Semicircular semiconductor part detection tool

Abstract

The invention discloses a semicircular semiconductor part detection tool, and aims to overcome the defect of low working efficiency of semicircular semiconductor part detection. The device comprises a base, a loading groove is formed in the base, a datum plane is arranged at one end of the loading groove, a movably-arranged push plate is installed at the other end of the loading groove, the base is rotationally connected with a positioning balance rod, a profiling semicircular plate is rotationally installed on the positioning balance rod, at least one pair of supporting rollers is installed at the bottom of the loading groove, and semiconductor parts are loaded in the loading groove. The semiconductor part is supported on the supporting roller, the positioning balance rod presses the opening end of the semiconductor part, and the push plate abuts against the end of the semiconductor part. The semi-circular semiconductor part detection tool can rapidly detect the size of a semi-circular semiconductor part, and is high in working efficiency and accurate and reliable in detection.

Description

Technical Field

[0001] The invention relates to semiconductor component detection technology, and more specifically, to a semicircular semiconductor component detection tool. Background Art

[0002] At present, there is a kind of commonly used tile-shaped parts (hereinafter referred to as tiles) in semiconductor equipment components. Its structure is a thick-walled circular tube divided into two, with mounting holes opened in the side wall, the mounting holes facing the axis, and its inner diameter, outer diameter, mounting holes on the side wall and length are all key part dimensions. The number of such parts is very large during production, and customers require that all part features be inspected. It is not economical to use three-coordinate inspection. Conventional inspection requires multiple positioning and repeated measurement of each part, which is very inefficient. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides a semicircular semiconductor part detection tool, which can quickly detect the size of the semicircular semiconductor part, has high working efficiency, and is accurate and reliable in detection.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: a semicircular semiconductor parts detection tooling, including a base, a loading slot is provided on the base, a reference surface is set at one end of the loading slot, a push plate is installed on the other end of the loading slot, the base is rotatably connected to a positioning balance bar, a contoured semicircular plate is rotatably installed on the positioning balance bar, at least one pair of support rollers is installed at the bottom of the loading slot, semiconductor parts are loaded in the loading slot, the semiconductor parts are supported on the support rollers, the positioning balance bar is pressed on the open end of the semiconductor part, and the push plate is pressed against the end of the semiconductor part.

[0005] When the semicircular semiconductor parts are inspected, the semiconductor parts are installed in the loading slot on the base with the opening facing upwards. The support rollers at the bottom of the loading slot support the semiconductor parts, which reduces the contact area of ​​the outer surface of the semiconductor parts and helps reduce the risk of scratches. Then push the push plate so that one end of the semiconductor part is close to the reference surface, and the other end of the semiconductor part is close to the push plate. The length of the semiconductor part can be indirectly measured by the distance moved by the push plate. After that, the positioning balance bar is turned down and pressed to the upper opening of the semiconductor part. The positioning balance bar contacts the edges of the opening of the semiconductor part on both sides to ensure that the profiling semicircular plate is coaxial with the semiconductor part, and then the profiling semicircular plate is turned down. The radius of the profiling semicircular plate is slightly larger than the radius of the inner wall of the semiconductor part. The profiling semicircular plate turns down and touches the inner wall of the semiconductor part and stops rotating. The inner diameter of the semiconductor part meets the requirements by observing the angle of the profiling semicircular plate. If the angle of rotation of the profiling semicircular plate is within the set angle range, it is determined that the inner diameter of the semiconductor part meets the inspection requirements. This semicircular semiconductor parts inspection tool can quickly detect the size of semicircular semiconductor parts, with high work efficiency and accurate and reliable inspection.

[0006] Preferably, the push plate is connected to a push rod, a length scale line is provided on the push rod, and the push rod is movably plug-in connected to the base.

[0007] The push plate is pushed by the push rod to move, thereby pushing the semiconductor parts. A length scale line is set on the push rod to facilitate the measurement of the length of the semiconductor parts.

[0008] Preferably, a hole position detection member is mounted on the base, a slidably arranged detection block is provided on the hole position detection member, a detection pin is provided on the detection block, and the detection pin is aligned with the mounting hole on the semiconductor component.

[0009] After the semiconductor parts are loaded into place, the positioning balance bar contacts the two side edges of the semiconductor parts opening. At this time, the positioning balance bar is in a horizontal position, and the two side edges of the semiconductor parts opening are on the same horizontal plane. In other words, the semiconductor parts are in a correct posture. During the detection process, if the positioning pin can pass through the mounting hole, it means that the mounting hole position accuracy meets the requirements.

[0010] Preferably, a rotatable support shaft is installed on the base, a connecting rod is rotatably connected to the support shaft, and the connecting rod is tightly connected to the positioning balance rod.

[0011] The rotation connection of the positioning balance rod is realized by setting the supporting shaft and the connecting rod, and the connection is stable and reliable.

[0012] Preferably, a limit block which is arranged to slide laterally is installed on the base, and two limit parts are arranged on the limit block, and the two limit parts are respectively arranged on both sides of the rotation center of the supporting shaft, and a guide surface and a limit surface are arranged on the limit part, and the guide surface is arranged to be inclined, and the two limit surfaces respectively limit the supporting shaft support on both sides of the rotation center.

[0013] The setting of the limit block enables the support shaft to rotate and lock in position. When the limit block moves away from the support shaft, the limit surface separates from the support shaft, and the limit block loses the limit on the support shaft. At this time, the support shaft can rotate. When the limit block moves toward the support shaft, the guide surface slides over the outer wall of the support shaft and supports the support shaft to the limit surface. At this time, the support shaft is in a horizontal state and cannot rotate, which is convenient for the detection of the mounting hole.

