Crystal bar cleaning equipment and method

Abstract

The invention provides crystal bar cleaning equipment and a crystal bar cleaning method. The crystal bar cleaning equipment comprises a cleaning tank, a clamping mechanism and two cleaning nozzles, a first opening is formed in the upper portion of the cleaning tank, and the cleaning tank is used for containing cleaning liquid; the clamping mechanism is used for clamping and transferring the cut crystal bar; a plurality of water spraying holes are uniformly formed in the cleaning nozzles, and the two cleaning nozzles are oppositely arranged above the first opening, can move relative to the cleaning tank and are used for spraying and cleaning the cut crystal bar. According to the crystal bar cleaning equipment disclosed by the embodiment of the invention, the clamping mechanism is arranged, so that the cut crystal bar can be clamped and transferred; by arranging the cleaning nozzles capable of moving relative to the silicon wafers, the adjacent silicon wafers after cutting can be cleaned in all directions; and the cleaning liquid is sprayed to the crystal bar through the plurality of water spraying holes uniformly formed in the cleaning spray head, so that gaps between adjacent silicon wafers can be efficiently cleaned.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a crystal rod cleaning device and method. Background Art

[0002] After the crystal rod is generated, the crystal rod is cut according to the required thickness of the silicon wafer to obtain the silicon wafer. In the process of cutting the crystal rod, wire cutting is mostly used, and coolant is required during the cutting process, resulting in a large amount of mortar mixed with silicon slag and silicon carbide between adjacent silicon wafers of the cut crystal rod. The mortar has a certain viscosity, and due to the surface tension in the mortar, adjacent silicon wafers stick together and are difficult to separate. Therefore, when cleaning the cut crystal rod, it is difficult for the cleaning liquid to enter the gap between adjacent silicon wafers, resulting in poor cleaning effect. Summary of the invention

[0003] The embodiments of the present invention provide a crystal rod cleaning device and method, which are used to solve the problem in the prior art that adjacent silicon wafers are difficult to separate after the crystal rod is cut due to the presence of a large amount of mortar, resulting in poor cleaning effect of the gaps between adjacent silicon wafers.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a crystal rod cleaning device, comprising:

[0006] A cleaning tank, a clamping mechanism and two cleaning nozzles;

[0007] A first opening is provided above the cleaning tank, and the cleaning tank is used to hold cleaning liquid;

[0008] The clamping mechanism is used to clamp and transport the cut crystal rod;

[0009] A plurality of water spray holes are evenly arranged on the cleaning nozzle, and two cleaning nozzles are relatively arranged above the first opening and can move relative to the cleaning tank, so as to spray and clean the cut crystal rods.

[0010] Further, the cleaning nozzle is connected to the cleaning tank through a pipeline;

[0011] A pump is provided between the cleaning tank and the cleaning nozzle, for conveying the cleaning liquid from the cleaning tank to the cleaning nozzle and pressurizing the conveyed cleaning liquid.

[0012] Furthermore, the interval between adjacent water spray holes on the cleaning nozzle in the first direction is between 0.5 mm and 1.1 mm;

[0013] The first direction is the direction of the axis of the crystal rod.

[0014] Furthermore, the crystal rod cleaning device further comprises: a nozzle control mechanism;

[0015] The nozzle control mechanism is connected to the cleaning nozzle and is used to control the cleaning nozzle to move in the horizontal direction and the vertical direction, and to control the cleaning nozzle to rotate relative to the nozzle control mechanism.

[0016] Further, the clamping mechanism comprises: a plurality of clamps;

[0017] A support plate is bonded to the side of the crystal rod, and the support plate is clamped by the clamp to control the crystal rod.

[0018] Furthermore, a heater is provided in the cleaning tank for heating the cleaning liquid.

[0019] In a second aspect, an embodiment of the present invention provides a crystal rod cleaning method, which is applied to the crystal rod cleaning device as described above, comprising:

[0020] Controlling the clamping mechanism to move the cut crystal rod to the first opening, with the axis of the crystal rod parallel to the liquid surface of the cleaning liquid in the cleaning tank, and immersing a portion of the crystal rod in the cleaning liquid;

[0021] Controlling the two cleaning nozzles to approach the crystal rod until the cleaning nozzles are located on both sides of the crystal rod;

[0022] Controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod and simultaneously reciprocate between two ends of the crystal rod along a second direction;

[0023] The second direction is a direction parallel to the axis of the crystal rod.

[0024] Further, controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod includes:

[0025] The cleaning liquid in the cleaning tank is transported to the cleaning nozzle through a pipeline and a pump disposed between the cleaning tank and the cleaning nozzle;

[0026] Wherein, during the delivery process of the cleaning liquid, the cleaning liquid is pressurized by the pump to control the pressure of the cleaning liquid sprayed from the cleaning nozzle.

