Personalized data processing method of wafer-level chip and related equipment
By a method of obtaining personalized data during the wafer probe testing phase and analyzing personalized data in the finished product testing phase, the problem of efficient and safe writing of personalized data is solved, reducing testing costs and improving efficiency.
Patent Information
- Application Number
- CN202411911144.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-04-18
AI Technical Summary
During the testing of wafer-level chips, how to write personalized data efficiently and safely to avoid increasing testing costs and time?
Personalized information in the preset format is obtained during the wafer probe testing phase, and the on-chip operating system analyzes and outputs personalized data to the target storage area according to the preset analysis rules during the finished product testing phase.
During the finished product testing phase, no third parties need to write personalized data through the on-chip operating system, which reduces security monitoring steps, reduces testing costs, and improves testing efficiency.
Smart Images
Figure CN119848924A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of chip technology, and in particular to the field of wafer-level chip testing, and specifically to a personalized data processing method for a wafer-level chip and related equipment. Background Art
[0002] Wafer-level chip testing includes wafer probe testing (Chip Probing, CP testing) and finished product testing (Final Test, FT testing). With the development of chip technology, chip testing is participated by multiple parties. The CP testing stage is implemented by chip manufacturers, and the FT testing stage is implemented by a third party.
[0003] The chip's personalized data is read and written through the chip operating system (COS) during the FT test phase and participates in the FT test. Since personalized data involves the chip's privacy data, when written by a third party during the FT test phase, strict security monitoring measures need to be configured to prevent personalized data leakage.
[0004] However, the above method increases the test cost and test time in the FT test phase, and how to write personalized data efficiently and securely becomes an urgent problem to be solved. Summary of the invention
[0005] The purpose of the present invention is to provide a personalized data processing method for a wafer-level chip and related equipment, which can efficiently and safely write personalized data during the testing process of the wafer-level chip.
[0006] According to a first aspect of the present invention, a personalized data processing method for a wafer-level chip is provided, comprising:
[0007] The wafer probe test phase obtains personalized information in a preset format through a test interface;
[0008] In the finished product testing stage after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, and the preset parsing rules are used to parse the data in the preset format;
[0009] The personalized data is output to a target storage area.
[0010] According to a second aspect of the present invention, there is provided a personalized data processing device for a wafer-level chip, comprising:
[0011] A writing module, used to obtain personalized information in a preset format through a test interface during a wafer probe test phase;
[0012] A parsing module, used in the finished product testing phase after chip packaging, wherein the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, wherein the preset parsing rules are used to parse the data in the preset format;
[0013] The output module is used to output the personalized data to a target storage area.
[0014] According to a third aspect of the present invention, there is provided an electronic device, the electronic device comprising:
[0015] at least one processor; and
[0016] a memory communicatively connected to the at least one processor; wherein,
[0017] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the personalized data processing method for wafer-level chips described in any embodiment.
[0018] According to a fourth aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the personalized data processing method for wafer-level chips described in any embodiment of the present invention when executed.
[0019] The technical solution provided by the present invention is that personalized information in a preset format is obtained through a test interface during the wafer probe test phase; during the finished product test phase after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, and the preset parsing rules are used to parse the data in the preset format; and the personalized data is output to a target storage area. Compared with the current practice of a third party writing personalized data through COS during the FT test phase, the technical solution provided by the embodiment of the present invention can write personalized information in a preset format during the CP test phase. After the CP test is completed and the chip is packaged, the FT test phase is entered. During the FT test phase, since the personalized information has been written to the chip during the CP test phase, the on-chip operating system COS parses the personalized information according to the preset parsing rules to obtain personalized data. The stored personalized information in the preset format is parsed according to the preset parsing rules to obtain personalized data, so there is no need for a third party to write personalized data through COS during the FT test phase. Avoiding the detection of the security of personalized data through security monitoring and other methods during the FT test phase reduces the cost of FT testing. For the FT test phase, there is no need to write personalized data through COS, and the step of writing personalized data through the COS interface is omitted, thereby reducing the FT test time and improving the test efficiency of the FT test phase.
