Humidity-heat aging resistant semiconductor heat-sealing cover tape and preparation method thereof

Abstract

The invention discloses a damp-heat-aging-resistant semiconductor heat-sealing cover tape and a preparation method thereof. According to the preparation method, amino-terminated nitrile rubber, carboxyl-terminated nitrile rubber, SEBS rubber and polyamide are adopted as a glue solution main body, a certain amount of tackifying resin is added, a semiconductor heat-sealing cover tape glue solution which takes rubber as a main body and has a semi-crosslinking structure is prepared, and after a PET film is coated with the mixed glue, the damp-heat-aging-resistant semiconductor heat-sealing cover tape can be obtained. The stripping force change rate of the semiconductor heat-sealing cover tape is less than 10% after the semiconductor heat-sealing cover tape passes through double 90% (90% humidity and 90% temperature).

Description

Technical Field

[0001] The invention relates to a semiconductor heat-sealing cover tape resistant to moisture and heat aging and a preparation method thereof. Background Art

[0002] The rapid development of the semiconductor industry has brought about a period of rapid development of materials related to the semiconductor packaging and packaging industry. With the development trend of miniaturization, internal refinement and functional diversification of semiconductor components and IC components, the corresponding packaging industry has gradually changed from pressure sensitivity to heat sensitivity, so as to better protect such precision electronic components. As the best semiconductor packaging and packaging solution on the market, semiconductor heat sealing cover tape has anti-static properties, excellent peel strength, low peel force fluctuation, width plasticity and excellent compatibility with carriers of different materials, all of which prove that this solution is the best solution for the current semiconductor packaging and packaging industry.

[0003] Although the currently disclosed patents mainly focus on improving the peeling force of semiconductor heat-sealed cover tapes and stabilizing the fluctuation of peeling force, the current production model of the semiconductor industry does not assemble semiconductor components at the packaging site. The packaged semiconductor components need to be transported to other locations or even overseas for assembly and production. The harsh environment during transportation poses a huge test to the entire heat-sealing system. If the packaging fails and the electronic components jump out of the carrier tape, it will cause huge economic losses. Therefore, it is urgent to design a formula for semiconductor heat-sealed cover tape that is resistant to moisture and heat aging and produce it. Summary of the invention

[0004] The present invention aims to provide a semiconductor heat-sealing cover tape resistant to moisture and heat aging and a preparation method thereof on the basis of maintaining the advantages of the traditional cover tape.

[0005] The materials and technical solutions used by the present invention to solve the above technical problems are as follows:

[0006] A method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging, the method comprising:

[0007] Step 1: Preparation of amino-terminated nitrile rubber: using amino-terminated nitrile rubber as raw material and toluene as solvent to prepare amino-terminated nitrile rubber solution;

[0008] Step 2: Preparation of carboxyl-terminated nitrile rubber: using carboxyl-terminated nitrile rubber as raw material and toluene as solvent to prepare a carboxyl-terminated nitrile rubber solution;

[0009] Step 3: Preparation of SEBS rubber solution: using SEBS rubber as raw material and toluene as solvent to prepare SEBS rubber solution;

[0010] Step 4: Preparation of polyamide solution: using polyamide as raw material and toluene as solvent to prepare a polyamide solution;

[0011] Step 5: Preparation of C5 petroleum resin solution: using C5 petroleum resin as raw material and toluene as solvent to prepare C5 petroleum resin solution;

[0012] Step 6: Preparation of water-white hydrogenated rosin resin: using water-white hydrogenated rosin resin as raw material and toluene as solvent to prepare a water-white hydrogenated rosin resin solution;

[0013] Step 7: Mix the solutions obtained in steps 1 to 6 at 45° C. according to a certain ratio to mix the obtained glue solution evenly;

[0014] Step 8: coating the obtained glue solution on the PET substrate, and the coating thickness is related to the viscosity of the solution obtained in step 7. When the coating head parameters are fixed, the coating thickness increases with the increase of the solution viscosity. After the coating process is completed, the PET substrate is placed in a vacuum drying oven for drying to obtain a semiconductor heat sealing tape resistant to moisture and heat aging.

[0015] Furthermore, in step 1, the concentration of the amino-terminated nitrile rubber solution is 10 g / L to 50 g / L.

[0016] Furthermore, in step 2, the concentration of the carboxyl-terminated nitrile rubber solution is 10 g / L to 50 g / L.

[0017] Furthermore, in step three, the concentration of the SEBS rubber solution is 50 g / L to 100 g / L.

[0018] Furthermore, in step 4, the concentration of the polyamide solution is 5 g / L to 20 g / L.

[0019] Furthermore, in step five, the concentration of the C5 petroleum resin solution is 20 g / L to 50 g / L.

