Thermal resistance optimization method and system for micro-channel heat exchange module

Abstract

The invention relates to the technical field of heat exchange modules, and provides a thermal resistance optimization method and system for a micro-channel heat exchange module, and the method comprises the steps: constructing a first virtual micro-channel heat exchange module corresponding to the micro-channel heat exchange module; generating a plurality of second virtual micro-channel heat exchange modules corresponding to the first virtual micro-channel heat exchange module based on a preset micro-channel heat exchange module generation method; the micro-channel cross sectional areas of the virtual micro-channel heat exchange modules are different from one another; based on a preset heat exchange performance detection method, the heat exchange performance of each virtual micro-channel heat exchange module is detected; and a target virtual micro-channel heat exchange module is determined in all the virtual micro-channel heat exchange modules based on the heat exchange performance of all the virtual micro-channel heat exchange modules. According to the method, the thermal resistance of the micro-channel heat exchange module is optimized.

Description

Technical Field

[0001] The present application relates to the technical field of heat exchange modules, and in particular to a method and system for optimizing thermal resistance of a microchannel heat exchange module. Background Art

[0002] With the advancement of technology, microchannel heat exchange modules have been widely used in the field of air conditioning due to their compact design, high heat exchange efficiency and low material usage. However, the existing design methods of microchannel heat exchange modules are usually based on human experience. After the design is completed, it is impossible to optimize the thermal resistance of the microchannel heat exchange module. Summary of the invention

[0003] The present application provides a method and system for optimizing the thermal resistance of a microchannel heat exchange module to solve the problems raised by the above-mentioned background technology.

[0004] In a first aspect, the present application provides a method for optimizing thermal resistance of a microchannel heat exchange module, comprising: Constructing a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module; Based on a preset microchannel heat exchange module generation method, a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module are generated; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; For each of the virtual microchannel heat exchange modules, the virtual microchannel heat exchange module is installed in a preset virtual air conditioner to obtain a target virtual air conditioner corresponding to the microchannel heat exchange module, and initial heat exchange performance scores corresponding to the virtual microchannel heat exchange module under each operating condition of the target virtual air conditioner are respectively generated, and a target heat exchange performance score of the virtual microchannel heat exchange module is generated based on each of the initial heat exchange performance scores; A target virtual microchannel heat exchange module is determined among the virtual microchannel heat exchange modules based on the target heat exchange performance score of each virtual microchannel heat exchange module.

[0005] In a possible implementation, the first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module is constructed, including: Acquiring geometric structure information and material information of the microchannel heat exchange module; Constructing a virtual geometric structure of the microchannel heat exchange module based on the geometric structure information, and acquiring target material property information in a database based on the material information; The target material property information is assigned to the virtual geometric structure to obtain the first virtual microchannel heat exchange module.

[0006] In a possible implementation, the method for generating a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generation method includes: Based on a preset finite element segmentation method, finite element segmentation processing is performed on the width of each microchannel gap of the first virtual microchannel heat exchange module, and a plurality of virtual microchannel extension boundary lines are generated in each of the microchannel gaps; For each of the microchannel gaps, if the number of virtual microchannel extension boundary lines in the microchannel gap is an odd number, a virtual microchannel extension boundary line in the middle position is deleted; For each virtual microchannel of the first virtual microchannel heat exchange module, both sides of the virtual microchannel are sequentially expanded from near to far toward a virtual microchannel expansion boundary line close to the virtual microchannel to obtain a plurality of second virtual microchannel heat exchange modules.

[0007] In a possible implementation, generating a target heat exchange performance score of the virtual microchannel heat exchange module based on each of the initial heat exchange performance scores includes: Obtaining an average heat transfer performance score and a standard deviation between the initial heat transfer performance scores; The ratio between the average heat exchange performance score and the standard deviation is determined as the target heat exchange performance score.

