Automatic glue monitoring method

By using automatic glue monitoring method in fully automatic dispensing equipment, the glue output weight is automatically monitored and adjusted, and the glue output weight is solved, and the glue output weight is reduced due to the increase in the glue viscosity is ensured, ensuring the qualification of the glue dispensing amount and product quality.

CN119838828APending Publication Date: 2025-04-18DONG GUAN GAO WEI GUANG XUE DIAN ZI YOU XIAN GONG SI
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202510048029.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-13
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

In fully automatic dispensing equipment, as the glue usage time increases, the viscosity increases, resulting in a decrease in the weight of the glue output, affecting the qualification of the dispensing amount and product production quality.

Method used

The glue automatic monitoring method is adopted. By moving the glue groove to the bottom of the glue needle, using the glue groove to connect the extruded glue, and using the pickup arm to pick up the glue groove to the weighing sensor to automatically monitor the glue weight. Adjust the air pressure value according to the comparison difference value until the glue weight is determined to be qualified.

Benefits of technology

It realizes the fully automatic monitoring of the glue output weight, ensures the dispensing amount of the fully automatic dispensing equipment, ensures the product production quality, and improves the accuracy of air pressure value adjustment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119838828A_ABST
    Figure CN119838828A_ABST
Patent Text Reader

Abstract

The invention discloses an automatic glue monitoring method which comprises the following steps: S100, moving a glue tank below a glue needle, and receiving glue extruded from the glue needle by using the glue tank; s200, a pickup arm is controlled to pick up the glue groove to a weighing sensor for weighing, and the actual glue weight of glue discharged by the full-automatic dispensing equipment at a time is obtained; s300, the actual glue weight, obtained in the step S200, of the glue is compared with a set glue weight control range; if the actual glue weight of the glue is out of the set glue weight control range, entering the step S400; if the actual glue weight of the glue is within the set glue weight control range, entering the step S500; s400, the air pressure value is adjusted according to the comparison difference value, the glue groove is moved to the position below the glue needle again, and then the step S100, the step S200 and the step S300 are repeated; and S500, it is determined that the actual glue output glue weight is qualified. According to the automatic glue monitoring method, the glue output weight of the glue can be automatically monitored, it is guaranteed that the glue dispensing amount of full-automatic glue dispensing equipment is qualified, and the production quality of products is guaranteed.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of glue monitoring, and in particular to an automatic glue monitoring method. Background Art

[0002] Fully automatic dispensing equipment is a device used to automatically dispense glue to products.

[0003] During the production process, the fully automatic dispensing equipment uses air pressure to squeeze the pre-stored glue out of the glue needle through the glue hose and drip it onto the product.

[0004] However, as the fully automatic dispensing equipment is used for a longer time, the viscosity of the glue pre-stored in the equipment will increase, resulting in a reduction in the extrusion weight of the glue using the same air pressure value, which can easily cause the dispensing amount of the fully automatic dispensing equipment to be unqualified, affecting product production quality. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an automatic glue monitoring method, which can automatically monitor the glue output weight of the glue, ensure the glue dispensing amount of the fully automatic glue dispensing equipment is qualified, and ensure the product production quality.

[0006] A method for automatically monitoring glue according to an embodiment of the present invention comprises the following steps: S100: Move the glue slot to below the glue needle and use the glue slot to collect the glue squeezed out from the glue needle; S200: Control the pick-up arm to pick up the glue slot and place it on the weighing sensor for weighing, so as to obtain the actual weight of the glue dispensed by the fully automatic dispensing equipment in a single operation; S300: Compare the actual glue weight obtained in step S200 with the set glue weight control range; if the actual glue weight is outside the set glue weight control range, proceed to step S400; if the actual glue weight is within the set glue weight control range, proceed to step S500; S400: adjusting the air pressure value according to the comparison difference, moving the glue groove back to below the glue needle, and then repeating steps S100, S200 and S300 until it is determined that the actual glue weight of the glue is qualified; S500: Determine whether the actual glue weight is qualified.

