at the bottom of the encapsulation groove, a first support cylinder is installed through the top of the second box, a second L-shaped frame is installed through the inner wall of the first support cylinder, and one end of the second L-shaped frame is connected to the bottom of the top plate through the second opening. The second motor is located on the inner wall of the second box, the top head is located at the output end of the second motor, the second spring is located on the outer wall of the second L-shaped frame, and one end of the second spring is connected to the inner wall of the second box. The limiting block is located on the inner wall of the second box.

[0013] Preferably, the limiting block is located below the second L-shaped frame, the top head is located below the second L-shaped frame, and the second L-shaped frame is moved by the first support cylinder.

[0014] Preferably, a detection component is installed on the inner wall of the housing, a pushing component is installed on the outer wall of the conveyor belt, and a collecting cylinder is installed on one side of the conveyor belt.

[0015] Preferably, the detection component includes a camera and a processing module. The camera is located on the inner wall of the housing and above the conveyor belt. The processing module is located on the outer wall of the housing. The processing module is electrically connected to the camera and to the pop-up component. The camera is used to capture real-time images of the diode chip after packaging, and the processing module contains images of good products after the diode chip is packaged.

[0016] Preferably, the real-time image of the packaged diode chip is transmitted to the processing module, which compares the real-time image of the packaged diode chip with the image of a good product after the diode chip is packaged. If the comparison result of the real-time image of the packaged diode chip and the image of a good product after the diode chip is matched, the image is set to a qualified state; if the comparison result of the real-time image of the packaged diode chip and the image of a good product after the diode chip is not matched, the image is set to a unqualified state.

[0017] Preferably, the feeding assembly includes a No. 5 box, a No. 3 cylinder, a No. 5 cylinder, an air pump, a blocking ball, a T-shaped frame, a T-shaped push rod, and a No. 6 cylinder. The No. 5 box is located on the outer wall of the conveyor belt, the No. 3 cylinder is located on the inner wall of the No. 5 box, and the No. 5 cylinder passes through the outer wall of the No. 3 cylinder. The air pump passes through the inner wall of the No. 5 box, and the output end of the air pump is connected to one end of the No. 5 cylinder. A sealing ring is installed on the inner wall of the No. 5 cylinder, and a No. 5 spring is installed on the outer wall of the sealing ring. The T-shaped frame is located at one end of the No. 5 spring, the blocking ball is located at one end of the T-shaped frame, the No. 6 cylinder passes through the outer wall of the No. 5 box, and the T-shaped push rod passes through the inner wall of the No. 6 cylinder. One end of the T-shaped push rod extends to the inner wall of the No. 3 cylinder, and a sealing block is installed at one end of the T-shaped push rod.

[0018] Preferably, the T-shaped push rod moves with the support of the No. 6 and No. 3 cylinders, the sealing ring cooperates with the ball to seal the No. 5 cylinder, the outer wall of the T-shaped push rod is equipped with the No. 8 spring, and one end of the No. 8 spring is connected to the inner wall of the No. 5 box.

[0019] Preferably, the method of using the integrated device includes the following steps:

[0020] Step S1: The water pump starts and draws cold water from the No. 1 tank into the cooling pipe. At this time, the diode chip is cooled through the cooling pipe after being packaged by the plastic encapsulation head. The water source in the cooling pipe enters the No. 1 tank through the No. 1 pipe. At this time, the No. 1 motor rotates, which drives the No. 1 striking head to rotate. The rotation of the No. 1 striking head drives the No. 1 support rod to move. The movement of the No. 1 support rod drives the No. 1 slide cylinder to move. The movement of the No. 1 slide cylinder causes the No. 1 support rod to drive the No. 1 spring to move. The movement of the No. 1 spring causes the No. 1 support rod to drive the dispersion head to move. The movement of the dispersion head disperses the water source discharged from the No. 1 pipe. The dispersed water source is evenly sprayed onto the surface of the semiconductor cooling block to cool it down quickly. This realizes the function of rapidly cooling the diode chip after packaging and improving the production speed of the integrated device.

