Secondary molding method and secondary molding device

Abstract

The invention relates to a secondary forming method, which comprises the following steps of: obtaining an intermediate model of middleware through three-dimensional modeling, comparing the intermediate model with a target model to obtain a to-be-formed model of a to-be-formed part, slicing a depth map of the to-be-formed model to obtain a plurality of slice maps, and performing secondary forming on the plurality of slice maps. The forming material is printed on the middleware layer by layer in an ink-jet printing mode and cured, so that the to-be-formed part can be formed on the middleware, secondary forming is achieved, and a finished workpiece is obtained. As the to-be-formed part is stacked and formed layer by layer in a manner of printing one layer of forming material and curing one layer of forming material, the to-be-formed part can be fused with the middleware without the aid of high-temperature and high-pressure environments. Therefore, the secondary forming method can realize secondary forming in a normal-temperature and normal-pressure environment. In addition, the invention further provides a secondary forming device.

Description

Technical Field

[0001] The invention relates to the technical field of parts precision molding, and in particular to a secondary molding method and a secondary molding device. Background Art

[0002] Secondary molding technology is a commonly used technology in the mold injection molding industry. After the raw materials are molded once to obtain a semi-finished workpiece, they are put into the mold again. The raw materials for secondary molding are melted at high temperature and injected into the mold. After the raw materials are cooled, they can be combined with the semi-finished product to obtain the final shape of the workpiece. When secondary molding is performed by mold injection molding, the semi-finished workpiece needs to withstand high temperature (generally above 150°C) and high pressure (generally above 0.1Mpa). However, most electronic components cannot withstand high temperature and high pressure environments due to their material characteristics, resulting in the inability to achieve secondary molding smoothly. Summary of the invention

[0003] Based on this, it is necessary to provide a secondary molding method and a secondary molding device that can achieve secondary molding under normal temperature and pressure environment to address the above problems.

[0004] A secondary molding method comprises the steps of:

[0005] S110, loading the intermediate piece onto the workbench;

[0006] S120, performing three-dimensional modeling on the middleware to obtain an intermediate model of the middleware;

[0007] S130, comparing the intermediate model with a target model corresponding to the finished workpiece to obtain a to-be-formed model of the to-be-formed portion;

[0008] S140, performing slicing processing on the depth map of the model to be formed, and obtaining a plurality of slice maps;

[0009] S150, according to the plurality of slice diagrams, printing and curing the molding material layer by layer on the intermediate piece by inkjet printing, until the to-be-molded portion is molded on the intermediate piece and the finished workpiece is obtained.

[0010] In one of the embodiments, before the step S120, the step further includes: obtaining the distance between the middle piece and the inkjet print head in the height direction, and adjusting the distance between the inkjet print head and the middle piece to within a preset distance range.

[0011] In one of the embodiments, before step S120, the method further includes the step of obtaining the inclination of the middleware, and leveling the middleware whose inclination exceeds a threshold.

[0012] In one of the embodiments, the middle piece is scanned by 3D point laser to obtain point cloud data of the middle piece, and the distance between the middle piece and the inkjet print head and the inclination of the middle piece are obtained based on the point cloud data.

[0013] In one of the embodiments, before the step S120, the method further includes the steps of: acquiring two-dimensional coordinate information of the middleware, and correcting the middleware according to the two-dimensional coordinate information.

[0014] In one of the embodiments, the step S120 includes: obtaining three-dimensional coordinate information of the intermediate component by 3D line laser scanning, and obtaining the intermediate model according to the three-dimensional coordinate information.

[0015] In one embodiment, the surface of the intermediate piece has a recessed portion, and before the step S120, the step further includes: obtaining a pre-printing amount according to a size parameter of the recessed portion, printing a molding material in the recessed portion according to the pre-printing amount and curing the molding material by inkjet printing to form a filling portion that fills the recessed portion.

[0016] In one embodiment, during the execution of step S150 and before the to-be-formed portion is completely formed, the process returns to step S120 at least once and steps S120 to S150 are repeated in sequence.

[0017] In one of the embodiments, after the step S150, the method further includes: performing three-dimensional modeling on the finished workpiece to obtain a finished model of the finished workpiece, and comparing the finished model with the target model.

