Semiconductor drying and heating gas treatment device for cable dehumidification

Abstract

The invention discloses a semiconductor drying and heating gas treatment device for cable dehumidification, and belongs to the technical field of cable air dehumidification. The device comprises a shell, wherein an air inlet, an air outlet and a water outlet are formed in the shell; at least two groups of cold and hot cavities are formed in the shell; gas from the gas inlet to the gas outlet flows upwards, the gas inlet, the at least two groups of cold and hot cavities and the gas outlet are communicated in sequence, and each group of cold and hot cavities comprises a cold cavity and a hot cavity which are communicated in sequence and are provided with water outlets; the hot ends of the semiconductor coolers are arranged in the hot cavity, and the cold ends of the semiconductor coolers are arranged in the cold cavity; the detection assembly is used for detecting the temperature and the water content of gas in each cavity; and the control assembly is electrically connected with the detection assembly and the semiconductor cooler, and the control assembly is used for receiving the temperature and water content data of the detection assembly and adjusting the refrigerating capacity and the heating capacity of the semiconductor cooler according to the temperature and water content data. The device is small in size and good in dehumidification effect.

Description

Technical Field

[0001] The invention relates to the technical field of cable air dehumidification, in particular to a semiconductor drying and heating gas processing device for cable dehumidification. Background Art

[0002] Cable dehumidification is an important part of cable safety protection. This part usually involves injecting qualified gas into the damp cable to dehumidify it. The qualified air needs to meet two requirements, namely, the moisture content and temperature must meet the standards. Otherwise, excessive temperature will reduce the resistance of the cable's insulation material and increase the dielectric loss, seriously affecting the cable's service life. Excessive moisture content will result in incomplete cable dehumidification.

[0003] Nitrogen is often used in existing technologies, but the use of nitrogen is limited by many technical and safety factors. First of all, the damp cables that need to be treated are mostly at construction sites or emergency repair sites, where the on-site environment is complex and the space is small. Nitrogen cylinders are large in size and heavy in weight. A single nitrogen cylinder often weighs dozens of kilograms, which is not easy to transport and is not suitable for deployment on site. In addition, some technologies use refrigeration equipment and heating equipment to dry and heat the gas once to achieve dehumidification. However, they only perform a single drying and heating treatment, and the temperature and water content of the gas are not accurately controlled, resulting in poor dehumidification effect. Summary of the invention

[0004] The invention provides a semiconductor drying and heating gas processing device for cable dehumidification, aiming to solve the problem that the existing air device for cable dehumidification has a large volume and a poor dehumidification effect.

[0005] The present invention provides a semiconductor drying and heating gas processing device for cable dehumidification, comprising:

[0006] A shell, wherein the shell is provided with an air inlet, an air outlet and a water outlet; the shell has at least two groups of cold and hot chambers; in the gas flow direction from the air inlet to the air outlet, the air inlet, at least two groups of the cold and hot chambers and the air outlet are connected in sequence, and each group of the cold and hot chambers includes a cold chamber and a hot chamber with the water outlet connected in sequence;

[0007] At least two semiconductor refrigerators, the hot end of the semiconductor refrigerator is arranged in the hot cavity, and the cold end of the semiconductor refrigerator is arranged in the cold cavity;

[0008] A detection component, the detection component is used to detect the temperature and water content of the gas in each cavity;

[0009] A control component is electrically connected to the detection component and the semiconductor refrigerator, and is used to receive temperature and water content data of the detection component, and adjust the cooling capacity and heating capacity of the semiconductor refrigerator according to the temperature and water content data.

[0010] In one of the embodiments, a condensing component is provided in the cold chamber, and a heat dissipation component is provided in the hot chamber;

[0011] The condensing component is connected to the cold end of the semiconductor refrigerator, and the heat dissipation component is connected to the hot end of the semiconductor refrigerator.

[0012] In one embodiment, the condensing assembly includes a plurality of condensing sheets, and the plurality of condensing sheets are regularly arranged.