[0021] Step S2: The function of the limiting block is to provide a limit for the second L-shaped frame. After the diode chip is packaged and cooled, the second motor rotates, which drives the top head to rotate. The rotation of the top head drives the second L-shaped frame to move. The movement of the second L-shaped frame drives the second spring to move. The movement of the second spring causes the second L-shaped frame to drive the top plate to move. The movement of the top plate pushes the packaged diode chip out of the packaging slot, realizing the function of convenient removal of the packaged diode chip and improving the material discharge efficiency.

[0022] Step S3: When the processing module detects that the image is in a qualified state, the processing module controls the pusher component to not start. After the pusher component is not started, the camera continues to capture real-time images of the diode chip after packaging until the processing module detects that the image is in a qualified state. When the processing module detects that the image is in a qualified state, the processing module controls the pusher component to start. After the pusher component starts, the camera continues to capture real-time images of the diode chip after packaging until the processing module detects that the image is in a qualified state. This realizes the function of the integrated diode chip packaging and detection device to quickly detect unqualified diode chip packages and improve product output quality.

[0023] Step S4: After the image shows a defective state, the air pump starts and generates pressurized gas, which moves the blocking ball. The movement of the blocking ball moves the T-shaped frame, which in turn moves the No. 5 spring. The movement of the No. 5 spring causes the blocking ball to move away from the sealing ring. At this time, the No. 5 cylinder opens and introduces gas into the No. 3 cylinder. The pressurized gas moves the sealing block, which in turn moves the T-shaped push rod. The movement of the T-shaped push rod moves the No. 8 spring, which in turn pushes the T-shaped push rod into the collection cylinder, thus realizing the function of quickly detecting and removing defective diode chips and improving the manufacturing quality of diode chips.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. This invention uses a water pump to draw cold water from a first tank into a cooling pipe. At this time, the diode chip, after being encapsulated by a plastic seal, is cooled through the cooling pipe. The water in the cooling pipe enters the first tank through a first pipe. Simultaneously, a first motor rotates, driving a first striking head to rotate. The rotation of the first striking head moves a first support rod, which in turn moves a first sliding cylinder. The movement of the first sliding cylinder causes the first support rod to move a first spring, which in turn causes the first support rod to move a dispersing head. The dispersing head disperses the water discharged from the first pipe, evenly spraying it onto the surface of the semiconductor cooling block for rapid cooling. This achieves the function of rapidly cooling the encapsulated diode chip, thus increasing the production speed of the integrated device.

[0026] 2. The present invention uses a limiting block to provide a limit for the second L-shaped frame. After the diode chip is packaged and cooled, the second motor rotates, which drives the top head to rotate. The rotation of the top head drives the second L-shaped frame to move. The movement of the second L-shaped frame drives the second spring to move. The movement of the second spring causes the second L-shaped frame to drive the top plate to move. The movement of the top plate pushes the packaged diode chip out of the packaging slot, thus realizing the function of convenient removal of the packaged diode chip and improving the material discharge efficiency.

[0027] 3. This invention, through the installation of a processing module, detects a qualified image state and controls the pusher component to not start. After the pusher component is not started, the camera continuously captures real-time images of the diode chip after packaging until the processing module detects a qualified image state. When the processing module detects a qualified image state, it controls the pusher component to start. After the pusher component starts, the camera continuously captures real-time images of the diode chip after packaging until the processing module detects a qualified image state. This realizes the function of a diode chip packaging and detection integrated device to quickly detect unqualified diode chip packages and improve product output quality.

[0028] 4. This invention utilizes a pump that, upon detecting a defective diode chip, generates pressurized gas that moves a blocking ball. This movement of the blocking ball moves a T-shaped frame, which in turn moves a fifth spring. The movement of the fifth spring causes the blocking ball to move away from the sealing ring, opening the fifth cylinder and introducing gas into the third cylinder. This pressurized gas then moves a sealing block, which in turn moves a T-shaped push rod. The T-shaped push rod then moves a eighth spring, which in turn pushes the T-shaped push rod into the collection cylinder. This invention achieves rapid detection and removal of defective diode chips, improving the manufacturing quality of diode chips. Attached Figure Description

[0029] Figure 1 This is a front view structural diagram of the present invention;

[0030] Figure 2 This is a schematic diagram of the front structure of the present invention;

[0031] Figure 3 This is a schematic diagram of the support platform structure of the present invention;

[0032] Figure 4 This is a schematic diagram of the cooling pipe structure of the present invention;

[0033] Figure 5 For the present invention Figure 4 A schematic diagram of structure A;

[0034] Figure 6 This is a schematic diagram of the top plate structure of the present invention;

[0035] Figure 7 This is a schematic diagram of the camera structure of the present invention;

[0036] Figure 8 This is a schematic diagram of the diode chip testing process of the present invention;

[0037] Figure 9 This is a schematic diagram of the T-shaped push rod structure of the present invention;

[0038] Figure 10 For the present invention Figure 9 A schematic diagram of the B structure.

