Stacked electronic structure

Abstract

A stacked electronic structure includes a substrate on which a plurality of electronic components are disposed, a package covering the plurality of electronic components, the plurality of electronic components including a first active component, a first electrode of the first active component being located on an upper surface of the first active component, and a second electrode of the first active component being located on a lower surface of the first active component. A second electrode of the first active element is located on a lower surface of the first active element; and a magnetic element over the package, the magnetic element including a magnetic body and a first inductor in the magnetic body, in which the second electrode of the first active element is electrically connected to the substrate, and the first inductor is electrically connected to the first electrode of the first active element.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to a stacked electronic structure. Background Art

[0002] Conventional electronic structures, such as power modules and DC-DC converters, typically include an electronic device having an interconnection circuit that is electrically connected to a substrate. The electronic device is coupled to leads for connection to conductive patterns and / or other electronic components. A conventional method for reducing the surface area occupied by the electronic structure is to stack the assembled devices, but the heat generated by the coils is difficult to dissipate. In addition, the heat generated by the stacked electronic structure is also difficult to dissipate.

[0003] Therefore, the industry needs a better solution to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a stacked electronic structure.

[0005] In one embodiment of the present invention, a stacked electronic structure is provided, which includes: a substrate, wherein a plurality of electronic components are arranged on the substrate, wherein a package body covers the plurality of electronic components, wherein the plurality of electronic components include a first active component, wherein a first electrode of the first active component is located on an upper surface of the first active component, and a second electrode of the first active component is located on a lower surface of the first active component; and a magnetic component, located above the package body, the magnetic component includes a magnetic body and a first inductor located in the magnetic body, wherein the second electrode of the first active component is electrically connected to the substrate, and the first inductor is electrically connected to the first electrode of the first active component.

[0006] In one embodiment, the first active device is a first field effect transistor (MOSFET).

[0007] In one embodiment, the first inductor is made of a flat metal wire.

[0008] In one embodiment, a first electrode of a second active element is located on an upper surface of the second active element, a second electrode of the second active element is located on a lower surface of the second active element, wherein a second inductor is located in the magnetic body, wherein the second electrode of the second active element is electrically connected to the substrate, and the second inductor is electrically connected to the first electrode of the second active element.

[0009] In one embodiment, the first active device is a first field effect transistor (MOSFET), and the second active device is a second field effect transistor.

[0010] In one embodiment, the second inductor is made of a flat metal wire.

[0011] In one embodiment, a first conductive column is disposed on the substrate and electrically connected to the substrate, wherein the package encapsulates the first active element and the first conductive column, and wherein the first inductor is electrically connected to the first electrode of the first active element and the first conductive column.

[0012] In one embodiment, a first conductive column and a second conductive column are disposed on the substrate and electrically connected to the substrate, wherein the package body covers the first active component, the second active component, the first conductive column and the second conductive column, wherein the first inductor is electrically connected to the first electrode of the first active component and the first conductive column, and the second inductor is electrically connected to the second electrode of the second active component and the second conductive column.

[0013] In one embodiment, a portion of the first inductor is not covered by the magnetic body so as to be connected to a heat sink.

[0014] In one embodiment, an upper surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

[0015] In one embodiment, one side surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

[0016] In one embodiment, a gasket is disposed on the upper surface of the first inductor to facilitate connection with the heat sink.

[0017] In one embodiment of the present invention, a stacked electronic structure is provided, which includes: a substrate, wherein a plurality of electronic components are arranged on the substrate, wherein a package body covers the plurality of electronic components; and a magnetic element, located above the package body, the magnetic element includes a magnetic body and a first inductor located in the magnetic body, wherein a portion of the first inductor is not covered by the magnetic body so as to be connected to a heat sink.

[0018] In one embodiment, an upper surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

[0019] In one embodiment, a gasket is disposed on the upper surface of the first inductor to facilitate connection with the heat sink.

[0020] In one embodiment, a first side surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

[0021] In one embodiment, a second side surface of the first inductor is not covered by the magnetic body so as to be connected to another heat sink, wherein the first side surface and the second side surface are two opposite side surfaces of the first inductor.