[0013] In one embodiment, the condenser sheet is an L-shaped condenser sheet;

[0014] Along the gas flow direction, the height of the L-shaped condensing plate gradually decreases, and the bottom of the L-shaped condensing plate is inclined.

[0015] In one of the embodiments, the heat dissipation assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are regularly arranged.

[0016] In one of the embodiments, the heat sink is an L-shaped heat sink;

[0017] The L-shaped heat sink comprises a first sheet body and a second sheet body;

[0018] The first sheet is located above a communication port between the cold chamber and the hot chamber, and the second sheet is aligned with the communication port.

[0019] In one of the embodiments, the air inlet and the air outlet are arranged on the same shell wall side of the shell, and the two groups of cold and hot chambers are arranged symmetrically to the center.

[0020] In one of the embodiments, a first vertical partition and a plurality of second vertical partitions are fixed to the inner wall of the shell;

[0021] The first vertical partition separates the interior of the shell into at least two cold and hot chambers, and a first flow hole for connecting different cold and hot chambers is provided on the top of the first vertical partition;

[0022] The second vertical partition is arranged in the cold and hot chamber, the second vertical partition divides the cold and hot chamber into the cold chamber and the hot chamber, a second flow hole is arranged on the second vertical partition, and the semiconductor refrigerator is installed on the second vertical partition.

[0023] In one embodiment, the heights of the air inlet, the air outlet, and the first flow hole are all higher than the height of the second flow hole.

[0024] In one embodiment, the hot cavity and the cold cavity are both wrapped with heat insulating materials;

[0025] The water outlet is connected to a bend pipe through a pipeline, the water inlet end of the bend pipe is arranged on the inner bottom surface of the cold chamber, the height of the water inlet end of the bend pipe is higher than the height of the water outlet, and the height of the water inlet end of the bend pipe is lower than the height of the peripheral edge of the inner bottom surface of the cold chamber.

[0026] It can be seen from the above technical solutions that the present invention has the following advantages:

[0027] The present embodiment provides a semiconductor drying and heating gas treatment device for cable dehumidification. Since a semiconductor refrigerator is used, the semiconductor refrigerator is small in size and can achieve cooling and heating in the compact space of the present embodiment, reducing the volume and weight of the whole machine; and since the air inlet, at least two groups of cold and hot chambers and the air outlet are connected in sequence, and each group of cold and hot chambers includes a cold chamber and a hot chamber with a water outlet connected in sequence, after the air enters, it will first undergo a preliminary drying and heating treatment in the first group of cold and hot chambers, that is, it will first be condensed and dried in the cold chamber to remove water, and then heated in the hot air. In the first treatment The semiconductor refrigerator cooperates with the detection component and the controller to reduce the temperature and moisture content of the air to the preset intermediate range. Then, the air that has undergone the initial drying and heating treatment will undergo a secondary drying and heating treatment in the second set of cold and hot chambers. The heated gas can increase the temperature difference of the second cooling process, thereby accelerating the condensation of moisture. In the second treatment, the semiconductor refrigerator cooperates with the detection component and the controller to reduce the humidity and moisture content of the air to the range required for cable dehumidification, thereby achieving precise control of the air temperature and moisture content; it effectively solves the problem that the existing air devices for cable dehumidification are large in size and have poor dehumidification effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 A horizontal cross-sectional view of a semiconductor drying and heating gas processing device for cable moisture removal provided by an embodiment of the present invention;

[0030] Figure 2 A vertical cross-sectional view of a first cold chamber and a first hot chamber provided in an embodiment of the present invention;

[0031] Figure 3 A vertical cross-sectional view of a first hot chamber and a second cold chamber provided in an embodiment of the present invention;

[0032] Figure 4 A vertical cross-sectional view of a second cold chamber and a second hot chamber provided in an embodiment of the present invention.