[0018] A secondary molding device comprises a supporting mechanism, a 3D scanning mechanism, an inkjet printing mechanism, a curing mechanism and a controller; the supporting mechanism comprises a transfer assembly and a workbench arranged on the transfer assembly; the inkjet printer comprises an inkjet print head, the 3D scanning mechanism can perform three-dimensional scanning on an intermediate piece carried on the workbench, and the controller obtains an intermediate model of the intermediate piece; the controller can compare the intermediate model with a target model corresponding to a finished workpiece to obtain a to-be-molded model of a to-be-molded portion, and slice the depth map of the to-be-molded model to obtain a plurality of slice maps; the controller can also control the inkjet print head to print molding material layer by layer on the intermediate piece and control the curing mechanism to cure the molding material layer by layer according to the plurality of slice maps, until the to-be-molded portion is molded on the intermediate piece and the finished workpiece is obtained.

[0019] In one of the embodiments, a 2D scanning mechanism is further included, and the 2D scanning mechanism can obtain the two-dimensional coordinate information of the middle piece, and the controller can control the transfer component to correct the deviation of the middle piece according to the two-dimensional coordinate information.

[0020] In one of the embodiments, a point cloud scanning mechanism is further included, which can use 3D point laser to scan the middleware to obtain point cloud data of the middleware, and the controller obtains the distance between the middleware and the inkjet print head in the height direction and the inclination of the middleware according to the point cloud data.

[0021] In one of the embodiments, the controller can also control the inkjet printing mechanism to adjust the distance between the inkjet printing head and the intermediate component to within a preset distance range.

[0022] In one of the embodiments, the inkjet printing mechanism includes a plurality of the inkjet printing heads, and the controller is capable of controlling any of the inkjet printing heads to print the molding material layer by layer on the intermediate member.

[0023] In one of the embodiments, a cleaning mechanism is further included, and the cleaning mechanism is capable of performing a cleaning operation on the inkjet print head.

[0024] The above-mentioned secondary molding method and secondary molding device first obtain the intermediate model of the intermediate part through three-dimensional modeling, and then compare it with the target model to obtain the model of the part to be molded. After slicing the depth map of the model to be molded and obtaining multiple slice maps, the molding material is printed layer by layer on the intermediate part by inkjet printing and solidified, and the part to be molded can be molded on the intermediate part to achieve secondary molding and obtain the finished workpiece. Since the part to be molded is stacked layer by layer by printing a layer of molding material and then solidifying a layer of molding material, it does not need to be fused with the intermediate part in a high temperature and high pressure environment. Therefore, the above-mentioned secondary molding method and secondary molding device can achieve secondary molding under normal temperature and pressure conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a secondary molding method according to an embodiment of the present invention;

[0027] Figure 2It is a structural schematic diagram of a secondary molding device in one embodiment of the present invention;

[0028] Figure 3 for Figure 2 A schematic structural diagram of the secondary molding device from another angle;

[0029] Figure 4 for Figure 2 A schematic diagram of the secondary molding device shown with some structures hidden;

[0030] Figure 5 for Figure 2 A schematic diagram of the partial structure of the inkjet printing mechanism in the secondary molding device shown. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0037] The present invention provides a secondary molding method, which can secondary mold parts on an intermediate piece and finally obtain a complete finished workpiece. The intermediate piece can be a purchased part of a certain model, a workpiece output from a previous process, or an intermediate product obtained during the execution of the secondary molding method.

[0038] For example, the intermediate piece may be a hinge for folding the screen in a foldable screen mobile phone, which has a concave-convex structure and is not convenient for screen installation. After the hinge is assembled to the body of the foldable screen mobile phone, a matching part can be formed at the concave-convex structure of the hinge by the secondary molding method, thereby forming an ideal surface on the hinge to facilitate screen installation and improve the durability of the screen.

[0039] See also Figure 1 The secondary molding method in one embodiment of the present invention includes steps S110 to S150. In which:

[0040] S110, loading the intermediate piece onto the workbench.

