Dual-channel cooling device and cooling method for semiconductor laser

Abstract

The invention discloses a dual-channel cooling device for a semiconductor laser and a cooling method, and belongs to the field of semiconductor laser cooling. The invention relates to a dual-channel cooling device for a semiconductor laser, which comprises a cooling box and radiating fins. The working current of the motor can be adjusted according to the temperature generated when the semiconductor laser works, so that the output power of the motor is adjusted, the speeds of wind blown to the cooling fins by the fan blades are different, the cooling degrees of the cooling fins are different, and the problem that the service life of the motor is shortened when the output power of the motor is rated for a long time is solved. The cooling efficiency of the semiconductor laser is prevented from being reduced due to insufficient output power of the motor, so that good cooling of the semiconductor laser is realized, dual heat dissipation of the heat dissipation fins by using one driving source is realized, dual heat dissipation of water cooling and air cooling of the semiconductor laser is realized, and the service life of the semiconductor laser is prolonged. And the cooling efficiency of the semiconductor laser is improved, so that the service life of the semiconductor laser is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser cooling, and in particular to a dual-channel cooling device and a cooling method for a semiconductor laser. Background Art

[0002] Semiconductor lasers are electronic components that generate a lot of heat when working, so they need to be cooled to maintain their operating temperature. The following are several common methods for cooling semiconductor lasers: Heating sink. A heat sink made of metal or heat-conducting material is used to conduct the heat generated by the laser. This method is economical and simple and is suitable for lasers with lower power. Air cooling. Air cooling is to use a special air-cooled heat sink (also called a cooling fan) to dissipate heat. Water cooling. By passing a cooling medium (usually water) through the heat sink or cooling plate of the laser, the heat is absorbed and taken away. Water cooling can provide a relatively high heat absorption capacity and is suitable for lasers with higher power. Refrigerant cooling. Use a refrigerant (such as refrigerant Freon) to cool the laser and absorb heat through the circulation of the refrigerant. This method is suitable for lasers with higher temperature control requirements.

[0003] At present, when a heating sink is used to cool a semiconductor laser, the cooling efficiency is low, and a large amount of dust will adhere to the outer surface of the heating sink, blocking the heat dissipation efficiency of the heating sink, thereby affecting the cooling efficiency of the semiconductor laser. When air cooling and water cooling are used in combination for cooling, the motor and the water pump need to run at the same time to ensure the cooling efficiency. During cooling, the output power of the motor and the water pump cannot be adjusted according to the heat generated by the semiconductor laser. If full power output is used, the service life of the motor and the water pump will be affected. If low power is used, the semiconductor laser cannot be fully cooled. Based on this, a dual-channel cooling device and a cooling method for a semiconductor laser are proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the output power of the motor and the water pump cannot be adjusted according to the heat generated by the semiconductor laser. If the full power output will affect the service life of the motor and the water pump, if the low power operation, the semiconductor laser cannot be fully cooled. A dual-channel cooling device and cooling method for a semiconductor laser are proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A dual-channel cooling device for a semiconductor laser comprises a cooling box and a semiconductor laser mounted on the top of the cooling box, and further comprises: a heat dissipation fin fixedly connected to the top of the cooling box; a motor fixedly connected to the bottom of the inner wall of the cooling box, the output end of the motor being fixedly connected to a rotating shaft, the outer wall of the rotating shaft being provided with a reciprocating wire, the outer wall of the rotating shaft being fixedly connected to a fan blade, and the top of the rotating shaft being fixedly connected to a main bevel gear; a first channel fixedly connected to both sides of the cooling box, the inner wall of the first channel being fixedly connected to a first filter plate; a second channel fixedly connected to the other two sides of the cooling box, the inner wall of the second channel being fixedly connected to a second filter plate.

[0006] In order to perform water cooling on the heat dissipation fins and improve the cooling quality and efficiency of the semiconductor laser, preferably, it also includes: a water cooling box fixedly connected to the bottom of the inner wall of the cooling box, a water pumping cooling pipe fixedly connected to the water cooling box, an end of the water pumping cooling pipe away from the water cooling box is fixedly connected to a liquid extraction box, the inner wall of the liquid extraction box is rotatably connected to a turntable, the outer wall of the turntable is fixedly connected to a liquid extraction sheet, and the outer wall of the liquid extraction box is fixedly connected to a water discharge cooling pipe.

[0007] In order to enable the cleaning rack to slide along the outer surface of the heat dissipating fins to clean the heat dissipating fins and ensure the heat dissipation efficiency and heat dissipation quality of the heat dissipating fins, preferably, it also includes: a rotating rod rotatably connected to the inner wall of the cooling box, the outer wall of the rotating rod is fixedly connected to a bevel gear, and the outer wall of the rotating rod is connected to the cleaning rack through a thread.

