Windowing heat dissipation structure of ABF carrier plate on PCB and process method

Abstract

The invention discloses a windowing heat dissipation structure of an ABF carrier plate on a PCB and a process method, and belongs to the field of integrated circuit packaging processes, the windowing heat dissipation structure comprises an ABF carrier plate, the front surface of the ABF carrier plate is connected with a first core particle through a copper column bump, the back surface of the ABF carrier plate is connected with a second core particle through a copper column bump, a redistribution layer is arranged between the copper column bumps, and the first core particle is connected with a second core particle through a copper column bump. The first core particle and the second core particle are connected through a redistribution layer in the copper column protruding block. A plurality of solder balls are arranged on the two sides of the back face of the ABF carrier plate, the back face of the ABF carrier plate is connected with a windowing PCB through the solder balls, and the second core particles leak out of the windowing position of the windowing PCB, so that the second core particles leak out of a window body and are directly exposed in the external environment; according to the invention, the limitation of a traditional closed structure on heat dissipation is broken through, so that heat can be dissipated into surrounding air more quickly, the heat dissipation efficiency of the core particle II is remarkably enhanced, and the working temperature of the core particle II can be effectively reduced.

Description

Technical Field

[0001] The invention belongs to the field of integrated circuit packaging technology, and in particular relates to a window heat dissipation structure of an ABF carrier board on a PCB board and a process method. Background Art

[0002] In today's electronic technology field, a variety of processes based on different IC substrates are constantly evolving. Among them, the three-dimensional integration process is particularly eye-catching, which can greatly reduce the area of ​​​​the electronic system and significantly improve the performance per unit area. This process will encapsulate the processor chip used for calculation or control inside the microsystem. Since the processor chip generates a lot of heat when working inside the microsystem, the three-dimensional integrated packaging method makes it difficult to dissipate the heat quickly and effectively, making the heat dissipation problem a safety risk, which is prone to problems such as system soft errors, functional disorders or reduced reliability.

[0003] There are currently two ways to solve the heat dissipation problem. One is to deconstruct a large-area chip into several core particles to achieve distributed heat dissipation. The principle of this method is to increase the number of heat dissipation units and expand the heat dissipation area, thereby improving the heat dissipation efficiency. The second is to lead out the signals in the chip, increase the bonding points, and adopt face-to-face hybrid bonding technology. In this way, the heat conduction path inside the chip can be optimized and the heat dissipation effect can be improved. However, both methods have obvious limitations. Whether it is core particle deconstruction or signal lead-out and hybrid bonding, the chip needs to be redesigned. This process involves complex chip architecture adjustment, circuit layout optimization and other work, and after the design is completed, it is necessary to perform tape-out operations. Tape-out not only takes a lot of time, but also has high costs, including raw material costs, manufacturing process costs, and testing costs. For enterprises, this undoubtedly adds a huge economic burden and time cost.

[0004] Therefore, how to achieve effective heat dissipation at the lowest cost for existing processor chips without large-scale redesign and tape-out has become a common problem that needs to be solved urgently in the industry. Summary of the invention

[0005] The purpose of the present invention is to provide a window heat dissipation structure and process method of an ABF carrier on a PCB board, so as to overcome the shortcomings of the prior art that improving the heat dissipation efficiency requires redesigning the chip, which is time-consuming and increases costs.

