Liquid discharge apparatus, substrate processing apparatus, and article manufacturing method

Abstract

The invention provides a liquid discharge apparatus, a substrate processing apparatus, and an article manufacturing method, which can prevent foreign matters from remaining near a discharge port so as to ensure a liquid coating grade. The liquid discharge device includes: a first discharge head that discharges a first liquid from a first discharge port; a second discharge head that discharges the second liquid from the second discharge port; a pressure control unit that individually controls the pressure inside the first discharge head and the second discharge head; and a suction unit that sucks the first discharge port and the second discharge port. The pressure control unit controls the pressure inside the first discharge head before the suction of the first discharge port by the suction unit and the pressure inside the second discharge head before the suction of the second discharge port by the suction unit so as to differ depending on the volatility difference between the first liquid and the second liquid, and the pressure control unit controls the pressure inside the first discharge head before the suction of the first discharge port by the suction unit and the pressure inside the second discharge head before the suction of the second discharge port by the suction unit to differ depending on the volatility difference between the first liquid and the second liquid. And a value.

Description

Technical Field

[0001] The present invention relates to a liquid discharge device, a substrate processing device and an article manufacturing method. Background Art

[0002] In recent years, attempts have been made to manufacture various functional elements by using a liquid discharge device to impart a pattern (patterning) to the material of the functional element. Patterning using a liquid discharge device has the following advantages: since customized patterning can be performed, the material usage efficiency is high; since it is non-vacuum processing, the manufacturing device is relatively small; and large-area coating can be achieved at high speed, etc.

[0003] In the above-mentioned liquid discharge device, problems such as poor discharge or disordered quality may occur due to foreign matter adhering to the liquid discharge port during the dot pattern formation process or the standby process, or the liquid flowing through the discharge port becoming thicker, etc. As a means to solve such problems, Patent Document 1 describes a technique for pressurizing the foreign matter or liquid inside the discharge port to discharge it and removing the attachments remaining on the surface of the discharge port by suction in a non-contact manner. While the discharge head is changed in a direction that is positive pressure compared to the pressure during discharge, the attachments are removed by suction using a suction port located at a position facing the surface of the discharge port. In this way, attachments remaining on the surface of the discharge port can be prevented from entering the discharge port, and attachments on the surface of the discharge port can be removed.

[0004] As another solution to remove the deposits on the surface of the discharge port, a technique using a jet nozzle and a suction nozzle provided at a position facing the surface of the discharge port is described in Patent Document 2. The jet nozzle is used to collect the tiny deposits on the surface of the discharge port, and the suction nozzle is used to remove the collected deposits by suction.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-215638

[0008] Patent Document 2: Japanese Patent Application Publication No. 2012-045936 Summary of the invention

[0009] Problems to be solved by the invention

[0010] Consider a liquid discharge device configured to discharge different liquids from a plurality of discharge ports. Generally speaking, different liquids have different volatilities. The more volatile the discharge head contains, the faster the attached matter remaining on the surface of the discharge port dries, and there is a problem that the attached matter cannot be removed by suction in a non-contact manner. Foreign matter that dries and remains near the discharge port causes poor discharge.

[0011] The present invention provides, for example, a liquid discharge device that is advantageous in preventing foreign matter from remaining near a discharge port and thereby ensuring the quality of liquid coating.

[0012] Solutions to Solve Problems

[0013] According to the first aspect of the present invention, there is provided a liquid discharge device, characterized in that the liquid discharge device comprises: a first discharge head, which discharges a first liquid from a first discharge port; a second discharge head, which discharges a second liquid from a second discharge port; a pressure control unit, which individually controls the internal pressures of the first discharge head and the second discharge head; and a suction unit, which sucks the first discharge port and the second discharge port, and the pressure control unit controls the internal pressure of the first discharge head before the suction unit sucks the first discharge port and the internal pressure of the second discharge head before the suction unit sucks the second discharge port to different pressure values ​​according to the difference in volatility of the first liquid and the second liquid.

[0014] According to the second aspect of the present invention, there is provided a substrate processing device, which processes a substrate and is characterized in that the substrate processing device comprises: a carrier, which holds and moves the substrate; and a liquid discharge device involved in the first aspect, which discharges liquid onto the substrate held by the carrier.