[0007] A method for automatically monitoring glue according to an embodiment of the present invention has at least the following beneficial effects: 1. The present invention moves the glue groove to below the glue needle in step S100, and uses the glue groove to collect the glue squeezed out from the glue needle. It can be understood that the glue groove can collect the glue squeezed out by the glue needle once each time, and can also collect the glue squeezed out by the glue needle a preset number of times, thereby facilitating the quantitative collection of the glue squeezed out by the glue needle.

[0008] 2. The present invention controls the picking arm to pick up the glue slot to the weighing sensor for weighing in step S200, so as to obtain the actual glue weight of the glue discharged by the full-automatic glue dispensing equipment in a single time. It can be understood that by using the picking arm to move the glue slot, the glue slot can be automatically moved to the weighing sensor for weighing the glue in the full-automatic glue dispensing equipment, thereby eliminating the need for manual transfer of the glue slot to the electronic scale for weighing the glue, and eliminating the glue weight measurement errors caused by the workshop environment and time difference when discharging the glue and weighing the glue, as well as manual operations, so that the glue weight control is more reliable.

[0009] 3. The present invention compares the actual glue weight obtained in step S200 with the set glue weight control range in step S300; if the actual glue weight is outside the set glue weight control range, then enters step S400; if the actual glue weight is within the set glue weight control range, then enters step S500, thereby facilitating automatic judgment of whether the actual glue weight of a single glue discharge by the fully automatic dispensing equipment is within the set glue weight control range, and selecting the next step according to the judgment result, thereby realizing fully automatic glue weight control.

[0010] 4. The present invention adjusts the air pressure value according to the comparison difference in step S400, moves the glue groove back to under the glue needle, and then repeats steps S100, S200 and S300 until it is determined that the actual glue weight is qualified. It can be understood that when the actual glue weight is outside the set glue weight control range, the air pressure value is increased or decreased according to the compared glue weight difference so as to adjust the single glue output of the automatic dispensing equipment. At the same time, the glue groove is moved back to under the glue needle, and steps S100, S200 and S300 are repeated. Thus, the glue squeezed out after the glue output of the automatic dispensing equipment is adjusted is weighed again, so that when the actual glue weight is not within the set glue weight control range, the actual glue weight is automatically adjusted to the set glue weight control range, thereby realizing fully automatic monitoring of the glue output weight, ensuring the qualified glue dispensing amount of the automatic dispensing equipment, and ensuring the product production quality.

[0011] 5. The present invention adjusts the air pressure value according to the comparison difference. It can be understood that when the comparison difference is large, the air pressure value can be adjusted greatly, and when the comparison difference is small, the air pressure value can be adjusted slightly. Thus, the adjustment value of the air pressure value can change with the change of the comparison difference, thereby improving the accuracy of the air pressure value adjustment, and facilitating the rapid setting of the glue weight adjustment value of a single glue discharge of the fully automatic dispensing equipment within the glue weight control range.

[0012] According to some embodiments of the present invention, if the actual glue weight is outside the set glue weight control range, the step of adjusting the air pressure value according to the comparison difference includes the following steps: If the actual glue weight is less than the lower limit of the set glue weight control range, the air pressure value will be adjusted upward according to the comparison difference; If the actual glue weight is greater than the set upper limit of the glue weight control range, the air pressure value will be adjusted downward according to the comparison difference.

[0013] According to some embodiments of the present invention, a single adjustment range of the air pressure value of the upward adjustment air pressure value and the air pressure value of the downward adjustment air pressure value is 20kPa-50kPa.

[0014] According to some embodiments of the present invention, in the step S100, the glue groove is disposed on a movable platform, and the movable platform translates to drive the glue groove to move to below the glue needle or away from below the glue needle.

[0015] According to some embodiments of the present invention, a glue cleaning portion is defined at the top edge of the glue groove. In the step S100, after each glue dripping by the glue needle, the movable platform is controlled to translate and rise and fall to drive the glue cleaning portion of the glue groove to scrape the needle hole of the glue needle to clean the glue remaining at the needle hole of the glue needle.

[0016] According to some embodiments of the present invention, a positioning box is provided on the movable platform, and a positioning cavity is provided on the top of the positioning box, and the positioning cavity is used for positioning the glue groove.

[0017] According to some embodiments of the present invention, in step S400, the picking arm is controlled to pick up the glue groove on the weighing sensor to the positioning cavity of the positioning box, and the movable platform translates to drive the glue groove to move below the glue needle.

