Silicon wafer transport method, sorting apparatus, and silicon wafer transport device

Abstract

The application provides a wafer conveying method, a sorting device and a wafer conveying device, and is applied to the sorting device. The method comprises the following steps: receiving a first job control instruction or a second job control instruction from an EAP device automation platform; in the case of receiving the first job control instruction, conveying a wafer from a first carrier to a target bearing position in a target carrier; or in the case of receiving the second job control instruction, conveying the wafer from the first carrier to one of the second carriers in one of the first target loading ports. The application distinguishes the conveying paths through the first job control instruction and the second job control instruction, so that the sorting device can flexibly switch the job form according to the actual production demand, realize automatic scheduling and sorting control, effectively reduce the error rate, and be beneficial to maximizing the equipment utilization rate.

Description

Technical Field

[0001] This application relates to the fields of computer integrated manufacturing and silicon wafer manufacturing technology, and in particular to silicon wafer transport methods, sorting equipment and silicon wafer transport devices. Background Technology

[0002] In the fields of computer integrated manufacturing and silicon wafer manufacturing, the quality and transport efficiency of silicon wafers have a significant impact on subsequent wafer processing and integrated circuit manufacturing processes. To meet the demands of semiconductor production lines for efficient and precise wafer handling, sorting equipment is widely used in the classification and transport of silicon wafers. Most related sorting methods rely on manual labor or simple equipment control, resulting in inefficiencies due to asynchronous production information, complex and error-prone operations, and difficulties in achieving full automation—problems particularly prominent in high-capacity production scenarios.

[0003] With the development of semiconductor manufacturing technology, intelligent automated equipment based on the SCES GEM300 communication framework can control the transport and sorting of silicon wafers through the synergy of the MES manufacturing execution system and the EAP equipment automation platform. However, most of these technologies adopt fixed-path transport methods and lack support for diverse production needs.

[0004] Based on this, this application provides a silicon wafer transport method, sorting equipment, and silicon wafer transport apparatus to improve related technologies. Summary of the Invention

[0005] The purpose of this application is to provide a silicon wafer transport method, sorting equipment, and silicon wafer transport device that can flexibly switch the operation mode of the sorting equipment and improve equipment utilization.

[0006] The objective of this application is achieved through the following technical solution:

[0007] In a first aspect, this application provides a silicon wafer transfer method applied to a sorting device, the method comprising: receiving a first operation control command or a second operation control command from an EAP device automation platform; upon receiving the first operation control command, transferring the silicon wafer from a first carrier to a target carrying position within a target carrier; or, upon receiving the second operation control command, transferring the silicon wafer from the first carrier to one carrying position within one of a second carriers of a first target loading port.

[0008] In some embodiments, upon receiving the first job control instruction, the target carrier and the target carrying position are determined according to the first job control instruction.

[0009] In some embodiments, upon receiving the second job control instruction, the first target loading port is determined according to the second job control instruction.

[0010] In some embodiments, upon receiving the second operation control command, the silicon wafer is placed into the second carrier in a top-to-bottom order according to its carrying position.

[0011] In some embodiments, the first job control instruction and the second job control instruction correspond to different instruction structures.

[0012] Secondly, this application provides a sorting device, the sorting device comprising: a robot; a control module, configured to receive a first operation control command or a second operation control command from an EAP equipment automation platform; upon receiving the first operation control command, controlling the robot to transfer a silicon wafer from a first carrier to a target carrying position within a target carrier; or, upon receiving the second operation control command, controlling the robot to transfer the silicon wafer from the first carrier to one carrying position within one of the second carriers of a first target loading port.

[0013] In some embodiments, the sorting device further includes an Aligner calibrator for adjusting the position and / or orientation of the silicon wafers.

[0014] Thirdly, this application provides a silicon wafer transport device, comprising: a Manufacturing Execution System (MES) for outputting product sorting information; an Equipment Automation Platform (EAP) for receiving and identifying the product sorting information from the MES, and outputting a first operation control command or a second operation control command; and a sorting device for receiving the first operation control command or the second operation control command from the EAP platform; upon receiving the first operation control command, transporting the silicon wafer from a first carrier to a target carrying position within a target carrier; or, upon receiving the second operation control command, transporting the silicon wafer from the first carrier to one carrying position within one of the second carriers of a first target loading port.