[0014] Preferably, an angle measuring rod is installed at the bottom of the loading slot, and the distance a between the outer wall of the loading slot and the circumferential contour line of the semiconductor part is lower than that of the semiconductor part, where a is the maximum allowable roundness error value.

[0015] When the roundness of the outer wall of the semiconductor part is detected, the supporting shaft rotates, thereby driving the semiconductor part to rotate. If the roundness error of the outer wall of the semiconductor part exceeds the maximum error value, the angle measuring rod contacts the outer wall of the semiconductor part. At this time, the angle measuring rod is pushed and deflected by the friction force. Therefore, the roundness of the outer wall of the semiconductor part can be judged by observing the deflection angle of the angle measuring rod.

[0016] Preferably, a downwardly recessed avoidance groove is provided on the surface of the base corresponding to the supporting shaft.

[0017] The setting of the avoidance groove provides space for the support shaft to rotate, avoiding interference and jamming.

[0018] Preferably, a rotating shaft is arranged on the supporting shaft, and the rotating shaft is rotatably mounted on the base, and the rotating axis of the rotating shaft is parallel to the axis of the semiconductor component.

[0019] The axis of the rotating shaft is parallel to the axis of the semiconductor part, ensuring that the axis of the positioning balance rod intersects the axis of the semiconductor part vertically, thereby ensuring the accuracy of the detection.

[0020] Preferably, spring blocks are installed at both ends of the positioning balance rod, and a buffer spring is installed between the spring block and the positioning balance rod. Push surfaces are set at the lower parts of the opposing surfaces of the two spring blocks, and the two push surfaces are inclined from top to bottom in a direction away from each other. An outer diameter scale line is set along the length direction of the positioning balance rod.

[0021] When the positioning balance bar is pressed down to the opening end of the semiconductor part, the outer edge of the opening end of the semiconductor part comes into contact with the pushing surface, thereby pushing the spring block to move, and the outer diameter of the semiconductor part is indirectly measured by the moving distance of the spring block.

[0022] Preferably, a piston cylinder is installed on the profiling semicircular plate, a large piston is installed in the piston cylinder, the large piston is connected to a contact rod, the length of the contact rod radially extending from the outer edge of the profiling semicircular plate is b, and b is the maximum allowable error value of the inner diameter; the piston cylinder is connected to a small flow channel, a small piston is installed in the small flow channel, the small piston is connected to a stroke amplification rod, a conductive contact piece is installed in the small flow channel, the conductive contact piece is connected to the indicator light circuit, and the stroke amplification rod moves and touches the conductive contact piece to light up the indicator light.

[0023] When testing the inner diameter of semiconductor parts, turn the profiling semicircular plate downward. If the profiling semicircular plate cannot turn over the inner bottom surface of the semiconductor part, it means that the inner diameter of the semiconductor part does not meet the requirements. If the profiling semicircular plate can turn over the inner bottom surface of the semiconductor part, and the touch rod can touch the inner bottom surface of the semiconductor part, the touch rod pushes the large piston to move, and the medium in the piston cylinder flows into the small flow channel and drives the small piston to move. Since the area of ​​the large piston is much larger than that of the small piston, the distance moved by the small piston is magnified, and the travel amplification rod moves to touch the conductive contact sheet to light up the indicator light, indicating that the inner diameter of the semiconductor part meets the requirements.

[0024] Compared with the prior art, the present invention has the following beneficial effects: (1) the semicircular semiconductor parts inspection tool can quickly inspect the size of the semicircular semiconductor parts, with high working efficiency and accurate and reliable inspection; (2) by observing the deflection angle of the angle measuring stick, it is possible to judge whether the roundness of the outer wall of the semiconductor parts meets the requirements, which is convenient for inspection; (3) by indirectly measuring the outer diameter of the semiconductor parts by the distance moved by the spring block, it is convenient for inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the detection status of Example 1 of the present invention.

[0026] Figure 2 It is a schematic structural diagram of embodiment 1 of the present invention.

[0027] Figure 3 It is a schematic structural diagram of embodiment 2 of the present invention.

[0028] Figure 4 It is a schematic structural diagram of the positioning balance rod of Example 3 of the present invention.

[0029] Figure 5 It is a schematic structural diagram of the positioning balance rod of Example 4 of the present invention.

[0030] Figure 6 It is a partial enlarged view of the touch rod position of Example 4 of the present invention.

[0031] In the figure: 1, base, 2, loading slot, 3, reference surface, 4, push plate, 5, push rod, 6, length scale line, 7, positioning balance bar, 8, contoured semicircular plate, 9, support roller, 10, semiconductor parts, 11, support shaft, 12, connecting rod, 13, rotating shaft, 14, avoidance groove, 15, support, 16, limit block, 17, limit part, 18, guide surface, 19, limit surface, 20, deflection scale line, 21, pointer, 22, angle measuring stick, 2 3. Angle scale line, 24. Hole position detection part, 25. Detection block, 26. Detection pin, 27. Mounting hole, 28. Spring block, 29. Buffer spring, 30. Connecting groove, 31. Positioning plug, 32. Push surface, 33. Piston cylinder, 34. Large piston, 35. Reset spring, 36. Touch rod, 37. Small flow channel, 38. Small piston, 39. Return spring, 40. Travel amplification rod, 41. Conductive contact sheet, 42. Wiring ring, 43. Conductive ring. DETAILED DESCRIPTION