[0027] Further, controlling the cleaning nozzle to reciprocate between two ends of the crystal rod along the second direction includes:

[0028] A nozzle control mechanism connected to the cleaning nozzle is started, and the cleaning nozzle is driven to reciprocate between the two ends of the crystal rod along the second direction through the movement of the nozzle control mechanism, and the cleaning nozzle is controlled to rotate relative to the crystal rod.

[0029] Furthermore, the crystal rod cleaning method further includes:

[0030] Starting the heater in the cleaning tank to heat the cleaning liquid;

[0031] Wherein, the temperature range for heating the cleaning liquid is 55°C-65°C.

[0032] The beneficial effects of the present invention are:

[0033] The crystal rod cleaning device of the embodiment of the present invention can clamp and transport the cut crystal rod by providing the holding mechanism; by providing the cleaning nozzle that can move relative to the silicon wafer, it can perform all-round cleaning on the adjacent silicon wafers after cutting, and spray cleaning liquid to the crystal rod through multiple water spray holes evenly provided on the cleaning nozzle, so as to efficiently clean the gap between adjacent silicon wafers. The crystal rod cleaning device of the embodiment of the present invention solves the problem in the prior art that the adjacent silicon wafers are difficult to separate due to the presence of a large amount of mortar after the crystal rod is cut, resulting in poor cleaning effect on the gap between adjacent silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 One of the structural schematic diagrams showing a crystal rod cleaning device according to an embodiment of the present invention;

[0035] Figure 2 A second structural schematic diagram showing a crystal rod cleaning device according to an embodiment of the present invention;

[0036] Figure 3 The structure of the crystal rod of the embodiment of the present invention is shown;

[0037] Figure 4 A schematic diagram showing the steps of a crystal rod cleaning method according to an embodiment of the present invention;

[0038] Figure 5 A schematic diagram of a module of a crystal rod cleaning device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0040] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0041] Aiming at the problem in the prior art that adjacent silicon wafers are difficult to separate after the crystal rod is cut due to the presence of a large amount of mortar, resulting in poor cleaning effect of the gaps between adjacent silicon wafers, the present invention provides a crystal rod cleaning device and method.

[0042] like Figures 1 to 3 As shown, an embodiment of the present invention provides a crystal rod cleaning device, comprising:

[0043] A cleaning tank 1, a clamping mechanism 2 and two cleaning nozzles 3;

[0044] A first opening is provided above the cleaning tank 1, and the cleaning tank 1 is used to hold cleaning liquid;

[0045] The clamping mechanism 2 is used to clamp and transport the cut crystal rod 4;

[0046] The cleaning nozzle 3 is evenly provided with a plurality of water spray holes. Two cleaning nozzles 3 are relatively arranged above the first opening and can move relative to the cleaning tank 1 to spray and clean the cut crystal rod 4 .

[0047] Optionally, the two cleaning nozzles are movable relative to the cleaning tank, including:

[0048] The two cleaning nozzles can move and rotate relative to the cleaning tank (or the cut crystal rod located above the cleaning tank).

[0049] In the embodiment of the present invention, the cleaning nozzle can move in the horizontal direction and the vertical direction relative to the cut crystal rod;

[0050] The cleaning nozzle can rotate relative to the cut crystal rod.

[0051] The crystal rod cleaning device of the embodiment of the present invention can clamp and transport the cut crystal rod by setting the holding mechanism; by setting the cleaning nozzle, the adjacent silicon wafers after cutting can be cleaned in all directions by moving the cleaning nozzle relative to the silicon wafer, and the cleaning liquid is sprayed to the crystal rod through multiple water spray holes evenly arranged on the cleaning nozzle, so that the gap between adjacent silicon wafers can be efficiently cleaned. The crystal rod cleaning device of the embodiment of the present invention solves the problem in the prior art that the adjacent silicon wafers are difficult to separate due to the presence of a large amount of mortar after the crystal rod is cut, resulting in poor cleaning effect of the gap between adjacent silicon wafers.

[0052] Optionally, the cleaning nozzle 3 is connected to the cleaning tank 1 through a pipeline 5;

[0053] A pump 6 is provided between the cleaning tank 1 and the cleaning nozzle 3 for conveying the cleaning liquid from the cleaning tank 1 to the cleaning nozzle 3 and pressurizing the conveyed cleaning liquid.

[0054] Optionally, the pump comprises:

[0055] Centrifugal pumps, axial flow pumps, mixed flow pumps and vortex pumps.