[0008] In order to adjust the current of the motor according to the temperature generated when the semiconductor laser is working, thereby adjusting the output power of the motor, it further includes: a temperature sensing box fixedly connected to the middle position of the heat dissipation fin, the inner wall of the temperature sensing box is slidably connected with a slide plate, the top of the slide plate is fixedly connected with a return spring, the bottom of the slide plate is fixedly connected with an adjustment ring, and the inner wall of the adjustment ring is slidably connected with an electrode column.

[0009] Furthermore, the outer side wall of the reciprocating wire is connected to a reciprocating frame through a thread, and the end of the reciprocating frame is fixedly connected to a cleaning rod.

[0010] Furthermore, the inner wall of the turntable is fixedly connected to the outer wall of the rotating shaft, the end of the drainage cooling pipe away from the liquid extraction box is fixedly connected to the water cooling box, and the rotating shaft passes through the liquid extraction box and is rotatably connected to the liquid extraction box.

[0011] Furthermore, the outer side wall of the slave bevel gear is meshed with the outer side wall of the master bevel gear, and the cleaning frame is in contact with the heat dissipation fins and slides with each other.

[0012] Furthermore, the top of the reset spring is fixedly connected to the top of the inner wall of the temperature sensing box, the bottom of the electrode column is fixedly connected to the bottom of the inner wall of the temperature sensing box, the space in which the reset spring is installed in the temperature sensing box is filled with carbon dioxide gas, and the electrode column and the adjustment ring are electrically connected to the motor.

[0013] Furthermore, the reciprocating frame penetrates the first filter plate and the second filter plate and is slidably connected with the first filter plate and the second filter plate, and the cleaning rod is fitted with the first filter plate and the second filter plate on one side close to the reciprocating frame and slides with each other.

[0014] A dual-channel cooling method for a semiconductor laser comprises the following steps: Step 1: Install the semiconductor laser on the top of the cooling box; Step 2: When the semiconductor laser is working, start the motor to make the refrigerant circulate in the water pumping cooling pipe and the water discharge cooling pipe; Step 3: The outside air is drawn into the cooling box through the fan blades, carrying the heat from the cooling fins.

[0015] Compared with the prior art, the present invention provides a dual-channel cooling device and cooling method for a semiconductor laser, which has the following beneficial effects: 1. The dual-channel cooling device for the semiconductor laser, when the semiconductor laser is working, the heat generated by the semiconductor laser will be conducted to the carbon dioxide filled in the temperature sensing box, so that the carbon dioxide gas expands due to the heat, pushing the slide plate to slide, and making the adjustment ring slide along the outer wall of the electrode column, so as to adjust the working current of the motor according to the temperature generated when the semiconductor laser is working, thereby adjusting the output power of the motor, so that the wind speed of the fan blades blowing to the heat dissipation fins is different, and the degree of cooling of the heat dissipation fins is different, thereby preventing the motor from having a rated output power for a long time, resulting in a decrease in the service life of the motor, and preventing the motor from having insufficient output power, resulting in a decrease in the cooling efficiency of the semiconductor laser, thereby achieving good cooling of the semiconductor laser.

[0016] 2. The dual-channel cooling device for the semiconductor laser, when the motor is working, will cause the rotating shaft to drive the fan blades to work, so that the fan blades draw outside air through the first channel and the second channel to act on the heat dissipation fins, and the rotating shaft will also drive the turntable to rotate, so that the liquid extraction plate rotates, and the extracted refrigerant circulates in the water extraction cooling pipe and the water discharge cooling pipe, realizing the double heat dissipation of the heat dissipation fins by using one driving source, thereby realizing the double heat dissipation of water cooling and air cooling of the semiconductor laser, improving the cooling efficiency of the semiconductor laser, and thus ensuring the service life of the semiconductor laser.

[0017] 3. The dual-channel cooling device for the semiconductor laser will make the cleaning rod slide up and down along the outer surfaces of the first filter plate and the second filter plate when the motor is working, so as to effectively clean the first filter plate and the second filter plate, thereby ensuring the air intake efficiency. At the same time, the motor will also drive the cleaning frame to slide along the outer surface of the heat sink fins in a circular manner to clean the heat sink fins, thereby preventing dust from adhering to the heat sink fins and affecting the heat conduction rate of the heat sink fins, thereby further improving the cooling efficiency of the semiconductor laser.

