Laser cleaning device and method for base

Abstract

The invention discloses a laser cleaning device and method for a base. The laser cleaning device comprises a horizontal sliding table, a laser ranging unit, a laser cleaning unit and a control unit. The horizontal sliding table is used for bearing the base and driving the base to move according to a preset path; the laser ranging unit is located on the side, away from the sliding table, of the base, is in communication connection with the control unit and is used for measuring the focusing distance of attachments on the surface of the base and transmitting the focusing distance to the control unit. The control unit is in communication connection with the driving control end of the horizontal sliding table and the laser cleaning unit and used for controlling the cleaning laser beams output by the laser cleaning unit to be focused on the attachments according to the focusing distance while controlling the horizontal sliding table to move according to the preset path so as to clean the attachments. The laser cleaning device is used for cleaning attachments on the base, the requirement for the operation environment is low, the cost can be reduced, and the efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of base cleaning, and in particular to a laser cleaning device and method for a base. Background Art

[0002] In semiconductor processing, the substrate is usually placed on a base, such as a graphite base, to utilize the high thermal conductivity, heat resistance and corrosion resistance of graphite to provide the substrate with a stable and uniform flow field and temperature field. The uniform flow field and temperature field are crucial to the quality of the deposition / epitaxial layer prepared on the substrate.

[0003] However, in the process of preparing the deposition / epitaxial layer on the substrate surface on the graphite base, some by-products will inevitably adhere to the graphite base. In order to prevent the attachments on the graphite base from affecting the uniformity and defect density of the subsequent deposition / epitaxial layer, the graphite base needs to be cleaned before placing the substrate on the graphite base.

[0004] Existing methods for removing attachments from graphite bases include thermal sublimation, chemical etching and physical removal. Thermal sublimation requires a large heating and cooling system and exhaust system, which is costly and occupies a large space. Chemical etching not only poses safety risks, but also produces waste gas and a large amount of acidic waste liquid, which places high demands on the operating environment. Physical removal can only be done manually, which is very inefficient. Summary of the invention

[0005] The present invention provides a laser cleaning device and method for a base, so as to solve the problems of high cost, high requirements on operating environment and low efficiency of the existing base cleaning method.

[0006] In a first aspect, an embodiment of the present invention provides a laser cleaning device for a base, the laser cleaning device comprising a horizontal slide table, a laser ranging unit, a laser cleaning unit and a control unit;

[0007] The horizontal slide is used to carry the base and drive the base to move along a preset path;

[0008] The laser distance measuring unit is located on a side of the base away from the slide and is in communication connection with the control unit, and is used to measure the focus distance of the object attached to the surface of the base and transmit the focus distance to the control unit;

[0009] The control unit is respectively communicated with the driving control end of the horizontal slide and the laser cleaning unit, and is used to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance while controlling the horizontal slide to move according to the preset path, so as to clean the attachment.

[0010] Optionally, the control unit is used to control the laser cleaning unit to move along a first direction according to the focusing distance while controlling the horizontal slide to move along the preset path, so as to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment; the first direction intersects with the plane where the horizontal slide is located.

[0011] Optionally, the laser cleaning device further includes a slide bar;

[0012] The laser cleaning unit is fixed on the sliding rod;

[0013] The control unit is also communicatively connected to the driving control end of the slide rod, and is also used to control the slide rod to move along the first direction according to the focusing distance while controlling the horizontal slide table to move along the preset path, so as to control the laser cleaning unit to move along the first direction.

[0014] Optionally, a transmission path of the ranging laser beam output by the laser ranging unit is different from a transmission path of the cleaning laser beam output by the laser cleaning unit.

[0015] Optionally, a transmission path of the ranging laser beam output by the laser ranging unit is partially the same as a transmission path of the cleaning laser beam output by the laser cleaning unit.