[0020] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 It is a flowchart of a personalized data processing method for a wafer-level chip provided by an embodiment of the present invention;
[0023] Figure 2 is a flow chart of another wafer-level chip personalized data processing method provided by an embodiment of the present invention;
[0024] Figure 3 is a schematic diagram of the structure of a personalized data processing device for a wafer-level chip provided by an embodiment of the present invention;
[0025] Figure 4 It is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0026] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0028] Wafer-level chip testing includes wafer probe testing (Chip Probing, CP testing) and finished product testing (Final Test, FT testing). With the development of chip technology, chip testing is participated by multiple parties. The CP testing stage is implemented by chip manufacturers, and the FT testing stage is implemented by a third party.
[0029] The chip's personalized data is read and written through the chip operating system (COS) during the FT test phase and participates in the FT test. Since personalized data involves the user's privacy data, such as keys in transportation card applications, issuer application data, and cardholder data, etc. Therefore, when a third party writes during the FT test phase, strict security monitoring measures need to be configured to prevent personalized data leakage. The above method increases the test cost and test time during the FT test phase. How to write personalized data efficiently and securely has become an urgent problem to be solved.
[0030] Figure 1 The process diagram of the personalized data processing method of wafer-level chip provided by the embodiment of the present invention is as follows Figure 1 This embodiment is applicable to the case where personal user data is quickly and securely written during the test process of a wafer-level chip, especially in the case where personal user data is quickly and securely written during the CP test and FT test of the chip and the chip test is performed. The method can be executed by a personalized data processing device for a wafer-level chip, and the personalized data processing device for a wafer-level chip can be implemented in the form of hardware and / or software. The method includes:
[0031] Step S101 : During the wafer probe test phase, personalized information in a preset format is obtained through a test interface.
[0032] During the wafer probe test (CP test) phase, a test interface is configured. The test interface is a reserved interface for communicating with embedded software to achieve data transmission and control. The wafer-level chip can receive test data sent from the test terminal through the test interface, and the test data may include the test code of the CP test phase and related data required for the test. In addition, personalized information in a preset format can also be obtained through the test interface.
[0033] The personalized data may be personalized data specific to each chip, such as the chip identification, a virtual user identification for testing, etc. The specific content of the personalized data may be configured according to the chip usage scenario and test requirements, and is not limited here.
[0034] The preset format can be TLV format or other formats. The chip manufacturer can determine the data structure of the preset format by agreeing with the third party that performs the FT test. Generate personalized information containing personalized data according to the data structure. Generate personalized information in the preset format through the test terminal, and write the personalized information in the preset format into the chip during the CP stage. You can agree on personalized information with different data structures with multiple third parties that perform the FT test, or you can agree on the same preset format with different third parties.
[0035] Optionally, the personalized information in the preset format includes: label data, length data and value data; the label data is used to identify the personalized information, the length data is used to record the total length of the personalized information, the value data includes segmented label data, segment length data and segment value data of multiple segmented data, and the segmented data includes: personalized information check value, personalized data, personalized data check value and end symbol.
[0036] Exemplarily, the preset format can be a TLV format. TLV (Tag-Length-Value) format is a data serialization format used to perform payload encoding on data such as personalized data and verification data. The TLV format consists of three basic parts: tag data (Tag), length data (Length) and value data (Value). Tag data can be used to identify the type or meaning of a field. In an embodiment of the present application, tag data is used to identify personalized information. Length data (Length) can represent the length of value data (Value), and value data (Value) is actual data content, such as personalized data.
[0037] Table 1 is a schematic diagram of the data structure of TLV data provided by an embodiment of the present invention. As shown in Table 1, the personalized information includes tag data, length data and value data. Among them, the tag data is the identifier of the personalized information, and the length data is the length of the value data or the length of the personalized data.
