Wafer bonding device and wafer bonding method

Abstract

The present invention relates to a wafer bonding apparatus and a wafer bonding method capable of processing a wafer having a deformed shape, the wafer bonding apparatus comprising: a first wafer mounting table on which a first wafer is mounted; a second wafer is mounted on the second wafer mounting table in a manner of being opposite to the first wafer; the wafer pressing devices are arranged on one of the first wafer mounting table and the second wafer mounting table or are respectively arranged on each of the first wafer mounting table and the second wafer mounting table, and are used for pressing the first wafer in the direction facing the second wafer or pressing the second wafer in the direction facing the first wafer; therefore, the first wafer and the second wafer are combined.

Description

Technical Field

[0001] The present invention relates to a wafer bonding device and a wafer bonding method, and more particularly to a wafer bonding device and a wafer bonding method capable of processing wafers with deformed shapes. Background Art

[0002] Silicon is the most commonly used important raw material for manufacturing semiconductor chips. Silicon wafers are the basic materials for manufacturing substrates as raw materials for semiconductors. They can be produced by growing high-purity silicon into single crystal silicon in an electric furnace and then cutting and grinding.

[0003] In order to overcome the limitation of increasing integration in two dimensions and increase the functional density of materials, semiconductor integration technology based on silicon substrates has developed into a three-dimensional stacked integrated circuit (3D-stacked IC) in which at least two or more wafers are combined and stacked three-dimensionally. Summary of the invention

[0004] [Technical issues]

[0005] However, as the thickness of wafers has recently become thinner due to ultra-thin chips or economic considerations, warping, in which the shape of the wafer is irregularly deformed, has frequently occurred. Traditional wafer bonding devices that fixedly press the center of the wafer to reduce the occurrence of bubbles are completely unable to handle this irregular warping of the wafer. As a result, there are many problems such as the wafer bonding cannot be formed uniformly as a whole, bubbles occur in the severely deformed parts of the wafer, or bonding is partially not formed.

[0006] The present invention aims to solve various problems including the above-mentioned problems, and its purpose is to provide a wafer bonding device and a wafer bonding method that can handle a wafer with shape deformation caused by a warping phenomenon, etc., and can freely adjust not only the central part of the wafer but also the bonding pressing force of the peripheral part, thereby greatly improving the precision and accuracy of manufacturing. However, these problems are exemplary and do not limit the scope of the present invention.

[0007] [Technical solution]

[0008] The wafer bonding device for solving the above-mentioned problems based on the concept of the present invention includes: a first wafer mounting table on which a first wafer is mounted; a second wafer mounting table on which a second wafer is mounted opposite to the first wafer; and a wafer pressing device, which is arranged on one of the first wafer mounting table and the second wafer mounting table or is respectively arranged on each of the first wafer mounting table and the second wafer mounting table, and presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer so that the first wafer and the second wafer are bonded. The wafer pressing device can convert the horizontal pressing force applied from the side of the first wafer or the second wafer into a vertical pressing force for bonding the first wafer and the second wafer and transmit it.

[0009] In addition, according to the present invention, the wafer pressing device may include: a deforming plate, which is formed along the rear surface of the first wafer or the second wafer and changes its shape due to an external force; and a first moving platform, which is formed on an edge portion of a first side of the deforming plate and is movable in a horizontal direction along a first guide portion formed on a base toward a center portion of the deforming plate, so that the center portion of the deforming plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer.

[0010] In addition, according to the present invention, the wafer pressing device may further include a second movable platform, which is formed on an edge portion of the second side of the deformable plate and can move in a horizontal direction along a second guide portion formed on the base toward a center portion of the deformable plate, so that the center portion of the deformable plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer.

[0011] In addition, according to the present invention, the first moving stage and the second moving stage can be arranged along a first virtual line formed in a direction starting from the edge of the first side of the deformable plate, passing through the central part of the deformable plate, to the edge part of the second side of the deformable plate opposite to the first side.

[0012] Furthermore, according to the present invention, a first distance from a central portion of the deformation plate to the first moving stage and a second distance from a central portion of the deformation plate to the second moving stage may be identical to each other.

[0013] In addition, according to the present invention, the wafer pressing device may further include: a third movable table, which is formed on the edge portion of the third side of the deformation plate and can be moved in the horizontal direction along the third guide portion formed on the base toward the center portion of the deformation plate, so that the center portion of the deformation plate is protrudingly deformed in the vertical direction to be able to press the first wafer or the second wafer; and a fourth movable table, which is formed on the edge portion of the fourth side of the deformation plate and can be moved in the horizontal direction along the fourth guide portion formed on the base toward the center portion of the deformation plate, so that the center portion of the deformation plate is protrudingly deformed in the vertical direction to be able to press the first wafer or the second wafer.

[0014] In addition, according to the present invention, the third moving stage and the fourth moving stage can be arranged along a second virtual line formed in a direction starting from the edge of the third side of the deformable plate, passing through the central part of the deformable plate, to the edge part of the fourth side of the deformable plate opposite to the third side.

[0015] Furthermore, according to the present invention, the first virtual line and the second virtual line may cross at an angle of 90 degrees.

