MiniLED packaging technology and packaging structure

Abstract

The invention discloses a mini LED packaging technology and a mini LED packaging structure, and the mini LED packaging technology comprises the following steps: providing a solid crystal substrate, and enabling the solid crystal substrate to be fixedly provided with mini LED chips which are arranged in an array in a pasting manner; providing a fluorescent glue layer, wherein the fluorescent glue layer is used for modulating the light emitting color of the mini LED chip; a grid layer is provided, the grid layer is arranged on the front face of the die bonding substrate, and meshes of the grid layer coincide with the mini LED chips; and the fluorescent glue layer is laminated with the die bonding substrate through the grid layer, so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in meshes of the grid layer and are attached and fixed with the mini LED chip. According to the technical scheme, the display effect is improved, and the packaging stability and reliability are enhanced.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging technology, and in particular to a mini LED packaging process and packaging structure. Background Art

[0002] In the miniLED packaging process, the application of fluorescent film achieves high color gamut and high brightness light output by evenly dispersing fluorescent powder in silicone or epoxy resin and covering the blue LED chip. However, the existing fluorescent film packaging process still has significant defects: for example, the difference between the curing shrinkage rate of the fluorescent film and the thermal expansion coefficient of the substrate causes surface warping, which increases the surface roughness of the backlight panel and affects the touch screen bonding yield; the color temperature shift caused by the sedimentation of fluorescent powder and the increase in "haze" caused by interface light scattering reduce the display contrast. Summary of the invention

[0003] The purpose of the present invention is to provide a miniLED packaging process, aiming to solve some technical problems of the existing fluorescent film packaging process in the background technology.

[0004] To achieve this object, the present invention adopts the following technical solutions: A miniLED packaging process, the miniLED packaging process comprising the following steps: Providing a die-bonding substrate, on which miniLED chips arranged in an array are fixedly mounted; Providing a fluorescent glue layer, wherein the fluorescent glue layer is used to modulate the light emission color of the miniLED chip; Providing a grid layer, disposing the grid layer on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the miniLED chip; The fluorescent glue layer is pressed onto the die-bonding substrate through the grid layer, so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the mesh holes of the grid layer and are bonded and fixed to the mini LED chip.

[0005] Preferably, the step of providing a grid layer, arranging the grid layer on the front side of the die-bonding substrate, and overlapping the mesh holes of the grid layer with the mini LED chip comprises: Processing the composite material using a 3D printer to obtain a grid structure having uniform meshes, wherein the center distance between adjacent meshes is the same as the center distance between adjacent miniLED chips; Performing shaping processing on the grid structure to obtain the grid layer; Composite glue is coated on one side of the die-bonding substrate, the mesh layer is bonded to the die-bonding substrate, and the mini LED chip passes through the mesh hole.

[0006] Preferably, the step of coating a composite adhesive on one side of the die-bonding substrate, bonding the mesh layer to the die-bonding substrate, and passing the miniLED chip through the mesh hole comprises: After the miniLED chip is fixedly mounted on the die-bonding substrate, the composite adhesive is applied to the surface of the die-bonding substrate; Positioning the mesh layer according to its structure and size to ensure that the mesh holes overlap with the miniLED chip; Heating the die-bonding substrate to soften the composite adhesive; The grid layer is pressed, and UV curing is performed on one side of the grid layer to bond the grid layer to the die-bonding substrate.

[0007] Preferably, the step of heating the die-bonding substrate to melt the composite adhesive and bond the grid layer to the die-bonding substrate comprises: Continuously heating the die-bonding substrate at a temperature of 80° C. to 180° C. for a heating time of 10 seconds to 100 seconds to soften the composite adhesive; The step of laminating the grid layer and UV curing one side of the grid layer to bond the grid layer to the die-bonding substrate comprises: Using a pressing plate to press the grid layer and the solid crystal substrate layer; The grid layer is continuously irradiated with light of 365nm~405nm wavelength and 100~1000 mW / cm² light intensity for 10s~200s to bond the grid layer to the solid crystal substrate.

