Miniature LED lighting module

Abstract

A micro LED lighting module is disclosed. A micro LED lighting module includes a micro module having one or more transparent polymer layers thereon. In addition, the one or more transparent polymer layers are configured to maintain a temperature of the micro LED lighting module below about 220 DEG C.

Description

Technical Field

[0001] The information provided in this section is for the purpose of generally presenting the context of the present disclosure. The work of the presently named inventors, to the extent it is described in this section and in aspects of the description that may not qualify as prior art at the time of filing, is neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0002] The present disclosure generally relates to a micro LED lighting module. Background Art

[0003] Vehicles often include various exterior lighting modules. A lighting module may be a headlight, taillight, or other exterior vehicle lighting. Conventional lighting modules consist of LCDs, which are then coupled to exterior body panels during vehicle assembly. Since body panels require a lightweight yet high-strength design, body panels are often produced using an injection molding process. However, since lighting modules are easily damaged by heat from the injection molding process, lighting modules must be produced separately from body panels.

[0004] Furthermore, the connection between the lighting module and the vehicle body panel requires the use of sealing elements to prevent moisture from entering the lighting module. Since the sealing elements are susceptible to failure which may result in damage to the lighting module, there remains a need for an integrated lighting module. Summary of the invention

[0005] In some examples, the micro LED lighting module includes a micro module having one or more transparent polymer layers thereon. In addition, the one or more transparent polymer layers are configured to keep the temperature of the micro LED lighting module below about 220 degrees Celsius (°C). In some instances, the one or more transparent polymer layers are multiple transparent polymer layers. In some instances, the one or more transparent polymer layers are produced by overmolding. In some instances, the one or more transparent polymer layers are composed of one or more of polycarbonate, acrylonitrile styrene acrylate, or polymethyl methacrylate. In addition, in some instances, the one or more transparent polymer layers are filled with hollow glass microspheres. In addition, in some examples, a body panel for a vehicle includes a micro LED lighting module. In addition, in some examples, the vehicle includes a micro LED lighting module.

[0006] In some examples, the micro LED lighting module includes a backplane configured to be connected to a power source. The micro LED lighting module also includes a micro module connected to the backplane and configured to be powered by the power source. In addition, the micro LED lighting module includes a transparent polymer layer disposed above the micro module. In some instances, the transparent polymer layer is also disposed on the backplane. In some instances, the transparent polymer layer is connected to the micro module by overmolding. In some instances, the transparent polymer layer is connected to the micro module by thermoforming. In some instances, the transparent polymer layer is a plurality of transparent polymer layers. In some instances, the transparent polymer layer is composed of one or more of polycarbonate, acrylonitrile styrene acrylate, or polymethyl methacrylate. In some examples, a body panel includes a micro LED lighting module. In addition, in some examples, a vehicle includes a micro LED lighting module.

[0007] In some examples, a body panel for a vehicle includes a polymer body panel portion and a micromodule. In some examples, the micromodule is a one-dimensional or two-dimensional array. In addition, the micromodule is a plastic polymer and is composed of one or more of polyethylene terephthalate, polymethyl methacrylate, or polycarbonate. In addition, the body panel includes a back plate that is connected to the micromodule and is configured to provide an electrical connection to the micromodule. In addition, the body panel includes a high thermal conductivity window frame disposed around the micromodule and adjacent to the polymer body panel portion. In addition, the body panel is configured to be formed by an injection molding process that heats the body panel portion to a temperature greater than about 220°C, and the micro LED lighting module is maintained below about 220°C during the injection molding process. In some examples, the high thermal conductivity window frame is composed of one or more of copper or aluminum. In some examples, the body panel also includes a transparent polymer layer disposed between the polymer body panel portion and the micromodule. In some examples, the transparent polymer layer is a plurality of transparent polymer layers. In some examples, the vehicle includes a body panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are for illustrative purposes only of selected configurations and are not intended to limit the scope of the present disclosure.