[0016] Furthermore, according to the present invention, a third distance from the center portion of the deformable plate to the third moving stage and a fourth distance from the center portion of the deformable plate to the fourth moving stage may be the same as the first distance.

[0017] In addition, according to the present invention, the wafer pressing device may further include: a fifth moving stage formed on an edge portion of a fifth side of the deformable plate, and capable of moving in a horizontal direction along a fifth guide portion formed on the base toward a central portion of the deformable plate, so that the central portion of the deformable plate is deformed protrudingly in a vertical direction so as to be able to press the first wafer or the second wafer; a sixth moving stage formed on an edge portion of a sixth side of the deformable plate, and capable of moving in a horizontal direction along a sixth guide portion formed on the base toward a central portion of the deformable plate, so that the central portion of the deformable plate is deformed protrudingly in a vertical direction so as to be able to press a first wafer or a second wafer; a seventh movable stage formed on an edge portion of a seventh side of the deformation plate and movable in a horizontal direction along a seventh guide portion formed on the base toward a center portion of the deformation plate, so that the center portion of the deformation plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer; and an eighth movable stage formed on an edge portion of an eighth side of the deformation plate and movable in a horizontal direction along an eighth guide portion formed on the base toward a center portion of the deformation plate, so that the center portion of the deformation plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer.

[0018] In addition, according to the present invention, the fifth mobile station and the sixth mobile station can be arranged along a third virtual line formed in a direction starting from the edge of the fifth side of the deformable plate, passing through the central part of the deformable plate, to the edge of the sixth side of the deformable plate opposite to the fifth side, and the seventh mobile station and the eighth mobile station can be arranged along a fourth virtual line formed in a direction starting from the edge of the seventh side of the deformable plate, passing through the central part of the deformable plate, to the edge of the eighth side of the deformable plate opposite to the seventh side.

[0019] Furthermore, according to the present invention, the third virtual line and the fourth virtual line may cross at an angle of 90 degrees, and the first virtual line and the third virtual line may cross at an angle of 45 degrees.

[0020] In addition, according to the present invention, the fifth distance from the center part of the deformable plate to the fifth moving station, the sixth distance from the center part of the deformable plate to the sixth moving station, the seventh distance from the center part of the deformable plate to the seventh moving station, and the eighth distance from the center part of the deformable plate to the eighth moving station can be the same as the first distance.

[0021] In addition, according to the present invention, the wafer pressing device may further include: a first actuator driving the first movable table with a first horizontal pressing force; a second actuator driving the second movable table with a second horizontal pressing force; and a control part applying a control signal to the first actuator or the second actuator.

[0022] Furthermore, according to the present invention, the control part may differently apply control signals to the first actuator and the second actuator according to the deformed forms of the first wafer and the second wafer so as to form the first and second horizontal pressing forces different from each other.

[0023] Furthermore, according to the present invention, the wafer pressing device may further include: a wafer shape sensing sensor which applies the wafer shape to the control part to sense the deformed form of the first wafer or the second wafer.

[0024] In addition, according to the present invention, the first actuator may include at least one of a linear motor, a tension forming motor for forming tension on the wiring, a traction device for pulling a bow-shaped elastic body, a cylinder device for moving a piston back and forth, a first rotary motor for rotating a unidirectional threaded rod having a unidirectional thread, and a second rotary motor for rotating a double threaded rod having a forward direction thread and a reverse direction thread, or a combination thereof.

[0025] Furthermore, according to the present invention, the wafer pressing device may further include a central guide member formed at a central portion of the rear surface of the deformation plate and formed to be able to rise and fall along a guide hole formed on the base.

[0026] In addition, a wafer bonding method for solving the above-mentioned problem based on the concept of the present invention includes: step (a), mounting a first wafer on a first wafer mounting table; step (b), mounting a second wafer on a second wafer mounting table opposite to the first wafer; step (c), bonding the first wafer and the second wafer by a wafer pressing device that presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer. In step (c), the horizontal pressing force applied from the side of the first wafer or the second wafer can be converted into a vertical pressing force for bonding the first wafer and the second wafer and transmitted by the wafer pressing device.

[0027] In addition, a wafer bonding device for solving the above-mentioned problem based on the concept of the present invention includes: a first wafer mounting table on which a first wafer is mounted; a second wafer mounting table on which a second wafer is mounted opposite to the first wafer; and a wafer pressing device, which is arranged on one of the first wafer mounting table and the second wafer mounting table or is respectively arranged on each of the first wafer mounting table and the second wafer mounting table, and presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer so that the first wafer and the second wafer are bonded. The wafer pressing device can convert the horizontal pressing force applied from the side of the first wafer or the second wafer into a vertical pressing force for bonding the first wafer and the second wafer and transmit it. The wafer pressing device may include: a deformable plate formed along a rear surface of a first wafer or a second wafer and changing its shape due to an external force; a first moving stage formed on an edge portion of a first side of the deformable plate and capable of moving in a horizontal direction along a first guide portion formed on a base toward a center portion of the deformable plate, so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer; a second moving stage formed on an edge portion of a second side of the deformable plate and capable of moving in a horizontal direction along a second guide portion formed on a base toward the center portion of the deformable plate, so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer. The wafer pressing device may further include: a first actuator driving the first movable stage with a first horizontal pressing force; a second actuator driving the second movable stage with a second horizontal pressing force; and a control part applying a control signal to the first actuator or the second actuator; and a central guide member formed at the central part of the rear surface of the deformable plate and formed to be able to rise and fall along the guide hole formed on the substrate.