[0016] Optionally, the laser cleaning device further includes a reflective plate and an objective lens;

[0017] The transmission path of the distance measuring laser beam after being reflected by the reflecting plate is the same as the transmission path of the cleaning laser beam passing through the reflecting plate;

[0018] The objective lens is used to focus the distance measuring laser beam reflected by the reflection plate or the cleaning laser beam passing through the reflection plate.

[0019] Optionally, the laser ranging unit includes a first laser; the laser cleaning unit includes a second laser;

[0020] The laser power of the first laser is smaller than the laser power of the second laser.

[0021] Optionally, the first laser includes a continuous wave ranging laser or a pulsed ranging laser;

[0022] The second laser includes a semiconductor laser, a gas laser or a solid laser.

[0023] In a second aspect, an embodiment of the present invention provides a laser cleaning method, comprising:

[0024] Receive the focus distance output by the laser ranging unit;

[0025] While controlling the horizontal slide table to move along a preset path, the cleaning laser beam output by the laser cleaning unit is controlled to focus on the attached object according to the focusing distance, so as to clean the attached object.

[0026] Optionally, controlling the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance includes:

[0027] The laser cleaning unit is controlled to move along a first direction according to the focusing distance, so as to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment; the first direction intersects with the plane where the horizontal slide table is located.

[0028] Compared with existing base cleaning methods such as thermal sublimation, chemical etching and physical scraping, the technical solution of the embodiment of the present invention, by setting a control unit, can control the cleaning laser beam output by the laser cleaning unit to focus on the attachments according to the focal distance of the attachments on the base surface measured by the laser ranging unit, thereby achieving the purpose of cleaning the attachments. It not only has low requirements on the operating environment, but also can reduce costs and improve efficiency.

[0029] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic structural diagram of a laser cleaning device for a base provided in an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the structure of a base with an attachment attached provided by an embodiment of the present invention;

[0033] Figure 3 A schematic structural diagram of another base with an attachment provided by an embodiment of the present invention;

[0034] Figure 4 A schematic structural diagram of another laser cleaning device for a base provided in an embodiment of the present invention;

[0035] Figure 5 A schematic structural diagram of another laser cleaning device for a base provided in an embodiment of the present invention;

[0036] Figure 6 A flow chart of a laser cleaning method provided by an embodiment of the present invention;

[0037] Figure 7 A flow chart of another laser cleaning method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only used to illustrate the relative positional relationship between the components or components, and does not particularly limit the specific installation orientation of the components or components.

[0040] Figure 1 A schematic diagram of a laser cleaning device for a base provided in an embodiment of the present invention, referring to Figure 1The laser cleaning device in the embodiment of the present invention includes a horizontal slide 10, a laser ranging unit 20, a laser cleaning unit 30 and a control unit 40. The horizontal slide 10 is used to support a base 101 and drive the base 101 to move along a preset path. The laser ranging unit 20 is located on the side of the base 101 away from the slide and is in communication connection with the control unit 40, and is used to measure the focus distance of the attachment 102 on the surface of the base 101 and transmit the focus distance to the control unit 40. The control unit 40 is respectively in communication connection with the driving control end of the horizontal slide 10 and the laser cleaning unit 30, and is used to control the cleaning laser beam 301 output by the laser cleaning unit 30 to focus on the attachment 102 according to the focus distance while controlling the horizontal slide 10 to move along the preset path, so as to clean the attachment 102.

[0041] Exemplarily, the horizontal slide 10 can move along the second direction X and the third direction Y. The control unit 40 is electrically connected to the driving control end of the horizontal slide 10, and can control the horizontal slide 10 to move along the preset path according to the preset path. The base 101 is placed on the horizontal slide 10, and can follow the horizontal slide 10 to move along the preset path. It should be noted that the preset path can be an "S"-shaped path, a "Z"-shaped path, a "U"-shaped path, etc. The embodiment of the present invention does not limit the shape of the preset path, and those skilled in the art can set it according to their needs. It should also be noted that the second direction X and the third direction Y in the embodiment of the present invention intersect and can be perpendicular to each other.

