Copper Surface Organic Acid Type Ultra-roughening Agent Micro-etching Device

Abstract

The present invention relates to the technical field of copper surface micro-etching processing, and particularly to a micro-etching device for an organic acid type super-roughening agent on a copper surface, which comprises a cleaning tank. A first conveyor rack is fixed on the outer wall of one side of the top of the cleaning tank, and a first assembly line is installed on the inner wall of the top of the first conveyor rack. A micro-etching tank is arranged on the outer wall of one side of the cleaning tank. A second conveyor rack is fixed on the outer wall of the top between the cleaning tank and the micro-etching tank, and a second assembly line is installed on the inner wall of the top of the second conveyor rack. Lifting racks are symmetrically erected and fixed on the inner walls of both sides of the bottoms of the cleaning tank and the micro-etching tank; The micro-etching device for the organic acid type super-roughening agent on the copper surface of the present invention is composed of an assembly line, a cleaning tank and a micro-etching tank, and a liftable conveyor belt is arranged inside the cleaning tank and the micro-etching tank, which can realize automatic loading and unloading of PCB boards for micro-etching treatment, and sequentially complete degreasing and cleaning of the copper surface, micro-etching treatment of the copper surface, and cleaning after micro-etching of the copper surface, improving the automation level of the micro-etching device for the organic acid type super-roughening agent on the copper surface.

Description

Technical Field

[0001] The present invention relates to the technical field of copper surface micro-etching processing, and particularly to a micro-etching device for an organic acid type super-roughening agent on a copper surface. Background Art

[0002] In the manufacturing of printed circuit boards (PCBs), the treatment of the copper surface is one of the key steps. To ensure good adhesion between the copper layer and insulating materials (such as resins), it is usually necessary to roughen the copper surface; traditional roughening methods include mechanical grinding, chemical etching, etc., but these methods have problems such as low efficiency, large environmental pollution, and poor surface uniformity. The organic acid type super-roughening agent micro-etching technology has emerged as a more environmentally friendly and efficient copper surface treatment solution; the micro-etching device for the organic acid type super-roughening agent on the copper surface is used to micro-etch the copper surface in PCB manufacturing to enhance its adhesion to subsequent layers. This device micro-etches the copper surface through an organic acid type super-roughening agent to form a rough surface and improve adhesion. In the patent: CN202671660U, a micro super-roughening pre-treatment machine is disclosed, which includes a circuit control box and a treatment system. The circuit control box is connected to the treatment system through a control line. The treatment system includes a chemical pump, a base, a connecting pipe, a pressure gauge, a water tank, and a main frame cabinet. The chemical pump is fixed on the base, the pressure gauge is arranged on the connecting pipe outside the water tank, the water tank is arranged on the upper part of the main frame cabinet, the circuit control box is connected to the chemical pump through a control line, the connecting pipe includes an input pipe, a return pipe, an output pipe, a three-way pipe, and a shunt pipe. The input pipe is connected to the chemical pump and the shunt pipe, the shunt pipe is connected to the water tank, the return pipe is connected to the chemical pump, and the return pipe and the output pipe are connected to the bottom drain port of the water tank through a three-way pipe. Vertical clamping plate devices are arranged on two opposite sides in the water tank, and at least one spray pipe is arranged on the other two opposite sides respectively and connected to the shunt pipe, reducing equipment investment costs, achieving the copper surface roughness, effectively improving the adhesion between the copper surface and the interface, having a small footprint, low investment, and easy maintenance and preservation.

[0003] The existing micro-etching devices for the organic acid type super-roughening agent on the copper surface in the market have a relatively simple structure. It is necessary to manually load and unload the PCB board, which is laborious and inconvenient. They do not have the ability to clean and dry before and after micro-etching processing, affecting the effect of copper surface micro-etching processing. Moreover, the traditional micro-etching devices for the organic acid type super-roughening agent on the copper surface do not have the ability of linkage spraying of the organic acid type super-roughening agent, which is not conducive to uniform micro-etching of the copper surface and affects the efficiency of copper surface micro-etching processing.

[0004] To solve the above problems, a micro-etching device for the organic acid type super-roughening agent on the copper surface is proposed in the present invention. Summary of the Invention

[0005] (1) Technical problems to be solved:

[0006] The object of the present invention is to overcome the problems of the existing copper surface organic acid type super roughening agent micro-etching device, which requires manual loading and unloading of PCB boards, is laborious and inconvenient, does not have the ability to clean and dry before and after micro-etching processing, affects the effect of copper surface micro-etching processing, and does not have the ability of organic acid type super roughening agent linkage spraying, which is not conducive to uniform micro-etching of the copper surface and affects the efficiency of copper surface micro-etching processing. To meet the actual needs, a copper surface organic acid type super roughening agent micro-etching device is provided to solve the above technical problems.