[0009] Figure 1 is a perspective view of the exterior of the vehicle;

[0010] Figure 2 is a schematic diagram of a micro LED lighting module and a vehicle body panel formed via an injection molding process according to one aspect of the present disclosure;

[0011] Figure 3A is a cross-sectional view of a vehicle body panel formed in a mold according to one aspect of the present disclosure;

[0012] Figure 3Bis a cross-sectional view of a vehicle body panel formed in a mold according to one aspect of the present disclosure;

[0013] Figure 4 is a schematic diagram of a micro LED lighting module formed according to one aspect of the present disclosure;

[0014] Figure 5 is a schematic diagram of a micro LED lighting module formed according to one aspect of the present disclosure;

[0015] Figure 6 is a cross-sectional view of a vehicle body panel formed in a mold according to one aspect of the present disclosure;

[0016] Figure 7 is a cross-sectional view of a vehicle body panel formed in a mold according to one aspect of the present disclosure; and

[0017] Figure 8 is a schematic diagram of a micro LED lighting module formed according to one aspect of the present disclosure.

[0018] Corresponding reference characters indicate corresponding parts throughout the several views of the drawings. DETAILED DESCRIPTION

[0019] Example configurations will now be described more fully with reference to the accompanying drawings. Example configurations are provided so that the present disclosure will be thorough and will fully convey the scope of the present disclosure to those of ordinary skill in the art. Specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the configurations of the present disclosure. It will be apparent to those of ordinary skill in the art that specific details need not be employed, that example configurations may be embodied in many different forms, and that the specific details and example configurations should not be construed as limiting the scope of the present disclosure.

[0020] The terms used herein are for the purpose of describing specific exemplary configurations only and are not intended to be limiting. As used herein, the singular articles "a", "an", and "the" may also be intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprises", "includes" and "have" are inclusive and therefore specify the presence of features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts and / or groups thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an order of execution. Additional or alternative steps may be used.

[0021] When an element or layer is referred to as being "on another element or layer," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly on, directly engaged with, connected to, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more associated listed items.

[0022] The terms "first", "second", "third", etc. may be used in this article to describe various elements, components, regions, layers and / or parts. These elements, components, regions, layers and / or parts should not be limited by these terms. These terms may only be used to distinguish an element, component, region, layer or part from another region, layer or part. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply an order or sequence. Therefore, without departing from the teaching of the example configuration, the first element, component, region, layer or part discussed below may be referred to as a second element, component, region, layer or part.

[0023] In this application, including the definitions below, the term "module" may be replaced with the term "circuit". The term "module" may refer to, be a part of, or include an application specific integrated circuit (ASIC); a digital, analog, or mixed analog / digital discrete circuit; a digital, analog, or mixed analog / digital integrated circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor (shared, dedicated, or group) that executes code; a processor (shared, dedicated, or group) that stores code executed by a memory; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system on a chip.

[0024] The term "code" as used above may include software, firmware and / or microcode, and may refer to a program, a routine, a function, a class and / or an object. The term "shared processor" covers a single processor that executes some or all codes from multiple modules. The term "group processor" covers a processor that executes some or all codes from one or more modules in combination with an additional processor. The term "shared memory" covers a single memory that stores some or all codes from multiple modules. The term "group memory" includes a memory that stores some or all codes from one or more modules in combination with an additional memory. The term "memory" may be a subset of the term "computer-readable medium". The term "computer-readable medium" does not include transient electrical signals and electromagnetic signals propagated through the medium, and therefore can be considered to be tangible and non-transient memory. Non-limiting examples of non-temporary memory include tangible computer-readable media, which include non-volatile memory, magnetic memory, and optical memory.

[0025] The apparatus and methods described in this application may be implemented in part or in whole by one or more computer programs executed by one or more processors. The computer program includes processor executable instructions stored on at least one non-transitory tangible computer readable medium. The computer program may also include and / or rely on stored data.

[0026] Software applications (i.e., software resources) may refer to computer software that enables a computing device to perform tasks. Example applications include, but are not limited to, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.