[0042] The embodiment of the present invention does not limit the type of the base 101. For example, Figure 2 A schematic diagram of a structure of a base with an attachment provided by an embodiment of the present invention, Figure 2 The base 101 in the embodiment only includes a layer of graphite, and an attachment 102 is attached to the upper surface of the graphite. Figure 3 A schematic diagram of the structure of another base with an attachment provided by an embodiment of the present invention, Figure 3 The base 101 in the embodiment includes a graphite layer 101A and a coating 102B stacked along a first direction Z. The coating 102B may be a SiC film or a TaC film. The upper surface of the coating 102B is attached with an attachment 102. It should be noted that the first direction Z intersects with the second direction X and the third direction Y respectively, and the first direction Z, the second direction X and the third direction Y may be perpendicular to each other.

[0043] Exemplarily, the laser ranging unit 20 includes a first laser and a ranging unit. While the control unit 40 controls the horizontal slide 10 and the base 101 to move along a preset path, the control unit 40 can also control the first laser to output a ranging laser beam 201 to the surface of the horizontal slide 10 or an attachment to the horizontal slide 10 through the ranging unit. The horizontal slide 10 or the attachment 102 on the horizontal slide 10 will reflect the ranging laser beam 201 to the ranging unit. The ranging unit will calculate the focus distance of the attachment 102 on the surface of the base 101 based on the time or phase difference required for the ranging laser beam 201 to be emitted and received, and transmit the focus distance to the control unit 40. The focus distance of the attachment 102 on the surface of the base 101 can be the distance between the attachment 102 and the ranging laser beam output end of the laser ranging unit 20 for outputting the ranging laser beam 201. It should be noted that the control unit 40 acquires a plurality of focus distances of the attachment 102 on the surface of the base 101 , and the arrangement order of the plurality of focus distances corresponds to the preset path.

[0044] Exemplarily, the laser cleaning unit 30 includes a second laser. After receiving the distance between the attachment 102 and the distance measuring laser beam output end of the laser distance measuring unit 20, that is, the focus distance of the attachment 102 on the surface of the base 101, the control unit 40 can first determine the distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30 for outputting the cleaning laser beam 301 according to the focus distance of the attachment 102 on the surface of the base 101. The control unit 40 can be electrically connected to the second laser, and after determining the distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30, while controlling the horizontal slide 10 and the base 101 to move according to a preset path, the cleaning laser beam 301 output by the laser cleaning unit 30 can be controlled to focus on the attachment 102 according to the distance between the attachment 102 and the cleaning laser beam output end in the laser cleaning unit 30, thereby cleaning the attachment 102. It should be noted that the cleaning laser beam output end in the laser cleaning unit 30 is the laser beam output end of the second laser.

[0045] It should be noted that the laser power of the first laser is less than the laser power of the second laser. It is understandable that when the laser ranging unit 20 outputs the ranging laser beam 201, in order to ensure the accuracy of the focusing distance of the attachment 102 on the surface of the base 101, it is necessary to control the laser power of the first laser used to output the ranging laser beam 201 in the laser ranging unit 20 to be smaller, so as to ensure that the ranging laser beam 201 will not damage the attachment 102. In order to ensure that the laser cleaning unit 30 can clean the attachment 102, that is, destroy the attachment 102, it is necessary not only to control the cleaning laser beam in the laser cleaning unit 30 to focus on the attachment 102, but also to control the laser power used to output the second laser to be larger, so that the cleaning laser beam output to the attachment 102 can destroy the attachment 102, and the attachment 102 can be vaporized or sputtered away.

[0046] Specifically, the laser power P1 of the first laser satisfies P1≤10 W, and the laser power P2 of the second laser satisfies P2≥100 W. The operating frequency of the second laser is positively correlated with its laser power, and the operating frequency of the second laser is generally greater than 5000 Hz.

[0047] As a feasible implementation, the first laser includes a continuous wave ranging laser or a pulsed ranging laser. The second laser includes a semiconductor laser, a gas laser or a solid laser.