[0028] [Beneficial Effects]

[0029] According to some embodiments of the present invention as described above, it is intended to have the effect of being able to handle a wafer with shape deformation caused by a warpage phenomenon, etc., and freely adjusting the bonding pressing force not only in the central portion of the wafer but also in the peripheral portion, thereby greatly improving the precision and accuracy of manufacturing and greatly improving productivity and yield by preventing bonding defects, etc. Of course, the scope of the present invention is not limited to these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a side view showing a wafer mounting state of wafer bonding manufacturing according to some embodiments of the present invention.

[0031] Figure 2 It is shown Figure 1 A side view of a wafer bonding state of a wafer bonding apparatus.

[0032] Figure 3 It is shown Figure 1 A perspective view of an example of a wafer pressing device of a wafer bonding device.

[0033] Figure 4 It is shown Figure 3 A plan view of a center pressing mode of a wafer pressing device of a wafer bonding device.

[0034] Figure 5 It is shown Figure 3 A plan view of a warpage processing mode of a wafer pressing device of a wafer bonding device.

[0035] Figure 6 It is shown Figure 1 A plan view of a center pressing mode of another example of a wafer pressing device of a wafer bonding device.

[0036] Figure 7 It is shown Figure 6 A plan view of a warpage processing mode of a wafer pressing device of a wafer bonding device.

[0037] Figures 8 to 14 It is shown Figure 1 Side views of multiple embodiments of a wafer pressing device of a wafer bonding device.

[0038] Fig.15 is a flow chart illustrating a wafer bonding method according to some embodiments of the present invention.

[0039] [Explanation of Reference Numerals]

[0040] W1: Wafer 1

[0041] W2: Second wafer

[0042] 10: First wafer mounting station

[0043] 20: Second wafer mounting station

[0044] 30: Wafer pressing device

[0045] 31: Deformed Plate

[0046] C: Center

[0047] B: Base

[0048] A: Main pressing area

[0049] D1~D8: First to eighth mobile stations

[0050] G1~G8: First guide section to eighth guide section

[0051] R: Roller

[0052] F: Guide surface

[0053] L1~L4:First virtual line~Fourth virtual line

[0054] R1~R8: First distance~eighth distance

[0055] A1: First actuator

[0056] LM: Linear Motor

[0057] 1: Wiring

[0058] TM: Tension forming motor

[0059] 2: Elastomer

[0060] TW: Traction device

[0061] P: Piston

[0062] CY: Cylinder device

[0063] S: One-way thread

[0064] SB: Single direction threaded rod

[0065] M1: First rotary motor

[0066] S1: positive direction thread

[0067] S2: Reverse thread

[0068] DSB: Double threaded rod

[0069] M2: Second rotary motor

[0070] A2: Second actuator

[0071] 40: Control section

[0072] 50: Wafer shape sensing sensor

[0073] 32: Center guide member

[0074] GH: Guide Hole

[0075] 100: Wafer bonding device DETAILED DESCRIPTION

[0076] Hereinafter, some preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0077] The embodiments of the present invention are provided to more completely illustrate the present invention to those of ordinary skill in the art, and the following embodiments may be changed into various forms, and the scope of the present invention is not limited to the following embodiments. On the contrary, these embodiments make the present invention more substantial and complete, and are provided to fully convey the spirit of the present invention to those skilled in the art. In addition, for convenience and clear description, the thickness or size of each layer in the drawings is exaggerated.

[0078] The terms used in the specification are used to describe specific embodiments and do not limit the present invention. As used in this specification, unless the context clearly indicates otherwise, the singular form may include the plural form. As used herein, "comprise" and / or "comprising" means the existence of the mentioned shapes, numbers, steps, operations, components and / or combinations thereof, and does not exclude the existence or addition of one or more other shapes, numbers, steps, operations, components and / or combinations thereof.

[0079] Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings which briefly illustrate preferred embodiments of the present invention. In the accompanying drawings, it is expected that the shapes shown will be deformed due to manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention should not be interpreted as being limited to the specific shapes within the regions shown in this specification, but include shape variations caused by, for example, manufacturing.

[0080] Figure 1 1 is a side view showing a wafer bonding state of the wafer bonding apparatus 100 according to some embodiments of the present invention.

[0081] First, if Figure 1 As shown, a wafer bonding apparatus 100 according to some embodiments of the present invention generally includes a first wafer mounting table 10 , a second wafer mounting table 20 and a wafer pressing apparatus 30 .

[0082] The first wafer mounting table 10 may be applied with a device such as an electrostatic chuck that fixes the first wafer W1 by vacuum pressure or static electricity to mount the first wafer W1 .

[0083] For example, the first wafer mounting table 10 may include a deformable plate 31 of a wafer pressing device 30 described later, and the deformable plate 31 may form a plurality of vacuum holes to form vacuum pressure or may have built-in electrostatic electrodes to form static electricity.