[0015] According to the third aspect of the present invention, a method for manufacturing an article is provided, characterized in that the method comprises: a process of discharging liquid onto a substrate using the substrate processing device involved in the second aspect to form a liquid film; a process of drying the substrate on which the liquid film is formed to form a dry film; and a process of manufacturing an article from the substrate on which the dry film is formed.

[0016] Effects of the Invention

[0017] According to the present invention, for example, a liquid discharge device which is advantageous in preventing foreign matter from remaining near a discharge port and thus ensuring the quality of liquid coating can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a diagram showing the structure of the liquid discharge device.

[0019] Figure 2 This is a flowchart showing the operation procedure of the liquid discharge device.

[0020] Figure 3 Schematic diagram showing an example of application of materials of a functional element.

[0021] Figure 4 It is a diagram showing a state where the discharge head is pressurized.

[0022] Figure 5 It is a diagram showing the configuration of a recovery unit.

[0023] Figure 6 It is a diagram for explaining the setting of the pressure of the first discharge head and the pressure of the second discharge head.

[0024] Figure 7 It is a diagram for explaining the sequence of pressure control. DETAILED DESCRIPTION

[0025] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention involved in the claims. In the embodiments, a plurality of features are described, but not all of these features are necessary components of the invention, and a plurality of features can be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar components are marked with the same reference numerals, and repeated descriptions are omitted.

[0026] Reference Figure 1 The basic structure and operation principle of the liquid discharge device 1 are described below. Figure 1 As shown, the direction is shown in the XYZ coordinate system with the surface parallel to the surface on which the substrate is configured as the XY plane. The liquid discharge device 1 includes a substrate carrier 3 that holds and moves a substrate 2. As the substrate 2, a substrate appropriately selected from a glass substrate, a plastic substrate, etc. is used according to the object product to be manufactured. The substrate 2 is typically a plate-shaped member, but it is not limited to a specific form as long as it can function as a substrate. The substrate 2 may be, for example, a deformable (flexible) film. In addition, the substrate 2 may be either rectangular or circular. The substrate 2 has: a pixel area 201 for applying liquid and arranging a plurality of display pixels; and an evaluation area 202 for experimentally discharging liquid in order to evaluate the state of the liquid.

[0027] The liquid discharge device 1 has a plurality of discharge heads 36 that can discharge the liquid stored therein toward a predetermined position of the substrate 2. The liquid is, for example, ink. Therefore, the liquid discharge device can also be called an inkjet device. "Ink" is a liquid used to form a pattern or a film on the substrate 2. In this specification, there is no particular limitation on the composition of the ink. For example, the ink can be a liquid containing a composition of a solute and a solvent in order to form an organic film.

[0028] The plurality of discharge heads 36 may include: a first discharge head 5 for storing a first liquid 25; and a second discharge head 30 for storing a second liquid 26 having a higher volatility than the first liquid 25. The first discharge head 5 and the second discharge head 30 are arranged in the Y direction, for example. The liquid discharge device 1 includes: a first liquid storage tank 7 for storing the first liquid 25; and a first liquid supply system 6 for supplying the first liquid 25 stored in the first liquid storage tank 7 to the first discharge head 5. In addition, the liquid discharge device 1 includes: a second liquid storage tank 29 for storing the second liquid 26; and a second liquid supply system 35 for supplying the second liquid 26 stored in the second liquid storage tank 29 to the second discharge head 30. In addition, the liquid discharge device 1 includes a recovery unit 8 for performing a cleaning process on the plurality of discharge heads 36 to recover the discharge characteristics. By individually controlling the discharge of the liquid from each discharge head, the liquid of a desired distribution can be applied to the pixel area 201 on the substrate 2.

[0029] When the substrate 2 is mounted on the substrate stage 3, a placement error of the substrate 2 occurs. In addition, since the substrate 2 undergoes various manufacturing processes, the shape of the substrate 2 is deformed in the XY direction. The alignment oscilloscope 9 measures the position of the substrate 2 and the deformation amount of the substrate 2. In addition, since there is a manufacturing deviation in the thickness of the substrate 2, if liquid is discharged from the plurality of discharge heads 36 while scanning the substrate stage 3 in the Y direction, the thickness deviation of the substrate 2 causes a deviation in the landing position of the droplets on the substrate 2. Therefore, the liquid discharge device 1 also includes a height sensor 10 for measuring the position (height) of the substrate 2 in the Z direction.