[0048] It should be noted that the embodiment of the present invention does not limit the types of the first laser in the laser ranging unit 20 and the second laser in the laser cleaning unit 30, and those skilled in the art can set them according to actual needs. The cleaning laser beam 301 output by the second laser can select different wavelengths according to the material system of the attachment 102. For example, the attachment 102 grown by SiC epitaxial growth is mainly 3C-SiC, which is a transparent material under the visible light wavelength. In order to ensure that the cleaning laser beam 301 output by the second laser can destroy the attachment 102, it is necessary to select a laser in the UVC band.

[0049] Compared with existing base cleaning methods such as thermal sublimation, chemical etching and physical scraping, the embodiment of the present invention can control the cleaning laser beam output by the laser cleaning unit 30 to focus on the attachment 102 according to the focusing distance of the attachment 102 on the surface of the base 101 measured by the laser ranging unit 20 by setting the control unit 40, thereby achieving the purpose of cleaning the attachment. It not only has low requirements on the operating environment, but also can reduce costs and improve efficiency.

[0050] In a feasible implementation manner, in order to ensure that the cleaning laser beam 301 output by the laser cleaning unit 30 can be focused on the attachment 102 while controlling the horizontal slide 10 to move along a preset path, the control unit 40 can adjust the focal length of the cleaning laser beam 301 output by the laser cleaning unit 30 according to the acquired focusing distance of the attachment 102 on the surface of the base 101 while controlling the horizontal slide 10 to move along a preset path, so that the focal length of the cleaning laser beam 301 output by the laser cleaning unit 30 is equal to the distance between the attachment 102 and the cleaning laser beam output end in the laser cleaning unit 30.

[0051] In another feasible implementation, the control unit 40 is used to control the laser cleaning unit 30 to move along the first direction Z according to the focus distance while controlling the horizontal slide 10 to move along a preset path, so as to control the cleaning laser beam 301 output by the laser cleaning unit 30 to focus on the attachment 102. The first direction Z intersects with the plane where the horizontal slide 10 is located.

[0052] Exemplarily, in order to ensure that the cleaning laser beam 301 output by the laser cleaning unit 30 can be focused on the attachment 102 while controlling the horizontal slide 10 to move along a preset path, the control unit 40 can also control the laser cleaning unit 30 to move along the first direction Z according to the acquired focusing distance of the attachment 102 on the surface of the base 101 while controlling the horizontal slide 10 to move along a preset path, thereby controlling the distance between the attachment 102 and the output end of the cleaning laser beam in the laser cleaning unit 30 to be equal to the fixed focal length of the cleaning laser beam 301 output by the laser cleaning unit 30.

[0053] Specifically, Figure 4 A schematic diagram of the structure of another laser cleaning device for a base provided in an embodiment of the present invention, referring to Figure 4 The laser cleaning device further includes a slide bar 50. The laser cleaning unit 30 is fixed on the slide bar 50. The control unit 40 is also in communication connection with the driving control end of the slide bar 50, and is also used to control the slide bar 50 to move along the first direction Z according to the focus distance while controlling the horizontal slide table 10 to move along the preset path, so as to control the laser cleaning unit 30 to move along the first direction Z.

[0054] Exemplarily, the laser cleaning unit 30 is fixed on the slide bar 50. To control the laser cleaning unit 30 to move along the first direction Z, the control unit 40 can drive the laser cleaning unit 30 to move by controlling the slide bar 50 to move along the first direction Z. The embodiment of the present invention does not limit the method for realizing the movement of the laser cleaning unit 30 along the first direction Z. It can be realized by the slide bar 50 set as above, or by a mechanical arm. Those skilled in the art can set it by themselves according to actual conditions.

[0055] In one possible implementation, reference Figure 1, the transmission path of the ranging laser beam 201 output by the laser ranging unit 20 is different from the transmission path of the cleaning laser beam 301 output by the laser cleaning unit 30.