[0015] In some embodiments, the MES (Manufacturing Execution System) is further configured to output product scheduling information; the silicon wafer transfer device further includes: an MCS (Motorcycle Control System) for receiving product scheduling information from the MES and outputting motorized transport information; an OHTC (Overhead Control Center Management System) for receiving motorized transport information from the MCS and outputting transport control commands; and an OHT (Overhead Crane Transfer Equipment) for receiving transport control commands from the OHTC, the transport control commands indicating a second target loading port; and placing the first carrier at the second target loading port.

[0016] In some embodiments, the silicon wafer transmission device further includes: middleware for enabling communication functions between different devices.

[0017] This application provides a silicon wafer transport method, sorting equipment, and silicon wafer transport device, which can flexibly switch the operating mode of the sorting equipment and improve equipment utilization. Specifically, the sorting equipment achieves precise control over the silicon wafer transport path and carrier position by receiving different operation control commands (a first operation control command or a second operation control command). When the first operation control command is received, the sorting equipment transports the silicon wafer from a first carrier to a target carrier position within a target carrier, achieving precise transport between specified carriers (i.e., specifying both the carrier and the carrier position simultaneously). When the second operation control command is received, the sorting equipment transports the silicon wafer from the first carrier to one of the carrier positions within one of the second carriers at a first target loading port (i.e., specifying only the loading port, without specifying the carrier and the carrier position). This method ensures the flexibility and accuracy of transport path and target position selection, thereby supporting sorting operations under different production needs. This application significantly improves the flexibility and automation level of the sorting equipment. By distinguishing the transport path through the first and second operation control commands, the sorting equipment can flexibly switch operating modes according to actual production needs, improving the limitations of fixed-path transport methods and adapting to diverse production requirements. Meanwhile, the entire operation process is automatically scheduled and sorted, reducing manual intervention and improving transmission efficiency and sorting accuracy. This not only effectively reduces the error rate but also helps to maximize equipment utilization. Attached Figure Description

[0018] This application will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] Figure 1 This is a schematic flowchart of a silicon wafer transfer method provided in an embodiment of this application.

[0020] Figure 2 This is a schematic diagram of the communication architecture of a silicon wafer transmission device provided in an embodiment of this application.

[0021] Figure 3a This is a schematic diagram of the first operating mode of a sorting device provided in an embodiment of this application.

[0022] Figure 3b This is a schematic diagram of a second operating mode of a sorting device provided in an embodiment of this application. Detailed Implementation

[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] The following is a brief introduction to the terminology used in this article.

[0026] CIM: Computer Integrated Making.

[0027] MES: Manufacturing Execution Systems.

[0028] EAP: Equipment Automation Programming.

[0029] MCS: Material Control System, vehicle transport control system.

[0030] OHT: Over Hand Transfer, overhead crane conveying equipment.

[0031] OHTC: Over Hand Transfer Control, or OHT control center management system, which can be simply referred to as the control center management system in this article.

[0032] Port: Equipment loading / unloading port, also known as loading port.

[0033] Slot: The location within a box (also known as a carrier) where each silicon wafer (i.e., silicon chip) is positioned.

[0034] SECS: Semiconductor Equipment Communications Standard 2.

[0035] GEM: Generic Equipment Model.

[0036] GEM300: The GEM standard corresponding to a 300mm silicon wafer.

[0037] Carrier: Also known as a silicon wafer carrier box, silicon wafer transport box, box, or container, it is a carrier that holds silicon wafers.

[0038] Sort Equipment: Sorting equipment.

[0039] Load: to load.

[0040] FOSB: Front Opening Shipping Box, a carrier for silicon wafers.

[0041] Robot: A robotic device.

[0042] Wafer: Silicon wafer, also known as silicon wafer.

[0043] S14F9: The S14 range of SECS GEM covers the data items required for reporting, storing and transmitting board data, including functions such as S14F1, S14F2, S14F3, S14F4, S14F5, S14F6, S14F7, S14F8, S14F9, S14F10, S14F11, and S14F12.

[0044] Job Management Control: Job management and control.

[0045] Command: Instructions, also known as commands.

[0046] Control Job Command: Job control instructions.

[0047] Communicate SPEC: Communication Specification.

[0048] Aligner: calibrator.