[0020] Furthermore, in step six, the concentration of the water-white hydrogenated rosin resin solution is 50 g / L to 100 g / L.

[0021] Furthermore, in step seven, the ratio is: 20 parts of amino-terminated nitrile rubber solution, 20 parts of amino-terminated nitrile rubber solution, 30 parts of SEBS rubber solution, 10 parts of polyamide solution, 20 parts of C5 petroleum resin solution, and 50 parts of water-whitened hydrogenated rosin resin solution.

[0022] Furthermore, in step eight, the drying temperature is 150° C. and the time is 15 minutes.

[0023] A semiconductor heat-sealing cover tape resistant to moisture and heat aging prepared by the above preparation method

[0024] The advantage of the present invention is the rational use of multiple rubber systems, in which polyamide, amino-terminated nitrile rubber and carboxyl-terminated nitrile rubber are introduced. Due to the introduction of the above three substances, a certain amount of cross-linking structure can be introduced into the system, and the polyamide can also play the role of a plasticizer, thereby improving the weather resistance of the entire system without increasing its heat sealing temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a digital photo of the semiconductor heat sealing tape after packaging in Example 1;

[0026] Figure 2 This is a digital photo of the aging test of the heat-resistant semiconductor thermal sealing cover tape after packaging in Example 1;

[0027] Figure 3 This is a peel strength diagram of the heat-resistant semiconductor heat-sealing cover tape after packaging of Example 1;

[0028] Figure 4 This is a peel strength diagram of the semiconductor heat sealing cover tape package aging test resistant to humidity and heat aging of Example 1;

[0029] Figure 5 This is a digital photo of the semiconductor heat sealing tape after packaging in Example 2;

[0030] Figure 6 This is a digital photo of the aging test of the heat-resistant semiconductor thermal sealing cover tape after packaging in Example 2;

[0031] Figure 7 This is a peel strength diagram of the heat-resistant semiconductor heat-sealing cover tape after packaging of Example 2;

[0032] Figure 8 This is a peel strength diagram of the semiconductor heat sealing cover tape package aging test resistant to humidity and heat aging of Example 2;

[0033] Fig. 9 This is a digital photo of the semiconductor heat sealing tape after packaging in Example 3;

[0034] Fig.10 This is a digital photo of the aging test of the heat-resistant semiconductor thermal sealing cover tape after packaging in Example 3;

[0035] Fig.11 This is a peel strength diagram of the heat-resistant semiconductor heat-sealing cover tape after packaging in Example 3;

[0036] Fig.12 This is a peel strength diagram of the semiconductor heat sealing cover tape package aging test resistant to humidity and heat aging of Example 3; DETAILED DESCRIPTION

[0037] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments, but is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention that does not depart from the spirit and scope of the technical solution of the present invention should be included in the protection scope of the present invention.

[0038] The invention adopts amino-terminated nitrile rubber, carboxyl-terminated nitrile rubber, SEBS rubber and polyamide as the main body of the glue liquid, adds a certain amount of tackifying resin, and prepares a semiconductor heat-sealing cover tape glue liquid with rubber as the main body and a semi-crosslinked structure. After the mixed glue is coated on a PET film, a semiconductor heat-sealing cover tape resistant to moisture and heat aging can be obtained. After the semiconductor heat-sealing cover tape is subjected to double 90% (90% humidity, 90% temperature), the peeling force change rate of the semiconductor heat-sealing cover tape is less than 10%.

[0039] Example 1: Design and preparation of semiconductor heat-sealing cover tape that can withstand double 90% aging test for 28 days

[0040] Weigh 3.63 g of amino-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with an amino-terminated nitrile rubber concentration of 36.3 g / L;

[0041] Weigh 2.02 g of carboxyl-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with a carboxyl-terminated nitrile rubber concentration of 20.2 g / L;

[0042] Weigh 8.8 g of SEBS rubber and disperse it in 100 mL of toluene to prepare a solution with a SEBS rubber concentration of 88 g / L;

[0043] Weigh 1.25 g of polyamide and disperse it in 100 mL of toluene to prepare a solution with a polyamide concentration of 12.5 g / L;

[0044] Weigh 4.7 g of C5 petroleum resin and disperse it in 100 mL of toluene to prepare a solution with a C5 petroleum resin concentration of 47 g / L;

[0045] Weigh 8.3 g of water-white hydrogenated rosin resin and disperse it in 100 mL of toluene to prepare a solution with a water-white hydrogenated rosin resin concentration of 83 g / L;

[0046] Weigh 20mL of amino-terminated nitrile rubber solution, 20mL of amino-terminated nitrile rubber solution, 30mL of SEBS rubber solution, 10mL of polyamide solution, 20mL of C5 petroleum resin solution and 50mL of water-white hydrogenated rosin resin solution, heat the entire solution system to about 45°C, and stir vigorously at a stirring speed of 800r / min to form an adhesive solution for semiconductor heat sealing cover tape resistant to moisture and heat aging.