[0056] For example, Figure 1 and Figure 4 The laser ranging unit 20 and the laser cleaning unit 30 shown in the figure are arranged along the second direction X, and the transmission path of the ranging laser beam 201 output by the laser ranging unit 20 is parallel to the transmission path of the cleaning laser beam 301 output by the laser cleaning unit 30, and is perpendicular to the plane where the base 101 is located.

[0057] Figure 5 A schematic diagram of the structure of another laser cleaning device for a base provided in an embodiment of the present invention, referring to Figure 5 In another feasible implementation manner, the transmission path of the ranging laser beam 201 output by the laser ranging unit 20 is partially the same as the transmission path of the cleaning laser beam 301 output by the laser cleaning unit 30 .

[0058] Continue to refer Figure 5 The laser cleaning device further includes a reflector 60 and an objective lens 70. The transmission path of the distance measuring laser beam 201 reflected by the reflector 60 is the same as the transmission path of the cleaning laser beam 301 passing through the reflector 60. The objective lens 70 is used to focus the distance measuring laser beam 201 reflected by the reflector 60 or the cleaning laser beam 301 passing through the reflector 60.

[0059] For example, Figure 5 The laser distance measuring unit 20 and the laser cleaning unit 30 shown in the figure are arranged alternately along the second direction X and the third direction Y. The cleaning laser beam 301 output by the laser cleaning unit 30 can directly pass through the reflector 60, and its transmission path is perpendicular to the plane where the base 101 is located. When the distance measuring laser beam 201 output by the laser distance measuring unit 20 is reflected by the reflector 60, it will be reflected by the reflector 60 to the attachment 102 on the base 101. The transmission path of the distance measuring laser beam 201 before being reflected by the reflector 60 is perpendicular to the transmission path of the cleaning laser beam 301, and the transmission path of the distance measuring laser beam 201 after being reflected by the reflector 60 is parallel to and overlaps with the transmission path of the cleaning laser beam 301.

[0060] The laser distance measuring unit 20 and the laser cleaning unit 30 in the embodiment of the present invention can be integrated in the same device. The main function of the reflector 60 is to allow the distance measuring laser beam 201 output by the laser distance measuring unit 20 and the cleaning laser beam 301 output by the laser cleaning unit 30 to share the same optical path. The specific reflector 60 is coated with a film and has different optical properties for different wavelengths, ensuring that the cleaning laser beam 301 output by the laser cleaning unit 30 can be transmitted, while the distance measuring laser beam 201 output by the laser distance measuring unit 20 can be reflected.

[0061] The objective lens 70 may be composed of one lens or a plurality of lenses. The objective lens 70 focuses the distance measuring laser beam 201 reflected by the reflector 60 to limit the damage of the distance measuring laser beam 201 to the base 101 and the attached object 102 itself. The objective lens 70 focuses the cleaning laser beam 301 passing through the reflector 60, and a laser cleaning unit 30 with a relatively low power may be used for cleaning, which is beneficial to reducing the power consumption of the laser cleaning unit 30 for cleaning the attached object 102.

[0062] Compared with the transmission path of the ranging laser beam 201 output by the laser ranging unit 20 and the transmission path of the cleaning laser beam 301 output by the laser cleaning unit 30, which are different, two objective lenses are required to focus the ranging laser beam 201 and the cleaning laser beam 301 respectively. The embodiment of the present invention changes the transmission path of the ranging laser beam 201 output by the laser ranging unit 20 by setting a reflection plate 60, and finally makes the transmission path of the ranging laser beam 201 after being reflected by the reflection plate 60 the same as the transmission path of the cleaning laser beam 301 passing through the reflection plate 60, and shares the same objective lens 70 for focusing, which is beneficial to reducing the volume of the entire device integrated with the laser ranging unit 20 and the laser cleaning unit 30.