[0030] The first discharge head 5 and the second discharge head 30 have at least one discharge port (nozzle) for discharging the respective liquids. Hereinafter, the discharge port of the first discharge head 5 is referred to as the first discharge port 19, the discharge port of the second discharge head 30 is referred to as the second discharge port 27, and further, the surfaces provided with the first discharge port 19 and the second discharge port 27 are referred to as the first discharge port surface 20 and the second discharge port surface 28, respectively.

[0031] The liquid discharge device 1 has a pressure control unit 12. The pressure control unit 12 can individually control the pressure inside the first discharge head 5 for discharging the first liquid 25 and the pressure inside the second discharge head 30 for discharging the second liquid 26. The pressure control unit 12 may include piping, pumps, and valves that are not shown. The first liquid storage tank 7 and the second liquid storage tank 29 are connected to the pump via piping and valves. The first liquid storage tank 7 and the second liquid storage tank 29 can be connected to one pump or to different pumps. By adjusting the valve and performing negative pressure control to suck the space inside the first liquid storage tank 7 and the second liquid storage tank 29 by the pump, the pressure of the liquid surface of the first liquid storage tank 7 and the second liquid storage tank 29 can be adjusted. Through this negative pressure control, the liquid inside each discharge head forms a curved liquid surface near the opening of the discharge port and becomes a state suitable for discharge, which can suppress liquid leakage at an unexpected time. In one example, the pressure control unit 12 performs control so that the pressure of the meniscus becomes a pressure (negative pressure) that is 0.3 to 2.0 kPa lower than the atmospheric pressure.

[0032] During the discharge process or standby process, foreign matter may adhere to the opening of the discharge port or the liquid may become thicker near the opening of the discharge port, which may cause problems such as poor discharge and quality disturbance. In this case, the pressure control unit 12 controls the pressure inside each discharge head to be higher than the atmospheric pressure, so that the liquid or foreign matter inside the discharge port can be discharged to the outside. In one example, the pressure control unit 12 controls so that the pressure of the meniscus becomes a pressure (positive pressure) 5 to 50 kPa higher than the atmospheric pressure.

[0033] The control unit 11 controls each part of the liquid discharge device 1 and generally controls the pattern formation on the substrate 2. The control unit 11 can be composed of, for example, a PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose computer in which a program is written, or a combination of all or part of them.

[0034] Reference Figure 2The operation sequence of the liquid discharge device 1 is described below. In S201, the control unit 11 controls the substrate conveying device (not shown) to carry the substrate 2 into the liquid discharge device 1. In S202, the control unit 11 performs a recovery judgment on the first discharge port 19 of the first discharge head 5 and the second discharge port 27 of the second discharge head 30. The recovery judgment is achieved by performing a detection of poor discharge, a detection of grade disturbance, etc. of the first discharge port 19 of the first discharge head 5 and the second discharge port 27 of the second discharge head 30. When it is determined in the recovery judgment that recovery is required, in S203, the control unit 11 controls the recovery unit 8 to perform nozzle recovery processing. The nozzle recovery processing may include the following processing: by controlling the pressure inside the discharge head to a pressure higher than the atmospheric pressure by the pressure control unit 12, the liquid or foreign matter inside the discharge port is discharged to the outside.

[0035] In S204, the control unit 11 controls the substrate stage 3 and the oscilloscope 9 for adjustment to perform alignment measurement of the substrate 2. In S205, the control unit 11 controls the substrate stage 3 and the height sensor 10 to perform height measurement of the substrate 2. In addition, the order of the alignment measurement in S204 and the height measurement in S205 can also be reversed. The information related to the position, deformation amount, and height of the substrate 2 obtained by the alignment measurement and the height measurement is stored in a memory in the control unit 11, for example. The control unit 11 obtains the discharge control information based on the pixel data including information such as the pixel configuration or pixel size formed on the substrate 2. The discharge control information includes information representing the target coating distribution of the liquid in the pixel area 12 and the evaluation area 13 on the substrate 2.

[0036] In S206, the control unit 11 performs a recovery determination of each ejection head. The recovery determination is performed in the same manner as in S202. If there is a nozzle that is determined to be ejection defective in the recovery determination, the control unit 11 performs a nozzle recovery process on the nozzle in S207.