[0032] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Embodiment 1: A semicircular semiconductor parts inspection tool (see Figure 1 , Figure 2), including a base 1, the base 1 is in a long strip structure, a loading slot 2 is provided on the base 1, the loading slot 2 is arranged on the upper surface of the base 1, the loading slot 2 is in a semicircular structure, a reference surface 3 is provided at one end of the loading slot 2, and a push plate 4 is installed on the other end of the loading slot 2, the push plate 4 is also in a semicircular structure, the push plate 4 is connected to the push rod 5, the push rod 5 is provided with a length scale line 6, and the push rod 5 is movably connected with the base 1. The push plate 4 is pushed to move by the push rod 5, so as to realize the pushing of the semiconductor part 10. The push rod 5 is provided with a length scale line 6, which is convenient for measuring the length of the semiconductor part 10. An insertion hole is provided on the side of the loading slot 2 opposite to the reference surface 3, and the push rod 5 is plug-in-connected with the insertion hole. A flange is provided at the end of the push rod 5, and the flange plays a limiting role on the push rod 5 to prevent the push rod 5 from moving too far.

[0033] The base 1 is rotatably connected to the positioning balance bar 7, and a contoured semicircular plate 8 is rotatably installed on the positioning balance bar 7. At least one pair of support rollers 9 is installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are arranged, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The loading groove 2 is loaded with a semiconductor part 10, and the semiconductor part 10 is supported on the support roller 9. The positioning balance bar 7 is pressed on the open end of the semiconductor part 10, and the push plate 4 is pressed on the end of the semiconductor part 10.

[0034] A rotatable support shaft 11 is installed on the base 1, and two connecting rods 12 are rotatably connected to the support shaft 11. The two connecting rods 12 are respectively connected to the two ends of the support shaft, and the two connecting rods 12 are respectively tightly connected to the two positioning balance rods 7. The profiling semicircular plate 8 is rotatably installed in the middle of the positioning balance rod 7. A rotating shaft 13 is arranged on the support shaft 11, and the rotating shaft 13 is rotatably installed on the base 1, and the rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor part 10. The rotating shaft 13 is arranged in the middle of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly, and the rotation axis of the profiling semicircular plate 8 intersects the axis of the semiconductor part 10 perpendicularly.

[0035] A downwardly recessed avoidance groove 14 is arranged on the surface of the base 1 corresponding to the supporting shaft 11, and two supports 15 are arranged on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes, and both ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The avoidance groove 14 is placed between the two supports 15, and the depth of the avoidance groove 14 gradually increases from the middle to both ends.

[0036] The radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor component 10 . The outer wall of the positioning balance bar 7 is provided with deflection scale lines 20 , which are arranged circumferentially. The profiling semicircular plate 8 is provided with a pointer 21 , which points to the deflection scale lines 20 .

[0037] An angle measuring rod 22 is installed at the bottom of the loading tank 2. The angle measuring rod 22 is rotatably arranged. The distance a between the outer wall of the loading tank 2 and the circumferential contour line of the semiconductor component 10 is lower than that of the outer wall of the semiconductor component 10. a is the maximum allowable error value of the roundness of the outer wall of the semiconductor component 10. An angle scale line 23 is arranged between the base 1 and the angle measuring rod 22. The angle scale line 23 is arranged circumferentially on the side wall of the base 1. An alignment line is arranged on the angle measuring rod 22. The alignment line is aligned with the angle scale line 23.

[0038] A hole position detection member 24 is mounted on the base 1, and a detection block 25 is provided on the hole position detection member 24 for sliding arrangement. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25, and a guide groove adapted to the guide rail is provided on the hole position detection member 24, and the guide rail and the guide groove are movably plug-connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with a mounting hole 27 on the semiconductor component 10.

[0039] During the inspection operation of the semicircular semiconductor part 10, the semiconductor part 10 is installed in the loading slot 2 on the base 1 with the opening facing upwards. The support rollers 9 at the bottom of the loading slot 2 support the semiconductor part 10, which reduces the contact area of ​​the outer surface of the semiconductor part 10 and helps reduce the risk of scratches. Then push the push plate 4 so that one end of the semiconductor part 10 is close to the reference surface 3, and the other end of the semiconductor part 10 is close to the push plate 4. The length of the semiconductor part 10 can be indirectly measured by the distance moved by the push plate 4. After the semiconductor part 10 is loaded in place, the positioning balance bar 7 contacts the two side edges of the opening of the semiconductor part 10. At this time, the positioning balance bar 7 is in a horizontal position, and the two side edges of the opening of the semiconductor part 10 are on the same horizontal plane. In other words, the semiconductor part 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the position accuracy of the mounting hole 27 meets the requirements.

[0040] The positioning balance bar 7 is flipped downward and pressed to the upper opening of the semiconductor part 10, and the positioning balance bar 7 contacts the edges of both sides of the opening of the semiconductor part 10 to ensure that the profiling semicircular plate 8 is coaxial with the semiconductor part 10, and then the profiling semicircular plate 8 is flipped downward, and the radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. The profiling semicircular plate 8 flips downward and touches the inner wall of the semiconductor part 10 and stops rotating. By observing the angle of the profiling semicircular plate 8, it is judged whether the inner diameter of the semiconductor part 10 meets the requirements. If the angle of rotation of the profiling semicircular plate 8 is within the set angle range, it is determined that the inner diameter of the semiconductor part 10 meets the detection requirements.

[0041] When the roundness of the outer wall of the semiconductor part 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor part 10 to rotate. If the roundness error of the outer wall of the semiconductor part 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of the semiconductor part 10. At this time, the angle measuring rod 22 is pushed and deflected by the friction force. Therefore, it is possible to judge whether the roundness of the outer wall of the semiconductor part 10 meets the requirements by observing the deflection angle of the angle measuring rod 22.