[0084] However, the first wafer mounting table 10 is not necessarily limited to the drawings, and may be applicable to electrostatic chucks of various forms or types that can mount a wafer.

[0085] The second wafer mounting table 20 is a device for mounting the second wafer W2 opposite to the first wafer W1 , and a device such as an electrostatic chuck for mounting the second wafer W2 by fixing the second wafer W2 by vacuum pressure or static electricity can be applied.

[0086] For example, the second wafer mounting table 20 may include a deformable plate 31 of a wafer pressing device 30 described later, and the deformable plate 31 may form a plurality of vacuum holes to form vacuum pressure or may have built-in electrostatic electrodes to form static electricity.

[0087] However, the second wafer mounting table 20 is not necessarily limited to the drawings, and may be applicable to electrostatic chucks of various forms or types that can mount a wafer.

[0088] For example, the wafer pressing device 30 may be provided on one of the first wafer mounting table 10 and the second wafer mounting table 20, or may be provided on the first wafer mounting table 10 and the second wafer mounting table 20. Figure 1 As shown, it is respectively arranged on each of the first wafer mounting table 10 and the second wafer mounting table 20, and can be a device for pressing the first wafer W1 in a direction toward the second wafer W2 or pressing the second wafer W2 in a direction toward the first wafer W1 so that the first wafer W1 and the second wafer W2 can be combined with each other.

[0089] For example, the wafer pressing device 30 may be a direction conversion device that converts the horizontal pressing force applied from the sides of the first wafer W1 and the second wafer W2 into a vertical pressing force for bonding the first wafer W1 and the second wafer W2 and transmits the converted force.

[0090] More specifically, for example, the wafer pressing device 30 may include a deforming plate 31, a first moving stage D1, and a second moving stage D2. The deforming plate 31 is formed along the rear surface of the first wafer W1 or the second wafer W2, and changes shape due to an external force. The first moving stage D1 is formed on an edge portion of a first side of the deforming plate 31, and can be moved in a horizontal direction, along a first guide portion G1, and toward a center portion C of the deforming plate 31, the first guide portion G1 being formed on a substrate B so that the center portion C of the deforming plate 31 is deformed protrudingly in a vertical direction so as to be able to press the first wafer W1 or the second wafer W2. The second moving stage D2 is formed on an edge portion of a second side of the deforming plate 31, and can be moved in a horizontal direction, along a second guide portion G2 formed on a substrate B, and toward a center portion C of the deforming plate 31, so that the center portion C of the deforming plate 31 is deformed protrudingly in a vertical direction so as to be able to press the first wafer W1 or the second wafer W2.

[0091] The deformable plate 31 can be made of an elastic material or diaphragm such as rubber, silicon, ethyl formate, metal with excellent restoring force, other resins or composite materials, so that the middle shape of the deformable plate 31 can be deformed in the vertical direction by the horizontal pressing force in the horizontal direction.

[0092] For example, the deformable plate 31 may internally form a vacuum hole connected to a vacuum line to vacuum-absorb the first wafer W1 or the second wafer W2 , or may internally have an electrostatic electrode to electrostatically absorb the first wafer W1 or the second wafer W2 .

[0093] Here, for example, the first guide portion G1 may be applied to a rail member such as a linear motion (LM) guide to guide the forward and backward movement path of the first moving table D1. However, the first guide portion G1 is not limited thereto and may be applied to all guides of the rollers R (see Figure 8 )'s guide surface F and other guide components in various forms.

[0094] For example, the wafer pressing device 30 may also include a first actuator A1 that drives the first movable table D1 with a first horizontal pressing force, a second actuator A2 that drives the second movable table D2 with a second horizontal pressing force, a control part 40 that applies a signal to the first actuator A1 or the second actuator A2, and at least one wafer shape sensing sensor 50 that applies a wafer shape signal to the control part 40 to sense the deformed morphology of the first wafer W1 or the second wafer W2.

[0095] For example, the first actuator A1 or the second actuator A2 may be applied to various actuators such as linear motors LM or forward and backward moving devices.

[0096] For example, the wafer shape sensing sensor 50 can sense the warping phenomenon of the first wafer W1 or the second wafer W2, and can be applicable to all multiple image sensors, level sensors, laser sensors, infrared sensors, ultrasonic sensors, motion sensing sensors and other sensors of various forms or types arranged in the front-to-back direction, left-to-right direction, etc. of the first wafer W1 or the second wafer W2.

[0097] Figure 2 It is shown Figure 1 FIG. 1 is a side view of the wafer bonding state of the wafer bonding apparatus 100 .

[0098] Therefore, if Figure 1 and Figure 2 As shown in FIG. 1 , the operation process of the wafer bonding apparatus 100 according to some embodiments of the present invention is described. First, as shown in FIG. Figure 1 As shown, in the wafer mounting state, when the first wafer W1 is mounted on the first wafer mounting table 10 and the second wafer W2 is mounted on the second wafer mounting table 20, the wafer shape sensing sensor 50 can sense shape deformation such as warping of the first wafer W1 or the second wafer W2.

