Electronic device

Abstract

The electronic device includes: a housing having a space therein and including a heat dissipation channel penetrating from one side to the other side; an electronic component disposed in the space; and a heat dissipation member disposed within the heat dissipation channel and having a coolant flowing therein, in which the heat dissipation channel includes a hole facing the electronic component, and the heat dissipation member is disposed to at least partially overlap the electronic component in a vertical direction through the hole.

Description

Technical Field

[0001] Teachings according to exemplary and non-limiting embodiments of this invention generally relate to electronic devices. Background Art

[0002] Electronic devices in vehicles are usually the engine electrical system (starter, ignition, charging system) and lighting systems, but recently, as vehicles use more and more electronic controls, most systems, including chassis electrical systems, are becoming more electronic.

[0003] Various electronic devices installed in the vehicle (such as lights, audio, heaters and air conditioners) are powered by the battery when the vehicle is stopped, and powered by the generator when the vehicle is in motion. At this time, the power generation capacity of the 14V power supply system is used as the normal power supply voltage.

[0004] In recent years, with the development of the information technology industry, various new technologies (such as motor-driven power steering, the Internet, etc.) have been incorporated into vehicles to increase the convenience of automobiles. It is expected that the development of new technologies that can make full use of current automobile systems will continue in the future.

[0005] The electronic device is formed by a housing. Inside the housing, a plurality of electronic parts for driving are arranged. The plurality of electronic parts generate heat by driving. Summary of the invention

[0006]

Technical Topics

[0007] The present exemplary embodiment provides an electronic device capable of improving heat dissipation efficiency while reducing weight.

[0008]

Technical solution

[0009] In one aspect of the present invention, an electronic device can be provided, comprising: a shell having a space therein and including a heat dissipation channel extending from one side to the other side; an electronic part arranged in the space; and a heat dissipation member arranged in the heat dissipation channel, in which a coolant flows, wherein the heat dissipation channel includes a hole facing the electronic part, and the heat dissipation member is arranged to at least partially overlap with the electronic part in an up and down direction through the hole.

[0010] Preferably, but not necessarily, the housing may be made of plastic, and the heat dissipation member may be made of metal.

[0011] Preferably, but not necessarily, the housing and the heat dissipation component may be integrally formed by insert injection.

[0012] Preferably, but not necessarily, the lower surface of the heat dissipation member facing the electronic parts may be a flat surface.

[0013] Preferably, but not necessarily, the heat dissipation component may include a heat dissipation plate, an upper surface of the heat dissipation plate contacts the heat dissipation channel, and a lower surface of the heat dissipation plate contacts the electronic component.

[0014] Preferably, but not necessarily, the heat sink may be fixed to the inner surface of the housing by screws.

[0015] Preferably, but not necessarily, the inner surface of the housing may include a guide which protrudes more than other areas, the heat dissipation plate is attached to the guide, and the guide may be divided into a plurality of areas by the heat dissipation channels.

[0016] Preferably, but not necessarily, each of the plurality of regions may be fixed together with the heat sink and the electronic parts by screws.

[0017] Preferably, but not necessarily, the region of the upper surface of the electronic component that contacts the heat sink may include a metal material.

[0018] Preferably, but not necessarily, in a region of the upper surface of the housing corresponding to the formation region of the heat dissipation channel, a protrusion protruding upwards than other regions may be formed.

[0019]

Beneficial Effects

[0020] The present exemplary embodiment has an advantage of improving the heat dissipation efficiency of the electronic equipment due to the structure in which the heat dissipation member through which the coolant flows is in contact with the electronic parts through the heat dissipation plate or in direct contact.

[0021] In addition, the metal heat dissipation member is formed integrally with the plastic housing, which has the advantages of making the electronic device lighter and reducing the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a perspective view of one side of an electronic device according to a first exemplary embodiment of the present invention.

[0023] Figure 2 is a perspective view of another side of the electronic device according to the first exemplary embodiment of the present invention.

[0024] Figure 3 is a plan view of a lower surface of an electronic device according to a first exemplary embodiment of the present invention.

[0025] Figure 4 is a perspective view of a housing, a heat sink, and electronic parts according to a first exemplary embodiment of the present invention.