[0008] In a possible implementation, generating the initial heat exchange performance score corresponding to the virtual microchannel heat exchange module under each operating condition of the target virtual air conditioner includes: For each of the working conditions, indoor environment parameter information corresponding to the working condition is obtained, and the environmental state of the virtual indoor environment corresponding to the target virtual air conditioner is set based on the indoor environment parameter information corresponding to the working condition; Running the target virtual air conditioner based on the working condition, and acquiring virtual indoor environment parameter information of the virtual indoor environment in real time during the running of the target virtual air conditioner, and recording the target virtual indoor environment parameter information and the target running time when the virtual indoor environment parameter information no longer changes; wherein the target virtual indoor environment parameter information is the virtual indoor environment parameter information corresponding to when the virtual indoor environment parameter information no longer changes, and the target running time is the time corresponding to when the target virtual air conditioner starts running to when the virtual indoor environment parameter information no longer changes; Obtaining standard indoor environmental parameter information and standard operating time corresponding to the working condition in a database; Acquire the similarity between the target virtual indoor environment parameter information and the standard indoor environment parameter information; Calculating a ratio between the standard running time and the target running time; The product of the similarity and the ratio is determined as the initial heat exchange performance score.

[0009] In a second aspect, the present application provides a thermal resistance optimization system for a microchannel heat exchange module, comprising: A construction module, used to construct a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module; A first generating module, used for generating a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generating method; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; The second generating module is used for installing each virtual microchannel heat exchange module in a preset virtual air conditioner, obtaining a target virtual air conditioner corresponding to the microchannel heat exchange module, and respectively generating an initial heat exchange performance score corresponding to the virtual microchannel heat exchange module under each working condition of the target virtual air conditioner, and generating a target heat exchange performance score of the virtual microchannel heat exchange module based on each initial heat exchange performance score; A determination module is used to determine a target virtual microchannel heat exchange module among the virtual microchannel heat exchange modules based on the target heat exchange performance scores of the virtual microchannel heat exchange modules.

[0010] The present application provides a method and system for optimizing the thermal resistance of a microchannel heat exchange module, the method comprising: constructing a first virtual microchannel heat exchange module corresponding to a microchannel heat exchange module; generating multiple second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generation method; the microchannel cross-sectional areas of each of the virtual microchannel heat exchange modules are different; detecting the heat exchange performance of each of the virtual microchannel heat exchange modules based on a preset heat exchange performance detection method; and determining a target virtual microchannel heat exchange module in each of the virtual microchannel heat exchange modules based on the heat exchange performance of each of the virtual microchannel heat exchange modules. The method optimizes the thermal resistance of a microchannel heat exchange module by generating multiple virtual microchannel heat exchange modules with different cross-sectional areas of virtual microchannels, detecting the heat exchange performance of each of the virtual microchannel heat exchange modules based on a preset heat exchange performance detection method, and determining a target virtual microchannel heat exchange module in each of the virtual microchannel heat exchange modules based on the heat exchange performance of each of the virtual microchannel heat exchange modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0012] Figure 1 A schematic flow chart of a method for optimizing the thermal resistance of a microchannel heat exchange module provided in an embodiment of the present application; Figure 2 A schematic structural block diagram of a thermal resistance optimization system for a microchannel heat exchange module provided in an embodiment of the present application; Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change based on actual conditions.

[0015] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0016] It should be further understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0017] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0018] See also Figure 1 , Figure 1 A schematic diagram of a flow chart of a thermal resistance optimization method for a channel heat exchange module provided in an embodiment of the present application, such as Figure 1 As shown, the thermal resistance optimization method of the channel heat exchange module provided in the embodiment of the present application includes steps S1 to S4.

[0019] Step S1, constructing a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module.

[0020] It should be noted that the method provided in this embodiment is used to optimize the thermal resistance of the microchannel heat exchange module of the air conditioner.

[0021] Specifically, step S1 includes the following steps: Acquire geometric structure information and material information of the microchannel heat exchange module; specifically, acquire design drawing information of the microchannel heat exchange module in a database, wherein the design drawing information includes the geometric structure information and the material information; A virtual geometric structure of the microchannel heat exchange module is constructed based on the geometric structure information, and target material property information is obtained in a database based on the material information; specifically, a virtual geometric structure corresponding to the geometric structure information is drawn based on a preset three-dimensional drawing software, and a mapping relationship between each material information and its corresponding material property information is provided in the database, and the material property information includes but is not limited to density, thermal conductivity, tensile strength, specific heat capacity, expansion coefficient, etc., and the three-dimensional drawing software is any one of SolidWorks, 3ds Max, CATIA and TinkerCAD.

[0022] The target material property information is assigned to the virtual geometric structure to obtain the first virtual microchannel heat exchange module.

[0023] Step S2: generating a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generation method; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; Wherein, the virtual microchannel heat exchange module includes the first virtual microchannel heat exchange module and the second virtual microchannel heat exchange module.