[0039] In the diagram: 1. Housing; 2. Machine door; 3. Processing module; 4. Port No. 1; 5. Conveyor belt; 6. Sealing head; 7. Robotic arm; 8. Support platform; 9. Box No. 1; 10. Semiconductor cooling block; 11. Water pump; 12. Sealing tank; 13. Cooling pipe; 14. Pipe No. 1; 15. Motor No. 1; 16. Impact head No. 1; 17. L-shaped frame No. 1; 18. Slide cylinder No. 1; 19. Spring No. 1; 20. Support rod No. 1; 21. Dispersing head; 22. Box No. 2; 23. Support Cylinder No. 1; 24. L-shaped Frame No. 2; 25. Opening No. 2; 26. Top Plate; 27. Spring No. 2; 28. Limiting Block; 29. ​​Motor No. 2; 30. Top Head; 31. Box No. 5; 32. Cylinder No. 6; 33. T-shaped Push Rod; 34. Cylinder No. 3; 35. Sealing Block; 36. Air Pump; 37. Cylinder No. 5; 38. Sealing Ring; 39. Spring No. 5; 40. T-shaped Frame; 41. Blocking Ball; 42. Camera. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand this according to the specific circumstances.

[0043] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5This invention provides an embodiment of an integrated intelligent diode chip packaging and testing device, comprising a housing 1, a first port 4, a door 2, a sealing head 6, a support platform 8, a robotic arm 7, and a cooling assembly. The outer wall of the housing 1 has a first port 4, and the door 2 is installed on the outer wall of the housing 1. The sealing head 6 is installed on the inner wall of the housing 1, the support platform 8 is installed on the inner wall of the housing 1, the robotic arm 7 is installed on the inner wall of the housing 1, and the cooling assembly is installed on the inner wall of the support platform 8. A conveyor belt 5 is installed through the outer wall of the first port 4. A pushing assembly is installed on the inner wall of the support platform 8, and a packaging groove 12 is installed on the top of the support platform 8. A testing assembly is installed on the inner wall of the housing 1. A pushing assembly is installed on the outer wall of the conveyor belt 5, and a collecting cylinder is installed on one side of the conveyor belt 5. The door is opened... 2. Place the diode chip in the encapsulation tank 12. At this time, the encapsulation head 6 starts to encapsulate the diode chip. After the diode chip is encapsulated, the robotic arm 7 picks up the diode chip and places it on the surface of the conveyor belt 5. The conveyor belt 5 starts to detect the diode chip and then removes it. The cooling assembly includes a first box 9, a semiconductor cooling block 10, a first pipe 14, a water pump 11, a cooling pipe 13, a first motor 15, and a first L-shaped frame 17. The first box 9 is located on the inner wall of the support platform 8. The semiconductor cooling block 10 is located on the inner wall of the first box 9. The first pipe 14 passes through the outer wall of the first box 9. The water pump 11 passes through the outer wall of the first box 9. The cooling pipe 13 is installed on the outer wall of the encapsulation tank 12, and the output end of the water pump 11 extends to the inner wall of the cooling pipe 13. One end of the first pipe 14 extends... The first motor 15 extends through the inner wall of the cooling pipe 13 and passes through the outer wall of the first box 9. The first L-shaped frame 17 is located on the inner wall of the first box 9. A first slide cylinder 18 is installed on the outer wall of the first L-shaped frame 17. A first support rod 20 is installed on the outer wall of the first slide cylinder 18. A first spring 19 is installed on the outer wall of the first support rod 20, with one end of the first spring 19 connected to the outer wall of the first L-shaped frame 17. A first striking head 16 is installed at the output end of the first motor 15. A dispersion head 21 is installed on the outer wall of the first support rod 20. The dispersion head 21 moves through the first pipe 14. The first slide cylinder 18 moves under the support of the first L-shaped frame 17. The first striking head 16 is located above the first support rod 20, and the dispersion head 21 is located above the semiconductor cooling block 10. When water pump 11 starts, it draws cold water from tank 9 into cooling pipe 13. At this time, the diode chip, after being encapsulated by plastic head 6, is cooled by cooling pipe 13. The water in cooling pipe 13 enters tank 9 through pipe 14. Simultaneously, motor 15 rotates, driving impact head 16 to rotate. Impact head 16 rotates, moving support rod 20. Support rod 20 moves slide cylinder 18, which in turn moves spring 19. Spring 19 moves spring 19, which in turn moves dispersion head 21. Dispersion head 21 disperses the water discharged from pipe 14, evenly spraying the surface of semiconductor cooling block 10 for rapid cooling.This technology enables rapid cooling of diode chips after packaging, thereby increasing the production speed of integrated devices.