[0026] Figure 5 is a perspective view of a housing, a heat dissipation member, a heat dissipation plate, and electronic parts according to a first exemplary embodiment of the present invention.

[0027] Figure 6 is an exploded view of a housing and a heat dissipation member according to a first exemplary embodiment of the present invention.

[0028] Figure 7 is a plan view showing a combined structure of an electronic part and a heat dissipation member according to a first exemplary embodiment of the present invention.

[0029] Figure 8 is a perspective view of one side of an electronic device according to a second exemplary embodiment of the present invention.

[0030] Fig. 9 is a perspective view of another side of the electronic device according to the second exemplary embodiment of the present invention.

[0031] Fig.10 is a top view of an electronic device according to a second exemplary embodiment of the present invention.

[0032] Fig.11 It is shown Fig.10 A view of the A-A' line in FIG.

[0033] Fig.12 is an exploded perspective view of an electronic device according to a second exemplary embodiment of the present invention.

[0034] Fig.13 Shown from different angles Fig.12 of the view. DETAILED DESCRIPTION

[0035] Exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] However, the present invention is not limited to the given exemplary embodiments described, but may be implemented in various different forms, and one or more components among the exemplary embodiments may be arbitrarily combined or replaced between embodiments within the scope of the present invention.

[0037] In addition, unless explicitly defined and described in detail, the terms (including technical and scientific terms) used in the embodiments of the present invention should be interpreted according to the meaning that can be understood by ordinary technicians in the field to which the present invention belongs, and commonly used terms (such as terms defined in dictionaries) should be interpreted according to their contextual meanings in the relevant field.

[0038] Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments but are not intended to limit the present invention.

[0039] In this specification, unless the context requires otherwise, the singular may include the plural, and a reference to "at least one (or more) of A and / or B and C" may include one or more of any combinations of A, B and C that can be combined.

[0040] In addition, the terms first, second, A, B, (a), (b), etc. may be used to describe the components of the embodiments of the present invention. These terms are only used to distinguish one component from another component, and are not intended to limit the nature, order or sequence of these components by these terms.

[0041] In addition, when a component is described as being “connected,” “coupled” or “attached” to another component, it may include the case where the component is directly “connected,” “coupled” or “attached” to the other component, and it may also include the case where the component is “connected,” “coupled” or “attached” to other components located between the component and the other component.

[0042] Furthermore, when described as being formed or disposed “above” or “below” each component, “above” or “below” includes not only a case where two components are in direct contact, but also a case where one or more other components are formed or disposed between the two components. Furthermore, when expressed as “above” or “below”, the meaning of upward and downward relative to a single component may also be included.

[0043] The electronic device according to an exemplary embodiment of the present invention can be equipped in a vehicle and can include a converter, a pump and an electronic control unit (ECU). However, this is only an example, and the electronic device can include at least one or more electronic parts placed in a housing, and various devices electrically connected through external terminals and connectors.

[0044] Figure 1 is a perspective view of one side of an electronic device according to a first exemplary embodiment of the present invention, Figure 2 is a perspective view of another side of the electronic device according to the first exemplary embodiment of the present invention, Figure 3 is a plan view of the lower surface of the electronic device according to the first exemplary embodiment of the present invention, Figure 4 is a perspective view of a housing, a heat sink, and electronic parts of an electronic device according to a first exemplary embodiment of the present invention, Figure 5 is a perspective view of a housing, a heat dissipation member, a heat dissipation plate, and electronic parts of an electronic device according to a first exemplary embodiment of the present invention, Figure 6 is an exploded view of a housing and a heat dissipation member of an electronic device according to a first exemplary embodiment of the present invention, Figure 7 1 is a plan view showing a combined structure of an electronic part and a heat dissipation member according to a first exemplary embodiment of the present invention.

[0045] Reference Figures 1 to 7 , the electronic device 10 according to the first embodiment of the present invention may include a housing 100 , an electronic part 170 , and a heat dissipation member 200 .

[0046] The housing 100 may form the outer shape of the electronic device 10. The housing 100 may have a rectangular cross-sectional shape. The housing 100 may be shaped like a box. At least one or more parts (including electronic parts 170) for driving the electronic device 10 may be arranged in the space 102 in the housing 100. The space 102 in the housing 100 may be open downward. A cover (not shown) may be attached to the lower surface of the housing 100 to cover the lower surface of the space 102.