[0018] The parts not involved in the device are the same as the prior art or can be implemented by the prior art. The present invention can adjust the working current of the motor according to the temperature generated when the semiconductor laser is working, thereby adjusting the output power of the motor, so that the wind speed of the fan blades blowing to the heat dissipation fins is different, and the degree of cooling of the heat dissipation fins is different, thereby preventing the motor from having a rated output power for a long time, resulting in a decrease in the service life of the motor, and preventing the motor from having insufficient output power, resulting in a decrease in the cooling efficiency of the semiconductor laser, thereby achieving good cooling of the semiconductor laser, and achieving dual heat dissipation of the heat dissipation fins using one driving source, thereby achieving dual heat dissipation of the semiconductor laser by water cooling and air cooling, improving the cooling efficiency of the semiconductor laser, and ensuring the service life of the semiconductor laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 2 A three-dimensional partially cutaway structural schematic diagram of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 3 A schematic diagram of the front middle section structure of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 4 A schematic diagram of a cross-section of the middle side structure of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 5 A dual-channel cooling device for a semiconductor laser proposed by the present invention Figure 4 The enlarged structural diagram at A in the middle; Figure 6 A schematic diagram of the three-dimensional structure of a cooling box of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 7 A schematic diagram of the three-dimensional structure of a cleaning frame of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Figure 8 A schematic diagram of the three-dimensional structure of a liquid extraction plate of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig. 9 A schematic diagram of a three-dimensional partially cutaway structure of a temperature sensing box of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.10 A schematic diagram of the cross-section structure of the middle part of a cleaning frame of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.11 A dual-channel cooling device for a semiconductor laser proposed by the present invention Fig.10 The enlarged structural diagram at B in the middle; Fig.12 A schematic diagram of the cross-section structure of the middle portion of a cleaning rod of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.13 A schematic diagram of a partially cutaway structure of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.14 A dual-channel cooling device for a semiconductor laser proposed by the present invention Fig.13 The enlarged structural diagram at C in the middle; Fig.15 A dual-channel cooling device for a semiconductor laser proposed by the present invention Fig.13 The enlarged structural diagram at D in the middle; Fig.16 A schematic diagram of the structure of a negative pressure port of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.17 A schematic diagram of the processing chamber structure of a dual-channel cooling device for a semiconductor laser proposed by the present invention; Fig.18 A dual-channel cooling device for a semiconductor laser proposed by the present invention Fig.17 Schematic diagram of the local structure.

[0020] In the figure: 1, cooling box; 2, semiconductor laser; 3, heat dissipation fin; 4, water cooling box; 5, first channel; 6, first filter plate; 7, second channel; 8, second filter plate; 9, motor; 10, rotating shaft; 11, reciprocating wire; 12, reciprocating frame; 13, cleaning rod; 14, fan blade; 15, turntable; 16, liquid extraction sheet; 17, liquid extraction box; 18, water extraction cooling pipe; 19, water drainage cooling pipe; 20, main bevel gear; 21, slave bevel gear; 22, rotating rod; 23, cleaning frame; 24, temperature sensing box; 25, slide plate; 26, reset spring; 27, adjustment ring; 28. Electrode column; 29. ​​Piston plate; 30. Air inlet; 31. Connecting groove; 32. Air blowing plate; 33. Air blowing hole; 34. Connecting pipe; 35. Air jet hole; 36. Magnetic plate; 37. First spring; 38. Connecting rope; 39. Second spring; 40. Knocking block; 41. Piston cylinder; 42. Negative pressure port; 43. First negative pressure pipe; 44. Processing chamber; 45. Dust shield; 46. Air inlet; 47. Dust collecting hood; 48. Funnel cover; 49. First external interface; 50. Second external interface; 51. Second negative pressure pipe; 52. Adjusting pipe; 53. Dust shield. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Example