[0024] Specifically, step S2 includes the following steps: Based on a preset finite element segmentation method, finite element segmentation processing is performed on the width of each microchannel gap of the first virtual microchannel heat exchange module, and a plurality of virtual microchannel extension boundary lines are generated in each of the microchannel gaps; For each of the microchannel gaps, if the number of virtual microchannel extension boundary lines in the microchannel gap is an odd number, a virtual microchannel extension boundary line in the middle position is deleted; it can be understood that when the number of virtual microchannel extension boundary lines in the microchannel gap is an odd number, deleting a virtual microchannel extension boundary line in the middle position can prevent the widths of the cross sections of two adjacent virtual microchannels from being adjacent when they are extended to the maximum value; For each virtual microchannel of the first virtual microchannel heat exchange module, both sides of the virtual microchannel are sequentially expanded from near to far toward a virtual microchannel expansion boundary line close to the virtual microchannel to obtain a plurality of second virtual microchannel heat exchange modules. Specifically, each time each virtual microchannel of the first virtual microchannel heat exchange module is expanded, each virtual microchannel is expanded to the same size along the virtual microchannel expansion boundary line to both sides.

[0025] It can be understood that this embodiment increases the width of the cross section of each virtual microchannel, which is beneficial to increase the contact area between each virtual microchannel and the air, helps to reduce thermal resistance and improve heat exchange efficiency. However, if the distance between two adjacent virtual microchannels is too close, the fluid will produce large local turbulence or uneven flow in the channel. The uneven flow will cause excessive flow in some channels, while other channels may have dead zones or insufficient flow, affecting the heat exchange efficiency. Step S2 uses the finite element segmentation method to gradually increase the cross-sectional area of ​​each virtual microchannel to generate as many second virtual microchannel heat exchange modules as possible, which is helpful to select the best target virtual microchannel heat exchange module in the subsequent selection.

[0026] Step S3: based on a preset heat exchange performance detection method, respectively detect the heat exchange performance of each of the virtual microchannel heat exchange modules.

[0027] Specifically, step S3 includes the following steps: Obtaining a virtual air conditioner of the air conditioner corresponding to the microchannel heat exchange module in a database; For each of the virtual microchannel heat exchange modules, the virtual microchannel heat exchange module is installed in the virtual air conditioner to obtain a target virtual air conditioner, and a target heat exchange performance score corresponding to the virtual microchannel heat exchange module is generated based on the target virtual air conditioner.

[0028] Wherein, generating a target heat exchange performance score corresponding to the virtual microchannel heat exchange module based on the target virtual air conditioner comprises the following steps: For each operating condition of the target virtual air conditioner, generating an initial heat exchange performance score corresponding to the operating condition based on a preset heat exchange performance scoring method; Obtaining an average heat transfer performance score and a standard deviation between the initial heat transfer performance scores; The ratio between the average heat exchange performance score and the standard deviation is determined as the target heat exchange performance score.

[0029] It can be understood that the above method of generating the target heat exchange performance score corresponding to the virtual microchannel heat exchange module based on the target virtual air conditioner analyzes the initial heat exchange performance score corresponding to each working condition, so that the evaluation does not only rely on a single working condition, but can comprehensively reflect the heat exchange effect under multiple working conditions. This helps to select the best target virtual microchannel heat exchange module in the future and effectively optimize the thermal resistance of the microchannel heat exchange module.

[0030] Wherein, generating the initial heat exchange performance score corresponding to the working condition based on the preset heat exchange performance scoring method comprises the following steps: Acquire indoor environment parameter information corresponding to the working condition, and set the environmental state of the virtual indoor environment corresponding to the target virtual air conditioner based on the indoor environment parameter information corresponding to the working condition; Running the target virtual air conditioner based on the working condition, and acquiring virtual indoor environment parameter information of the virtual indoor environment in real time during the running of the target virtual air conditioner, and recording the target virtual indoor environment parameter information and the target running time when the virtual indoor environment parameter information no longer changes; wherein the target virtual indoor environment parameter information is the virtual indoor environment parameter information corresponding to when the virtual indoor environment parameter information no longer changes, and the target running time is the time corresponding to when the target virtual air conditioner starts running to when the virtual indoor environment parameter information no longer changes; Obtaining standard indoor environmental parameter information and standard operating time corresponding to the working condition in a database; wherein the standard operating time is the time required for the indoor environmental state to change from the indoor environmental parameter information to the standard indoor environmental parameter information under the working condition; Acquire the similarity between the target virtual indoor environment parameter information and the standard indoor environment parameter information; specifically, input the target virtual indoor environment parameter information and the standard indoor environment parameter information into a preset parameter feature extraction model, obtain a first feature vector and a second feature vector, and determine that the cosine value between the first feature vector and the second feature vector is the similarity; Calculating a ratio between the standard running time and the target running time; The product of the similarity and the ratio is determined as the initial heat exchange performance score.