[0018] According to some embodiments of the present invention, in the step S100, before the glue groove moves to below the glue needle, the following steps are also included: Calibrate the position of each pick-up and release action of the pick-up arm to the glue slot.

[0019] According to some embodiments of the present invention, in the step S100, before the glue groove moves to below the glue needle, the following steps are also included: Standard image settings for the alignment box, load cell, glue channel on the alignment box, glue channel under the glue needle, and glue channel on the load cell.

[0020] According to some embodiments of the present invention, when the glue groove is on the positioning box, when the glue groove is below the glue needle, and when the glue groove is on the weighing sensor, photos are taken and compared with the standard image to detect whether the position of the glue groove is accurate.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A process flow chart of an automatic glue monitoring method according to an embodiment of the present invention; Figure 2 A process flow chart of step S400 of a method for automatically monitoring glue according to an embodiment of the present invention; Figure 3 This is a process flow chart of step S010 of a method for automatically monitoring glue according to an embodiment of the present invention; Figure 4 A process flow chart of step S020 of a method for automatically monitoring glue according to an embodiment of the present invention; Figure 5 The present invention is a structural schematic diagram of a glue tank of an automatic glue monitoring method according to an embodiment of the present invention.

[0024] Figure numerals: 100 - glue groove, 110 - glue cleaning part, 120 - glue holding position. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it is necessary to understand that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of first and second, this is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation, connection and connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] A method for automatically monitoring glue according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0030] The present invention aims to provide an embodiment of a method for automatically monitoring glue.

[0031] Reference Figure 1 In this embodiment, a glue automatic monitoring method includes the following steps: S100: Move the glue groove 100 to below the glue needle, and use the glue groove 100 to receive the glue squeezed out from the glue needle; S200: Control the pick-up arm to pick up the glue tank 100 to the weighing sensor for weighing, so as to obtain the actual glue weight of the glue dispensed by the full-automatic glue dispensing equipment in a single time; S300: Compare the actual glue weight obtained in step S200 with the set glue weight control range; if the actual glue weight is outside the set glue weight control range, proceed to step S400; if the actual glue weight is within the set glue weight control range, proceed to step S500; S400: adjusting the air pressure value according to the comparison difference, moving the glue groove 100 back to below the glue needle, and then repeating steps S100, S200 and S300 until it is determined that the actual glue weight of the glue out is qualified; S500: Determine whether the actual glue weight is qualified.

[0032] In this embodiment, the glue groove 100 is moved to below the glue needle in step S100, and the glue groove 100 is used to collect the glue squeezed out from the glue needle. It can be understood that the glue groove 100 can collect the glue squeezed out by the glue needle once, or can collect the glue squeezed out by the glue needle a preset number of times, thereby facilitating the quantitative collection of the glue squeezed out by the glue needle.

[0033] Then, this embodiment controls the picking arm to pick up the glue groove 100 to the weighing sensor for weighing in step S200, so as to obtain the actual glue weight of the glue discharged by the full-automatic dispensing equipment in a single time. It can be understood that by using the picking arm to move the glue groove 100, it is possible to automatically move the glue groove 100 to the weighing sensor for weighing the glue in the full-automatic dispensing equipment, thereby eliminating the need for manual transfer of the glue groove 100 to the electronic scale for weighing the glue, and eliminating the glue weight measurement errors caused by the workshop environment and time difference when discharging the glue and weighing the glue, as well as manual operations, so that the glue weight control is more reliable.

[0034] Next, this embodiment compares the actual glue weight obtained in step S200 with the set glue weight control range in step S300; if the actual glue weight is outside the set glue weight control range, then enters step S400; if the actual glue weight is within the set glue weight control range, then enters step S500, thereby facilitating automatic judgment of whether the actual glue weight of a single glue discharge by the fully automatic dispensing equipment is within the set glue weight control range, and selecting the next step according to the judgment result, thereby realizing fully automatic glue weight control.