[0023] Reference Figure 1-Figure 4 , Figure 6-Figure 8 A dual-channel cooling device for a semiconductor laser comprises a cooling box 1 and a semiconductor laser 2 mounted on the top of the cooling box 1, and further comprises: a heat dissipation fin 3 fixedly connected to the top of the cooling box 1; a motor 9 fixedly connected to the bottom of the inner wall of the cooling box 1, a rotating shaft 10 fixedly connected to the output end of the motor 9, a reciprocating wire 11 is arranged on the outer wall of the rotating shaft 10, a reciprocating frame 12 is connected to the outer wall of the reciprocating wire 11 by a thread, a cleaning rod 13 is fixedly connected to the end of the reciprocating frame 12, a fan blade 14 is fixedly connected to the outer wall of the rotating shaft 10, and a main bevel gear 20 is fixedly connected to the top of the rotating shaft 10; a first channel 5 fixedly connected to both sides of the cooling box 1, and a first filter plate 6 is fixedly connected to the inner wall of the first channel 5; A second channel 7 is fixedly connected to the other two sides of the cooling box 1, and a second filter plate 8 is fixedly connected to the inner side wall of the second channel 7. A reciprocating frame 12 penetrates the first filter plate 6 and the second filter plate 8 and is slidably connected to the first filter plate 6 and the second filter plate 8. A cleaning rod 13 is attached to the first filter plate 6 and the second filter plate 8 on one side close to the reciprocating frame 12 and slides with each other. When in use, the semiconductor laser 2 is installed on the top of the cooling box 1. When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the heat dissipation fins 3, and when the semiconductor laser 2 is working, the motor 9 is started so that the motor 9 works at the minimum power. The operation of the motor 9 will drive the rotating shaft 10 to rotate, and then drive the fan blades 14 and the reciprocating wires 11 to rotate. The fan blades 14 will extract the outside air through the first channel 5 and the second channel 7. The outside air entering the first channel 5 and the second channel 7 will be filtered by the first filter plate 6 and the second filter plate 8. The air entering the cooling box 1 will be discharged to the outside after passing through the heat dissipation fins 3, and the heat dissipation fins 3 will be cooled. In addition, the rotation of the reciprocating wires 11 will drive the cleaning rod 13 to slide up and down along the outer surfaces of the first filter plate 6 and the second filter plate 8 through the reciprocating frame 12 to clean the filter plates. The semiconductor laser 2 is cooled by air, and dust is prevented from clogging the first filter plate 6 and the second filter plate 8 to affect the air intake efficiency, thereby ensuring the cooling efficiency of the semiconductor laser 2.

[0024] Reference Figure 2 , Figure 3 , Figure 5 , Figure 7 , Figure 8 , further comprising: a water cooling box 4 fixedly connected to the bottom of the inner side wall of the cooling box 1, a water pumping cooling pipe 18 fixedly connected to the water cooling box 4, an end of the water pumping cooling pipe 18 away from the water cooling box 4 is fixedly connected to a liquid pumping box 17, the liquid pumping box 17 is cylindrical, and the liquid pumping box 17 is composed of a quarter arc and a three-quarter arc, and the radius of the quarter arc is greater than the radius of the three-quarter arc, the inner side wall of the liquid pumping box 17 is rotatably connected to a turntable 15, the inner side wall of the turntable 15 is fixedly connected to the outer side wall of the rotating shaft 10, and the turntable 15 The outer wall is fixedly connected with a liquid extraction sheet 16, which is made of rubber material. When the liquid extraction sheet 16 passes through a circular arc with a larger quarter radius, it will be squeezed by the liquid extraction box 17, squeezing the refrigerant in the liquid extraction box 17 into the drainage cooling pipe 19. The outer wall of the liquid extraction box 17 is fixedly connected with the drainage cooling pipe 19. The end of the drainage cooling pipe 19 away from the liquid extraction box 17 is fixedly connected to the water cooling box 4. The rotating shaft 10 passes through the liquid extraction box 17 and is rotatably connected to the liquid extraction box 17. The liquid extraction box 17 is fixedly connected to the inner wall of the cooling box 1; When the rotating shaft 10 rotates, it will drive the rotating disk 15 to rotate, and the rotating disk 15 will drive the liquid extraction plate 16 to rotate. When the liquid extraction plate 16 passes through a circular arc with a larger quarter radius, it will be squeezed by the liquid extraction box 17, and the refrigerant in the liquid extraction box 17 will be squeezed into the drainage cooling pipe 19. When the liquid extraction plate 16 passes through the water extraction cooling pipe 18, the refrigerant in the water cooling box 4 will be extracted into the liquid extraction box 17, and the refrigerant in the drainage cooling pipe 19 will be discharged into the water cooling box 4, so that the refrigerant circulates and further cools the air entering the cooling box 1. Double heat dissipation of the heat sink 3 by one driving source is achieved, thereby achieving double heat dissipation of the semiconductor laser 2 by water cooling and air cooling, improving the cooling efficiency of the semiconductor laser 2, and thus ensuring the service life of the semiconductor laser 2.

