High-oxidation-resistance circuit board surface treatment agent and treatment method

Abstract

The invention discloses a circuit board surface treatment agent with high oxidation resistance and a treatment method. A formula of the circuit board surface treatment agent comprises polyamide, epoxy resin, polyurethane, alkyl benzimidazole, organic acid, deionized water, an antioxidant, zinc borate and polytetrafluoroethylene. The treatment method comprises the following steps: step 1, selecting medicament materials; 2, preparing a treatment agent; 3, cleaning the surface of the circuit board; step 4, metal passivation treatment; step 5, dip-coating the medicament; 6, circuit board follow-up processing is carried out; according to the invention, a medicament main body composed of polyamide, epoxy resin and polyurethane is designed, so that the chemical stability and thermal stability of the medicament can be remarkably improved, the hardness and impact resistance of a protective layer are effectively improved, and the elasticity and corrosion resistance of the medicament are improved; meanwhile, the zinc borate component is added, so that the heat resistance of the medicament is effectively improved; the polytetrafluoroethylene component is also added, so that the wear resistance of the medicament is greatly improved, and the use effect of the medicament is improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board surface treatment agents, and in particular to a circuit board surface treatment agent with high oxidation resistance and a treatment method. Background Art

[0002] The main surface treatment agent for circuit boards with high oxidation resistance is OSP organic solder preservative, which can form a solid organic film on the surface of the circuit board, covering and protecting the copper surface and each perforation, effectively maintaining the flatness of the copper surface and preventing the copper surface from being oxidized, thereby improving the quality and reliability of the circuit board. These agents can improve the adhesion of the circuit board surface, making printing, spraying and other processes adhere more firmly to the surface, thereby achieving better conductivity. In daily use, the surface of the circuit board is easily corroded by chemicals. These agents can form a protective film to effectively prevent the surface of the circuit board from being corroded. By using surface treatment agents with high oxidation resistance, the quality and reliability of the circuit board can be significantly improved, and problems such as poor signals and circuit breaks can be reduced, ensuring the stable operation of the circuit board. Preventing oxidation and corrosion can extend the service life of the circuit board, reduce the frequency of maintenance and replacement, and reduce the overall cost of ownership. Environmentally friendly materials are usually used, complying with environmental protection directives such as ROHS, which helps to reduce the environment. With the popularization of electronic products and the continuous advancement of technology, the quality and reliability requirements of circuit boards are getting higher and higher, which in turn promotes the demand for surface treatment agents with high oxidation resistance.

[0003] However, the conventional circuit board surface treatment agent with high oxidation resistance cannot meet people's needs, and has the following defects: first, the existing circuit board surface treatment agent is not designed with a main component with high oxidation resistance, and the chemical stability and thermal stability of the agent cannot be improved, and the hardness and impact resistance of the protective layer cannot be increased, and the elasticity and corrosion resistance of the agent are reduced, and the circuit board cannot be widely protected from the influence of the external environment, and the durability of the circuit board is reduced; second, the existing circuit board surface treatment agent does not add a certain component of heat-resistant components, and the heat resistance of the agent cannot be increased. The OSP film formed by the agent has poor heat resistance and is easily decomposed in a high temperature environment, thereby affecting the solderability of the PCB, and the applicability of the agent cannot be effectively improved. The temperature needs to be strictly controlled during the welding process to avoid the decomposition of the OSP film; third, the existing circuit board surface treatment agent does not add a certain component of wear-resistant components, and the wear resistance of the agent cannot be effectively improved. The wear resistance of the OSP film formed by the agent is poor and is easily mechanically damaged. During the assembly and transportation of the PCB, if it is not handled properly, the OSP film may be damaged, thereby affecting the solderability of the PCB and reducing the use effect of the agent. Summary of the invention

[0004] The object of the present invention is to provide a circuit board surface treatment agent and treatment method with high oxidation resistance to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a circuit board surface treatment agent with high oxidation resistance, the formula of which includes: polyamide, epoxy resin, polyurethane, alkylbenzimidazole, organic acid, cupric chloride, deionized water, antioxidant, zinc borate and polytetrafluoroethylene, the mass percentages of the components are: 15% to 30% of polyamide, 10% to 20% of epoxy resin, 12% to 24% of polyurethane, 5% to 8% of alkylbenzimidazole, 4% to 8% of organic acid, 4% to 6% of cupric chloride, 4% to 7% of deionized water, 8% to 12% of antioxidant, 5% to 10% of zinc borate and 4% to 10% of polytetrafluoroethylene.