[0033] Reference numerals:

[0034] 1. Shell; 10. Air inlet; 11. Air outlet; 12. Water outlet; 13. Hot and cold chambers; 13a. First hot and cold chambers; 13b. Second hot and cold chambers; 130. Cold chamber; 130a. First cold chamber; 130b. Second cold chamber; 131. Hot chamber; 131a. First hot chamber; 131b. Second hot chamber; 14. First vertical partition; 140. First flow hole; 15. Second vertical partition; 150. Second flow hole; 16. Bend pipe; 2. Semiconductor refrigerator; 20. DC power supply; 200. DC power supply charging port; 3. Detection component; 4. Control component; 5. Condensation component; 50. Condensation sheet; 6. Heat dissipation component; 60. Heat dissipation sheet. DETAILED DESCRIPTION

[0035] The embodiment of the present invention provides a semiconductor drying and heating gas processing device for cable dehumidification, which is used to solve the technical problems that the existing air devices for cable dehumidification are large in size and have poor dehumidification effect.

[0036] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figures 1 to 4 The present invention provides a semiconductor drying and heating gas processing device for cable dehumidification, comprising:

[0038] A shell, wherein the shell is provided with an air inlet, an air outlet and a water outlet; the shell has at least two groups of cold and hot chambers 13; in the gas flow direction from the air inlet 10 to the air outlet 11, the air inlet 10, the at least two groups of cold and hot chambers 13 and the air outlet 11 are sequentially connected, and each group of cold and hot chambers 13 includes a cold chamber 130 and a hot chamber 131 with a water outlet 12 that are sequentially connected;

[0039] At least two semiconductor refrigerators 2, the hot end of the semiconductor refrigerator 2 is arranged in the hot cavity 131, and the cold end of the semiconductor refrigerator 2 is arranged in the cold cavity 130;

[0040] Detection component 3, detection component 3 is used to detect the temperature and water content of the gas in each cavity;

[0041] The control component 4 is electrically connected to the detection component 3 and the semiconductor refrigerator 2. The control component 4 is used to receive the temperature and water content data of the detection component 3, and adjust the cooling capacity and heating capacity of the semiconductor refrigerator 2 according to the temperature and water content data.

[0042] During the working process of this embodiment, the outlet 11 of the semiconductor drying and heating gas treatment device for cable dehumidification is connected to the cable, and then the air or the gas to be treated is pumped into the semiconductor drying and heating gas treatment device for cable dehumidification through the air inlet 10, and the air enters the cold chamber 130 (hereinafter referred to as the first cold chamber 130a) of the first cold and hot chamber 13a for condensation and drying to remove water, and then the air enters the hot chamber 131 (hereinafter referred to as the first hot chamber 131a) of the first cold and hot chamber 13a for the first temperature increase, so that the temperature and moisture content of the air reach the first gradient range. Then the air will enter the cold chamber 130 (hereinafter referred to as the second cold chamber 130b) of the second cold and hot chamber 13 for condensation, drying and dehumidification, and finally the air will enter the hot chamber 131 (hereinafter referred to as the second hot chamber 131b) of the second cold and hot chamber 13b for a second temperature increase, and finally pass into the cable for dehumidification. When the air enters each chamber, the detection component 3 will detect and record the temperature and moisture content of the air, and feed back to the detection component 3 to control the cooling capacity or heating capacity of the semiconductor refrigerator 2 in each chamber, so that the temperature and moisture content of the air reach the preset standard of the chamber.

[0043] It can be seen from the above process that the moisture content and temperature of the air will be recorded when it enters the first cold chamber 130a, and then the detection component 3 will transmit the moisture content and temperature to the control component 4. The control component 4 will judge based on the moisture content and temperature and the preset threshold value to determine whether it is necessary to adjust the cooling capacity of the current cold chamber 130 so that the moisture content and temperature of the air are adjusted to within the preset range. Then, when the air enters the first hot chamber 131a and other chambers, the moisture content and temperature will also be recorded. The steps are the same as those of the first cold chamber 130. The entire dehumidification process of the air is carried out under the signal detection of the detection component 3 and the control component 4.