[0044] Example 2: Please refer to Figure 2 , Figure 3 and Figure 6 An embodiment of the present invention provides: the actuating assembly includes a second box 22, a top plate 26, a second opening 25, a second motor 29, a second spring 27, a limiting block 28, and a top head 30. The second box 22 is located on the inner wall of the support platform 8, the top plate 26 is located on the inner wall of the encapsulation groove 12, the second opening 25 is opened at the bottom of the encapsulation groove 12, a first support cylinder 23 is installed through the top of the second box 22, a second L-shaped frame 24 is installed through the inner wall of the first support cylinder 23, and one end of the second L-shaped frame 24 is connected to the bottom of the top plate 26 through the second opening 25. The second motor 29 is located on the inner wall of the second box 22, the top head 30 is located at the output end of the second motor 29, and the second spring 27 is located on the outer wall of the second L-shaped frame 24. One end is connected to the inner wall of the second box 22. The limiting block 28 is located on the inner wall of the second box 22 and below the second L-shaped frame 24. The top head 30 is located below the second L-shaped frame 24. The second L-shaped frame 24 moves through the first support cylinder 23. The function of the limiting block 28 is to provide a limit for the second L-shaped frame 24. After the diode chip is packaged and cooled, the second motor 29 rotates and drives the top head 30 to rotate. The rotation of the top head 30 drives the second L-shaped frame 24 to move. The movement of the second L-shaped frame 24 drives the second spring 27 to move. The movement of the second spring 27 causes the second L-shaped frame 24 to drive the top plate 26 to move. The movement of the top plate 26 pushes the packaged diode chip out of the packaging slot 12, realizing the function of convenient removal of the packaged diode chip and improving the material discharge efficiency.

[0045] Example 3: Please refer to Figure 2 , Figure 7 and Figure 8, an embodiment provided by the present invention: The detection component includes a camera 42 and a processing module 3. The camera 42 is located on the inner wall of the housing 1, above the conveyor belt 5. The processing module 3 is located on the outer wall of the housing 1. The processing module 3 is electrically connected to the camera 42 and is also electrically connected to the ejection component. The camera 42 is used to capture real-time images of the diode chip after encapsulation. The processing module 3 stores the good product images of the diode chip after encapsulation. The real-time images of the diode chip after encapsulation are transmitted into the processing module 3. The processing module 3 compares the real-time images of the diode chip after encapsulation with the good product images of the diode chip after encapsulation. When the comparison result between the real-time images of the diode chip after encapsulation and the good product images of the diode chip after encapsulation matches, it is set as the qualified state of the picture. When the comparison result does not match, it is set as the unqualified state of the picture. When the processing module 3 detects the qualified state of the picture, the processing module 3 controls the pusher component not to start. After the pusher component does not start, the camera 42 continuously captures real-time images of the diode chip after encapsulation until the processing module 3 detects the unqualified state of the picture. When the processing module 3 detects the unqualified state of the picture, the processing module 3 controls the pusher component to start. After the pusher component starts, the camera 42 continuously captures real-time images of the diode chip after encapsulation until the processing module 3 detects the qualified state of the picture, realizing the function of the integrated device for diode chip encapsulation and detection to quickly detect unqualified diode chip encapsulations and improve the product output quality.