[0006] As a further technical solution of the present invention, the mass percentages of the components are: 20% polyamide, 15% epoxy resin, 18% polyurethane, 8% alkylbenzimidazole, 6% organic acid, 5% cupric chloride, 6% deionized water, 10% antioxidant, 7% zinc borate and 5% polytetrafluoroethylene.

[0007] A method for treating a circuit board surface treatment agent with high oxidation resistance, comprising step 1, selecting agent materials; step 2, preparing the treatment agent; step 3, cleaning the circuit board surface; step 4, metal passivation treatment; step 5, dip coating the agent; step 6, subsequent treatment of the circuit board;

[0008] In the above step 1, the components of the circuit board surface treatment agent are confirmed;

[0009] In the above step 2, a circuit board surface treatment agent is prepared according to the selected components;

[0010] In the above step 3, the surface of the circuit board to be processed is cleaned;

[0011] In the above step 4, a specific passivating agent is used to passivate the metal surface of the circuit board;

[0012] In the above step 5, the circuit board surface treatment agent is dip-coated on the surface of the circuit board to form an organic film to effectively protect the circuit board;

[0013] In the above step six, the circuit board is subsequently treated by steps such as pure water washing and drying to ensure the best anti-oxidation effect.

[0014] As a further technical solution of the present invention, in the step 1, the components of the circuit board surface treatment agent are confirmed, and polyamide, epoxy resin and polyurethane are selected as the main materials of the agent. Polyamide has good chemical stability and thermal stability, is a common component in anti-oxidation coatings, and can widely protect circuit boards from external environmental influences. Epoxy resin has high hardness and good impact resistance, and is particularly suitable for situations where there is less organic silicon on the surface of the circuit board, providing a solid protective layer for the circuit board. Polyurethane has good elasticity and strong corrosion resistance, and is suitable for situations with high humidity and high risk of circuit board use environment, and can enhance the durability of the circuit board. Alkylbenzimidazole, organic acid, copper chloride and deionized water are selected as additives of the agent. These ingredients can be used to form a non-stick, thin and uniform protective film, which has good thermal stability and simple management, can effectively reduce pollution and facilitate assembly by downstream manufacturers.

[0015] As a further technical solution of the present invention, in the step one, an antioxidant is selected to further enhance the antioxidant performance of the agent and protect the circuit board from oxidation damage. Zinc borate is selected as the heat-resistant agent of the agent. The zinc borate auxiliary agent will undergo a decomposition reaction in a high temperature environment to produce substances such as zinc oxide and boric acid. These decomposition products will form a dense and strong protective film, which effectively blocks the transfer of oxygen and heat, thereby enhancing the heat resistance of the treatment agent. Polytetrafluoroethylene is selected as the wear-resistant agent of the agent. Polytetrafluoroethylene has an extremely low friction coefficient and will form a lubricating film on the surface of the part during the friction process, thereby significantly improving the wear resistance of the material.

[0016] As a further technical solution of the present invention, in the step 2, the circuit board surface treatment agent is prepared according to the selected components, the selected component reagents are mixed according to the determined component ratio, and are evenly mixed using specific agent equipment to ensure that the components are fully integrated, and the integrated agent is tested and its parameters are adjusted to ensure that parameters such as viscosity and pH value meet the required requirements.

[0017] As a further technical solution of the present invention, in the step three, the surface of the circuit board to be processed is cleaned. The circuit board may be stained with ink and other stains during the processing, resulting in an unclean surface. The surface of the circuit board is cleaned before applying the agent. The stains on the surface of the circuit board are cleaned by a chemical cleaning method with the help of detergent and water. After cleaning, it is necessary to wash with water to ensure that no chemical substances such as detergents remain.