[0041] The workbench can be provided with an adsorption hole connected to the negative pressure device, so that the intermediate piece loaded on the workbench can be adsorbed to keep it stable. In addition, the workbench can also be connected to the transfer assembly, which can drive the workbench to translate and rotate in multiple degrees of freedom, so as to adjust the position and angle of the intermediate piece carried on the workbench. The workbench is generally set as a contoured structure to better fix the intermediate piece.

[0042] S120, performing three-dimensional modeling on the middleware to obtain an intermediate model of the middleware.

[0043] Specifically in one embodiment, the above step S120 includes: obtaining the three-dimensional coordinate information of the middleware by 3D line laser scanning, and obtaining the intermediate model according to the three-dimensional coordinate information. By scanning the middleware in all directions with 3D line laser, its accurate three-dimensional coordinate information can be obtained. According to the three-dimensional coordinate information, a three-dimensional model of the middleware, i.e., the intermediate model, can be constructed by professional three-dimensional modeling software.

[0044] S130, comparing the intermediate model with the target model corresponding to the finished workpiece to obtain a to-be-formed model of the to-be-formed part.

[0045] The target model is a 3D model obtained by 3D modeling of the finished workpiece. The method of obtaining the target model is generally the same as that of the intermediate model. It can also be directly established through the modeling software and can be acquired and stored in advance for easy retrieval. In the 3D modeling software, the intermediate model is compared with the target model to identify the part that needs to be added, that is, the part to be formed. Through software simulation operations, the model data of the part can be extracted from the target model to form the model to be formed.

[0046] It should be noted that the finished workpiece in the above step S130 refers to the finished workpiece in an ideal state, which is a reference standard set artificially, while the finished workpiece in the following step S150 refers to the actual product obtained, and there is a difference between the two. The finished workpiece in the following step S150 may have structural deviations from the finished workpiece in the above step S130 due to factors such as processing accuracy.

[0047] S140, performing slicing processing on the depth map of the model to be formed, and obtaining a plurality of slice maps.

[0048] Slicing is the process of cutting the model to be formed into multiple two-dimensional images, namely slices. The goal of slicing is to convert the model to be formed into two dimensions and obtain multiple sets of two-dimensional coordinates (each slice is a set of two-dimensional coordinates) to facilitate subsequent inkjet printing. The slicing software can cut the model to be formed according to the parameters set by the user (such as layer thickness) to obtain a certain number of slices. For the same model to be formed, the more slices obtained by slicing, the higher the accuracy of subsequent inkjet printing; conversely, if the fewer slices obtained by slicing, the lower the accuracy of subsequent inkjet printing.

[0049] In addition, before slicing, it is generally necessary to convert the resolution of the depth map of the model to be formed so that the depth map presents more details and textures, so that the final sliced ​​image better meets the resolution requirements of inkjet printing.

[0050] S150, according to the multiple slice diagrams, printing and curing the molding material layer by layer on the intermediate piece by inkjet printing, until the part to be molded is molded on the intermediate piece and a finished workpiece is obtained.

[0051] The inkjet print head can print the molding material layer by layer according to the slice diagram. The molding material can be resin, plastic, etc., which is liquid at room temperature. Specifically, UV ink can be used as the molding material. After each layer of molding material is printed, the molding material can be cured by ultraviolet rays or other curing means to ensure a close bond between the layers. Multiple slice diagrams are pre-sorted according to a specific sequence. During inkjet printing, the first layer of molding material is printed on the surface of the middle piece according to the first slice diagram (i.e., the first set of two-dimensional coordinates) and immediately cured. Then, the second layer of molding material is printed on the first layer of molding material according to the second slice diagram and immediately cured. Repeat this process until inkjet printing and curing are completed according to all slice diagrams, and a complete part to be formed can be formed. The part to be formed is integrated with the middle piece to obtain a finished workpiece.

[0052] The thickness of each layer of molding material is related to the molding accuracy. The thinner the thickness of each layer of molding material is, the higher the molding accuracy is, and the closer the printed part to be molded is to the ideal shape. Correspondingly, the more slices need to be output in the slicing process, the longer the inkjet printing time is. Optionally, the thickness of each layer of molding material is set to about 3 microns, which can ensure high molding accuracy while also having high molding efficiency.