[0007] (2) Technical solution:

[0008] In order to achieve the object of the present invention, the technical solution adopted by the present invention is as follows:

[0009] A copper surface organic acid type super roughening agent micro-etching device, including a cleaning pool, on one side outer wall of the top of the cleaning pool, a first conveying rack is fixed, and on the inner wall of the top of the first conveying rack, a first assembly line is installed. On one side outer wall of the cleaning pool, a micro-etching pool is arranged. On the top outer wall between the cleaning pool and the micro-etching pool, a second conveying rack is fixed, and on the inner wall of the top of the second conveying rack, a second assembly line is installed. On both sides of the bottom inner walls of the cleaning pool and the micro-etching pool, lifting racks are symmetrically erected and fixed. Inside the cleaning pool and the micro-etching pool, mounting racks are arranged. On both ends of the inner walls of the mounting racks, rotating rollers are rotatably installed, and a conveyor belt is sleeved between the rotating rollers. On both ends of the outer walls of both sides of the mounting rack, guide blocks are fixed. On both sides of the inner walls of the lifting rack, guide grooves are opened, and one end of the guide block is inserted into the inside of the guide groove. On the top outer wall of the guide block, a threaded hole is penetrated and opened. Inside the threaded hole, a screw rod is screwed, and both ends of the screw rod are rotatably connected to the inner walls of both ends of the guide groove. On one side outer wall of the top of the lifting rack, a first motor is inlaid and fixed. The first motor and the screw rod are coaxially connected. On one side outer walls of the cleaning pool and the micro-etching pool, a pump liquid conveyor belt driving unit is arranged. On the top outer wall of the second assembly line, a linkage drying assembly is arranged. Inside the micro-etching pool, a micro-etching spraying assembly is arranged.

[0010] Preferably, the pump liquid conveyor belt driving unit includes a two-way pump respectively fixed on one side outer walls of the cleaning pool and the micro-etching pool. The liquid suction end of the two-way pump is connected with a liquid suction pipe, and one end of the liquid suction pipe penetrates through the inside of the pool body. The liquid pumping end of the two-way pump is connected with a liquid pumping pipe. On one side outer wall of the end of the mounting rack, a mounting groove is penetrated and opened. On the inner wall of one end of the mounting groove, a first gear is rotatably installed. The rotating roller and the first gear are coaxially connected. On the inner wall of the other end of the mounting groove, a second gear is rotatably installed. On one side outer wall of the mounting rack, a first turbine is installed. The first turbine and the second gear are coaxially connected. One end of the liquid pumping pipe is connected with the outer wall of one side of the first turbine in a penetrating manner. On the outer wall of the other side of the first turbine, a liquid outlet pipe is connected in a penetrating manner.

[0011] Preferably, the linkage drying component includes a blowing hood arranged on the outer wall of the top of the second production line, and both ends of the blowing hood are fixed on the tops of the two lifting frames on both sides. A first fixing frame is fixed on the middle outer wall of the mounting frame inside the cleaning tank. A second turbine is installed on the top outer wall of the first fixing frame. A second motor is installed on the top outer wall of the second turbine, and the second motor and the second turbine are coaxially connected. The air suction end of the second turbine is connected through an air filter element. The air pumping end of the second turbine is connected through a pump air pipe, and one end of the pump air pipe is connected through to the inside of the blowing hood. An electric heating rod is installed on the top inner wall of the blowing hood. A blowing hood is arranged on the middle inner wall of the first fixing frame. Connecting plates are fixed on both outer walls of the blowing hood, and one end of the connecting plate is fixedly connected to the middle inner wall of the first fixing frame. The bottom end of the rotating shaft of the second turbine is connected to a transmission shaft, and a first impeller is fixed on the outer wall of one end of the transmission shaft passing through the inside of the blowing hood.

[0012] Preferably, the micro-etching spraying component includes a liquid pump fixed on the outer wall of one side of the micro-etching tank. The liquid suction end of the liquid pump is communicated with a suction pipe, and the liquid pumping end of the liquid pump is communicated with a pump delivery pipe. A second fixing frame is fixed on the middle outer wall of the mounting frame inside the micro-etching tank. A third turbine is fixed on the top outer wall of the second fixing frame. A rotating pipe is rotatably installed on the middle inner wall of the third turbine. A second impeller is fixedly installed on the outer wall of one end of the rotating pipe passing through the inside of the third turbine. One end of the pump delivery pipe is connected through to the outer wall of one side of the third turbine. The outer wall of the other side of the third turbine is connected through a bent pipe. The bent pipe and the end of the rotating pipe are rotatably connected, and a rotary joint is installed at the rotating connection. Rotating branch pipes are distributed and connected through on the outer wall of the end of the rotating pipe, and spray heads are distributed and installed through on the bottom outer wall of the rotating branch pipes.

[0013] Preferably, a separation filter element is installed through on the middle outer wall of the suction pipe.

[0014] Preferably, support frames are installed on the bottom outer walls of both the first conveying frame and the second conveying frame.

[0015] Preferably, a first inclined groove is opened on the bottom inner wall of the second conveying frame on one side of the cleaning tank, and a second inclined groove is opened on the bottom inner wall of the second conveying frame on one side of the micro-etching tank.

[0016] Preferably, the pump delivery pipe is a kind of telescopic hose.

[0017] Preferably, brushes are distributed and fixed on the outer wall of the conveyor belt.

[0018] Preferably, the spray head is a kind of rotary spray head.