[0038] Table 1
[0039]
[0040]
[0041] Exemplarily, the label data "95" is used to indicate that the structure is used to identify personalized information. The chip receives a data packet through the test interface. If the label data in the data packet is "95", the data packet is identified as personalized information. The length data is "N", indicating that the data length of the personalized information is N, occupying N storage units of the storage space, and the storage unit can be a bit or a position. The segmented label data includes a "9A" segmentation label for representing a cyclic redundancy check code of the personalized information, a "9B" segmentation label for representing personalized data, a "9C" segmentation label for representing a personalized data check code, and a segmentation label "9D" for representing an end bit. Optionally, the above-mentioned cyclic redundancy check code can be a 32-bit cyclic redundancy check code (Cyclic Redundancy Check, CRC32). The cyclic redundancy check code of the personalized information is calculated from the content of the personalized data and the personalized data check code.
[0042] The above implementation method can store personalized information through data in TLV format, and the personalized data can be accurately described and recorded according to the TLV format, thereby improving the security of personalized data. During the FT test phase, different third parties can parse the stored personalized information through COS according to the decoding rules of the TLV format. The unified decoding of personalized information is achieved through the TLV format, thereby improving the decoding efficiency of personalized information.
[0043] Optionally, the personalized data includes multiple personalized sub-data; the personalized sub-data includes a sub-data tag value, a sub-data length value and a sub-data value of the personalized sub-data; the personalized data verification value includes multiple sub-data verification values; the sub-data verification value includes sub-data verification tag values, sub-data verification length values and sub-data verification values of multiple sub-data.
[0044] Table 2 is a schematic diagram of the data structure of personalized sub-data provided in an embodiment of the present invention. As shown in Table 2, the personalized data includes a sub-data tag value, a sub-data length value, and a sub-data value.
[0045] Table 2
[0046]
[0047] Wherein, illustratively, the personalized sub-data includes 01-0F sub-data, each of which has a sub-data tag value, a sub-data length value and a sub-data value. illustratively, the sub-data tag value of a certain sub-data is "01", the sub-data length value is "x1", and the sub-data value is "ax". In Table 2, "x1"-"xn" are integers representing the length. "ax"-"nx" are the data content of the sub-data.
[0048] Table 3 is a schematic diagram of the data structure of the sub-data check value provided in an embodiment of the present invention. As shown in Table 3, the sub-data check value includes a sub-data check tag value, a sub-data check length value and a sub-data check value.
[0049] Table 3
[0050]
[0051]
[0052] Wherein, illustratively, the personalized data check value includes 01-0F sub-data check data, and each sub-data check data includes a sub-data check tag value, a sub-data check length value, and a sub-data check value. Exemplarily, the sub-data check tag value of a sub-data check value is "01", the sub-data check length value is "2", and the sub-data check value is "ay". In Table 3, "ay"-"ny" are sub-data check values.
[0053] The above implementation can store multiple personalized sub-data through TLV, and each sub-data corresponds to a data item of personalized data. When personalized data contains multiple data items, the data structure of the above sub-data can accurately express the sub-data while saving storage space, thereby improving the storage efficiency of personalized data.
[0054] Optionally, during the wafer probe test phase, obtaining personalized information in a preset format through a test interface may be implemented as follows:
[0055] The wafer probe test phase receives data input instructions through the test interface, and the input instructions include personalized information in a preset format.
[0056] The command structure that the chip can recognize in the CT stage is known. The input instruction that the chip can recognize in the CP stage is generated according to the personalized data and the personalized data verification data. The input instruction is input to the chip, and the chip recognizes the input instruction to obtain personalized information, which can be data encoded in TLV format.
[0057] The above implementation can quickly write personalized information in a preset format through data input instructions that can be recognized by the test interface during the CP stage, thereby improving the efficiency of writing personalized information.
[0058] Step S102, in the finished product testing phase after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, and the preset parsing rules are used to parse the data in the preset format.
[0059] In the FT test phase, there is no need to import personalized data. COS parses the personalized information according to preset parsing rules. The preset parsing rules can be a parsing algorithm agreed in advance with the chip manufacturer, or a parsing algorithm for parsing a unified preset format, such as a parsing algorithm for parsing the TLV format.