[0042] Embodiment 2: A semicircular semiconductor parts inspection tool (see Figure 3 ), including a base 1, the base 1 is in a long strip structure, a loading slot 2 is provided on the base 1, the loading slot 2 is arranged on the upper surface of the base 1, the loading slot 2 is in a semicircular structure, a reference surface 3 is provided at one end of the loading slot 2, and a push plate 4 is installed on the other end of the loading slot 2, the push plate 4 is also in a semicircular structure, the push plate 4 is connected to the push rod 5, the push rod 5 is provided with a length scale line 6, and the push rod 5 is movably connected with the base 1. The push plate 4 is pushed to move by the push rod 5, so as to realize the pushing of the semiconductor part 10. The push rod 5 is provided with a length scale line 6, which is convenient for measuring the length of the semiconductor part 10. An insertion hole is provided on the side of the loading slot 2 opposite to the reference surface 3, and the push rod 5 is plug-in-connected with the insertion hole. A flange is provided at the end of the push rod 5, and the flange plays a limiting role on the push rod 5 to prevent the push rod 5 from moving too far.

[0043] The base 1 is rotatably connected to the positioning balance bar 7, and a contoured semicircular plate 8 is rotatably installed on the positioning balance bar 7. At least one pair of support rollers 9 is installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are arranged, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The loading groove 2 is loaded with a semiconductor part 10, and the semiconductor part 10 is supported on the support roller 9. The positioning balance bar 7 is pressed on the open end of the semiconductor part 10, and the push plate 4 is pressed on the end of the semiconductor part 10.

[0044] A rotatable support shaft 11 is installed on the base 1, and two connecting rods 12 are rotatably connected to the support shaft 11. The two connecting rods 12 are respectively connected to the two ends of the support shaft, and the two connecting rods 12 are respectively tightly connected to the two positioning balance rods 7. The profiling semicircular plate 8 is rotatably installed in the middle of the positioning balance rod 7. A rotating shaft 13 is arranged on the support shaft 11, and the rotating shaft 13 is rotatably installed on the base 1, and the rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor part 10. The rotating shaft 13 is arranged in the middle of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly, and the rotation axis of the profiling semicircular plate 8 intersects the axis of the semiconductor part 10 perpendicularly.

[0045] A downwardly recessed avoidance groove 14 is arranged on the surface of the base 1 corresponding to the supporting shaft 11, and two supports 15 are arranged on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes, and both ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The avoidance groove 14 is placed between the two supports 15, and the depth of the avoidance groove 14 gradually increases from the middle to both ends.

[0046] A limit block 16 that is arranged to slide laterally is installed on the base 1. A slide seat is arranged on the base 1 corresponding to the limit block 16. A slide groove is arranged on the slide seat. A slider is arranged at the bottom of the limit block 16. The slider is slidably connected to the slide groove. The slider and the slide groove are both isosceles trapezoidal structures. Two limit parts 17 are arranged on the limit block 16. The two limit parts 17 are respectively placed on both sides of the rotation center of the supporting shaft 11. A guide surface 18 and a limit surface 19 are arranged on the limit part 17. The guide surface 18 is inclined, and the two limit surfaces 19 respectively support and limit the supporting shaft 11 on both sides of the rotation center.

[0047] The setting of the limit block 16 enables the support shaft 11 to rotate and lock in position. When the limit block 16 moves away from the support shaft 11, the limit surface 19 separates from the support shaft 11, and the limit block 16 loses the limit on the support shaft 11. At this time, the support shaft 11 can rotate. When the limit block 16 moves toward the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limit surface 19. At this time, the support shaft 11 is in a horizontal state and cannot rotate, which is convenient for the detection of the mounting hole 27.

[0048] The radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor component 10 . The outer wall of the positioning balance bar 7 is provided with deflection scale lines 20 , which are arranged circumferentially. The profiling semicircular plate 8 is provided with a pointer 21 , which points to the deflection scale lines 20 .

[0049] An angle measuring rod 22 is installed at the bottom of the loading tank 2. The angle measuring rod 22 is rotatably arranged. The distance a between the outer wall of the loading tank 2 and the circumferential contour line of the semiconductor component 10 is lower than that of the outer wall of the semiconductor component 10. a is the maximum allowable error value of the roundness of the outer wall of the semiconductor component 10. An angle scale line 23 is arranged between the base 1 and the angle measuring rod 22. The angle scale line 23 is arranged circumferentially on the side wall of the base 1. An alignment line is arranged on the angle measuring rod 22. The alignment line is aligned with the angle scale line 23.

[0050] A hole position detection member 24 is mounted on the base 1, and a detection block 25 is provided on the hole position detection member 24 for sliding arrangement. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25, and a guide groove adapted to the guide rail is provided on the hole position detection member 24, and the guide rail and the guide groove are movably plug-connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with a mounting hole 27 on the semiconductor component 10.

[0051] During the inspection operation of the semicircular semiconductor part 10, the semiconductor part 10 is installed in the loading slot 2 on the base 1 with the opening facing upwards. The support rollers 9 at the bottom of the loading slot 2 support the semiconductor part 10, which reduces the contact area of ​​the outer surface of the semiconductor part 10 and helps reduce the risk of scratches. Then push the push plate 4 so that one end of the semiconductor part 10 is close to the reference surface 3, and the other end of the semiconductor part 10 is close to the push plate 4. The length of the semiconductor part 10 can be indirectly measured by the distance moved by the push plate 4. After the semiconductor part 10 is loaded in place, the positioning balance bar 7 contacts the two side edges of the opening of the semiconductor part 10. At this time, the positioning balance bar 7 is in a horizontal position, and the two side edges of the opening of the semiconductor part 10 are on the same horizontal plane. In other words, the semiconductor part 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the position accuracy of the mounting hole 27 meets the requirements.