[0031] It can be understood that the above-mentioned method based on preset heat exchange performance scoring generates the initial heat exchange performance score corresponding to the working condition, and forms a comprehensive initial heat exchange performance score by calculating the similarity between the target virtual indoor environment parameters and the standard indoor environment parameters, and combining the ratio of the target operating time to the standard operating time. It effectively combines the similarity of environmental states and the operating efficiency of the air-conditioning system, and can comprehensively and accurately measure the heat exchange performance.

[0032] Step S4: determining a target virtual microchannel heat exchange module among the virtual microchannel heat exchange modules based on the heat exchange performance of the virtual microchannel heat exchange modules.

[0033] Specifically, it is determined that the virtual microchannel heat exchange module corresponding to the maximum target heat exchange performance score is the target virtual microchannel heat exchange module.

[0034] The method provided in this embodiment optimizes the thermal resistance of the microchannel heat exchange module by generating multiple virtual microchannel heat exchange modules with different cross-sectional areas of virtual microchannels, detecting the heat exchange performance of each virtual microchannel heat exchange module based on a preset heat exchange performance detection method, and determining a target virtual microchannel heat exchange module in each virtual microchannel heat exchange module based on the heat exchange performance of each virtual microchannel heat exchange module.

[0035] See also Figure 2 , Figure 2 A schematic block diagram of the structure of a thermal resistance optimization system 100 for a microchannel heat exchange module provided in an embodiment of the present application, as shown in FIG. Figure 2 As shown, the thermal resistance optimization system 100 of the microchannel heat exchange module provided in the embodiment of the present application includes: The construction module 110 is used to construct a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module.

[0036] The generation module 120 is used to generate a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generation method; the microchannel cross-sectional areas of each of the virtual microchannel heat exchange modules are different.

[0037] The detection module 130 is used to detect the heat exchange performance of each of the virtual microchannel heat exchange modules based on a preset heat exchange performance detection method.

[0038] The determination module 140 determines a target virtual microchannel heat exchange module among the virtual microchannel heat exchange modules based on the heat exchange performance of each of the virtual microchannel heat exchange modules.

[0039] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process of the system and each module described above can refer to the process in the aforementioned thermal resistance optimization method embodiment of the channel heat exchange module, and will not be repeated here.

[0040] The thermal resistance optimization system 100 of the channel heat exchange module provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in Figure 3 The system is run on the terminal device 200 shown.

[0041] See also Figure 3 , Figure 3 The present invention provides a schematic block diagram of the structure of a terminal device 200 according to an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0042] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed by the processor 201, the processor 201 can execute any of the above-mentioned thermal resistance optimization methods of the channel heat exchange module.

[0043] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0044] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned thermal resistance optimization methods of the channel heat exchange module.

[0045] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device 200 involved in the scheme of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0046] It should be understood that the processor 201 may be a central processing unit (CPU), and the processor 201 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0047] In some embodiments, the processor 201 is used to run a computer program stored in the memory to implement the following steps: Constructing a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module; Based on a preset microchannel heat exchange module generation method, a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module are generated; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; Based on a preset heat exchange performance detection method, the heat exchange performance of each virtual microchannel heat exchange module is detected respectively; A target virtual microchannel heat exchange module is determined among the virtual microchannel heat exchange modules based on the heat exchange performance of each of the virtual microchannel heat exchange modules.

[0048] It should be noted that technicians in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working process of the terminal device 200 described above can refer to the process of the thermal resistance optimization method of the aforementioned channel heat exchange module, and will not be repeated here.

[0049] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement the thermal resistance optimization method of the channel heat exchange module provided in the embodiment of the present application.

[0050] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped with the terminal device 200.