[0099] Then, if Figure 2 As shown, the control part 40 applies control signals to the first actuator A1 and the second actuator A2 differently so as to form the first horizontal pressing force and the second horizontal pressing force differently, so that the main pressing area A (see Figure 4 and Figure 5 ), and the first wafer W1 and the second wafer W2 are combined corresponding to the deformed shape of the first wafer W1 or the second wafer W2.

[0100] For example, if the left side portion of the first wafer W1 is deformed to protrude upward, the control part 40 controls the second horizontal pressing force of the second actuator A2 to be greater than the first horizontal pressing force of the first actuator A1 to offset the bonding force concentrated on the left side portion of the first wafer W1 caused by this warping phenomenon, thereby applying a uniform bonding pressing force on the interface between the first wafer W1 and the second wafer W2.

[0101] Figure 3 It is shown Figure 1 FIG. 1 is a perspective view of an example of the wafer pressing device 30 of the wafer bonding device 100 . Figure 4 It is shown Figure 3 FIG. 1 is a plan view of a center pressing mode of the wafer pressing device 30 of the wafer bonding device 100 . Figure 5 It is shown Figure 3 FIG. 1 is a plan view of a warpage processing mode of the wafer pressing device 30 of the wafer bonding device 100 .

[0102] refer to Figures 3 to 5 , Figure 1 The wafer pressing device 30 of the wafer bonding device 100 may further include a third moving stage D3 and a fourth moving stage D4. The third moving stage D3 is formed on an edge portion of a third side of the deformable plate 31, and can be moved in a horizontal direction along a third guide portion G3 formed on the substrate B toward a center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in a vertical direction to be able to press the first wafer W1 or the second wafer W2. The fourth moving stage D4 is formed on an edge portion of a fourth side of the deformable plate 31, and can be moved in a horizontal direction along a fourth guide portion G4 formed on the substrate B toward a center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in a vertical direction to be able to press the first wafer W1 or the second wafer W2.

[0103] The first and second moving stages D1 and D2 may be arranged along a first virtual line L1 formed in a direction from an edge of a first side of the deformable plate 31 , through a center portion C of the deformable plate 31 , to an edge portion of a second side of the deformable plate 31 opposite to the first side.

[0104] The third moving stage D3 and the fourth moving stage D4 can be arranged along a second virtual line L2 formed in a direction starting from the edge of the third side of the deformable plate 31, passing through the central portion C of the deformable plate 31, to the edge portion of the fourth side of the deformable plate 31 opposite to the third side.

[0105] The first distance R1 from the center portion C of the deformable plate 31 to the first moving stage D1, the second distance R2 from the center portion C of the deformable plate 31 to the second moving stage D2, the third distance R3 from the center portion C of the deformable plate 31 to the third moving stage D3, and the fourth distance R4 from the center portion C of the deformable plate 31 to the fourth moving stage D4 can all be the same, so that the uniform control or differential control of the control part 40 can be easily processed arithmetically.

[0106] In addition, for example, the first virtual line L1 is arranged in the front-to-back direction, etc., and for example, the second virtual line L2 can be arranged in the left-to-right direction, etc., so that the first virtual line L1 and the second virtual line L2 can intersect each other at an angle of 90 degrees, so that the uniform control or differential control of the control part 40 can be easily processed arithmetically.

[0107] Therefore, if Figure 4As shown, the control part 40 can execute a center pressing mode, which is to move the first movable table D1, the second movable table D2, the third movable table D3 and the fourth movable table D4 respectively with the same horizontal pressing force or by the same distance, so that the center part C of the first wafer W1 becomes the main pressing area A, thereby pressing the first wafer W1 in the vertical direction.

[0108] In addition, if Figure 5 As shown, the control part 40 can execute a warping processing mode, which moves the first movable table D1, the second movable table D2, the third movable table D3 and the fourth movable table D4 respectively with different horizontal pressing forces or by different distances, so that the off-center portion of the first wafer W1 becomes the main pressing area A, thereby pressing the first wafer W1 in the vertical direction.

[0109] Figure 6 It is shown Figure 1 FIG. 1 is a plan view of a center pressing mode of another example of the wafer pressing device 30 of the wafer bonding apparatus 100 . Figure 7 It is shown Figure 6 FIG. 1 is a plan view of a warpage processing mode of the wafer pressing device 30 of the wafer bonding device 100 .

[0110] like Figure 6 and Figure 7 As shown, Figure 1The wafer pressing device 30 of the wafer bonding device 100 may further include a fifth moving stage D5, a sixth moving stage D6, a seventh moving stage D7, and an eighth moving stage D8. The fifth moving stage D5 is formed on an edge portion of the fifth side of the deformable plate 31, and can be moved in a horizontal direction along a fifth guide portion G5 formed on the substrate B toward the center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in the vertical direction to be able to press the first wafer W1 or the second wafer W2. The sixth moving stage D6 is formed on an edge portion of the sixth side of the deformable plate 31, and can be moved in a horizontal direction along a sixth guide portion G6 formed on the substrate B toward the center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in the vertical direction to be able to press the first wafer W1 or the second wafer W2. The seventh moving stage D7 is formed on the edge portion of the seventh side of the deformable plate 31, and can be moved in the horizontal direction along the seventh guide portion G7 formed on the base B toward the center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in the vertical direction to be able to press the first wafer W1 or the second wafer W2. The eighth moving stage D8 is formed on the edge portion of the eighth side of the deformable plate 31, and can be moved in the horizontal direction along the eighth guide portion G8 formed on the base B toward the center portion C of the deformable plate 31, so that the center portion C of the deformable plate 31 is deformed protrudingly in the vertical direction to be able to press the first wafer W1 or the second wafer W2.

