Passive balancing method for degraded connector in high-speed interconnection system

Abstract

The invention discloses a passive equalization method for a degraded connector in a high-speed interconnection system. The method comprises the following steps: firstly, carrying out degradation treatment on a part of connector samples and measuring channel parameters; obtaining film layer resistance and film layer capacitance of a degradation interface according to the measured sample channel parameters, and establishing an equivalent circuit model of the connector before and after degradation; passive equalizers in connectors with different degradation degrees are designed according to the film layer resistors and the film layer capacitors, and finally, the feasibility of the passive equalizers is proved through contrastive analysis of output eye diagrams before and after equalization. The method is characterized in that film layer resistance and film layer capacitance of a connector after degradation are considered, a corresponding passive equalizer is designed according to the film layer resistance and the film layer capacitance, and the advantages of the method are displayed according to comparison of eye diagrams before and after equalization. Through the method, the passive equalizer in the high-speed interconnection channel can be effectively designed, and the method has reference value for engineering design of a high-speed interconnection system which needs to consider an equalization technology in a severe environment.

Description

Technical Field

[0001] The invention relates to the fields of communication circuits and electromagnetic fields and microwave technologies, and in particular to a passive equalization method for a post-degenerate connector in a high-speed interconnection system. Background Art

[0002] With the rapid development of integrated circuits and the fifth generation of mobile communication technology, various high-speed interconnection systems have been widely used. Human society's demand for high-speed data transmission is becoming increasingly broad and demanding. It is not only reflected in faster data transmission rates, higher application frequencies, and high-density, miniaturized circuits, chip structure sizes, etc., but also requires higher reliability to ensure the integrity of transmission signals between devices.

[0003] As an important component for high-frequency and high-speed signal transmission, RF connectors are widely used in communications, aerospace, automotive electronics, and national defense. Their performance directly affects the stability and reliability of the system. However, RF connectors are often faced with harsh environments during use, such as high temperature, high humidity, vibration, salt spray, and chemical corrosion. These factors may cause degradation of the connector contact interface, metal oxidation or wear, and even aging of the insulating material, which will significantly increase the contact resistance and reduce the efficiency and stability of signal transmission. Especially in scenarios that require high reliability, such as satellite communications and military equipment, the degradation of connector performance may cause signal loss or system failure, resulting in serious consequences. Therefore, in-depth research on the degradation mechanism of RF connectors in harsh environments and improving their environmental adaptability have become an important research direction to ensure the reliability of high-frequency and high-speed communication systems.

[0004] The research on high-speed equalization technology is of great significance in today's high-data-rate communication systems. With the continuous increase in transmission rates, high-frequency signals are easily interfered by loss, reflection, crosstalk and noise during transmission, resulting in a significant increase in signal distortion and bit error rate. These problems are particularly prominent in long-distance, high-density high-speed transmission links, directly affecting the stability and performance of the system. High-speed equalization technology can significantly improve signal integrity and ensure data accuracy under high-speed transmission conditions by real-time compensation for loss and distortion in the signal path.

[0005] At the same time, high-speed equalization technology also plays an important role in optimizing system design and reducing hardware complexity and cost. By implementing equalization technology at the receiving or transmitting end, the stringent requirements for physical channel quality can be reduced, thereby simplifying the design and reducing dependence on materials and processes. In addition, as high-speed transmission systems gradually develop towards high frequency and multi-channel, equalization technology also provides support for system compatibility and scalability. Overall, high-speed equalization technology is not only a key means to solve the transmission bottleneck of high-speed communication systems, but also an important technical foundation for promoting the next generation of communication systems to achieve high performance and high reliability.

[0006] However, most current equalizers focus on the equalization optimization of transmission lines and receiving ends, while ignoring the key impact of connectors on overall link performance. Few researchers consider the impact of connector damage in harsh environments on system performance. In response to the above problems existing in the current design of high-speed data transmission systems, the present invention proposes a passive equalization method for degraded connectors in high-speed interconnection systems, which can effectively compensate for the impact of channel degradation on high-speed interconnection systems. Summary of the invention

[0007] In view of the deficiencies in the above-mentioned prior art, the present invention provides a passive equalization method for a degraded connector in a high-speed interconnection system. The method effectively compensates for the influence of channel degradation on the interconnection system through circuit simulation analysis combined with experimental testing. The technical solution adopted by the present invention is as follows:

[0008] Original and degraded samples of connectors transmitting high-speed signals were prepared, and the S parameters of each sample were tested using a vector network tester.

[0009] An equivalent circuit model of the original connector sample is established and compared with the experimental measurement results to optimize and improve the model.

[0010] Based on the experimental data, the equivalent circuit model of connector samples with different degradation degrees was established. According to the measured S parameters of the samples, the film resistance and film capacitance of the corrosion film on the connector pin after degradation were obtained using circuit analysis software in the circuit simulation model.

[0011] Based on the film resistance and film capacitance of the connector pin after degradation, in order to make the channel frequency response flat, the parameters of each component in the passive equalizer are designed according to the transfer function of the passive component. According to mathematical derivation, in the equalizer, the resistance value should be The capacitance value should be Among them, R f is the film resistance, C f is the film capacitance, and Z0 is the characteristic impedance.