[0046] Embodiment 4: Please refer to Figure 2 , Figure 9 and Figure 10An embodiment of the present invention provides: the pushing assembly includes a No. 5 box 31, a No. 3 cylinder 34, a No. 5 cylinder 37, an air pump 36, a blocking ball 41, a T-shaped frame 40, a T-shaped push rod 33, and a No. 6 cylinder 32. The No. 5 box 31 is located on the outer wall of the conveyor belt 5, the No. 3 cylinder 34 is located on the inner wall of the No. 5 box 31, the No. 5 cylinder 37 penetrates through the outer wall of the No. 3 cylinder 34, the air pump 36 penetrates through the inner wall of the No. 5 box 31, and the output end of the air pump 36 is connected to one end of the No. 5 cylinder 37. A sealing ring 38 is installed on the inner wall of the No. 5 cylinder 37, and a No. 5 spring 39 is installed on the outer wall of the sealing ring 38. The T-shaped frame 40 is located at one end of the No. 5 spring 39, the blocking ball 41 is located at one end of the T-shaped frame 40, the No. 6 cylinder 32 penetrates through the outer wall of the No. 5 box 31, the T-shaped push rod 33 penetrates through the inner wall of the No. 6 cylinder 32, and one end of the T-shaped push rod 33 extends to the inner wall of the No. 3 cylinder 34. One end of cylinder 3 is equipped with a sealing block 35. The T-shaped push rod 33 moves with the support of cylinder 6 32 and cylinder 3 34. The sealing ring 38 cooperates with the ball stopper 41 to seal cylinder 5 37. When the image shows a defective state, the air pump 36 starts to generate pressurized gas, which drives the ball stopper 41 to move. The movement of the ball stopper 41 drives the T-shaped frame 40 to move. The movement of the T-shaped frame 40 drives the fifth spring 39 to move. The movement of the fifth spring 39 causes the ball stopper 41 to move away from the sealing ring 38. At this time, cylinder 5 37 opens and introduces gas into cylinder 3 34. The pressurized gas drives the sealing block 35 to move. The movement of the sealing block 35 drives the T-shaped push rod 33 to move. The movement of the T-shaped push rod 33 drives the eighth spring to move. The movement of the eighth spring causes the T-shaped push rod 33 to push the defective diode chip into the collection cylinder, realizing the function of quickly detecting and removing defective diode chips and improving the manufacturing quality of diode chips.

[0047] The method of using this integrated device includes the following steps:

[0048] Step S1: The water pump 11 starts and draws cold water from the first tank 9 into the cooling pipe 13. At this time, the diode chip is packaged by the plastic encapsulation head 6 and cooled by the cooling pipe 13. The water source in the cooling pipe 13 enters the first tank 9 through the first pipe 14. At this time, the first motor 15 rotates and drives the first striking head 16 to rotate. The rotation of the first striking head 16 drives the first support rod 20 to move. The movement of the first support rod 20 drives the first slide cylinder 18 to move. The movement of the first slide cylinder 18 causes the first support rod 20 to drive the first spring 19 to move. The movement of the first spring 19 causes the first support rod 20 to drive the dispersion head 21 to move. The movement of the dispersion head 21 disperses the water source discharged from the first pipe 14. The dispersed water source is evenly sprayed onto the surface of the semiconductor cooling block 10 to cool it down quickly. This realizes the function of rapidly cooling the diode chip after packaging and improving the production speed of the integrated device.

[0049] Step S2: The function of the limiting block 28 is to provide a limit for the second L-shaped frame 24. After the diode chip is packaged and cooled, the second motor 29 rotates, driving the top head 30 to rotate. The rotation of the top head 30 drives the second L-shaped frame 24 to move. The movement of the second L-shaped frame 24 drives the second spring 27 to move. The movement of the second spring 27 causes the second L-shaped frame 24 to drive the top plate 26 to move. The movement of the top plate 26 pushes the packaged diode chip out of the packaging slot 12, realizing the function of convenient removal of the packaged diode chip and improving the material discharge efficiency.

[0050] In step S3, when the processing module 3 detects that the image is in a qualified state, the processing module 3 controls the pusher component to not start. After the pusher component is not started, the camera 42 continues to capture real-time images of the diode chip after packaging until the processing module 3 detects that the image is in a qualified state. When the processing module 3 detects that the image is in a qualified state, the processing module 3 controls the pusher component to start. After the pusher component starts, the camera 42 continues to capture real-time images of the diode chip after packaging until the processing module 3 detects that the image is in a qualified state. This realizes the function of the integrated diode chip packaging and detection device to quickly detect unqualified diode chip packages and improve product output quality.