[0111] The fifth moving stage D5 and the sixth moving stage D6 may be arranged along a third virtual line L3 formed in a direction starting from an edge of the fifth side of the deformed plate 31, passing through the center portion C of the deformed plate 31, to an edge portion of the sixth side of the deformed plate 31 opposite to the fifth side. The seventh moving stage D7 and the eighth moving stage D8 may be arranged along a fourth virtual line L4 formed in a direction starting from an edge of the seventh side of the deformed plate 31, passing through the center portion C of the deformed plate 31, to an edge portion of the eighth side of the deformed plate 31 opposite to the seventh side.

[0112] The third virtual line L3 and the fourth virtual line L4 may cross each other at an angle of 90 degrees, and the first virtual line L1 and the third virtual line L3 may cross each other at an angle of 45 degrees, so that uniform control or differential control of the control portion 40 may be easily processed arithmetically.

[0113] The fifth distance R5 from the center portion C of the deforming plate 31 to the fifth moving stage D5, the sixth distance R6 from the center portion C of the deforming plate 31 to the sixth moving stage D6, the seventh distance R7 from the center portion C of the deforming plate 31 to the seventh moving stage D7, and the eighth distance R8 from the center portion C of the deforming plate 31 to the eighth moving stage D8 can be the same as the first distance R1, so that the uniform control or differential control of the control part 40 can be easily processed arithmetically.

[0114] Therefore, if Figure 6 As shown, the control part 40 can execute a center pressing mode, which moves the fifth mobile stage D5, the sixth mobile stage D6, the seventh mobile stage D7 and the eighth mobile stage D8 respectively with the same horizontal pressing force or by the same distance, so that the center part C of the first wafer W1 becomes the main pressing area A, thereby pressing the first wafer W1 in the vertical direction.

[0115] In addition, if Figure 7 As shown, the control part 40 can execute a warping processing mode, which moves the fifth movable table D5, the sixth movable table D6, the seventh movable table D7 and the eighth movable table D8 respectively with different horizontal pressing forces or by different distances, so that the part widely extending in the left and right directions of the first wafer W1 becomes the main pressing area A, thereby pressing the first wafer W1 in the vertical direction.

[0116] Figures 8 to 14 It is shown Figure 1 1 is a side view of multiple embodiments of the wafer pressing device 30 of the wafer bonding device 100.

[0117] For example, Figure 8 As shown, the first actuator A1 may be a tension forming motor TM for forming tension on the wiring 1 .

[0118] Therefore, if Fig. 9 , if the tension forming motor TM forms tension to the wiring 1 , the distance between the first moving stage D1 and the second moving stage D2 is narrowed, so that the center portion C of the first wafer W1 can rise.

[0119] Here, a guide surface F may be formed on the substrate B to guide the roller R provided to the first moving stage D1.

[0120] For example, Fig.10 As shown, the first actuator A1 can be used as a traction device TW for pulling the bow-shaped elastic body 2.

[0121] Therefore, if Fig.11As shown, if the pulling device TW pulls the bow-shaped elastic body 2, the distance between the first moving stage D1 and the second moving stage D2 is narrowed, so that the center portion C of the first wafer W1 can rise.

[0122] For example, Fig.12 As shown, the first actuator A1 and the second actuator A2 may be adapted to be cylinder devices CY for moving the piston P forward and backward.

[0123] Therefore, if Fig.12 As shown, if the cylinder device CY moves the piston P forward and backward, the distance between the first moving stage D1 and the second moving stage D2 becomes narrower or wider, so that the center portion C of the first wafer W1 can rise or fall.

[0124] For example, Fig.13 As shown, the first actuator A1 and the second actuator A2 may be adapted to be a first rotary motor M1 that rotates a unidirectional threaded rod SB having a unidirectional thread S formed thereon.

[0125] Therefore, if Fig.13 As shown, if the first rotary motor M1 rotates the unidirectional threaded rod SB formed with the unidirectional thread S, the distance between the first moving stage D1 and the second moving stage D2 is narrowed or widened so that the center portion C of the first wafer W1 can rise or fall.

[0126] For example, Fig.14 As shown, the first actuator A1 may be adapted to be a second rotary motor M2 that rotates a double threaded rod DSB formed with a forward direction thread S1 and a reverse direction thread S2.

[0127] Therefore, if Fig.14 As shown, if the second rotary motor M2 rotates the double threaded rod DSB formed with the forward direction thread S1 and the reverse direction thread S2, the distance between the first moving stage D1 and the second moving stage D2 becomes narrower or wider, so that the center portion C of the first wafer W1 can rise or fall.

[0128] In addition, for example, Figures 8 to 14 As shown, the wafer pressing device 30 may further include a central guide member 32 formed at a central portion C of the rear surface of the deformable plate 31 and formed to be able to rise and fall along a guide hole GH formed on the substrate B.