[0060] Optionally, the on-chip operating system parses the personalized information according to a preset parsing rule to obtain personalized data, which can be implemented in the following manner:
[0061] The on-chip operating system analyzes the personalized information according to preset analysis rules to obtain personalized data and verification data; verifies the personalized data according to the verification data; and obtains personalized data if the verification is successful.
[0062] If the personalized data contains multiple personalized sub-data, the sub-data are verified according to the personalized sub-data check value, and then the personalized information is verified according to the check data of the personalized information. The verification algorithm can be a cyclic redundancy algorithm (CRC). Through the verification interface provided by the embedded software, combined with the cyclic redundancy check code, the verification is performed to detect whether the read personalized data is consistent with the personalized data written in the CP stage. If they are consistent, the verification is successful, and the personalized data is written to the target storage area through the write interface provided by the embedded software.
[0063] The above implementation can verify the personalized data before the FT test, thereby avoiding the problem that the personalized data is accidentally modified in the CP stage, resulting in the FT test stage being unable to execute normally, and improving the reliability of the FT test.
[0064] Step S103: output the personalized data to a target storage area.
[0065] Optionally, in an implementation manner, step S101 stores the personalized information according to a preset format, which may be implemented as: writing the personalized information into a preset storage area according to the preset format.
[0066] The personalized information can be written into a preset storage area. After the personalized information in the preset storage area is parsed to obtain personalized data, step S102 writes the obtained personalized data into the target storage area. The target storage area can be a storage area for storing test data during FT testing. There are multiple target storage areas, and different personalized data (or personalized sub-data) can be stored in different target storage areas for performing FT tests of different functions.
[0067] After outputting the personalized data to the target storage area, the method further includes:
[0068] Testing is performed based on the personalized data in the target storage area.
[0069] The preset storage area is a storage space opened in the CP phase for storing test data. In the FT test phase, COS reads the personalized data in the preset storage area to the target storage area. The target storage area is the storage area used for testing in the FT phase. The preset storage area can be the storage unit of any wafer.
[0070] Optionally, after the personalized data (or personalized sub-data) is output to the target storage area, the on-chip operating system reads the personalized data (or personalized sub-data) in the target storage area to perform an FT test of the corresponding function.
[0071] The on-chip operating system can choose whether to read the personalized data (or personalized sub-data) in the target storage area according to the test requirements. In other words, the on-chip operating system can also perform the FT test without reading the personalized data (or personalized sub-data) according to the requirements.
[0072] The above implementation can read and parse the personalized information from the preset storage area to obtain personalized data, and write the personalized data into the target storage area. The personalized data in different target storage areas can be used to perform different FT tests, thereby improving the test efficiency of the FT test.
[0073] Further, after testing according to the personalized data in the target storage area, the method further includes:
[0074] Deleting the personalized information in the preset storage area; and / or deleting the personalized data in the target storage area.
[0075] The above implementation method can delete personalized data when starting the FT test or after the FT test is finished, thereby preventing useless data from occupying storage space and improving storage space utilization.
[0076] The personalized data processing method of the wafer-level chip provided by the present invention obtains personalized information in a preset format through a test interface during the wafer probe test phase; during the finished product test phase after the chip is packaged, the on-chip operating system parses the personalized information according to a preset parsing rule to obtain personalized data, and the preset parsing rule is used to parse the data in the preset format; and the personalized data is output to a target storage area. Compared with the current practice of a third party writing personalized data through COS during the FT test phase, the personalized data processing method of the wafer-level chip provided by the embodiment of the present invention can write personalized information in a preset format during the CP test phase. After the CP test is completed and the chip is packaged, the FT test phase is entered. During the FT test phase, since the personalized information has been written to the chip during the CP test phase, the on-chip operating system COS parses the personalized information according to the preset parsing rule to obtain personalized data. The stored personalized information in the preset format is parsed according to the preset parsing rule to obtain personalized data, so there is no need for a third party to write personalized data through COS during the FT test phase. Avoiding the detection of the security of personalized data through security monitoring and other methods during the FT test phase reduces the FT test cost. For the FT test phase, there is no need to write personalized data through COS, and the step of writing personalized data through the COS interface is omitted, thereby reducing the FT test time and improving the test efficiency of the FT test phase.