[0025] Reference Figure 2 , Figure 5 , Figure 7 , Figure 8 , further comprising: a rotating rod 22 rotatably connected to the inner wall of the cooling box 1, the outer wall of the rotating rod 22 is provided with a reciprocating wire 11, the outer wall of the rotating rod 22 is fixedly connected with a slave bevel gear 21, the outer wall of the slave bevel gear 21 is meshed with the outer wall of the main bevel gear 20, the outer wall of the rotating rod 22 is connected with a cleaning rack 23 through a thread, and the cleaning rack 23 is in contact with the heat dissipation fins 3 and slides with each other; When the rotating shaft 10 rotates, it will drive the main bevel gear 20 to rotate, and then drive the slave bevel gear 21 to rotate, so that the rotating rod 22 rotates, and the rotating rod 22 will drive the cleaning frame 23 to slide along the outer surface of the heat dissipation fin 3 to clean the heat dissipation fin 3; This prevents dust from adhering to the heat dissipation fins 3 to affect the heat conduction rate of the heat dissipation fins 3 , thereby further improving the cooling efficiency of the semiconductor laser 2 .

[0026] Reference Figure 2 , Figure 5 , Figure 7-Figure 9 , further comprising: a temperature sensing box 24 fixedly connected to the middle position of the heat dissipation fin 3, a slide plate 25 slidably connected to the inner wall of the temperature sensing box 24, a return spring 26 fixedly connected to the top of the slide plate 25, a space in which the return spring 26 is installed in the temperature sensing box 24 is filled with carbon dioxide gas, the top of the return spring 26 is fixedly connected to the top of the inner wall of the temperature sensing box 24, an adjusting ring 27 is fixedly connected to the bottom of the slide plate 25, an electrode column 28 is slidably connected to the inner wall of the adjusting ring 27, the bottom of the electrode column 28 is fixedly connected to the bottom of the inner wall of the temperature sensing box 24, and the electrode column 28 and the adjusting ring 27 are electrically connected to the motor 9; When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the carbon dioxide gas in the temperature sensing box 24. When the heat generated by the semiconductor laser 2 increases, the carbon dioxide gas expands due to the heat, pushing the slide plate 25 to slide downward, and then the adjustment ring 27 slides downward along the outer surface of the electrode column 28, thereby increasing the working current of the motor 9, increasing the rotation speed of the fan blade 14 and the flow rate of the refrigerant. When the heat generated by the semiconductor laser 2 decreases, the slide plate 25 will drive the adjustment ring 27 to slide upward along the outer surface of the electrode column 28 under the action of the return spring 26, thereby reducing the working current of the motor 9, reducing the rotation speed of the fan blade 14 and the flow rate of the refrigerant. It is achieved that the working current of the motor 9 is adjusted according to the temperature generated when the semiconductor laser 2 is working, thereby adjusting the output power of the motor 9, so that the wind speed of the fan blade 14 blowing to the heat dissipation fin 3 is different, and the degree of cooling of the heat dissipation fin 3 is different, thereby preventing the motor 9 from having a rated output power for a long time, resulting in a decrease in the service life of the motor 9, and preventing the output power of the motor 9 from being insufficient, resulting in a decrease in the cooling efficiency of the semiconductor laser 2, thereby achieving good cooling of the semiconductor laser 2.

[0027] Reference Figure 1-Figure 9 , a dual-channel cooling method for a semiconductor laser, comprising the following steps: Step 1: Install the semiconductor laser 2 on the top of the cooling box 1; Step 2: When the semiconductor laser 2 is working, the motor 9 is started to make the refrigerant circulate in the water pumping cooling pipe 18 and the water discharge cooling pipe 19; When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the carbon dioxide gas in the temperature sensing box 24. When the heat generated by the semiconductor laser 2 increases, the carbon dioxide gas expands due to the heat, pushing the slide plate 25 to slide downward, and then the adjustment ring 27 slides downward along the outer surface of the electrode column 28, thereby increasing the working current of the motor 9, increasing the rotation speed of the fan blade 14 and the flow rate of the refrigerant. When the heat generated by the semiconductor laser 2 decreases, the slide plate 25 will drive the adjustment ring 27 to slide upward along the outer surface of the electrode column 28 under the action of the return spring 26, thereby reducing the working current of the motor 9, reducing the rotation speed of the fan blade 14 and the flow rate of the refrigerant. The working current of the motor 9 is adjusted according to the temperature generated when the semiconductor laser 2 is working, thereby adjusting the output power of the motor 9, so that the wind speed of the fan blade 14 blowing to the heat dissipation fin 3 is different, and the degree of cooling of the heat dissipation fin 3 is different, thereby preventing the motor 9 from having a rated output power for a long time, resulting in a reduction in the service life of the motor 9, and preventing the motor 9 from having insufficient output power, resulting in a reduction in the cooling efficiency of the semiconductor laser 2, thereby achieving good cooling of the semiconductor laser 2; When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the heat dissipation fins 3, and when the semiconductor laser 2 is working, the motor 9 is started so that the motor 9 works at the minimum power, and the work of the motor 9 will drive the rotating shaft 10 to rotate, thereby driving the fan blades 14 and the reciprocating wire 11 to rotate; When the rotating shaft 10 rotates, it will drive the rotating disk 15 to rotate, and the rotating disk 15 will drive the liquid extraction plate 16 to rotate. When the liquid extraction plate 16 passes through a circular arc with a larger quarter radius, it will be squeezed by the liquid extraction box 17, and the refrigerant in the liquid extraction box 17 will be squeezed into the drainage cooling pipe 19. When the liquid extraction plate 16 passes through the water extraction cooling pipe 18, the refrigerant in the water cooling box 4 will be extracted into the liquid extraction box 17, and the refrigerant in the drainage cooling pipe 19 will be discharged into the water cooling box 4, so that the refrigerant circulates and further cools the air entering the cooling box 1. When the rotating shaft 10 rotates, it will drive the main bevel gear 20 to rotate, and then drive the slave bevel gear 21 to rotate, so that the rotating rod 22 rotates, and the rotating rod 22 will drive the cleaning frame 23 to slide along the outer surface of the heat dissipation fin 3 to clean the heat dissipation fin 3; Step 3: The fan blades 14 draw outside air into the cooling box 1, carrying the heat of the heat dissipation fins 3; The fan blades 14 will draw in external air through the first channel 5 and the second channel 7. The external air entering the first channel 5 and the second channel 7 will be filtered by the first filter plate 6 and the second filter plate 8. The air entering the cooling box 1 will be discharged to the outside after passing through the heat dissipation fins 3 to cool the heat dissipation fins 3. The rotation of the reciprocating wire 11 will drive the cleaning rod 13 to slide up and down along the outer surfaces of the first filter plate 6 and the second filter plate 8 through the reciprocating frame 12 to clean the filter plates. Example