[0044] Compared with the prior art, the advantages of this embodiment are:

[0045] First, it is small in size and highly portable. The cooling and heating of this embodiment are both realized by the semiconductor refrigerator 2. Compared with the prior art, which uses nitrogen bottles, desiccants, water-cooled and air-cooled dehumidifiers, etc., the semiconductor refrigerator 2 of this embodiment is small in size and light in weight. The entire device can be carried to various complex environments and narrow spaces for application without explosion hazard, and is more suitable for on-site working environments.

[0046] Second, the control of temperature and humidity is more precise. On the one hand, the air is first preliminarily dried and heated in the first cold and hot chamber 13a. The temperature and water content of the air are reduced from the external environmental temperature and water content to the temperature and water content of a preset first gradient. Then, it undergoes secondary drying and heating in the second cold and hot chamber 13b. The temperature and water content of the air are reduced from the preset first gradient to the second gradient. The temperature and humidity are increased in a gradient manner, and the temperature difference and water content difference for each increase in temperature and humidity are relatively small, avoiding the large temperature difference, large water content difference, and large error in one-time heating and dehumidification as in the prior art, which makes it impossible to precisely control the temperature and water content of the air. On the other hand, when the air is processed in each chamber, there are detection components 3 and control components 4 for detection and control, making the control of the temperature and water content of the air more accurate.

[0047] Third, the processing time is short. Compared with the prior art that only uses one-time heating and dehumidification, the time required from detecting that the cable needs dehumidification to outputting suitable air is relatively long. The dehumidified air in this embodiment is quickly adjusted multiple times in the two sets of cold and hot chambers 13, enabling the temperature and water content of the air to quickly reach the required standards, without delaying the dehumidification treatment of the cable, reducing the risk of cable damage due to moisture, and better carrying out emergency repair work.

[0048] In a specific embodiment, as Figure 1 shown, a realizable structure of the housing 1 is further provided. The air inlet 10 and the air outlet 11 are arranged on the same housing wall side of the housing 1, and the two sets of cold and hot chambers 13 are arranged centrally symmetrically, that is, as Figure 1 , the internal space of the entire housing 1 forms a "field" - shaped structure. Specifically, during implementation, the air enters from the Figure 1 left - hand air inlet 10, and the air is successively processed in the first cold chamber 130a, the first hot chamber 131a, the second cold chamber 130b, and the second hot chamber 131b. The air forms a "C" - shaped arc - like flow trajectory inside the housing 1 and finally exits from the Figure 1 left - hand air outlet 11. The arc - like flow will cause a certain degree of disturbance and eddy current of the air, which helps to break the air boundary layer, making the contact between the air and the surface of the dehumidification device or the dehumidification medium more sufficient, improving the dehumidification efficiency. And, after the internal space of the housing 1 forms a "field" - shaped structure, the space layout is more compact, the volume of the entire device is smaller, and it can be carried to narrow spaces such as cable trenches, cable shafts, and cable tunnels for application.

[0049] In an embodiment, the internal structure of the housing 1 is further provided, as Figure 1As shown, a first vertical partition 14 and a plurality of second vertical partitions 15 are fixed to the inner wall of the shell 1; the first vertical partition 14 divides the interior of the shell into two cold and hot chambers 13, and a first flow hole 140 for connecting different cold and hot chambers 13 is provided on the top of the first vertical partition 14, and the first flow hole 140 connects the first hot chamber 131a with the second cold chamber 130b; the second vertical partition 15 is arranged in the cold and hot chamber 13, and the second vertical partition 15 divides the cold and hot chamber 13 into a cold chamber 130 and a hot chamber 131, and a second flow hole 150 is provided on the second vertical partition 15, and a semiconductor refrigerator 2 is installed on the second vertical partition 15. In specific implementation, the first vertical partition 14 can separate two cold and hot chambers 13, and the second vertical partition 15 can separate a cold chamber 130 and a hot chamber 131 to achieve air flow.