[0052] The positioning balance bar 7 is flipped downward and pressed to the upper opening of the semiconductor part 10, and the positioning balance bar 7 contacts the edges of both sides of the opening of the semiconductor part 10 to ensure that the profiling semicircular plate 8 is coaxial with the semiconductor part 10, and then the profiling semicircular plate 8 is flipped downward, and the radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. The profiling semicircular plate 8 flips downward and touches the inner wall of the semiconductor part 10 and stops rotating. By observing the angle of the profiling semicircular plate 8, it is judged whether the inner diameter of the semiconductor part 10 meets the requirements. If the angle of rotation of the profiling semicircular plate 8 is within the set angle range, it is determined that the inner diameter of the semiconductor part 10 meets the detection requirements.

[0053] When the roundness of the outer wall of the semiconductor part 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor part 10 to rotate. If the roundness error of the outer wall of the semiconductor part 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of the semiconductor part 10. At this time, the angle measuring rod 22 is pushed and deflected by the friction force. Therefore, it is possible to judge whether the roundness of the outer wall of the semiconductor part 10 meets the requirements by observing the deflection angle of the angle measuring rod 22.

[0054] Embodiment 3: A semicircular semiconductor parts inspection tool (see Figure 4), including a base 1, the base 1 is in a long strip structure, a loading slot 2 is provided on the base 1, the loading slot 2 is arranged on the upper surface of the base 1, the loading slot 2 is in a semicircular structure, a reference surface 3 is provided at one end of the loading slot 2, and a push plate 4 is installed on the other end of the loading slot 2, the push plate 4 is also in a semicircular structure, the push plate 4 is connected to the push rod 5, the push rod 5 is provided with a length scale line 6, and the push rod 5 is movably connected with the base 1. The push plate 4 is pushed to move by the push rod 5, so as to realize the pushing of the semiconductor part 10. The push rod 5 is provided with a length scale line 6, which is convenient for measuring the length of the semiconductor part 10. An insertion hole is provided on the side of the loading slot 2 opposite to the reference surface 3, and the push rod 5 is plug-in-connected with the insertion hole. A flange is provided at the end of the push rod 5, and the flange plays a limiting role on the push rod 5 to prevent the push rod 5 from moving too far.

[0055] The base 1 is rotatably connected to the positioning balance bar 7, and a contoured semicircular plate 8 is rotatably installed on the positioning balance bar 7. At least one pair of support rollers 9 is installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are arranged, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The loading groove 2 is loaded with a semiconductor part 10, and the semiconductor part 10 is supported on the support roller 9. The positioning balance bar 7 is pressed on the open end of the semiconductor part 10, and the push plate 4 is pressed on the end of the semiconductor part 10.

[0056] A rotatable support shaft 11 is installed on the base 1, and two connecting rods 12 are rotatably connected to the support shaft 11. The two connecting rods 12 are respectively connected to the two ends of the support shaft, and the two connecting rods 12 are respectively tightly connected to the two positioning balance rods 7. The profiling semicircular plate 8 is rotatably installed in the middle of the positioning balance rod 7. A rotating shaft 13 is arranged on the support shaft 11, and the rotating shaft 13 is rotatably installed on the base 1, and the rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor part 10. The rotating shaft 13 is arranged in the middle of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly, and the rotation axis of the profiling semicircular plate 8 intersects the axis of the semiconductor part 10 perpendicularly.

[0057] A downwardly recessed avoidance groove 14 is arranged on the surface of the base 1 corresponding to the supporting shaft 11, and two supports 15 are arranged on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes, and both ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The avoidance groove 14 is placed between the two supports 15, and the depth of the avoidance groove 14 gradually increases from the middle to both ends.

[0058] A limit block 16 that is arranged to slide laterally is installed on the base 1. A slide seat is arranged on the base 1 corresponding to the limit block 16. A slide groove is arranged on the slide seat. A slider is arranged at the bottom of the limit block 16. The slider is slidably connected to the slide groove. The slider and the slide groove are both isosceles trapezoidal structures. Two limit parts 17 are arranged on the limit block 16. The two limit parts 17 are respectively placed on both sides of the rotation center of the supporting shaft 11. A guide surface 18 and a limit surface 19 are arranged on the limit part 17. The guide surface 18 is inclined, and the two limit surfaces 19 respectively support and limit the supporting shaft 11 on both sides of the rotation center.

[0059] The setting of the limit block 16 enables the support shaft 11 to rotate and lock in position. When the limit block 16 moves away from the support shaft 11, the limit surface 19 separates from the support shaft 11, and the limit block 16 loses the limit on the support shaft 11. At this time, the support shaft 11 can rotate. When the limit block 16 moves toward the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limit surface 19. At this time, the support shaft 11 is in a horizontal state and cannot rotate, which is convenient for the detection of the mounting hole 27.

[0060] The radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor component 10 . The outer wall of the positioning balance bar 7 is provided with deflection scale lines 20 , which are arranged circumferentially. The profiling semicircular plate 8 is provided with a pointer 21 , which points to the deflection scale lines 20 .

[0061] An angle measuring rod 22 is installed at the bottom of the loading tank 2. The angle measuring rod 22 is rotatably arranged. The distance a between the outer wall of the loading tank 2 and the circumferential contour line of the semiconductor component 10 is lower than that of the outer wall of the semiconductor component 10. a is the maximum allowable error value of the roundness of the outer wall of the semiconductor component 10. An angle scale line 23 is arranged between the base 1 and the angle measuring rod 22. The angle scale line 23 is arranged circumferentially on the side wall of the base 1. An alignment line is arranged on the angle measuring rod 22. The alignment line is aligned with the angle scale line 23.