[0018] As a further technical solution of the present invention, in the step four, the metal surface of the circuit board is passivated using a specific passivator. After the surface of the circuit board is cleaned, the metal surface of the circuit board is treated with a chromite passivator to dissolve small impurities such as iron, magnesium, and copper on the metal surface, which can not only effectively remove impurities but also enhance the corrosion resistance of the metal surface. During the treatment, the passivator is poured into the passivation tank, and then the circuit board is immersed in the tank. The treatment time is usually 5-15 minutes, during which the passivator in the passivation tank needs to be fully stirred to ensure its uniform distribution.

[0019] As a further technical solution of the present invention, in the step five, the circuit board surface treatment agent is dip-coated on the surface of the circuit board to form an organic film, which effectively protects the circuit board. After the circuit board is treated, it is dip-coated with the agent, and the cleaned circuit board is immersed in the agent to form an organic film on the clean bare copper surface. This film has the characteristics of anti-oxidation, heat shock resistance, moisture resistance, etc., and can protect the copper surface of the circuit board from oxidation or sulfurization in a normal environment.

[0020] As a further technical solution of the present invention, in step six, the circuit board is subsequently treated by steps such as pure water washing and drying to ensure the best anti-oxidation effect. After the reagent dipping is completed, the circuit board is treated by steps such as pure water washing and drying to ensure that the reagent is evenly attached to the surface of the circuit board and achieve the best anti-oxidation effect without damaging the protective film.

[0021] Compared with the prior art, the present invention has the following beneficial effects: the present invention is designed with a medicament body based on polyamide, epoxy resin and polyurethane, which can significantly improve the chemical stability and thermal stability of the medicament, effectively increase the hardness and impact resistance of the protective layer, improve the elasticity and corrosion resistance of the medicament, and can widely protect the circuit board from the influence of the external environment, provide a solid protective layer for the circuit board, enhance the durability of the circuit board, and add an antioxidant to the medicament to further enhance its antioxidant performance and protect the circuit board from oxidation damage; at the same time, a zinc borate component is added to effectively improve the heat resistance of the medicament, and the zinc borate auxiliary agent has good heat resistance at high temperature. Decomposition reactions will occur in the environment to produce substances such as zinc oxide and boric acid. These decomposition products will form a dense and strong protective film, which can effectively block the transfer of oxygen and heat, thereby enhancing the heat resistance of the treatment agent, effectively improving the applicability of the agent, and reducing the requirements for the environment; polytetrafluoroethylene components are also added to greatly improve the wear resistance of the agent. Polytetrafluoroethylene has an extremely low friction coefficient and will form a lubricating film on the surface of parts during the friction process, thereby significantly improving the wear resistance of the material, effectively avoiding mechanical damage to the OST film, effectively improving the solderability of the PCB, and increasing the use effect of the agent. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1The present invention is a flow chart of the method. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] Please see attached Figure 1 , a technical solution provided by the present invention:

[0025] Example 1

[0026] A circuit board surface treatment agent with high oxidation resistance, the formula of which includes: polyamide, epoxy resin, polyurethane, alkylbenzimidazole, organic acid, cupric chloride, deionized water, antioxidant, zinc borate and polytetrafluoroethylene, the mass percentages of the components are: 20% polyamide, 15% epoxy resin, 18% polyurethane, 8% alkylbenzimidazole, 6% organic acid, 5% cupric chloride, 6% deionized water, 10% antioxidant, 7% zinc borate and 5% polytetrafluoroethylene;

[0027] A method for treating a circuit board surface treatment agent with high oxidation resistance, comprising step 1, selecting agent materials; step 2, preparing the treatment agent; step 3, cleaning the circuit board surface; step 4, metal passivation treatment; step 5, dip coating the agent; step 6, subsequent treatment of the circuit board;