[0050] Among them, the first vertical partition 14 and the second vertical partition 15 are hollow inside, and the power supply, wires and control components 4 of the semiconductor refrigerator 2 are placed in the hollow space of the first vertical partition 14. The two second vertical partitions 15 are provided with installation positions for the semiconductor refrigerator 2. The semiconductor refrigerator 2 is installed on the second vertical partition 15, and the cold end of the semiconductor refrigerator 2 is arranged toward the cold cavity 130, and the hot end of the semiconductor refrigerator 2 is arranged toward the hot cavity 131.

[0051] Based on the above embodiments, in order to increase the flow trajectory and flow duration of the gas, as shown in FIG. Figures 2 to 4 As shown, the heights of the air inlet, the air outlet and the first flow hole 140 are higher than the height of the second flow hole 150, wherein the first flow hole 140 is a connecting hole between adjacent cold and hot chambers 13, that is, the first flow hole 140 is a connecting hole between the first hot chamber 131a and the second cold chamber 130b; the second flow hole 150 is a connecting hole between the cold chamber 130 and the hot chamber 131 of the same cold and hot chamber 13, that is, the second flow hole 150 is a connecting hole between the first cold chamber 130a and the first hot chamber 131a, or is a connecting hole between the second cold chamber 130b and the second hot chamber 131b The connecting hole, in specific implementation, when air enters from the air inlet and then contacts the cold end or condensation component 5 of the semiconductor refrigerator 2, the air cools down and sinks until it contacts the second flow hole 150, and then the air can enter the hot cavity 131. When the air entering the hot cavity 131 contacts the hot end or heat dissipation component 6 of the semiconductor refrigerator 2, the air heats up and floats until it contacts the first flow hole 140, and then enters the cold cavity 130 of the next group of hot and cold cavities 13. Subsequently, the flow trajectory of the air is the same as that in the first hot and cold cavity 13, which effectively extends the flow trajectory of the gas.

[0052] Based on the above embodiment, in order to improve the thermal insulation performance of the housing 1, as Figure 1As shown, the hot cavity 131 and the cold cavity 130 are wrapped with heat-insulating materials, that is, the outer shell 1 is composed of a plurality of hollow walls, the hollow inner wall of the outer shell 1 is filled with heat-insulating materials, and the inside of the first vertical partition 14 and the plurality of second vertical partitions 15 are also paved with heat-insulating materials in addition to the power supply, wires and control components 4. In specific implementation, after the hot cavity 131 and the cold cavity 130 are wrapped with heat-insulating materials, heat loss can be avoided when air flows inside the device, and temperature control is better.

[0053] The heat-insulating material may be heat-insulating cotton, the filling thickness of which is at least 1 cm, or the heat-insulating material may be heat-insulating foam, or the heat-insulating material may be a heat-insulating material composited with silica gel, core material, and getter.

[0054] Based on the above embodiment, in order to improve the sealing performance of the housing 1, as Figure 2 and Figure 4 As shown, the water outlet 12 is connected to the elbow 16 through a pipeline, and the water inlet end of the elbow 16 is arranged on the inner bottom surface of the cold chamber 130. The height of the water inlet end of the elbow 16 is higher than the height of the water outlet 12, and the height of the water inlet end of the elbow 16 is lower than the height of the peripheral edge of the inner bottom surface of the cold chamber 130, that is, the inner bottom surface of the cold chamber 130 is inclined, and it is inclined from the peripheral edge of the cold chamber 130 to the water inlet end of the elbow 16. After the moisture in the air condenses and drips, it will flow from the inclined surface to the elbow 16, and the setting of the U-shaped elbow 16 with unequal heights at both ends plays a sealing role. The improvement of the sealing performance is helpful to control the moisture content of the air. A horizontal pipe is connected to the U-shaped elbow 16 to discharge the condensed water from the water outlet 12 out of the chamber. In specific implementation, the condensed water in the first cold chamber 130a and the second cold chamber 130b can be discharged from the elbow 16 to the water outlet 12.