[0006] In order to achieve the above object, the present invention provides the following technical solutions: In a first aspect, the present invention provides an ABF carrier board on a PCB window heat dissipation structure, comprising: It includes an ABF carrier board, the front side of the ABF carrier board is connected to core particle 1 through a copper column bump, the back side of the ABF carrier board is connected to core particle 2 through a copper column bump, a redistribution layer is arranged between the copper column bumps, and the core particle 1 and the core particle 2 are connected through the redistribution layer in the copper column bumps; a plurality of solder balls are arranged on both sides of the back side of the ABF carrier board, the back side of the ABF carrier board is connected to a window PCB board through solder balls, and the core particle 2 leaks out from the window of the window PCB board. The core particle 2 with large dynamic power consumption and the core particle 1 with close communication interaction with it and relatively low power consumption are arranged on the front and back sides of the ABF carrier board respectively, and connected through the copper column bumps and the redistribution layer. This layout makes the heat generation source relatively dispersed, avoiding the problem of local overheating caused by the high power consumption core particles concentrated on one side. The physical structure of the copper column bump can support the chip to a certain extent, disperse the stress on the chip during installation and use, and prevent the chip from being damaged by external forces. The design of the window PCB allows the chip 2 to leak out from the window of the window PCB, directly exposed to the external environment or convenient for installing a specific heat dissipation device. This provides an additional, efficient heat dissipation channel for the chip 2, breaking the heat dissipation limitation of the traditional closed structure, allowing the heat to be dissipated to the surrounding air more quickly.

[0007] Furthermore, the dynamic power consumption of the core particle 2 is greater than the dynamic power consumption of the core particle 1, and the core particle 2 includes a GPU, an NPU, a SOC, and an FPGA.

[0008] Furthermore, the chiplet 1 is a chiplet that closely communicates and interacts with the chiplet 2, and the chiplet 1 includes Nor Flash, SRAM, and a dynamic memory chip.

[0009] Furthermore, a lower filling material sealing structure 8 is provided at the gap where the ABF carrier board 3 and the window PCB board 7 are connected and at the bottom of the core particle 2 5, forming a cofferdam structure with the window of the window PCB board 7. A thermal conductive potting glue layer 9 is provided at the window of the window PCB board 7. The thermal conductive potting glue layer has good thermal conductivity and can quickly transfer the heat generated by the core particle 2 during operation to the heat dissipation structure around the window or directly dissipate it into the air.

[0010] Furthermore, the height of the thermally conductive potting glue layer is the same as the thickness of the window PCB board. Furthermore, a lower filler sealing structure 8 is provided at the gap between the ABF carrier board 3 and the window PCB board 7 and at the bottom of the core particle 2 5, forming a cofferdam structure with the window of the window PCB board 7, and a heat conductive potting glue layer 9 is provided at the window of the window PCB board 7, the height of the heat conductive potting glue layer 9 is lower than the height of the core particle 2 5, and a seed layer 10 is deposited on the back of the core particle 2 5, and a copper layer 11 is deposited on the seed layer 10; the main function of the seed layer is to increase the adhesion of the copper layer, ensure that the copper layer can be firmly attached to the back of the core particle 2, and form an effective heat dissipation layer. The copper layer has good thermal conductivity and can quickly conduct the heat generated by the core particle 2 to a larger surface area, thereby improving the efficiency of heat dissipation to the surrounding environment.

[0011] Furthermore, the seed layer material is gold.

[0012] Furthermore, the height of the thermally conductive potting adhesive layer 9 is smaller than the thickness of the window PCB board 7 .

[0013] In a second aspect, the present invention provides a process method for a PCB window heat dissipation structure based on a thermally conductive potting adhesive, comprising the following steps: The core particle 1 is welded to the front side of the ABF carrier board, and the core particle 2 is welded to the back side of the ABF carrier board to obtain the ABF carrier board module, and the welding residue of the ABF carrier board module is cleaned; After the core particles 1 and 2 on the ABF carrier module are plasma treated, bottom filler is injected into the bottom of the core particle 1, the gap between the ABF carrier and the window PCB board, and the bottom of the core particle 2, and the bottom filler is solidified to form a lower filler sealing structure 8, and the ABF carrier module is welded on the window PCB board to obtain a PCB board structure module after the welding is completed, and the PCB board structure module is plasma cleaned; After the plasma cleaning of the PCB board structure module is completed, a thermal conductive glue is injected into the window at the bottom of the PCB board structure module to encapsulate and wrap the second core particle at the bottom of the PCB board structure module, and a thermal conductive potting glue layer is formed at the window of the window PCB board to obtain a PCB window heat dissipation structure with thermal conductive potting glue.