[0028] In the above step 1, the components of the circuit board surface treatment agent are confirmed, and polyamide, epoxy resin and polyurethane are selected as the main materials of the agent. Polyamide has good chemical stability and thermal stability, and is a common component in anti-oxidation coatings. It can widely protect circuit boards from external environmental influences. Epoxy resin has high hardness and good impact resistance. It is particularly suitable for the situation where there is less organic silicon on the surface of the circuit board, and provides a solid protective layer for the circuit board. Polyurethane has good elasticity and strong corrosion resistance. It is suitable for situations with high humidity and high risk of circuit board use environment, and can enhance the durability of the circuit board. Alkylbenzimidazole, organic acid, copper chloride and deionized water are selected as additives of the agent. These ingredients can be used Form a non-stick, thin and uniform protective film with good thermal stability and easy management, which can effectively reduce pollution and facilitate assembly by downstream manufacturers. Antioxidants are selected to further enhance the antioxidant properties of the agent and protect the circuit board from oxidation damage. Zinc borate is selected as the heat-resistant agent of the agent. Zinc borate additives will decompose under high temperature conditions to produce substances such as zinc oxide and boric acid. These decomposition products will form a dense and strong protective film, which effectively blocks the transfer of oxygen and heat, thereby enhancing the heat resistance of the treatment agent. Polytetrafluoroethylene is selected as the wear-resistant agent of the agent. Polytetrafluoroethylene has an extremely low friction coefficient and will form a lubricating film on the surface of the parts during the friction process, thereby significantly improving the wear resistance of the material.

[0029] In the above step 2, the circuit board surface treatment agent is prepared according to the selected components, the selected component reagents are mixed according to the determined component ratio, and the agent-specific equipment is used to evenly mix them to ensure that the components are fully integrated, and the integrated agent is tested and its parameters are adjusted to ensure that the viscosity, pH value and other parameters meet the required requirements. The pH value needs to be greater than 7, alkaline, and the specific gravity needs to be greater than 1;

[0030] In the above step 3, the circuit board to be processed is cleaned on the surface. The circuit board may be stained with ink and other stains during the processing, resulting in an unclean surface. The surface of the circuit board is cleaned before applying the agent. The stains on the surface of the circuit board are cleaned by a chemical cleaning method with the help of detergent and water. After cleaning, it is necessary to wash with water to ensure that no chemical substances such as detergents remain.

[0031] In the above step 4, the metal surface of the circuit board is passivated by using a specific passivator. After the surface of the circuit board is cleaned, the metal surface of the circuit board is treated by using a chromite passivator to dissolve small impurities such as iron, magnesium, and copper on the metal surface, which can not only effectively remove impurities but also enhance the corrosion resistance of the metal surface. During the treatment, the passivator is poured into the passivation tank, and the circuit board is immersed in the tank. The treatment time is usually 5-15 minutes, during which the passivator in the passivation tank needs to be fully stirred to ensure its uniform distribution;

[0032] In the above step 5, the circuit board surface treatment agent is dip-coated on the surface of the circuit board to form an organic film, which effectively protects the circuit board. After the circuit board is treated, it is dip-coated with the agent, and the cleaned circuit board is immersed in the agent to form an organic film on the clean bare copper surface. This film has the characteristics of anti-oxidation, heat shock resistance, moisture resistance, etc., and can protect the copper surface of the circuit board from oxidation or sulfurization in a normal environment. When the agent is used, 8-15 times of clean water needs to be added and heated to 50°C-70°C, and the circuit board is immersed in the agent for 5 minutes to complete the agent dipping;

[0033] In the above step six, the circuit board is subsequently treated by steps such as pure water washing and drying to ensure the best anti-oxidation effect. After the reagent dipping is completed, the circuit board is treated by steps such as pure water washing and drying to ensure that the reagent is evenly attached to the surface of the circuit board and achieve the best anti-oxidation effect without damaging the protective film.

[0034] Example 2

[0035] A circuit board surface treatment agent with high oxidation resistance, the formula of which includes: polyamide, epoxy resin, polyurethane, alkylbenzimidazole, organic acid, cupric chloride, deionized water, antioxidant, zinc borate and polytetrafluoroethylene, the mass percentage of each component is: 25% polyamide, 17% epoxy resin, 12% polyurethane, 7% alkylbenzimidazole, 8% organic acid, 4% cupric chloride, 5% deionized water, 8% antioxidant, 9% zinc borate and 5% polytetrafluoroethylene, and the treatment method is consistent with that of Example 1.

[0036] Example 3

[0037] A circuit board surface treatment agent with high oxidation resistance, the formula of which includes: polyamide, epoxy resin, polyurethane, alkylbenzimidazole, organic acid, cupric chloride, deionized water, antioxidant, zinc borate and polytetrafluoroethylene, the mass percentages of the components are: 28% of polyamide, 12% of epoxy resin, 20% of polyurethane, 5% of alkylbenzimidazole, 4% of organic acid, 5% of cupric chloride, 4% of deionized water, 9% of antioxidant, 5% of zinc borate and 8% of polytetrafluoroethylene, and the treatment method is consistent with that of Example 1.