[0019] (3) Beneficial effects:

[0020] A. The copper surface organic acid type ultra-roughening agent micro-etching device is composed of an assembly line, a cleaning tank and a micro-etching tank, and a liftable conveyor belt is arranged inside the cleaning tank and the micro-etching tank, which can realize the automatic loading and unloading of PCB boards for micro-etching treatment, and sequentially complete the degreasing and cleaning of the copper surface, the micro-etching treatment of the copper surface, and the cleaning after the micro-etching of the copper surface, improving the automation level of the copper surface organic acid type ultra-roughening agent micro-etching device;

[0021] B. Through the setting of the pump liquid conveyor belt driving unit, by controlling the operation of the two-way pump, the two-way pump pumps and sucks the water liquid in the tank body through the liquid suction pipe during operation, and pumps it out through the liquid pumping pipe and inputs it into the first turbine, and then returns to the tank body through the liquid outlet pipe on one side of the first turbine. During the process of the water liquid flowing through the first turbine, it will drive the first turbine to rotate, thereby driving the second gear to rotate. Under the combined transmission of the second gear and the first gear, the rotating roller will be driven to rotate. Under the rotation of the rotating roller, the conveyor belt above the mounting frame will be driven to rotate. By controlling the reverse rotation of the two-way pump, the conveyor belt can be driven to rotate in the reverse direction. Through the rotation of the conveyor belt, the loading and unloading transportation of the PCB board for micro-etching treatment is carried out. During the rotation of the conveyor belt in the cleaning tank or the micro-etching tank, it plays a role in stirring and disturbing the cleaning liquid or the organic acid type ultra-roughening agent in the tank, improving the efficiency and effect of the degreasing and cleaning of the copper surface and the micro-etching.

[0022] C. Through the setting of the linkage drying component, during the transportation above the second assembly line after the micro-etching treatment and cleaning treatment of the copper surface of the PCB board, control the operation of the second motor to drive the second turbine to rotate. Through the air filter element, external air is sucked, and the sucked air is input into the air blowing hood through the air pumping pipe. During the process, the electric heating rod works to heat the blown air, and the hot air is blown out above the second assembly line through the air blowing hood to dry the copper surface of the PCB board after the cleaning treatment or the micro-etching treatment transported above the second assembly line, which is beneficial to the micro-etching of the copper surface organic acid type ultra-roughening agent. During the rotation of the second turbine, the first impeller is synchronously driven to rotate through the transmission shaft. When the conveyor belt and the PCB board above it sink into the cleaning tank, the first impeller is placed in the cleaning tank, and the rotating first impeller plays a role in stirring the cleaning liquid in the cleaning tank, strengthening the cleaning effect. After the conveyor belt is lifted, the first impeller rotates in the air blowing hood, playing a role in blowing and drying the copper surface of the PCB board after the cleaning treatment above the conveyor belt.

[0023] D. Through the setting of the micro-etching spray component, during the process that the above conveyor belt and the PCB board above sink into the micro-etching tank for micro-etching, the liquid pump is controlled to work to pump the organic acid type super-roughening agent in the micro-etching tank through the suction pipe, input it into the third turbine through the pump delivery pipe, then input it into the rotating pipe through the elbow pipe and the rotating joint, and spray it out through the nozzle at the bottom of the rotating branch pipe. When the liquid passes through the third turbine, it will impact the second impeller, thereby driving the rotating pipe to rotate and also driving the rotating branch pipe to make a turnover, so that the organic acid type super-roughening agent sprayed by the nozzle acts on the copper surface evenly and effectively, and the copper surface of the PCB board on the conveyor belt is subjected to the spraying treatment of the organic acid type super-roughening agent, improving the effect of the micro-etching treatment of the organic acid type super-roughening agent on the copper surface. During the process that the above suction pipe sucks the organic acid type super-roughening agent in the micro-etching tank, the filter element filters the impurities in the organic acid type super-roughening agent, and the impurities can be cleaned at the filter element later, playing a role in filtering and purifying the organic acid type super-roughening agent in the micro-etching tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a three-dimensional structural schematic diagram of the micro-etching device for the copper surface with the organic acid type super-roughening agent of the present invention;

[0025] Figure 2 is a partial three-dimensional structural schematic diagram of the micro-etching device for the copper surface with the organic acid type super-roughening agent of the present invention;

[0026] Figure 3 is Figure 1 an enlarged structural view of area A in

[0027] Figure 4 is Figure 1 an enlarged structural view of area B in

[0028] Figure 5 is Figure 1 an enlarged structural view of area C in

[0029] Figure 6 is Figure 2 an enlarged structural view of area D in

[0030] Figure 7 is Figure 1 an enlarged structural view of area E in

[0031] Figure 8 is Figure 1 an enlarged structural view of area F in

[0032] Figure 9 is a partial three-dimensional sectional structural schematic diagram of the micro-etching spray component in the micro-etching device for the copper surface with the organic acid type super-roughening agent of the present invention.

