PCB assembly including thermal module

Abstract

A PCB assembly according to one embodiment includes: a first circuit board; the electronic component is arranged on the first circuit board; a second circuit board connected to the first circuit board; a thermal module configured to absorb heat from the electronic component; and a pressurization structure configured to apply a preload to the thermal module in a direction toward the electronic component, where the pressurization structure may be supported on the first circuit board or the external structure while being separated from the second circuit board.

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board (PCB) assembly including a thermal module. Background Art

[0002] As technology develops, the hardware performance of electronic devices has been improved, and the size of electronic devices has been miniaturized. For example, for components such as the central processing unit (CPU) or application processor (AP) of an electronic device, products with hundreds of Mhz units were used in the past. However, recently, products with Ghz units have been used and launched.

[0003] A printed circuit board (PCB) assembly including high-performance electronic components may require a high-performance circuit board for driving the electronic components, and thus, the cost of the components may increase.

[0004] That is, high-performance electronic components may accelerate heating problems, and since the PCB assembly or an electronic device including the PCB assembly may be overheated, a portion of performance may be deteriorated or internal components may be damaged.

[0005] However, the foregoing description should not be construed as an admission by the applicant that it is prior art with respect to the description herein, and should be construed as the only art relevant to the invention described herein. Summary of the invention

[0006] A printed circuit board (PCB) assembly is provided, which can be formed by integrating a high-specification circuit board on which electronic components (such as a central processing unit (CPU), a memory, or a graphic element) are arranged with a relatively low-specification circuit board. The provided PCB assembly integrating different circuit boards can ensure cost competitiveness and can be conducive to miniaturization of the PCB assembly.

[0007] A PCB assembly is provided that includes a thermal module for controlling the temperature of an electronic component.

[0008] Technical objectives to be achieved by the embodiments of the present disclosure are not limited to those described above, and other technical objectives not mentioned above are clearly understood by those of ordinary skill in the art from the following description.

[0009] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0010] According to one aspect of the present disclosure, a PCB assembly may include a first circuit board, an electronic component disposed on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure configured to apply a preload to the thermal module in a direction toward the electronic component, wherein the pressurizing structure may be separated from the second circuit board and may be supported by the first circuit board or an external structure.

[0011] According to one aspect of the present disclosure, a PCB assembly may include a first circuit board, an electronic component disposed on the first circuit board, a thermal module configured to absorb heat from the electronic component, and a pressurizing structure disposed between the thermal module and the electronic component and configured to apply a preload to the thermal module, wherein the pressurizing structure may be separated from the second circuit board and may be supported by an external structure by penetrating the first circuit board.

[0012] According to one aspect of the present disclosure, a PCB assembly may include a first circuit board, an electronic component disposed on the first circuit board, a second circuit board connected to the first circuit board, a thermal module configured to absorb heat from the electronic component, a bracket connected to the thermal module and fixed to the first circuit board, a first fixing member disposed on the first circuit board and supported by the first circuit board, a second fixing member disposed on the bracket and fixing the bracket to the first fixing member, and a pressurizing structure disposed between the bracket and the second fixing member and configured to apply a preload to the thermal module in a direction toward the electronic component, wherein the pressurizing structure can be separated from the second circuit board and can be supported by the first circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0014] Figure 1 is a diagram of an electronic device in a network environment according to an embodiment;

[0015] Figure 2a is a front perspective view of an electronic device according to an embodiment;

[0016] Figure 2b is a rear perspective view of an electronic device according to an embodiment;

[0017] Figure 2c is an exploded perspective view of an electronic device according to an embodiment;

[0018] Figure 3 is a cross-sectional view of a printed circuit board (PCB) assembly according to an embodiment;

[0019] Figure 4 is a cross-sectional view of a PCB assembly according to an embodiment;

[0020] Figure 5 is a cross-sectional view of a PCB assembly according to an embodiment;

[0021] Figure 6 is a cross-sectional view of a PCB assembly according to an embodiment;

[0022] Figure 7a is a perspective view of an electronic device according to an embodiment;

[0023] Figure 7b is an exploded perspective view of a first housing of an electronic device according to an embodiment;

[0024] Figure 8a is a cross-sectional view of a PCB assembly in a disassembled state according to an embodiment;

[0025] Figure 8b is a cross-sectional view of a PCB assembly according to an embodiment;

[0026] Fig. 9 is a cross-sectional view of a PCB assembly according to an embodiment;

[0027] Fig.10 is a cross-sectional view of a PCB assembly according to an embodiment;

[0028] Fig.11 is a cross-sectional view of a PCB assembly according to an embodiment; and

[0029] Fig.12 is a cross-sectional view of a PCB assembly according to an embodiment. DETAILED DESCRIPTION

[0030] Hereinafter, example embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the accompanying drawings, and their redundant descriptions will be omitted. The embodiments described herein are example embodiments, and therefore, the present disclosure is not limited thereto, and may be implemented in various other forms. It should be understood that unless the context clearly dictates otherwise, singular forms include plural referents. Terms including technical or scientific terms used in the present disclosure may have the same meanings as those generally understood by those skilled in the art.

[0031] It should be understood that the various exemplary embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific exemplary embodiments, and include various changes, equivalents or replacements of the corresponding exemplary embodiments. In conjunction with the description of the accompanying drawings, the same reference numerals may be used for similar or related parts. It should be understood that, unless otherwise clearly stated in the relevant context, the singular form of the noun corresponding to the project may include one or more things. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "A, B or C" may include any one of the items listed together in the corresponding one in the phrase, or all possible combinations thereof. Terms such as "first", "second" or "first" or "second" may be used simply to distinguish a component from other components discussed, and do not limit the component in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being "coupled", "coupled to", "connected to" or "connected to" another element (e.g., the second element) with or without the term "operably" or "communicatively", it means that the element can be coupled to the other element directly (e.g., by wire), wirelessly, or via a third element.

[0032] As used in conjunction with various example embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component or its smallest unit or portion suitable for performing one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0033] Various example embodiments as described herein may be implemented as software (e.g., processor 120) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138), which may be read by a machine (e.g., an electronic device). For example, a processor of a machine (e.g., an electronic device) may call at least one of the one or more instructions stored in the storage medium and execute it. This allows the machine to be operated to perform at least one function according to at least one of the called instructions. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply indicates that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between a case where data is semi-permanently stored in a storage medium and a case where data is temporarily stored in a storage medium.

[0034] According to example embodiments, the methods according to various example embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or via an application store (e.g., PlayStore). TM ) online distribution (e.g., download or upload), or directly between two user devices (e.g., smart phones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, an application store's server, or a relay server.

[0035] According to an embodiment, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some of the multiple entities may be individually arranged in different components. According to an embodiment, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various example embodiments, the integrated component may still perform one or more functions of each component in the multiple components in the same or similar manner as performed by a corresponding one of the multiple components before integration. According to various example embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the operations may be performed or omitted in a different order, or one or more other operations may be added.

[0036] Figure 11 is a block diagram showing an electronic device 101 in a network environment 100 according to an embodiment. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components (eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (eg, display module 160).

[0037] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that may operate independently of the main processor 121 or in conjunction with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power or be specific to a designated function than the main processor 121. The auxiliary processor 123 may be implemented separately from the main processor 121 or as a part of the main processor 121.

[0038] The auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) instead of the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121 when the main processor 121 is in an active state (e.g., executing an application). According to one embodiment, the auxiliary processor 123 (e.g., ISP or CP) may be implemented as a part of another component (e.g., camera module 180 or communication module 190) related to the auxiliary processor 123 function. According to one embodiment, the auxiliary processor 123 (e.g., NPU) may include a hardware structure designated for artificial intelligence (AI) model processing. The AI ​​model may be generated by machine learning. Such learning may be performed by, for example, the electronic device 101 in which artificial intelligence is executed, or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The AI ​​model may include multiple artificial neural network layers. The artificial neural network may include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recursive neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. The AI ​​model may include, in addition or alternatively, a software structure in addition to a hardware structure.

[0039] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, input data or output data of software (e.g., the program 140) and commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0040] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0041] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing recordings. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0043] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to one embodiment, the display module 160 may include a touch sensor adapted to sense a touch, or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0044] The audio module 170 can convert sound into an electrical signal, and vice versa. According to one embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., electronic device 102 such as a speaker or earphone) directly or wirelessly connected to the electronic device 101.

[0045] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0046] The interface 177 may support one or more specified protocols for the electronic device 101 to be directly (e.g., by wire) or wirelessly coupled to an external electronic device (e.g., the electronic device 102). According to an example embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0047] The connection end 178 may include a connector, and the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to one embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module 179 may convert electrical signals into mechanical stimulation (eg, vibration or movement) or electrical stimulation, which may be recognized by the user via his or her tactile or kinesthetic sense. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0049] The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0050] The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a portion of a power management integrated circuit (PMIC).

[0051] The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors that can operate independently of the processor 120 (e.g., AP) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). The corresponding communication module among these communication modules can communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TMThe wireless communication module 192 may communicate with the external electronic device 104 via a wireless communication network (e.g., Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a remote communication network such as a traditional cellular network, a fifth generation (5G) network, a next generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the SIM 196 to identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0053] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., mmWave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an example embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0054] The antenna module 197 may send a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to one embodiment, another component other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197.

[0055] According to one embodiment, the antenna module 197 may form a millimeter wave antenna module. According to one embodiment, the millimeter wave antenna module may include a PCB, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the PCB and capable of supporting a specified high frequency band (e.g., millimeter wave frequency band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the PCB and capable of transmitting or receiving signals in the specified high frequency band.

[0056] At least some of the above components can be coupled to each other and transmit signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

[0057] According to one embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled to the second network 199. Each of the external electronic devices 102 and 104 may be a device of the same type or a different type as the electronic device 101. According to one embodiment, all or some of the operations to be performed by the electronic device 101 may be performed at one or more of the external electronic devices 102, 104, and 108. For example, if the electronic device 101 needs to automatically perform a function or service, or in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service without performing the function or service, or as a supplement to performing the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or an additional function or additional service related to the request, and may transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a part of the response to the request with or without further processing the result. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technology can be used. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or health care) based on 5G communication technology or IoT-related technologies.

[0058] The electronic device according to the embodiment may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance device. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0059] Figure 2a is a front perspective view of an electronic device 201 according to an embodiment. Figure 2b is a rear perspective view of the electronic device 201 according to the embodiment. Figure 2c is an exploded perspective view of an electronic device 201 according to an embodiment.

[0060] refer to Figure 2a to Figure 2c , the electronic device 201 in the embodiment (for example, Figure 1The electronic device 101 may include a housing 210 forming an exterior and accommodating components therein. The housing 210 may include a front surface 210a, a rear surface 210b, and a side surface 211c, and the side surface 211c surrounds an internal space between the front surface 210a and the rear surface 210b. The housing 210 may include a plurality of side surfaces 211c extending from the front surface 210a to the rear surface 210b, and the plurality of side surfaces 211c may include a lower side surface 211c-1, an upper side surface 211c-2, a right side surface 211c-3, and a left side surface 211c-4.

[0061] In an embodiment, the front surface 210a can be formed by a front plate 211a, at least a portion of which is substantially transparent. For example, the front plate 211a can include a polymer plate or a glass plate including at least one coating. In an embodiment, the rear surface 210b can be formed by a substantially opaque rear plate 211b.

[0062] For example, the rear plate 211b may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface 211c may be coupled to the front plate 211a and the rear plate 211b, and may be formed of a side member 240 comprising a metal and / or a polymer. In an embodiment, the rear plate 211b and the side member 240 may be integrally and seamlessly formed. In an embodiment, the rear plate 211b and the side member 240 may be formed of substantially the same material (e.g., aluminum).