[0053] Since the part to be formed is formed layer by layer by inkjet printing a layer of forming material and then curing a layer of forming material, it does not need to be fused with the intermediate piece in a high temperature and high pressure environment, so the above-mentioned secondary molding method can achieve secondary molding under normal temperature and pressure. Moreover, the above-mentioned secondary molding method does not require the use of a mold in the process of molding the part to be formed, so it can also effectively reduce costs.

[0054] In one embodiment, before the above step S120, the step of obtaining the distance between the middle piece and the inkjet print head in the height direction and adjusting the distance between the inkjet print head and the middle piece to within a preset distance range is also included. Specifically, the distance between the middle piece and the inkjet print head in the height direction can be obtained first, and the position of the inkjet print head can be adjusted according to the obtained distance information so that it remains within a preset distance range from the middle piece. This ensures that the molding material can be evenly and accurately attached to the middle piece during the printing process, thereby improving the accuracy of the secondary molding.

[0055] Furthermore, in one embodiment, before the above step S120, the method further includes the steps of: obtaining the inclination of the middleware, and leveling the middleware whose inclination exceeds a threshold.

[0056] The inclination refers to the degree of inclination of the middle piece relative to a reference datum. Ideally, the middle piece loaded onto the workbench should coincide with the reference datum. However, due to factors such as tolerance and assembly error, the middle piece may deviate from the reference datum. If the deviation is too large, that is, the inclination is too large, the accuracy of inkjet printing will be affected. Therefore, when it is detected that the inclination of the middle piece exceeds the preset threshold, it can be leveled to the allowable range by adjusting the position of the workbench or the middle piece, thereby further improving the accuracy of secondary molding.

[0057] The purpose of leveling is to adjust the middle piece so that it basically overlaps with the reference datum. The leveling can be automatically performed by the transfer assembly connected to the worktable transmission. In addition, an alarm signal can be issued when the inclination of the middle piece exceeds a threshold, and the machine can be temporarily stopped for manual leveling.

[0058] Specifically, in one embodiment, 3D point laser scanning is used to obtain point cloud data of the middleware, and the distance between the middleware and the inkjet print head and the inclination of the middleware are obtained based on the point cloud data.

[0059] The point cloud data includes the 3D coordinate information of each feature point in the middleware. The 3D coordinate information of the inkjet print head can be pre-calibrated, and the 3D coordinate information used as a reference can also be obtained in advance. The above distance and inclination can be obtained by comparing the point cloud data. The 3D point laser can be used to scan the middleware in all directions to obtain its accurate point cloud data, so that the distance between the middleware and the inkjet print head and the inclination of the middleware can be accurately calculated, which is more accurate and efficient than other measurement methods.

[0060] Moreover, the distance between the middle piece and the inkjet print head and the inclination of the middle piece can be obtained simultaneously through a single 3D point laser scan, which helps to simplify the process and reduce computing pressure.

[0061] In one embodiment, before the above step S120, the method further includes the steps of: acquiring two-dimensional coordinate information of the middleware, and correcting the middleware according to the two-dimensional coordinate information.

[0062] Two-dimensional coordinate information generally refers to the plane parallel to the worktable bearing surface, such as the coordinate information in the XY plane. By comparing the obtained two-dimensional coordinate information with the reference coordinate, the offset of the middleware can be obtained. After the middleware is corrected according to the offset, on the one hand, the accuracy of three-dimensional modeling for the middleware can be ensured, and on the other hand, the accuracy of inkjet printing can be ensured, which will ultimately help to further improve the accuracy of secondary molding.

[0063] In addition, in one embodiment, the surface of the intermediate piece has a recessed portion, and before the above-mentioned step S120, the step is also included: obtaining a pre-printing amount according to the size parameters of the recessed portion, printing a molding material in the recessed portion according to the pre-printing amount and curing it by inkjet printing, so as to form a filling portion that fills the recessed portion.