[0028] Reference Figure 3 , Figure 4 , Figure 10-15, a dual-channel cooling device for a semiconductor laser, further comprising: a piston cylinder 41 fixedly connected to the bottom of the inner side wall of a cooling box 1, a piston plate 29 slidably connected to the inner side wall of the piston cylinder 41, the piston plate 29 fixedly connected to the bottom of a reciprocating frame 12, an air inlet hole 30 is provided on the outer side wall of the piston cylinder 41, a one-way valve is provided in the air inlet hole 30, so that outside air can only enter the piston cylinder 41 through the air inlet hole 30, a connecting groove 31 is provided in the middle of the piston plate 29, a one-way valve is provided in the connecting groove 31, so that the air in the piston cylinder 41 can only be discharged through the connecting groove 31, the connecting groove 31 is provided inside the reciprocating frame 12 and is connected to the blowing plate 32, the outer side wall of the reciprocating frame 12 is fixedly connected to the blowing plate 32, and a blowing plate 32 is provided on the side of the blowing plate 32 close to the first filter plate 6 The air hole 33, the top of the reciprocating frame 12 is fixedly connected with a connecting pipe 34, the connecting pipe 34 is connected with the connecting groove 31, the end of the connecting pipe 34 away from the reciprocating frame 12 is fixedly connected with the outer wall of the cleaning frame 23, and the connecting pipe 34 is set in the form of a hose, the cleaning frame 23 and the heat dissipation fin 3 are fitted with an air jet hole 35, the air jet hole 35 is connected with the connecting pipe 34, the side wall of the cooling box 1 is slidably connected with a magnetic plate 36, the magnetic plate 36 is attracted to the side wall of the cleaning frame 23, the side of the magnetic plate 36 away from the cleaning frame 23 is fixedly connected with a first spring 37 and a connecting rope 38, the end of the connecting rope 38 away from the magnetic plate 36 is fixedly connected with a knocking block 40, the top of the knocking block 40 is fixedly connected with a second spring 39, and the outer wall of the knocking block 40 is slidably connected with the inside of the side wall of the cooling box 1; The up and down movement of the reciprocating frame 12 will cause the piston plate 29 to slide up and down along the inner wall of the piston cylinder 41. When the piston plate 29 slides upward along the inner wall of the piston cylinder 41, it will draw outside air into the piston cylinder 41 through the air inlet hole 30, and when the piston plate 29 slides downward, the air in the piston cylinder 41 will enter the connecting groove 31, and part of the air will enter the blowing plate 32, and blow to the first filter plate 6 and the second filter plate 8 through the blowing hole 33 to dredge the filter holes of the first filter plate 6 and the second filter plate 8, and clean the cleaning rod 13, while another part of the air will enter the cleaning frame 23 through the connecting pipe 34, and then be sprayed to the heat sink 3 through the air jet hole 35, so as to improve the cleaning efficiency of the heat sink 3, prevent dust from adhering to the cleaning frame 23 and the heat sink 3, resulting in a decrease in the heat dissipation efficiency of the heat sink 3, and improve the heat dissipation efficiency of the heat sink 3, thereby improving the cooling quality and cooling efficiency of the semiconductor laser 2; When the cleaning frame 23 slides outward, it will attract the magnetic plate 36 to slide toward one side of the cleaning frame 23, and then pull the knocking block 40 to slide upward through the connecting rope 38. When the cleaning frame 23 slides inward, it will drive the magnetic plate 36 to move with the movement of the cleaning frame 23. When the elastic force of the first spring 37 is greater than the magnetic attraction between the magnetic plate 36 and the cleaning frame 23, the magnetic plate 36 will slide inward under the action of the first spring 37, so that the connecting rope 38 is loose. At this time, the knocking block 40 will suddenly move downward under the action of the second spring 39, knocking the reciprocating frame 12, causing the reciprocating frame 12 to vibrate, thereby driving the cleaning rod 13, the first filter plate 6 and the second filter plate 8 to shake, and further shaking off the dust on the cleaning rod 13, the first filter plate 6 and the second filter plate 8, ensuring the air intake efficiency and the cleanliness of the air, thereby improving the cooling efficiency of the semiconductor laser 2.