[0047] The housing 100 may include an upper plate 103 and a side plate 104 extending downward from an edge of the upper plate 103. The upper plate 103 may form an upper surface of the electronic device 10. The side plate 104 may form a side portion of the electronic device 10. At least one hole or groove may be formed in the side plate 104. External terminals may be coupled to the housing 100 through the holes or grooves.

[0048] A plurality of regions arranged in a staggered (stepped) manner may be formed on the upper surface of the housing 100. Some of the plurality of regions may have a shape that is protruded upward or recessed downward compared to other regions.

[0049] The housing 100 may include a heat dissipation channel 160. The heat dissipation channel 160 is a region in which at least a portion of the heat dissipation member 200 is arranged, and may be formed in the housing 100. One side of the housing 100 may be formed with a first opening 161 (see Figure 6 ), the other side of the housing 100 may be formed with a second opening 162 constituting the other end of the heat dissipation channel 160. The heat dissipation channel 160 may be formed as a line defined from the first opening 161 to the second opening 162. The cross section of the heat dissipation channel 160 may be formed to correspond to the cross-sectional shape of the heat dissipation member 200. For example, the shape of the heat dissipation channel 160 may be circular.

[0050] The heat dissipation channel 160 may have an area bent at least once. The heat dissipation channel 160 may be arranged in a manner overlapping with the electronic part 170 in the up-down direction. One side of the housing 100 formed with the first opening 161 and the other side of the housing 100 formed with the second opening 162 may be disposed adjacent to each other. One side of the housing 100 formed with the first opening 161 and the other side of the housing 100 formed with the second opening 162 may be positioned perpendicular to each other.

[0051] The protrusion 110 may be formed in an area of ​​the upper surface of the housing 100 corresponding to the formation area of ​​the heat dissipation channel 160, and the protrusion protrudes upward from the area of ​​the housing 100 corresponding to the formation area of ​​the heat dissipation channel 160. The heat dissipation channel 160 may be formed on the inner side of the protrusion 110.

[0052] The hole 163 may be formed in the lower surface of the heat dissipation channel 160 facing the electronic part 170. The hole 163 may be arranged to overlap with the electronic part 170 in the vertical direction. The space in the heat dissipation channel 160 may be opened downward through the hole 163. When the heat dissipation channel 160 is observed from the side, the hole 163 may have an arc-shaped cross-section. The space in the heat dissipation channel 160 may be exposed downward through the hole 163. Through the hole 163, the heat dissipation member 200 may be exposed downward (which is the direction facing the electronic part 170).

[0053] A rib (not shown) protruding downward may be formed on the lower surface of the upper plate 103. The rib may increase the surface area of ​​the housing 100. Therefore, the heat dissipation efficiency of the housing 100 may be improved.

[0054] A connector (not shown) may be disposed at a side of the housing 100. Depending on the material properties of the housing 100, the connector may be formed as one body with the housing 100.

[0055] The material of the housing 100 may be plastic, so that the electronic device 10 can be made lightweight.

[0056] The housing 100 may include a guide member 180. Figure 4 As shown, the guide 180 may have a shape protruding downward from the lower surface of the upper plate 103. The guide 180 may be located outside the heat dissipation channel 160. The guide 180 may have a rectangular cross-section. The guide 180 may be divided into two areas by the heat dissipation channel 160. The guide 180 may be located outside the area in which the hole 163 is formed in the heat dissipation channel 160. The lower surface of the guide 180 may be located above the lower surface of the heat dissipation channel 160. The lower surface of the guide 180 may be located above the lower surface of the heat dissipation member 200. However, this is only an example, and the lower surface of the guide 180 may also be positioned to be in the same plane as the lower surface of the flat surface 232 in the heat dissipation channel 160 and the heat dissipation member 200 described later.