[0008] Preferably, the step of pressing the fluorescent glue layer to the die-bonding substrate through the grid layer so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the meshes of the grid layer and fixedly bonded to the miniLED chip comprises: Disposing the fluorescent glue layer above the grid layer; Using a preset tool, the fluorescent glue layer is passed through the mesh layer and pressed into the mesh holes of the mesh layer to obtain a plurality of fluorescent units; The fluorescent unit is cured so that the fluorescent unit is bonded and fixed to the surface of the mini LED chip.

[0009] Preferably, the step of curing the fluorescent unit so that the fluorescent unit is bonded and fixed to the surface of the miniLED chip comprises: The fluorescent unit is continuously irradiated with light of a wavelength of 365nm to 405nm and a light intensity of 100 to 1000 mW / cm² for a time of 10s to 200s, so that the fluorescent unit is bonded and fixed to the miniLED chip.

[0010] Preferably, the method further comprises the steps of: Coating a flexible protective layer on the fluorescent unit and the grid layer; The flexible protective layer is subjected to embossing treatment to obtain a flexible light-guiding layer with a light-guiding structure.

[0011] Preferably, the method further comprises the steps of: The surface of the flexible light-guiding layer having the light-guiding structure is subjected to a sol-gel process to obtain an anti-oxidation film.

[0012] The present invention further provides a miniLED packaging structure, which is manufactured by using any of the above-mentioned miniLED packaging processes; the miniLED packaging structure comprises: A die-bonding substrate, on which array-arranged miniLED chips are fixedly mounted; A grid layer, the grid layer is arranged on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the miniLED chip; A plurality of fluorescent units are housed in the meshes of the grid layer and are bonded and fixed to the mini LED chip.

[0013] Preferably, the miniLED packaging structure further includes: A flexible protective layer, the flexible protective layer is arranged above the fluorescent unit and the grid layer, and a light guide structure is formed on the upper surface of the flexible protective layer; An anti-oxidation film is disposed on the surface of the light-guiding structure.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The technical solution of the present invention divides the fluorescent glue layer into multiple fluorescent units through the design of the grid layer, and ensures that the fluorescent glue layer is tightly fitted to the miniLED chip, thereby reducing the warping phenomenon caused by the shrinkage of the fluorescent glue layer during the curing process and the difference in thermal expansion coefficient of the substrate, and ensuring the flatness of the backlight panel surface.

[0015] The grid layer effectively separates the fluorescent glue layer, avoids the sedimentation of the fluorescent powder, ensures the uniform distribution of the fluorescent glue layer, reduces the color temperature deviation caused by the sedimentation of the fluorescent powder, and thus improves the consistency and stability of the display.

[0016] Furthermore, through the structural design of the grid layer, the fluorescent glue layer can be evenly separated, avoiding thickness unevenness, thereby reducing light scattering, reducing the "haze" phenomenon, and improving display contrast. The fluorescent glue layer is fixed to the miniLED chip through the grid layer lamination, which enhances the stability of the package and improves the overall reliability of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 This is a schematic diagram of the process flow of the first embodiment of the miniLED packaging process of the present invention; Figure 2 This is a schematic diagram of the process flow of the second embodiment of the miniLED packaging process of the present invention; Figure 3 for Figure 2 A schematic diagram of a flow chart of an embodiment of step S33; Figure 4 This is a schematic diagram of the process flow of the third embodiment of the miniLED packaging process of the present invention; Figure 5 This is a schematic diagram of the process flow of the fourth embodiment of the miniLED packaging process of the present invention; Figure 6 It is a schematic diagram of the structure of the fluorescent adhesive layer of the present invention when it is pressed; Figure 7 This is a schematic diagram of the structure of a miniLED packaging structure according to an embodiment of the present invention; Figure 8 This is a schematic diagram of another embodiment of the miniLED packaging structure of the present invention; Illustrations: 100, miniLED packaging structure; 110, die-bonding substrate; 111, substrate; 112, miniLED chip; 120, grid layer; 130, fluorescent glue layer; 131, fluorescent unit; 140, flexible protective layer; 141, light guide structure; 150, anti-oxidation film; 20, preset tools. DETAILED DESCRIPTION

[0020] In order to make the technical purpose, features and advantages of the present invention more obvious and easy to understand, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] An embodiment of the present invention provides a mini LED packaging process.