[0129] Therefore, if the central guide member 32 is used, the shape deformation of the deformation plate 31 can be independently formed into left deformation and right deformation with the central portion C as a reference, so that the shape can be controlled more precisely.

[0130] Fig.15 is a flow chart illustrating a wafer bonding method according to some embodiments of the present invention.

[0131] like Figures 1 to 15 As shown, the wafer bonding method according to some embodiments of the present invention includes: step (a), mounting the first wafer W1 on the first wafer mounting table 10; step (b), mounting the second wafer W2 on the second wafer mounting table 20 opposite to the first wafer W1; and step (c), bonding the first wafer W1 and the second wafer W2 by means of a wafer pressing device 30 that presses the first wafer W1 in a direction toward the second wafer W2 or presses the second wafer W2 in a direction toward the first wafer W1. In step (c), the horizontal pressing force applied from the side of the first wafer W1 or the second wafer W2 can be converted into a vertical pressing force for bonding the first wafer W1 and the second wafer W2 and transmitted by the wafer pressing device 30.

[0132] Therefore, according to the present invention, it is possible to process wafers whose shapes are deformed due to warping phenomena, etc., and the bonding pressing force of not only the central part of the wafer but even the peripheral part can be freely adjusted, thereby greatly improving the precision and accuracy of manufacturing, and by preventing bonding defects, etc., the productivity and yield are greatly improved.

[0133] Although the present invention is described with reference to the embodiments shown in the accompanying drawings, this is only exemplary, and it should be understood that a person skilled in the art may make various modifications and other equivalent embodiments. Therefore, the true technical protection scope of the present invention should be limited by the technical ideas of the scope of the attached patent claims.

Claims

1. A wafer bonding device, comprising: a first wafer mounting table on which a first wafer is mounted; a second wafer mounting table on which a second wafer is mounted opposite to the first wafer; as well as a wafer pressing device, which is disposed on one of the first wafer mounting table and the second wafer mounting table or is disposed on each of the first wafer mounting table and the second wafer mounting table, and presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer so that the first wafer and the second wafer are combined, The wafer pressing device converts the horizontal pressing force applied from the side of the first wafer or the second wafer into a vertical pressing force for combining the first wafer and the second wafer and transmits the vertical pressing force.

2. The wafer bonding device according to claim 1, wherein: The wafer pressing device comprises: a deformable plate formed along a rear surface of the first wafer or the second wafer and changing shape due to an external force; and A first movable table is formed on an edge portion of a first side of the deformable plate and is movable in a horizontal direction along a first guide portion formed on a base toward a center portion of the deformable plate, so that the center portion of the deformable plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer.

3. The wafer bonding device according to claim 2, wherein: The wafer pressing device further comprises: A second moving stage is formed on an edge portion of a second side of the deformable plate and is movable in a horizontal direction along a second guide portion formed on the base toward the center portion of the deformable plate, so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer.

4. The wafer bonding device according to claim 3, wherein: The first moving stage and the second moving stage are arranged along a first virtual line formed in a direction from an edge of the first side of the deformable plate, through the central portion of the deformable plate, to an edge portion of the second side of the deformable plate opposite to the first side.

5. The wafer bonding device according to claim 4, wherein: A first distance from the central portion of the deformable plate to the first moving stage and a second distance from the central portion of the deformable plate to the second moving stage are identical to each other.

6. The wafer bonding device according to claim 5, wherein: The wafer pressing device further comprises: a third moving stage formed on an edge portion of a third side of the deformation plate and movable in a horizontal direction along a third guide portion formed on the base toward the center portion of the deformation plate so that the center portion of the deformation plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer; and A fourth movable table is formed on an edge portion of a fourth side of the deformable plate and is movable in a horizontal direction along a fourth guide portion formed on the base toward the center portion of the deformable plate, so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer.

7. The wafer bonding device according to claim 6, wherein: The third moving stage and the fourth moving stage are arranged along a second virtual line formed in a direction starting from the edge of the third side of the deformable plate, passing through the central portion of the deformable plate, to an edge portion of the fourth side of the deformable plate opposite to the third side.

8. The wafer bonding device according to claim 7, wherein: The first virtual line and the second virtual line intersect at an angle of 90 degrees.

9. The wafer bonding device according to claim 7, wherein: A third distance from the central portion of the deformable plate to the third moving stage and a fourth distance from the central portion of the deformable plate to the fourth moving stage are the same as the first distance.

10. The wafer bonding device according to claim 9, wherein: The wafer pressing device further comprises: a fifth moving stage formed on an edge portion of a fifth side of the deformable plate and movable in a horizontal direction along a fifth guide portion formed on the base toward the central portion of the deformable plate so that the central portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer; a sixth moving stage formed on an edge portion of a sixth side of the deformable plate and movable in a horizontal direction along a sixth guide portion formed on the base toward the central portion of the deformable plate so that the central portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer; a seventh moving stage formed on an edge portion of a seventh side of the deformation plate and movable in a horizontal direction along a seventh guide portion formed on the base toward the center portion of the deformation plate so that the center portion of the deformation plate is protrudingly deformed in a vertical direction to be able to press the first wafer or the second wafer; and An eighth movable table is formed on an edge portion of an eighth side of the deformable plate and is movable in a horizontal direction along an eighth guide portion formed on the base toward the center portion of the deformable plate, so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer.