[0062] A hole position detection member 24 is mounted on the base 1, and a detection block 25 is provided on the hole position detection member 24 for sliding arrangement. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25, and a guide groove adapted to the guide rail is provided on the hole position detection member 24, and the guide rail and the guide groove are movably plug-connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with a mounting hole 27 on the semiconductor component 10.

[0063] Both ends of the positioning balance bar 7 are equipped with spring blocks 28, and a buffer spring 29 is installed between the spring block 28 and the positioning balance bar 7. Both ends of the positioning balance bar 7 are provided with connecting grooves 30, and the upper part of the spring block 28 and the buffer spring 29 are installed in the connecting grooves 30. The end of the positioning balance bar 7 is connected to a positioning plug 31, and the buffer spring 29 abuts between the positioning plug 31 and the spring block 28. The lower parts of the opposing surfaces of the two spring blocks 28 are provided with push surfaces 32, and the two push surfaces 32 are inclined from top to bottom in a direction away from each other, and the positioning balance bar 7 is provided with outer diameter scale lines along the length direction.

[0064] When the positioning balance bar 7 is pressed down to the opening end of the semiconductor component 10 , the outer edge of the opening end of the semiconductor component 10 abuts against the pushing surface 32 , thereby pushing the spring block 28 to move, and the outer diameter of the semiconductor component 10 is indirectly measured by the moving distance of the spring block 28 .

[0065] During the inspection operation of the semicircular semiconductor part 10, the semiconductor part 10 is installed in the loading slot 2 on the base 1 with the opening facing upwards. The support rollers 9 at the bottom of the loading slot 2 support the semiconductor part 10, which reduces the contact area of ​​the outer surface of the semiconductor part 10 and helps reduce the risk of scratches. Then push the push plate 4 so that one end of the semiconductor part 10 is close to the reference surface 3, and the other end of the semiconductor part 10 is close to the push plate 4. The length of the semiconductor part 10 can be indirectly measured by the distance moved by the push plate 4. After the semiconductor part 10 is loaded in place, the positioning balance bar 7 contacts the two side edges of the opening of the semiconductor part 10. At this time, the positioning balance bar 7 is in a horizontal position, and the two side edges of the opening of the semiconductor part 10 are on the same horizontal plane. In other words, the semiconductor part 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the position accuracy of the mounting hole 27 meets the requirements.

[0066] The positioning balance bar 7 is flipped downward and pressed to the upper opening of the semiconductor part 10, and the positioning balance bar 7 contacts the edges of both sides of the opening of the semiconductor part 10 to ensure that the profiling semicircular plate 8 is coaxial with the semiconductor part 10, and then the profiling semicircular plate 8 is flipped downward, and the radius of the profiling semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. The profiling semicircular plate 8 flips downward and touches the inner wall of the semiconductor part 10 and stops rotating. By observing the angle of the profiling semicircular plate 8, it is judged whether the inner diameter of the semiconductor part 10 meets the requirements. If the angle of rotation of the profiling semicircular plate 8 is within the set angle range, it is determined that the inner diameter of the semiconductor part 10 meets the detection requirements.

[0067] When the roundness of the outer wall of the semiconductor part 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor part 10 to rotate. If the roundness error of the outer wall of the semiconductor part 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of the semiconductor part 10. At this time, the angle measuring rod 22 is pushed and deflected by the friction force. Therefore, it is possible to judge whether the roundness of the outer wall of the semiconductor part 10 meets the requirements by observing the deflection angle of the angle measuring rod 22.

[0068] Embodiment 4: A semicircular semiconductor parts inspection tool (see Figure 5 , Figure 6), including a base 1, the base 1 is in a long strip structure, a loading slot 2 is provided on the base 1, the loading slot 2 is arranged on the upper surface of the base 1, the loading slot 2 is in a semicircular structure, a reference surface 3 is provided at one end of the loading slot 2, and a push plate 4 is installed on the other end of the loading slot 2, the push plate 4 is also in a semicircular structure, the push plate 4 is connected to the push rod 5, the push rod 5 is provided with a length scale line 6, and the push rod 5 is movably connected with the base 1. The push plate 4 is pushed to move by the push rod 5, so as to realize the pushing of the semiconductor part 10. The push rod 5 is provided with a length scale line 6, which is convenient for measuring the length of the semiconductor part 10. An insertion hole is provided on the side of the loading slot 2 opposite to the reference surface 3, and the push rod 5 is plug-in-connected with the insertion hole. A flange is provided at the end of the push rod 5, and the flange plays a limiting role on the push rod 5 to prevent the push rod 5 from moving too far.

[0069] The base 1 is rotatably connected to the positioning balance bar 7, and a contoured semicircular plate 8 is rotatably installed on the positioning balance bar 7. At least one pair of support rollers 9 is installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are arranged, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The loading groove 2 is loaded with a semiconductor part 10, and the semiconductor part 10 is supported on the support roller 9. The positioning balance bar 7 is pressed on the open end of the semiconductor part 10, and the push plate 4 is pressed on the end of the semiconductor part 10.

[0070] A rotatable support shaft 11 is installed on the base 1, and two connecting rods 12 are rotatably connected to the support shaft 11. The two connecting rods 12 are respectively connected to the two ends of the support shaft, and the two connecting rods 12 are respectively tightly connected to the two positioning balance rods 7. The profiling semicircular plate 8 is rotatably installed in the middle of the positioning balance rod 7. A rotating shaft 13 is arranged on the support shaft 11, and the rotating shaft 13 is rotatably installed on the base 1, and the rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor part 10. The rotating shaft 13 is arranged in the middle of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly, and the rotation axis of the profiling semicircular plate 8 intersects the axis of the semiconductor part 10 perpendicularly.