[0024] First embodiment: See also Figure 1 , is a schematic diagram of a process flow of a miniLED packaging process according to an embodiment of the present invention, wherein the miniLED packaging process comprises the following steps: Step S1, providing a die-bonding substrate 110, wherein the die-bonding substrate 110 is fixedly mounted with array-arranged mini LED chips 112; See also Figure 6 and Figure 7The solid crystal substrate 110 refers to a substrate 111 carrying a miniLED chip 112, wherein the substrate 111 is usually made of a material with good thermal conductivity and mechanical strength, such as ceramic, silicon or metal. The function of the substrate 111 is to provide a stable support for the miniLED chip 112 and ensure that it can be reliably soldered on the substrate 111. The miniLED chip 112 is used as a light source for emitting light or backlighting display. The array arrangement ensures that the spacing and position between each miniLED chip 112 are accurate, which is beneficial to the uniformity of the light source and the display effect.

[0025] Step S2, providing a fluorescent glue layer 130, wherein the fluorescent glue layer 130 is used to modulate the light emission color of the mini LED chip 112; Please continue reading Figure 6 , Figure 7 and Figure 8 The fluorescent glue layer 130 is a film or gel made of a colloidal substance containing fluorescent powder. The function of the fluorescent glue layer 130 is to change the color output by adjusting the wavelength of the blue light or purple light emitted by the miniLED chip 112. The fluorescent glue layer 130 is made of materials such as silicone or epoxy resin, and the fluorescent powder is evenly dispersed. After the fluorescent glue layer 130 covers the surface of the miniLED chip 112, it can convert blue light or purple light into light of different colors to meet different display requirements, enhance the color gamut and brightness of the display screen, and optimize the visual effect. Preferably, the fluorescent glue layer 130 is gel-like.

[0026] Step S3, providing a mesh layer 120, and disposing the mesh layer 120 on the front surface of the die-bonding substrate 110, and the mesh holes of the mesh layer 120 overlap with the mini LED chip 112; See also Figure 6 and Figure 7 The grid layer 120 refers to a laminated structure composed of a structure with uniform mesh holes. The grid layer 120 is arranged between the miniLED chip 112 and the fluorescent glue layer 130 to provide physical support, position accuracy and heat conduction. The grid layer 120 is usually made of a material with appropriate hardness, such as plastic or metal or a composite of metal and plastic, and the grid layer 120 can be accurately manufactured by methods such as three-dimensional printing to ensure the uniformity and accuracy of the mesh holes. The grid layer 120 is arranged on the front side of the solid crystal substrate 110, and its mesh holes are precisely aligned with the arrangement of the miniLED chips 112. The position of each mesh hole corresponds to a miniLED chip 112 to ensure that each miniLED chip 112 is tightly fitted and reliably supported by the corresponding fluorescent glue layer 130 unit.

[0027] In step S4 , the fluorescent glue layer 130 is pressed onto the die-bonding substrate 110 through the mesh layer 120 , so that the fluorescent glue layer 130 is divided into a plurality of fluorescent units 131 , and the fluorescent units 131 are received in the mesh holes of the mesh layer 120 and are bonded and fixed to the mini LED chip 112 .

[0028] See also Figure 6 and Figure 7 , pressing means that the fluorescent glue layer 130 is tightly combined with the solid crystal substrate 110 through the mesh holes of the grid layer 120 by applying mechanical pressure or a scraper, and the fluorescent glue layer 130 is divided into multiple small units under the action of the grid layer 120, ensuring that each fluorescent unit 131 can correspond to a miniLED chip 112. After the fluorescent glue layer 130 is pressed into the mesh holes of the grid layer 120, each fluorescent unit 131 is fixed in the mesh holes and fits with the corresponding miniLED chip 112. Thereby improving the overall quality of the package. The bonding of the fluorescent glue layer 130 and the miniLED chip 112 ensures that the fluorescent glue layer 130 will not be displaced or deformed during the curing process, ensuring the consistency and stability of the light output.