[0014] In a third aspect, the present invention provides a process method for a PCB window heat dissipation structure based on a deposition process, wherein a core particle 1 is welded to the front side of an ABF carrier board, and a core particle 2 is welded to the back side of the ABF carrier board to obtain an ABF carrier board module, and the welding residue of the ABF carrier board module is cleaned; After the core particles 1 and 2 on the ABF carrier module are plasma treated, bottom filler is injected into the bottom of the core particle 1, the gap between the ABF carrier and the window PCB board, and the bottom of the core particle 2, and the bottom filler is solidified to form a lower filler sealing structure 8, and the ABF carrier module is welded on the window PCB board to obtain a PCB board structure module after the welding is completed, and the PCB board structure module is plasma cleaned; After the plasma cleaning of the PCB board structure module is completed, a thermal conductive glue is injected into the bottom window of the PCB board structure module to encapsulate and wrap the second core particle at the bottom of the PCB board structure module, and a thermal conductive potting glue layer is formed at the window of the window PCB board to obtain a PCB window heat dissipation structure with thermal conductive potting glue; A seed layer is sputtered on the second surface of the encapsulated core particle, and a copper layer is generated on the surface of the seed layer by chemical deposition.

[0015] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention provides an ABF carrier board with a PCB window heat dissipation structure, wherein a core particle 2 with relatively large dynamic power consumption and a core particle 1 which closely communicates with the core particle 2 and has relatively low power consumption are arranged on the front and back of the ABF carrier board respectively, and connected through copper column bumps and a redistribution layer. This layout makes the heat generation source relatively dispersed, avoids the problem of high-power core particles being concentrated on one side and causing local overheating, improves the heat dissipation balance of the entire structure, and reduces the risk of chip performance degradation, reliability reduction, and possible thermal failure caused by local overheating. The design of the window PCB board allows the core particle 2 to leak out of the window and be directly exposed to the external environment, breaking the limitation of the traditional closed structure on heat dissipation, allowing the heat to be dissipated to the surrounding air more quickly, significantly enhancing the heat dissipation efficiency of the core particle 2, and effectively reducing its operating temperature.

[0016] Specifically, based on the PCB window heat dissipation structure with thermally conductive potting glue, a lower filler is injected at the bottom of the core particle 2 to form a lower filler sealing structure. The lower filler can fill the tiny gap between the chip 2 and the ABF carrier due to the uneven surface, so that a good thermal conduction interface is formed between the chip 2 and the ABF carrier, and the efficiency of heat transfer from the chip 2 to the ABF carrier is improved. At the same time, the lower filler sealing structure can also enhance the adhesion of the chip 2 to the ABF carrier to prevent the chip from shifting or falling off when subjected to external force or thermal stress. Thermally conductive potting glue is injected at the window to form a thermally conductive potting glue layer. The thermally conductive potting glue layer has good thermal conductivity and can quickly transfer the heat generated by the core particle 2 during operation to the heat dissipation structure around the window or directly dissipate it into the air. Specifically, based on the deposition process, a seed layer of gold material is first deposited on the back of the second core, and then a copper layer is deposited thereon. The main function of the gold seed layer is to increase the adhesion of the copper layer, ensuring that the copper layer can be firmly attached to the back of the second core to form an effective heat dissipation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of a PCB window heat dissipation structure of an ABF carrier in Example 1 of the present invention.

[0018] Figure 2 This is a schematic diagram of a PCB window heat dissipation structure based on thermal conductive potting glue in Example 2 of the present invention.

[0019] Figure 3 This is a PCB window heat dissipation structure based on a deposition process in Example 3 of the present invention.