[0022] In one embodiment, the heat sink is a copper plate.

[0023] In one embodiment of the present invention, a stacked electronic structure is provided, comprising: a substrate, wherein a plurality of electronic components are arranged on the substrate, wherein a package body covers the plurality of electronic components; and a magnetic element, located above the package body, the magnetic element comprising a magnetic body and a first inductor located in the magnetic body, wherein a lower surface of a first electrode of the first inductor and a lower surface of a second electrode of the first inductor are not on the same plane.

[0024] In one embodiment of the present invention, a stacked electronic structure is provided, which includes: a substrate, wherein a first active element and a first conductive column are arranged on the substrate; a package body, covering the first active element and the first conductive column, wherein a first electrode of the first active element is located on an upper surface of the first active element, wherein an upper portion of the first conductive column is not in contact with the package body, and a lower portion of the first conductive column is embedded in the package body; a magnetic element, located above the package body, the magnetic element includes a magnetic body and a first inductor located in the magnetic body, wherein the first electrode of the first inductor is electrically connected to the first electrode of the first active element, and the second electrode of the first inductor is electrically connected to the first conductive column.

[0025] In one embodiment, there is a gap between the first side surface of the first conductive pillar and a first portion of the package body.

[0026] In order to make the above and other features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

[0028] Figure 1A-1E A three-dimensional view showing a stacked electronic structure according to an embodiment of the present invention;

[0029] Figure 2 A three-dimensional view showing a stacked electronic structure according to an embodiment of the present invention;

[0030] Figure 3A three-dimensional view showing a stacked electronic structure according to an embodiment of the present invention;

[0031] Figure 4 A three-dimensional view showing a stacked electronic structure according to an embodiment of the present invention;

[0032] Figure 5 A three-dimensional view showing a stacked electronic structure according to an embodiment of the present invention;

[0033] Figure 6 A cross-sectional view of a stacked electronic structure according to an embodiment of the present invention is shown.

[0034] Explanation of the reference numerals: 101-substrate; 102a, 102b-active components; 102c, 102d-passive components; 103-package; 102aE1, 102aE2-electrodes; 200-magnetic component; 201-magnetic body; 202, 203-inductor; 102bE1, 102bE2-electrodes; 104a-conductive column; 104b-conductive column; 104c-conductive column; 104d-conductive column; 102aE3-ground pad; 102bE3-ground pad; 202E1-electrode; 202E2-electrode; 104aTP-upper part; 104aLP-lower part; GP1-first gap; GP2-second gap; 301a-heat sink; 301b-heat sink; 400-heat sink. DETAILED DESCRIPTION

[0035] Figure 1A A 3D view of a printed circuit board (PCB) and components thereon showing a stacked electronic structure; Figure 1B A 3D view showing the package being added to the PCB to enclose the component; Figure 1C A 3D view showing magnetics added to the package. According to one embodiment of the present invention, a stacked electronic structure includes a substrate 101, wherein a plurality of electronic components 102a, 102b, 102c, and 102d are disposed on the substrate 101, wherein a package 103 covers the plurality of electronic components 102a, 102b, 102c, and 102d, wherein the plurality of electronic components include a first active component 102a, wherein a first electrode 102aE1 of the first active component 102a is located on an upper surface of the first active component 102a, and a second electrode 102aE2 of the first active component 102a is located on a lower surface of the first active component 102a; and a magnetic component 200, located above the package 103, wherein the magnetic component 200 includes a magnetic body 201 and a first inductor 202 located in the magnetic body 201, wherein the second electrode 102aE2 of the first active component 102a is electrically connected to the substrate 101, and the first inductor 202 is electrically connected to the first electrode 102aE1 of the first active component 102a.

[0036] In one embodiment, the first electrode 102aE1 of the first active device 102a is exposed from the package.

[0037] In one embodiment, the first active component is a first field effect transistor (MOSFET). In one embodiment, the plurality of electronic components include passive components 102c and 102d.