[0029] Therefore, in this embodiment, the fluorescent glue layer 130 is divided into a plurality of fluorescent units 131 through the design of the grid layer 120, and the fluorescent glue layer 130 is ensured to be closely attached to the miniLED chip 112, thereby reducing the warping phenomenon caused by the difference in thermal expansion coefficients of the fluorescent glue layer 130 and the substrate 111 during the curing process due to shrinkage, and ensuring the flatness of the backlight surface. The grid layer 120 effectively separates the fluorescent glue layer 130, avoids the sedimentation of the fluorescent powder, ensures the uniform distribution of the fluorescent glue layer 130, reduces the color temperature deviation caused by the sedimentation of the fluorescent powder, and thus improves the consistency and stability of the display.

[0030] Furthermore, through the structural design of the grid layer 120, the fluorescent glue layer 130 can be evenly separated, avoiding thickness unevenness, thereby reducing light scattering, reducing the "haze" phenomenon, and improving display contrast. The fluorescent glue layer 130 is fixed to the miniLED chip 112 by pressing the grid layer 120, which enhances the stability of the package and improves the overall reliability of the package.

[0031] Second embodiment: Please refer to Figure 2 , based on the above first embodiment, the step S3 includes: Step S31, using a 3D printer to process the composite material to obtain a grid structure having uniform meshes, wherein the center distance between adjacent meshes is the same as the center distance between adjacent miniLED chips 112; It is understandable that in this step, the composite material is processed by three-dimensional printing technology to manufacture a grid structure. The grid structure has evenly distributed meshes, and the center spacing of each mesh is the same as the center spacing of the miniLED chip 112. This ensures that the grid structure can be accurately docked with the miniLED chip 112, and ensures the correspondence between the fluorescent glue layer 130 and the chip after separation, so that each mesh can accurately accommodate a fluorescent unit 131. Optionally, the composite material is a mixture of epoxy resin material, alumina, photosensitive material, etc., and the grid layer 120 can not only play a supporting role, but also improve the heat conduction efficiency.

[0032] Step S32, performing shaping processing on the grid structure to obtain the grid layer 120; In this step, the mesh structure is subjected to a shaping process, that is, the mesh structure is stably formed by UV curing or cooling, etc., to achieve the desired size and shape, thereby obtaining the final mesh layer 120. The shaping process ensures that the size and structure of the mesh layer 120 will not affect the subsequent packaging process due to deformation in the external environment or during processing.

[0033] Step S33 , coating a composite adhesive on one side of the die-bonding substrate 110 , bonding the mesh layer 120 to the die-bonding substrate 110 , and allowing the mini LED chip 112 to pass through the mesh holes.

[0034] In this step, a composite adhesive is applied to the surface of the die-bonding substrate 110, and then the mesh layer 120 is bonded to the die-bonding substrate 110. The purpose of applying the composite adhesive is to ensure that the mesh layer 120 is firmly attached to the surface of the substrate 111, while allowing the miniLED chip 112 to pass through the mesh of the mesh layer 120. This process ensures that the position of the mesh layer 120 is stable. Optionally, the composite adhesive is a light-curing adhesive or a common hot-melt adhesive.

[0035] Based on the above second embodiment, step S33 includes: Step S331, after the mini LED chip 112 is fixedly mounted on the die-bonding substrate 110, the composite adhesive is coated on the surface of the die-bonding substrate 110; Specifically, the composite glue is a glue that can provide good bonding strength. The purpose of applying the composite glue is to provide adhesion for the next step of bonding the grid layer 120 to the die-bonding substrate 110. Before the die-bonding substrate 110 fixes the miniLED chip 112, applying the composite glue can ensure that the grid layer 120 is firmly bonded to the substrate 111 in subsequent operations, avoiding deviation or looseness during the lamination process. In this embodiment, the composite glue is a hot melt light-curing glue.

[0036] Specifically, the composite glue can melt when heated to initially bond the die-bonding substrate 110 to the grid layer 120. After cooling, it can be temporarily cured to provide initial bonding strength, and finally, under UV light, the glue will be finally cured to form a permanent bond.

[0037] It is understandable that when the composite adhesive is a hot melt adhesive, the miniLED chip 112 easily generates heat during operation, which easily leads to poor thermal stability of the miniLED packaging structure. If the composite adhesive is a light-curing adhesive, the light-curing adhesive cures quickly, resulting in poor bonding yield between the grid layer 120 and the die-bonding substrate 110.