[0047] At 50° C., the adhesive of the above-mentioned semiconductor heat-sealing cover tape resistant to moisture and heat aging was placed in a vacuum constant temperature drying oven for degassing, and the degassing process lasted for 20 minutes.

[0048] The obtained adhesive liquid of the moisture-heat aging resistant semiconductor heat sealing cover tape was coated on a 23 μm PET substrate with a coating thickness of 8 μm. After the coating process, the glued PET was placed in a constant temperature drying oven at 150°C for 15 minutes.

[0049] Determination of peel strength: The peel strength of the heat-resistant semiconductor heat-sealed cover tape was measured using an electronic universal testing machine at a test speed of 10 mm / min. The packaged carrier tape was placed for 28 days at 90% humidity and 90°C using a constant temperature and humidity aging machine, and the peel strength of the heat-resistant semiconductor heat-sealed cover tape was tested and compared. The results are as follows: the peel strength of the cover tape without heat-resistant aging is 62g; the peel strength of the cover tape after heat-resistant aging is 60g.

[0050] Comparison of semiconductor thermal sealing cover tape packaging before and after test of humidity and heat aging resistance Figure 1 and Figure 2 The peel strength curves before and after the aging test are shown in Figure 3 and Figure 4 shown.

[0051] Example 2: Design and preparation of semiconductor heat-sealing cover tape that can withstand double 90% aging test for 21 days

[0052] Weigh 2.45 g of amino-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with an amino-terminated nitrile rubber concentration of 24.5 g / L;

[0053] Weigh 1.85 g of carboxyl-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with a carboxyl-terminated nitrile rubber concentration of 18.5 g / L;

[0054] Weigh 8.8 g of SEBS rubber and disperse it in 100 mL of toluene to prepare a solution with a SEBS rubber concentration of 88 g / L;

[0055] Weigh 1.25 g of polyamide and disperse it in 100 mL of toluene to prepare a solution with a polyamide concentration of 12.5 g / L;

[0056] Weigh 4.7 g of C5 petroleum resin and disperse it in 100 mL of toluene to prepare a solution with a C5 petroleum resin concentration of 47 g / L;

[0057] Weigh 8.3 g of water-white hydrogenated rosin resin and disperse it in 100 mL of toluene to prepare a solution with a water-white hydrogenated rosin resin concentration of 83 g / L;

[0058] Weigh 20mL of amino-terminated nitrile rubber solution, 20mL of amino-terminated nitrile rubber solution, 30mL of SEBS rubber solution, 10mL of polyamide solution, 20mL of C5 petroleum resin solution and 50mL of water-white hydrogenated rosin resin solution, heat the entire solution system to about 45°C, and stir vigorously at a stirring speed of 800r / min to form an adhesive solution for semiconductor heat sealing cover tape resistant to moisture and heat aging.

[0059] At 50° C., the adhesive of the above-mentioned semiconductor heat-sealing cover tape resistant to moisture and heat aging was placed in a vacuum constant temperature drying oven for degassing, and the degassing process lasted for 20 minutes.

[0060] The obtained adhesive liquid of the moisture-heat aging resistant semiconductor heat sealing cover tape was coated on a 23 μm PET substrate with a coating thickness of 8 μm. After the coating process, the glued PET was placed in a constant temperature drying oven at 150°C for 15 minutes.

[0061] Determination of peel strength: The peel strength of the heat-resistant semiconductor heat-sealed cover tape was measured using an electronic universal testing machine at a test speed of 10 mm / min. The packaged carrier tape was placed for 21 days at 90% humidity and 90°C using a constant temperature and humidity aging machine, and the peel strength of the heat-resistant semiconductor heat-sealed cover tape was tested and compared. The results are as follows: the peel strength of the cover tape without heat-resistant aging is 64g; the peel strength of the cover tape after heat-resistant aging is 62g.

[0062] Comparison of semiconductor thermal sealing cover tape packaging before and after test of humidity and heat aging resistance Figure 5 and Figure 6 The peel strength curves before and after the aging test are shown in Figure 7 and Figure 8 shown.