[0063] An embodiment of the present invention provides a laser cleaning method, which is applied to the laser cleaning device provided by the above embodiment of the present invention. Figure 6 A flow chart of a laser cleaning method provided by an embodiment of the present invention, referring to Figure 6 , the laser cleaning method in the embodiment of the present invention includes:

[0064] S110, receiving the focus distance output by the laser ranging unit.

[0065] refer to Figure 1 , the control unit 40 can obtain the focus distance of the attachment 102 on the surface of the base 101 through the distance measuring unit in the laser distance measuring unit 20 while controlling the horizontal slide 10 and the base 101 to move according to the preset path. Specifically, the control unit 40 can control the first laser in the laser distance measuring unit 20 to output the distance measuring laser beam 201 to the surface of the horizontal slide 10 or the attachment of the horizontal slide 10 through the distance measuring unit while controlling the horizontal slide 10 and the base 101 to move according to the preset path. The horizontal slide 10 or the attachment 102 on the horizontal slide 10 will reflect the distance measuring laser beam 201 to the distance measuring unit. The distance measuring unit will calculate the focus distance of the attachment 102 on the surface of the base 101 according to the time or phase difference required from the emission to the reception of the distance measuring laser, and transmit the focus distance to the control unit 40. It should be noted that the control unit 40 obtains multiple focus distances of the attachment 102 on the surface of the base 101, and the arrangement order of the multiple focus distances corresponds to the preset path.

[0066] S120, while controlling the horizontal slide table to move along a preset path, control the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance, so as to clean the attachment.

[0067] Exemplary, reference Figure 1 After receiving the focus distance of the attachment 102 on the surface of the base 101, that is, the distance between the attachment 102 and the distance measuring laser beam output end of the laser distance measuring unit 20, the control unit 40 can first determine the distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30 for outputting the cleaning laser beam 301 according to the focus distance of the attachment 102 on the surface of the base 101. The control unit 40 can be electrically connected to the second laser in the laser cleaning unit 30, and after determining the distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30, while controlling the horizontal slide 10 and the base 101 to move according to the preset path, the cleaning laser beam 301 output by the laser cleaning unit 30 can be controlled to focus on the attachment 102 according to the determined distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30, thereby cleaning the attachment 102.

[0068] In a feasible implementation manner, in order to ensure that the cleaning laser beam 301 output by the laser cleaning unit 30 can be focused on the attachment 102 while controlling the horizontal slide 10 to move along a preset path, the control unit 40 can adjust the focal length of the cleaning laser beam 301 output by the laser cleaning unit 30 according to the acquired focusing distance of the attachment 102 on the surface of the base 101 while controlling the horizontal slide 10 to move along a preset path, so that the focal length of the cleaning laser beam 301 output by the laser cleaning unit 30 is equal to the distance between the attachment 102 and the cleaning laser beam output end in the laser cleaning unit 30.

[0069] Figure 7 A flowchart of another laser cleaning method provided by an embodiment of the present invention, Figure 7 The embodiment shown in the figure describes in detail how to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance, and refer to Figure 7 , the laser cleaning method in the embodiment of the present invention includes:

[0070] S210, receiving the focus distance output by the laser ranging unit.

[0071] S220, while controlling the horizontal slide to move along a preset path, control the laser cleaning unit to move along a first direction according to the focusing distance, so as to control the cleaning laser beam output by the laser cleaning unit to focus on the attachments, thereby cleaning the attachments, wherein the first direction intersects with the plane where the horizontal slide is located.

[0072] Exemplary, reference Figure 4 To ensure that the cleaning laser beam 301 output by the laser cleaning unit 30 can be focused on the attachment 102 while the horizontal slide 10 is controlled to move along the preset path, the control unit 40 can also control the laser cleaning unit 30 to move along the first direction Z according to the acquired focus distance of the attachment 102 on the surface of the base 101 while the horizontal slide 10 is controlled to move along the preset path, thereby controlling the distance between the attachment 102 and the cleaning laser beam output end of the laser cleaning unit 30 to be equal to the fixed focal length of the cleaning laser beam 301 output by the laser cleaning unit 30. Specifically, refer to Figure 3 The laser cleaning unit 30 is fixed on the sliding rod 50 , and the laser cleaning unit 30 can be controlled to move along the first direction Z by controlling the sliding rod 50 to move along the first direction Z.