[0033] The reference numerals are as follows:

[0034] 1. Cleaning tank; 2. First conveying rack; 3. First assembly line; 4. Micro-etching tank; 5. Second conveying rack; 6. Second assembly line; 7. Lifting rack; 8. Mounting rack; 9. Rotating roller; 10. Conveyor belt; 11. Guide block; 12. Guide groove; 13. Screw hole; 14. Screw; 15. First motor; 16. Pump liquid conveyor belt drive unit; 17. Linkage drying assembly; 18. Micro-etching spraying assembly; 19. Filter element; 20. Support frame; 21. First chute; 22. Second chute; 23. Brush

[0035] 161. Two-way pump; 162. Liquid suction pipe; 163. Pump liquid pipe; 164. Installation groove; 165. First gear; 166. Second gear; 167. First turbine; 168. Liquid outlet pipe

[0036] 171. Blowing hood; 172. First fixing frame; 173. Second turbine; 174. Second motor; 175. Air filter element; 176. Pump air pipe; 177. Electric heating rod; 178. Blowing hood; 179. Connecting plate; 1710. Transmission shaft; 1711. First impeller

[0037] 181. Liquid pump; 182. Suction pipe; 183. Pump delivery pipe; 184. Second fixing frame; 185. Third turbine; 186. Rotating pipe; 187. Second impeller; 188. Elbow pipe; 189. Rotary joint; 1810. Rotating branch pipe; 1811. Nozzle Detailed implementation mode

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0039] Next, in conjunction with the attached Figures 1-9 and the embodiments, the present invention will be further described:[[]]END]]

[0040] In this embodiment, as Figures 1-9As shown in the figure, the copper surface organic acid type super roughening agent micro-etching device includes a cleaning tank 1. On one side of the top outer wall of the cleaning tank 1, a first conveyor rack 2 is fixed, and a first assembly line 3 is installed on the top inner wall of the first conveyor rack 2. On one side of the outer wall of the cleaning tank 1, a micro-etching tank 4 is provided. On the top outer wall between the cleaning tank 1 and the micro-etching tank 4, a second conveyor rack 5 is fixed, and a second assembly line 6 is installed on the top inner wall of the second conveyor rack 5. On both sides of the bottom inner walls of the cleaning tank 1 and the micro-etching tank 4, lifting racks 7 are symmetrically installed and fixed. Inside both the cleaning tank 1 and the micro-etching tank 4, mounting frames 8 are provided. On both ends of the inner walls of the mounting frame 8, rotating rollers 9 are rotatably installed, and a conveyor belt 10 is sleeved between the rotating rollers 9. On both sides and both ends of the outer wall of the mounting frame 8, guide blocks 11 are fixed. On both sides of the inner wall of the lifting rack 7, guide grooves 12 are opened, and one end of the guide block 11 is inserted into the inside of the guide groove 12. A threaded hole 13 is penetrated and opened on the top outer wall of the guide block 11. A screw rod 14 is screwed and connected inside the threaded hole 13, and both ends of the screw rod 14 are rotatably connected to the inner walls at both ends of the guide groove 12. On one side of the top outer wall of the lifting rack 7, a first motor 15 is inlaid and fixed. The first motor 15 and the screw rod 14 are coaxially connected. On one side of the outer walls of both the cleaning tank 1 and the micro-etching tank 4, a pump liquid conveyor belt driving unit 16 is provided. On the top outer wall of the second assembly line 6, a linkage drying assembly 17 is provided. Inside the micro-etching tank 4, a micro-etching spraying assembly 18 is provided. During the use of this copper surface organic acid type super roughening agent micro-etching device, control the first motor 15 to work to drive the screw rod 14 to rotate. Under the combined drive of the screw rod 14 and the threaded hole 13, drive the guide block 11 to lift and lower along the guide groove 12 on the inner wall of the lifting rack 7, thereby driving the mounting frame 8 and the conveyor belt 10 above to lift and lower in the cleaning tank 1 or the micro-etching tank 4. Control the first motor 15 to work, so that the conveyor belts 10 in the cleaning tank 1 and the micro-etching tank 4 rise to a horizontal state with the first assembly line 3 and the second assembly line 6. Through the rotation of the first assembly line 3, the conveyor belt 10 and the second assembly line 6, the PCB boards to be micro-etched are conveyed. The first assembly line 3 conveys the PCB boards to be micro-etched above the conveyor belt 10 in the cleaning tank 1. Control the first motor 15 to work, so that the conveyor belt 10 and the PCB boards above sink into the cleaning tank 1. The conveyor belt 10 rotates to disturb the cleaning liquid in the cleaning tank 1, realizing the cleaning of the PCB boards above the conveyor belt 10. After cleaning, control the conveyor belt 10 to lift to a horizontal state with the second assembly line 6. The conveyor belt 10 and the second assembly line 6 cooperate to convey the cleaned PCB boards above the conveyor belt 10 in the micro-etching tank 4. Then control the first motor 15 to work, so that the conveyor belt 10 and the PCB boards above sink into the micro-etching tank 4 for micro-etching treatment of the copper surface during PCB manufacturing. After the treatment, control the conveyor belt 10 to lift to a horizontal state with the second assembly line 6. Then control the first assembly line 3, the conveyor belt 10 and the second assembly line 6 to rotate in the reverse direction for automatic blanking of the PCB boards after micro-etching treatment.