[0020] Figure 4 The present invention is a schematic diagram of a process flow of a PCB window heat dissipation structure based on thermally conductive potting glue in an embodiment of the present invention.

[0021] Figure 5 The present invention is a schematic diagram of a process flow of a PCB window heat dissipation structure based on a deposition process in an embodiment of the present invention.

[0022] In the figure, 1, core particle one; 2, copper pillar bump; 3, ABF carrier board; 4, redistribution layer; 5, core particle two; 6, solder ball; 7, window PCB board; 8, lower filler sealing structure; 9, thermal conductive potting glue layer; 10, seed layer; 11, copper layer. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] The present invention makes full use of the double-sided welding characteristics of the ABF substrate, and solders the core particles with high power consumption on the back side of the ABF substrate in an inverted manner. Then, by utilizing the windowed PCB structure, the core particles with high power consumption are leaked out of the PCB window from the back side to form a heat dissipation surface, thereby being able to implement the heat dissipation solution more conveniently and effectively.

[0026] Example 1 See also Figure 1 The present invention provides an ABF carrier board heat dissipation structure with a window on a PCB, comprising an ABF carrier board 3, wherein a core particle 1 is connected to the front side of the ABF carrier board 3 through a copper column bump 2, and a core particle 2 5 is connected to the back side of the ABF carrier board 3 through a copper column bump 2; a redistribution layer 4 is arranged between the copper column bumps 2, and the core particle 1 and the core particle 2 5 are connected through the redistribution layer 4; the dynamic power consumption of the core particle 2 5 is greater than the dynamic power consumption of the core particle 1, and the core particle 1 1 is a core particle that closely communicates and interacts with the core particle 2 5; by arranging the core particle 2 5 with large dynamic power consumption and the core particle 1 1 that closely communicates and interacts with it and has relatively low power consumption on the front side and the back side of the ABF carrier board 3 respectively, a large amount of heat generated by the core particle 2 5 can be dissipated to the back side of the ABF carrier board 3 and the surrounding space, and a small amount of heat generated by the core particle 1 also has its own independent heat dissipation path, and will not be superimposed on the heat of the core particle 2 5 to aggravate the local thermal stress, so that the heat generation source is relatively dispersed, and the problem of high-power consumption core particles concentrated on one side causing local overheating is avoided.

[0027] A plurality of solder balls 6 are arranged on both sides of the back side of the ABF carrier board 3. The back side of the ABF carrier board 3 is connected to a window PCB board 7 through the solder balls 6. The core particle 2 5 leaks out from the window of the window PCB board 7. The design of the window PCB board 7 allows the core particle 2 5 to leak out from the window and be directly exposed to the external environment. Compared with the traditional closed structure, the heat dissipated by the core particle 2 5 is no longer limited to conduction and dissipation inside the PCB board, but can directly exchange heat with the surrounding air; part of the heat generated by the core particle 2 5 is dissipated through air convection in direct contact with the window, and the other part can be conducted to the solder balls through the ABF carrier board 3, and then the solder balls 6 transfer the heat to the window PCB board 7 for further diffusion.

[0028] In some preferred embodiments of the present invention, the chip 2 5 includes a graphics processor GPU, a neural network processor NPU, a system-on-chip SOC, and a field programmable gate array FPGA.

[0029] In some preferred embodiments of the present invention, the chip 1 includes a NOR flash memory, a static memory chip SRAM, and a dynamic memory chip.