[0035] Furthermore, in this embodiment, the air pressure value is adjusted according to the comparison difference in step S400, the glue groove 100 is moved back to the bottom of the glue needle, and then steps S100, S200 and S300 are repeated until it is determined that the actual glue weight of the glue output is qualified. It can be understood that when the actual glue weight is outside the set glue weight control range, the air pressure value is increased or decreased according to the compared glue weight difference so as to adjust the single glue output amount of the full-automatic dispensing equipment. At the same time, the glue groove 100 is moved back to the bottom of the glue needle, and steps S100, S200 and S300 are repeated, so that the glue squeezed out after the glue output amount of the full-automatic dispensing equipment is adjusted is weighed again, so that when the actual glue weight of the glue is not within the set glue weight control range, the actual glue weight of the glue is automatically adjusted to the set glue weight control range, thereby realizing fully automatic monitoring of the glue output weight, ensuring the qualified dispensing amount of the full-automatic dispensing equipment, and ensuring the product production quality.

[0036] At the same time, the air pressure value is adjusted according to the comparison difference. It can be understood that when the comparison difference is large, the air pressure value can be adjusted greatly, and when the comparison difference is small, the air pressure value can be adjusted slightly. Thus, the adjustment value of the air pressure value can change with the change of the comparison difference, thereby improving the accuracy of the air pressure value adjustment, and facilitating the rapid adjustment of the glue weight of a single glue discharge of the fully automatic dispensing equipment to be within the glue weight control range.

[0037] Reference Figure 2 In some specific embodiments, if the actual glue weight is outside the set glue weight control range, the step of adjusting the air pressure value according to the comparison difference includes the following steps: S410: If the actual glue weight is less than the set lower limit of the glue weight control range, the air pressure value is adjusted upward according to the comparison difference; S420: If the actual glue weight is greater than the set upper limit of the glue weight control range, the air pressure value is adjusted downward according to the comparison difference.

[0038] It can be understood that if the actual glue weight is less than the set lower limit of the glue weight control range, the single glue output of the full-automatic dispensing equipment can be increased by increasing the air pressure value, which facilitates adjusting the single glue output of the full-automatic dispensing equipment to within the set glue weight control range; if the actual glue weight is greater than the set upper limit of the glue weight control range, the single glue output of the full-automatic dispensing equipment can be reduced by lowering the air pressure value, which facilitates adjusting the single glue output of the full-automatic dispensing equipment to within the set glue weight control range, thereby making the adjustment of the single glue output of the full-automatic dispensing equipment more accurate.

[0039] In some specific embodiments, the single adjustment range of the air pressure value for increasing and decreasing the air pressure value is 20kpa-50kpa, thereby limiting the range of the air pressure value for a single adjustment, making the adjustment of the air pressure value more precise and avoiding the air pressure value for a single adjustment being too large or too small.

[0040] In some specific embodiments, in step S100, the glue groove 100 is disposed on a movable platform, and the movable platform can translate to drive the glue groove 100 to move to below the glue needle or away from below the glue needle.

[0041] It can be understood that when it is necessary to monitor the weight of the glue squeezed out by the glue needle, the movable platform can drive the glue groove 100 to move to the bottom of the glue needle to facilitate the glue groove 100 to receive the glue squeezed out by the glue needle. During normal production, the movable platform can drive the glue groove 100 to move away from under the glue needle, thereby preventing the glue groove 100 from obstructing the glue needle from dispensing glue on the product.

[0042] Reference Figure 5 In some specific embodiments, the top edge of the glue groove 100 is defined with a glue cleaning portion 110. In step S100, after each glue drop by the glue needle, the movable platform is controlled to translate and rise and fall to drive the glue cleaning portion 110 of the glue groove 100 to scrape the needle opening of the glue needle to clean the glue remaining at the needle opening of the glue needle.

[0043] It can be understood that when the glue groove 100 receives glue, after each glue droplet from the glue needle, the movable platform is controlled to translate and rise and fall to drive the glue cleaning unit 110 to scrape the needle mouth of the glue needle to clean the glue remaining at the needle mouth of the glue needle, thereby avoiding the glue remaining at the needle mouth of the glue needle after each glue droplet affecting the next glue extrusion of the glue needle, thereby ensuring the accuracy of glue weighing.

