Tungsten steel milling cutter for horizontal machining center and preparation method of tungsten steel milling cutter

By designing a spiral chip drain and heat dissipation groove of the ring array on the milling cutter head of the tungsten steel milling cutter, and setting a heat dissipation plate and diamond coating in the heat dissipation groove, the wear problem caused by thermal energy accumulation during the processing process of the tungsten steel milling cutter is solved, achieving more effective heat dissipation and extending service life.

CN119839349APending Publication Date: 2025-04-18KUNSHAN TESHENGLONG PRECISION TOOLS CO LTD
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Patent Information

Application Number
CN202311338032.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-16
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

During the processing process, the existing tungsten steel milling cutters are converted into a large amount of heat energy due to high-speed friction and chip removal grooves, which causes the tungsten steel milling cutters to wear too quickly, especially the ends of the milling cutters, which cannot quickly dissipate heat, resulting in a shortened service life.

Method used

A tungsten steel milling cutter for horizontal machining center is designed. The milling cutter head ring array has several spiral chip discharge grooves. The side walls of the chip discharge groove are composed of arcuate guiding surfaces and horizontal guiding surfaces. A heat dissipation groove is opened on the horizontal guiding surface. A heat dissipation plate is provided in the heat dissipation groove. The heat dissipation plate is connected to the heat dissipation groove through a heat dissipation adhesive layer. The heat dissipation adhesive layer is formed by an adhesive and nanopowder. The nanopowder includes boron nitride, aluminum nitride, etc., and a diamond coating is provided on the heat dissipation plate and the chip discharge groove.

Benefits of technology

By increasing the setting of the heat dissipation plate and the heat dissipation adhesive layer, the heat conduction ability of the tungsten steel milling cutter is improved, and the heat energy is quickly taken away, which reduces the wear of the end of the milling cutter and extends the service life.

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Abstract

The invention discloses a tungsten steel milling cutter for a horizontal machining center and a preparation method thereof, the tungsten steel milling cutter comprises a milling cutter handle (1) and a milling cutter head (2) which are of an integrated structure, and is characterized in that a plurality of spiral chip grooves (3) are annularly arrayed on the milling cutter head (2), and the side wall of each chip groove (3) is composed of an arc-shaped guide surface and a horizontal guide surface; and a heat dissipation groove is formed in the horizontal guide surface.
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Description

Technical Field

[0001] The invention relates to the technical field of tungsten steel milling cutters, and more specifically, to a tungsten steel milling cutter for a horizontal machining center and a preparation method thereof. Background Art

[0002] Tungsten steel milling cutter is a tool made of tungsten steel. It is generally used in CNC machining centers and CNC engraving machines. It can also be installed on ordinary milling machines to process some relatively hard and uncomplicated heat-treated materials. Tungsten steel milling cutter is widely used and uses high-speed processing. The hardness of tungsten steel milling cutter is Vickers 10K, second only to diamond. Because of this, tungsten steel milling cutter has the characteristic of not being easily worn.

[0003] However, during the operation of the tungsten steel milling cutter, the blade of the tungsten steel milling cutter and the cutting part generate high-speed friction, and the chip groove on the tungsten steel milling cutter generates greater friction with the cut waste chips, resulting in the conversion of the mechanical energy of the tungsten steel milling cutter into a large amount of heat energy. When the heat is too high, the wear of the tungsten steel milling cutter is accelerated. The existing heat dissipation means generally cool the tungsten steel milling cutter by setting a coolant. However, when some materials of workpieces are cut, the heat energy generated by the tungsten steel milling cutter and the workpiece is too high, and the end of the tungsten steel milling cutter in contact with the workpiece is constantly polished during the operation. The coolant cannot cool the end of the tungsten steel milling cutter better. The tungsten steel milling cutter itself cannot dissipate heat quickly, causing the end of the tungsten steel milling cutter to wear too quickly and the wear on the side of the milling cutter slows down, resulting in the tungsten steel milling cutter being disposed of before it is fully used, increasing the usage of the milling cutter.