[0071] A downwardly recessed avoidance groove 14 is arranged on the surface of the base 1 corresponding to the supporting shaft 11, and two supports 15 are arranged on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes, and both ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The avoidance groove 14 is placed between the two supports 15, and the depth of the avoidance groove 14 gradually increases from the middle to both ends.

[0072] A limit block 16 that is arranged to slide laterally is installed on the base 1. A slide seat is arranged on the base 1 corresponding to the limit block 16. A slide groove is arranged on the slide seat. A slider is arranged at the bottom of the limit block 16. The slider is slidably connected to the slide groove. The slider and the slide groove are both isosceles trapezoidal structures. Two limit parts 17 are arranged on the limit block 16. The two limit parts 17 are respectively placed on both sides of the rotation center of the supporting shaft 11. A guide surface 18 and a limit surface 19 are arranged on the limit part 17. The guide surface 18 is inclined, and the two limit surfaces 19 respectively support and limit the supporting shaft 11 on both sides of the rotation center.

[0073] The setting of the limit block 16 enables the support shaft 11 to rotate and lock in position. When the limit block 16 moves away from the support shaft 11, the limit surface 19 separates from the support shaft 11, and the limit block 16 loses the limit on the support shaft 11. At this time, the support shaft 11 can rotate. When the limit block 16 moves toward the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limit surface 19. At this time, the support shaft 11 is in a horizontal state and cannot rotate, which is convenient for the detection of the mounting hole 27.

[0074] An angle measuring rod 22 is installed at the bottom of the loading tank 2. The angle measuring rod 22 is rotatably arranged. The distance a between the outer wall of the loading tank 2 and the circumferential contour line of the semiconductor component 10 is lower than that of the outer wall of the semiconductor component 10. a is the maximum allowable error value of the roundness of the outer wall of the semiconductor component 10. An angle scale line 23 is arranged between the base 1 and the angle measuring rod 22. The angle scale line 23 is arranged circumferentially on the side wall of the base 1. An alignment line is arranged on the angle measuring rod 22. The alignment line is aligned with the angle scale line 23.

[0075] A hole position detection member 24 is mounted on the base 1, and a detection block 25 is provided on the hole position detection member 24 for sliding arrangement. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25, and a guide groove adapted to the guide rail is provided on the hole position detection member 24, and the guide rail and the guide groove are movably plug-connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with a mounting hole 27 on the semiconductor component 10.

[0076] Both ends of the positioning balance bar 7 are equipped with spring blocks 28, and a buffer spring 29 is installed between the spring block 28 and the positioning balance bar 7. Both ends of the positioning balance bar 7 are provided with connecting grooves 30, and the upper part of the spring block 28 and the buffer spring 29 are installed in the connecting grooves 30. The end of the positioning balance bar 7 is connected to a positioning plug 31, and the buffer spring 29 abuts between the positioning plug 31 and the spring block 28. The lower parts of the opposing surfaces of the two spring blocks 28 are provided with push surfaces 32, and the two push surfaces 32 are inclined from top to bottom in a direction away from each other, and the positioning balance bar 7 is provided with outer diameter scale lines along the length direction.

[0077] When the positioning balance bar 7 is pressed down to the opening end of the semiconductor component 10 , the outer edge of the opening end of the semiconductor component 10 abuts against the pushing surface 32 , thereby pushing the spring block 28 to move, and the outer diameter of the semiconductor component 10 is indirectly measured by the moving distance of the spring block 28 .

[0078] The outer edge of the profiling semicircular plate 8 is matched with the inner wall of the semiconductor component 10. A piston cylinder 33 is installed on the profiling semicircular plate 8. A large piston 34 and a return spring 35 are installed in the piston cylinder 33. The large piston 34 is connected to a contact rod 36. The return spring 35 abuts on the large piston 34. The contact rod 36 radially extends out of the outer edge of the profiling semicircular plate 8 by a length b, and b is the maximum allowable error value of the inner diameter of the semiconductor component 10; the piston cylinder 33 is connected to a small flow channel 37, and a small piston 38 and a return spring 39 are installed in the small flow channel 37. The diameter of the small piston 38 is much smaller than the diameter of the large piston 34. Hydraulic oil is loaded in the piston cylinder 33, and the small piston 38 is connected to a stroke amplification rod 40. The return spring 39 abuts on the small piston 38. A conductive contact piece 41 is installed in the small flow channel 37, and the conductive contact piece 41 is connected to the indicator light circuit. The stroke amplification rod 40 moves to touch the conductive contact piece 41 to light up the indicator light. A wiring ring 42 is provided at the end of the small flow channel 37 , and two conductive contacts 41 are installed on the inner wall of the wiring ring 42 . A circle of conductive ring 43 is provided on the outer wall of the end of the stroke amplification rod 40 , and the conductive ring 43 is provided close to the conductive contact 41 .

[0079] During the inspection operation of the semicircular semiconductor part 10, the semiconductor part 10 is installed in the loading slot 2 on the base 1 with the opening facing upwards. The support rollers 9 at the bottom of the loading slot 2 support the semiconductor part 10, which reduces the contact area of ​​the outer surface of the semiconductor part 10 and helps reduce the risk of scratches. Then push the push plate 4 so that one end of the semiconductor part 10 is close to the reference surface 3, and the other end of the semiconductor part 10 is close to the push plate 4. The length of the semiconductor part 10 can be indirectly measured by the distance moved by the push plate 4. After the semiconductor part 10 is loaded in place, the positioning balance bar 7 contacts the two side edges of the opening of the semiconductor part 10. At this time, the positioning balance bar 7 is in a horizontal position, and the two side edges of the opening of the semiconductor part 10 are on the same horizontal plane. In other words, the semiconductor part 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the position accuracy of the mounting hole 27 meets the requirements.