[0038] Optionally, the composite adhesive may be coated on the surface of the die-bonding substrate 110 before the die-bonding substrate 110 fixes and mounts the miniLED chip 112 , thereby reducing contamination of the miniLED chip 112 .

[0039] Step S332, positioning the mesh layer 120 according to its structure and size to ensure that the mesh holes overlap with the mini LED chip 112; It is understandable that the purpose of this step is to ensure that each mesh accurately corresponds to a miniLED chip 112, to ensure that when the fluorescent glue layer 130 is subsequently separated, the correspondence between each fluorescent unit 131 and the miniLED chip 112 is accurate, and to avoid uneven or unstable distribution of the fluorescent glue layer 130.

[0040] Step S333, heating the die-bonding substrate 110 to soften the composite adhesive; It is understandable that the temporarily cured composite adhesive can better react with the mesh layer 120 and the surface of the die-bonding substrate 110 after softening, thereby providing more reliable bonding.

[0041] Step S334 , laminating the mesh layer 120 , and UV curing one side of the mesh layer 120 , so that the mesh layer 120 is bonded to the die-bonding substrate 110 .

[0042] The mesh layer 120 is pressed together with the die-bonding substrate 110 by applying pressure to ensure a tight fit between the mesh layer 120 and the die-bonding substrate 110. UV light curing is used to make the bonding between the mesh layer 120 and the substrate 111 even stronger. UV curing cures the composite adhesive by irradiating ultraviolet light of a specific wavelength, thereby enhancing the bonding strength and ensuring that the mesh layer 120 maintains a stable position during the entire packaging process.

[0043] Furthermore, the step S333 includes: Step S3331, continuously heating the die-bonding substrate 110 at a temperature of 80°C to 180°C for a heating time of 10s to 100s to soften the composite adhesive; Specifically, a heating plate may be provided below the die-bonding substrate 110 to heat-melt the composite adhesive, or a hot air gun may be used to heat-melt the composite adhesive.

[0044] The step S334 includes: Step S3341, using a pressing plate to press the grid layer 120 and the die-bonding substrate 110; Step S3342: Continuously irradiate the grid layer 120 with light having a wavelength of 365 nm to 405 nm and a light intensity of 100 to 1000 mW / cm² for a irradiation time of 10 s to 200 s, so that the grid layer 120 is bonded to the die-bonding substrate 110.

[0045] It is understandable that the UV-cured composite adhesive is converted into an irreversible solid state, thereby being able to show a more stable connection.

[0046] Third embodiment: Based on the first embodiment or the second embodiment, step S4 includes: Step S41, disposing the fluorescent glue layer 130 on the grid layer 120; Step S42, using a preset tool 20 to pass the fluorescent glue layer 130 through the mesh layer 120 and press it into the mesh holes of the mesh layer 120 to obtain a plurality of fluorescent units 131; In this step, the fluorescent glue layer 130 is pressed into the mesh of the grid layer 120 by using a stamp or a mechanical scraper. The purpose of this operation is to separate the fluorescent glue layer 130 into multiple small units, each of which can accurately fill a mesh, thereby ensuring the uniform distribution of the fluorescent units 131 and docking with the miniLED chip 112. When implementing this step, it is necessary to ensure that the pressure is evenly distributed to avoid excessive lamination causing the adhesive film to overflow or be too thin, affecting the separation effect. This process requires precise control of pressure and position to ensure that each fluorescent unit 131 is completely contained in the mesh and in close contact with the grid layer 120 and the miniLED chip 112; Step S43 , curing the fluorescent unit 131 so that the fluorescent unit 131 is bonded and fixed to the surface of the mini LED chip 112 .

[0047] In this step, the purpose of curing the fluorescent units 131 is to ensure that they are firmly bonded to the surface of the miniLED chip 112 to achieve stable optical performance and effective light emission regulation. The curing process is usually completed by heating or UV curing.