[0063] In one embodiment, the front plate 211a may include a plurality of first peripheral regions 212a-1 that are rounded in a direction from at least one region of the front surface 210a toward the rear plate 211b and extend in one direction (e.g., + or -X axis direction), a plurality of second peripheral regions 212a-2 that are rounded in a direction from at least one region of the front surface 210a toward the rear plate 211b and extend in another direction (e.g., + or -Y axis direction), and a plurality of third peripheral regions 212a-3 that are rounded in a direction from at least one region of the front surface 210a toward the rear plate 211b and are disposed between the plurality of first peripheral regions 212a-1 and the plurality of second peripheral regions 212a-2.

[0064] In one embodiment, the rear panel 211b may include a plurality of fourth peripheral regions 212b-1 that are rounded in a direction from at least one region of the rear surface 210b toward the front panel 211a and extend in one direction (e.g., + or -X axis direction), a plurality of fifth peripheral regions 212b-2 that are rounded in a direction from at least one region of the rear surface 210b toward the front panel 211a and extend in another direction (e.g., + or -Y axis direction), and a plurality of sixth peripheral regions 212b-3 that are rounded in a direction from at least one region of the rear surface 210b toward the front panel 211a and are disposed between the plurality of fourth peripheral regions 212b-1 and the plurality of fifth peripheral regions 212b-2.

[0065] In an embodiment, the side member 240 may surround at least a portion of the inner space between the front surface 210a and the rear surface 210b. The side member 240 may include a first support structure 241 disposed on at least a portion of the side surface 211c and a second support structure 242 connected to the first support structure 241 to form a space for arranging components of the electronic device 201.

[0066] In an embodiment, the first support structure 241 may connect the periphery of the front plate 211a and the periphery of the rear plate 211b and surround the space between the first plate 211a and the second plate 211b, thereby forming a side surface 211c of the housing 210. In an embodiment, the second support structure 242 may be disposed inside (or in the main body portion) of the electronic device 201. The second support structure 242 may be formed integrally with the first support structure 241, or may be formed separately from the first support structure 241 and connected to the first support structure 241. In an embodiment, the first support structure 241 and / or the second support structure 242 may be a component of the housing 210.

[0067] In an embodiment, at least one PCB assembly 251 or 252 may be disposed in the second support structure 242. The second support structure 242 may be connected to a ground of the at least one PCB assembly 251 or 252, for example.

[0068] In an embodiment, the display 261 may be disposed on a first surface of the second support structure 242 (eg, Figure 2c The rear plate 211b may be disposed on a lower surface (surface in the +Z-axis direction) of the second support structure 242, and the rear plate 211b may be disposed on a second surface (eg, Figure 2c On the upper surface (the surface in the -Z-axis direction)).

[0069] In an embodiment, at least a portion of the side member 240 may be formed of a conductive material. For example, the first support structure 241 may be formed of a metal and / or a conductive polymer material. In an embodiment, the second support structure 242 may be formed of a metal and / or a conductive polymer material, similar to the first support structure 241.

[0070] In an embodiment, the rear plate 211b of the housing 210 may include a camera hole 275 to receive the second camera module 280b and the flash 280c, and the housing 210 may include a camera decoration 273 for protecting the second camera module 280b and the flash 280c. The camera decoration 273 may be coupled to the rear plate 211b and may be visually exposed to the outside of the housing 210 by being disposed on the camera hole 275.

[0071] In an embodiment, the electronic device 201 may include a display 261 (eg, Figure 1 In an embodiment, the display 261 may be disposed on the front surface 210a. In an embodiment, the display 261 may be exposed through at least a portion of the front plate 211a (e.g., a plurality of first peripheral regions 212a-1, a plurality of second peripheral regions 212a-2, and a plurality of third peripheral regions 212a-3). In an embodiment, the display 261 may have a shape substantially the same as a shape of an outer edge of the front plate 211a.

[0072] In an embodiment, an edge of the display 261 may substantially coincide with an outer edge of the front panel 211a. In an embodiment, the display 261 may include a touch sensing circuit, a pressure sensor for sensing the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus.

[0073] In an embodiment, the display 261 may include a screen display area 261a that is visually exposed and displays content through pixels or multiple units. In an embodiment, the screen display area 261a may include a sensing area 261a-1 and / or a camera area 261a-2. In this case, the sensing area 261a-1 may overlap with at least a portion of the screen display area 261a. The sensing area 261a-1 may allow for communication with a sensor module 276 (e.g., Figure 1 The sensing area 261a-1 may display content, such as the screen display area 261a that does not overlap with the sensing area 261a-1.

[0074] For example, the sensing area 261a-1 may display content when the sensor module 276 is not operating. The camera area 261a-2 may overlap at least one area of ​​the screen display area 261a. The camera area 261a-2 may allow transmission of images with the camera modules 280a and 280b (e.g., Figure 1 The camera area 261a-2 may display content, such as the screen display area 261a that does not overlap with the camera area 261a-2. For example, the camera area 261a-2 may display content when the camera module 280a or 280b is not operating.

[0075] In an embodiment, the electronic device 201 may include a sensor module 276. The sensor module 276 may sense a signal applied to the electronic device 201. The sensor module 276 may be positioned, for example, on the front surface 210a of the electronic device 201. The sensor module 276 may form a sensing area 261a-1 in at least a portion of the screen display area 261a. The sensor module 276 may receive an input signal transmitted through the sensing area 261a-1, and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, or ultrasound). As another example, the input signal may include a signal related to the user's biometric information (e.g., fingerprint, voice, etc.).

[0076] In an embodiment, the electronic device 201 may include camera modules 280a and 280b (eg, Figure 1 In one embodiment, the camera modules 280a and 280b may include a first camera module 280a and a second camera module 280b, and in an embodiment may further include a flash 280c.

[0077] In an embodiment, the first camera module 280a may be arranged to be exposed to the outside through the front surface 210a of the housing 210, and the second camera module 280b and the flash 280c may be arranged to be exposed through the rear surface 210b of the housing 210. In an embodiment, at least a portion of the first camera module 280a may be disposed in the housing 210 so as to be covered by the display 261. In an embodiment, the first camera module 280a may receive an optical signal transmitted through the camera area 261a-2. In an embodiment, the second camera module 280b may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). In an embodiment, the flash 280c may include a light emitting diode or a xenon lamp.

[0078] The electronic device 201 may include an input module 250 (eg, Figure 1The input module 250 may receive a manipulation signal of a user. The input module 250 may include, for example, at least one key input device that is disposed to be exposed on the side surface 211 c of the housing 210.

[0079] In an embodiment, the electronic device 201 may include a connection terminal 278 (e.g., Figure 1 In an embodiment, the connection end 278 may be disposed on the outer circumferential surface of the housing 210, and may be disposed on the lower surface 211c-1 of the electronic device 201, for example. Figure 2a Specifically, when in one direction (for example, Figure 2a When the electronic device 201 is observed in the +Y-axis direction (in the +Y-axis direction of the electronic device 201), the connection end 278 can be set on the central portion of the lower side surface 211c-1.

[0080] like Figure 2a and Figure 2b As shown, the connection terminal 278 may be provided on a side surface 211c of the housing 210 forming the exterior of the electronic device 201. However, in actual implementation, the example is not limited thereto, and at least a portion of the connection terminal 278 may be provided on the front surface 210a or the rear surface 210b of the housing 210 or may be provided inside the housing 210. For example, although not shown in the drawings, the housing 210 in the embodiment may include a cover for replacing the battery 289.

[0081] In an embodiment, the electronic device 201 may include a battery 289 (e.g., Figure 1 A battery 189) and at least one PCB assembly 251 or 252 including one or more PCBs.

[0082] In an embodiment, the electronic device 201 may include a plurality of PCB assemblies 251 and 252, and for example, the plurality of PCB assemblies 251 and 252 may be configured in two PCB assemblies spaced apart from each other. For example, the plurality of PCB assemblies 251, 252 may include a first PCB assembly 251 and a second PCB assembly 252.

[0083] The first PCB assembly 251 in the embodiment may be a main board of the electronic device 201 accommodated in the first board slot 242a of the second support structure 242 , and the second PCB assembly 252 may be a sub-board of the electronic device 201 accommodated in the second board slot 242b of the second support structure 242 .

[0084] In an embodiment, the battery 289 may be accommodated in a battery slot 245 of the second support structure 242 , the battery slot 245 being formed between the first plate slot 242 a and the second plate slot 242 b .

[0085] In an embodiment, in the PCB components 251 and 252, for example, Figure 2c The first PCB assembly 251 shown in FIG. 2 may be formed by integrating different PCBs, and the different PCBs may include a first circuit board 251 - 1 and a second circuit board 251 - 2 .

[0086] In an embodiment, the second circuit board 251-2 may include at least one electronic component 253, and may include various structures associated therewith (eg, Figure 3 thermal module 330 or pressurized structure 350).

[0087] In an embodiment, the electronic component 253 may include various circuits or some components for driving or controlling the electronic device 201. For example, the electronic component 253 may be an integrated circuit. The electronic component 253 may generate heat due to operation and may need to be cooled.

[0088] In an embodiment, the electronic component 253 may be a CPU (e.g., Figure 1 The processor 120 or main processor 121 ) or AP is an element for performing key operations of the electronic device 201 .

[0089] In an embodiment, the electronic component 253 may be a wireless communication circuit (e.g., Figure 1 The wireless communication circuit can communicate with, for example, an external device (e.g., Figure 1 The electronic device 201 may include an antenna (eg, Figure 1 The wireless communication circuit may be electrically connected to the antenna structure. The wireless communication circuit may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure. For example, PCB assembly 251 or 252 may include a ground, and the ground of PCB assembly 251 or 252 may be used as a ground for the antenna structure implemented using the wireless communication circuit. However, the example is not limited thereto, and the electronic component 253 may be a graphic component (e.g., Figure 1 part of the display module 160).

[0090] Hereinafter, the configuration and structure of the PCB assembly 300 in the embodiment are described based on the description of the electronic device 201. Hereinafter, in order to describe the electronic device 201, the description repeated with the electronic device 201 is omitted, and a part of the configuration or structure may be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art.

[0091] Figure 3 is a cross-sectional view of a PCB assembly 300 according to an embodiment.

[0092] refer to Figure 3 , PCB assembly 300 (e.g., Figure 2c The PCB assembly 251 may include a first circuit board 310 (eg, Figure 2c The first circuit board 251-1), the second circuit board 320 (for example, Figure 2c The second circuit board 251-2), the thermal module 330 and the pressurizing structure 350

[0093] In an embodiment, the PCB assembly 300 may be a PCB assembly 300 including different PCBs, wherein the first circuit board 310 is coupled or connected to the second circuit board 320. The first circuit board 310 and the second circuit board 320 may be separate circuit boards and may be connected to each other by a connection member 340, such as a soldering member.

[0094] In embodiments, the connection member 340 may physically couple the first circuit board 310 to the second circuit board 320 , or may electrically and communicatively connect the first circuit board 310 to the second circuit board 320 .

[0095] In an embodiment, the PCB assembly 300 may include an electronic component 311 (e.g., Figure 2c 311). However, the electronic component 311 described herein is only one of the various components included in the PCB assembly 300. In actual implementations, the PCB assembly 300 may include one or more electronic components of various types, structures, and arrangements.

[0096] For example, the electronic component 311 may refer to a component that needs thermal protection or temperature control by the thermal module 330 among various components included in the PCB assembly 300. The electronic component 311 may be a CPU or AP configured to perform key operations, a CP, a wireless communication circuit, or a graphic element.