[0080] When the inner diameter of the semiconductor part 10 is detected, the positioning balance bar 7 is turned down and pressed to the upper opening of the semiconductor part 10. The positioning balance bar 7 contacts the edges of the opening of the semiconductor part 10 on both sides to ensure that the profiling semicircular plate 8 is coaxial with the semiconductor part 10. Then the profiling semicircular plate 8 is turned down. If the profiling semicircular plate 8 cannot rotate over the inner bottom surface of the semiconductor part 10, it means that the inner diameter of the semiconductor part 10 does not meet the requirements. If the profiling semicircular plate 8 can rotate over the inner bottom surface of the semiconductor part 10 and the touch rod 36 can touch the inner bottom surface of the semiconductor part 10, the touch rod 36 pushes the large piston 34 to move, and the medium in the piston cylinder 33 flows into the small flow channel 37 and drives the small piston 38 to move. Since the area of ​​the large piston 34 is much larger than the area of ​​the small piston 38, the distance moved by the small piston 38 is magnified, and the stroke amplification rod 40 moves to touch the conductive contact sheet 41 to light up the indicator light, indicating that the inner diameter of the semiconductor part 10 meets the requirements.

[0081] When the roundness of the outer wall of the semiconductor part 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor part 10 to rotate. If the roundness error of the outer wall of the semiconductor part 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of the semiconductor part 10. At this time, the angle measuring rod 22 is pushed and deflected by the friction force. Therefore, it is possible to judge whether the roundness of the outer wall of the semiconductor part 10 meets the requirements by observing the deflection angle of the angle measuring rod 22.

[0082] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. A semicircular semiconductor parts inspection tool, characterized in that: The invention comprises a base, a loading slot is arranged on the base, a reference surface is arranged at one end of the loading slot, a push plate which is movably arranged is installed at the other end of the loading slot, the base is rotatably connected to a positioning balance bar, a contoured semicircular plate is rotatably installed on the positioning balance bar, at least one pair of supporting rollers is installed at the bottom of the loading slot, semiconductor parts are loaded in the loading slot, the semiconductor parts are supported on the supporting rollers, the positioning balance bar is pressed on the open end of the semiconductor parts, and the push plate is pressed on the end of the semiconductor parts.

2. A semicircular semiconductor parts detection tool according to claim 1, characterized in that: The push plate is connected to the push rod, a length scale line is arranged on the push rod, and the push rod is movably plug-in connected to the base.

3. A semicircular semiconductor parts detection tool according to claim 1, characterized in that: A hole position detection piece is installed on the base, a detection block is slidably arranged on the hole position detection piece, and a detection pin is arranged on the detection block, and the detection pin is aligned with the installation hole on the semiconductor part.

4. A semicircular semiconductor parts detection tool as claimed in claim 1, characterized in that: A rotatably arranged supporting shaft is installed on the base, a connecting rod is rotatably connected on the supporting shaft, and the connecting rod is tightly connected with the positioning balance rod.

5. A semicircular semiconductor parts detection tool as claimed in claim 4, characterized in that: A limit block which is arranged to slide laterally is installed on the base, and two limit parts are arranged on the limit block, and the two limit parts are respectively arranged on both sides of the rotation center of the supporting shaft. A guide surface and a limit surface are arranged on the limit part, and the guide surface is arranged to be inclined. The two limit surfaces respectively support and limit the supporting shaft on both sides of the rotation center.

6. A semicircular semiconductor parts detection tool as claimed in claim 4, characterized in that: An angle measuring stick is installed at the bottom of the loading slot. The distance between the outer wall of the loading slot and the circumferential contour line of the semiconductor part is a, and a is the maximum allowable roundness error value.

7. A semicircular semiconductor parts detection tool as claimed in claim 4, characterized in that: A downwardly recessed avoidance groove is arranged on the surface of the base corresponding to the supporting shaft.

8. A semicircular semiconductor parts detection tool as claimed in claim 4, characterized in that: A rotating shaft is arranged on the supporting shaft, and the rotating shaft is rotatably mounted on the base, and the rotating axis of the rotating shaft is parallel to the axis of the semiconductor component.

9. The semicircular semiconductor parts detection tool according to claim 1 is characterized in that: Spring blocks are installed at both ends of the positioning balance rod, and a buffer spring is installed between the spring block and the positioning balance rod. Push surfaces are set at the lower parts of the opposing surfaces of the two spring blocks. The two push surfaces are inclined from top to bottom in a direction away from each other. An outer diameter scale line is set along the length direction of the positioning balance rod.

10. A semicircular semiconductor parts inspection tool according to any one of claims 1 to 9, characterized in that: A piston cylinder is installed on the profiling semicircular plate, a large piston is installed in the piston cylinder, the large piston is connected to a contact rod, the length of the contact rod radially extending from the outer edge of the profiling semicircular plate is b, and b is the maximum allowable error value of the inner diameter; the piston cylinder is connected to a small flow channel, a small piston is installed in the small flow channel, the small piston is connected to a stroke amplification rod, a conductive contact piece is installed in the small flow channel, the conductive contact piece is connected to an indicator light circuit, and the stroke amplification rod moves to touch the conductive contact piece to light up the indicator light.

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