[0051] Step S4: After the screen displays an unqualified state, the air pump 36 starts to generate pressurized gas, which moves the blocking ball 41. The movement of the blocking ball 41 moves the T-shaped frame 40, which in turn moves the fifth spring 39. The movement of the fifth spring 39 causes the blocking ball 41 to move away from the sealing ring 38. At this time, the fifth cylinder 37 opens and introduces gas into the third cylinder 34. The pressurized gas moves the sealing block 35, which in turn moves the T-shaped push rod 33. The movement of the T-shaped push rod 33 moves the eighth spring, which pushes the T-shaped push rod 33 into the collection cylinder, thus realizing the function of quickly detecting and removing unqualified diode chips and improving the manufacturing quality of diode chips.

[0052] Working principle: Water pump 11 starts to draw cold water from tank 9 into cooling pipe 13. At this time, the diode chip, after being encapsulated by plastic head 6, is cooled by cooling pipe 13. The water in cooling pipe 13 enters tank 9 through pipe 14. Simultaneously, motor 15 rotates, driving impact head 16 to rotate. Impact head 16 rotates, moving support rod 20. Support rod 20 moves slide cylinder 18, which in turn moves spring 19, which in turn moves dispersion head 21. Discharge from pipe 14 is then carried out by dispersion head 21. The water source is dispersed, and the dispersed water is evenly sprayed onto the surface of the semiconductor cooling block 10 to rapidly cool it down. This achieves the function of rapidly cooling the diode chip after packaging, thereby increasing the production speed of the integrated device. The limiting block 28 provides a limit for the second L-shaped frame 24. After the diode chip is packaged and cooled down, the second motor 29 rotates, driving the top head 30 to rotate. The rotation of the top head 30 drives the second L-shaped frame 24 to move. The movement of the second L-shaped frame 24 drives the second spring 27 to move. The movement of the second spring 27 causes the second L-shaped frame 24 to drive the top plate 26 to move. The movement of the top plate 26 pushes the packaged diode chip out of the packaging slot 12, realizing convenient removal and lifting of the packaged diode chip. The high output efficiency feature allows the processing module 3 to control the pusher component to remain inactive when it detects a qualified image. After the pusher component is deactivated, the camera 42 continuously captures real-time images of the packaged diode chips until the processing module 3 detects a qualified image. Upon detecting a defective image, the processing module 3 then controls the pusher component to activate. Once activated, the camera 42 continuously captures real-time images of the packaged diode chips until the processing module 3 detects a qualified image. This integrated diode chip packaging and detection device rapidly detects defective diode chip packages, improving product output quality. After the condition is qualified, the air pump 36 starts to generate pressurized gas, which drives the blocking ball 41 to move. The movement of the blocking ball 41 drives the T-shaped frame 40 to move. The movement of the T-shaped frame 40 drives the fifth spring 39 to move. The movement of the fifth spring 39 causes the blocking ball 41 to move away from the sealing ring 38. At this time, the fifth cylinder 37 opens and introduces gas into the third cylinder 34. The pressurized gas drives the sealing block 35 to move. The movement of the sealing block 35 drives the T-shaped push rod 33 to move. The movement of the T-shaped push rod 33 drives the eighth spring to move. The movement of the eighth spring causes the T-shaped push rod 33 to push the unqualified diode chip into the collection cylinder. This realizes the function of quickly detecting and removing unqualified diode chips and improving the manufacturing quality of diode chips.