[0049] SCES GEM300 E94 Control Job Management: The E94 section of GEM300, Control Job Management.

[0050] Utilization rate: The proportion of time that equipment is used to create value within its available time.

[0051] The relevant SCES GEM300 framework is difficult to meet the requirements of silicon wafer (i.e., silicon slab) sorting equipment to support equipment production in both To Port and To Carrier paths. This results in problems such as asynchronous production information, wasted manpower and time, and easy occurrence of operational errors, making it difficult to fully realize automated production.

[0052] The implementation methods of this application will be described in detail below.

[0053] See Figure 1 , Figure 1 This is a schematic flowchart of a silicon wafer transfer method provided in an embodiment of this application.

[0054] This application provides a silicon wafer transfer method for use in a sorting device, the method comprising steps S101 to S102.

[0055] Step S101: Receive the first or second job control command from the EAP equipment automation platform.

[0056] Step S102: Upon receiving the first operation control command, the silicon wafer is transferred from the first carrier to the target carrier position within the target carrier; or, upon receiving the second operation control command, the silicon wafer is transferred from the first carrier to one of the carrier positions within one of the second carriers of the first target loading port.

[0057] In the above embodiments, the first job control command corresponds to a first job format, namely the To Carrier job format, which transfers the silicon wafer from the first carrier to a target carrier location within the target carrier, specifying both the carrier and the slot. The second job control command corresponds to a second job format, namely the To Port job format, which transfers the silicon wafer from the first carrier to one of the carrier locations within one of the first target loading ports, specifying the port but not the carrier or the slot. The job format can also be referred to as a job mode, path mode, transmission mode, or delivery mode.

[0058] It is important to note that the prefixes "first" and "second" in "first carrier" and "second carrier" are merely distinguishing features; both are essentially carriers. Similarly, the prefixes "first" and "second" in "first target loading port" and "second target loading port" (hereinafter referred to as "second target loading port") are merely distinguishing features; both are essentially loading ports.

[0059] In some embodiments, the first job control instruction and the second job control instruction may correspond to different instruction structures. For example, the first job control instruction corresponds to a first instruction structure, and the second job control instruction corresponds to a second instruction structure; furthermore, the first instruction structure differs from the second instruction structure. In some embodiments, the EAP equipment automation platform is used to receive and identify product sorting information from the MES manufacturing execution system, and to output either a first job control instruction or a second job control instruction with different instruction structures. Thus, the EAP equipment automation platform can distinguish control instructions through different SCESCommand structures, and issue instructions with two corresponding transmission methods (i.e., the first job control instruction and the second job control instruction) to the sorting equipment as needed.

[0060] In some embodiments, upon receiving the first job control instruction, the target carrier and the target carrier location can be determined based on the first job control instruction. As an example, the first job control instruction may include the identification (ID) of the target carrier and the identifier of the target carrier location.

[0061] In some embodiments, upon receiving the second job control instruction, the first target loading port can be determined according to the second job control instruction. As an example, the second job control instruction may include the identifier of the first target loading port.

[0062] In some embodiments, upon receiving the second job control instruction, the silicon wafers are placed into the second carrier in a top-to-bottom order according to their carrying positions. That is, the product (i.e., the silicon wafer) is transferred to a non-designated box (i.e., the carrier) at the first target loading port and placed sequentially into the slot from top to bottom.

[0063] The above embodiment features a novel intelligent sorting mode that automatically switches between transport modes: the To Carrier operation mode corresponding to the first job control command and the To Port operation mode corresponding to the second job control command. As can be seen, the sorting equipment simultaneously supports both To Port and To Carrier operation modes, representing an optimization and modification of the SCES GEM300E94 Control Job Management method. This not only reduces human intervention and enables fully automated production, lowering the probability of human-caused errors, but also improves production efficiency and maximizes equipment uptime.

[0064] This application embodiment also provides a sorting device, which includes a robot and a control module. The robot may be, for example, a robot with one or more joints, a robotic arm, or an industrial device. The control module is used to receive a first operation control command or a second operation control command from an EAP (Electronic Automation Platform) platform; upon receiving the first operation control command, it controls the robot to transfer a silicon wafer from a first carrier to a target carrying position within a target carrier; or, upon receiving the second operation control command, it controls the robot to transfer the silicon wafer from the first carrier to one of the carrying positions within one of the second carriers of a first target loading port.