[0056] Optionally, the connection between the pipeline and the cleaning tank is located above the middle of the cleaning tank.

[0057] The crystal rod cleaning equipment of the embodiment of the present invention connects the cleaning tank with the cleaning nozzle through the pipeline, and can clean the crystal rod with the cleaning liquid in the cleaning tank, so that the cleaning liquid can be recycled; by locating the connection between the pipeline and the cleaning tank above the middle of the cleaning tank, the mud mixed in the cleaning liquid can have enough time to settle to the bottom of the cleaning tank, and the cleaning liquid pumped by the pump contains less mud.

[0058] The crystal rod cleaning equipment of the embodiment of the present invention can control the spray pressure of the cleaning liquid sprayed from the cleaning nozzle by arranging the pump between the cleaning tank and the cleaning nozzle, so that the cleaning liquid with higher pressure can enter the gap between adjacent silicon wafers, thereby cleaning the gap between adjacent silicon wafers in the cut crystal rod by the high-pressure cleaning liquid.

[0059] Optionally, the interval between adjacent water spray holes on the cleaning nozzle 3 in the first direction is between 0.5 mm and 1.1 mm;

[0060] The first direction is the direction of the axis of the crystal rod 4 .

[0061] It should be noted that the thickness of the silicon wafer ranges from 0.6 mm to 0.9 mm.

[0062] The crystal rod cleaning equipment of the embodiment of the present invention, by setting the interval of the water spray holes in the first direction to between 0.5mm and 1.1mm, can fully clean the gaps between each silicon wafer when the cleaning nozzle sprays and cleans the silicon wafer, thereby improving the cleaning effect of the cut crystal rod.

[0063] Optionally, the crystal rod cleaning device further includes: a nozzle control mechanism 7;

[0064] The nozzle control mechanism 7 is connected to the cleaning nozzle 3 and is used to control the cleaning nozzle 3 to move in the horizontal direction and the vertical direction, and to control the cleaning nozzle 3 to rotate relative to the nozzle control mechanism 7 .

[0065] The crystal rod cleaning device of the embodiment of the present invention can control the cleaning nozzle to move and rotate relative to the crystal rod through the nozzle control mechanism, thereby performing all-round cleaning on the crystal rod.

[0066] Optionally, the clamping mechanism 2 comprises: a plurality of clamps 21;

[0067] A support plate 8 is bonded to the side surface of the crystal rod 4 , and the support plate 8 is clamped by the clamp 21 to control the crystal rod.

[0068] It should be noted that, in order to prevent the crystal rod from scattering after being cut, and to facilitate clamping of the cylindrical crystal rod with a smooth surface, a support beam is usually attached to the side of the crystal rod.

[0069] Optionally, the support plate runs through the entire crystal rod.

[0070] The crystal rod cleaning device of the embodiment of the present invention can still be a whole after the crystal rod is cut by bonding the support plate to the crystal rod, so as to facilitate subsequent transportation.

[0071] Optionally, a heater 9 is provided in the cleaning tank 1 for heating the cleaning liquid.

[0072] Optionally, the cleaning liquid is heated at a temperature ranging from 55°C to 65°C.

[0073] It should be noted that the cleaning effect of the cleaning fluid can achieve the best cleaning effect at a specific temperature.

[0074] The crystal rod cleaning device of the embodiment of the present invention can make the cleaning liquid reach the optimal cleaning temperature by arranging the heater in the cleaning tank, thereby improving the cleaning effect of the crystal rod.

[0075] like Figure 4 The embodiment of the present invention further provides a crystal rod cleaning method, which is applied to the crystal rod cleaning device as described above, and comprises the following steps:

[0076] Step 401, controlling the clamping mechanism to move the cut crystal ingot to the first opening, with the axis of the crystal ingot parallel to the liquid surface of the cleaning liquid in the cleaning tank, and immersing a portion of the crystal ingot in the cleaning liquid;

[0077] Step 402, controlling the two cleaning nozzles to approach the crystal rod until the cleaning nozzles are located on both sides of the crystal rod;

[0078] Step 403, controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod and simultaneously move back and forth between two ends of the crystal rod along a second direction;

[0079] The second direction is a direction parallel to the axis of the crystal rod.

[0080] Optionally, a portion of the crystal rod is immersed in the cleaning liquid, and another portion of the crystal rod is outside the cleaning liquid, and the cleaning liquid sprayed by the cleaning nozzle is used to clean the portion of the crystal rod that leaks out of the cleaning liquid.