[0027] Non-transitory memory can be a physical device used to temporarily or permanently store programs (e.g., sequences of instructions) or data (e.g., program state information) for use by a computing device. Non-transitory memory can be volatile and / or non-volatile addressable semiconductor memory. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electrically erasable programmable read-only memory (EEPROM) (e.g., commonly used for firmware, such as bootloaders). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase change memory (PCM), and disk or tape.

[0028] These computer programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and may be implemented in high-level procedural and / or object-oriented programming languages ​​and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, non-transitory computer-readable medium, memory, and / or device (e.g., disk, optical disk, processor, programmable logic device (PLD)) for providing machine instructions and / or data to a programmable device, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0029] Various implementations of the systems and techniques described herein can be implemented in digital electronic and / or optical circuits, integrated circuits, specially designed ASICs (application specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include implementations in one or more computer programs executable and / or interpretable on a programmable system that includes at least one programmable processor, which may be special purpose or general purpose, coupled to receive data and instructions from a storage system, at least one input device, and at least one output device, and to send data and instructions to the storage system, at least one input device, and at least one output device.

[0030] The process and logic flow described in this specification can be performed by one or more programmable processors (also referred to as data processing hardware), which execute one or more computer programs to perform functions by operating on input data and generating outputs. The process and logic flow can also be performed by a dedicated logic circuit (e.g., FPGA (field programmable gate array) or ASIC (application-specific integrated circuit)). As an example, a processor suitable for executing a computer program includes both general-purpose and special-purpose microprocessors, and any one or more processors of any type of digital computer. Typically, the processor will receive instructions and data from a read-only memory or a random access memory or both. The basic elements of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Typically, a computer will also include one or more large-capacity storage devices (e.g., magnetic disks, magneto-optical disks, or optical disks) for storing data, or be operably connected to receive data from it or transmit data to it or both. However, a computer does not need to have such a device. Computer-readable media suitable for storing computer program instructions and data include all forms of nonvolatile memory, media, and memory devices, including, for example, semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD ROM and DVD-ROM disks. The processor and memory may be supplemented by, or incorporated in, special purpose logic circuitry.

[0031] To provide interaction with a user, one or more aspects of the present disclosure may be implemented on a computer having a display device (e.g., a CRT (cathode ray tube), LCD (liquid crystal display) monitor, or touch screen) for displaying information to the user and optionally a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other kinds of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user may be received in any form, including sound, voice, or tactile input. In addition, the computer may interact with the user by sending documents to and receiving documents from a device used by the user; for example, by sending a web page to a web browser on a user's client device in response to a request received from the web browser.

[0032] First reference Figure 1, a vehicle is shown at 10. The exterior of the vehicle 10 includes a plurality of exterior body panels 12 coupled to various exterior lighting modules. The body panels 12 are typically large, uniquely shaped sections. These sections provide secure mounting and coverage for vehicle systems and protect occupants from objects during a collision. Due to the unique shape and necessary strength requirements, the body panels 12 are typically constructed of polymers and produced by an injection molding process. The injection molding process is a forming process that uses a mold. Materials such as synthetic resins or plastics are heated and melted and then fed to a mold 14 where they are formed. Once the desired shape is formed, the body panels 12 are cooled and then removed from the mold 14 for assembly onto the vehicle 10.

[0033] Many exterior lighting modules, including but not limited to headlamps, taillamps, and center high mounted stop lamps (CHMSLs), are required by law for safety reasons. Since the lighting modules are heat sensitive, the exterior lighting modules are assembled separately and then assembled into the body panel 12 in a separate step to avoid damage to the lighting modules during injection molding or other forming processes. However, assembling the separate components requires additional components such as seals and often results in failure of the lighting modules due to water leakage between the assembled components.

[0034] Figure 1-8 A micro LED lighting module 20 is shown that overcomes these disadvantages. The micro LED lighting module 20 includes a micro module 22 and a backplane 24.