[0004] Therefore, a new solution needs to be proposed to solve this problem. Summary of the invention

[0005] In view of the deficiencies in the prior art, the object of the present invention is to provide a tungsten steel milling cutter for a horizontal machining center and a preparation method thereof, which is achieved through structural settings.

[0006] The above technical purpose of the present invention is achieved through the following technical scheme: a tungsten steel milling cutter for a horizontal machining center, comprising a milling cutter shank and a milling cutter head of an integrated structure, the milling cutter head having a ring array with a plurality of spiral chip grooves, the side walls of the chip grooves being composed of an arc guide surface and a horizontal guide surface, and a heat dissipation groove is provided on the horizontal guide surface.

[0007] The present invention is further configured as follows: a heat dissipation plate is arranged in the heat dissipation groove, and the heat dissipation plate is connected to the heat dissipation groove through a heat dissipation adhesive layer.

[0008] The present invention is further configured as follows: the heat dissipation adhesive layer is formed by an adhesive and nanopowder, the adhesive is a mixture of polyvinyl alcohol and water in a ratio of 8:2, and the nanopowder includes one or more of boron nitride, aluminum nitride, silicon carbide, silicon nitride, silicon dioxide, aluminum oxide, zinc oxide and magnesium oxide.

[0009] The present invention is further configured as follows: one side of the heat sink is coplanar with a side wall of the chip groove, a diamond coating is provided on the heat sink and the chip groove, and the thickness of the diamond coating is higher than 2 μm.

[0010] The present invention is further configured as follows: the heat dissipation plate is a graphene and ceramic particle combination plate.

[0011] A method for preparing a tungsten steel milling cutter for a horizontal machining center comprises the following steps:

[0012] 1) Send the tungsten steel material into the sintering furnace for sintering. The temperature in the sintering furnace is 750-850℃. The reaction time is 1-2h to form a tungsten steel blank.

[0013] 2) grinding, heat treating, pickling and groove rolling the tungsten steel blank material prepared in step 1 on a lathe to form a primary tungsten steel milling cutter with a heat dissipation groove;

[0014] 3) Graphene and ceramic particles are prepared into a slurry in a ratio of 10:1 to 1:5, and the slurry is applied in a heat dissipation tank with a thickness of 8 to 10 μm. The tungsten steel milling cutter coated with the slurry is placed in an oven for drying to form a heat dissipation plate;

[0015] 4) Remove the heat sink produced in step 3, mix polyvinyl alcohol and water in a ratio of 8:2 to form an adhesive, then apply the adhesive on the bonding surface of the heat sink and the heat sink, scatter the nano powder on the adhesive, and then bond the heat sink around the heat sink to form a heat dissipation bonding layer with the adhesive and the nano powder;

[0016] 5) Spray a diamond coating with a thickness of more than 2 μm on the side wall of the chip groove of the tungsten steel milling cutter produced in step 4 and on the side of the heat dissipation plate away from the heat dissipation groove.

[0017] In summary, the present invention has the following beneficial effects:

[0018] 1. By setting a heat sink and a heat dissipation adhesive layer, the heat sink is made of graphene and ceramic particles in a ratio of 10:1 to 1:5, and the heat dissipation adhesive layer is formed by an adhesive and nano powder. The nano powder includes one or more of boron nitride, aluminum nitride, silicon carbide, silicon nitride, silicon dioxide, aluminum oxide, zinc oxide and magnesium oxide. The heat sink and the heat dissipation adhesive layer increase the heat conduction to the milling cutter head, thereby increasing the heat dissipation effect of the milling cutter head.

[0019] 2. Diamond coating is provided on the heat sink and the chip groove. The thickness of the diamond coating is higher than 2μm. The diamond coating increases the hardness of the side wall of the chip groove of the milling cutter head, preventing the heat sink from being worn due to excessive wear of the side wall of the chip groove, thereby ensuring the heat dissipation effect of the milling cutter head. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 It is a cross-sectional view of the present invention.