[0012] Since the present invention is mainly aimed at the passive equalization method of the post-degeneration connector in the high-speed interconnection system, the reliability and advantages of the passive equalization method are finally verified by comparing the eye diagram data of the channel receiving end before and after equalization.

[0013] The passive equalization method for the post-degenerate connector in the high-speed interconnection system proposed by the present invention effectively analyzes and compensates the performance of the interconnection system through a complete circuit model theoretical analysis combined with experimental testing.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] (1) The present invention comprehensively considers connectors with different degrees of degradation under certain conditions, and establishes a relatively complete equivalent circuit structure model to analyze the performance of each connector.

[0016] (2) The present invention considers the film resistance and capacitance of the connector pin after degradation according to the principle of electrical contact, and designs a passive equalizer suitable for different degrees of degradation based on this. The passive equalizer can reduce the loss generated in signal transmission, does not require additional power consumption, has the advantages of strong stability and high reliability, and is suitable for high-speed communication systems.

[0017] (3) The method of the present invention can effectively compensate for the signal transmission quality impact caused by environmental degradation of the connector. After adding the passive equalizer, the eye diagram of the receiving end is almost completely opened, improving the transmission effect of high-speed signals. This method combines simulation analysis design with experimental testing methods to provide a reference for the engineering design of high-speed interconnection systems in different environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0019] Figure 1 It is a specific flow chart of an embodiment of the present invention.

[0020] Figure 2 It is a principle block diagram of the high-speed signal transmission interconnection system of the present invention.

[0021] Figure 3 It is a principle block diagram of the passive equalizer designed by the present invention. DETAILED DESCRIPTION

[0022] The present invention is described in detail below through the accompanying drawings and embodiments.

[0023] Figure 1 This is a specific process of an embodiment of the present invention, which mainly includes the following steps.

[0024] Step 101: Perform degradation treatments of different degrees on multiple samples of the target connector, and use a vector network analyzer to test the S parameters of each sample before and after the degradation.

[0025] Step 102: Figure 2 Based on the principle block diagram shown in the figure, an equivalent circuit model of the interconnection system for transmitting high-speed signals is established, as shown in Figure 3 .

[0026] Step 103: For the connector that has undergone accelerated degradation, the electrical contact principle is used to analyze the film resistance and film capacitance at the contact degradation point based on the channel parameters obtained in step 101 through circuit simulation software, and the simulation model is optimized and improved to improve the accuracy of the channel model.

[0027] Step 104: designing passive device parameters of a passive equalizer for connectors with different degradation degrees according to the film resistance and the film capacitance obtained in step 103.

[0028] Step 105: A complete high-speed signal interconnection circuit system model is established, and the eye diagram results of the simulation before and after the equalization technology is used are compared and analyzed. It can be clearly seen that the signal quality is significantly improved and the signal integrity is effectively restored, which proves the effectiveness and reliability of the passive equalization method of the present invention in improving the quality of high-speed signal transmission.

[0029] It should be pointed out that the above is only an embodiment of the present invention and is not intended to limit the present invention. Without departing from the concept of the present invention, any modification, equivalent substitution, improvement, etc. made by any person within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A passive equalization method for a degraded rear connector in a high-speed interconnect system, characterized in that: Using accelerated degradation tests, multiple channel samples were subjected to different degrees of degradation; The corresponding film resistance and film capacitance are obtained through the experimental test data of the channel parameters of each degraded connector sample; The equivalent circuit model of the connector before and after degradation was established; Passive equalizers for connectors with different degrees of degradation were designed; Finally, the comparison of eye diagrams before and after equalization verifies the feasibility and advantages of this equalization technology.

2. The passive equalization method for a degraded connector in a high-speed interconnection system according to claim 1, characterized in that: The channel degradation effects of the interconnection system are considered more comprehensively, and a variety of different degradation samples are prepared in advance.

3. The passive equalization method for a degraded rear connector in a high-speed interconnection system according to claim 1, characterized in that: An equivalent circuit model of the connector before and after degradation was established. At the same time, according to the S parameters measured by the vector network analyzer on the channel sample, the film resistance and film capacitance were added to the equivalent circuit model of the connector after degradation. The final channel model can predict and analyze the performance of the channel before and after degradation.

4. The passive equalization method for a degraded connector in a high-speed interconnection system according to claim 1, characterized in that: According to the film resistance and capacitance of the connector pin after degradation, a passive equalizer is designed based on the transfer function of the passive device to make the channel frequency response flat. Compared with the active equalizer, although DC attenuation is introduced, no additional power is consumed. This equalizer is introduced into the corresponding circuit model, and the performance of each interconnection system is analyzed; the simulation obtains important results such as the eye diagram and S parameters of the high-speed interconnection system.

5. The passive equalization method for a degraded connector in a high-speed interconnection system according to claim 1, characterized in that: A complete high-speed signal interconnection circuit system model was established, and finally the eye diagram results simulated before and after using the equalization technology were compared to prove the reliability of the passive equalization method of the present invention.

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