[0064] The size parameters of the recessed portion can be obtained based on the original three-dimensional model of the middleware, and the original three-dimensional model can be acquired and stored in advance, or it can be acquired in real time in the same manner as in the above step S120. When the surface of the middleware has a recessed portion, the recessed portion can be equivalent to the cavity of the molding mold. Therefore, the molding material required for molding the filling portion can be sprayed into the recessed portion and then solidified to obtain the filling portion at one time. Since the filling portion is not stacked and formed by printing layer by layer and solidifying layer by layer, but a fixed amount of molding material is sprayed out at one time and then solidified centrally, there is no need to perform three-dimensional modeling, slicing and other operations in the molding process of the filling portion, and its molding efficiency is relatively high.

[0065] The filling part may constitute a part of the middleware in the above step S120. After the recessed part is filled or partially filled by the filling part, the above steps 120 to S150 are sequentially performed on the middleware, that is, three-dimensional modeling is performed on the middleware, the model to be formed is obtained, and the slicing process is performed, and finally the precise forming of the part to be formed is completed by printing and curing layer by layer, so as to take into account both the forming efficiency and the forming accuracy. At this time, the middleware refers to the intermediate product obtained during the execution of the method.

[0066] In addition, in one embodiment, during the execution of the above step S150 and before the to-be-formed portion is completely formed, the process returns to step S120 at least once and the above steps S120 to S150 are repeated in sequence.

[0067] Before the above-mentioned step S150 is executed, that is, before the part to be formed is completely formed, you can return to step S120 at any time to re-model the intermediate product in three dimensions to obtain a new intermediate model. At this time, the middleware also refers to the intermediate product obtained during the execution of the method. By comparing the new intermediate model with the target model, it can be determined whether there is a deviation between the already formed part of the part to be formed and the part to be formed of the finished workpiece. Moreover, after reconstructing the new intermediate model, the new intermediate model can also be compared with the target model to obtain a new model to be formed, and then the new model to be formed can be sliced ​​to obtain several new slice diagrams, and the inkjet printing process can be adjusted according to the new slice diagrams.

[0068] That is, when the part to be formed has not been completely formed, the process can return to step S120 and repeat steps S120 to S150 in sequence to achieve multiple iterations and corrections of inkjet printing. This method is suitable for complex parts or parts with high precision requirements. Through multiple iterations and corrections, the forming precision and quality of the part to be formed can be further improved.

[0069] It should be noted that during the execution of the above step S150, the molding materials printed by inkjet printing can be switched, that is, more than two molding materials can be used to mold the part to be molded, thereby improving the diversity of secondary molding. Moreover, if multiple parts to be molded are to be secondary molded on the intermediate piece, the above steps S120 to S150 can be repeated.

[0070] After the above step S150, the method further includes the steps of: performing three-dimensional modeling on the finished workpiece to obtain a finished model of the finished workpiece, and comparing the finished model with the target model.

[0071] By comparing the finished product model with the target model, it can be determined whether the finished workpiece obtained has any deviation compared to the finished workpiece used as the reference standard, and the molding process can be re-inspected. If the deviation between the finished product model and the target model is less than the threshold, the re-inspection passes, indicating that the finished workpiece obtained meets the accuracy requirements. Otherwise, it means that the finished workpiece obtained does not meet the accuracy requirements and may need to be scrapped or graded according to the degree of deviation.

[0072] The above-mentioned secondary molding method first obtains the intermediate model of the middleware through three-dimensional modeling, and then compares it with the target model to obtain the model of the part to be molded. After slicing the depth map of the model to be molded and obtaining multiple slice maps, the molding material is printed layer by layer on the middleware by inkjet printing and solidified, and the part to be molded can be molded on the middleware to achieve secondary molding and obtain the finished workpiece. Since the part to be molded is stacked layer by layer by printing a layer of molding material and then solidifying a layer of molding material, it does not need to be fused with the middleware in a high temperature and high pressure environment. Therefore, the above-mentioned secondary molding method can achieve secondary molding under normal temperature and pressure conditions.

[0073] See also Figure 2 and Figure 3 The present invention further provides a secondary molding device 200, which can perform the above secondary molding method. The secondary molding device 200 in one embodiment of the present invention includes a carrying mechanism 210, a 3D scanning mechanism 220, an inkjet printing mechanism 230, a curing mechanism 240 and a controller (not shown).