[0097] In an embodiment, the electronic component 311 may be disposed on the first circuit board 310. For example, the first circuit board 310 may be a core circuit board or a main circuit board. Compared with the second circuit board 320, the first circuit board 310 may be a relatively high-specification or highly integrated circuit board.

[0098] In an embodiment, the second circuit board 320 may be connected to the first circuit board 310. For example, the second circuit board 320 may be a sub-circuit board or an auxiliary circuit board. Compared with the first circuit board 310, the second circuit board 320 may be a relatively low-profile or low-integration circuit board.

[0099] In an embodiment, the first circuit board 310 may be made of a relatively low material or a low dielectric constant material compared to the second circuit board 320. By including the first circuit board 310 in which the electronic components 311 are disposed and the second circuit board 320 connected to the first circuit board 310 in the PCB assembly 300, ease and economic feasibility of manufacturing the PCB assembly 300 may be ensured.

[0100] In an embodiment, the thermal module 330 may absorb heat from the electronic component 311. For example, the thermal module 330 may be a cooling module or a thermal protection module. The thermal module 330 may absorb external heat or heat generated due to the operation of the electronic component 311. Alternatively, the thermal module 330 may control the temperature of the electronic component 311 or the PCB assembly 300 to prevent the electronic component 311 from overheating.

[0101] For example, the thermal module 330 may be a type of heat diffusion member (e.g., a heat pipe, a steam chamber, a graphite sheet, a Cu plate, a Cu sheet, or any combination thereof), and may quickly diffuse the heat generated by the component to the outside of the component. Alternatively, the thermal module 330 may be a fan that directly reduces the heat of the component or a water cooling member including a thermoelectric element.

[0102] In an embodiment, the pressurizing structure 350 may apply a preload to the thermal module 330 and / or the electronic component 311 to reduce or minimize the contact thermal resistance between the thermal module 330 and the electronic component 311. For example, the pressurizing structure 350 may apply a preload to the thermal module 330 in a direction toward the electronic component 311. The thermal module 330 and the electronic component 311 may be in close contact with each other through the pressurizing structure 350.

[0103] In an embodiment, a thermal interface material (TIM) 337 may be disposed between the pressurized structure 350 and the electronic component 311. The TIM 337 may include a thermally conductive material.

[0104] In an embodiment, the TIM 337 may be applied and cured in a cream or paste state between the pressurizing structure 350 and the electronic component 311. However, examples are not limited thereto.

[0105] In an embodiment, TIM 337 may improve thermal conductivity between pressurized structure 350 and electronic component 311. However, TIM 337 may be omitted, and in this case, pressurized structure 350 and electronic component 311 may be in direct contact with each other and thermally connected to each other.

[0106] In one embodiment, the pressurizing structure 350 may be a plate-shaped elastic body. A first surface (e.g., a surface in the +W direction) of the pressurizing structure 350 may be connected to the thermal module 330, and a second surface (e.g., a surface in the −W direction) opposite to the first surface may be connected to the electronic component 311. The TIM 337 may be disposed between the pressurizing structure 350 and the electronic component 311, and at least a portion of the heat generated by the electronic component 311 may be moved to the pressurizing structure 350 through the TIM 337.

[0107] In an embodiment, the pressurizing structure 350 may apply stress to the first circuit board 310 or the second circuit board 320 based on the shape, arrangement and / or structure of the plurality of fixing members 361, 362 and 363. For example, when the pressurizing structure 350 is supported by the second circuit board 320, the second circuit board 320 may receive a reaction force corresponding to the preload.

[0108] In an embodiment, stress transferred to the first circuit board 310 or the second circuit board 320 may affect the connection member 340. The stress may cause at least partial damage or cracks in the connection member 340. When the connection member 340 is damaged, poor connection or disconnection between the first circuit board 310 and the second circuit board 320 may occur.

[0109] In an embodiment, when the pressurizing structure 350 is not fixed to the second circuit board 320 (e.g., separated from the second circuit board 320, spaced apart, not attached to the second circuit board 320, not adhered to the second circuit board 320, removed from the second circuit board 320, in an unfixed state relative to the second circuit board 320, etc.), the pressurizing structure 350 may be supported by the first circuit board 310 or the external structure 305. Alternatively, the pressurizing structure 350 may not be fixed to the second circuit board 320 or supported by the second circuit board 320. Alternatively, the pressurizing structure 350 may also not be in contact with the second circuit board 320. When the pressurizing structure 350 is fixed to the first circuit board 310 or the external structure 305 instead of the second circuit board 320, the pressurizing structure 350 may suppress or minimize the stress transferred to the connecting member 340.

[0110] For example, the pressurizing structure 350 may be supported by the external structure 305 by penetrating the first circuit board 310. The external structure 305 may be an external support or component of the PCB assembly 300. For example, the external structure 305 may be a separate support component included in the PCB assembly 300 or an external housing different from the PCB assembly 300 (e.g., Figure 2c The first plate groove 242a or the second plate groove 242b).

[0111] Hereinafter, a structure for suppressing or minimizing stress occurring in the connection member 340 of the PCB assembly 300 is described through various embodiments. However, this is an example, and at least a portion of the structure and arrangement may be implemented with various design modifications within a range that can be easily modified by a person skilled in the art, and the scope of the present disclosure is not limited to the following description and the drawings.

[0112] In an embodiment, the PCB assembly 300 may include a plurality of fixing members 361, 362, and 363. For example, the plurality of fixing members 361, 362, and 363 may include a first fixing member 361, a second fixing member 362, and a third fixing member 363.

[0113] In an embodiment, the first fixing member 361 may be a supporting structure supported by the external structure 305. For example, the first fixing member 361 may be an internal thread, a nut, or a supporting body fixed to the external structure 305 and having an assembly structure.

[0114] In an embodiment, the second fixing member 362 may be disposed on the first circuit board 310. The second fixing member 362 may penetrate the first circuit board 310, may be inserted into the first circuit board 310, or may be fixed to the first circuit board 310. The second fixing member 362 may be self-locked to the first circuit board 310, and for example, the second fixing member 362 may be a locking nut, an insert nut, or a swaging nut.

[0115] In one embodiment, the second fixing member 362 may be fixed to the first fixing member 361. When the second fixing member 362 is fixed to the first fixing member 361, the second fixing member 362 may fix the first circuit board 310 to the first fixing member 361 and the external structure 305.

[0116] In an embodiment, the third fixing member 363 may have a structure that can be inserted into or fixed to the first fixing member 361 and / or the second fixing member 362. For example, the third fixing member 363 may be an external thread or a bolt. Without being limited thereto, the third fixing member 363 may be a nail, cone, or column-shaped structure having a circular or polygonal cross section.

[0117] In an embodiment, the third fixing member 363 may penetrate the pressurizing structure 350 and the second fixing member 362. For example, the head of the third fixing member 363 may contact the first surface of the pressurizing structure 350, and the shaft extending from the head of the third fixing member 363 may penetrate from the first surface of the pressurizing structure 350 to the second surface of the pressurizing structure 350. Without being limited thereto, at least a portion of the third fixing member 363 may be fixed or connected to the pressurizing structure 350, and may be integrally formed therewith.

[0118] In an embodiment, a penetration hole may be formed in the second fixing member 362, and the third fixing member 363 may be fixed to the first fixing member 361 by penetrating the second fixing member 362. When the third fixing member 363 is fixed to the first fixing member 361, the third fixing member 363 may fix the pressurizing structure 350 to the first fixing member 361 and the external structure 305.

[0119] In an embodiment, the plurality of fixing members 361, 362, and 363 may not be fixed to or supported by the second circuit board 320, and may be fixed to or supported by the first circuit board 310 or the external structure 305. The pressurizing structure 350 may transfer a portion of the preload or the reaction force of the preload to the first circuit board 310 or the external structure 305, and may reduce or minimize the force transferred to the second circuit board 320. The PCB assembly 300 including different circuit boards (e.g., the first circuit board 310 and the second circuit board 320) may provide improved durability by reducing or minimizing the stress applied to the connecting member 340 by the plurality of fixing members 361, 362, and 363.

[0120] In embodiments, the PCB assembly 300 including the plurality of fixing members 361 , 362 , and 363 may have relatively fewer required parts for the fixing members, the volume of the PCB assembly 300 may be reduced, and / or the PCB assembly 300 may be relatively easily coupled.

[0121] In an embodiment, since the PCB assembly 300 including multiple fixing members 361, 362 and 363 requires only a small amount of space for the second fixing member 362 to penetrate the first circuit board 310, the circuit board can be handled relatively easily, can provide miniaturization and space efficiency, and / or can provide improved durability.

[0122] Figure 4 is a cross-sectional view of a PCB assembly 300 according to an embodiment.

[0123] refer to Figure 4 , the PCB assembly 300 in the embodiment may include a plurality of fixing members 361a, 362a, 363a and 364a. In some embodiments, the PCB assembly 300 may include at least a portion of the first fixing member 361a, the second fixing member 362a, the third fixing member 363a and the fourth fixing member 364a.

[0124] exist Figure 4In the description of the PCB assembly 300, the structure and configuration of the PCB assembly 300 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 300.

[0125] In an embodiment, the first fixing member 361a and the third fixing member 363a may each be a support structure also supported by the external structure 305. For example, the first fixing member 361a and the third fixing member 363a may be internal threads, nuts, or supports fixed to the external structure 305 and having an assembly structure.

[0126] In an embodiment, in each of the first fixing member 361a and the third fixing member 363a, a first surface may be fixed to or supported by the external structure 305, and a second surface opposite to the first surface may have a columnar shape extending in a direction away from the external structure 305 (e.g., +W direction).

[0127] In an embodiment, the second fixing member 362a and the fourth fixing member 364a may have a structure that can be inserted or fixed to the first fixing member 361a and the third fixing member 363a, respectively. For example, the second fixing member 362a and the fourth fixing member 364a may each be an external thread or a bolt. Without being limited thereto, the second fixing member 362a and the fourth fixing member 364a may be a structure in the shape of a nail, a cone or a column having a circular or polygonal cross section.

[0128] In an embodiment, the second fixing member 362a may be disposed on the first circuit board 310. The second fixing member 362a may penetrate the first circuit board 310, may be inserted into the first circuit board 310, and may be fixed to the first circuit board 310.

[0129] For example, a head of the second fixing member 362 a may contact the first surface of the first circuit board 310 , and a shaft of the second fixing member 362 a extending from the head may penetrate from the first surface of the first circuit board 310 to the second surface of the first circuit board 310 .

[0130] In an embodiment, the second fixing member 362a may be fixed to the first fixing member 361a. When the second fixing member 362a is fixed to the first fixing member 361a, the second fixing member 362a may fix the first circuit board 310 to the first fixing member 361a and the external structure 305.

[0131] In an embodiment, the third fixing member 363a may penetrate the first circuit board 310. For example, the first circuit board 310 may include at least one opening 313a that penetrates the first circuit board 310 in a vertical direction (e.g., W-axis direction). The third fixing member 363a may extend from the external structure 305 through the penetration opening 313a and may penetrate the first circuit board 310.

[0132] In an embodiment, the fourth fixing member 364a may be disposed on the pressurizing structure 350. The fourth fixing member 364a may be disposed on the pressurizing structure 350, may be inserted into the pressurizing structure 350, or may be fixed to the pressurizing structure 350.

[0133] For example, the head of the fourth fixing member 364a may contact the first surface of the pressurizing structure 350, and the shaft extending from the head of the fourth fixing member 364a may penetrate from the first surface of the pressurizing structure 350 to the second surface of the pressurizing structure 350. Without being limited thereto, at least a portion of the fourth fixing member 364a may be fixed or connected to the pressurizing structure 350 and may be integrally formed therewith.