[0081] The crystal rod cleaning method of the embodiment of the present invention moves the cut crystal rod to the first opening of the cleaning tank by setting the holding mechanism; by setting the cleaning nozzle that can move relative to the silicon wafer, the adjacent silicon wafers after cutting can be cleaned in all directions, and the cleaning liquid is sprayed to the crystal rod through multiple water spray holes evenly arranged on the cleaning nozzle, so that the gap between adjacent silicon wafers can be efficiently cleaned. The crystal rod cleaning method of the embodiment of the present invention solves the problem in the prior art that the adjacent silicon wafers are difficult to separate due to the presence of a large amount of mortar after the crystal rod is cut, resulting in poor cleaning effect of the gap between adjacent silicon wafers.

[0082] Optionally, controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod includes:

[0083] The cleaning liquid in the cleaning tank is transported to the cleaning nozzle through a pipeline and a pump disposed between the cleaning tank and the cleaning nozzle;

[0084] Wherein, during the delivery process of the cleaning liquid, the cleaning liquid is pressurized by the pump to control the pressure of the cleaning liquid sprayed from the cleaning nozzle.

[0085] The crystal rod cleaning equipment of the embodiment of the present invention can control the spray pressure of the cleaning liquid sprayed from the cleaning nozzle by arranging the pump between the cleaning tank and the cleaning nozzle, so that the cleaning liquid with higher pressure can enter the gap between adjacent silicon wafers, thereby cleaning the gap between adjacent silicon wafers in the cut crystal rod by the high-pressure cleaning liquid.

[0086] Optionally, controlling the cleaning nozzle to reciprocate between two ends of the crystal rod along the second direction includes:

[0087] A nozzle control mechanism connected to the cleaning nozzle is started, and the cleaning nozzle is driven to reciprocate between the two ends of the crystal rod along the second direction through the movement of the nozzle control mechanism, and the cleaning nozzle is controlled to rotate relative to the crystal rod.

[0088] The crystal rod cleaning device of the embodiment of the present invention can control the cleaning nozzle to move and rotate relative to the crystal rod through the nozzle control mechanism, thereby performing all-round cleaning on the crystal rod.

[0089] Optionally, the crystal rod cleaning method further includes:

[0090] Starting the heater in the cleaning tank to heat the cleaning liquid;

[0091] Wherein, the temperature range for heating the cleaning liquid is 55°C-65°C.

[0092] The crystal rod cleaning device of the embodiment of the present invention can make the cleaning liquid reach the optimal cleaning temperature by arranging the heater in the cleaning tank, thereby improving the cleaning effect of the crystal rod.

[0093] like Figure 5 As shown, the present invention also provides a crystal rod cleaning device 500, including:

[0094] A first control module 501 is used to control the clamping mechanism to move the cut crystal ingot to the first opening, with the axis of the crystal ingot parallel to the liquid surface of the cleaning liquid in the cleaning tank, and immerse part of the crystal ingot in the cleaning liquid;

[0095] A second control module 502 is used to control the two cleaning nozzles to approach the crystal ingot until the cleaning nozzles are located on both sides of the crystal ingot;

[0096] A third control module 503 is used to control the cleaning nozzle to spray the cleaning liquid onto the crystal rod and move back and forth between the two ends of the crystal rod along a second direction;

[0097] The second direction is a direction parallel to the axis of the crystal rod.

[0098] The crystal rod cleaning device of the embodiment of the present invention moves the cut crystal rod to the first opening of the cleaning tank by setting the holding mechanism; by setting the cleaning nozzle that can move relative to the silicon wafer, it can perform all-round cleaning on the adjacent silicon wafers after cutting, and spray cleaning liquid to the crystal rod through multiple water spray holes evenly arranged on the cleaning nozzle, so as to efficiently clean the gap between adjacent silicon wafers. The crystal rod cleaning method of the embodiment of the present invention solves the problem in the prior art that the adjacent silicon wafers are difficult to separate due to the presence of a large amount of mortar after the crystal rod is cut, resulting in poor cleaning effect on the gap between adjacent silicon wafers.

[0099] Optionally, the third control module is further used to:

[0100] The cleaning liquid in the cleaning tank is transported to the cleaning nozzle through a pipeline and a pump disposed between the cleaning tank and the cleaning nozzle;

[0101] Wherein, during the delivery process of the cleaning liquid, the cleaning liquid is pressurized by the pump to control the pressure of the cleaning liquid sprayed from the cleaning nozzle.

[0102] Optionally, the third control module is further used to:

[0103] A nozzle control mechanism connected to the cleaning nozzle is started, and the cleaning nozzle is driven to reciprocate between the two ends of the crystal rod along the second direction through the movement of the nozzle control mechanism, and the cleaning nozzle is controlled to rotate relative to the crystal rod.