[0057] On the lower surface of the guide 180, a guide protrusion 182 and a first threaded hole 186 may be formed. The guide protrusion 182 may have a shape that protrudes downward from the lower surface of the guide 180. The guide protrusion 182 may be provided in a plurality of quantities and may be arranged facing each other with respect to the heat dissipation channel 160. The guide protrusion 182 may be arranged in a corner area of ​​the lower surface of the guide 180. The first threaded hole 186 may have a shape that is recessed upward from the lower surface of the guide 180 in different areas. The inner surface of the first threaded hole 186 may be formed with a thread or a thread groove. The first threaded hole 186 may be provided in a plurality of quantities and arranged at a distance from each other. A plurality of first threaded holes 186 may be arranged relatively with respect to the heat dissipation channel 160.

[0058] At least one electronic part may be arranged in the space 102 in the housing 100. A printed circuit board (not shown) may be arranged in the space 102 in the housing 100. The printed circuit board may be formed in a plate shape, and one or more parts for driving may be arranged (mounted) on one side or the other side.

[0059] An electronic component 170 may be arranged in the space 102 in the housing 100. The electronic component 170 may be mounted on the upper surface of a printed circuit board. The electronic component 170 may include a plurality of pins 172 for connecting to the printed circuit board. The electronic component 170 may include a core and a plurality of pins 172 extending from the side of the core. The electronic component 170 may generate heat by being driven. The electronic component 170 may be arranged on the lower surface of the upper plate 103 of the housing 100.

[0060] The electronic part 170 may be arranged to overlap the heat dissipation passage 160 in the up-down direction. The electronic part 170 may be arranged to overlap at least a portion of the heat dissipation member 200 in the up-down direction. The electronic part 170 may be arranged to overlap the hole 163 of the heat dissipation passage 160 in the up-down direction. The heat dissipation passage 160 may be arranged to overlap the guide 180 in the up-down direction.

[0061] The electronic part 170 may be fixed to the lower surface of the guide member 180 by a screw. To this end, the electronic part 170 may include a second threaded hole 171 facing the first threaded hole 186. Similar to the first threaded hole 186, the second threaded hole 171 may be provided as a plurality of holes and may be arranged at a distance from each other. When the electronic part 170 and the guide member 180 are combined, the screw 177 may pass through the second threaded hole 171 and be screwed into the first threaded hole 186.

[0062] The electronic device 10 may include a heat dissipation member 200. The heat dissipation member 200 may be formed with a flow channel so that a coolant flows therein. The heat dissipation member 200 may be formed in a tubular shape. The heat dissipation member 200 may have an annular cross section. The heat dissipation member 200 may be arranged in the heat dissipation channel 160. Both ends of the heat dissipation member 200 may protrude from the outer surface of the housing 100 through the first opening 161 and the second opening 162 of the heat dissipation channel 160. The heat dissipation member 200 may be at least partially exposed in the downward direction of the space 102 in the housing 100 through the hole 163. The heat dissipation member 200 may be arranged to be opposite to the electronic part 170 through the hole 163.

[0063] The heat dissipation member 200 may be formed of metal and may be integrally formed with the housing 100 made of plastic by insert injection.

[0064] At one end of the heat dissipation member 200, a coolant inlet 210 for introducing a coolant into the flow channel may be formed, and at the other end of the heat dissipation member 200, a coolant outlet 220 for discharging the coolant that has circulated in the flow channel may be formed. The coolant inlet 210 and the coolant outlet 220 may be arranged in parallel. The heat dissipation member 200 may be formed as a line defined from the coolant inlet 210 to the coolant outlet 220. As described above, the area where the coolant inlet 210 is located and the area where the coolant outlet 220 is located may be perpendicular to each other.

[0065] The heat dissipation member 200 may have at least one bending region.

[0066] Specifically, the heat dissipation member 200 may include a contact portion 230 disposed between the coolant inlet 210 and the coolant outlet 220. The contact portion 230 may be bent from the end of the coolant inlet 210 and extend toward the coolant outlet 220. The contact portion 230 may be positioned to form an obtuse angle with the coolant inlet 210 or the coolant outlet 220. The contact portion 230 may be arranged to connect one side and the other side of the housing 100 that are arranged adjacent to each other. A first bent portion 273 may be formed between the contact portion 230 and the coolant inlet 210.