[0134] In an embodiment, the fourth fixing member 364a may be fixed to the third fixing member 363a. When the fourth fixing member 364a is fixed to the third fixing member 363a, the fourth fixing member 364a may fix the pressurizing structure 350 to the third fixing member 363a and the external structure 305.

[0135] In an embodiment, the plurality of fixing members 361a, 362a, 363a, and 364a may not be fixed to or supported by the second circuit board 320, and may be fixed to or supported by the first circuit board 310 or the external structure 305. The pressurizing structure 350 may transfer a portion of the preload or the reaction force of the preload to the first circuit board 310 or the external structure 305, and may reduce or minimize the force transferred to the second circuit board 320. The PCB assembly 300 including different circuit boards (e.g., the first circuit board 310 and the second circuit board 320) may provide improved durability by reducing or minimizing the stress applied to the connecting member 340 by the plurality of fixing members 361a, 362a, 363a, and 364a.

[0136] In an embodiment, in a PCB assembly 300 including a plurality of fixing members 361a, 362a, 363a and 364a, some structures (e.g., a third fixing member 363a and a fourth fixing member 364a) for supporting or fixing a pressurizing structure 350 and which are not fixed to (e.g., in an unfixed state relative to the first circuit board 310 and the second circuit board 320, spaced apart from the first circuit board 310 and the second circuit board 320, separated from the first circuit board 310 and the second circuit board 320, etc.) the first circuit board 310 and the second circuit board 320 may be supported by an external structure 305.

[0137] In an embodiment, since the stress of the pressurizing structure 350 is not transferred to the first circuit board 310, the second circuit board 320, and the connecting member 340, the PCB assembly 300 including the plurality of fixing members 361a, 362a, 363a, and 364a can reduce durability problems caused by the application of preload of the pressurizing structure 350, and the strength control of the preload of the pressurizing structure 350 can be less restricted. The PCB assembly 300 including the plurality of fixing members 361a, 362a, 363a, and 364a can allow relatively easy circuit board design, the pressurizing structure 350 can apply a greater preload to the thermal module 330 and / or the electronic component 311, and / or can provide improved durability of the PCB assembly 300.

[0138] Figure 5 is a cross-sectional view of a PCB assembly 300 according to an embodiment.

[0139] refer to Figure 5 , the PCB assembly 300 in the embodiment may include a plurality of fixing members 361b, 362b, 363b and 364b. In some embodiments, the PCB assembly 300 may include at least a portion of the first fixing member 361b, the second fixing member 362b, the third fixing member 363b and the fourth fixing member 364b.

[0140] exist Figure 5 In the description of the PCB assembly 300, the structure and configuration of the PCB assembly 300 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 300.

[0141] In an embodiment, the first fixing member 361b may be a supporting structure supported by the external structure 305. For example, the first fixing member 361b may be an internal thread, a nut, or a supporting body fixed to the external structure 305 and having an assembly structure.

[0142] In an embodiment, in the first fixing member 361b, a first surface may be fixed to or supported by the external structure 305, and a second surface opposite to the first surface may have a columnar shape extending in a direction away from the external structure 305 (eg, +W direction).

[0143] In an embodiment, the second fixing member 362b and the fourth fixing member 364b may have a structure that can be inserted or fixed to the first fixing member 361b and the third fixing member 363b, respectively. For example, the second fixing member 362b and the fourth fixing member 364b may be an external thread or a bolt. Without being limited thereto, the second fixing member 362b and the fourth fixing member 364b may be a structure in the shape of a nail, a cone or a column having a circular or polygonal cross section.

[0144] In an embodiment, the second fixing member 362b may be disposed on the first circuit board 310. The second fixing member 362b may penetrate the first circuit board 310, may be inserted into the first circuit board 310, or may be fixed to the first circuit board 310.

[0145] For example, the head of the second fixing member 362 b may contact the first surface of the first circuit board 310 , and the shaft of the second fixing member 362 b extending from the head may penetrate from the first surface of the first circuit board 310 to the second surface of the first circuit board 310 .

[0146] In an embodiment, the second fixing member 362b may be fixed to the first fixing member 361b. When the second fixing member 362b is fixed to the first fixing member 361b, the second fixing member 362b may fix the first circuit board 310 to the first fixing member 361b and the external structure 305.

[0147] In an embodiment, the third fixing member 363b may be disposed on the first circuit board 310. The third fixing member 363b may be inserted into the first circuit board 310 and may be fixed to the first circuit board 310. The third fixing member 363b may be self-locked to the first circuit board 310, and for example, the third fixing member 363b may be a locking nut, an insert nut, or a swaging nut.

[0148] In an embodiment, the fourth fixing member 364b may be disposed on the pressurizing structure 350. The fourth fixing member 364b may be disposed on the pressurizing structure 350, may be inserted into the pressurizing structure 350, or may be fixed to the pressurizing structure 350.

[0149] For example, the head of the fourth fixing member 364b may contact the first surface of the pressurizing structure 350, and the shaft extending from the head of the fourth fixing member 364b may penetrate from the first surface of the pressurizing structure 350 to the second surface of the pressurizing structure 350. Without being limited thereto, at least a portion of the fourth fixing member 364b may be fixed or connected to the pressurizing structure 350 and may be integrally formed therewith.

[0150] In an embodiment, the fourth fixing member 364b may be fixed to the third fixing member 363b. When the fourth fixing member 364b is fixed to the third fixing member 363b, the fourth fixing member 364b may fix the pressurizing structure 350 to the third fixing member 363b and the first circuit board 310. When the pressurizing structure 350 is fixed to the first circuit board 310, the pressurizing structure 350 may be supported by the external structure 305 through the first fixing member 361b and the second fixing member 362b.

[0151] In an embodiment, the plurality of fixing members 361b, 362b, 363b, and 364b may not be fixed to or supported by the second circuit board 320, and may be fixed to or supported by the first circuit board 310 or the external structure 305. The pressurizing structure 350 may transfer a portion of the preload or the reaction force of the preload to the first circuit board 310 or the external structure 305, and may reduce or minimize the force transferred to the second circuit board 320. The PCB assembly 300 including different circuit boards (e.g., the first circuit board 310 and the second circuit board 320) may provide improved durability by reducing or minimizing the stress applied to the connecting member 340 by the plurality of fixing members 361b, 362b, 363b, and 364b.

[0152] In an embodiment, since the third fixing member 363b has a structure fixed to the first circuit board 310, the PCB assembly 300 including the plurality of fixing members 361b, 362b, 363b, and 364b may not require a separate opening of the first circuit board 310 or the second circuit board 320 (e.g., Figure 4 The opening 313a or Figure 6 The opening 313c of the PCB assembly 300 and the external structure 305 may be relatively simplified in fixing structure, and / or the shapes and structures of the plurality of fixing members 361b, 362b, 363b and 364b may be relatively simplified. The PCB assembly 300 including the plurality of fixing members 361b, 362b, 363b and 364b may provide relatively easy circuit board design and improved space efficiency.

[0153] Figure 6 is a cross-sectional view of a PCB assembly 300 according to an embodiment.

[0154] refer to Figure 6 , the PCB assembly 300 in the embodiment may include a plurality of fixing members 361c, 362c, 363c and 364c. The PCB assembly 300 may include at least a portion of the first fixing member 361c, the second fixing member 362c, the third fixing member 363c and the fourth fixing member 364c.

[0155] exist Figure 6 In the description of the PCB assembly 300, the structure and configuration of the PCB assembly 300 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 300.

[0156] In an embodiment, the first fixing member 361c and the third fixing member 363c may each be a support structure supported by the external structure 305. For example, the first fixing member 361c and the third fixing member 363c may be internal threads, nuts, or supports fixed to the external structure 305 and having an assembly structure.

[0157] In an embodiment, in each of the first fixing member 361c and the third fixing member 363c, a first surface may be fixed to or supported by the external structure 305, and a second surface opposite to the first surface may have a columnar shape extending in a direction away from the external structure 305 (e.g., +W direction).

[0158] In an embodiment, the second fixing member 362c and the fourth fixing member 364c may have a structure that can be inserted or fixed to the first fixing member 361c and the third fixing member 363c, respectively. For example, the second fixing member 362c and the fourth fixing member 364c may be an external thread or a bolt. Without being limited thereto, the second fixing member 362c and the fourth fixing member 364c may be a structure in the shape of a nail, a cone or a column having a circular or polygonal cross section.

[0159] In an embodiment, the second fixing member 362c may be disposed on the first circuit board 310. The second fixing member 362c may penetrate the first circuit board 310, may be inserted into the first circuit board 310, or may be fixed to the first circuit board 310.

[0160] For example, a head of the second fixing member 362 c may contact the first surface of the first circuit board 310 , and a shaft of the second fixing member 362 c extending from the head may penetrate from the first surface of the first circuit board 310 to the second surface of the first circuit board 310 .

[0161] In an embodiment, the second fixing member 362c may be fixed to the first fixing member 361c. When the second fixing member 362c is fixed to the first fixing member 361c, the second fixing member 362c may fix the first circuit board 310 to the first fixing member 361c and the external structure 305.

[0162] In an embodiment, the third fixing member 363c may penetrate the second circuit board 320. For example, the second circuit board 320 may include at least one opening 313c that penetrates in a vertical direction (e.g., W-axis direction). The third fixing member 363c may extend from the external structure 305 through the penetration opening 313c and may penetrate the second circuit board 320.

[0163] In an embodiment, the fourth fixing member 364c may be disposed on the pressurizing structure 350. The fourth fixing member 364c may be disposed on the pressurizing structure 350, may be inserted into the pressurizing structure 350, or may be fixed to the pressurizing structure 350.

[0164] For example, the head of the fourth fixing member 364c may contact the first surface of the pressurizing structure 350, and the shaft extending from the head of the fourth fixing member 364c may penetrate from the first surface of the pressurizing structure 350 to the second surface of the pressurizing structure 350. Without being limited thereto, at least a portion of the fourth fixing member 364c may be fixed or connected to the pressurizing structure 350 and may be integrally formed therewith.

[0165] In an embodiment, the fourth fixing member 364c may be fixed to the third fixing member 363c. When the fourth fixing member 364c is fixed to the third fixing member 363c, the fourth fixing member 364c may fix the pressurizing structure 350 to the third fixing member 363c and the external structure 305.

[0166] In an embodiment, when the third fixing member 363c penetrates the opening 313c of the second circuit board 320, the plurality of fixing members 361c, 362c, 363c, and 364c may not be fixed to or supported by the second circuit board 320, and may be fixed to or supported by the first circuit board 310 or the external structure 305. The pressurizing structure 350 may transfer a portion of the preload or the reaction force of the preload to the first circuit board 310 or the external structure 305, and may reduce or minimize the force transferred to the second circuit board 320. The PCB assembly 300 including different circuit boards (e.g., the first circuit board 310 and the second circuit board 320) may provide improved durability by reducing or minimizing the stress applied to the connecting member 340 by the plurality of fixing members 361c, 362c, 363c, and 364c.

[0167] In an embodiment, in a PCB assembly 300 including a plurality of fixing members 361c, 362c, 363c and 364c, some structures (e.g., a third fixing member 363c and a fourth fixing member 364c) for supporting or fixing a pressurizing structure 350 and which are not fixed to (e.g., in an unfixed state relative to the first circuit board 310 and the second circuit board 320, separated from the first circuit board 310 and the second circuit board 320, spaced apart from the first circuit board 310 and the second circuit board 320, etc.) the first circuit board 310 and the second circuit board 320 may be supported by an external structure 305.