[0037] In S208, the control unit 11 controls the discharge of liquid by the plurality of discharge heads 36 based on the target coating distribution while synchronously driving the discharge head 5 and the substrate stage 3. In order to form a plurality of functional elements on a substrate using the liquid discharge device 1, the coating area of ​​the coating liquid and the plurality of discharge heads 36 are relatively scanned to coat the material of the functional element. Figure 3 Schematic diagram for explaining the application of materials for the functional element described above. Figure 3 In the embodiment, the substrate surface 101 is a surface of the substrate 2 on which the functional element 102 is formed. The scanning is performed along the Y direction with respect to each of the A column to the E column, for example. Figure 3Since it is a schematic diagram, only 7×5 functional elements 102 are shown, but in fact, a very large number of functional elements can be formed. In addition, scanning can be achieved by driving the substrate stage 3. Alternatively, the substrate stage 3 can also be fixed, and multiple discharge heads 36, an oscilloscope 9 for adjustment, etc. can be driven in the XY plane to perform scanning. Alternatively, scanning can also be performed by driving the substrate stage 3, multiple discharge heads 36, an oscilloscope 9 for adjustment, etc. separately.

[0038] In S209, the control unit 11 determines whether the discharge of the target coating distribution is completed based on the discharge control information. If the discharge of the target coating distribution is completed, the process proceeds to S210. Otherwise, the process returns to S206. In S210, the control unit 11 controls the substrate transport device (not shown) to carry the substrate 2 out of the liquid discharge device 1.

[0039] Figure 4 The figure shows a state in which the liquid is discharged from the inside of the discharge port under pressure in the liquid discharge device 1. The recovery unit 8 includes: a tray 33 for the liquid or foreign matter discharged from the first discharge port 19; and a tray 34 for the liquid or foreign matter discharged from the second discharge port 27. When the liquid is discharged under pressure, the plurality of discharge heads 36 or the recovery unit 8 moves so that the tray 33 is located directly below the first discharge port 19 and the tray 34 is located directly below the second discharge port 27. Most of the liquid or foreign matter discharged from the first discharge port 19 and the second discharge port 27 are respectively stored in the tray 33 and the tray 34, while a part of the liquid or foreign matter adheres to the first discharge port surface 20 and the second discharge port surface 28. Hereinafter, the attachment attached to the first discharge port surface 20 is referred to as the first attachment 31, and the attachment attached to the second discharge port surface 28 is referred to as the second attachment 32.

[0040] Reference Figure 5 The recovery unit 8 will be described. Figure 5 , the tray 33 and the tray 34 are omitted. The recovery unit 8 is equipped with a suction port 13 for sucking the first attachment 31 and the second attachment 32. In addition, a plurality of suction ports including a suction port for sucking the first attachment 31 and a suction port for sucking the second attachment 32 may be mounted on the recovery unit 8. Thus, the recovery unit 8 functions as a suction unit. Hereinafter, the surface of the suction port 13 (the surface on which the suction port 13 is formed) is referred to as a suction port surface 23.

[0041] The flow control unit 14 controls the flow rate of the liquid sucked from the suction port 13. The drive system 15 moves the suction port 13 in parallel with the first discharge port surface 20 and the second discharge port surface 28. The drive system 21 moves the suction port 13 in the vertical direction with respect to the first discharge port surface 20 and the second discharge port surface 28. The distance control unit 22 controls the distance between the first discharge port surface 20 and the second discharge port surface 28 and the suction port surface 23. The distance control unit 22 makes the first discharge port surface 20 and the second discharge port surface 28 approach the suction port surface 23, and the flow control unit 14 controls the flow rate of the liquid sucked from the suction port 13, thereby enabling the first attachment 31 and the second attachment 32 to be sucked. In one example, the flow control unit 14 sets the flow rate of the liquid sucked from the suction port 13 to 10 L / min or more, and the distance control unit 22 sets the distance between the first discharge port surface 20 and the second discharge port surface 28 and the suction port surface 23 to 200 μm or more and 600 μm or less. In this way, the suction unit is configured to suction the first discharge port 19 and the second discharge port 27 in a non-contact manner.