[0035] The micromodule 22 is a one-dimensional array or a two-dimensional array of microelements. In some instances, the micromodule 22 is a small component having a diameter of less than one (1) millimeter. Common micromodule 22 sizes include diameters of about one hundred (100) microns to about ten (10) microns, however, various other sizes have been considered. In some examples, the micromodule 22 is a microLED array consisting of a plurality of microscopic LEDs forming a display. In one configuration, the micromodule 22 includes more than 1,000 microLEDs. Additionally, in some instances, the micromodule 22 includes more than 10,000 microLEDs. In some instances, the micromodule 22 includes more than 100,000 microLEDs. Additionally, in some instances, the micromodule 22 includes more than 1,000,000 microLEDs. However, various other configurations are also contemplated.

[0036] Additionally, in some examples, the micromodules 22 are constructed of a plastic polymer and include one or more of polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), or polycarbonate (PC). However, various other materials have been contemplated. The micromodules 22 may be any size and shape configured to display a desired lighting effect.

[0037] like Figure 2-8 As shown in the illustrated example, the micro LED lighting module 20 also includes a back plate 24. The back plate 24 is configured to be coupled to the micro module 22. In some examples, the back plate 24 is configured to be coupled to each micro LED of the micro module 22 so that the back plate 24 extends along the entire surface of the micro module 22.

[0038] The back plate 24 may include any substrate responsible for carrying the functions of the micro LED lighting module 20, such as a printed circuit board (PCB), etc. The shape and size of the back plate 24 may be suitable for the micro module 22, and is configured to distribute functions including power, signals, etc. to each micro LED so that appropriate electrical connections and signal transmissions can be obtained. In addition, the back plate 24 may be configured to be connected to a power source (not shown) via a cable 26 or other connection mechanism.

[0039] In some examples, such as Figure 3A In the example shown, the micro LED lighting module 20 also includes a transparent polymer layer 30 disposed on one or more of the micro modules 22 or the backplane 24 of the micro LED lighting module 20. The transparent polymer layer 30 is generally transparent so that light is visible through the transparent polymer layer 30. In addition, it is expected that the transparent polymer layer 30 can be tinted to match the color of the body panel or other vehicle components. In addition, it is contemplated that in some examples, the transparent polymer layer 30 can also be translucent or opaque if desired. In addition, it is expected that a portion of the transparent polymer layer 30 can be transparent, while another portion of the transparent polymer layer 30 can be tinted and / or translucent or opaque.

[0040] In some examples, the transparent polymer layer 30 is composed of one or more of polycarbonate (PC), acrylonitrile styrene acrylate (PSA), or polymethyl methacrylate (PMMA). However, various other compositions have been contemplated. Additionally, in some examples, the transparent polymer layer 30 is disposed on the micromodule 22 opposite the backplane 24. In some examples, the transparent polymer layer 30 is disposed on both the micromodule 22 and the backplane 24. In some examples, such as Figure 5 In the example shown, the transparent polymer layer 30 can completely surround the micro LED lighting module 20, leaving only the cable 26 extending therefrom to connect to the power supply. In addition, in some examples, the transparent polymer layer 30 can be thermoformed on one or more of the micro modules 22 and the backplane 24.

[0041] In addition, the transparent polymer layer 30 is configured to maintain the temperature of the micro LED lighting module 20 below about 220 degrees Celsius (° C.). In some examples, the transparent polymer layer 30 is configured to maintain the temperature of the micro LED lighting module 20 below about 200° C. In some examples, the transparent polymer layer 30 is configured to maintain the temperature of the micro LED lighting module 20 below about 150° C. In some examples, the transparent polymer layer 30 is configured to maintain the temperature of the micro LED lighting module 20 below about 135° C.