[0074] Please also read Figure 4 , the carrying mechanism 210 includes a transfer assembly 211 and a workbench 212, and the workbench 212 is used to carry the intermediate piece. The workbench 212 may be provided with an adsorption hole connected to the negative pressure device, so that the intermediate piece can be adsorbed to maintain stability. The transfer assembly 211 can drive the workbench 212 to translate and rotate within multiple degrees of freedom, so as to adjust the position and angle of the intermediate piece carried on the workbench 212. Specifically, the transfer assembly 211 can generally drive the workbench 212 to translate along mutually perpendicular XYZ directions, and drive the workbench 212 to rotate around a rotating shaft extending along the Z direction, and the Z direction is the height direction. Driven by the transfer assembly 211, the workbench 212 can drive the intermediate piece to translate and rotate, so as to correct the deviation of the intermediate piece, and can drive the intermediate piece to transfer between components such as the 3D scanning mechanism 220 and the inkjet printing mechanism 230 to perform related processes.

[0075] The controller has a built-in control program and corresponding software, which can control the working process of the carrying mechanism 210, the 3D scanning mechanism 220, the inkjet printing mechanism 230 and the curing mechanism 240. The 3D scanning mechanism 220 can perform a three-dimensional scan on the middleware carried on the workbench 212, and the controller obtains the intermediate model of the middleware. Specifically, the 3D scanning mechanism 220 obtains the three-dimensional coordinate information of the middleware by 3D line laser scanning and uploads the three-dimensional coordinate information to the controller, and the built-in three-dimensional modeling software of the controller can construct the intermediate model according to the three-dimensional coordinate information.

[0076] After obtaining the intermediate model, the controller can also compare the intermediate model with the target model corresponding to the finished workpiece to obtain the to-be-formed model of the to-be-formed part, and perform slicing processing on the depth map of the to-be-formed model to obtain multiple slice maps. How to obtain the to-be-formed model and how to perform slicing processing have been described in detail in the relevant parts of the above steps S130 and S140, so they will not be repeated here.

[0077] Please also read Figure 5 The inkjet printing mechanism 230 includes an inkjet print head 231, through which liquid molding material can be ejected in a directional manner. The inkjet printing mechanism 230 generally also includes an ink supply component 232, an adjustment component 233, etc. The ink supply component 232 can provide liquid molding material to the inkjet print head 231, and the adjustment component 233 can adjust the height of the inkjet print head 231 along the height direction, i.e., the Z direction. The curing mechanism 240 can cure the liquid molding material by emitting curing light, such as ultraviolet rays or other means. The curing mechanism 240 is generally installed on the inkjet printing mechanism 230, so as to maintain a fixed relative position with the inkjet print head 231, so as to facilitate the timely curing of the molding material ejected by the inkjet print head 231.

[0078] Furthermore, the controller can also control the inkjet print head 231 to print the molding material layer by layer on the intermediate piece and control the curing mechanism 240 to cure the molding material layer by layer according to the multiple slice diagrams, until the part to be formed is formed on the intermediate piece and a finished workpiece is obtained.

[0079] After each layer of molding material is printed by the inkjet print head 231, the controller can control the curing mechanism 240 to start and solidify the molding material through ultraviolet rays or other curing means to ensure a close bond between the layers. Repeat this process until the inkjet print head 231 completes inkjet printing according to all the slice diagrams, and a complete part to be molded can be formed, and the part to be molded and the intermediate piece are integrated to obtain a finished workpiece. It can be seen that the part to be molded is stacked layer by layer by printing a layer of molding material and then solidifying a layer of molding material, without the need for high temperature and high pressure environment to achieve fusion with the intermediate piece, so the above-mentioned secondary molding device 200 can achieve secondary molding under normal temperature and pressure environment.

[0080] Please refer again Figure 2 and Figure 3 In this embodiment, the secondary molding device 200 further includes a 2D scanning mechanism 250, which can obtain two-dimensional coordinate information of the intermediate piece, and the controller can control the transfer component 211 to correct the deviation of the intermediate piece according to the two-dimensional coordinate information.