[0168] In an embodiment, since the stress of the pressurizing structure 350 is not transferred to the first circuit board 310, the second circuit board 320, and the connecting member 340, the PCB assembly 300 including the plurality of fixing members 361c, 362c, 363c, and 364c can reduce durability problems caused by the application of preload by the pressurizing structure 350, and the strength control of the preload of the pressurizing structure 350 can be less restricted. The PCB assembly 300 including the plurality of fixing members 361c, 362c, 363c, and 364c can allow relatively easy circuit board design, the pressurizing structure 350 can apply a larger preload, and / or can provide improved durability of the PCB assembly 300.

[0169] In an embodiment, the first circuit board 310 may be a high-specification circuit board on which the electronic components 311 are disposed, and the second circuit board 320 may be a relatively low-specification circuit board compared to the first circuit board 310. The PCB assembly 300 including the plurality of fixing members 361, 362c, 363c, and 364c may provide further improved ease of design and economic feasibility in manufacturing of the PCB assembly 300 by forming the opening 313c in the second circuit board 320.

[0170] Figure 7a is a perspective view of an electronic device 401 according to an embodiment, and Figure 7b is an exploded perspective view of a first housing 410 of an electronic device 401 according to an embodiment.

[0171] refer to Figure 7a and Figure 7b , the electronic device 401 in the embodiment (for example, Figure 1 The electronic device 101 may include a first housing 410, a second housing 420, a connector 430, a battery 440 (eg, Figure 1 A battery 189) and a PCB assembly 450.

[0172] In an embodiment, the first housing 410 may include a keyboard 402, a touch pad 404, and an antenna module 408. The keyboard 402 (eg, Figure 1The input module 150 of the electronic device 401 may include a plurality of keys. The keyboard 402 may receive numeric or character information. The keyboard 402 may include a plurality of input keys and function keys for setting various functions of the electronic device 401. The function keys may include arrow keys, volume keys and / or shortcut keys, which are set to perform designated functions. The keyboard 402 may include one of a qwerty keyboard, a 3*4 keyboard, a 4*3 keyboard or a touch key.

[0173] In an embodiment, the touch pad 404 can replace the function of a mouse. The touch pad 404 can be used to input input for selecting or executing a function displayed on the display 421 (e.g., Figure 1 The display module 160 displays the instructions of the application.

[0174] In an embodiment, the antenna module 408 (e.g., Figure 1 The antenna module 197 can transmit signals to an external electronic device (eg, Figure 1 electronic devices 102 and 104 and / or server 108) to send signals or power to or from external electronic devices (e.g., Figure 1 The electronic devices 102 and 104 and / or the server 108) receive signals or power.

[0175] In an embodiment, the first housing 410 may include at least one electronic component. For example, the electronic component of the first housing 410 may include Figure 1 processor 120, memory 130 and sensor module 176 and / or other electronic components.

[0176] In an embodiment, the display 421 may be provided on the second housing 420. The display 421 may include a screen for displaying information to be provided to the user or information input by the user through various menus and the keyboard 402 using the electronic device 401. The screen may include at least one of a liquid crystal display (LCD), an organic light emitting diode (OLED) display, an active matrix organic light emitting diode (AMOLED) display, a flexible display, or a transparent display. The screen may provide at least one of various screens based on the use of the electronic device 401, for example, a home screen, a menu screen, a lock screen, a game screen, a web page screen, a call screen, or a music or video playback screen.

[0177] In an embodiment, the second housing 420 may include at least one electronic component therein. For example, the electronic component of the second housing 420 may include Figure 1 The camera module 180 and the sound output module 155 and / or other electronic components.

[0178] In an embodiment, the connector 430 may connect the first housing 410 to the second housing 420. The connector 430 may allow the first housing 410 and the second housing 420 to rotate relative to each other.

[0179] For example, the electronic device 401 can be changed between a closed state in which the first housing 410 and the second housing 420 actually face each other and an open state in which one of the first housing 410 and the second housing 420 is rotated relative to the other.

[0180] In an embodiment, the connector 430 may include a hinge structure configured to mechanically connect the first housing 410 to the second housing 420. The connector 430 may electrically connect the first housing 410 to the second housing 420. For example, the connector 430 may include a flexible PCB (FPCB).

[0181] In an embodiment, the first housing 410 may include a front cover 411 and a rear cover 412. The front cover 411 may form an exterior of a front surface (eg, +z direction surface) of the first housing 410.

[0182] For example, keyboard 402 and / or touchpad 404 may be arranged on front cover 411. Rear cover 412 may form the outside of the rear surface (e.g., -z direction surface) of first housing 410. Front cover 411 and / or rear cover 412 may include plastic and / or metal material. However, this is only an example, and the materials of front cover 411 and rear cover 412 are not limited thereto.

[0183] In an embodiment, when the front cover 411 is fixed to the rear cover 412 , a space in which various components may be disposed may be formed inside the first housing 410 .

[0184] For example, the front cover 411 may be fixed to the rear cover 412 substantially along the circumference of the rear cover 412 to form a space therebetween. The battery 440 and the PCB 450 may be disposed in the inner space of the first housing 410. However, this is merely an example, and the components disposed in the inner space of the first housing 410 are not limited thereto.

[0185] In an embodiment, the battery 440 may supply power to at least one component of the electronic device 401. Various electronic components for implementing the functions of the electronic device 401 may be disposed on the PCB assembly 450. The battery 440 and / or the PCB assembly 450 may be disposed and fixed in the inner space of the first housing 410. For example, the PCB assembly 450 may be connected and fixed to the front cover 411.

[0186] In an embodiment, the PCB assembly 450 may be formed by coupling different PCBs, and for example, the PCB assembly 450 may include a first circuit board 450 - 1 and a second circuit board 450 - 2 .

[0187] In an embodiment, the second circuit board 450-2 may include at least one electronic component 451, and may include various structures associated therewith (eg, Figure 8a thermal module 530 or pressurized structure 550).

[0188] In an embodiment, the electronic component 451 may include various circuits or some components for driving or controlling the electronic device 401. For example, the electronic component 451 may be an integrated circuit. The electronic component 451 may generate heat due to operation and may need to be cooled.

[0189] In an embodiment, the electronic component 451 may be a CPU (e.g., Figure 1 The processor 120 or main processor 121 ) or AP is an element for performing key operations of the electronic device 401 .

[0190] In an embodiment, electronic component 451 may be a wireless communication circuit (e.g., Figure 1 The wireless communication circuit can communicate with, for example, an external device (e.g., Figure 1 The electronic device 401 may include an antenna (eg, Figure 1 The wireless communication circuit may be electrically connected to the antenna structure. The wireless communication circuit may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure. For example, the PCB assembly 450 may include a ground, and the ground of the PCB assembly 450 may be used as a ground for the antenna structure implemented using the wireless communication circuit. However, the example is not limited thereto, and the electronic component 451 may be a graphic component (e.g., Figure 1 part of the display module 160).

[0191] Hereinafter, the configuration and structure of the PCB assembly in the embodiment are described based on the description of the electronic device 401. Hereinafter, in order to describe the electronic device 401, the description repeated with the electronic device 401 is omitted, and a part of the configuration or structure may be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art.

[0192] Figure 8a is a cross-sectional view of a PCB assembly 500 in a disassembled state according to an embodiment, and Figure 8b is a cross-sectional view of a PCB assembly 500 according to an embodiment.

[0193] refer to Figure 8a and 8b , PCB assembly 500 (e.g., Figure 7b The PCB assembly 450 may include a first circuit board 510 (eg, a first circuit board 450-1), a second circuit board 520 (eg, Figure 7b The second circuit board 450 - 2 ), the thermal module 530 , the bracket 535 , the sealing structure 513 and at least a portion of the pressurizing structure 550 .

[0194] In an embodiment, at least one component or feature of the above-described embodiments may be coupled to the PCB assembly 500 .

[0195] In an embodiment, the PCB assembly 500 may be a PCB assembly 500 including different PCBs, wherein the first circuit board 510 is coupled or connected to the second circuit board 520. The first circuit board 510 and the second circuit board 520 may be separate circuit boards, and for example, the PCB assembly 500 may include a main circuit board and an auxiliary circuit board, or may include a main circuit board and a sub-circuit board.

[0196] In an embodiment, the first circuit board 510 and the second circuit board 520 may be connected to each other by a connecting member 540. The connecting member 540 may physically combine the first circuit board 510 and the second circuit board 520 with each other, or may electrically connect the first circuit board 510 and communicatively connect to the second circuit board 520. For example, the connecting member 540 may be a welding member or an interposer member for connecting wiring between the first circuit board 510 and the second circuit board 520. The connecting member 540 may be formed of at least one of silicone, glass, a polymer compound, or solder paste.

[0197] In an embodiment, the PCB assembly 500 may include an electronic component 511 (e.g., Figure 7b 5. However, the electronic component 511 described herein is only one of the various components included in the PCB assembly 500. In actual implementations, the PCB assembly 500 may include one or more electronic components of various types, structures, and arrangements.

[0198] For example, electronic component 511 may refer to a component that needs to be thermally protected or temperature controlled by thermal module 530 among various components included in PCB assembly 500. For example, electronic component 511 may be a CPU or AP configured to perform key operations, a CP, a wireless communication circuit, or a graphic element.

[0199] In an embodiment, the electronic component 511 may be disposed on the first circuit board 510. For example, the first circuit board 510 may be a core circuit board or a main circuit board. Compared with the second circuit board 520, the first circuit board 510 may be a relatively high-specification or highly integrated circuit board. The second circuit board 520 may be connected to the first circuit board 510. For example, the second circuit board 520 may be a sub-circuit board or an auxiliary circuit board. Compared with the first circuit board 510, the second circuit board 520 may be a circuit board of a relatively low-specification or lower-integration circuit. By including the first circuit board 510 in which the electronic component 511 is disposed and the second circuit board 520 connected to the first circuit board 510 in the PCB assembly 500, the ease and economic feasibility of manufacturing the PCB assembly 500 can be ensured.

[0200] In an embodiment, the thermal module 530 can absorb heat from the electronic component 511. For example, the thermal module 530 can be a cooling module or a thermal protection module. The thermal module 530 can absorb external heat or heat generated due to the operation of the electronic component 511. Alternatively, the thermal module 530 can control the temperature of the electronic component 511 or the PCB assembly 500 to prevent the electronic component 511 from overheating. The thermal module 530 can be directly thermally connected to the electronic component 511 or indirectly thermally connected to the electronic component 511 through another component (e.g., the bracket 535 and / or the TIM 537) for heat exchange.

[0201] In an embodiment, the TIM 537 may be disposed between the electronic component 511 and the bracket 535 or the thermal module 530. The TIM 537 may improve thermal conductivity from the electronic component 511 to the bracket 535 or the thermal module 530.

[0202] In an embodiment, the TIM 537 may be applied in a paste or paste state and cured between the pressurizing structure 550 and the electronic component 511. However, examples are not limited thereto.

[0203] In an embodiment, the bracket 535 may be a support structure to which the thermal module 530 is connected or fixed. A first surface (e.g., a surface in the +W direction) of the bracket 535 may be connected to the thermal module 530, and a second surface (e.g., a surface in the -W direction) opposite to the first surface may be connected to the electronic component 511. The TIM 537 may be disposed between the bracket 535 and the electronic component 511, and at least a portion of the heat generated by the electronic component 511 may be moved to the bracket 535 or the thermal module 530 through the TIM 537.

[0204] In an embodiment, the bracket 535 may be disposed at a position facing the first circuit board 510. Based on the first circuit board 510, the bracket 535 and the thermal module 530 may be disposed in a direction (e.g., +W direction) in which the electronic component 511 is disposed, and the second circuit board 520 and the connecting member 540 may be disposed in a direction (e.g., -W direction) opposite thereto. When the second circuit board 520 is disposed in a position opposite to the electronic component 511, the thermal module 530, and the bracket 535, thermal shock to the electronic component 511 and / or shock of electromagnetic waves may be reduced.