[0042] In some instances, such as Figure 3B In the example shown in , the transparent polymer layer 30 may be composed of multiple transparent polymer layers 30 disposed on top of each other. The multiple layers of transparent polymer layer 30 add to the thermal insulation provided by the layer 30 to the micro LED lighting module 20 when the micro LED lighting module 20 is molded onto the vehicle body panel 12, as will be described in more detail below. Figure 3B In the diagram shown in Figure 3A The transparent polymer layer 30 shown in FIG. 1 illustrates multiple layers compared to different cross-hatching. In addition, the multiple transparent polymer layers 30 are shown as including three (3) substantially identical sheets of the same length stacked on top of each other. Alternatively, one or more of the transparent polymer layers 30 may be filled with hollow glass microspheres to provide a low density, low thermal conductivity polymer layer 30 such that at least one of the layers 30 is different from the other layers 30. Finally, while the transparent polymer layer 30 is shown as including three (3) sheets, the transparent polymer layer 30 may include any number of sheets - greater or less than three (3) sheets.

[0043] Still reference Figure 2-5 In the example shown in , to form a multi-layer transparent polymer layer 30, one transparent polymer layer can be thermoformed with a second transparent polymer layer to form a transparent polymer layer 30 having multiple transparent polymer layers 30. It is also contemplated that more than two transparent polymer layers 30 can be thermoformed together (see Figure 3B ) to form a multi-layer transparent polymer layer 30.

[0044] In some examples, once transparent polymer layer 30 is formed, it can be attached to one or more of micromodules 22 and / or backplane 24. Figure 4 In the example shown, the transparent polymer layer 30 is coupled to the backing plate 24. In another example, as shown in FIG. Figure 5As shown, the transparent polymer layer 30 is coupled to both the backplane 24 and the micromodule 22. Other configurations are also contemplated. In some examples, the connection of the transparent polymer layer 30 to one or more of the micromodule 22 and / or the backplane 24 is accomplished by a thermoforming process. Additionally or alternatively, in some examples, for example Figure 2 In the example shown in FIG. 1 , a transparent polymer layer 30 (eg, PC or PSA) may be overmolded onto the micromodule 22 using an injection molding process or an injection compression molding process.

[0045] In some examples, once formed, the micro LED lighting module 20 can then be further processed into the vehicle body panel 12. Figure 2 In the example shown, the transparent polymer layer 30 is a multilayer film that includes one or more layers of optical coupling agent 32 (the optical coupling agent helps facilitate the connection between the micro LED lighting module 20 and the body panel 12), a polycarbonate or other polymer compatible layer 23, and a graphene layer 34 or another additional layer that provides additional conductivity and / or strength to the micro LED lighting module 20 and / or the body panel 12 when the transparent polymer layer 30 is attached to the micro LED lighting module 20 and then overmolded onto the body panel 12. The multilayer film of the transparent polymer layer 30 may also include a micro lens array 25 that is disposed on the micro module 22 when the transparent polymer layer 30 is attached to the micro module 22, such as Figure 2 Once the transparent polymer layer 30 is attached to the micromodule 22 , the illumination pattern of the micromodule 22 can be designed by the cover layer from the microlens array 25 .

[0046] Reference now Figure 4 In the example shown in , as described above, the transparent polymer layer 30 can be thermoformed onto the micromodule 22. In some examples, an optical connector 32 or adhesive can be disposed between the micromodule 22 or backplane 24 and the transparent polymer layer 30. In addition, it is contemplated that the transparent polymer layer 30 can be thermoformed or otherwise connected to another transparent polymer layer 30 before being thermoformed onto the micromodule 22 and / or backplane 24. Once the transparent polymer layer 30 is thermoformed onto the micromodule 22, the transparent polymer layer 30 can be trimmed to the desired size and the micro LED lighting module 20 can be formed. The micro LED lighting module 20 can then be further processed in an overmolding or other high heat process without causing damage to the micromodule 22, such as Figure 5 shown.