[0038] In one embodiment, the first inductor 202 is made of a flat metal wire.

[0039] In one embodiment, a second active component 102b is disposed on the substrate 101, wherein a first electrode 102bE1 of the second active component 102b is located on an upper surface of the second active component 102b, and a second electrode 102bE2 is located on a lower surface of the second active component 102b, wherein a second inductor 203 is located in the magnetic body 201, wherein the second electrode 102bE2 of the second active component 102b is electrically connected to the substrate 101, and the second inductor 203 is electrically connected to the first electrode 102bE1 of the second active component 102b.

[0040] In one embodiment, the first active device 102 a is a first field effect transistor (MOSFET), and the second active device is a second field effect transistor (MOSFET).

[0041] In one embodiment, the second inductor 203 is made of a flat metal wire.

[0042] In one embodiment, the first conductive pillar 104a is disposed on the substrate 101 and electrically connected thereto, wherein the package 103 covers the first active device 102a and the first conductive pillar 104a, wherein the first inductor 202 is electrically connected to the first electrode 102aE1 of the first active device 102a and the first conductive pillar 104a.

[0043] In one embodiment, the first conductive pillar 104a and the second conductive pillar 104b are disposed on the substrate 101 and electrically connected to the substrate 101, wherein the package body 103 covers the first active component 102a, the second active component 102b, the first conductive pillar 104a and the second conductive pillar 104b, wherein the first inductor 202 is electrically connected to the first electrode 102aE1 of the first active component 102a and the first conductive pillar 104a, and the second inductor 203 is electrically connected to the second electrode 102bE2 of the second active component 102b and the second conductive pillar 104b.

[0044] In one embodiment, a portion of the first inductor 202 is not covered by the magnetic body 103 so as to be connected to a heat sink.

[0045] In one embodiment, Figure 1D As shown, the ground pad 102aE3 of the first active component 102a is located on the upper surface of the first active component 102a.

[0046] In one embodiment, Figure 1D As shown, the ground pad 102bE3 of the second active component 102b is located on the upper surface of the second active component 102b.

[0047] In one embodiment, Figure 1E As shown, the first electrode 102aE1 of the first active device 102a is exposed from the upper surface of the package.

[0048] In one embodiment, Figure 1E As shown, the first electrode 102bE1 of the second active device 102b is exposed from the upper surface of the package.

[0049] In one embodiment, Figure 1E As shown, the pad of the conductive pillar 104c is exposed from the upper surface of the package body.

[0050] In one embodiment, Figure 2 As shown, the upper surface 202a of the first inductor 202 is not covered by the magnetic body 103 so as to be connected to a heat sink, which may be Figure 6 The heat sink 400 is shown.

[0051] In one embodiment, Figure 2 As shown, the upper surface 202a of the first inductor 202 is not covered by the magnetic body 103 so as to be connected to a heat sink, which may be Figure 6 The heat sink 400 is shown.

[0052] In one embodiment, Figure 2 As shown, the upper surface 203a of the second inductor 203 is not covered by the magnetic body 103 so as to be connected to a heat sink, which may be Figure 6 The heat sink 400 is shown.

[0053] In one embodiment, Figure 3 As shown, the side surface 202 b of the first inductor 202 is not covered by the magnetic body 103 so as to be connected to the heat sink 301 a .

[0054] In one embodiment, Figure 3 As shown, the side surface 203 b of the second inductor 203 is not covered by the magnetic body 103 so as to be connected to the heat sink 301 b .

[0055] In one embodiment, a pad is disposed on the portion of the first inductor 202 to facilitate connection to a heat sink. In one embodiment, a lower surface of the first electrode of the first inductor is not coplanar with a lower surface of the second electrode of the first inductor.

[0056] In one embodiment, the present invention provides a stacked electronic structure, wherein the stacked electronic structure includes: a substrate 101, on which a plurality of electronic components 102a, 102b are arranged, wherein a package 103 covers the plurality of electronic components 102a, 102b; and a magnetic element 200, including a magnetic body 201 arranged above the package 103 and a first inductor 202 arranged in the magnetic body 201, wherein a portion of the first inductor 202 is not covered by the magnetic body 201 so as to be connected to a heat sink.