[0065] In some embodiments, the number of robot robots can be one or more. As an example, the control module can perform independent operation control for each robot robot.

[0066] In some embodiments, the sorting equipment may further include an Aligner calibrator for adjusting the position and / or orientation of the silicon wafers. As an example, the sorting equipment can not only sort silicon wafers but also adjust their pose (including position and orientation) for easier subsequent operations.

[0067] See Figure 2 , Figure 2 This is a schematic diagram of the communication architecture of a silicon wafer transmission device provided in an embodiment of this application. Figure 2 In this context, P1 to P4 are abbreviations for Port 1 to Port 4.

[0068] This application also provides a silicon wafer transport device, which includes a Manufacturing Execution System (MES), an Equipment Automation Platform (EAP), and a sorting device. The MES outputs product sorting information. The EAP receives and identifies the product sorting information from the MES and outputs a first operation control command or a second operation control command. The sorting device receives the first or second operation control command from the EAP; upon receiving the first operation control command, it transports the silicon wafer from a first carrier to a target carrying position within a target carrier; or, upon receiving the second operation control command, it transports the silicon wafer from the first carrier to one carrying position within one of the second carriers of a first target loading port.

[0069] In some embodiments, the MES (Manufacturing Execution System) can also be used to output product scheduling information. The silicon wafer transport device may further include one or more of the following: an MCS (Mountain Carrier Control System), an OHTC (Oxygen Control Center Management System), and an OHT (Oxygen Overhead Crane Transport Equipment). The MCS is used to receive product scheduling information from the MES and output vehicle transport information. The OHTC receives vehicle transport information from the MCS and outputs transport control commands. The OHT receives transport control commands from the OHTC, which instruct a second target loading port to be placed at the second target loading port.

[0070] like Figure 2 As shown, the aforementioned silicon wafer transport device includes a Manufacturing Execution System (MES), an Equipment Automation Platform (EAP), a SortEquipment sorting equipment, an MCS carrier transport control system, an OHTC control center management system, and an OHT overhead crane transport equipment. As an example, the production scheduling transport information flow is MES→MCS→OHTC→OHT. After scheduling is completed, the Carrier loads at the corresponding Port (i.e., loading port) of the SortEquipment. The production operation information flow is MES→EAP→SortEquipment. After information transmission is completed, the products (i.e., silicon wafers) within the Carrier are sorted (i.e., picked up) as needed.

[0071] The operation process of the aforementioned silicon wafer transport device is as follows: the OHT transports and places the FOSB (or carrier) to the designated equipment port (i.e., the second target loading port). The sorting equipment uses a robot to pick up and place wafers, classifying the products in an orderly manner. This involves MES→MCS→OHTC→OHT for transport control, MES→EAP→Sort Equipment for classification and placement information control, and Sort Equipment for complete physical pick-up and placement control.

[0072] See Figure 3a and Figure 3b , Figure 3a This is a schematic diagram of a first operating mode of a sorting device provided in an embodiment of this application. Figure 3b This is a schematic diagram of a second operating mode of a sorting device provided in an embodiment of this application.

[0073] For example, such as Figure 3a and Figure 3b As shown, the sorting equipment performs a sorting operation, transferring products within Carrier 1 and Carrier 2. Specifically, as... Figure 3a As shown, in the first operating mode, the product is transferred to the designated box (e.g., Carrier 3 or Carrier 4) according to path ① or ②, specifying the slot (e.g., layer position); or, as... Figure 3b As shown, in the second operating mode, the product is transferred to the designated port (e.g., Port3 or Port4) according to path ③ or ④, and the non-designated box (i.e., Carrier X) is placed into the slot in sequence from top to bottom.

[0074] As an example, the S14F9 Control Job Management control transmission method can be used during the control information interaction between the EAP equipment automation platform and the Sort Equipment.

[0075] For example, such as Figure 2 As shown, after the production system scheduling information flow is completed, the Carrier arrives at the Sort Equipment to interact with the production operation information flow. The MES manufacturing execution system issues product sorting information, and the EAP receives the product sorting information and identifies it. Different types of control instructions (first job control instruction or second job control instruction) are transmitted through different instruction structures to realize the above silicon wafer transmission method.