[0029] like Figure 16-18 The inner wall of the cooling box 1 is fixedly connected with a processing chamber 44 and a dust collecting hood 47. 4-8 dust covers 45 are arranged inside the processing chamber 44. The dust cover 45 is funnel-shaped. An air inlet 46 is arranged at the small end of the dust cover 45. The dust collecting hood 47 is located at the bottom of the processing chamber 44. The bottom between every two dust covers 45 and the bottom between the dust cover 45 and the inner wall of the processing chamber 44 are connected with the top of the dust collecting hood 47 through the funnel cover 48.

[0030] A negative pressure port 42 is provided on one side of the cleaning rod 13 close to the side wall of the cooling box 1 , a first negative pressure pipe 43 is provided between the negative pressure port 42 and one end of the processing chamber 44 , and one end of the processing chamber 44 away from the first negative pressure pipe 43 is connected to the air inlet 30 through a second negative pressure pipe 51 .

[0031] The small end of the dust shield 45 faces the first negative pressure pipe 43 .

[0032] When air is taken in, the air inlet 30 generates negative pressure at the negative pressure port 42 through the second negative pressure pipe 51 and the first negative pressure pipe 43, absorbs dust from the first filter plate 6 and the second filter plate 8, and cooperates with the cleaning rod 13 to improve the dust removal efficiency.

[0033] Dust enters the processing chamber 44 through the first negative pressure pipe 43, and after being filtered layer by layer through the dust cover 45, part of the dust is adsorbed on the side wall of the dust cover 45, and part of the dust enters the dust collecting cover 47 through the funnel cover 48, ensuring that the appearance of dust in the piston cylinder 41 is reduced as much as possible.

[0034] An adjusting pipe 52 is connected between the second negative pressure pipe 51 and the top of the dust collecting hood 47 . A dust shield plate 53 is provided at the connection between the adjusting pipe 52 and the dust collecting hood 47 . The dust shield plate 53 is located inside the dust collecting hood 47 .

[0035] Through the design of the adjusting tube 52, the adjusting tube 52 and the processing chamber 44 are connected in parallel, which effectively avoids the dust cover 45 from being blocked and unable to work. Through the design of the adjusting tube 52, even if several blockages appear in the adjusting tube 52, it is also ensured that emergency work is done first and then the workers immediately repair it; and, during the operation of the piston cylinder 41, the dust cover 47 also generates negative pressure through the adjusting tube 52, so that dust is accelerated to enter the dust cover 47. At the same time, the dust shield plate 53 effectively avoids dust from entering the adjusting tube 52.

[0036] A first external interface 49 is provided at the top between every two dust shields 45 and at the top between the dust shield 45 and the inner wall of the processing chamber 44. A second external interface 50 is provided at the bottom of the dust collecting cover 47. Valves are provided on the first external interface 49 and the second external interface 50.

[0037] After working for a long time, when a large amount of dust accumulates on the inner wall of the dust cover 45 and the dust collecting cover 47, the second external interface 50 is connected to an external suction pump, and the first external interfaces 49 are opened in turn, one or two at a time, and the air is sucked away by the suction of the external suction pump connected to the second external interface 50 to achieve the purpose of cleaning.