[0067] The contact portion 230 may be disposed in the heat dissipation channel 160. The contact portion 230 may be exposed at the lower surface of the space 102 in the housing 100 through the hole 163. The lower surface of the contact portion 230 may be disposed to face the electronic part 170. A flat surface 232 may be formed on the lower surface of the contact portion 230, which is exposed to the lower surface of the heat dissipation channel 160 through the hole 163. The heat dissipation member 200, except for the contact portion 230, is a tube having a circular cross-sectional shape, but the cross-sectional area of ​​the contact portion 230 forming area may not be circular due to the presence of the flat surface 232.

[0068] The flat surface 232 may be formed to be stepped upward from other regions of the heat dissipation member 200. Based on the lower surface of the heat dissipation member 200, a formation region of the flat surface 232 may have a groove shape.

[0069] The flat surface 232 can be formed by press-processing the heat dissipation member 200. Before insert injection of the housing 100 and the heat dissipation member 200 is performed, the flat surface 232 can be pre-formed in the heat dissipation member 200. The flat surface 232 can be formed in the lower surface of the contact portion 230 in an area facing the electronic part 170 or the heat dissipation plate 300 (described later). The flat surface 232 can be a surface parallel to the upper surface or lower surface of the upper plate 103 of the housing 100. The flat surface 232 can be a surface parallel to the upper surface of the electronic part 170 or the upper surface of the heat dissipation plate 300. The flat surface 232 can be in contact with the upper surface of the heat dissipation plate 300 or the upper surface of the electronic part 170. An inclined surface can be formed on the surface connecting the flat surface 232 in the heat dissipation member 200 and other areas.

[0070] The heat dissipation member 200 may further include a connection portion 250 in addition to the contact portion 230, and both ends of the connection portion 250 may be connected to the contact portion 230 and the coolant outlet 220. The connection portion 250 may be positioned perpendicular to the coolant inlet 210 or the coolant outlet 220. The connection portion 250 may be positioned to form an obtuse angle with the contact portion 230. The connection portion 250 may be at least partially located outside the heat dissipation channel 160.

[0071] A second bending portion 272 may be formed between the connection portion 250 and the contact portion 230, and a third bending portion 271 may be formed between the connection portion 250 and the coolant outlet 220. The first and second bending portions 273 and 272 may be arranged to overlap the housing 100 in the up-and-down direction.

[0072] The electronic device 10 may include a heat dissipation plate 300. The heat dissipation plate 300 may be arranged between the lower surface of the guide 180 and the upper surface of the electronic part 170. The heat dissipation plate 300 may be arranged between the lower surface of the contact portion 230 exposed downward through the hole 163 and the upper surface of the electronic part 170. The heat dissipation plate 300 may be provided between the flat surface 232 and the upper surface of the electronic part 170. The upper surface of the heat dissipation plate 300 may contact the flat surface 232, and the lower surface thereof may contact the upper surface of the electronic part 170.

[0073] The heat dissipation plate 300 may be plate-shaped and may be made of metal. The heat dissipation plate 300 may include a guide hole 310 in which the guide protrusion 182 is engaged and a third threaded hole 186, the third threaded hole facing the first threaded hole 186 and the second threaded hole 171. When the heat dissipation plate 300 and the guide 180 are combined, the guide protrusion 182 may be combined with the guide hole 310. In addition, the screw 177 may be screwed into the first threaded hole 186 through the second threaded hole 171 and the third threaded hole 186.

[0074] A heat dissipation tape (not shown) made of a material having good thermal conductivity may be provided between the heat dissipation plate 300 and the upper surface of the electronic component 170. An adhesive material may be coated on one or both sides of the heat dissipation tape to bond the heat dissipation plate 300 and the electronic component 170 together.

[0075] At the same time, if Figure 7 As shown, a metal plate 179 made of metal may be formed on the lower surface of the heat dissipation plate 300 or on the upper surface of the electronic part 170 in contact with the flat surface 232. The metal plate 179 may be exposed upward from the upper surface of the core of the electronic part 170 and contact the lower surface of the heat dissipation plate 300.

[0076] According to the above structure, the structure in which the heat dissipation member through which the coolant flows is in contact with the electronic parts through the heat dissipation plate has an advantage of improving the heat dissipation efficiency of the electronic equipment.

[0077] In addition, the metal heat dissipation member is integrated with the plastic housing, which has the advantages of making the electronic device lighter and reducing the manufacturing cost.