[0077] Figure 2 A schematic diagram of a personalized data processing method for a wafer-level chip provided by an embodiment of the present invention, exemplarily, the method includes:
[0078] Step S201 : During the wafer probe test phase, a data input instruction is received through a test interface, where the input instruction includes personalized information in a preset format.
[0079] Step S202: writing the personalized information into a preset storage area according to a preset format.
[0080] The personalized information in the preset format is data in TLV format. The personalized information includes: tag data, length data and value data.
[0081] The tag data is used to identify personalized information, the length data is used to record the total length of personalized information, the value data includes segment tag data, segment length data and segment value data of multiple segment data, and the segment data includes: personalized information check value, personalized data, personalized data check value and end symbol.
[0082] Further, the personalized data includes multiple personalized sub-data; the personalized sub-data includes a sub-data tag value, a sub-data length value and a sub-data value of the personalized sub-data. The personalized data check value includes multiple sub-data check values; the sub-data check value includes a sub-data check tag value, a sub-data check length value and a sub-data check value of the multiple sub-data.
[0083] Step S203, in the finished product testing phase after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data and verification data.
[0084] The preset parsing rule is used to parse the data in the preset format.
[0085] Step S204: verify the personalized data according to the verification data.
[0086] Step S205: If the verification fails, an error message is given or a prompt indicating that the personal data verification has failed is displayed.
[0087] Step S206: If the verification is successful, the personalized data is obtained.
[0088] Step S207: output the personalized data to the target storage area.
[0089] Step S208: perform FT test.
[0090] The FT test may be performed using the personal data in the target storage area or may be performed without using the personal data in the target storage area.
[0091] Step S209, deleting the personalized information in the preset storage area; deleting the personalized data in the target storage area.
[0092] Figure 3 The structural diagram of the personalized data processing device for wafer-level chips provided by the embodiment of the present invention can be applied to the situation of quickly and securely writing personal user data during the test process of wafer-level chips, especially in the CP test and FT test of the chip, quickly and securely writing personal user data and performing chip testing. The device includes: a writing module 31, a parsing module 32 and a testing module 33.
[0093] A writing module 31 is used to obtain personalized information in a preset format through a test interface during a wafer probe test phase;
[0094] The parsing module 32 is used in the finished product testing stage after chip packaging. The on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data. The preset parsing rules are used to parse the data in the preset format;
[0095] The output module 33 is used to output the personalized data to a target storage area.
[0096] Based on the above implementation, optionally, the parsing module 32 is used to:
[0097] The on-chip operating system analyzes the personalized information according to preset analysis rules to obtain personalized data and verification data;
[0098] Verifying the personalized data according to the verification data;
[0099] If the verification is successful, the personalized data is obtained;
[0100] If the verification fails, an error message will be displayed or a prompt will be given indicating that the personal data verification has failed.
[0101] Based on the above implementation, optionally, the personalized information in the preset format includes:
[0102] Tag data, length data, and value data;
[0103] The label data is used to identify personalized information, the length data is used to record the total length of personalized information, the value data includes segment label data, segment length data and segment value data of multiple segment data, and the segment data includes: personalized information check value, personalized data, personalized data check value and end symbol.
[0104] Based on the above implementation, optionally, the personalized data includes a plurality of personalized sub-data; the personalized sub-data includes a sub-data tag value, a sub-data length value and a sub-data value of the personalized sub-data;
[0105] The personalized data check value includes a plurality of sub-data check values; the sub-data check value includes a plurality of sub-data sub-data check tag values, a sub-data check length value and a sub-data check value.