[0063] Example 3: Design and preparation of semiconductor heat-sealing cover tape that can withstand double 90% aging test for 14 days

[0064] Weigh 2.05 g of amino-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with an amino-terminated nitrile rubber concentration of 20.5 g / L;

[0065] Weigh 1.55 g of carboxyl-terminated nitrile rubber and disperse it in 100 mL of toluene to prepare a solution with a carboxyl-terminated nitrile rubber concentration of 15.5 g / L;

[0066] Weigh 8.8 g of SEBS rubber and disperse it in 100 mL of toluene to prepare a solution with a SEBS rubber concentration of 88 g / L;

[0067] Weigh 0.95 g of polyamide and disperse it in 100 mL of toluene to prepare a solution with a polyamide concentration of 0.95 g / L;

[0068] Weigh 4.7 g of C5 petroleum resin and disperse it in 100 mL of toluene to prepare a solution with a C5 petroleum resin concentration of 47 g / L;

[0069] Weigh 9.8 g of water-white hydrogenated rosin resin and disperse it in 100 mL of toluene to prepare a solution with a water-white hydrogenated rosin resin concentration of 98 g / L;

[0070] Weigh 20mL of amino-terminated nitrile rubber solution, 20mL of amino-terminated nitrile rubber solution, 30mL of SEBS rubber solution, 10mL of polyamide solution, 20mL of C5 petroleum resin solution and 50mL of water-white hydrogenated rosin resin solution, heat the entire solution system to about 45°C, and stir vigorously at a stirring speed of 800r / min to form an adhesive solution for semiconductor heat sealing cover tape resistant to moisture and heat aging.

[0071] At 50° C., the adhesive of the above-mentioned semiconductor heat-sealing cover tape resistant to moisture and heat aging was placed in a vacuum constant temperature drying oven for degassing, and the degassing process lasted for 20 minutes.

[0072] The obtained adhesive liquid of the moisture-heat aging resistant semiconductor heat sealing cover tape was coated on a 23 μm PET substrate with a coating thickness of 8 μm. After the coating process, the glued PET was placed in a constant temperature drying oven at 150°C for 15 minutes.

[0073] Determination of peel strength: The peel strength of the heat-resistant semiconductor heat-sealed cover tape was measured using an electronic universal testing machine at a test speed of 10 mm / min. The packaged carrier tape was placed for 14 days at 90% humidity and 90°C using a constant temperature and humidity aging machine, and the peel strength of the heat-resistant semiconductor heat-sealed cover tape was tested and compared. The results are as follows: the peel strength of the cover tape without heat-resistant aging is 81g; the peel strength of the cover tape after heat-resistant aging is 74g.

[0074] Comparison of semiconductor thermal sealing cover tape packaging before and after test of humidity and heat aging resistance Fig. 9 and Fig.10 The peel strength curves before and after the aging test are shown in Fig.11 and Fig.12 shown.

Claims

1. A method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging, characterized in that: The method is: Step 1: Preparation of amino-terminated nitrile rubber: using amino-terminated nitrile rubber as raw material and toluene as solvent to prepare amino-terminated nitrile rubber solution; Step 2: Preparation of carboxyl-terminated nitrile rubber: using carboxyl-terminated nitrile rubber as raw material and toluene as solvent to prepare a carboxyl-terminated nitrile rubber solution; Step 3: Preparation of SEBS rubber solution: using SEBS rubber as raw material and toluene as solvent to prepare SEBS rubber solution; Step 4: Preparation of polyamide solution: using polyamide as raw material and toluene as solvent to prepare a polyamide solution; Step 5: Preparation of C5 petroleum resin solution: using C5 petroleum resin as raw material and toluene as solvent to prepare C5 petroleum resin solution; Step 6: Preparation of water-white hydrogenated rosin resin: using water-white hydrogenated rosin resin as raw material and toluene as solvent to prepare a water-white hydrogenated rosin resin solution; Step 7: Mix the solutions obtained in steps 1 to 6 at 45° C. according to a certain ratio to mix the obtained glue solution evenly; Step 8: coating the obtained adhesive solution on the PET substrate. After the coating process is completed, the PET substrate is placed in a vacuum drying oven for drying to obtain a semiconductor heat-sealing cover tape resistant to moisture and heat aging.

2. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step 1, the concentration of the amino-terminated nitrile rubber solution is 10 g / L to 50 g / L.

3. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step 2, the concentration of the carboxyl-terminated nitrile rubber solution is 10 g / L to 50 g / L.

4. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step three, the concentration of the SEBS rubber solution is 50 g / L to 100 g / L.

5. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step 4, the concentration of the polyamide solution is 5 g / L to 20 g / L.

6. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step 5, the concentration of the C5 petroleum resin solution is 20 g / L to 50 g / L.

7. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step six, the concentration of the water-white hydrogenated rosin resin solution is 50 g / L to 100 g / L.

8. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step seven, the ratio is: 20 parts of amino-terminated nitrile rubber solution, 20 parts of amino-terminated nitrile rubber solution, 30 parts of SEBS rubber solution, 10 parts of polyamide solution, 20 parts of C5 petroleum resin solution, and 50 parts of water-white hydrogenated rosin resin solution.

9. The method for preparing a semiconductor heat-sealing cover tape resistant to moisture and heat aging according to claim 1, characterized in that: In step eight, the drying temperature is 150° C. and the time is 15 min.

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