[0057] In one embodiment, a pad is disposed on the portion of the first inductor 202 to facilitate connection to a heat sink.

[0058] In one embodiment, the upper surface of the first inductor 202 is not covered by a magnetic body so as to be connected to a heat sink.

[0059] In one embodiment, the first side surface of the first inductor 202 is not covered by a magnetic body so as to be connected to the first heat sink.

[0060] In one embodiment, the second side surface of the first inductor 202 is not covered by the magnetic body so as to be connected to the second heat sink, wherein the first side surface and the second side surface are two opposite side surfaces of the first inductor.

[0061] In one embodiment, the heat sink is a copper plate.

[0062] In one embodiment, if Figure 4 As shown, the present invention provides a stacked electronic structure, wherein the stacked electronic structure includes: a substrate 101, wherein a plurality of electronic components 102a, 102b are disposed on the substrate 101, and a package 103 encapsulates the plurality of electronic components 102a, 102b; and a magnetic device 200, comprising a magnet 201 disposed on the package 103, and a first inductor 202 disposed in the magnet 201, wherein a lower surface of a first electrode 202E1 of the first inductor 202 and a lower surface of a second electrode 202E2 of the first inductor 202 are not on the same plane.

[0063] In one embodiment, if Figure 5 As shown, the lower surface of the first electrode 202E1 of the first inductor 202 is disposed on an electrode on the upper surface of the MOSFET, and the lower surface of the second electrode 202E2 of the first inductor 202 is disposed on a pad on the substrate.

[0064] In one embodiment, if Figure 6 As shown, the present invention provides a stacked electronic structure, wherein the stacked electronic structure includes: a substrate, wherein a first active element and a first conductive column are disposed on the substrate; a package body, encapsulating the first active element and the first conductive column, wherein a first electrode of the first active element is disposed on an upper surface of the first active element, wherein an upper portion 104aTP of the first conductive column 104a is not in contact with the package body 103, and a lower portion 104aLP of the first conductive column 104a is embedded in the package body 103, wherein a first electrode of the first inductor 202 is electrically connected to a first electrode 102aE1 of the first active element 102a, and a second electrode of the first inductor 202 is electrically connected to the first conductive column 104a.

[0065] In one embodiment, if Figure 6 As shown, there is a first gap GP1 between the first side surface of the first conductive pillar 104 a and the first package body 103 .

[0066] In one embodiment, if Figure 6 As shown, there is a second gap GP2 between the second side surface of the first conductive pillar 104 a and the first package body 103 .

[0067] In one embodiment, a heat sink 400 is disposed on the upper surface of the inductor 202 .

[0068] In one embodiment, an insulating layer 500 is disposed between the inductor 202 and the heat sink 400 .

[0069] In one embodiment, if Figure 1D As shown, the upper portion 104aTP of the first conductive pillar 104a does not contact the package body 103, and the lower portion 104aLP of the first conductive pillar 104a is embedded in the package body 103. The upper portion 104bTP of the second conductive pillar 104b does not contact the package body 103, and the lower portion 104aLP of the second conductive pillar 104b is embedded in the package body 103.

[0070] Although the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that modifications may be made to the described embodiments without departing from the spirit of the present invention. Therefore, the scope of the present invention will be limited by the appended claims rather than by the above detailed description.

Claims

1. A stacked electronic structure, characterized in that: include: a substrate, wherein a plurality of electronic components are disposed on the substrate, wherein a package body covers the plurality of electronic components, wherein the plurality of electronic components include a first active component, wherein a first electrode of the first active component is located on an upper surface of the first active component, and a second electrode of the first active component is located on a lower surface of the first active component; and A magnetic element is located above the package body, and includes a magnetic body and a first inductor located in the magnetic body, wherein the second electrode of the first active element is electrically connected to the substrate, and the first inductor is electrically connected to the first electrode of the first active element.

2. The stacked electronic structure according to claim 1, characterized in that: The first active element is a first field effect transistor.