[0055] In a specific embodiment, Figure 1 As shown, an achievable structure of the detection component 3 is further provided, and the detection component 3 includes multiple groups of temperature sensors and humidity sensors, one group of temperature sensors and humidity sensors are arranged at the air inlet 10 of the shell 1, and are used to detect the temperature and moisture content of the air entering the shell 1; one group of temperature sensors and humidity sensors are arranged at the second through hole, and are used to detect the temperature and moisture content of the air when it enters the hot chamber 131 from the cold chamber 130; one group of temperature sensors and humidity sensors are arranged at the first through hole, and are used to detect the temperature and moisture content of the air when it enters the cold chamber 130 from the hot chamber 131.

[0056] In a specific embodiment, Figure 1As shown, a feasible structure of the control component 4 is further provided, the control component 4 is electrically connected to the detection component 3, that is, the control component 4 is connected to multiple temperature sensors and humidity sensors. In specific implementation, when air enters the air inlet 10, the temperature and moisture content data of the air will be synchronously transmitted to the control component 4, and the control component 4 will compare the received data with the first threshold range to determine whether the current incoming air is within the first threshold range. If the current air is within the first threshold range, the cold end of the semiconductor refrigeration plate is controlled to be cooled at a normal temperature. If the current air is not within the first threshold range, the cold end of the semiconductor refrigeration plate is controlled to be cooled at a temperature higher or lower than the normal temperature so that the air is condensed and dried for the first time in the cold chamber 130, so that the temperature of the air treated by the cold chamber 130 is within the first temperature range and the moisture content of the air is within the first moisture content range; when the air enters the second flow hole 150, the air The temperature and moisture content data will be synchronously transmitted to the control component 4, and the control component 4 will compare the received data with the second threshold range to determine whether the current incoming air is within the second threshold range. If so, the hot end of the semiconductor refrigeration plate is controlled to dissipate heat at a normal temperature. If the current air is not within the second threshold range, the hot end of the semiconductor refrigeration plate is controlled to heat the air at a temperature higher than or lower than the normal temperature so that the air is heated for the first time in the hot chamber 131, so that the temperature of the air treated by the cold chamber 130 is within the second temperature range and the moisture content of the air is within the second moisture content range; then, the air enters the first flow hole 140, and the principle and processing process of comparison with the third threshold are the same as when the air enters the air inlet 10; thereafter, when the air enters the second flow hole 150 of different hot and cold chambers 13, the principle and processing process of comparison with the fourth threshold are the same as when the air enters the second flow hole 150, which will not be elaborated here.

[0057] In a specific application scenario, assume that the external ambient air temperature is 30°C and the moisture content is 80%, the target dehumidified air temperature is 40°C and the moisture content is 30%; the first threshold range is set to 15-25°C and 75-85% moisture content; the second threshold range is set to 15-25°C and 55-65% moisture content; the third threshold range is 30-40°C and 55-65% moisture content; the fourth threshold range is 20-30°C and 28-32% moisture content; the fifth threshold range is 39-41°C and 29-31% moisture content. When air enters the air inlet 10, the temperature and moisture content of the air are detected to be within the first threshold range, and then the cold end of the semiconductor refrigeration plate is controlled to cool at a normal temperature. The air then enters different cavities in turn, and the temperature and moisture content of the air are detected and judged at the same time. If normal, the normal operation of the semiconductor refrigeration plate is maintained. If the temperature and moisture content of the air in a certain cavity exceeds the set threshold, the cooling or heating amount of the semiconductor refrigeration plate in the next cavity is adjusted so that the final air falls within it when it is judged with the fifth threshold, thereby achieving the target dehumidified air temperature and moisture content.