[0205] In an embodiment, the bracket 535 may include an opening 539. The opening 539 may be a space into which the pressurizing structure 550 and / or a fixing member (eg, the second fixing member 562) is inserted.

[0206] In an embodiment, the bracket 535 may be formed of a thermally conductive material, may receive heat generated by the electronic component 511 , and may perform a thermal protection function.

[0207] In an embodiment, the thermal module 530 may cool a bracket 535 that substantially contacts the thermal module 530 , and by cooling the bracket 535 , the thermal module 530 may indirectly absorb heat from the electronic component 511 and may cool the electronic component 511 and / or the PCB assembly 500 .

[0208] In an embodiment, the sealing structure 513 may include a shielding case 515 and a shielding structure 517. The sealing structure 513 may isolate the electronic component 511 from the outside physically, electrically, and / or communicatively.

[0209] In an embodiment, the shielding case 515 may be disposed between the bracket 535 and the first circuit board 510 and may surround the electronic component 511. The shielding structure 517 may be disposed between the shielding case 515 and the bracket 535 and may substantially shield the inside and outside of the shielding case 515.

[0210] In an embodiment, the shield case 515 may prevent foreign materials such as water, water vapor, and dust from entering a space surrounded by the shield case 515. Alternatively, the shield case 515 may protect the electronic component 511 to prevent an external impact from being transferred to the electronic component 511.

[0211] In an embodiment, the shielding cover 515 can improve the thermal protection or cooling effect inside the shielding cover 515 by isolating the electronic component 511 and the area adjacent thereto from the outside. Alternatively, the shielding cover 515 can prevent electromagnetic waves from entering the electronic component 511 and / or the shielding cover 515 can seal the electromagnetic waves generated by the electronic component 511 to prevent the electromagnetic waves from being emitted to the outside.

[0212] In an embodiment, the shield 515 may be formed of an electromagnetic shielding material, a non-conductor or an insulator. For example, the shield 515 may be formed of graphite, a metal compound or a polymer material.

[0213] In an embodiment, the shielding case 515 may be connected to the first circuit board 510, and the shielding structure 517 may be disposed between the shielding case 515 and the bracket 535. The shielding structure 517 may shield the inside of the shielding case 515 from the outside.

[0214] In an embodiment, the PCB assembly 500 may include a plurality of fixing members 561 and 562. For example, the plurality of fixing members 561 and 562 may include a first fixing member 561 and a second fixing member 562. The bracket 535 may be fixed to the first circuit board 510 by the first fixing member 561 and the second fixing member 562.

[0215] In an embodiment, the first fixing member 561 may be a support structure supported by the first circuit board 510. The first fixing member 561 may be inserted into the first circuit board 510 and may be fixed to the first circuit board 510. The first fixing member 561 may be self-locked to the first circuit board 510, and for example, the first fixing member 561 may be a locking nut, an insert nut, or a swaging nut.

[0216] In an embodiment, the second fixing member 562 may be provided on the bracket 535. The second fixing member 562 may be fixed to the first fixing member 561, and the bracket 535 may be fixed to the first fixing member 561. The second fixing member 562 may have a structure that can be inserted or fixed to the opening 539 of the first fixing member 561 and / or the bracket 535. For example, the second fixing member 562 may be an external thread or a bolt. Without being limited thereto, the second fixing member 562 may be a structure in the shape of a nail, a cone, or a column having a circular or polygonal cross section.

[0217] In an embodiment, the second fixing member 562 may penetrate the first fixing member 561, the opening 539 of the bracket 535, and at least a portion of the pressurizing structure 550. For example, the head of the second fixing member 562 may contact the surface of the bracket 535, and the shaft of the second fixing member 562 extending from the head may penetrate from the opening 539 of the bracket 535. Without being limited thereto, at least a portion of the second fixing member 562 may be fixed or connected to the bracket 535, and may be integrally formed therewith.

[0218] In an embodiment, the pressurizing structure 550 may apply a preload to the thermal module 530 and / or the electronic component 511 to reduce or minimize the contact thermal resistance between the thermal module 530 and the electronic component 511 .

[0219] In an embodiment, the pressurizing structure 550 may apply a preload to the thermal module 530 in a direction toward the electronic component 511. For example, when the pressurizing structure 550 presses the bracket 535 in a direction facing the first circuit board 510 (e.g., the -W direction), the thermal module 530 connected to the bracket 535 may apply a preload to the electronic component 511 disposed on the first circuit board 510. Through the pressurizing structure 550, the thermal module 530 and the electronic component 511 may be in close contact with each other.

[0220] In an embodiment, the pressurizing structure 550 may be a spring-like elastic body. The pressurizing structure 550 may be disposed between the second fixing member 562 and the bracket 535. Without limitation thereto, the pressurizing structure 550 may include various arrangements (e.g., Fig. 9 or Fig.11 The pressurized structure 550a) and the structure (e.g., Fig.12 Pressurized structure 550b).

[0221] In an embodiment, the pressurizing structure 550 may be pressed by the second fixing member 562 and may be compressed. When the first fixing member 561 and the second fixing member 562 are fixed to each other, a portion of the bracket 535 and the pressurizing structure 550 may be disposed therebetween. When the first fixing member 561 and the second fixing member 562 are fixed, the pressurizing structure 550 may be supported by the first circuit board 510 in which the first fixing member 561 is disposed.

[0222] In an embodiment, when the pressurizing structure 550 is compressed by the second fixing member 562, the bracket 535 may be pressed by applying elastic force to the bracket 535 in one direction (e.g., -W direction). When the pressurizing structure 550 presses the bracket 535, the bracket 535 may apply a preload in a direction (e.g., -W direction) facing the first circuit board 510, and the pressurizing structure 550 may apply a preload in a direction facing the electronic component 511 to the thermal module 530 connected to the bracket 535.

[0223] In an embodiment, the pressurizing structure 550 may apply stress to the first circuit board 510 or the second circuit board 520 based on the shape, arrangement and / or structure of the plurality of fixing members 561 and 562. For example, when the first fixing member 561 is disposed at the second circuit board 520 and the bracket 535 and the pressurizing structure 550 are supported by the second circuit board 520, the second circuit board 520 may receive a reaction force corresponding to the preload.

[0224] In an embodiment, the stress transmitted to the first circuit board 510 or the second circuit board 520 may affect the connecting member 540. The stress may cause at least partial damage or cracks in the connecting member 540. In the case where the connecting member 540 is damaged, a poor connection or disconnection between the first circuit board 510 and the second circuit board 520 may occur.

[0225] In an embodiment, when the pressurizing structure 550 is not fixed to the second circuit board 520 (e.g., not attached to, not adhered to, removed from, in an unfixed state relative to, separated from, spaced apart from, etc.), the pressurizing structure 550 may be supported by the first circuit board 510. Alternatively, the pressurizing structure 550 may not be fixed to or supported by the second circuit board 520. Alternatively, the pressurizing structure 550 may not be in contact with the second circuit board 520. When the pressurizing structure 550 is fixed to the first circuit board 510 instead of the second circuit board 520, the pressurizing structure 550 may suppress or minimize the stress transferred to the connecting member 540.

[0226] In an embodiment, the plurality of fixing members 561 and 562 may not be fixed to or supported by the second circuit board 520, and may be directly or indirectly fixed to or supported by the first circuit board 510. The pressurizing structure 550 may transfer a portion of the preload or the reaction force of the preload to the first circuit board 510, and may reduce or minimize the force transferred to the second circuit board 520. The PCB assembly 500 including different circuit boards (e.g., the first circuit board 510 and the second circuit board 520) may provide improved durability by reducing or minimizing the stress applied to the connecting member 540 by the plurality of fixing members 561 and 562.

[0227] In an embodiment, the first fixing member 561 and the second fixing member 562 may be disposed inside the shielding case 515. The opening 539 of the bracket 535 may be disposed at a position corresponding to the first fixing member 561 to face the first fixing member 561 inside the shielding case 515, and the second fixing member 562 and the pressurizing structure 550 may be disposed in the opening 539 of the bracket 535. Inside the shielding case 515, the pressurizing structure 550 may be located relatively close to the thermal module 530 and the electronic component 511 compared to the outside of the shielding case 515.

[0228] In an embodiment, when the first fixing member 561 and the second fixing member 562 are disposed inside the shield case 515 , the pressurizing structure 550 may be disposed relatively close to the thermal module 530 , and thus, the pressurizing structure 550 may more effectively apply a preload to the thermal module 530 .

[0229] For example, when the pressurizing structure 550 is formed relatively away from the thermal module 530, the elastic force applied to the pressurizing structure 550 may increase to generate a target preload. When the elastic force increases, the stress transmitted to the first circuit board 510, the second circuit board 520, or the connecting member 540 may increase. Alternatively, when the pressurizing structure 550 is relatively moved away from the thermal module 530, the size of the area to which the elastic force is transmitted may increase, and the area to which the stress of a predetermined intensity is applied in the PCB assembly 500 may increase.

[0230] In an embodiment, in a PCB assembly 500 including a plurality of fixing members 561 and 562, by arranging the first fixing member 561 and the second fixing member 562 in the internal space of the shielding cover 515, the distance between the pressurizing structure 550 and the thermal module 530 can be relatively reduced, and in this way, the PCB assembly 500 can provide more stable improved durability.

[0231] Fig. 9 is a cross-sectional view of a PCB assembly 500 according to an embodiment.

[0232] refer to Fig. 9 , the PCB assembly 500 in the embodiment may include a plurality of fixing members 561a and 562a, an opening 539a, and at least a portion of a pressurizing structure 550a.

[0233] exist Fig. 9 In the description of the PCB assembly 500, the structure and configuration of the PCB assembly 500 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 500.

[0234] In an embodiment, the first fixing member 561a and the second fixing member 562a may be disposed on the outside of the shielding case 515. The opening 539a of the bracket 535 may be disposed at a position corresponding to the first fixing member 561a to face the first fixing member 561a at the outside of the shielding case 515, and the second fixing member 562a and the pressurizing structure 550a may be disposed in the opening 539a of the bracket 535.

[0235] In an embodiment, when the first fixing member 561a and the second fixing member 562a are disposed inside the shielding cover 515, the interior of the shielding cover 515 may be substantially unsealed, or the sealing performance may be reduced by the opening 539a of the bracket 535 or the area where the first fixing member 561a, the second fixing member 562a and the pressurizing structure 550a are connected to another structure.

[0236] In an embodiment, the PCB assembly 500 can ensure the function of the sealing structure 513 by disposing the first fixing member 561a and the second fixing member 562a on the outside of the shielding cover 515. As described above, the shielding cover 515 and the shielding structure 517 can physically, electrically and / or communicatively separate the electronic component 511 from the outside, can protect the electronic component 511, or can improve the thermal protection or cooling performance of the electronic component 511 through the thermal module 530.

[0237] In an embodiment, in a PCB assembly 500 including a plurality of fixing members 561a and 562a, by arranging the first fixing member 561a and the second fixing member 562a in the external space of the shielding cover 515, the functions of the shielding structure 517 and the sealing structure 513 of the shielding cover 515 can be improved, and by doing so, the PCB assembly 500 can provide more stable improved performance and durability.

[0238] Fig.10 is a cross-sectional view of a PCB assembly 500 according to an embodiment.

[0239] refer to Fig.10 , the PCB assembly 500 in one embodiment may include a thermal module hole 536.