3. The stacked electronic structure according to claim 1, characterized in that: The first inductor is made of a flat metal wire.

4. The stacked electronic structure according to claim 1, characterized in that: A first electrode of a second active element is located on an upper surface of the second active element, a second electrode of the second active element is located on a lower surface of the second active element, wherein a second inductor is located in the magnetic body, wherein the second electrode of the second active element is electrically connected to the substrate, and the second inductor is electrically connected to the first electrode of the second active element.

5. The stacked electronic structure according to claim 4, characterized in that: The first active element is a first field effect transistor, and the second active element is a second field effect transistor.

6. The stacked electronic structure according to claim 5, characterized in that: The second inductor is made of a flat metal wire.

7. The stacked electronic structure according to claim 1, characterized in that: A first conductive column is disposed on the substrate and electrically connected to the substrate, wherein the package body covers the first active element and the first conductive column, wherein the first inductor is electrically connected to the first electrode of the first active element and the first conductive column.

8. The stacked electronic structure according to claim 4, characterized in that: A first conductive column and a second conductive column are disposed on the substrate and electrically connected to the substrate, wherein the package body covers the first active component, the second active component, the first conductive column and the second conductive column, wherein the first inductor is electrically connected to the first electrode of the first active component and the first conductive column, and the second inductor is electrically connected to the second electrode of the second active component and the second conductive column.

9. The stacked electronic structure according to claim 1, characterized in that: A portion of the first inductor is not covered by the magnetic body so as to be connected to a heat sink.

10. The stacked electronic structure according to claim 10, characterized in that: An upper surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

11. The stacked electronic structure according to claim 10, characterized in that: One side surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

12. The stacked electronic structure according to claim 10, characterized in that: A gasket is disposed on the upper surface of the first inductor so as to be connected to the heat sink.

13. A stacked electronic structure, characterized in that: include: a substrate, wherein a plurality of electronic components are disposed on the substrate, wherein a package body encapsulates the plurality of electronic components; and A magnetic element is located above the package body, and includes a magnetic body and a first inductor located in the magnetic body, wherein a portion of the first inductor is not covered by the magnetic body so as to be connected to a heat sink.

14. The stacked electronic structure according to claim 13, characterized in that: An upper surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

15. The stacked electronic structure according to claim 14, characterized in that: A gasket is disposed on the upper surface of the first inductor so as to be connected to the heat sink.

16. The stacked electronic structure according to claim 13, characterized in that: A first side surface of the first inductor is not covered by the magnetic body so as to be connected to the heat sink.

17. The stacked electronic structure according to claim 16, characterized in that: A second side surface of the first inductor is not covered by the magnetic body so as to be connected to another heat sink, wherein the first side surface and the second side surface are two opposite side surfaces of the first inductor.

18. The stacked electronic structure according to claim 13, characterized in that: The heat sink is a copper plate.

19. A stacked electronic structure, characterized in that: include: a substrate, wherein a plurality of electronic components are disposed on the substrate, wherein a package body encapsulates the plurality of electronic components; as well as A magnetic element is located above the package, and includes a magnetic body and a first inductor located in the magnetic body, wherein the lower surface of the first electrode of the first inductor and the lower surface of the second electrode of the first inductor are not on the same plane.

20. A stacked electronic structure, characterized in that: include: a substrate, wherein a first active element and a first conductive column are disposed on the substrate; a package body, covering the first active element and the first conductive column, wherein a first electrode of the first active element is located on an upper surface of the first active element, wherein an upper portion of the first conductive column is not in contact with the package body, and a lower portion of the first conductive column is embedded in the package body; A magnetic element is located above the package body, and the magnetic element includes a magnetic body and a first inductor located in the magnetic body, wherein the first electrode of the first inductor is electrically connected to the first electrode of the first active element, and the second electrode of the first inductor is electrically connected to the first conductive column.

21. The stacked electronic structure according to claim 20, characterized in that: A gap exists between a first side surface of the first conductive pillar and a first portion of the package body.

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