[0041] Furthermore, the pump liquid conveyor belt driving unit 16 includes a two-way pump 161 respectively fixed on the outer walls of one side of the cleaning tank 1 and the micro-etching tank 4. The liquid suction end of the two-way pump 161 is connected with a liquid suction pipe 162, and one end of the liquid suction pipe 162 penetrates into the inside of the tank body. The liquid pumping end of the two-way pump 161 is connected with a liquid pumping pipe 163. An installation groove 164 is formed through the outer wall of one end of the installation frame 8. A first gear 165 is rotatably installed on the inner wall of one end of the installation groove 164. The rotating roller 9 is coaxially connected with the first gear 165. A second gear 166 is rotatably installed on the inner wall of the other end of the installation groove 164. A first turbine 167 is installed on the outer wall of one side of the installation frame 8. The first turbine 167 is coaxially connected with the second gear 166. One end of the liquid pumping pipe 163 is connected to the outer wall of one side of the first turbine 167 in a penetrating manner. A liquid outlet pipe 168 is connected to the outer wall of the other side of the first turbine 167 in a penetrating manner. During the rotation driving process of the conveyor belt 10, by controlling the operation of the two-way pump 161 above the cleaning tank 1 or the micro-etching tank 4, the two-way pump 161 pumps and sucks the water liquid in the tank body through the liquid suction pipe 162, and pumps it out through the liquid pumping pipe 163 and inputs it into the first turbine 167, and returns to the tank body through the liquid outlet pipe 168 on one side of the first turbine 167. During the flowing process of the water liquid in the first turbine 167, it will drive the first turbine 167 to rotate, thereby driving the second gear 166 to rotate. Under the combined transmission of the second gear 166 and the first gear 165, the rotating roller 9 will be driven to rotate. Under the rotation cooperation of the rotating roller 9, the conveyor belt 10 above the installation frame 8 will be driven to rotate. By controlling the reverse rotation of the two-way pump 161, the conveyor belt 10 can be driven to rotate in the reverse direction. Through the rotation of the conveyor belt 10, the feeding and discharging of the PCB board during the micro-etching process are carried out. During the rotation of the conveyor belt 10 in the cleaning tank 1 or the micro-etching tank 4, it plays a role in stirring and disturbing the cleaning liquid or the organic acid type super roughening agent in the tank, improving the efficiency and effect of degreasing and cleaning the copper surface and micro-etching.

[0042] Furthermore, support frames 20 are installed on the outer walls of the bottoms of the first conveying frame 2 and the second conveying frame 5, and the first conveying frame 2 and the second conveying frame 5 are supported by the support frames 20.

[0043] Furthermore, a first inclined groove 21 is formed on the inner wall of the bottom of the second conveying frame 5 on one side of the cleaning tank 1, and a second inclined groove 22 is formed on the inner wall of the bottom of the second conveying frame 5 on one side of the micro-etching tank 4. During the conveying process of the PCB board on the second assembly line 6 of the second conveying frame 5 after cleaning, the cleaning liquid contaminated on the outer wall of the PCB board drips into the first inclined groove 21, and the cleaning liquid flows back into the cleaning tank 1 through the first inclined groove 21; during the discharging process of the PCB board after micro-etching treatment through the second assembly line 6, the organic acid type super roughening agent contaminated on the outer wall of the PCB board drips into the second inclined groove 22, and the organic acid type super roughening agent flows back into the micro-etching tank 4 through the second inclined groove 22.

[0044] Further, brushes 23 are fixedly distributed on the outer wall of the conveyor belt 10. During the turnover process of the conveyor belt 10 in the cleaning tank 1 or the micro-etching tank 4, the brushes 23 above the conveyor belt 10 skim over the outer wall of the PCB board, improving the effects of micro-etching treatment and cleaning treatment on the copper surface of the PCB board.

[0045] In this embodiment, referring to Figure 1 , Figure 3 and Figure 4 , the linkage drying assembly 17 includes a blowing hood 171 arranged on the outer wall of the top of the second assembly line 6, and both ends of the blowing hood 171 are fixed on the tops of the two side lifting frames 7. A first fixing frame 172 is fixed on the middle outer wall of the mounting frame 8 inside the cleaning tank 1. A second turbine 173 is installed on the top outer wall of the first fixing frame 172. A second motor 174 is installed on the top outer wall of the second turbine 173, and the second motor 174 and the second turbine 173 are coaxially connected. The suction end of the second turbine 173 is connected through and communicated with an air filter element 175. The air pumping end of the second turbine 173 is connected through and communicated with a pump air pipe 176, and one end of the pump air pipe 176 is connected through and communicated with the inside of the blowing hood 171. An electric heating rod 177 is installed on the inner wall of the top of the blowing hood 171. A blowing hood 178 is arranged on the middle inner wall of the first fixing frame 172. Connecting plates 179 are fixed on the outer walls on both sides of the blowing hood 178, and one end of the connecting plate 179 is fixedly connected with the middle inner wall of the first fixing frame 172. The bottom end of the rotating shaft of the second turbine 173 is connected with a transmission shaft 1710, and a first impeller 1711 is fixed on the outer wall of one end of the transmission shaft 1710 penetrating through the inside of the blowing hood 178. During the conveying process above the second assembly line 6 after the micro-etching treatment and cleaning treatment of the copper surface of the PCB board, the second motor 174 is controlled to work to drive the second turbine 173 to rotate. External air is sucked through the air filter element 175, and the sucked air is input into the blowing hood 171 through the pump air pipe 176. During this process, the electric heating rod 177 works to heat the blown air, and the hot air is blown out above the second assembly line 6 through the blowing hood 171 to dry the copper surface of the PCB board after cleaning treatment or micro-etching treatment conveyed above the second assembly line 6, which is beneficial to the micro-etching of the organic acid type super-roughening agent on the copper surface. During the rotation of the second turbine 173, the first impeller 1711 is synchronously driven to rotate through the transmission shaft 1710. When the conveyor belt 10 and the PCB board above it sink into the cleaning tank 1, the first impeller 1711 is placed in the cleaning tank 1, and the rotating first impeller 1711 plays a role in stirring the cleaning liquid in the cleaning tank 1 to strengthen the cleaning effect. After the conveyor belt 10 is lifted, the first impeller 1711 rotates in the blowing hood 171, playing a role in blowing and drying the copper surface of the PCB board after cleaning treatment above the conveyor belt 10.