[0048] Specifically, it is first necessary to ensure that the fluorescent unit 131 is evenly distributed and its surface is in perfect contact with the miniLED chip 112. Subsequently, curing is performed by heating or irradiating ultraviolet rays of a specific wavelength. The heating can be performed at a temperature range of 80°C to 150°C, and the duration is generally 40 seconds to 100 seconds. The specific time and temperature depend on the characteristics of the fluorescent material used.

[0049] Optionally, if UV curing is adopted, it is necessary to use an ultraviolet lamp with a corresponding wavelength to irradiate the fluorescent unit 131, and control the irradiation time at the same time, so that the photosensitive components in the fluorescent material undergo a curing reaction and form a strong adhesive layer.

[0050] It can be understood that through this curing step, the fluorescent unit 131 can be firmly attached to the surface of the miniLED chip 112, ensuring long-term stable light emission, reducing the problem of uneven light emission that may be caused by poor physical contact, and improving the overall performance and reliability of the display.

[0051] Preferably, the step S43 includes: Step S431, using light with a wavelength of 365nm~405nm and a light intensity of 100~1000 mW / cm2 to continuously irradiate the fluorescent unit 131 for 10s~200s, so that the fluorescent unit 131 and the miniLED chip 112 are bonded and fixed.

[0052] It is understandable that the use of UV curing can improve the environmental adaptability and optical performance of the miniLED packaging structure, and ensure the stability of the miniLED packaging structure 100 during long-term use. It is also understandable that both the fluorescent unit 131 and the composite glue require UV curing, so the curing process of the fluorescent unit 131 reduces equipment costs and achieves efficient use of equipment.

[0053] Fourth embodiment: Based on any of the above embodiments, the miniLED packaging process further includes: Step S5, coating a flexible protective layer 140 on the fluorescent unit 131 and the mesh layer 120; In this step, a flexible protective layer 140 needs to be coated on top of the fluorescent unit 131 and the mesh layer 120. The function of the flexible protective layer 140 is to protect the fluorescent unit 131 and the mesh layer 120 from damage by the external environment, such as moisture, dust, mechanical shock, etc. The flexible protective layer 140 is usually made of a flexible material, such as a flexible plastic film, a polyester film or other transparent polymer material. During implementation, it should be ensured that the coating is uniform and the coverage is sufficient to protect the entire fluorescent unit 131 and the mesh layer 120. The coating process can use spraying, coating or other coating methods to ensure the uniformity of the protective layer and avoid bubbles or defects, so as to ensure the effect in subsequent steps.

[0054] Step S6 , performing an embossing process on the flexible protective layer 140 to obtain a flexible light guide layer with a light guide structure 141 .

[0055] In this step, the flexible protective layer 140 is processed by an embossing process to form a flexible light-guiding layer with a light-guiding structure 141. The purpose of the light-guiding structure 141 is to guide light and optimize light output, making its distribution more uniform, thereby improving the display effect. The embossing process usually uses a mold and mechanical pressure to press a specific light-guiding pattern into the flexible protective layer 140. During implementation, the pattern design of the mold needs to determine the shape and size of the light-guiding structure 141 according to actual needs, such as microstructures, optical lenses, or concave and convex surfaces. The temperature, pressure, and time need to be precisely controlled during the embossing process to ensure the clarity and stability of the light-guiding pattern. Through this process, the flexible protective layer 140 can not only protect the internal components, but also effectively control the propagation path of light, thereby improving the display effect and brightness uniformity.

[0056] Furthermore, the miniLED packaging process also includes: Step 7: Using a sol-gel process on the surface of the flexible light guide layer formed with the light guide structure 141 to obtain an anti-oxidation film 150 .

[0057] In this step, an anti-oxidation film 150 is formed on the surface of the flexible light-guiding layer by a sol-gel process. The main function of the anti-oxidation film 150 is to prevent oxygen and moisture in the environment from causing oxidative damage to the material on the surface of the flexible light-guiding layer, thereby improving its stability and durability in long-term use. It should be noted that in the specific implementation, a sol-gel solution needs to be prepared first, which is usually composed of a metal oxide precursor (such as silicon dioxide, titanium dioxide, etc.) and a solvent (such as alcohols, acids). The sol-gel solution will form a thin film under specific environmental conditions (such as temperature and humidity control).