[0038] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A dual-channel cooling device for a semiconductor laser, comprising a cooling box (1) and a semiconductor laser (2) mounted on top of the cooling box (1), characterized in that: Also includes: A heat dissipation fin (3) fixedly connected to the top of the cooling box (1); A motor (9) is fixedly connected to the bottom of the inner wall of the cooling box (1), the output end of the motor (9) is fixedly connected to a rotating shaft (10), the outer wall of the rotating shaft (10) is provided with a reciprocating wire (11), the outer wall of the rotating shaft (10) is fixedly connected to a fan blade (14), and the top of the rotating shaft (10) is fixedly connected to a main bevel gear (20); A first channel (5) fixedly connected to both sides of the cooling box (1), wherein the inner side wall of the first channel (5) is fixedly connected to a first filter plate (6); A second channel (7) is fixedly connected to the other two sides of the cooling box (1), and a second filter plate (8) is fixedly connected to the inner side wall of the second channel (7).

2. A dual-channel cooling device for a semiconductor laser according to claim 1, characterized in that: Also includes: A water cooling box (4) is fixedly connected to the bottom of the inner wall of the cooling box (1), a water extraction cooling pipe (18) is fixedly connected to the water cooling box (4), one end of the water extraction cooling pipe (18) away from the water cooling box (4) is fixedly connected to a liquid extraction box (17), the inner wall of the liquid extraction box (17) is rotatably connected to a turntable (15), the outer wall of the turntable (15) is fixedly connected to a liquid extraction plate (16), and the outer wall of the liquid extraction box (17) is fixedly connected to a water discharge cooling pipe (19).

3. A dual-channel cooling device for a semiconductor laser according to claim 1, characterized in that: Also includes: A rotating rod (22) is rotatably connected to the inner wall of the cooling box (1), the outer wall of the rotating rod (22) is fixedly connected to a slave bevel gear (21), and the outer wall of the rotating rod (22) is connected to a cleaning frame (23) via a thread.

4. A dual-channel cooling device for a semiconductor laser according to claim 1, characterized in that: Also includes: A temperature sensing box (24) is fixedly connected to the middle position of the heat dissipation fin (3), the inner side wall of the temperature sensing box (24) is slidably connected to a slide plate (25), the top of the slide plate (25) is fixedly connected to a return spring (26), the bottom of the slide plate (25) is fixedly connected to an adjustment ring (27), and the inner side wall of the adjustment ring (27) is slidably connected to an electrode column (28).

5. A dual-channel cooling device for a semiconductor laser according to claim 1, characterized in that: The outer side wall of the reciprocating wire (11) is connected to a reciprocating frame (12) via a thread, and the end of the reciprocating frame (12) is fixedly connected to a cleaning rod (13).

6. A dual-channel cooling device for a semiconductor laser according to claim 2, characterized in that: The inner wall of the rotating disk (15) is fixedly connected to the outer wall of the rotating shaft (10); one end of the drainage cooling pipe (19) away from the liquid extraction box (17) is fixedly connected to the water cooling box (4); and the rotating shaft (10) passes through the liquid extraction box (17) and is rotatably connected to the liquid extraction box (17).

7. A dual-channel cooling device for a semiconductor laser according to claim 3, characterized in that: The outer wall of the slave bevel gear (21) meshes with the outer wall of the master bevel gear (20), and the cleaning frame (23) fits with the heat dissipation fins (3) and slides with each other.

8. A dual-channel cooling device for a semiconductor laser according to claim 4, characterized in that: The top of the return spring (26) is fixedly connected to the top of the inner wall of the temperature sensing box (24), and the bottom of the electrode column (28) is fixedly connected to the bottom of the inner wall of the temperature sensing box (24). The space in the temperature sensing box (24) where the return spring (26) is installed is filled with carbon dioxide gas, and the electrode column (28) and the adjustment ring (27) are electrically connected to the motor (9).

9. A dual-channel cooling device for a semiconductor laser according to claim 5, characterized in that: The reciprocating frame (12) penetrates the first filter plate (6) and the second filter plate (8) and is slidably connected to the first filter plate (6) and the second filter plate (8); the cleaning rod (13) is in contact with the first filter plate (6) and the second filter plate (8) on one side close to the reciprocating frame (12) and slides relative to each other.

10. A dual-channel cooling method for a semiconductor laser, using a dual-channel cooling device for a semiconductor laser according to any one of claims 1 to 5, characterized in that: The steps include: Step 1: Install the semiconductor laser (2) on the top of the cooling box (1); Step 2: When the semiconductor laser (2) is working, the motor (9) is started to allow the refrigerant to circulate in the water pumping cooling pipe (18) and the water discharge cooling pipe (19); Step 3: The outside air is drawn into the cooling box (1) through the fan blades (14), carrying the heat of the heat dissipation fins (3).

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