[0046] In this embodiment, referring to Figure 1 , Figure 5 , Figure 8 andFigure 9 , the micro-etching spray assembly 18 includes a liquid pump 181 fixed on the outer wall of one side of the micro-etching tank 4. The liquid suction end of the liquid pump 181 is connected to a suction pipe 182, and the liquid pumping end of the liquid pump 181 is connected to a pump delivery pipe 183. A second fixing frame 184 is fixed on the middle outer wall of the mounting frame 8 inside the micro-etching tank 4. A third turbine 185 is fixed on the top outer wall of the second fixing frame 184. A rotating pipe 186 is rotatably installed on the inner wall of the middle of the third turbine 185. A second impeller 187 is fixedly sleeved on the outer wall of one end of the rotating pipe 186 passing through the inside of the third turbine 185. One end of the pump delivery pipe 183 is connected to the outer wall of one side of the third turbine 185 in a penetrating manner. The outer wall of the other side of the third turbine 185 is connected to an elbow pipe 188 in a penetrating manner. The elbow pipe 188 and the end of the rotating pipe 186 are rotatably connected, and a rotary joint 189 is installed at the rotating connection. The outer wall of the end of the rotating pipe 186 is distributively and penetratingly connected with rotating branch pipes 1810. Spray nozzles 1811 are distributively and penetratingly installed on the bottom outer wall of the rotating branch pipes 1810. During the process that the above conveyor belt 10 and the PCB board above sink into the micro-etching tank 4 for micro-etching, the liquid pump 181 is controlled to work to pump the organic acid type super-roughening agent in the micro-etching tank 4 through the suction pipe 182, input it into the third turbine 185 through the pump delivery pipe 183, then input it into the rotating pipe 186 through the elbow pipe 188 and the rotary joint 189, and spray it out through the spray nozzles 1811 at the bottom of the rotating branch pipes 1810. When the liquid passes through the third turbine 185, it will impact the second impeller 187, thereby driving the rotating pipe 186 to rotate, and also driving the rotating branch pipes 1810 to rotate, so that the organic acid type super-roughening agent sprayed by the spray nozzles 1811 acts on the copper surface evenly and effectively, and the copper surface of the PCB board on the conveyor belt 10 is subjected to the spraying treatment of the organic acid type super-roughening agent, improving the effect of the micro-etching treatment of the organic acid type super-roughening agent on the copper surface.

[0047] Further, a filter element 19 is installed in a penetrating manner on the middle outer wall of the suction pipe 182. During the process that the suction pipe 182 sucks the organic acid type super-roughening agent in the micro-etching tank 4, the filter element 19 filters the impurities in the organic acid type super-roughening agent, and the impurities can be cleaned at the filter element 19 later, playing a role in filtering and purifying the organic acid type super-roughening agent in the micro-etching tank 4.

[0048] Further, the pump delivery pipe 183 is a telescopic hose, which is beneficial to the liquid pumping of the pump delivery pipe 183 during the lifting adjustment of the conveyor belt 10.

[0049] Further, the spray nozzles 1811 are rotary spray nozzles, which improve the spraying effect of the organic acid type super-roughening agent.