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An integrated intelligent diode chip packaging and testing device, comprising a housing (1), a primary port (4), a machine door (2), a plastic sealing head (6), a support platform (8), a robotic arm (7), and a cooling assembly, characterized in that: The outer wall of the housing (1) has a port (4), the outer wall of the housing (1) is equipped with a door (2), the inner wall of the housing (1) is equipped with a sealing head (6), the inner wall of the housing (1) is equipped with a support platform (8), the inner wall of the housing (1) is equipped with a robotic arm (7), the inner wall of the support platform (8) is equipped with a cooling assembly, the outer wall of the port (4) is connected by a conveyor belt (5), the inner wall of the support platform (8) is equipped with a pushing assembly, and the top of the support platform (8) is equipped with a sealing groove (12). The cooling assembly includes a first box (9), a semiconductor cooling block (10), a first pipe (14), a water pump (11), a cooling pipe (13), a first motor (15), and a first L-shaped frame (17). The first box (9) is located on the inner wall of the support platform (8), the semiconductor cooling block (10) is located on the inner wall of the first box (9), the first pipe (14) passes through the outer wall of the first box (9), the water pump (11) passes through the outer wall of the first box (9), the cooling pipe (13) is installed on the outer wall of the encapsulation tank (12), and the output end of the water pump (11) extends to the inner wall of the cooling pipe (13). One end of the first pipe (14) extends to the inner wall of the cooling pipe (13), and the first motor (15)... A first L-shaped frame (17) is located on the inner wall of the first box (9). A first slide cylinder (18) is installed on the outer wall of the first L-shaped frame (17). A first support rod (20) is installed on the outer wall of the first slide cylinder (18). A first spring (19) is installed on the outer wall of the first support rod (20), and one end of the first spring (19) is connected to the outer wall of the first L-shaped frame (17). A first striking head (16) is installed at the output end of the first motor (15). A dispersing head (21) is installed on the outer wall of the first support rod (20). The dispersing head (21) moves through the first pipe (14). The first slide cylinder (18) is connected through the first... The L-shaped frame (17) is supported and moved. The first striking head (16) is located above the first support rod (20), and the dispersing head (21) is located above the semiconductor cooling block (10). The top moving assembly includes a second box (22), a top plate (26), a second opening (25), a second motor (29), a second spring (27), a limiting block (28), and a top head (30). The second box (22) is located on the inner wall of the support platform (8), the top plate (26) is located on the inner wall of the encapsulation groove (12), the second opening (25) is opened at the bottom of the encapsulation groove (12), and a first support cylinder (23) is installed through the top of the second box (22). The inner wall of the first support cylinder (23) is installed through the first support cylinder (23). There is a second L-shaped frame (24), and one end of the second L-shaped frame (24) is connected to the bottom of the top plate (26) through the second opening (25). The second motor (29) is located on the inner wall of the second box (22), the top head (30) is located at the output end of the second motor (29), the second spring (27) is located on the outer wall of the second L-shaped frame (24), and one end of the second spring (27) is connected to the inner wall of the second box (22). The limiting block (28) is located on the inner wall of the second box (22), and the limiting block (28) is located below the second L-shaped frame (24). The top head (30) is located below the second L-shaped frame (24). The second L-shaped frame (24) moves through the first support cylinder (23).