[0078] An electronic device according to a second exemplary embodiment of the present invention is described below.

[0079] Figure 8 is a perspective view of one side of an electronic device according to a second exemplary embodiment of the present invention, Fig. 9 shows a perspective view of another side of the electronic device according to the second exemplary embodiment of the present invention, Fig.10 is a top view of an electronic device according to a second exemplary embodiment of the present invention, Fig.11 It shows Fig.10 The view of the A-A' section, Fig.12 is an exploded perspective view of an electronic device according to a second exemplary embodiment of the present invention, and Fig.13 Shown from different angles Fig.12 of the view.

[0080] See also Figures 8 to 13 , the electronic device 20 according to the second exemplary embodiment of the present invention may include a housing 1100 , an electronic part 1170 , and a heat dissipation member 1200 .

[0081] The housing 1100 may form the outer shape of the electronic device 20. The housing 1100 may have a rectangular cross-sectional shape. The housing 1100 may be shaped like a box. At least one configuration (including an electronic part 1170) for driving the electronic device 20 may be arranged in the space 1108 in the housing 1100. The space 1108 in the housing 1100 may be open downward. A cover (not shown) may be coupled to the lower surface of the housing 1100 to cover the lower surface of the space 1108.

[0082] The housing 1100 may include an upper plate and a side plate bent from the edge of the upper plate and extending downward. The upper plate may form the upper surface of the electronic device 20. The side plate may form the side of the electronic device 20. At least one hole or groove may be formed in the side plate. The external terminal may be connected to the configuration provided in the housing 1100 through these holes or grooves.

[0083] A plurality of mutually staggered (stepped) regions may be formed on the upper surface of the housing 1100. The upper surface of the housing 1100 may include a first region 1101 and a second region 1102. The upper surface of the first region 1101 may be located above the upper surface of the second region 1102. The upper surface of the second region 1102 may be arranged to be lower in a step-like manner relative to the upper surface of the first region 1102.

[0084] On the upper surface of the second region 1102, a coupling groove 1110 and a hole 1112 may be formed, both of which are coupled to the heat dissipation member 1200 to be described below. The coupling groove 1110 may be formed by being recessed downwardly by a predetermined distance from the upper surface of the second region 1102. The lower surface of the coupling groove 1110 may be formed with a step (stepwise) lower than the upper surface of the second region 1102. A base 1210 of the heat dissipation member 1200 to be described later may be coupled to the coupling groove 1110. The cross-sectional shape of the coupling groove 1110 may be formed to correspond to the cross-sectional shape of the base 1210. The cross-sectional shape of the coupling groove 1110 may be substantially or shape.

[0085] The hole 1112 may be formed to penetrate the lower surface of the upper plate from the bottom surface of the coupling groove 1110. A heat dissipation plate 1212 of a heat dissipation member 1200 to be described below may be disposed in the hole 1112. The cross section of the hole 1112 may be approximately The cross-sectional area of ​​the hole 1112 may be smaller than the cross-sectional area of ​​the coupling groove 1110 .

[0086] A region of the lower surface of the upper plate corresponding to a coupling groove 1110 forming area may be shaped to protrude downward from other regions.

[0087] The connector 1190 may be provided on the side of the housing 1100. The connector 1190 may be provided to penetrate the side of the housing 1100. An external terminal (not shown) may be coupled to the connector 1190, and by coupling the external terminal, power may be supplied to the electronic device 20 or control signals related to the operation of the electronic device 20 may be transmitted and received. The connector pins may be provided within the internal space of the connector 1190, and may be electrically connected to a printed circuit board (not shown) disposed within the space 1108 of the housing 1100. Depending on the material properties of the housing 1100, the connector 1190 may be formed as a single unit with the housing 1100.

[0088] A protrusion (not shown) protruding downward may be formed on the lower surface of the upper plate of the housing 1100. The protrusion may increase the surface area of ​​the housing 1100. Therefore, the heat dissipation efficiency of the housing 1100 may be improved.

[0089] The housing 1100 may be made of plastic, so that the electronic device 20 can be made lightweight.