[0022] In the figure: 1. milling cutter handle; 2. milling cutter head; 3. chip groove; 4. heat sink. DETAILED DESCRIPTION

[0023] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] A tungsten steel milling cutter for horizontal machining centers, such as Figure 1 and Figure 2 As shown, it includes a milling cutter handle 1 and a milling cutter head 2 of an integrated structure. The milling cutter head 2 has a plurality of spiral chip grooves 3 in a ring array. The side wall of the chip groove 3 is composed of an arc guide surface and a horizontal guide surface. A heat dissipation groove is opened on the horizontal guide surface. A heat dissipation plate 4 is arranged in the heat dissipation groove. The heat dissipation plate 4 is connected to the heat dissipation groove through a heat dissipation adhesive layer.

[0025] Embodiment 1:

[0026] A tungsten steel milling cutter for a horizontal machining center, wherein the milling cutter head 2 is a four-edged structure, one side of a heat sink 4 is coplanar with a side wall of a chip groove 3, a diamond coating is provided on the heat sink 4 and the chip groove 3, the thickness of the diamond coating is higher than 2 μm, and the heat sink 4 is a graphene and ceramic particle combination plate.

[0027] A method for preparing a tungsten steel milling cutter for a horizontal machining center comprises the following steps:

[0028] 1) Send the tungsten steel material into the sintering furnace for sintering. The temperature in the sintering furnace is 750-850℃. The reaction time is 1-2h to form a tungsten steel blank.

[0029] 2) grinding, heat treating, pickling and groove rolling the tungsten steel blank material prepared in step 1 on a lathe to form a primary tungsten steel milling cutter with a heat dissipation groove;

[0030] 3) Graphene and ceramic particles are prepared into a slurry in a ratio of 10:1 to 1:5, and the slurry is applied in a heat dissipation tank with a thickness of 8 to 10 μm. The tungsten steel milling cutter coated with the slurry is placed in an oven at 80° C. for drying, and then the temperature is adjusted to 230° C. for further drying;

[0031] 4) Remove the heat sink 4 prepared in step 3, mix polyvinyl alcohol and water in a ratio of 8:2 to form an adhesive, then apply the adhesive on the bonding surface of the heat sink 4 and the heat sink, scatter the nano powder on the adhesive, and then bond the heat sink 4 around the periphery to the heat sink, so that the adhesive and the nano powder form a heat dissipation bonding layer;

[0032] 5) Spray a diamond coating with a thickness of more than 2 μm on the side wall of the chip groove 3 of the tungsten steel milling cutter produced in step 4 and on the side of the heat dissipation plate 4 away from the heat dissipation groove.

[0033] The new tungsten steel milling cutter produced by the above formula and process increases the heat conduction of the tungsten steel milling cutter and prevents the tungsten steel milling cutter from wearing too quickly due to excessive heat energy converted from mechanical energy.

[0034] Embodiment 2:

[0035] A tungsten steel milling cutter for a horizontal machining center, wherein the milling cutter head 2 is a four-edged structure, a diamond coating is provided on a heat dissipation plate 4 and a chip removal groove 3, and the heat dissipation layer is a nano powder, which includes one or more of boron nitride, aluminum nitride, silicon carbide, silicon nitride, silicon dioxide, aluminum oxide, zinc oxide and magnesium oxide.

[0036] 1) Send the tungsten steel material into the sintering furnace for sintering. The temperature in the sintering furnace is 750-850℃. The reaction time is 1-2h to form a tungsten steel blank.

[0037] 2) grinding, heat treating, pickling and groove rolling the tungsten steel blank material prepared in step 1 on a lathe to form a primary tungsten steel milling cutter with a heat dissipation groove;

[0038] 3) A slurry is prepared by mixing 5% polysilazane, 30% ceramic and 65% graphene, and the slurry is applied in the heat dissipation tank. The thickness of the slurry is 8 to 10 μm. The tungsten steel milling cutter coated with the slurry is placed in an oven for drying to form a heat dissipation plate 4;

[0039] 4) Remove the heat sink 4 prepared in step 3, mix polyvinyl alcohol and water in a ratio of 8:2 to form an adhesive, then apply the adhesive on the bonding surface of the heat sink 4 and the heat sink, scatter the nano powder on the adhesive, and then bond the heat sink 4 around the periphery to the heat sink, so that the adhesive and the nano powder form a heat dissipation bonding layer;

[0040] 5) Spray a diamond coating with a thickness of more than 2 μm on the side wall of the chip groove 3 of the tungsten steel milling cutter produced in step 4 and on the side of the heat dissipation plate 4 away from the heat dissipation groove.