[0042] Next, refer to Figure 6 The pressure control of the discharge head after pressurized discharge is described. After the liquid inside the multiple discharge heads 36 is pressurized and discharged, attachments remain on the first discharge port surface 20 and the second discharge port surface 28. Here, consider sucking the first attachment 31 and the second attachment 28 by the suction port 13. In order to suck by the suction port 13, it is necessary to prevent the first attachment 31 and the second attachment 32 from drying after the pressurized discharge until the suction starts. This is because, in the case where the attachments dry and remain as foreign matter near the discharge port, the possibility of causing poor discharge becomes higher. However, the second attachment 32 is more volatile than the first attachment 31 and is easy to dry. Therefore, it is necessary to discharge more liquid from the second discharge port 27 compared to the first discharge port 19 to prevent drying. Therefore, the pressure inside the second discharge head 30 after pressurized discharge ( Figure 6 The second pressure value P2 of (b) is set to be higher than the pressure inside the first discharge head 5 ( Figure 6 The first pressure value P1 of (a) is higher. P1 and P2 are both pressures higher than atmospheric pressure. Preferably, the first pressure value P1 is set to a value such that the mass flow rate (mass change per unit time) of the first liquid 25 volatilized is balanced with the mass flow rate of the first liquid 25 discharged from the first discharge port 19. Similarly, the second pressure value P2 is set to a value such that the mass flow rate of the second liquid 26 volatilized is balanced with the mass flow rate of the second liquid 26 discharged from the second discharge port 27.

[0043] The pressure control unit 12 controls the pressure (pressure A) inside the first discharge head 5 before the first discharge port 19 is sucked by the recovery unit 8 and the pressure (pressure B) inside the second discharge head 30 before the second discharge port 27 is sucked by the recovery unit 8. Here, the pressure control unit 12 controls so that the pressure A and the pressure B become different pressure values ​​according to the difference in volatility between the first liquid 25 and the second liquid 26.

[0044] Reference Figure 7 A specific example of the sequence of pressure control performed by the pressure control unit 12 is described. First, when foreign matter is attached near the opening of the discharge port, or when the liquid near the opening of the discharge port increases in viscosity, the pressure inside the first discharge head 5 and the second discharge head 30 is set to a pressure (positive pressure) that is 5 to 50 kPa higher than the atmospheric pressure, i.e., an initial pressure value P0. After pressurization at the initial pressure value P0 during the pressurization period (first period), the pressure is transferred to the suction waiting period (second period). During the suction waiting period, the pressure inside the first discharge head 5 is set to a positive pressure lower than the initial pressure value P0, i.e., a first pressure value P1 ( Figure 7 (a)), the pressure inside the second discharge head 30 is set to the second pressure value P2 ( Figure 7 (b)). The first pressure value P1 and the second pressure value P2 are both pressures higher than the atmospheric pressure, and the second pressure value P2 is a value higher than the first pressure value P1. Then, the process shifts to the suction period (third period) in which the first discharge port 19 and the second discharge port 27 are sucked by the recovery unit 8. That is, the suction waiting period (second period) is the period until the first discharge port 19 and the second discharge port 27 are sucked by the recovery unit 8. During the suction waiting period, the pressure inside the first discharge head 5 and the pressure inside the second discharge head 30 are maintained at the first pressure value P1 and the second pressure value P2, respectively.

[0045] During the suction period (third period), the pressure inside the first discharge head 5 and the pressure inside the second discharge head 30 are both set to the third pressure value P3. The third pressure value P3 is a pressure lower than the atmospheric pressure (i.e., negative pressure). By setting P3 to a negative pressure, when the first attachment 31 and the second attachment 32 are sucked by the suction port 13, the liquid in the first discharge port 19 and the second discharge port 27 is sucked out, which can prevent the liquid from adhering to the first discharge port 19 and the second discharge port 27 and causing discharge failure.

[0046] According to the present embodiment, the pressure inside the second discharge head 30 until the second discharge port surface 28 is sucked by the recovery unit 8 is set higher than the pressure inside the first discharge head 5 until the first discharge port surface 20 is sucked by the recovery unit 8. Thus, it is possible to prevent the drying of the attached matter on the first discharge port surface 20 and the second discharge port surface 28. By preventing the drying of the attached matter, it is possible to prevent foreign matter from remaining near the first discharge port 19 and the second discharge port 27, and to ensure the liquid coating quality.

[0047] The above-mentioned liquid discharge device can be incorporated into a substrate processing device for processing a display panel or a semiconductor substrate, for example, and used.