[0081] The two-dimensional coordinate information refers to the coordinate information in a certain plane, such as the XY plane. The controller can obtain the offset of the intermediate piece by comparing the two-dimensional coordinate information obtained by the 2D scanning mechanism 250 with the reference coordinate. The controller controls the transfer component 211 to translate and / or rotate according to the offset, so as to correct the deviation of the intermediate piece, thereby ensuring the accuracy of the secondary molding.

[0082] In this embodiment, the secondary molding device 200 further includes a point cloud scanning mechanism (not shown), which can use 3D point laser scanning to obtain point cloud data of the middleware, and the controller obtains the distance between the middleware and the inkjet print head 231 in the height direction and the inclination of the middleware according to the point cloud data. The inclination refers to the degree of inclination of the middleware relative to a reference datum, and its specific meaning has been explained above.

[0083] The point cloud data includes the three-dimensional coordinate information of each feature point in the middleware, and the above distance and inclination can be obtained by comparing the point cloud data. When the distance between the middleware and the inkjet print head 231 is outside the preset distance range, the controller can also control the inkjet printing mechanism 230 to adjust the distance between the inkjet print head 231 and the middleware to within the preset distance range. Specifically, the controller can control the adjustment component 233 to adjust the height of the inkjet print head 231 along the Z direction. In this way, it can be ensured that the inkjet print head 231 can print the molding material evenly and accurately on the middleware, thereby improving the accuracy of secondary molding.

[0084] When it is detected that the inclination of the middle piece exceeds a preset threshold, the middle piece can be leveled to within an allowable range by adjusting the workbench 212 or directly adjusting the middle piece, thereby further improving the accuracy of the secondary molding.

[0085] In addition, in this embodiment, the inkjet printing mechanism 230 includes a plurality of inkjet printing heads 231, and the controller can control any inkjet printing head 231 to print the molding material layer by layer on the intermediate piece.

[0086] The multiple inkjet print heads 231 can be provided with molding materials by different ink supply assemblies 232, and the types of molding materials provided by different ink supply assemblies 232 can be different. That is, during the process of inkjet printing by the inkjet printing mechanism 230, the molding materials can be switched by switching the inkjet print heads 231. Therefore, the part to be molded can be molded using more than two molding materials, thereby improving the diversity of secondary molding.

[0087] Please refer again Figure 4In this embodiment, the secondary molding device 200 further includes a cleaning mechanism 260, which can clean the inkjet print head 231. The cleaning mechanism 260 can keep the inkjet print head 231 clean at all times, thereby preventing molding materials from condensing at the outlet of the inkjet print head 231 and causing problems such as blockage, thereby ensuring the accuracy of inkjet printing.

[0088] Specifically, the cleaning mechanism 260 may include a dust-free cloth 261 and a conveying assembly 262. The dust-free cloth 261 is wound around the conveying assembly 262 and can move under the drive of the conveying assembly 262. The cleaning mechanism 260 can move to the bottom of the inkjet print head 231 and make the dust-free cloth 261 abut against the inkjet print head 231, so that the dust-free cloth 261 can wipe the inkjet print head 231 during the movement.

[0089] The above-mentioned secondary molding device 200 first obtains the intermediate model of the intermediate part through three-dimensional modeling, and then compares it with the target model to obtain the model of the part to be molded. After slicing the depth map of the model to be molded and obtaining multiple slice maps, the molding material is printed layer by layer on the intermediate part by inkjet printing and solidified, and the part to be molded can be molded on the intermediate part to achieve secondary molding and obtain a finished workpiece. Since the part to be molded is stacked layer by layer by printing a layer of molding material and then solidifying a layer of molding material, it does not need to be fused with the intermediate part in a high temperature and high pressure environment. Therefore, the above-mentioned secondary molding device 200 can achieve secondary molding under normal temperature and pressure conditions.

[0090] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A secondary molding method, characterized in that: Includes steps: S110, loading the middleware onto the workbench; S120, performing three-dimensional modeling on the middleware to obtain an intermediate model of the middleware; S130, comparing the intermediate model with a target model corresponding to the finished workpiece to obtain a to-be-formed model of the to-be-formed portion; S140, performing slicing processing on the depth map of the model to be formed, and obtaining a plurality of slice maps; S150, according to the plurality of slice diagrams, printing and curing the molding material layer by layer on the intermediate piece by inkjet printing, until the to-be-molded portion is molded on the intermediate piece and the finished workpiece is obtained.