[0106] Based on the above implementation, optionally, the writing module 31 is used to:
[0107] Writing the personalized information into a preset storage area according to a preset format;
[0108] Accordingly, a test module is also included, which is used to:
[0109] Testing is performed based on the personalized data in the target storage area.
[0110] Based on the above implementation, optionally, a deletion module is further included, and the deletion module is used to:
[0111] Deleting the personalized information in the preset storage area; and / or,
[0112] The personalized data in the target storage area is deleted.
[0113] Based on the above implementation, optionally, the writing module 31 is used to:
[0114] The wafer probe test phase receives data input instructions through the test interface, and the input instructions include personalized information in a preset format.
[0115] The personalized data processing device for wafer-level chips provided by the present invention comprises a writing module 31, which is used to obtain personalized information in a preset format through a test interface during a wafer probe test phase; a parsing module 32, which is used in a finished product test phase after chip packaging, wherein an on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, wherein the preset parsing rules are used to parse the data in the preset format; and an output module 33, which is used to output the personalized data to a target storage area. Compared with the current practice of a third party writing personalized data through COS during the FT test phase, the personalized data processing device for wafer-level chips provided by an embodiment of the present invention can write personalized information in a preset format during the CP test phase. After the CP test is completed and the chip is packaged, the FT test phase is entered. During the FT test phase, since the personalized information has been written to the chip during the CP test phase, the on-chip operating system COS parses the personalized information according to preset parsing rules to obtain personalized data. The stored personalized information in a preset format can be parsed according to the preset parsing rules to obtain personalized data, so there is no need for a third party to write personalized data through COS during the FT test phase. Avoid testing the security of personalized data through security monitoring and other methods during the FT test phase, reducing the FT test cost. For the FT test phase, there is no need to write personalized data through COS, and the step of writing personalized data through the COS interface is omitted, thus reducing the FT test time and improving the test efficiency of the FT test phase.
[0116] The personalized data processing device for wafer-level chips provided in the embodiment of the present invention can execute the personalized data processing method for wafer-level chips provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.
[0117] Figure 41 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. The electronic device 10 is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.
[0118] like Figure 4 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.
[0119] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.
[0120] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a personalized data processing method for a wafer-level chip.
[0121] In some embodiments, the personalized data processing method for wafer-level chips can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the personalized data processing method for wafer-level chips described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the personalized data processing method for wafer-level chips in any other appropriate manner (for example, by means of firmware).
[0122] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems operating systems on a chip (SOCs), programmable logic devices on a load (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.
[0123] The computer program for implementing the personalized data processing method of the wafer-level chip of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or the block diagram are implemented. The computer program can be executed completely on the machine, partially on the machine, partially on the machine as an independent software package and partially on a remote machine, or completely on a remote machine or server.
[0124] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions can be used to enable a processor to execute a personalized data processing method for a wafer-level chip, the method comprising:
[0125] The wafer probe test phase obtains personalized information in a preset format through a test interface;
[0126] In the finished product testing stage after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, and the preset parsing rules are used to parse the data in the preset format;
[0127] The personalized data is output to a target storage area.
[0128] Based on the above implementation, optionally, the on-chip operating system parses the personalized information according to a preset parsing rule to obtain personalized data, including:
[0129] The on-chip operating system analyzes the personalized information according to preset analysis rules to obtain personalized data and verification data;
[0130] Verifying the personalized data according to the verification data;
[0131] If the verification is successful, the personalized data is obtained;
[0132] If the verification fails, an error message will be displayed or a prompt will be given indicating that the personal data verification has failed.
[0133] Based on the above implementation, optionally, the personalized information in the preset format includes:
[0134] Tag data, length data, and value data;
[0135] The label data is used to identify personalized information, the length data is used to record the total length of personalized information, the value data includes segment label data, segment length data and segment value data of multiple segment data, and the segment data includes: personalized information check value, personalized data, personalized data check value and end symbol.