[0240] exist Fig.10 In the description of the PCB assembly 500, the structure and configuration of the PCB assembly 500 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 500.

[0241] In an embodiment, the thermal module hole 536 may be a seating groove into which the thermal module 530 is inserted and fixed. The thermal module hole 536 may be formed in the bracket 535 from a surface facing the first circuit board 510 to a surface opposite thereto. The thermal module hole 536 may be provided at a position facing the electronic component 511 of the first circuit board 510.

[0242] In an embodiment, the thermal module 530 may face the electronic component 511 through the thermal module hole 536. The TIM 537 may be disposed between the thermal module 530 and the electronic component 511, and other components (eg, a partial region of the bracket 535) may be omitted.

[0243] In an embodiment, when the PCB assembly 500 does not include the thermal module hole 536, for example, when the thermal module 530 contacts the surface of the bracket 535 (eg, see Figure 8a and 8b or Fig. 9 ), the heat exchange efficiency of the thermal module 530 may be reduced. Alternatively, when its heat exchange efficiency is reduced, the size of the preload required by the PCB assembly 500 for the pressurizing structure 550 may increase.

[0244] In an embodiment, when the PCB assembly 500 includes the thermal module hole 536, the thermal module 530 can increase its heat exchange efficiency by directly contacting the electronic component 511 or substantially directly contacting the electronic component 511 only through the TIM 537, and through this, the PCB assembly 500 can improve the thermal protection or cooling performance of the electronic component 511 of the thermal module 530, or the pressurized structure 550 can achieve the selected target with a relatively small preload.

[0245] Fig.11 is a cross-sectional view of a PCB assembly 500 according to an embodiment.

[0246] refer to Fig.11 , the PCB assembly 500 in the embodiment may include a plurality of fixing members 561a and 562a, a thermal module hole 536, an opening 539a, and at least a portion of a pressurizing structure 550a.

[0247] exist Fig.11 In the description of the PCB assembly 500, the structure and configuration of the PCB assembly 500 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 500.

[0248] In an embodiment, when the first fixing member 561a and the second fixing member 562a are disposed outside the shielding cover 515 (eg, Fig. 9 PCB assembly 500), the function of sealing structure 513 can be ensured. However, the size of preload provided to thermal module 530 can be reduced, or restrictions can be imposed on providing preload.

[0249] In an embodiment, when the thermal module 530 is disposed in the thermal module aperture 536 (eg, Fig.10 When the PCB assembly 500 includes the thermal module hole 536, the selected target can be achieved even if the pressurizing structure 550a generates a relatively small preload.

[0250] In an embodiment, in a PCB assembly 500 including a plurality of fixing members 561a and 562a, by disposing the first fixing member 561a and the second fixing member 562a in the outer space of the shielding cover 515, the functions of the shielding cover 515 of the shielding structure 517 and the sealing structure 513 can be improved, and the PCB assembly 500 can improve the thermal protection or cooling performance of the electronic component 511 of the thermal module 530 because the PCB assembly 500 includes the thermal module hole 536. In addition, by improving the heat exchange efficiency through the thermal module hole 536, the PCB assembly 500 can solve the preload degradation problem that may occur when the first fixing member 561a and the second fixing member 562a are disposed in the outer space of the shielding cover 515.

[0251] Fig.12 is a cross-sectional view of a PCB assembly 500 according to an embodiment.

[0252] refer to Fig.12 , the PCB assembly 500 in the embodiment may include a plurality of fixing members 561b and 562b and at least a portion of the pressurizing structure 550b.

[0253] exist Fig.12 In the description of the PCB assembly 500, the structure and configuration of the PCB assembly 500 are described, and the repeated description with the above-mentioned PCB assembly can be omitted. In addition, this is only an example, and a part of the configuration or structure can be replaced, added or omitted within the scope that can be easily understood by a person of ordinary skill in the art with reference to the following drawings and descriptions. In addition, at least one component or feature of the above-mentioned embodiment can be coupled to the PCB assembly 500.

[0254] In an embodiment, the first fixing member 561b may be a supporting structure supported by the bracket 535. For example, the first fixing member 561b may be an internal thread, a nut, or a supporting body fixed to the bracket 535 and having an assembly structure.

[0255] In an embodiment, in the first fixing member 561b, a first surface may be fixed to or supported by the bracket 535, and a second surface opposite to the first surface may have a columnar shape extending in a direction away from the bracket 535 (eg, -W direction).

[0256] In an embodiment, the second fixing member 562b may have a structure that can be inserted or fixed to the first fixing member 561b. For example, the second fixing member 562b may be an external thread or a bolt. Without being limited thereto, the second fixing member 562b may be a nail, cone or column-shaped structure having a circular or polygonal cross section.

[0257] In an embodiment, the second fixing member 562b may be disposed on the first circuit board 510. The second fixing member 562b may penetrate the first circuit board 510, may be inserted into the first circuit board 510, or may be fixed to the first circuit board 510.

[0258] For example, the head of the second fixing member 562 b may contact the first surface of the first circuit board 510 , and the shaft of the second fixing member 562 b extending from the head may penetrate from the first surface of the first circuit board 510 to the second surface of the first circuit board 510 .

[0259] In an embodiment, the second fixing member 562b may be fixed to the first fixing member 561b. When the second fixing member 562b is fixed to the first fixing member 561b, the second fixing member 562b may fix the first circuit board 510 to the bracket 535.

[0260] In an embodiment, in a PCB assembly 500 including a plurality of fixing members 561b and 562b, a bracket 535 and a pressurizing structure 550b connected to the bracket 535 in an unfixed state (e.g., not attached to, not adhered to, not removed from, etc.) relative to a second circuit board 520 may be indirectly supported by the first circuit board 510 via the plurality of fixing members 561b and 562b.

[0261] In an embodiment, the pressurizing structure 550 b may be a plate-shaped elastic body. Alternatively, the pressurizing structure 550 b may be a tape or a film. The pressurizing structure 550 b may cover at least a portion of the surface of the bracket 535 and the thermal module 530 , and may be attached to the bracket 535 .

[0262] In an embodiment, the pressurizing structure 550b may be provided on a surface of the bracket 535 and the thermal module 530 opposite to a surface facing the electronic component 511. The pressurizing structure 550b may apply a preload to the thermal module 530 in a direction facing the electronic component 511.

[0263] like Fig.12 As shown, the thermal module 530 may protrude a predetermined gap from the upper surface of the bracket 535. When the pressurizing structure 550b is connected to the upper surfaces of the thermal module 530 and the bracket 535 by substantially closely contacting the thermal module 530 and the bracket 535, the pressurizing structure 550b may press the thermal module 530 in the direction of the bracket 535 by its own elastic force or restoring force.

[0264] In an embodiment, the pressurizing structure 550b may be supported by the bracket 535. As described above, since the bracket 535 is fixed to the first circuit board 510 by the first fixing member 561b and the second fixing member 562b, the pressurizing structure 550b may be supported by the first circuit board 510 by the first fixing member 561b and the second fixing member 562b.

[0265] In an embodiment, in the PCB assembly 500 including the plurality of fixing members 561b and 562b and the pressurizing structure 550b, since the stress of the pressurizing structure 550b is mainly transferred to the bracket 535 and indirectly transferred to the first circuit board 510, the stress transferred to the second circuit board 520 and the connecting member 540 can be relatively reduced or minimized. Alternatively, the PCB assembly 500 including the plurality of fixing members 561b and 562b can provide a relatively easy circuit board design of the PCB assembly 500 and / or further improved durability.

[0266] In embodiments, the pressurizing structure 550b may be relatively simple and easy to form and assemble, space efficiency may be improved, and / or the pressurizing structure 550b may be easily managed. The PCB assembly 500 including the pressurizing structure 550b may have advantages in design and manufacturing.

[0267] The PCB assembly in the embodiment may include a first circuit board 310, an electronic component 311, 511 disposed on the first circuit board 311, 511, a second circuit board 320 or 520 connected to the first circuit board 310 or 510, a thermal module 330 or 530 configured to absorb heat from the electronic component 311 or 511, and a pressurizing structure 350, 550, 550a or 550b configured to apply a preload to the thermal module 330 or 530 in a direction toward the electronic component 311 or 511. In an embodiment, the pressurizing structure 350, 550, 550a or 550b in an unfixed state (e.g., not attached to, not adhered to, removed from, separated from, spaced apart from, etc.) relative to the second circuit board 320 or 520 may be supported by the first circuit board 310 or 510 or the external structure 305.

[0268] In an embodiment, the pressurizing structure 350 may penetrate the first circuit board 310 .

[0269] In an embodiment, the pressurizing structure 350 may include a plate-shaped elastic body, a first surface of the pressurizing structure 350 is connected to the thermal module 330 , and a second surface of the pressurizing structure opposite to the first surface is connected to the electronic component 311 .

[0270] In an embodiment, the PCB assembly 300 may include a first fixing member 361 supported by the external structure 305, a second fixing member 362 disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361, and a third fixing member 363 penetrating the pressurizing structure 350 and the second fixing member 362, and the third fixing member may fix the pressurizing structure 350 to the first fixing member 361.

[0271] In an embodiment, the PCB assembly 300 may include a first fixing member 361a supported by the external structure 305, a second fixing member 362a disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361a, a third fixing member 363a supported by the external structure 305 and penetrating the first circuit board 310, and a fourth fixing member 364a disposed on the pressurizing structure 350 and fixing the pressurizing structure 350 to the third fixing member 363a.

[0272] In an embodiment, the PCB assembly 300 may include a first fixing member 361b supported by the external structure 305, a second fixing member 362b disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361b, a third fixing member 363b disposed on the first circuit board 310 and supported by the first circuit board 310, and a fourth fixing member 364b disposed on the pressurizing structure 350 and fixing the pressurizing structure 350 to the third fixing member 363b.

[0273] In an embodiment, the PCB assembly 300 may include a first fixing member 361c supported by the external structure 305, a second fixing member 362c disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361c, a third fixing member 363c supported by the external structure 305 and penetrating the second circuit board 320, and a fourth fixing member 364c disposed on the pressurizing structure 350 and fixing the pressurizing structure 350 to the third fixing member 363c.

[0274] In an embodiment, the PCB assembly 500 may include a bracket 535 connected to the thermal module 530 and fixed to the first circuit board 510, a first fixing member 561 or 561a disposed on the first circuit board 510 and supported by the first circuit board 510, and a second fixing member 562 or 562a disposed on the bracket 535 and fixing the bracket 535 to the first fixing member 561 or 561a. In an embodiment, the pressurizing structure 550 or 550a may be disposed between the bracket 535 and the second fixing member 562 or 562a, and supported by the first circuit board 510 when the first fixing member 561 and the second fixing member 562 or 562a are fixed.

[0275] In an embodiment, the pressurizing structure 550 or 550 a may be pressurized by the second fixing member 562 or 562 a and may apply a preload to the thermal module 530 in a direction toward the electronic component 511 by applying a preload to the bracket 535 in a direction toward the first circuit board 510 .

[0276] In an embodiment, the PCB assembly 500 may include a shielding cover 515 disposed between the bracket 535 and the first circuit board 510, and the shielding cover 515 at least partially surrounds the electronic component 511. In an embodiment, the first fixing member 561 and the second fixing member 562 may be at least partially disposed within the shielding cover 515.

[0277] In an embodiment, the PCB assembly 500 may include a shielding cover 515 disposed between the bracket 535 and the first circuit board 510, and the shielding cover 515 at least partially surrounds the electronic component 511. In an embodiment, the first fixing member 561a and the second fixing member 562a may be at least partially disposed outside the shielding cover 515.