[0044] In some specific embodiments, a positioning box is provided on the movable platform, and a positioning cavity is provided on the top of the positioning box, and the positioning cavity is used to position the glue groove 100, thereby making the position of the glue groove 100 on the movable platform more accurate and stable, and at the same time, preventing the glue needle from moving the position of the glue groove 100 when the glue cleaning part 110 scrapes the needle mouth of the glue needle.

[0045] In some specific embodiments, in step S400, the picking arm is controlled to pick up the glue groove 100 on the weighing sensor to the positioning cavity of the positioning box, and the movable platform is translated to drive the glue groove 100 to move under the glue needle, so that the picking arm and the movable platform can cooperate to automatically drive the glue groove 100 to move back to under the glue needle, eliminating the need to manually move the glue groove 100 to re-acquire glue, and further eliminating the glue weighing error caused by the workshop environment and time difference during glue discharge and glue weighing, as well as manual operations, making glue weight control more reliable.

[0046] Reference Figure 3 In some specific embodiments, in step S100, before the glue groove 100 moves to below the glue needle, the following steps are also included: S010: Calibrate the positions of each picking action and releasing action of the picking arm on the glue groove 100.

[0047] It can be understood that by correcting the position of each picking action and releasing action of the picking arm on the glue groove 100, the position of each picking action and releasing action of the picking arm on the glue groove 100 can be made more accurate, ensuring that the picking arm can smoothly pick up the glue groove 100 and the release position of the glue groove 100 is accurate.

[0048] Specifically, calibrating the positions of each picking action and releasing action of the pick-up arm on the glue groove 100 includes the following steps: S011: Correction of the horizontal position and height position of the pick-up arm picking up the glue groove 100 on the positioning box; S012: The pick-up arm releases the glue tank 100 to calibrate the horizontal position and height position of the weighing sensor.

[0049] In some specific embodiments, in step S100, before the glue groove 100 moves to below the glue needle, the following steps are also included: S013: Correction of the horizontal position of the glue needle scraping the glue cleaning part 110 of the glue tank 100; S014: Correction of the glue position 120 of the glue tank 100; S015: The glue cleaning part 110 of the glue groove 100 resets the number of times the glue needle scrapes and cleans the glue.

[0050] Reference Figure 4In some specific embodiments, in step S100, before the glue groove 100 moves to below the glue needle, the following steps are also included: S020: Perform standard image settings for the positioning box, the weighing sensor, when the glue groove 100 is on the positioning box, when the glue groove 100 is under the glue needle, and when the glue groove 100 is on the weighing sensor.

[0051] It can be understood that by setting standard images of the positioning box, the weighing sensor, the glue slot 100 when it is on the positioning box, the glue slot 100 when it is under the glue needle, and the glue slot 100 when it is on the weighing sensor, it is convenient to obtain standard images of the positioning box, the weighing sensor, the glue slot 100 when it is on the positioning box, the glue slot 100 when it is under the glue needle, and the glue slot 100 when it is on the weighing sensor, thereby facilitating image comparison during the automatic glue monitoring process and discovering errors during the automatic glue monitoring process.

[0052] In some specific embodiments, when the glue groove 100 is on the positioning box, when the glue groove 100 is below the glue needle, and when the glue groove 100 is on the weighing sensor, photos are taken and compared with the standard image to detect whether the position of the glue groove 100 is accurate.

[0053] It can be understood that when the glue groove 100 is on the positioning box, when the glue groove 100 is below the glue needle, and when the glue groove 100 is on the weighing sensor, the camera device is controlled to take pictures, and then the taken pictures are compared with the standard image, so as to detect and determine whether the position of the glue groove 100 is accurate, and then, it is convenient to alarm when the position of the glue groove 100 is wrong.

[0054] In some specific embodiments, the positioning box and the weighing sensor may be photographed, and the photographed photograph may be compared with a standard image, thereby facilitating detection and determination of whether the positioning and the shape and position of the weighing sensor are accurate.

[0055] In some specific embodiments, when the glue tank 100 is full of glue, the cleaned glue tank 100 is directly replaced, thereby reducing the number of times of replacing the glue tank 100 and improving efficiency.

[0056] In some specific embodiments, the device can automatically save the weighing data in the device database after each weighing of the glue, thereby eliminating the need for data recording during manual work, saving labor time, and facilitating subsequent tracing.