[0104] Optionally, the crystal rod cleaning device further includes:

[0105] A heating module, used to start the heater in the cleaning tank to heat the cleaning liquid;

[0106] Wherein, the temperature range for heating the cleaning liquid is 55°C-65°C.

[0107] An embodiment of the present invention further provides a crystal rod cleaning device, comprising: a processor;

[0108] The processor is used to control the clamping mechanism to move the cut crystal rod to the first opening, with the axis of the crystal rod parallel to the liquid surface of the cleaning liquid in the cleaning tank, and immerse a portion of the crystal rod in the cleaning liquid;

[0109] Controlling the two cleaning nozzles to approach the crystal rod until the cleaning nozzles are located on both sides of the crystal rod;

[0110] Controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod and simultaneously reciprocate between two ends of the crystal rod along a second direction;

[0111] The second direction is a direction parallel to the axis of the crystal rod.

[0112] In addition, a specific embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above-mentioned crystal rod cleaning method are implemented. And the same technical effect can be achieved, so it will not be repeated here to avoid repetition.

[0113] The embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned crystal rod cleaning method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, they are not repeated here.

[0114] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A crystal rod cleaning device, characterized in that: include: A cleaning tank, a clamping mechanism and two cleaning nozzles; A first opening is provided above the cleaning tank, and the cleaning tank is used to hold cleaning liquid; The clamping mechanism is used to clamp and transport the cut crystal rod; The cleaning nozzle is evenly provided with a plurality of water spray holes. The two cleaning nozzles are relatively arranged above the first opening and can move relative to the cleaning tank, and are used for spray cleaning the cut crystal rods.

2. The crystal rod cleaning device according to claim 1, characterized in that: The cleaning nozzle is connected to the cleaning tank through a pipeline; A pump is provided between the cleaning tank and the cleaning nozzle, for conveying the cleaning liquid from the cleaning tank to the cleaning nozzle and pressurizing the conveyed cleaning liquid.

3. The crystal rod cleaning device according to claim 1, characterized in that: The interval between adjacent water spray holes on the cleaning nozzle in the first direction is between 0.5 mm and 1.1 mm; The first direction is the direction of the axis of the crystal rod.

4. The crystal rod cleaning device according to claim 1, characterized in that: Also includes: Nozzle control mechanism; The nozzle control mechanism is connected to the cleaning nozzle and is used to control the cleaning nozzle to move in the horizontal direction and the vertical direction, and to control the cleaning nozzle to rotate relative to the nozzle control mechanism.

5. The crystal rod cleaning device according to claim 1, characterized in that: The clamping mechanism comprises: a plurality of clamps; A support plate is bonded to the side of the crystal rod, and the support plate is clamped by the clamp to control the crystal rod.

6. The crystal rod cleaning device according to claim 1, characterized in that: A heater is provided in the cleaning tank for heating the cleaning liquid.

7. A crystal rod cleaning method, characterized in that: The crystal rod cleaning device according to any one of claims 1 to 6 comprises: Controlling the clamping mechanism to move the cut crystal rod to the first opening, with the axis of the crystal rod parallel to the liquid surface of the cleaning liquid in the cleaning tank, and immersing a portion of the crystal rod in the cleaning liquid; Controlling the two cleaning nozzles to approach the crystal rod until the cleaning nozzles are located on both sides of the crystal rod; Controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod and simultaneously reciprocate between two ends of the crystal rod along a second direction; The second direction is a direction parallel to the axis of the crystal rod.

8. The crystal rod cleaning method according to claim 7, characterized in that: Controlling the cleaning nozzle to spray the cleaning liquid toward the crystal rod includes: The cleaning liquid in the cleaning tank is transported to the cleaning nozzle through a pipeline and a pump disposed between the cleaning tank and the cleaning nozzle; Wherein, during the conveying process of the cleaning liquid, the cleaning liquid is pressurized by the pump to control the pressure of the cleaning liquid sprayed from the cleaning nozzle.

9. The crystal rod cleaning method according to claim 7, characterized in that: Controlling the cleaning nozzle to reciprocate between the two ends of the crystal rod along the second direction includes: A nozzle control mechanism connected to the cleaning nozzle is started, and the cleaning nozzle is driven to reciprocate between the two ends of the crystal rod along the second direction through the movement of the nozzle control mechanism, and the cleaning nozzle is controlled to rotate relative to the crystal rod.

10. The crystal rod cleaning method according to claim 7, characterized in that: The method further comprises: Starting the heater in the cleaning tank to heat the cleaning liquid; Wherein, the temperature range for heating the cleaning liquid is 55°C-65°C.

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