[0030] Example 2 See also Figure 2 , a PCB window heat dissipation structure based on heat-conducting potting glue, based on the PCB window heat dissipation structure of an ABF carrier mentioned in Example 1, a lower filler sealing structure 8 is provided at the bottom of the core particle 1, the gap between the ABF carrier 3 and the window PCB board 7, and the bottom of the core particle 2 5, forming a cofferdam structure with the window of the window PCB board 7, and a heat-conducting potting glue layer 9 is provided at the window of the window PCB board 7, and the height of the heat-conducting potting glue layer 9 is the same as the thickness of the window PCB board 7. The lower filler sealing structure 8 can be closely fitted with the window PCB board 7, and the lower filler sealing structure 8 can provide additional mechanical support for the core particle 2 5, enhance its connection strength with the ABF carrier 3, and make the heat generated by the core particle 2 5 more smoothly transferred to the ABF carrier 3, avoiding heat accumulation or conduction obstruction caused by the existence of poor heat conductors such as air gaps.

[0031] Example 3 See also Figure 3A PCB window heat dissipation structure based on a deposition process, a lower filler sealing structure 8 is provided at the gap between the ABF carrier board 3 and the window PCB board 7 and the bottom of the core particle 2 5, and a cofferdam structure is formed with the window of the window PCB board 7, and a heat conductive potting glue layer 9 is provided at the window of the window PCB board 7, and the height of the heat conductive potting glue layer 9 is lower than the height of the core particle 2 5, and a seed layer 10 is deposited on the back of the core particle 2 5, and a copper layer 11 is deposited on the seed layer 10. The heat conductive potting glue layer 9 is provided at the window of the window PCB board 7, and it is in direct contact with the core particle 2 5 and wraps a part of the area. With its own good thermal conductivity, the heat emitted by the core particle 2 5 can be quickly conducted to the surrounding environment of the window. And its height is controlled to be lower than the height of the core particle 2 5 and less than the thickness of the window PCB board 7, which, on the one hand, avoids interference with the deposition process on the back of the core particle 2 5, and on the other hand, it can also make the heat more concentratedly dissipated to the window, which is convenient for the subsequent use of the window structure to exchange heat with the external environment. The lower filler sealing structure 8, the thermal conductive potting glue layer 9, the seed layer 10 and the copper layer 11 together form a complete and efficient heat dissipation path. The heat starts from the core particle 2 5, passes through the lower filler sealing structure 8 to the ABF carrier board 3 and the window PCB board 7 in turn, and then passes through the thermal conductive potting glue layer 9 to the window, and then expands the heat dissipation area with the help of the copper layer 11, and finally dissipates to the external environment.

[0032] In some preferred embodiments of the present invention, the material of the seed layer 10 is gold. Gold is used as the material of the seed layer 10 and deposited on the back of the core particle 2 5 because gold has good chemical stability and excellent adhesion, so that the copper layer 11 can be tightly attached to the surface of the core particle 2 5 to avoid falling off, stratification, etc. during subsequent use.

[0033] In some preferred embodiments of the present invention, the height of the thermally conductive potting adhesive layer 9 is smaller than the thickness of the window PCB board 7 .

[0034] Example 4 See also Figure 4 A process method for a PCB window heat dissipation structure based on thermal conductive potting glue specifically comprises the following steps: Welding the core particle 1 to the front of the ABF carrier board 3 and welding the core particle 2 5 to the back of the ABF carrier board (3) to obtain an ABF carrier board module, and cleaning the welding residue of the ABF carrier board module; After the core particles 1 and 2 5 on the ABF carrier module are plasma treated, bottom filler is injected into the bottom of the core particle 1, the gap between the ABF carrier 3 and the window PCB board 7, and the bottom of the core particle 2 5, and the bottom filler is solidified to form a lower filler sealing structure 8, and the ABF carrier module is welded on the window PCB board to obtain a PCB board structure module after welding is completed, and the PCB board structure module is plasma cleaned; After the plasma cleaning of the PCB board structure module is completed, thermal conductive glue is injected into the window at the bottom of the PCB board structure module to encapsulate and wrap the core particle 2 5 at the bottom of the PCB board structure module, and a thermal conductive potting glue layer 9 is formed at the window of the window PCB board 7 to obtain a PCB window heat dissipation structure with thermal conductive potting glue.