[0090] The housing 1100 may include a ventilation structure. The ventilation structure may include an air hole extending from the outer surface of the housing 1100 through the inner surface and a film 1160 arranged to cover the air hole. The hole may be arranged in the first area 1101. The film 1160 may be made of a breathable and waterproof material and may be arranged to cover the hole. The film 1160 may be thermally coupled to the hole in the housing 1100.

[0091] At least one electronic part may be disposed in the space 1108 within the housing 1100. A printed circuit board (not shown) may be disposed in the space 1108 within the housing 1100. The printed circuit board may be formed in a plate shape, and at least one or more parts for driving may be disposed (mounted) on one side or the other side. The printed circuit board may be coupled to the connector pins of the connector 1190.

[0092] The electronic part 1170 may be arranged in the space 1108 within the housing 1100. The electronic part 1170 may be mounted on one side of a printed circuit board. The electronic part 1170 may include a plurality of pins 1172 for coupling with the printed circuit board. The electronic part 1170 may include a core and a plurality of pins 1172 extending from the side of the core. The electronic part 1170 may generate heat when operating.

[0093] The electronic parts 1170 may be disposed on a lower surface of the upper plate of the housing 1100 .

[0094] The electronic device 20 may include a heat dissipation member 1200. The heat dissipation member 1200 may be disposed such that at least a portion thereof penetrates the housing 1100. The heat dissipation member 1200 may include a body 1220, a first tube 1280, a second tube 1290, and a heat dissipation plate 1212.

[0095] The body 1220 may be disposed on the upper surface of the housing 1100. The cross section of the body 1220 may be substantially in the shape of a letter The body 1220 may have a shape. A flow channel through which the coolant flows may be formed in the body 1220. A first opening 1232 may be formed on one side of the body 1220, and a second opening may be formed on the other side of the body 1220, the first opening forming one end of the flow channel, and the second opening forming the other end of the flow channel. The first opening 1232 may be referred to as a coolant inlet. The second opening may be referred to as a coolant outlet.

[0096] The flow channel may be formed as a line defined from the first opening 1232 to the second opening. The flow channel may have at least one bend. The flow channel may be arranged to overlap the electronic part 1170 in the up and down direction. One side of the body 1220 formed with the first opening 1232 and the other side of the body 1220 formed with the second opening may be arranged perpendicular to each other.

[0097] A base 1210 having a larger cross-sectional area than other regions may be formed at the lower end of the body 1220. The base 1210 may be formed as one body with the body 1220. The cross section of the base 1210 may be formed to correspond to the cross-sectional shape of the coupling groove 1110. The base 1210 may be a plate-shaped with a predetermined thickness. The base 1210 may contact the bottom surface of the coupling groove 1110.

[0098] The body 1220 and the base 1210 may be formed of metal and may be formed as one body. The body 1220 and the base 1210 may be formed as one body with the housing 1100 made of plastic by insert injection.

[0099] The first tube 1280 may be coupled to the first opening 1232. The first tube 1280 may be tubular. The coolant may be introduced into a flow passage in the body 1220 through the first tube 1280. The first tube 1280 may be a coolant inlet.

[0100] The second tube 1290 may be coupled to the second opening. The second tube 1290 may be tubular. The coolant in the flow channel may be discharged to the outside through the second tube 1290. The second tube 1290 may be a coolant outlet.

[0101] However, this is only an example, and the second tube 1290 may be a coolant inlet, and the first tube 1280 may be a coolant outlet.

[0102] The first tube 1280 and the second tube 1290 may be arranged perpendicularly to each other on the housing 1100 .

[0103] The heat dissipation plate 1212 may be coupled to the lower surface of the body 1220. The heat dissipation plate 1212 may be coupled to the lower surface of the base 1210. The cross-sectional shape of the heat dissipation plate 1212 may be formed to correspond to the cross-sectional shape of the hole 1112. The heat dissipation plate 1212 may be made of metal and may be formed as one body with the body 1220 and the base 1210. The lower surface of the heat dissipation plate 1212 may be set downward relative to the lower surface of the base 1210 and be stepped (stair-shaped).

[0104] A first screw hole 1213 may be formed on the lower surface of the heat dissipation plate 1212. The first screw holes 1213 may be provided in a plurality and may be spaced apart from each other.