11. The wafer bonding device according to claim 10, wherein: the fifth moving stage and the sixth moving stage are arranged along a third virtual line formed in a direction from an edge of the fifth side of the deformed plate, through the central portion of the deformed plate, to an edge of the sixth side of the deformed plate opposite to the fifth side, The seventh moving stage and the eighth moving stage are arranged along a fourth virtual line formed in a direction from an edge of the seventh side of the deformable plate, through the central portion of the deformable plate, to an edge of the eighth side of the deformable plate opposite to the seventh side.

12. The wafer bonding device according to claim 11, wherein: The third virtual line and the fourth virtual line intersect at an angle of 90 degrees, The first virtual line and the third virtual line intersect at an angle of 45 degrees.

13. The wafer bonding device according to claim 11, wherein: The fifth distance from the center portion of the deformable plate to the fifth moving station, the sixth distance from the center portion of the deformable plate to the sixth moving station, the seventh distance from the center portion of the deformable plate to the seventh moving station, and the eighth distance from the center portion of the deformable plate to the eighth moving station are the same as the first distance.

14. The wafer bonding device according to claim 3, wherein: The wafer pressing device further comprises: a first actuator, driving the first moving platform with a first horizontal pressing force; a second actuator for driving the second moving stage with a second horizontal pressing force; and The control section applies a control signal to the first actuator or the second actuator.

15. The wafer bonding device according to claim 14, wherein: The control part differently applies control signals to the first actuator and the second actuator according to forms of deformation of the first wafer and the second wafer so as to form the first horizontal pressing force and the second horizontal pressing force different from each other.

16. The wafer bonding device according to claim 15, wherein: The wafer pressing device further comprises: A wafer shape sensing sensor applies a wafer shape to the control part to sense a deformed form of the first wafer or the second wafer.

17. The wafer bonding apparatus according to claim 14, wherein: The first actuator includes at least one of a linear motor, a tension forming motor for forming tension on the wiring, a traction device for pulling a bow-shaped elastic body, a cylinder device for moving a piston back and forth, a first rotary motor for rotating a unidirectional threaded rod with a unidirectional thread, and a second rotary motor for rotating a double threaded rod with a forward direction thread and a reverse direction thread, or a combination thereof.

18. The wafer bonding device according to claim 2, wherein: The wafer pressing device further comprises: A central guide member is formed at a central portion of a rear surface of the deformation plate and is formed to ascend and descend along a guide hole formed on the base.

19. A wafer bonding method, comprising: Step (a), mounting a first wafer on a first wafer mounting table; Step (b), mounting a second wafer on a second wafer mounting table opposite to the first wafer; Step (c), combining the first wafer and the second wafer by using a wafer pressing device that presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer, Wherein, in the step (c), the horizontal pressing force applied from the side of the first wafer or the second wafer is converted into a vertical pressing force for combining the first wafer and the second wafer and transmitted by the wafer pressing device.

20. A wafer bonding device, comprising: a first wafer mounting table on which a first wafer is mounted; a second wafer mounting table on which a second wafer is mounted opposite to the first wafer; as well as a wafer pressing device, which is disposed on one of the first wafer mounting table and the second wafer mounting table or is disposed on each of the first wafer mounting table and the second wafer mounting table, and presses the first wafer in a direction toward the second wafer or presses the second wafer in a direction toward the first wafer so that the first wafer and the second wafer are combined, The wafer pressing device converts the horizontal pressing force applied from the side of the first wafer or the second wafer into a vertical pressing force for combining the first wafer and the second wafer and transmits the vertical pressing force. Wherein, the wafer pressing device comprises: a deformable plate formed along a rear surface of the first wafer or the second wafer and changing shape due to an external force; and a first moving stage formed on an edge portion of a first side of the deformable plate and movable in a horizontal direction along a first guide portion formed on a base toward a central portion of the deformable plate so that the central portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer, a second moving stage formed on an edge portion of a second side of the deformable plate and movable in a horizontal direction along a second guide portion formed on the base toward the center portion of the deformable plate so that the center portion of the deformable plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer, a third moving stage formed on an edge portion of a third side of the deformation plate and movable in a horizontal direction along a third guide portion formed on the base toward the center portion of the deformation plate so that the center portion of the deformation plate is deformed protrudingly in a vertical direction to be able to press the first wafer or the second wafer; and a fourth moving stage formed on an edge portion of a fourth side of the deformable plate and movable in a horizontal direction along a fourth guide portion formed on the base toward the central portion of the deformable plate so that the central portion of the deformable plate is deformed protrudingly in a vertical direction to press the first wafer or the second wafer, Wherein, the wafer pressing device further comprises: a first actuator, driving the first moving platform with a first horizontal pressing force; a second actuator, driving the second moving stage with a second horizontal pressing force; a control section that applies a control signal to the first actuator or the second actuator; and A central guide member is formed at a central portion of a rear surface of the deformation plate and is formed to ascend and descend along a guide hole formed on the base.

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