[0035] Silk screen printing is added at the bottom window of the PCB board structure module to block the flow of glue when the PCB board structure module is filled at the bottom. The setting of silk screen printing can accurately control the flow range of the thermal conductive glue, avoid overflow or uneven distribution of the thermal conductive glue, and ensure that the thermal conductive glue layer 9 can form a suitable heat dissipation structure at the window.

[0036] Example 5 See also Figure 5 , welding the core particle 1 to the front of the ABF carrier board 3, welding the core particle 2 5 to the back of the ABF carrier board 3, obtaining the ABF carrier board module, and cleaning the welding residue of the ABF carrier board module, cleaning the welding residue can prevent impurities from affecting the heat conduction efficiency in subsequent steps; Plasma treatment is performed on the core particles 1 and 2 5 on the ABF carrier module to remove pollutants such as oxides and organic matter on the surface, increase surface energy, and make the surface of the core particles 1 and 2 5 more active, which is conducive to the infiltration and adhesion of the bottom filler to the chip surface. The bottom filler is injected into the bottom of the core particle 1, the gap between the ABF carrier board 3 and the window PCB board 7, and the bottom of the core particle 2 5. The bottom filler is solidified to form a bottom filler sealing structure 8. The bottom filler sealing structure enhances the mechanical connection strength between the chip and the carrier board, and between the carrier board and the PCB board, prevents the chip from being separated from the carrier board or damaged during thermal expansion and contraction, and ensures the stability of the heat dissipation path; The ABF carrier module is welded on the windowed PCB board and a PCB board structure module is obtained after the welding is completed, and the PCB board structure module is plasma cleaned; the physical structure of heat dissipation is further expanded, so that the heat can be more widely diffused through the windowed PCB board 7; After the plasma cleaning of the PCB board structure module is completed, a thermal conductive glue is injected into the window opening at the bottom of the PCB board structure module to encapsulate and wrap the core particle 2 5 at the bottom of the PCB board structure module, and a thermal conductive encapsulating glue layer 9 is formed at the window opening of the window PCB board 7 to obtain a PCB window heat dissipation structure with a thermal conductive encapsulating glue; A seed layer is sputtered on the surface of the encapsulated core particle 5, and a copper layer is formed on the surface of the seed layer by chemical deposition.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ABF carrier board heat dissipation structure with a window on a PCB, characterized in that: The invention comprises an ABF carrier board (3), wherein the front side of the ABF carrier board (3) is connected to a core particle 1 (1) via a copper column bump (2), and the back side of the ABF carrier board (3) is connected to a core particle 2 (5) via a copper column bump (2), a redistribution layer (4) is arranged between the copper column bumps (2), and the core particle 1 (1) and the core particle 2 (5) are connected via the redistribution layer (4) in the copper column bumps (2); a plurality of solder balls (6) are arranged on both sides of the back side of the ABF carrier board (3), and the back side of the ABF carrier board (3) is connected to a window PCB board (7) via the solder balls (6), and the core particle 2 (5) leaks out from the window of the window PCB board (7).

2. The ABF carrier board heat dissipation structure with a window on a PCB according to claim 1, characterized in that: The dynamic power consumption of the core particle 2 (5) is greater than the dynamic power consumption of the core particle 1 (1), and the core particle 2 (5) includes a GPU, an NPU, a SOC, and an FPGA.

3. The ABF carrier board heat dissipation structure with a window on a PCB according to claim 2, characterized in that: Core particle one (1) is a core particle that closely communicates and interacts with core particle two (5). Core particle one (1) includes Nor Flash, SRAM, and dynamic memory chips.

4. The ABF carrier board heat dissipation structure with a window on a PCB according to claim 1, characterized in that: A lower filling material sealing structure (8) is provided at the bottom of the core particle 1 (1), at the gap where the ABF carrier board (3) and the window PCB board (7) are connected, and at the bottom of the core particle 2 (5), forming a cofferdam structure with the window of the window PCB board (7), and a heat conductive potting glue layer (9) is provided at the window of the window PCB board (7).