[0041] The new tungsten steel milling cutter produced by the above formula and process increases the heat conduction of the tungsten steel milling cutter and prevents the tungsten steel milling cutter from wearing too quickly due to excessive heat energy converted from mechanical energy.

[0042] In summary, the tungsten steel milling cutter increases its own heat conduction through the setting of the heat dissipation plate 4 and the heat dissipation layer, so that the flowing coolant can quickly take away the heat energy of the tungsten steel milling cutter itself, preventing the end of the tungsten steel milling cutter in contact with the workpiece from wearing too quickly, thereby reducing the use of the tungsten steel milling cutter.

[0043] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A tungsten steel milling cutter for a horizontal machining center, comprising a milling cutter handle (1) and a milling cutter head (2) of an integrated structure, characterized in that: The milling cutter head (2) has a plurality of spiral chip removal grooves (3) in an annular array, the side walls of the chip removal grooves (3) are composed of an arc-shaped guide surface and a horizontal guide surface, and the horizontal guide surface is provided with a heat dissipation groove.

2. The tungsten steel milling cutter for a horizontal machining center according to claim 1, characterized in that: A heat dissipation plate (4) is arranged in the heat dissipation groove, and the heat dissipation plate (4) is connected to the heat dissipation groove via a heat dissipation adhesive layer.

3. The tungsten steel milling cutter for a horizontal machining center according to claim 2, characterized in that: The heat dissipation adhesive layer is formed by an adhesive and nano powder, the adhesive is a mixture of polyvinyl alcohol and water in a ratio of 8:2, and the nano powder includes one or more of boron nitride, aluminum nitride, silicon carbide, silicon nitride, silicon dioxide, aluminum oxide, zinc oxide and magnesium oxide.

4. The tungsten steel milling cutter for a horizontal machining center according to claim 3, characterized in that: One side of the heat dissipation plate (4) is coplanar with the side wall of the chip removal groove (3), and a diamond coating is provided on the heat dissipation plate (4) and the chip removal groove (3), wherein the thickness of the diamond coating is greater than 2 μm.

5. The tungsten steel milling cutter for a horizontal machining center according to claim 4, characterized in that: The heat dissipation plate (4) is a plate combining graphene and ceramic particles.

6. A method for preparing a tungsten steel milling cutter for a horizontal machining center, characterized in that: The following steps are involved: 1) Send the tungsten steel material into the sintering furnace for sintering. The temperature in the sintering furnace is 750-850℃. The reaction time is 1-2h to form a tungsten steel blank. 2) grinding, heat treating, pickling and groove rolling the tungsten steel blank material prepared in step 1 on a lathe to form a primary tungsten steel milling cutter with a heat dissipation groove; 3) preparing a slurry with graphene and ceramic particles in a ratio of 10:1 to 1:5, coating the slurry in a heat sink with a thickness of 8 to 10 μm, and placing a tungsten steel milling cutter coated with the slurry in an oven for drying to form a heat sink (4); 4) removing the heat sink (4) prepared in step 3, mixing polyvinyl alcohol and water in a ratio of 8:2 to form an adhesive, then applying the adhesive on the bonding surface of the heat sink (4) and the heat sink, spreading the nano powder on the adhesive, and then bonding the heat sink (4) around the periphery to the heat sink, so that the adhesive and the nano powder form a heat dissipation bonding layer; 5) Spray a diamond coating having a thickness greater than 2 μm on the side wall of the chip groove (3) of the tungsten steel milling cutter produced in step 4 and on the side of the heat dissipation plate (4) away from the heat dissipation groove.