[0038] The specific composition ratios of each embodiment are shown in the following table:

[0039] Example 1 Example 2 Example 3 Polyamide / % 20 25 28 Epoxy resin / % 15 17 12 Polyurethane / % 18 12 20 Alkylbenzimidazole / % 8 7 5 Organic acid / % 6 8 4 Copper chloride / % 5 4 5 Deionized water / % 6 5 4 Antioxidants / % 10 8 9 Zinc borate / % 7 9 5 Polytetrafluoroethylene / % 5 5 8

[0040] Based on the above, the advantages of the present invention are: the present invention is designed with a medicament body based on polyamide, epoxy resin and polyurethane, which can significantly improve the chemical stability and thermal stability of the medicament. Polyamide has good chemical stability and thermal stability, is a common component in anti-oxidation coatings, and can widely protect circuit boards from external environmental influences. Epoxy resin has high hardness and good impact resistance, and is particularly suitable for situations where there is less organic silicon on the surface of the circuit board, providing a solid protective layer for the circuit board. Polyurethane has good elasticity and strong corrosion resistance, and is suitable for situations with high humidity and high risk of circuit board use environment, and can enhance the durability of the circuit board. Antioxidants are added to the medicament to further enhance its antioxidant properties and protect the circuit board from oxidative damage. Alkylbenzimidazole, organic acid, copper chloride and deionized water are selected as additives to the medicament. These ingredients can be used to form a non-stick, thin and uniform protective layer. The membrane has good thermal stability and easy management, can effectively reduce pollution and facilitate assembly by downstream manufacturers; at the same time, zinc borate is added as a heat-resistant agent for the agent, which effectively improves the heat resistance of the agent. The zinc borate additive will decompose under high temperature to produce substances such as zinc oxide and boric acid. These decomposition products will form a dense and solid protective film, which effectively blocks the transfer of oxygen and heat, thereby enhancing the heat resistance of the treatment agent, effectively improving the applicability of the agent, and reducing the requirements for the environment; polytetrafluoroethylene is also added as a wear-resistant agent for the agent, which greatly improves the wear resistance of the agent. Polytetrafluoroethylene has an extremely low friction coefficient and will form a lubricating film on the surface of the parts during the friction process, thereby significantly improving the wear resistance of the material, effectively avoiding mechanical damage to the OST film, effectively improving the solderability of the PCB, and increasing the use effect of the agent.

[0041] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A circuit board surface treatment agent with high oxidation resistance, the formula of which includes: Polyamide, epoxy resin, polyurethane, alkylbenzimidazole, organic acid, cupric chloride, deionized water, antioxidant, zinc borate and polytetrafluoroethylene, characterized in that the mass percentages of the components are respectively: 15% to 30% of polyamide, 10% to 20% of epoxy resin, 12% to 24% of polyurethane, 5% to 8% of alkylbenzimidazole, 4% to 8% of organic acid, 4% to 6% of cupric chloride, 4% to 7% of deionized water, 8% to 12% of antioxidant, 5% to 10% of zinc borate and 4% to 10% of polytetrafluoroethylene.

2. The circuit board surface treatment agent with high oxidation resistance according to claim 1, characterized in that: The mass percentages of the components are: 20% of polyamide, 15% of epoxy resin, 18% of polyurethane, 8% of alkylbenzimidazole, 6% of organic acid, 5% of cupric chloride, 6% of deionized water, 10% of antioxidant, 7% of zinc borate and 5% of polytetrafluoroethylene.

3. A method for treating a circuit board surface treatment agent with high oxidation resistance, comprising step 1, selecting agent materials; step 2, preparing the treatment agent; step 3, cleaning the circuit board surface; step 4, metal passivation treatment; step 5, dip coating the agent; step 6, subsequent treatment of the circuit board; characterized in that: In the above step 1, the components of the circuit board surface treatment agent are confirmed; In the above step 2, a circuit board surface treatment agent is prepared according to the selected components; In the above step 3, the surface of the circuit board to be processed is cleaned; In the above step 4, a specific passivating agent is used to passivate the metal surface of the circuit board; In the above step 5, the circuit board surface treatment agent is dip-coated on the surface of the circuit board to form an organic film to effectively protect the circuit board; In the above step six, the circuit board is subsequently treated by steps such as pure water washing and drying to ensure the best anti-oxidation effect.