[0073] Compared with existing base cleaning methods such as thermal sublimation, chemical etching and physical scraping, the embodiment of the present invention controls the cleaning laser beam output by the laser cleaning unit 30 to focus on the attachment 102 according to the focal distance of the attachment 102 on the surface of the base 101 measured by the laser ranging unit 20, thereby achieving the purpose of cleaning the attachment. It not only has low requirements on the operating environment, but also can reduce costs and improve efficiency.

[0074] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser cleaning device for a base, characterized in that: The laser cleaning device comprises a horizontal slide table, a laser distance measuring unit, a laser cleaning unit and a control unit; The horizontal slide is used to carry the base and drive the base to move along a preset path; The laser distance measuring unit is located on a side of the base away from the slide and is in communication connection with the control unit, and is used to measure the focus distance of the object attached to the surface of the base and transmit the focus distance to the control unit; The control unit is respectively communicated with the driving control end of the horizontal slide and the laser cleaning unit, and is used to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance while controlling the horizontal slide to move according to the preset path, so as to clean the attachment.

2. The laser cleaning device according to claim 1, characterized in that: The control unit is used to control the laser cleaning unit to move along a first direction according to the focusing distance while controlling the horizontal slide to move along the preset path, so as to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment; the first direction intersects with the plane where the horizontal slide is located.

3. The laser cleaning device according to claim 2, characterized in that: The laser cleaning device also includes a slide bar; The laser cleaning unit is fixed on the sliding rod; The control unit is also communicatively connected to the driving control end of the slide rod, and is also used to control the slide rod to move along the first direction according to the focusing distance while controlling the horizontal slide table to move along the preset path, so as to control the laser cleaning unit to move along the first direction.

4. The laser cleaning device according to claim 1, characterized in that: The transmission path of the distance measuring laser beam output by the laser distance measuring unit is different from the transmission path of the cleaning laser beam output by the laser cleaning unit.

5. The laser cleaning device according to claim 1, characterized in that: The transmission path of the distance measuring laser beam output by the laser distance measuring unit is partially the same as the transmission path of the cleaning laser beam output by the laser cleaning unit.

6. The laser cleaning device according to claim 5, characterized in that: The laser cleaning device also includes a reflector and an objective lens; The transmission path of the distance measuring laser beam after being reflected by the reflecting plate is the same as the transmission path of the cleaning laser beam passing through the reflecting plate; The objective lens is used to focus the distance measuring laser beam reflected by the reflection plate or the cleaning laser beam passing through the reflection plate.

7. The laser cleaning device according to claim 1, characterized in that: The laser distance measuring unit includes a first laser; the laser cleaning unit includes a second laser; The laser power of the first laser is smaller than the laser power of the second laser.

8. The laser cleaning device according to claim 7, characterized in that: The first laser includes a continuous wave ranging laser or a pulsed ranging laser; The second laser includes a semiconductor laser, a gas laser or a solid laser.

9. A laser cleaning method, characterized in that: include: Receive the focus distance output by the laser ranging unit; While controlling the horizontal slide table to move along a preset path, the cleaning laser beam output by the laser cleaning unit is controlled to focus on the attached object according to the focusing distance, so as to clean the attached object.

10. The laser cleaning method according to claim 9, characterized in that: Controlling the cleaning laser beam output by the laser cleaning unit to focus on the attachment according to the focusing distance includes: The laser cleaning unit is controlled to move along a first direction according to the focusing distance, so as to control the cleaning laser beam output by the laser cleaning unit to focus on the attachment; the first direction intersects with the plane where the horizontal slide table is located.

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