2. The integrated intelligent diode chip packaging and testing device according to claim 1, characterized in that: The inner wall of the housing (1) is equipped with a detection component, the outer wall of the conveyor belt (5) is equipped with a pusher component, and a collection cylinder is installed on one side of the conveyor belt (5).

3. The integrated intelligent diode chip packaging and testing device according to claim 2, characterized in that: The detection component includes a camera (42) and a processing module (3). The camera (42) is located on the inner wall of the housing (1) and above the conveyor belt (5). The processing module (3) is located on the outer wall of the housing (1). The processing module (3) is electrically connected to the camera (42) and to the pop-up component. The camera (42) is used to capture real-time images of the diode chip after packaging. The processing module (3) contains images of good products after the diode chip is packaged.

4. The integrated intelligent diode chip packaging and testing device according to claim 3, characterized in that: The real-time image of the packaged diode chip is transmitted to the processing module (3). The processing module (3) compares the real-time image of the packaged diode chip with the good product image of the packaged diode chip. If the comparison result of the real-time image of the packaged diode chip and the good product image of the packaged diode chip matches, the image is set to a qualified state. If the comparison result of the real-time image of the packaged diode chip and the good product image of the packaged diode chip does not match, the image is set to a unqualified state.

5. The integrated intelligent diode chip packaging and testing device according to claim 2, characterized in that: The feeding assembly includes a No. 5 box (31), a No. 3 cylinder (34), a No. 5 cylinder (37), an air pump (36), a stopper (41), a T-shaped frame (40), a T-shaped push rod (33), and a No. 6 cylinder (32). The No. 5 box (31) is located on the outer wall of the conveyor belt (5), the No. 3 cylinder (34) is located on the inner wall of the No. 5 box (31), the No. 5 cylinder (37) passes through the outer wall of the No. 3 cylinder (34), and the air pump (36) passes through the inner wall of the No. 5 box (31), with the output end of the air pump (36) connected to one end of the No. 5 cylinder (37). A sealing ring (38) is installed on the inner wall of the No. 5 cylinder (37), and a No. 5 spring (39) is installed on the outer wall of the sealing ring (38). A T-shaped frame (40) is located at one end of the No. 5 spring (39), and a ball stop (41) is located at one end of the T-shaped frame (40). The No. 6 cylinder (32) penetrates the outer wall of the No. 5 box (31), and a T-shaped push rod (33) penetrates the inner wall of the No. 6 cylinder (32). One end of the T-shaped push rod (33) extends to the inner wall of the No. 3 cylinder (34), and a sealing block (35) is installed at one end of the T-shaped push rod (33).

6. The integrated intelligent diode chip packaging and testing device according to claim 5, characterized in that: The T-shaped push rod (33) moves with the support of the No. 6 cylinder (32) and the No. 3 cylinder (34). The sealing ring (38) and the ball stopper (41) cooperate to seal the No. 5 cylinder (37). The outer wall of the T-shaped push rod (33) is equipped with the No. 8 spring, and one end of the No. 8 spring is connected to the inner wall of the No. 5 box (31).

7. A method of using an integrated intelligent diode chip packaging and testing device, applicable to the integrated intelligent diode chip packaging and testing device as described in any one of claims 1-6, characterized in that, The method of using this integrated device includes the following steps: Step S1: The water pump (11) starts to draw cold water from the first box (9) into the cooling pipe (13). At this time, the diode chip is cooled by the cooling pipe (13) after being encapsulated by the plastic head (6). The water source in the cooling pipe (13) enters the first box (9) through the first pipe (14). At this time, the first motor (15) rotates and drives the first striking head (16) to rotate. The first striking head (16) rotates and drives the first support rod (20) to move. The first support rod (20) moves and drives the first slide cylinder (18) to move. The first slide cylinder (18) moves and causes the first support rod (20) to drive the first spring (19) to move. The first spring (19) moves and causes the first support rod (20) to drive the dispersing head (21) to move. The dispersing head (21) moves and disperses the water source discharged from the first pipe (14). The dispersed water source is evenly sprayed onto the surface of the semiconductor cooling block (10) to cool it down quickly. Step S2, the function of the limiting block (28) is to provide a limit for the second L-shaped frame (24). After the diode chip is packaged and cooled down, the second motor (29) rotates and drives the top head (30) to rotate. The rotation of the top head (30) drives the second L-shaped frame (24) to move. The movement of the second L-shaped frame (24) drives the second spring (27) to move. The movement of the second spring (27) causes the second L-shaped frame (24) to drive the top plate (26) to move. The movement of the top plate (26) pushes the packaged diode chip out of the packaging slot (12). Step S3: When the processing module (3) detects that the screen is in a qualified state, the processing module (3) controls the pusher component to not start. After the pusher component is not started, the camera (42) continues to capture real-time images of the diode chip after packaging until the processing module (3) detects that the screen is in a qualified state. When the processing module (3) detects that the screen is in a qualified state, the processing module (3) controls the pusher component to start. After the pusher component is started, the camera (42) continues to capture real-time images of the diode chip after packaging until the processing module (3) detects that the screen is in a qualified state. Step S4: After the screen is in an unqualified state, the air pump (36) starts to generate pressurized gas, which drives the blocking ball (41) to move. The movement of the blocking ball (41) drives the T-shaped frame (40) to move. The movement of the T-shaped frame (40) drives the No. 5 spring (39) to move. The movement of the No. 5 spring (39) causes the blocking ball (41) to move away from the sealing ring (38). At this time, the No. 5 cylinder (37) opens and introduces gas into the No. 3 cylinder (34). Its pressurized gas drives the sealing block (35) to move. The movement of the sealing block (35) drives the T-shaped push rod (33) to move. The movement of the T-shaped push rod (33) drives the No. 8 spring to move. The movement of the No. 8 spring causes the T-shaped push rod (33) to push the unqualified diode chip into the collection cylinder.

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