2. The secondary molding method according to claim 1, characterized in that: Before the step S120, the method further includes the steps of: acquiring the distance between the intermediate component and the inkjet print head in the height direction, and adjusting the distance between the inkjet print head and the intermediate component to within a preset distance range.

3. The secondary molding method according to claim 2, characterized in that: Before step S120, the method further includes the steps of: acquiring the inclination of the middleware, and leveling the middleware whose inclination exceeds a threshold.

4. The secondary molding method according to claim 3, characterized in that: The middle piece is scanned by 3D point laser to obtain point cloud data of the middle piece, and the distance between the middle piece and the inkjet print head and the inclination of the middle piece are acquired according to the point cloud data.

5. The secondary molding method according to claim 1, characterized in that: Before the step S120, the method further includes the steps of: acquiring the two-dimensional coordinate information of the middleware, and correcting the deviation of the middleware according to the two-dimensional coordinate information.

6. The secondary molding method according to claim 1, characterized in that: The step S120 includes: obtaining three-dimensional coordinate information of the intermediate component by 3D line laser scanning, and obtaining the intermediate model according to the three-dimensional coordinate information.

7. The secondary molding method according to claim 1, characterized in that: The surface of the intermediate piece has a recessed portion. Before step S120, it also includes the steps of: obtaining a pre-printing amount according to the size parameters of the recessed portion, printing a molding material in the recessed portion according to the pre-printing amount and curing it by inkjet printing to form a filling portion that fills the recessed portion.

8. The secondary molding method according to claim 1, characterized in that: During the execution of step S150 and before the to-be-formed portion is completely formed, the process returns to step S120 at least once and repeats steps S120 to S150 in sequence.

9. The secondary molding method according to claim 1, characterized in that: After step S150, the method further includes the steps of: performing three-dimensional modeling on the finished workpiece to obtain a finished model of the finished workpiece, and comparing the finished model with the target model.

10. A secondary molding device, characterized in that: It includes a carrying mechanism, a 3D scanning mechanism, an inkjet printing mechanism, a curing mechanism and a controller; the carrying mechanism includes a transfer component and a workbench arranged on the transfer component; the inkjet printer includes an inkjet print head, the 3D scanning mechanism can perform three-dimensional scanning on the intermediate piece carried on the workbench, and the controller obtains an intermediate model of the intermediate piece; the controller can compare the intermediate model with the target model corresponding to the finished workpiece to obtain a to-be-formed model of the to-be-formed part, and slice the depth map of the to-be-formed model to obtain multiple slice maps; the controller can also control the inkjet print head to print the molding material layer by layer on the intermediate piece and control the curing mechanism to cure the molding material layer by layer according to the multiple slice maps, until the to-be-formed part is formed on the intermediate piece and the finished workpiece is obtained.

11. The secondary molding device according to claim 10, characterized in that: It also includes a 2D scanning mechanism, which can obtain two-dimensional coordinate information of the middle piece, and the controller can control the transfer component to correct the middle piece according to the two-dimensional coordinate information.

12. The secondary molding device according to claim 10, characterized in that: It also includes a point cloud scanning mechanism, which can use 3D point laser to scan the middleware to obtain point cloud data of the middleware, and the controller obtains the distance between the middleware and the inkjet print head in the height direction and the inclination of the middleware according to the point cloud data.

13. The secondary molding device according to claim 12, characterized in that: The controller can also control the inkjet printing mechanism to adjust the distance between the inkjet printing head and the intermediate component to within a preset distance range.

14. The secondary molding device according to claim 10, characterized in that: The inkjet printing mechanism includes a plurality of inkjet printing heads, and the controller can control any of the inkjet printing heads to print molding material layer by layer on the intermediate component.

15. The secondary molding device according to claim 10, characterized in that: A cleaning mechanism is also included, and the cleaning mechanism can perform a cleaning operation on the inkjet print head.

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