[0048] <Embodiment of the method for producing an article>

[0049] The article manufacturing method of the embodiment of the present invention is suitable for manufacturing articles such as panels for displays such as organic EL or microdevices such as semiconductor devices or elements with fine structures. The article manufacturing method of this embodiment includes: a step of forming a discharged liquid film by discharging liquid onto a substrate using the above-mentioned liquid discharge device; a step of drying the substrate formed with the discharged liquid film to obtain a substrate formed with a dry film; and a step of manufacturing an article from the substrate formed with a dry film. Furthermore, the article manufacturing method includes other well-known steps (firing, cooling, cleaning, oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, slicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over previous methods in at least one aspect of the performance, quality, productivity, and production cost of the article.

[0050] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the concept and scope of the invention. Therefore, the following claims are attached to disclose the scope of the invention.

[0051] Description of Reference Numerals

[0052] 1: liquid discharge device, 2: substrate, 3: substrate carrier, 5: first discharge head, 7: first liquid storage tank, 8: recovery unit, 11: control unit, 12: pressure control unit, 19: first discharge outlet, 25: first liquid, 26: second liquid, 27: second discharge outlet, 30: second discharge head.

Claims

1. A liquid discharge device, characterized in that: The liquid discharge device comprises: a first discharge head that discharges a first liquid from a first discharge port; a second discharge head that discharges a second liquid from a second discharge port; a pressure control unit that controls the pressure inside the first discharge head and the second discharge head individually; as well as a suction unit that sucks the first discharge port and the second discharge port, The pressure control unit controls the pressure inside the first discharge head before the suction unit sucks the first discharge port and the pressure inside the second discharge head before the suction unit sucks the second discharge port to different pressure values ​​according to the difference in volatility between the first liquid and the second liquid.

2. The liquid discharge device according to claim 1, characterized in that: When the volatility of the second liquid is higher than that of the first liquid, the pressure control unit sets the pressure inside the second discharge head before the second discharge port is sucked by the suction unit to be higher than the pressure inside the first discharge head.

3. The liquid discharge device according to claim 2, characterized in that: For the above pressure control unit, During the first period, the pressure inside the first discharge head and the pressure inside the second discharge head are set to initial pressure values ​​that are positive pressures. In a second period after the first period, the pressure inside the first discharge head is set to a first pressure value as a positive pressure lower than the initial pressure value, and the pressure inside the second discharge head is set to a second pressure value higher than the first pressure value. After the second period, during a third period in which the first discharge port and the second discharge port are sucked by the suction unit, the pressure inside the first discharge head and the pressure inside the second discharge head are set to a third pressure value which is a negative pressure.

4. The liquid discharge device according to claim 3, characterized in that: The second period is a period until the suction unit starts suctioning the first discharge outlet and the second discharge outlet.

5. The liquid discharge device according to claim 3, characterized in that: The first pressure value is set to a value such that the mass flow rate of the first liquid volatilizing is balanced with the mass flow rate of the first liquid discharged from the first discharge port. The second pressure value is set to a value such that a mass flow rate of volatilization of the second liquid and a mass flow rate of discharge of the second liquid from the first discharge port are balanced.

6. The liquid discharge device according to claim 1, wherein: The suction unit is configured to suction the first discharge port and the second discharge port in a non-contact manner.

7. The liquid discharge device according to claim 1, wherein: The above-mentioned attraction unit comprises: A suction port for sucking liquid attached to the first discharge port and the second discharge port; a flow control unit that controls the flow rate of the liquid sucked from the suction port; and A distance control unit controls the distances between the first discharge port and the second discharge port and the suction port.

8. The liquid discharge device according to claim 7, characterized in that: The flow control unit sets the flow rate of the liquid sucked from the suction port to 10 L / min or more. The distance control unit sets the distance to be greater than or equal to 200 μm and less than or equal to 600 μm.

9. A substrate processing device for processing a substrate, characterized in that: The substrate processing device comprises: a stage that holds and moves the substrate; and The liquid discharge device according to any one of claims 1 to 8, wherein the liquid discharge device discharges liquid onto the substrate held by the stage.

10. A method for manufacturing an article, characterized in that: The above article manufacturing method has the following characteristics: A step of discharging liquid onto a substrate to form a liquid film using the substrate processing apparatus according to claim 9; a step of drying the substrate on which the liquid film is formed to form a dry film; and A step of manufacturing an article from the substrate having the dry film formed thereon.

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