[0050] Working principle: When the present invention is in use, during the operation of the copper surface organic acid type ultra-roughening agent micro-etching device, the first motor 15 is controlled to work to drive the screw rod 14 to rotate. Under the combined drive of the screw rod 14 and the screw hole 13, the guide block 11 is driven to lift and lower along the guide groove 12 on the inner wall of the lifting frame 7, thereby driving the mounting frame 8 and the conveyor belt 10 above it to lift and lower in the cleaning tank 1 or the micro-etching tank 4. The first motor 15 is controlled to work to raise the conveyor belt 10 in the cleaning tank 1 and the micro-etching tank 4 to the same horizontal state as the first production line 3 and the second production line 6. Through the rotation of the first production line 3, the conveyor belt 10, and the second production line 6, the PCB board to be micro-etched, etc. is conveyed. The first production line 3 conveys the PCB board to be micro-etched above the conveyor belt 10 in the cleaning tank 1. The first motor 15 is controlled to work to sink the conveyor belt 10 and the PCB board above it into the cleaning tank 1. The conveyor belt 10 rotates to disturb the cleaning liquid in the cleaning tank 1, realizing the cleaning of the PCB board above the conveyor belt 10. After cleaning, the conveyor belt 10 is controlled to be lifted to the same horizontal state as the second production line 6. The conveyor belt 10 and the second production line 6 cooperate to convey the cleaned PCB board above the conveyor belt 10 in the micro-etching tank 4. Then the first motor 15 is controlled to work to sink the conveyor belt 10 and the PCB board above it into the micro-etching tank 4 for the micro-etching treatment of the copper surface during PCB manufacturing. After the treatment, the conveyor belt 10 is controlled to be lifted to the same horizontal state as the second production line 6. Then the first production line 3, the conveyor belt 10, and the second production line 6 are controlled to rotate in the reverse direction for the automatic blanking of the PCB board after the micro-etching treatment; during the rotation driving process of the conveyor belt 10, by controlling the two-way pump 161 above the cleaning tank 1 or the micro-etching tank 4 to work, the two-way pump 161 pumps and sucks the water liquid in the tank body through the liquid suction pipe 162, and pumps it out through the liquid pumping pipe 163 and inputs it into the first turbine 167, and returns to the tank body through the liquid outlet pipe 168 on one side of the first turbine 167. During the flow of the water liquid in the first turbine 167, it will drive the first turbine 167 to rotate, thereby driving the second gear 166 to rotate. Under the combined drive of the second gear 166 and the first gear 165, the rotating roller 9 will be driven to rotate. Under the rotation cooperation of the rotating roller 9, the conveyor belt 10 above the mounting frame 8 will be driven to rotate. By controlling the two-way pump 161 to rotate in the reverse direction, the conveyor belt 10 can be driven to rotate in the reverse direction. Through the rotation of the conveyor belt 10, the loading and unloading transportation of the PCB board after the micro-etching treatment is carried out. During the rotation process of the conveyor belt 10 in the cleaning tank 1 or the micro-etching tank 4, it plays a role in stirring and disturbing the cleaning liquid or the organic acid type ultra-roughening agent in the tank, improving the efficiency and effect of degreasing and cleaning and micro-etching of the copper surface;During the conveying process above the second production line 6 after the copper surface of the PCB board is subjected to micro-etching treatment and cleaning treatment, the second motor 174 is controlled to work to drive the second turbine 173 to rotate. External air is sucked through the air filter element 175, and the sucked air is input into the air blowing hood 171 through the pump air pipe 176. During this process, the electric heating rod 177 works to heat the blown air. The hot air is blown out above the second production line 6 through the air blowing hood 171 to dry the copper surface of the PCB board after cleaning treatment or micro-etching treatment conveyed above the second production line 6, which is beneficial to the micro-etching of the organic acid type super-roughening agent on the copper surface. During the rotation of the second turbine 173, the first impeller 1711 is synchronously driven to rotate through the transmission shaft 1710. When the conveyor belt 10 and the PCB board above it sink into the cleaning tank 1, the first impeller 1711 is placed in the cleaning tank 1. The rotating first impeller 1711 plays a role in stirring the cleaning liquid in the cleaning tank 1 to enhance the cleaning effect. After the conveyor belt 10 is lifted, the first impeller 1711 rotates in the air blowing hood 171, playing a role in blowing and drying the copper surface of the PCB board after cleaning treatment above the conveyor belt 10. During the micro-etching process when the conveyor belt 10 and the PCB board above it sink into the micro-etching tank 4, the liquid pump 181 is controlled to work to pump and suck the organic acid type super-roughening agent in the micro-etching tank 4 through the suction pipe 182, input it into the third turbine 185 through the pump delivery pipe 183, then input it into the rotating pipe 186 through the elbow pipe 188 and the rotary joint 189, and spray it out through the nozzle 1811 at the bottom of the rotating branch pipe 1810. When the liquid passes through the third turbine 185, it will impact the second impeller 187, thereby driving the rotating pipe 186 to rotate and also driving the rotating branch pipe 1810 to rotate, so that the organic acid type super-roughening agent sprayed out by the nozzle 1811 acts on the copper surface evenly and effectively, and the copper surface of the PCB board on the conveyor belt 10 is subjected to organic acid type super-roughening agent spraying treatment, improving the effect of the organic acid type super-roughening agent micro-etching treatment on the copper surface.;

[0051] The disclosed embodiments of the present invention are preferred embodiments, but not limited thereto. Those of ordinary skill in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not depart from the spirit of the present invention, they are within the protection scope of the present invention.