[0136] On the basis of the above implementation, optionally,
[0137] The personalized data includes a plurality of personalized sub-data; the personalized sub-data includes a sub-data tag value, a sub-data length value and a sub-data value of the personalized sub-data;
[0138] The personalized data check value includes a plurality of sub-data check values; the sub-data check value includes a plurality of sub-data sub-data check tag values, a sub-data check length value and a sub-data check value.
[0139] Based on the above implementation, optionally, storing the personalized information according to a preset format includes:
[0140] Writing the personalized information into a preset storage area according to a preset format;
[0141] Accordingly, after outputting the personalized data to the target storage area, the method further includes:
[0142] Testing is performed based on the personalized data in the target storage area.
[0143] Based on the above implementation, optionally, after testing according to the personalized data in the target storage area, the method further includes:
[0144] Deleting the personalized information in the preset storage area; and / or,
[0145] The personalized data in the target storage area is deleted.
[0146] Based on the above implementation, optionally, in the wafer probe test phase, obtaining personalized information in a preset format through a test interface includes:
[0147] The wafer probe test phase receives data input instructions through the test interface, and the input instructions include personalized information in a preset format.
[0148] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0149] To provide interaction with a verification engineer, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the verification engineer; and a keyboard and a pointing device (e.g., a mouse or trackball), through which the verification engineer can provide input to the electronic device. Other types of devices may also be used to provide interaction with the verification engineer; for example, the feedback provided to the verification engineer may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and the input from the verification engineer may be received in any form (including acoustic input, voice input, or tactile input).
[0150] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a verification engineer can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.
[0151] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.
[0152] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.
[0153] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A personalized data processing method for a wafer-level chip, characterized in that: include: The wafer probe test phase obtains personalized information in a preset format through a test interface; In the finished product testing stage after chip packaging, the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, and the preset parsing rules are used to parse the data in the preset format; The personalized data is output to a target storage area.
2. The method according to claim 1, characterized in that The on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, including: The on-chip operating system analyzes the personalized information according to preset analysis rules to obtain personalized data and verification data; Verifying the personalized data according to the verification data; If the verification is successful, the personalized data is obtained; If the verification fails, an error message will be displayed or a prompt will be given indicating that the personal data verification has failed.
3. The method according to claim 2, characterized in that The personalized information in the preset format includes: Tag data, length data, and value data; The label data is used to identify personalized information, the length data is used to record the total length of personalized information, the value data includes segment label data, segment length data and segment value data of multiple segment data, and the segment data includes: personalized information check value, personalized data, personalized data check value and end symbol.
4. The method according to claim 3, characterized in that: The personalized data includes a plurality of personalized sub-data; the personalized sub-data includes a sub-data tag value, a sub-data length value and a sub-data value of the personalized sub-data; The personalized data check value includes a plurality of sub-data check values; the sub-data check value includes a plurality of sub-data sub-data check tag values, a sub-data check length value and a sub-data check value.
5. The method according to claim 1, characterized in that Storing the personalized information according to a preset format includes: Writing the personalized information into a preset storage area according to a preset format; Accordingly, after outputting the personalized data to the target storage area, the method further includes: Testing is performed based on the personalized data in the target storage area.
6. The method according to claim 5, characterized in that After testing according to the personalized data in the target storage area, the method further includes: Deleting the personalized information in the preset storage area; and / or, The personalized data in the target storage area is deleted.
7. The method according to claim 1, characterized in that The wafer probe test phase obtains personalized information in a preset format through the test interface, including: The wafer probe test phase receives data input instructions through the test interface, and the input instructions include personalized information in a preset format.
8. A personalized data processing device for wafer-level chips, characterized in that: include: A writing module, used to obtain personalized information in a preset format through a test interface during a wafer probe test phase; A parsing module, used in the finished product testing phase after chip packaging, wherein the on-chip operating system parses the personalized information according to preset parsing rules to obtain personalized data, wherein the preset parsing rules are used to parse the data in the preset format; The output module is used to output the personalized data to a target storage area.
9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the personalized data processing method for wafer-level chips according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the personalized data processing method for wafer-level chips according to any one of claims 1 to 7 when executed.