[0047] Additionally or alternatively, the micromodule 22 and backplane 24 may be coupled to a high thermal conductivity window frame 35, such as Figure 6-8 As shown in the example shown. The high thermal conductivity window frame 35 can be made of one or more of aluminum or copper. Figure 6-8As shown, the high thermal conductivity window frame 35 is generally rectangular with a hole defined therethrough. The micromodule 22 and the backplate 24 are disposed through the hole so that the high thermal conductivity window frame 35 surrounds the micromodule 22 and the backplate 24 on four sides. In this example, when the micro LED lighting module 20 has a polymer overmolded thereon, heat from the injection molding process is dissipated to the surface of the mold 14 and away from the micro LED lighting module 20, thereby preventing damage to the micro LED lighting module 20.

[0048] The micro LED lighting module 20 may include a micro module 22 and a high thermal conductivity window frame 35 ( Figure 7 ) to help dissipate heat from the injection molding process to the surface of the mold 14. In doing so, heat is dissipated from the micro LED lighting module 20 during the injection molding process and during further processing such as overmolding in an effort to protect the micro LED lighting module 20.

[0049] In operation, micromodule 22 is coupled to backsheet 24. In some examples, transparent polymer layer 30 is then injection molded onto one or more of micromodule 22 or backsheet 24, such as Figure 2 In some examples, the transparent polymer layer 30 is thermoformed onto one or more of the micromodule 22 or the backsheet 24, such as Figure 4 As shown. Figure 4 As shown, transparent polymer layer 30 may include multiple layers. In some examples, high thermal conductivity window frame 35 is coupled around micromodule 22 and backplane 24, such as Figure 6-8 In addition, a transparent polymer layer 30 may be disposed on the micromodule 22, the backing plate 24, and the high thermal conductivity window frame 35. The micro LED lighting module 20 is then overmolded with the polymer forming the body panel 12 so that the micro LED lighting module 20 and the body panel 12 are a single integral piece.

[0050] The micro LED lighting module 20 as described herein is configured to withstand high temperatures without damage and without dimming or otherwise affecting the micro module 22. For example, the micro LED lighting module 20 can be placed in a desired mold so that the exterior body panel 12 is overmolded thereon without damaging the micro LED lighting module 20. As described herein, the micro LED lighting module 20 is configured to be integrated into the body panel 12 so that the micro LED lighting module 20 and the body panel 12 form a single integral piece. In addition, the integral body panel 12 and micro LED lighting module 20 eliminate the need for additional seals or other parts and additional manual coupling steps.

[0051] Many embodiments have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of the present disclosure. Therefore, other embodiments are within the scope of the appended claims.

[0052] The foregoing description is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. The individual elements or features of a particular configuration are generally not limited to that particular configuration, but are interchangeable where applicable and can be used in a selected configuration, even if not specifically shown or described. It can also be varied in many ways. Such variations should not be considered as departing from the present disclosure, and all such modifications are intended to be included within the scope of the present disclosure.

Claims

1. A micro LED lighting module, comprising: A micro module having one or more transparent polymer layers thereon, wherein the one or more transparent polymer layers are configured to maintain a temperature of the micro LED lighting module below about 220 degrees Celsius (° C.). 2 . The micro LED lighting module of claim 1 , wherein the one or more transparent polymer layers are a plurality of transparent polymer layers. 3 . The micro LED lighting module of claim 1 , wherein the one or more transparent polymer layers are produced by overmolding. 4 . The micro LED lighting module of claim 1 , wherein the one or more transparent polymer layers comprise one or more of polycarbonate, acrylonitrile styrene acrylate, and polymethyl methacrylate.

5. The micro LED lighting module of claim 1, wherein the one or more transparent polymer layers comprise a micro lens array.

6. The micro LED lighting module of claim 1, further comprising a backplane coupled to the micro module.

7. The micro LED lighting module of claim 1, wherein the transparent polymer layer is coupled to the micro module by overmolding.

8. The micro LED lighting module of claim 1, wherein the transparent polymer layer is coupled to the micro module by thermoforming.

9. A body panel for a vehicle, comprising the micro LED lighting module according to claim 1.

10. A vehicle comprising the micro LED lighting module according to claim 1.

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