Claims

1. Copper surface organic acid type ultra-roughening agent micro-etching device, characterized in that: It includes a cleaning tank (1). On one side of the outer wall at the top of the cleaning tank (1), a first conveyor rack (2) is fixed. And on the inner wall at the top of the first conveyor rack (2), a first assembly line (3) is installed. On one side of the outer wall of the cleaning tank (1), a micro-etching tank (4) is provided. On the outer wall at the top between the cleaning tank (1) and the micro-etching tank (4), a second conveyor rack (5) is fixed. And on the inner wall at the top of the second conveyor rack (5), a second assembly line (6) is installed. On both sides of the inner walls at the bottom of the cleaning tank (1) and the micro-etching tank (4), lifting racks (7) are symmetrically erected and fixed. Inside both the cleaning tank (1) and the micro-etching tank (4), mounting racks (8) are provided. On the inner walls at both ends of the mounting rack (8), rotating rollers (9) are rotatably installed. And a conveyor belt (10) is sleeved between the rotating rollers (9). On the outer walls at both ends of both sides of the mounting rack (8), guide blocks (11) are fixed. On the inner walls on both sides of the lifting rack (7), guide grooves (12) are opened. And one end of the guide block (11) is inserted into the inside of the guide groove (12). On the outer wall at the top of the guide block (11), a threaded hole (13) is penetrated and opened. Inside the threaded hole (13), a screw rod (14) is threadedly connected. And both ends of the screw rod (14) are rotatably connected to the inner walls at both ends of the guide groove (12). On one side of the outer wall at the top of the lifting rack (7), a first motor (15) is embedded and fixed. The first motor (15) and the screw rod (14) are coaxially connected. On one side of the outer walls of both the cleaning tank (1) and the micro-etching tank (4), a pump liquid conveyor belt driving unit (16) is provided. On the outer wall at the top of the second assembly line (6), a linkage drying assembly (17) is provided. Inside the micro-etching tank (4), a micro-etching spraying assembly (18) is provided; The pump liquid conveyor belt driving unit (16) includes a two-way pump (161) respectively fixed on one side of the outer walls of the cleaning tank (1) and the micro-etching tank (4). The liquid suction end of the two-way pump (161) is connected with a liquid suction pipe (162). And one end of the liquid suction pipe (162) penetrates through the inside of the tank body. The liquid pumping end of the two-way pump (161) is connected with a liquid pumping pipe (163). On one side of the outer wall at the end of the mounting rack (8), a mounting groove (164) is penetrated and opened. On the inner wall at one end of the mounting groove (164), a first gear (165) is rotatably installed. The rotating roller (9) and the first gear (165) are coaxially connected. On the inner wall at the other end of the mounting groove (164), a second gear (166) is rotatably installed. On one side of the outer wall of the mounting rack (8), a first turbine (167) is installed. The first turbine (167) and the second gear (166) are coaxially connected. One end of the liquid pumping pipe (163) is connected through the outer wall on one side of the first turbine (167). On the outer wall on the other side of the first turbine (167), a liquid outlet pipe (168) is connected through; The linked drying assembly (17) includes a blowing hood (171) disposed on the outer wall of the top of the second production line (6), and both ends of the blowing hood (171) are fixed to the tops of the two lifting frames (7). A first fixing frame (172) is fixed to the outer wall of the middle part of the mounting rack (8) inside the cleaning tank (1). A second turbine (173) is installed on the outer wall of the top of the first fixing frame (172). A second motor (174) is installed on the outer wall of the top of the second turbine (173), and the second motor (174) is coaxially connected to the second turbine (173). The suction end of the second turbine (173) is connected through a connection to an air filter element (175). The pumping end of the second turbine (173) is connected through a connection to a pump air pipe (176), and one end of the pump air pipe (176) is connected through a connection to the inside of the blowing hood (171). An electric heating rod (177) is installed on the inner wall of the top of the blowing hood (171). A blowing hood (178) is disposed on the inner wall of the middle part of the first fixing frame (172). Connecting plates (179) are fixed to the outer walls of both sides of the blowing hood (178), and one end of each connecting plate (179) is fixedly connected to the inner wall of the middle part of the first fixing frame (172). The bottom end of the rotating shaft of the second turbine (173) is connected to a transmission shaft (1710), and a first impeller (1711) is fixed to the outer wall of one end of the transmission shaft (1710) passing through the inside of the blowing hood (178). The micro-etching spraying assembly (18) includes a liquid pump (181) fixed to the outer wall of one side of the micro-etching tank (4). The liquid suction end of the liquid pump (181) is communicated with a suction pipe (182). The liquid pumping end of the liquid pump (181) is communicated with a pump delivery pipe (183). A second fixing frame (184) is fixed to the outer wall of the middle part of the mounting rack (8) inside the micro-etching tank (4). A third turbine (185) is fixed to the outer wall of the top of the second fixing frame (184). A rotating pipe (186) is rotatably installed on the inner wall of the middle part of the third turbine (185). A second impeller (187) is fixedly sleeved on the outer wall of one end of the rotating pipe (186) passing through the inside of the third turbine (185). One end of the pump delivery pipe (183) is connected through a connection to the outer wall of one side of the third turbine (185). The outer wall of the other side of the third turbine (185) is connected through a connection to an elbow pipe (188). The elbow pipe (188) and the end of the rotating pipe (186) are rotatably connected, and a rotary joint (189) is installed at the rotating connection. Rotating branch pipes (1810) are distributed and connected through connections to the outer wall of the end of the rotating pipe (186). Sprayers (1811) are distributed and installed through connections on the outer wall of the bottom of the rotating branch pipes (1810).

2. The copper surface organic acid type ultra-roughening agent micro-etching device according to claim 1, characterized in that: A filter element (19) is installed through a connection on the outer wall of the middle part of the suction pipe (182).

3. The copper surface organic acid type ultra-roughening agent micro-etching device according to claim 1, characterized in that: Support frames (20) are installed on the outer walls of the bottoms of the first conveying rack (2) and the second conveying rack (5).

4. The copper surface organic acid type super roughening agent micro etching device according to claim 1, characterized in that: The bottom inner wall of the second conveyor rack (5) on one side of the cleaning tank (1) is provided with a first inclined groove (21), and the bottom inner wall of the second conveyor rack (5) on one side of the micro-etching tank (4) is provided with a second inclined groove (22).

5. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: The pump delivery pipe (183) is a kind of telescopic hose.

6. The copper surface organic acid type super-roughening agent micro-etching device according to claim 1, characterized in that: Brushes (23) are fixedly distributed on the outer wall of the conveyor belt (10).

7. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, wherein: The spray head (1811) is a kind of rotary spray head.

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