[0057] It is understandable that glue weighing monitoring is carried out every 4 hours, and conventional manual glue weighing monitoring takes an average of about 30 minutes each time, and the glue weight needs to be confirmed 6 times a day, which takes 180 minutes, seriously affecting the efficiency of equipment operation; an automatic glue monitoring method in this embodiment takes an average of about 16 minutes each time, and the glue weight needs to be confirmed 6 times a day, which takes 96 minutes, saving 84 minutes a day, greatly improving the operating efficiency of the equipment.

[0058] In the description of this specification, the description with reference to the terms "one embodiment, some embodiments, illustrative embodiments, examples, specific examples or some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] The terms "first, second, third, fourth", etc. (if any) in the specification and claims of this application and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that shown or described herein.

[0060] It should also be noted that in the description of this specification, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0061] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may also include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0062] Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0063] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A glue automatic monitoring method, characterized in that: The steps include: S100: Move the glue slot to below the glue needle and use the glue slot to collect the glue squeezed out from the glue needle; S200: Control the pick-up arm to pick up the glue slot and place it on the weighing sensor for weighing, so as to obtain the actual weight of the glue dispensed by the fully automatic dispensing equipment in a single operation; S300: comparing the actual glue weight obtained in step S200 with the set glue weight control range; If the actual glue weight is outside the set glue weight control range, the process proceeds to step S400; if the actual glue weight is within the set glue weight control range, the process proceeds to step S500; S400: adjusting the air pressure value according to the comparison difference, moving the glue groove back to below the glue needle, and then repeating steps S100, S200 and S300 until it is determined that the actual glue weight of the glue is qualified; S500: Determine whether the actual glue weight is qualified.

2. The method for automatic glue monitoring according to claim 1, characterized in that: If the actual glue weight is outside the set glue weight control range, the step of adjusting the air pressure value according to the comparison difference includes the following steps: If the actual glue weight is less than the lower limit of the set glue weight control range, the air pressure value will be adjusted upward according to the comparison difference; If the actual glue weight is greater than the set upper limit of the glue weight control range, the air pressure value will be adjusted downward according to the comparison difference.

3. The method for automatic glue monitoring according to claim 2, characterized in that: The single adjustment range of the air pressure value of the upward adjustment air pressure value and the air pressure value of the downward adjustment air pressure value is 20kpa-50kpa.

4. The method for automatic glue monitoring according to claim 1, characterized in that: In the step S100, the glue groove is arranged on a movable platform, and the movable platform translates to drive the glue groove to move to below the glue needle or away from below the glue needle.

5. The method for automatic glue monitoring according to claim 4, characterized in that: The top edge of the glue groove is defined with a glue cleaning portion. In the step S100, after each glue drop by the glue needle, the movable platform is controlled to translate and rise and fall to drive the glue cleaning portion of the glue groove to scrape the needle opening of the glue needle to clean the glue remaining at the needle opening of the glue needle.

6. The method for automatic glue monitoring according to claim 5, characterized in that: A positioning box is arranged on the movable platform, and a positioning cavity is provided on the top of the positioning box, and the positioning cavity is used for positioning the glue groove.

7. The automatic glue monitoring method according to claim 6, characterized in that: In the step S400, the picking arm is controlled to pick up the glue groove on the weighing sensor to the positioning cavity of the positioning box, and the movable platform is translated to drive the glue groove to move below the glue needle.

8. The method for automatic glue monitoring according to claim 5, characterized in that: In the step S100, the following steps are also included before the glue groove moves to below the glue needle: Calibrate the position of each pick-up and release action of the pick-up arm to the glue slot.

9. The method for automatic glue monitoring according to claim 5, characterized in that: In the step S100, the following steps are also included before the glue groove moves to below the glue needle: Standard image settings for the alignment box, load cell, glue channel on the alignment box, glue channel under the glue needle, and glue channel on the load cell.

10. The automatic glue monitoring method according to claim 9, characterized in that: When the glue slot is on the positioning box, when the glue slot is under the glue needle, and when the glue slot is on the weighing sensor, take photos and compare them with the standard image to detect whether the position of the glue slot is accurate.

Citation Information

Cited By

  • Dispensing machine control method and system, electronic equipment and storage medium

    CN121500844A