5. The ABF carrier board heat dissipation structure with a window on a PCB according to claim 4, characterized in that: The height of the heat-conductive potting adhesive layer (9) is the same as the thickness of the window-opening PCB board (7).

6. The ABF carrier board heat dissipation structure with a window on a PCB according to claim 1, characterized in that: A lower filler sealing structure (8) is provided at the gap between the ABF carrier board (3) and the window PCB board (7) and at the bottom of the second core particle (5), forming a cofferdam structure with the window opening of the window PCB board (7). A heat conductive potting adhesive layer (9) is provided at the window opening of the window PCB board (7), the height of the heat conductive potting adhesive layer (9) being lower than the height of the second core particle (5). A seed layer (10) is deposited on the back of the second core particle (5), and a copper layer (11) is deposited on the seed layer (10).

7. The PCB window heat dissipation structure based on deposition process according to claim 6, characterized in that: The material of the seed layer (10) is gold.

8. The PCB window heat dissipation structure based on deposition process according to claim 6, characterized in that: The height of the heat-conductive potting adhesive layer (9) is less than the thickness of the window-opening PCB board (7).

9. A process method for a PCB window heat dissipation structure based on a thermally conductive potting adhesive as described in any one of claims 4 to 5, characterized in that: The following steps are involved: Welding the core particle 1 (1) to the front side of the ABF carrier board (3), and welding the core particle 2 (5) to the back side of the ABF carrier board (3) to obtain an ABF carrier board module, and cleaning the welding residue of the ABF carrier board module; After plasma treatment of the core particle 1 (1) and the core particle 2 (5) on the ABF carrier module, a bottom filler is injected into the bottom of the core particle 1 (1), the gap between the ABF carrier (3) and the window PCB (7), and the bottom of the core particle 2 (5), and the bottom filler is solidified to form a bottom filler sealing structure 8, and the ABF carrier module is welded on the window PCB to obtain a PCB board structure module after the welding is completed, and the PCB board structure module is plasma cleaned; After the plasma cleaning of the PCB board structure module is completed, a thermal conductive adhesive is injected into the bottom window of the PCB board structure module to encapsulate and wrap the second core particle (5) at the bottom of the PCB board structure module, and a thermal conductive encapsulating adhesive layer (9) is formed at the window of the window PCB board (7), thereby obtaining a PCB window heat dissipation structure with a thermal conductive encapsulating adhesive.

10. A process method for a PCB window heat dissipation structure based on a deposition process as claimed in any one of claims 6 to 8, characterized in that: The following steps are involved: Welding the core particle 1 (1) to the front side of the ABF carrier board (3), and welding the core particle 2 (5) to the back side of the ABF carrier board (3) to obtain an ABF carrier board module, and cleaning the welding residue of the ABF carrier board module; After plasma treatment of the core particle 1 (1) and the core particle 2 (5) on the ABF carrier module, a bottom filler is injected into the bottom of the core particle 1 (1), the gap between the ABF carrier (3) and the window PCB (7), and the bottom of the core particle 2 (5), and the bottom filler is solidified to form a bottom filler sealing structure 8, and the ABF carrier module is welded on the window PCB to obtain a PCB board structure module after the welding is completed, and the PCB board structure module is plasma cleaned; After plasma cleaning of the PCB structure module is completed, a thermally conductive adhesive is injected into the bottom window of the PCB structure module to encapsulate and wrap the second core particle (5) at the bottom of the PCB structure module; a thermally conductive encapsulating adhesive layer (9) is formed at the window of the window PCB board (7), thereby obtaining a PCB window heat dissipation structure with a thermally conductive encapsulating adhesive; A seed layer is sputtered on the surface of the encapsulated core particle 2 (5), and a copper layer is generated on the surface of the seed layer by chemical deposition.

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