[0051] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for optimizing thermal resistance of a microchannel heat exchange module, characterized in that: include: Constructing a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module; Based on a preset microchannel heat exchange module generation method, a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module are generated; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; For each of the virtual microchannel heat exchange modules, the virtual microchannel heat exchange module is installed in a preset virtual air conditioner to obtain a target virtual air conditioner corresponding to the microchannel heat exchange module, and initial heat exchange performance scores corresponding to the virtual microchannel heat exchange module under each operating condition of the target virtual air conditioner are respectively generated, and a target heat exchange performance score of the virtual microchannel heat exchange module is generated based on each of the initial heat exchange performance scores; A target virtual microchannel heat exchange module is determined among the virtual microchannel heat exchange modules based on the target heat exchange performance score of each virtual microchannel heat exchange module.

2. The thermal resistance optimization method of the microchannel heat exchange module according to claim 1, characterized in that: The first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module is constructed, comprising: Acquiring geometric structure information and material information of the microchannel heat exchange module; Constructing a virtual geometric structure of the microchannel heat exchange module based on the geometric structure information, and acquiring target material property information in a database based on the material information; The target material property information is assigned to the virtual geometric structure to obtain the first virtual microchannel heat exchange module.

3. The thermal resistance optimization method of the microchannel heat exchange module according to claim 1, characterized in that: The method for generating a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generation method includes: Based on a preset finite element segmentation method, finite element segmentation processing is performed on the width of each microchannel gap of the first virtual microchannel heat exchange module, and a plurality of virtual microchannel extension boundary lines are generated in each of the microchannel gaps; For each of the microchannel gaps, if the number of virtual microchannel extension boundary lines in the microchannel gap is an odd number, a virtual microchannel extension boundary line in the middle position is deleted; For each virtual microchannel of the first virtual microchannel heat exchange module, both sides of the virtual microchannel are sequentially expanded from near to far toward a virtual microchannel expansion boundary line close to the virtual microchannel to obtain a plurality of second virtual microchannel heat exchange modules.

4. The thermal resistance optimization method of the microchannel heat exchange module according to claim 1, characterized in that: The generating a target heat exchange performance score of the virtual microchannel heat exchange module based on each of the initial heat exchange performance scores comprises: Obtaining an average heat transfer performance score and a standard deviation between the initial heat transfer performance scores; The ratio between the average heat exchange performance score and the standard deviation is determined as the target heat exchange performance score.

5. The thermal resistance optimization method of the microchannel heat exchange module according to claim 1, characterized in that: The generating of the initial heat exchange performance score corresponding to the virtual microchannel heat exchange module under each operating condition of the target virtual air conditioner includes: For each of the working conditions, indoor environment parameter information corresponding to the working condition is obtained, and the environmental state of the virtual indoor environment corresponding to the target virtual air conditioner is set based on the indoor environment parameter information corresponding to the working condition; Running the target virtual air conditioner based on the working condition, and acquiring virtual indoor environment parameter information of the virtual indoor environment in real time during the running of the target virtual air conditioner, and recording the target virtual indoor environment parameter information and the target running time when the virtual indoor environment parameter information no longer changes; wherein the target virtual indoor environment parameter information is the virtual indoor environment parameter information corresponding to when the virtual indoor environment parameter information no longer changes, and the target running time is the time corresponding to when the target virtual air conditioner starts running to when the virtual indoor environment parameter information no longer changes; Obtaining standard indoor environmental parameter information and standard operating time corresponding to the working condition in a database; Acquire the similarity between the target virtual indoor environment parameter information and the standard indoor environment parameter information; Calculating a ratio between the standard running time and the target running time; The product of the similarity and the ratio is determined as the initial heat exchange performance score.

6. A thermal resistance optimization system for a microchannel heat exchange module, characterized in that: include: A construction module, used to construct a first virtual microchannel heat exchange module corresponding to the microchannel heat exchange module; A first generating module, used for generating a plurality of second virtual microchannel heat exchange modules corresponding to the first virtual microchannel heat exchange module based on a preset microchannel heat exchange module generating method; the microchannel cross-sectional areas of the virtual microchannel heat exchange modules are different; The second generating module is used for installing each virtual microchannel heat exchange module in a preset virtual air conditioner, obtaining a target virtual air conditioner corresponding to the microchannel heat exchange module, and respectively generating an initial heat exchange performance score corresponding to the virtual microchannel heat exchange module under each working condition of the target virtual air conditioner, and generating a target heat exchange performance score of the virtual microchannel heat exchange module based on each initial heat exchange performance score; A determination module is used to determine a target virtual microchannel heat exchange module among the virtual microchannel heat exchange modules based on the target heat exchange performance scores of the virtual microchannel heat exchange modules.

Images