[0058] In a specific embodiment, Figures 1 to 4 As shown, in order to improve the refrigeration and heat dissipation efficiency, a condensing component 5 is provided in the cold chamber 130, and a heat dissipation component 6 is provided in the hot chamber 131; the condensing component 5 is connected to the cold end of the semiconductor refrigerator 2, and the heat dissipation component 6 is connected to the hot end of the semiconductor refrigerator 2. In specific implementation, after the air enters the cold chamber 130, the air will contact the condensing component 5, and the water vapor in the air will drip along the condensing component 5 and enter the water inlet end of the curved pipe 16, and finally be discharged from the drain port; after the air enters the hot chamber 131, the air will fully contact the heat dissipation component 6 for heat exchange, thereby improving the heat exchange efficiency of the air in the cold chamber 130 and the hot chamber 131.

[0059] In one embodiment, a feasible structure of the condensation component 5 is further provided, such as Figure 1 As shown, the condensation component 5 includes a plurality of condensation sheets 50, and the plurality of condensation sheets 50 are arranged regularly. In specific implementation, after air enters, the air will penetrate into the gaps between the condensation sheets 50 and fully contact with the condensation sheets 50. After the moisture in the air contacts the condensation sheets 50, it will condense and separate from the air.

[0060] There are various ways to regularly arrange the multiple condensing sheets 50. The multiple condensing sheets 50 can be evenly arranged at preset intervals, or the multiple condensing sheets 50 can be arranged on opposite sides of an axis.

[0061] In this embodiment, if Figure 1 As shown, the condensing sheet 50 is specifically an L-shaped condensing sheet 50; a plurality of L-shaped condensing sheets 50 are arranged on opposite sides of the second connecting hole to form an air flow channel, and the L-shaped condensing sheets 50 on the same side are arranged at intervals to form a multi-layer condensing sheet 50 structure that is nested in sequence, that is, the space of the cold cavity 130 is covered as much as possible in the horizontal direction; along the gas flow direction, the height of the L-shaped condensing sheet 50 gradually decreases, and the bottom of the L-shaped condensing sheet 50 is inclined, that is, the space of the cold cavity 130 is covered as much as possible in the vertical direction, so that the L-shaped condensing sheet 50 covers the space of the cold cavity 130 as much as possible both in the horizontal direction and in the vertical direction, and the air entering the cold cavity 130 can contact and condense with the plurality of L-shaped condensing sheets 50 to the greatest extent.

[0062] In one embodiment, a feasible structure of the heat dissipation component 6 is further provided, such as Figure 1 As shown, the heat dissipation assembly 6 includes a plurality of heat sinks 60, and the plurality of heat sinks 60 are arranged regularly. In specific implementation, after the air enters, the air will penetrate into the gaps between the heat sinks 60 and fully contact with the heat sinks 60. The air will fully contact with the heat sinks 60 for heat exchange, and the temperature of the air will rise.

[0063] In this embodiment, if Figure 1As shown, the heat sink 60 is an L-shaped heat sink 60, and a plurality of L-shaped heat sinks 60 are arranged on opposite sides of the second connecting hole to form an air flow channel, and the L-shaped heat sinks 60 on the same side are arranged at intervals to form a multi-layer heat sink 60 structure nested in sequence, that is, the space of the heat cavity 131 is covered as much as possible in the horizontal direction; the L-shaped heat sink 60 includes a first sheet body and a second sheet body; the first sheet body is located above the connecting port between the cold cavity 130 and the hot cavity 131, and the second sheet body is aligned with the connecting port, that is, along the gas flow direction, when the air flows out from the second flow hole 150, the air will contact and exchange heat with the bottom of the first sheet body first, and as the air flows, the air will contact and exchange heat with the second sheet body in front, and a plurality of L-shaped heat sinks 60 cover the vertical space of the entire heat cavity 131, so that the air entering the heat cavity 131 can contact and exchange heat with the plurality of L-shaped heat sinks 60 to the greatest extent.

[0064] In a specific embodiment, Figures 1 to 4 As shown, an achievable structure of a semiconductor refrigerator 2 is further provided. The semiconductor refrigerator 2 is a device that cools at one end and heats at the other end through the Peltier effect. The semiconductor refrigerator 2 is electrically connected to the control component 4. The DC power supply 20 of the semiconductor refrigerator 2 is arranged in a hollow part passing through the first vertical partition 14, and a DC power supply charging port 20 is arranged on the outer shell 1 for charging.