[0278] In an embodiment, the bracket 535 may include a thermal module hole 536 formed at a position corresponding to the electronic component 511. In an embodiment, the thermal module 530 may be disposed in the thermal module hole 536 and substantially contact the electronic component 511.

[0279] In an embodiment, the PCB assembly 500 may include a bracket 535 connected to the thermal module 530 and fixed to the first circuit board 510, a first fixing member 561b disposed on and supported by the bracket 535, and a second fixing member 562b disposed on the first circuit board 510 and fixing the first circuit board 510 to the first fixing member 561b.

[0280] In an embodiment, in the bracket 535 and the thermal module 530 , the pressurizing structure 550 b may be provided on a surface opposite to a surface facing the electronic component 511 , and may apply a preload to the thermal module 530 in a direction toward the electronic component 511 .

[0281] In an embodiment, the pressurizing structure 550b may be supported by the first circuit board 510 through the first fixing member 561b and the second fixing member 562b.

[0282] The PCB assembly in the embodiment may include a first circuit board 310, an electronic component 311 disposed on the first circuit board 310, a second circuit board 320 connected to the first circuit board 310, a thermal module 330 configured to absorb heat from the electronic component 311, and a pressurizing structure 350 disposed between the thermal module 330 and the electronic component 311 and configured to apply a preload to the thermal module 330 in a direction toward the electronic component 311. In the embodiment, the pressurizing structure 350 in an unfixed state (e.g., not attached to, not adhered to, removed from, separated from, spaced apart from, etc.) relative to the second circuit board 320 is supported by the external structure 305 by penetrating the first circuit board 310.

[0283] In an embodiment, the PCB assembly may include a first fixing member 361 supported by an external structure 305, a second fixing member 362 disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361, and a third fixing member 363 penetrating the pressurizing structure 350 and the second fixing member 362, and the third fixing member 363 may fix the pressurizing structure 350 to the first fixing member 361.

[0284] In an embodiment, the PCB assembly may include a first fixing member 361b supported by an external structure 305, a second fixing member 362b disposed on the first circuit board 310 and fixing the first circuit board 310 to the first fixing member 361b, a third fixing member 363b disposed on the first circuit board 310 and supported by the first circuit board 310, and a fourth fixing member 364b disposed on the pressurizing structure 350 and fixing the pressurizing structure 350 to the third fixing member 363b.

[0285] Alternatively, the PCB assembly in the embodiment may include a first circuit board 510, an electronic component 511 disposed on the first circuit board 310, a second circuit board 520 connected to the first circuit board 510, a thermal module 530 configured to absorb heat from the electronic component 511, a bracket 535 connected to the thermal module 530 and fixed to the first circuit board 510, a first fixing member 561 or 561a disposed on the first circuit board 510 and supported by the first circuit board 510, a second fixing member 562 or 562a disposed on the bracket 535 and fixing the bracket 535 to the first fixing member 561 or 561a, and a pressurizing structure 550 or 550a disposed between the bracket 535 and the second fixing member 562 or 562a and configured to apply a preload to the thermal module 530 in a direction toward the electronic component 511. In an embodiment, the pressurized structure 350 that is in an unfixed state relative to the second circuit board 520 (e.g., not attached to the second circuit board 520, not adhered to the second circuit board 520, removed from the second circuit board 520, separated from the second circuit board 520, spaced apart from the second circuit board 520, etc.) can be supported by the first circuit board 510.

[0286] In an embodiment, the PCB assembly may include a shielding case 515 disposed between the bracket 535 and the first circuit board 510 and at least partially surrounding the electronic component 511. In an embodiment, the first fixing member 561a and the second fixing member 562a may be disposed outside the shielding case 515.

[0287] The embodiments are shown and described above, however, the present disclosure is not limited to the foregoing embodiments. A person skilled in the art can implement various modifications within the scope of the claims, and it should not be understood that these modifications exceed the scope.

Claims

1. A printed circuit board (PCB) assembly (300, 500), comprising: A first circuit board (310, 510); An electronic component (311, 511) disposed on a first circuit board (310, 510); A second circuit board (320, 520) connected to the first circuit board (310, 510); A thermal module (330, 530) configured to absorb heat from the electronic component (311, 511); and A pressurizing structure (350, 550, 550a, 550b) is configured to apply a preload to the thermal module (330, 530) in a direction toward the electronic component (311, 511), The pressurizing structure (350, 550, 550a, 550b) is separated from the second circuit board (320, 520) and is supported by the first circuit board (310, 510) or the external structure (305).

2. The PCB assembly (300) according to claim 1, wherein: The pressurizing structure (350) penetrates the first circuit board (310).

3. The PCB assembly (300) according to claim 1 or 2, wherein: The pressurizing structure (350) comprises a plate-shaped elastic body, wherein a first surface of the pressurized structure (350) is connected to the thermal module (330), and A second surface of the pressurizing structure (350) opposite to the first surface is connected to the electronic component (311).

4. The PCB assembly (300) according to any one of claims 1 to 3, further comprising: a first fixing member (361) supported by the external structure (305); a second fixing member (362) disposed on the first circuit board (310) and fixing the first circuit board (310) to the first fixing member (361); and The third fixing member (363) passes through the pressurizing structure (350) and the second fixing member (362), and the third fixing member (363) fixes the pressurizing structure (350) to the first fixing member (361).

5. The PCB assembly (300) according to any one of claims 1 to 4, further comprising: a first fixing member (361a) supported by the external structure (305); a second fixing member (362a) disposed on the first circuit board (310) and configured to fix the first circuit board (310) to the first fixing member (361a); a third fixing member (363a) supported by the external structure (305) and passing through the first circuit board (310); and A fourth fixing member (364a) is disposed on the pressurizing structure (350) and fixes the pressurizing structure (350) to the third fixing member (363a).

6. The PCB assembly (300) according to any one of claims 1 to 5, further comprising: a first fixing member (361b) supported by the external structure (305); a second fixing member (362b) disposed on the first circuit board (310) and fixing the first circuit board (310) to the first fixing member (361b); a third fixing member (363b) disposed on the first circuit board (310) and supported by the first circuit board (310); and A fourth fixing member (364b) is disposed on the pressurizing structure (350) and fixes the pressurizing structure (350) to the third fixing member (363b).

7. The PCB assembly (300) according to any one of claims 1 to 6, further comprising: a first fixing member (361c) supported by the external structure (305); a second fixing member (362c) disposed on the first circuit board (310) and fixing the first circuit board (310) to the first fixing member (361c); a third fixing member (363c) supported by the external structure (305) and passing through the second circuit board (320); and A fourth fixing member (364c) is disposed on the pressurizing structure (350) and fixes the pressurizing structure (350) to the third fixing member (363c).

8. The PCB assembly (500) according to any one of claims 1 to 7, further comprising: a bracket (535) connected to the thermal module (530) and fixed to the first circuit board (510); a first fixing member (561, 561a) disposed on the first circuit board (510) and supported by the first circuit board (510); and a second fixing member (562, 562a) disposed on the bracket (535) and fixing the bracket (535) to the first fixing member (561, 561a), The pressurizing structure (550, 550a) is disposed between the bracket (535) and the second fixing member (562, 562a), and when the first fixing member (561) and the second fixing member (562, 562a) are fixed, the pressurizing structure (550, 550a) is supported by the first circuit board (510).

9. The PCB assembly (500) according to any one of claims 1 to 8, wherein: The pressurizing structure (550, 550a) is pressurized by the second fixing member (562, 562a), and is configured to apply the preload to the thermal module (530) in a direction toward the electronic component (511) by applying the preload to the bracket (535) in a direction toward the first circuit board (510).

10. The PCB assembly (500) according to any one of claims 1 to 9, further comprising: a shielding cover (515) disposed between the bracket (535) and the first circuit board (510), the shielding cover (515) at least partially surrounding the electronic component (511), The first fixing member (561) and the second fixing member (562) are at least partially disposed within the shielding cover (515).

11. The PCB assembly (500) according to any one of claims 1 to 10, further comprising: a shielding cover (515) disposed between the bracket (535) and the first circuit board (510), the shielding cover (515) at least partially surrounding the electronic component (511), The first fixing member (561a) and the second fixing member (562a) are at least partially disposed outside the shielding cover (515).

12. The PCB assembly (500) according to any one of claims 1 to 11, wherein: The bracket (535) includes a thermal module hole (536) disposed at a position corresponding to the electronic component (511), and The thermal module (530) is disposed in the thermal module hole (536) and contacts the electronic component (511).

13. The PCB assembly (500) according to any one of claims 1 to 12, further comprising: a bracket (535) connected to the thermal module (530) and fixed to the first circuit board (510); a first fixing member (561b) disposed on the bracket (535) and supported by the bracket (535); and A second fixing member (562b) is disposed on the first circuit board (510) and fixes the first circuit board (510) to the first fixing member (561b).

14. The PCB assembly (500) according to any one of claims 1 to 13, wherein: In the bracket (535) and the thermal module (530), the pressurizing structure (550b) is provided on a surface opposite to a surface facing the electronic component (511), and applies a preload to the thermal module (530) in a direction toward the electronic component (511).

15. The PCB assembly (500) according to any one of claims 1 to 14, wherein: The pressurizing structure (550b) is supported by the first circuit board (510) via the first fixing member (561b) and the second fixing member (562b).

16. A printed circuit board (PCB) assembly (300), comprising: A first circuit board (310); An electronic component (311) disposed on a first circuit board (310); A second circuit board (320) connected to the first circuit board (310); A thermal module (330) configured to absorb heat from the electronic component (311); and a pressurizing structure (350) disposed between the thermal module (330) and the electronic component (311) and configured to apply a preload to the thermal module (330) in a direction toward the electronic component (311), The pressurizing structure (350) is separated from the second circuit board (320) and is supported by an external structure (305) by penetrating the first circuit board (310).

17. The PCB assembly (300) according to claim 16, further comprising: a first fixing member (361) supported by the external structure (305); a second fixing member (362) disposed on the first circuit board (310) and fixing the first circuit board (310) to the first fixing member (361); and The third fixing member (363) passes through the pressurizing structure (350) and the second fixing member (362), and the third fixing member (363) fixes the pressurizing structure (350) to the first fixing member (361).

18. The PCB assembly (300) according to claim 16 or 17, further comprising: a first fixing member (361b) supported by the external structure (305); a second fixing member (362b) disposed on the first circuit board (310) and fixing the first circuit board (310) to the first fixing member (361b); a third fixing member (363b) disposed on the first circuit board (310) and supported by the first circuit board (310); and A fourth fixing member (364b) is disposed on the pressurizing structure (350) and fixes the pressurizing structure (350) to the third fixing member (363b).

19. A printed circuit board (PCB) assembly (500), comprising: A first circuit board (510); An electronic component (511) disposed on a first circuit board (510); A second circuit board (520) connected to the first circuit board (510); A thermal module (530) configured to absorb heat from the electronic component (511); a bracket (535) connected to the thermal module (530) and fixed to the first circuit board (510); a first fixing member (561, 561a) disposed on the first circuit board (510) and supported by the first circuit board (510); a second fixing member (562, 562a) disposed on the bracket (535) and fixing the bracket (535) to the first fixing member (561, 561a); and A pressurizing structure (550, 550a) is disposed between the bracket (535) and the second fixing member (562, 562a) and is configured to apply a preload to the thermal module (530) in a direction toward the electronic component (511), The pressurizing structure is separated from the second circuit board (520) and supported by the first circuit board (510).

20. The PCB assembly (500) according to claim 19, further comprising: a shielding cover (515), disposed between the bracket (535) and the first circuit board (510) and at least partially surrounding the electronic component (511), The first fixing member (561a) and the second fixing member (562a) are arranged outside the shielding cover (515).

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