4. The method for treating a circuit board surface treatment agent with high oxidation resistance according to claim 3, characterized in that: In the step 1, the components of the circuit board surface treatment agent are confirmed, and polyamide, epoxy resin and polyurethane are selected as the main materials of the agent. Polyamide has good chemical stability and thermal stability, is a common component in anti-oxidation coatings, and can widely protect circuit boards from external environmental influences. Epoxy resin has high hardness and good impact resistance, and is particularly suitable for the situation where there is less organic silicon on the surface of the circuit board, providing a solid protective layer for the circuit board. Polyurethane has good elasticity and strong corrosion resistance, and is suitable for situations with high humidity and high risk of circuit board use environment, and can enhance the durability of the circuit board. Alkylbenzimidazole, organic acid, copper chloride and deionized water are selected as additives of the agent. These ingredients can be used to form a non-stick, thin and uniform protective film, which has good thermal stability and simple management, can effectively reduce pollution and facilitate assembly by downstream manufacturers.

5. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In the step 1, an antioxidant is selected to further enhance the antioxidant performance of the agent and protect the circuit board from oxidation damage. Zinc borate is selected as the heat-resistant agent of the agent. The zinc borate auxiliary agent will undergo a decomposition reaction in a high temperature environment to produce substances such as zinc oxide and boric acid. These decomposition products will form a dense and strong protective film to effectively block the transfer of oxygen and heat, thereby enhancing the heat resistance of the treatment agent. Polytetrafluoroethylene is selected as the wear-resistant agent of the agent. Polytetrafluoroethylene has an extremely low friction coefficient and will form a lubricating film on the surface of the part during the friction process, thereby significantly improving the wear resistance of the material.

6. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In the step 2, the circuit board surface treatment agent is prepared according to the selected ingredients, the selected component reagents are mixed according to the determined component ratio, and the agent-specific equipment is used to evenly mix them to ensure that the ingredients are fully integrated, and the integrated agent is tested and its parameters are adjusted to ensure that parameters such as viscosity and pH value meet the required requirements.

7. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In the step three, the surface of the circuit board to be processed is cleaned. The circuit board may be stained with ink and other stains during the processing, resulting in an unclean surface. The surface of the circuit board is cleaned before applying the agent. The stains on the surface of the circuit board are cleaned by a chemical cleaning method with the help of detergent and water. After cleaning, it is necessary to rinse with water to ensure that no chemical substances such as detergents remain.

8. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In the step 4, the metal surface of the circuit board is passivated using a specific passivator. After the surface of the circuit board is cleaned, the metal surface of the circuit board is treated with a chromite passivator to dissolve small impurities such as iron, magnesium, and copper on the metal surface, which can not only effectively remove impurities but also enhance the corrosion resistance of the metal surface. During the treatment, the passivator is poured into the passivation tank and the circuit board is immersed in the tank. The treatment time is usually 5-15 minutes, during which the passivator in the passivation tank needs to be fully stirred to ensure its uniform distribution.

9. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In the step 5, the circuit board surface treatment agent is dip-coated on the surface of the circuit board to form an organic film, which effectively protects the circuit board. After the circuit board is treated, it is dip-coated with the agent, and the cleaned circuit board is immersed in the agent to form an organic film on the clean bare copper surface. This film has the characteristics of anti-oxidation, heat shock resistance, moisture resistance, etc., and can protect the copper surface of the circuit board from oxidation or sulfurization in a normal environment.

10. The method for treating a circuit board surface with a high oxidation resistance agent according to claim 3, characterized in that: In step six, the circuit board is subsequently treated by steps such as pure water washing and drying to ensure the best anti-oxidation effect. After the reagent dipping is completed, the circuit board is treated by steps such as pure water washing and drying to ensure that the reagent is evenly attached to the surface of the circuit board and achieve the best anti-oxidation effect without damaging the protective film.

Images