[0058] During the implementation process, the sol-gel solution is evenly coated on the surface of the flexible light-guiding layer that has formed the light-guiding structure 141. This process can be completed by spraying, dipping or spin coating to ensure the uniformity and thickness consistency of the sol-gel coating. After the coating is completed, it needs to be properly heated, usually baked or dried at a temperature range of 120°C to 200°C, so that the solvent in the sol-gel evaporates and the metal oxide precursor forms a solid anti-oxidation film 150. This film layer can not only effectively resist oxidation, but also improve the wear resistance and corrosion resistance of the light-guiding layer to a certain extent, further enhancing the reliability and service life of the package.

[0059] Through this process, the anti-oxidation film 150 can effectively protect the light guide layer, improve the environmental adaptability and optical performance of the package, and ensure the stability of the miniLED display during long-term use.

[0060] See also Figure 7 and Figure 8 The embodiment of the present invention further provides a miniLED packaging structure 100, which is manufactured by any of the miniLED packaging processes described above; the miniLED packaging structure 100 includes: A die-bonding substrate 110 , on which mini LED chips 112 arranged in an array are fixedly mounted; A mesh layer 120 , wherein the mesh layer 120 is disposed on the front surface of the die-bonding substrate 110 , and the mesh holes of the mesh layer 120 overlap with the mini LED chip 112 ; A plurality of fluorescent units 131 are received in the meshes of the mesh layer 120 and are attached and fixed to the mini LED chip 112 .

[0061] Specifically, the miniLED packaging structure 100 improves the display effect of the miniLED packaging structure 100 by setting a solid crystal substrate 110, a grid layer 120 and a plurality of fluorescent units 131 and by coordinating the functions of various features. First, the solid crystal substrate 110 provides a stable support and fixation for the miniLED chip 112, so that the entire packaging structure can maintain stability during long-term use, and the array-arranged miniLED chips 112 ensure uniform light source distribution and optimize the uniformity of light output. The grid layer 120 is precisely designed to ensure the precise docking between the fluorescent unit 131 and the miniLED chip 112, avoiding the color temperature shift or uneven light emission caused by uneven adhesive film, thereby improving the light conversion efficiency and the color consistency of the display. At the same time, the multiple fluorescent units 131 are tightly fitted with the miniLED chip 112, which enhances the reliability of the packaging structure, reduces light loss, and further improves the stability of the display effect.

[0062] Furthermore, if Figure 8 As shown, the mini LED packaging structure 100 further includes: A flexible protective layer 140, wherein the flexible protective layer 140 is disposed above the fluorescent unit 131 and the grid layer 120, and a light guide structure 141 is formed on an upper surface of the flexible protective layer 140; The anti-oxidation film 150 is disposed on the surface of the light guide structure 141 .

[0063] Optionally, the cross section of the light guide structure 141 is a continuously arranged triangular cross section. It can be understood that the arrangement of the light guide structure 141 can improve the left and right lateral light emission effect and improve the display quality of the miniLED.

[0064] It is understandable that the provision of the flexible protective layer 140 not only protects the fluorescent unit 131 and the grid layer 120 from being damaged by the external environment, but also the light-guiding structure 141 formed on its surface can effectively guide the light, making the light distribution more uniform, further improving the display effect. The addition of the antioxidant film 150 can prevent the corrosion of the light-guiding structure 141 by oxygen and moisture, thereby improving the durability of the packaging structure in high temperature and humid environments, ensuring the stability of the packaging material in long-term use, and avoiding the degradation of optical performance caused by oxidation. Through the combination of these features, this packaging structure not only improves the optical performance, but also enhances its ability to resist environmental factors, ensuring the long-term stable operation of the miniLED backlight or display system in a complex environment, and significantly improving the display quality and service life.

[0065] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A miniLED packaging process, characterized in that: The miniLED packaging process includes the following steps: Providing a die-bonding substrate, on which array-arranged miniLED chips are fixedly mounted; Providing a fluorescent glue layer, wherein the fluorescent glue layer is used to modulate the light emission color of the miniLED chip; Providing a grid layer, disposing the grid layer on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the mini LED chip; The fluorescent glue layer is pressed onto the die-bonding substrate through the grid layer, so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the mesh holes of the grid layer and are bonded and fixed to the miniLED chip.