[0076] In some embodiments, the silicon wafer transport device may further include middleware for enabling communication between different devices. These different devices may include, for example, two or more of the following: a Manufacturing Execution System (MES), an Equipment Automation Platform (EAP), a Sort Equipment (SOE), an MCS (Motorcycle Control System), an OHTC (Overhead Control Center) management system, and an OHT (Overhead Crane) transport system.

[0077] It should be noted that the various embodiments in this application are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the product embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiments.

[0078] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0079] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0080] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0081] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A silicon wafer transmission method, characterized in that, Applied to sorting equipment, the method includes: The system receives a first operation control command and a second operation control command from the EAP equipment automation platform; the EAP equipment automation platform is used to receive and identify product sorting information from the MES manufacturing execution system, and to output the first operation control command and the second operation control command. Upon receiving the first operation control instruction, the silicon wafer is transferred from the first carrier to a target carrier location within the target carrier, wherein the target carrier and the target carrier location are determined according to the first operation control instruction; upon receiving the second operation control instruction, the silicon wafer is transferred from the first carrier to a carrier location within one of the second carriers of a first target loading port, wherein the first target loading port is determined according to the second operation control instruction, and the second operation control instruction does not specify the second carrier or its carrier location; The first job control instruction corresponds to the To Carrier operation mode, and the second job control instruction corresponds to the To Port operation mode; the first job control instruction and the second job control instruction correspond to different instruction structures.

2. The silicon wafer transfer method according to claim 1, characterized in that, Upon receiving the second operation control command, the silicon wafer is placed into the second carrier in order of its bearing position from top to bottom.

3. A sorting device, characterized in that, The sorting equipment includes: Robot; The control module is configured to receive a first operation control command and a second operation control command from the EAP equipment automation platform; upon receiving the first operation control command, it controls the Robot robot to transfer the silicon wafer from a first carrier to a target carrying position within a target carrier, wherein the target carrier and the target carrying position are determined according to the first operation control command; upon receiving the second operation control command, it controls the Robot robot to transfer the silicon wafer from the first carrier to one carrying position within one of a second carriers of a first target loading port, wherein the first target loading port is determined according to the second operation control command, and the second operation control command does not specify the second carrier and its carrying position. The EAP equipment automation platform is used to receive and identify product sorting information from the MES manufacturing execution system, and to output a first operation control instruction and a second operation control instruction; the first operation control instruction corresponds to the To Carrier operation mode, and the second operation control instruction corresponds to the To Port operation mode; the first operation control instruction and the second operation control instruction correspond to different instruction structures.

4. The sorting equipment according to claim 3, characterized in that, The sorting equipment also includes: Aligner calibrator, used to adjust the position and / or orientation of the silicon wafer.

5. A silicon wafer transport device, characterized in that, The silicon wafer transport device includes: MES (Manufacturing Execution System) is used to output product sorting information; The EAP equipment automation platform is used to receive and identify product sorting information from the MES manufacturing execution system, and to output the first operation control command and the second operation control command. The sorting equipment is configured to receive a first operation control command and a second operation control command from the EAP equipment automation platform; upon receiving the first operation control command, it transfers the silicon wafer from a first carrier to a target carrier location within a target carrier, wherein the target carrier and the target carrier location are determined according to the first operation control command; upon receiving the second operation control command, it transfers the silicon wafer from the first carrier to a carrier location within a second carrier at a first target loading port, wherein the first target loading port is determined according to the second operation control command, and the second operation control command does not specify the second carrier or its carrier location. The first job control instruction corresponds to the To Carrier operation mode, and the second job control instruction corresponds to the To Port operation mode; the first job control instruction and the second job control instruction correspond to different instruction structures.

6. The silicon wafer transport device according to claim 5, characterized in that, The MES manufacturing execution system is also used to output product scheduling information; The silicon wafer transport device further includes: The MCS vehicle transport control system is used to receive product scheduling information from the MES manufacturing execution system and output vehicle transport information. The OHTC control center management system is used to receive vehicle transport information from the MCS vehicle transport control system and to output transport control commands. The OHT overhead crane conveying equipment is used to receive conveying control commands from the OHTC control central management system, the conveying control commands being used to instruct the second target loading port; and to convey and place the first carrier to the second target loading port.

7. The silicon wafer transport device according to claim 5, characterized in that, The silicon wafer transport device further includes: Middleware is used to enable communication between different devices.

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