[0065] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

[0066] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

Claims

1. A semiconductor drying and heating gas treatment device for cable dehumidification, characterized in that: include: A shell, wherein the shell is provided with an air inlet, an air outlet and a water outlet; and the shell has at least two groups of cold and hot chambers; In the gas flow direction from the air inlet to the air outlet, the air inlet, at least two groups of the cold and hot chambers and the air outlet are connected in sequence, and each group of the cold and hot chambers includes a cold chamber and a hot chamber with the water outlet connected in sequence; At least two semiconductor refrigerators, the hot end of the semiconductor refrigerator is arranged in the hot cavity, and the cold end of the semiconductor refrigerator is arranged in the cold cavity; A detection component, the detection component is used to detect the temperature and water content of the gas in each cavity; A control component is electrically connected to the detection component and the semiconductor refrigerator, and is used to receive temperature and water content data of the detection component, and adjust the cooling capacity and heating capacity of the semiconductor refrigerator according to the temperature and water content data.

2. The semiconductor drying and heating gas treatment device for cable dehumidification according to claim 1 is characterized in that: The cold chamber is provided with a condensing component, and the hot chamber is provided with a heat dissipation component; The condensing component is connected to the cold end of the semiconductor refrigerator, and the heat dissipation component is connected to the hot end of the semiconductor refrigerator.

3. The semiconductor drying and heating gas treatment device for cable dehumidification according to claim 2 is characterized in that: The condensing assembly includes a plurality of condensing sheets, and the plurality of condensing sheets are regularly arranged.

4. The semiconductor drying and heating gas treatment device for cable dehumidification according to claim 3 is characterized in that: The condensing sheet is an L-shaped condensing sheet; Along the gas flow direction, the height of the L-shaped condensing plate gradually decreases, and the bottom of the L-shaped condensing plate is inclined.

5. The semiconductor drying and heating gas treatment device for cable dehumidification according to claim 2, characterized in that: The heat dissipation assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are regularly arranged.

6. The semiconductor drying and heating gas processing device for cable dehumidification according to claim 5, characterized in that: The heat sink is an L-shaped heat sink; The L-shaped heat sink comprises a first sheet body and a second sheet body; The first sheet is located above a communication port between the cold chamber and the hot chamber, and the second sheet is aligned with the communication port.

7. The semiconductor drying and heating gas treatment device for cable dehumidification according to claim 1, characterized in that: The air inlet and the air outlet are arranged on the same shell wall side of the shell, and the two groups of cold and hot chambers are centrally symmetrically arranged.

8. The semiconductor drying and heating gas treatment device for cable moisture removal according to claim 7, characterized in that: A first vertical partition and a plurality of second vertical partitions are fixed to the inner wall of the shell; The first vertical partition separates the interior of the shell into at least two cold and hot chambers, and a first flow hole for connecting different cold and hot chambers is provided on the top of the first vertical partition; The second vertical partition is arranged in the cold and hot chamber, the second vertical partition divides the cold and hot chamber into the cold chamber and the hot chamber, a second flow hole is arranged on the second vertical partition, and the semiconductor refrigerator is installed on the second vertical partition.

9. The semiconductor drying and heating gas processing device for cable dehumidification according to claim 8, characterized in that: The heights of the air inlet, the air outlet, and the first flow hole are all higher than the height of the second flow hole.

10. The semiconductor drying and heating gas processing device for cable moisture removal according to claim 1, characterized in that: The hot cavity and the cold cavity are both wrapped with heat insulation materials; The water outlet is connected to a bend pipe through a pipeline, the water inlet end of the bend pipe is arranged on the inner bottom surface of the cold chamber, the height of the water inlet end of the bend pipe is higher than the height of the water outlet, and the height of the water inlet end of the bend pipe is lower than the height of the peripheral edge of the inner bottom surface of the cold chamber.

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