[0105] The lower surface of the heat sink 1212 may be coupled to the electronic part 1170. The lower surface of the heat sink 1212 and the upper surface of the electronic part 1170 may be in contact. The lower surface of the heat sink 1212 may be in contact with the upper surface of the core of the electronic part 1170. The electronic part 1170 may be fixed to the heat sink 1212 by screws. A second screw hole may be formed in the electronic part 1170 in an area facing the first screw hole 1213. Therefore, when the screw 1177 passes through the second screw hole and is coupled to the first screw hole 1213, the electronic part 1170 may be fixed to the lower surface of the heat sink 1212 by screws. The second screw hole may also be provided in a plurality of quantities, corresponding to the number of the first screw holes.

[0106] In addition to the above-mentioned screw connection, a heat dissipation belt (not shown) made of a material with good thermal conductivity can also be provided between the lower surface of the heat dissipation plate 1212 and the upper surface of the electronic component 1170. One or both sides of the heat dissipation belt can be coated with an adhesive material to allow the heat dissipation plate 1212 and the electronic component 1170 to be connected together.

[0107] According to the above structure, the structure in which the heat dissipation member through which the coolant flows is in direct contact with the electronic parts has an advantage of improving the heat dissipation efficiency.

[0108] In addition, the metal heat dissipation member is formed integrally with the plastic housing, which has the advantages of reducing the weight of the electronic device and lowering the manufacturing cost.

[0109] In the above, even if all the components constituting an embodiment of the present invention are described as being combined or operated by combining them, this embodiment is not necessarily limited. In other words, within the scope of the present invention, all components can be selectively combined and operated with one or more of them. In addition, unless otherwise clearly stated to the contrary, the terms "including", "comprising" or "having" used herein are intended to indicate that the component may be inherent and should be interpreted as including other components, rather than excluding other components. Unless otherwise defined, all terms (including technical or scientific terms) have the same meaning as those generally understood by ordinary technicians in the field to which the present invention belongs. Common terms (such as dictionary terms) should be interpreted in a manner consistent with their contextual meanings in the relevant field, and unless clearly defined in the present invention, should not be interpreted in an idealized or overly formal sense.

[0110] The above description is only an illustrative example of the technical idea of ​​the present invention, and a person of ordinary knowledge in the technical field to which the present invention belongs will be able to make various modifications and changes without departing from the basic features of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of ​​the present invention, but are intended to explain the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the attached claims, and all technical ideas within the scope of their equivalents should be interpreted as included in the protection scope of the present invention.

Claims

1. An electronic device, comprising: A housing, wherein a space is formed inside the housing and includes a heat dissipation channel extending from one side to the other side; electronic components, arranged in the space; as well as a heat dissipation member disposed in the heat dissipation channel and in which a coolant flows, The heat dissipation channel includes a hole facing the electronic component, and the heat dissipation member is arranged to at least partially overlap the electronic component in the up-down direction through the hole. 2 . The electronic device according to claim 1 , wherein the housing is made of plastic, and the heat dissipation member is made of metal. 3 . The electronic device according to claim 2 , wherein the housing and the heat dissipation member are integrally formed by insert injection. 4 . The electronic device according to claim 1 , wherein a lower surface of the heat dissipation member facing the electronic part is a flat surface. 5 . The electronic device according to claim 1 , comprising a heat dissipation plate, wherein an upper surface of the heat dissipation plate contacts the heat dissipation channel, and a lower surface of the heat dissipation plate contacts the electronic component. 6 . The electronic device according to claim 5 , wherein the heat dissipation plate is fixed to the inner surface of the housing with screws. 7 . The electronic device according to claim 6 , wherein the inner surface of the housing comprises a guide member protruding more than other areas, the heat dissipation plate is attached to the guide member, and the guide member is divided into a plurality of areas by the heat dissipation channel. 8 . The electronic device according to claim 7 , wherein each of the plurality of regions is fixed to the heat sink and the electronic part by a screw. 9 . The electronic device according to claim 5 , wherein a region of the upper surface of the electronic part that contacts the heat sink comprises a metal material. 10 . The electronic device according to claim 1 , wherein a protrusion that protrudes upward from other regions is formed in a region of the upper surface of the housing corresponding to a formation region of the heat dissipation channel.

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