2. The miniLED packaging process according to claim 1, characterized in that: The step of providing a grid layer, disposing the grid layer on the front side of the die-bonding substrate, and overlapping the mesh holes of the grid layer with the mini LED chip comprises: Processing the composite material using a 3D printer to obtain a grid structure having uniform meshes, wherein the center distance between adjacent meshes is the same as the center distance between adjacent miniLED chips; Performing shaping processing on the grid structure to obtain the grid layer; Composite glue is coated on one side of the die-bonding substrate, the mesh layer is bonded to the die-bonding substrate, and the mini LED chip passes through the mesh hole.

3. The miniLED packaging process according to claim 2, characterized in that: The step of coating a composite adhesive on one side of the die-bonding substrate, bonding the mesh layer to the die-bonding substrate, and passing the miniLED chip through the mesh hole comprises: After the miniLED chip is fixedly mounted on the die-bonding substrate, the composite adhesive is applied to the surface of the die-bonding substrate; Positioning the mesh layer according to its structure and size to ensure that the mesh holes overlap with the miniLED chip; Heating the die-bonding substrate to soften the composite adhesive; The grid layer is pressed, and UV curing is performed on one side of the grid layer to bond the grid layer to the die-bonding substrate.

4. The miniLED packaging process according to claim 2, characterized in that: The step of heating the solid crystal substrate to melt the composite adhesive and bond the grid layer to the solid crystal substrate comprises: Continuously heating the die-bonding substrate at a temperature of 80° C. to 180° C. for a heating time of 10 seconds to 100 seconds to soften the composite adhesive; The step of laminating the grid layer and UV curing one side of the grid layer to bond the grid layer to the die-bonding substrate comprises: Using a pressing plate to press the grid layer and the solid crystal substrate layer; The grid layer is continuously irradiated with light of 365nm~405nm wavelength and 100~1000 mW / cm² light intensity for 10s~200s to bond the grid layer to the solid crystal substrate.

5. The miniLED packaging process according to claim 4, characterized in that: The step of pressing the fluorescent glue layer to the die-bonding substrate through the grid layer so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the mesh holes of the grid layer and fixedly bonded to the mini LED chip comprises: Disposing the fluorescent glue layer above the grid layer; Using a preset tool, the fluorescent glue layer is passed through the mesh layer and pressed into the mesh holes of the mesh layer to obtain a plurality of fluorescent units; The fluorescent unit is cured so that the fluorescent unit is bonded and fixed to the surface of the mini LED chip.

6. The miniLED packaging process according to claim 5, characterized in that: The step of curing the fluorescent unit so that the fluorescent unit is bonded and fixed to the surface of the miniLED chip comprises: The fluorescent unit is continuously irradiated with light of a wavelength of 365nm to 405nm and a light intensity of 100 to 1000 mW / cm² for a time of 10s to 200s so that the fluorescent unit is bonded and fixed to the miniLED chip.

7. The miniLED packaging process according to any one of claims 1 to 6, characterized in that: Also includes the steps: Coating a flexible protective layer on the fluorescent unit and the grid layer; The flexible protective layer is subjected to embossing treatment to obtain a flexible light-guiding layer with a light-guiding structure.

8. The miniLED packaging process according to claim 7, characterized in that: Also includes the steps: The surface of the flexible light-guiding layer having the light-guiding structure is subjected to a sol-gel process to obtain an anti-oxidation film.

9. A miniLED packaging structure, characterized in that: The miniLED packaging structure is manufactured by the miniLED packaging process described in any one of claims 1 to 8; the miniLED packaging structure comprises: A die-bonding substrate, on which array-arranged miniLED chips are fixedly mounted; A grid layer, the grid layer is arranged on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the miniLED chip; A plurality of fluorescent units are housed in the meshes of the grid layer and are bonded and fixed to the mini LED chip.

10. The miniLED packaging structure according to claim 9, characterized in that: Also includes: A flexible protective layer, the flexible protective layer is arranged above the fluorescent unit and the grid layer, and a light guide structure is formed on the upper surface of the flexible protective layer; An anti-oxidation film is disposed on the surface of the light-guiding structure.

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